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TPA3116D2, TPA3118D2, TPA3130D2
SLOS708G – APRIL 2012 – REVISED DECEMBER 2017
TPA3116D2 15-W, 30-W, 50-W Filter-Free Class-D Stereo Amplifier Family With AM
Avoidance
1 Features
3 Description
•
The TPA31xxD2 series are stereo efficient, digital
amplifier power stage for driving speakers up to 100
W / 2 Ω in mono. The high efficiency of the
TPA3130D2 allows it to do 2 × 15 W without external
heat sink on a single layer PCB. The TPA3118D2 can
even run 2 × 30 W / 8 Ω without heat sink on a dual
layer PCB. If even higher power is needed the
TPA3116D2 does 2 × 50 W / 4 Ω with a small heatsink attached to its top side PowerPAD. All three
devices share the same footprint enabling a single
PCB to be used across different power levels.
1
•
•
•
•
•
•
•
•
•
•
•
Supports Multiple Output Configurations
– 2 × 50 W Into a 4-Ω BTL Load at 21 V
(TPA3116D2)
– 2 × 30 W Into a 8-Ω BTL Load at 24 V
(TPA3118D2)
– 2 × 15 W Into a 8-Ω BTL Load at 15 V
(TPA3130D2)
Wide Voltage Range: 4.5 V to 26 V
Efficient Class-D Operation
– >90% Power Efficiency Combined With Low
Idle Loss Greatly Reduces Heat Sink Size
– Advanced Modulation Schemes
Multiple Switching Frequencies
– AM Avoidance
– Master and Slave Synchronization
– Up to 1.2-MHz Switching Frequency
Feedback Power-Stage Architecture With High
PSRR Reduces PSU Requirements
Programmable Power Limit
Differential and Single-Ended Inputs
Stereo and Mono Mode With Single-Filter Mono
Configuration
Single Power Supply Reduces Component Count
Integrated Self-Protection Circuits Including
Overvoltage, Undervoltage, Overtemperature, DCDetect, and Short Circuit With Error Reporting
Thermally Enhanced Packages
– DAD (32-Pin HTSSOP Pad Up)
– DAP (32-Pin HTSSOP Pad Down)
–40°C to 85°C Ambient Temperature Range
The TPA31xxD2 advanced oscillator/PLL circuit
employs a multiple switching frequency option to
avoid AM interferences; this is achieved together with
an option of either master or slave option, making it
possible to synchronize multiple devices.
The TPA31xxD2 devices are fully protected against
faults with short-circuit protection and thermal
protection as well as overvoltage, undervoltage, and
DC protection. Faults are reported back to the
processor to prevent devices from being damaged
during overload conditions.
Device Information(1)
PART NUMBER
PACKAGE
BODY SIZE (NOM)
TPA3116D2
DAD (32)
11.00 mm × 6.20 mm
TPA3118D2
TPA3130D2
DAP (32)
11.00 mm × 6.20 mm
(1) For all available packages, see the orderable addendum at
the end of the datasheet.
Simplified Application Circuit
Tuner AM/FM
CD/ MP3
Audio Processor
And control
Right
•
•
•
•
Mini-Micro Component, Speaker Bar, Docks
After-Market Automotive
CRT TV
Consumer Audio Applications
PBTL
Detect
Left
2 Applications
4.5 V-26 V
PSU
TPA3116D2
Right
LC Filter
Left
LC Filter
SDZ
MUTE
Aux in
FAULTZ
AM /FM Avoidance
Control
GAIN control and Master /Slave setting
Power Limit
Capable of synchronizing to other devices
AM2,1,0
GAIN/SLV
PLIMIT
Sync
Copyright © 2016, Texas Instruments Incorporated
1
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.
TPA3116D2, TPA3118D2, TPA3130D2
SLOS708G – APRIL 2012 – REVISED DECEMBER 2017
www.ti.com
Table of Contents
1
2
3
4
5
6
7
Features ..................................................................
Applications ...........................................................
Description .............................................................
Revision History.....................................................
Pin Configuration and Functions .........................
Specifications.........................................................
1
1
1
2
3
5
6.1
6.2
6.3
6.4
6.5
6.6
6.7
5
5
5
6
6
7
8
Absolute Maximum Ratings ......................................
ESD Ratings ............................................................
Recommended Operating Conditions.......................
Thermal Information ..................................................
DC Electrical Characteristics ....................................
AC Electrical Characteristics.....................................
Typical Characteristics ..............................................
Detailed Description ............................................ 13
7.1 Overview ................................................................. 13
7.2 Functional Block Diagram ....................................... 13
7.3 Feature Description................................................. 13
7.4 Device Functional Modes........................................ 24
8
Application and Implementation ........................ 25
8.1 Application Information............................................ 25
8.2 Typical Application .................................................. 25
9 Power Supply Recommendations...................... 28
10 Layout................................................................... 28
10.1 Layout Guidelines ................................................. 28
10.2 Layout Example .................................................... 29
10.3 Heat Sink Used on the EVM ................................. 31
11 Device and Documentation Support ................. 32
11.1
11.2
11.3
11.4
11.5
11.6
Related Links ........................................................
Receiving Notification of Documentation Updates
Community Resources..........................................
Trademarks ...........................................................
Electrostatic Discharge Caution ............................
Glossary ................................................................
32
32
32
32
32
32
12 Mechanical, Packaging, and Orderable
Information ........................................................... 32
4 Revision History
Changes from Revision F (February 2017) to Revision G
Page
•
Changed R to GND column row 1 From: "Short" To: "Open" in Table 3 ............................................................................. 16
•
Changed R to GVDD column row 1 From: "Open" To: "Short" in Table 3 ........................................................................... 16
Changes from Revision E (September 2015) to Revision F
Page
•
Changed pin 20 Description From: ceramic cap to OUTPL To: ceramic cap to OUTNL in the Pin Functions table ............. 4
•
Changed pin 24 Description From: ceramic cap to OUTNL To: ceramic cap to OUTPL in the Pin Functions table ............. 4
•
Changed 2.3 Hz To 1.9 Hz for HIGH-PASS FILTER in Table 2 ......................................................................................... 14
Changes from Revision D (January 2015) to Revision E
•
Page
Deleted Package DAP (32) from Part Number TPA3116D2 in the Device Information table ............................................... 1
Changes from Revision C (April 2012) to Revision D
•
Page
Added Pin Configuration and Functions section, ESD Ratings table, Feature Description section, Device Functional
Modes, Application and Implementation section, Power Supply Recommendations section, Layout section, Device
and Documentation Support section, and Mechanical, Packaging, and Orderable Information section .............................. 1
Changes from Revision B (May 2012) to Revision C
Page
•
Changed Notes 2 and 3 of the Thermal Information Table. ................................................................................................... 6
•
Changed the Gain (BTL) Test Condition values for R1 and R2............................................................................................. 6
•
Changed the Gain (SLV) Test Condition values for R1 and R2............................................................................................. 6
•
Changed the System Block Diagram.................................................................................................................................... 13
2
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TPA3116D2, TPA3118D2, TPA3130D2
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SLOS708G – APRIL 2012 – REVISED DECEMBER 2017
5 Pin Configuration and Functions
DAD Package
32-Pin HTSSOP With PowerPAD Up
TPA3116D2 Only, Top View
MODSEL
1
32
PVCC
SDZ
2
31
PVCC
FAULTZ
3
30
BSPR
RINP
4
29
OUTPR
RINN
5
28
GND
PLIMIT
6
27
OUTNR
GVDD
7
26
BSNR
GAIN/SLV
8
25
GND
GND
9
24
BSPL
Thermal
PAD
LINP
10
23
OUTPL
LINN
11
22
GND
MUTE
12
21
OUTNL
AM2
13
20
BSNL
AM1
14
19
PVCC
AM0
15
18
PVCC
SYNC
16
17
AVCC
DAP Package
32-Pin HTSSOP With PowerPAD Down
Top View
MODSEL
1
32
PVCC
SDZ
2
31
PVCC
FAULTZ
3
30
BSPR
RINP
4
29
OUTPR
RINN
5
28
GND
PLIMIT
6
27
OUTNR
GVDD
7
26
BSNR
GAIN/SLV
8
25
GND
Thermal
PAD
GND
9
24
BSPL
LINP
10
23
OUTPL
LINN
11
22
GND
MUTE
12
21
OUTNL
AM2
13
20
BSNL
AM1
14
19
PVCC
AM0
15
18
PVCC
SYNC
16
17
AVCC
Copyright © 2012–2017, Texas Instruments Incorporated
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TPA3116D2, TPA3118D2, TPA3130D2
SLOS708G – APRIL 2012 – REVISED DECEMBER 2017
www.ti.com
Pin Functions
PIN
NO.
NAME
TYPE (1)
DESCRIPTION
1
MODSEL
I
Mode selection logic input (LOW = BD mode, HIGH = 1 SPW mode). TTL logic levels with compliance to
AVCC.
2
SDZ
I
Shutdown logic input for audio amp (LOW = outputs Hi-Z, HIGH = outputs enabled). TTL logic levels with
compliance to AVCC.
3
FAULTZ
DO
4
RINP
I
Positive audio input for right channel. Biased at 3 V.
5
RINN
I
Negative audio input for right channel. Biased at 3 V.
6
PLIMIT
I
Power limit level adjust. Connect a resistor divider from GVDD to GND to set power limit. Connect directly
to GVDD for no power limit.
7
GVDD
PO
Internally generated gate voltage supply. Not to be used as a supply or connected to any component other
than a 1 µF X7R ceramic decoupling capacitor and the PLIMIT and GAIN/SLV resistor dividers.
8
GAIN/SLV
I
Selects Gain and selects between Master and Slave mode depending on pin voltage divider.
9
GND
G
Ground
10
LINP
I
Positive audio input for left channel. Biased at 3 V. Connect to GND for PBTL mode.
11
LINN
I
Negative audio input for left channel. Biased at 3 V. Connect to GND for PBTL mode.
12
MUTE
I
Mute signal for fast disable/enable of outputs (HIGH = outputs Hi-Z, LOW = outputs enabled). TTL logic
levels with compliance to AVCC.
13
AM2
I
AM Avoidance Frequency Selection
14
AM1
I
AM Avoidance Frequency Selection
15
AM0
I
AM Avoidance Frequency Selection
16
SYNC
DIO
17
AVCC
P
Analog Supply
18
PVCC
P
Power supply
19
PVCC
P
Power supply
20
BSNL
BST
Boot strap for negative left channel output, connect to 220 nF X5R, or better ceramic cap to OUTNL
21
OUTNL
PO
Negative left channel output
22
GND
G
23
OUTPL
PO
Positive left channel output
24
BSPL
BST
Boot strap for positive left channel output, connect to 220 nF X5R, or better ceramic cap to OUTPL
25
GND
G
26
BSNR
BST
Boot strap for negative right channel output, connect to 220 nF X5R, or better ceramic cap to OUTNR
27
OUTNR
PO
Negative right channel output
General fault reporting including Over-temp, DC Detect. Open drain.
FAULTZ = High, normal operation
FAULTZ = Low, fault condition
Clock input/output for synchronizing multiple class-D devices. Direction determined by GAIN/SLV terminal.
Ground
Ground
28
GND
G
29
OUTPR
PO
Positive right channel output
30
BSPR
BST
Boot strap for positive right channel output, connect to 220 nF X5R or better ceramic cap to OUTPR
31
PVCC
P
Power supply
32
PVCC
P
Power supply
33
PowerPAD
G
Connect to GND for best system performance. If not connected to GND, leave floating.
(1)
4
Ground
TYPE: DO = Digital Output, I = Analog Input, G = General Ground, PO = Power Output, BST = Boot Strap.
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SLOS708G – APRIL 2012 – REVISED DECEMBER 2017
6 Specifications
6.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted) (1)
Supply voltage, VCC
Input voltage, VI
Slew rate, maximum
(2)
MIN
MAX
UNIT
PVCC, AVCC
–0.3
30
V
INPL, INNL, INPR, INNR
–0.3
6.3
V
PLIMIT, GAIN / SLV, SYNC
–0.3
GVDD+0.3
V
AM0, AM1, AM2, MUTE, SDZ, MODSEL
–0.3
PVCC+0.3
V
10
V/ms
Operating free-air temperature, TA
–40
85
°C
Operating junction temperature , TJ
–40
150
°C
Storage temperature, Tstg
–40
125
°C
(1)
(2)
AM0, AM1, AM2, MUTE, SDZ, MODSEL
Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating
conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
100 kΩ series resistor is needed if maximum slew rate is exceeded.
6.2 ESD Ratings
VALUE
V(ESD)
(1)
(2)
Electrostatic discharge
Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001 (1)
±2000
Charged-device model (CDM), per JEDEC specification JESD22C101 (2)
±500
UNIT
V
JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process. .
6.3 Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted)
MIN
NOM
Supply voltage
PVCC, AVCC
VIH
High-level input
voltage
AM0, AM1, AM2, MUTE, SDZ, SYNC, MODSEL
VIL
Low-level input
voltage
AM0, AM1, AM2, MUTE, SDZ, SYNC, MODSEL
0.8
V
VOL
Low-level output
voltage
FAULTZ, RPULL-UP = 100 kΩ, PVCC = 26 V
0.8
V
IIH
High-level input
current
AM0, AM1, AM2, MUTE, SDZ, MODSEL (VI = 2 V, VCC = 18 V)
50
µA
Output filter: L = 10 µH, C = 680 nF
Minimum load
Impedance
RL(PBTL)
Lo
Output filter: L = 10 µH, C = 1 µF
Output-filter
Inductance
2
3.2
4
TPA3130D2
5.6
8
TPA3116D2, TPA3118D2
1.6
TPA3130D2
3.2
Ω
4
1
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V
V
TPA3116D2, TPA3118D2
Minimum output filter inductance under short-circuit condition
Copyright © 2012–2017, Texas Instruments Incorporated
26
UNIT
VCC
RL(BTL)
4.5
MAX
µH
5
TPA3116D2, TPA3118D2, TPA3130D2
SLOS708G – APRIL 2012 – REVISED DECEMBER 2017
www.ti.com
6.4 Thermal Information
THERMAL METRIC (1)
TPA3130D2
TPA3118D2
TPA3116D2
DAP (2)
DAP (3)
DAD (4)
32 PINS
32 PINS
32 PINS
RθJA
Junction-to-ambient thermal resistance
36
22
14
ψJT
Junction-to-top characterization parameter
0.4
0.3
1.2
ψJB
Junction-to-board characterization parameter
5.9
4.7
5.7
(1)
(2)
(3)
(4)
UNIT
°C/W
For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report.
For the PCB layout please see the TPA3130D2EVM user guide.
For the PCB layout please see the TPA3118D2EVM user guide.
The heat sink drawing used for the thermal model data are shown in the application section, size: 14mm wide, 50mm long, 25mm high.
6.5 DC Electrical Characteristics
TA = 25°C, AVCC = PVCC = 12 V to 24 V, RL = 4 Ω (unless otherwise noted)
PARAMETER
TEST CONDITIONS
| VOS |
Class-D output offset voltage (measured
differentially)
ICC
Quiescent supply current
ICC(SD)
Quiescent supply current in shutdown
mode
rDS(on)
Drain-source on-state resistance,
measured pin to pin
G
G
Gain (BTL)
Gain (SLV)
TYP
MAX
VI = 0 V, Gain = 36 dB
1.5
15
SDZ = 2 V, No load or filter, PVCC = 12 V
20
35
SDZ = 2 V, No load or filter, PVCC = 24 V
32
50
SDZ = 0.8 V, No load or filter, PVCC = 12 V
150°C
Low
Output high impedance
Latched
Too High DC Offset
DC output voltage
Low
Output high impedance
Latched
Under Voltage on
PVCC
PVCC < 4.5V
–
Output high impedance
Self-clearing
Over Voltage on
PVCC
PVCC > 27V
–
Output high impedance
Self-clearing
7.3.9 DC Detect Protection
The TPA31xxD2 family has circuitry which will protect the speakers from DC current which might occur due to
defective capacitors on the input or shorts on the printed circuit board at the inputs. A DC detect fault will be
reported on the FAULT pin as a low state. The DC Detect fault will also cause the amplifier to shutdown by
changing the state of the outputs to Hi-Z.
If automatic recovery from the short circuit protection latch is desired, connect the FAULTZ pin directly to the
SDZ pin. This allows the FAULTZ pin function to automatically drive the SDZ pin low which clears the DC Detect
protection latch.
A DC Detect Fault is issued when the output differential duty-cycle of either channel exceeds 60% for more than
420 msec at the same polarity. Table x below shows some examples of the typical DC Detect Protection
threshold for several values of the supply voltage. This feature protects the speaker from large DC currents or
AC currents less than 2Hz. To avoid nuisance faults due to the DC detect circuit, hold the SD pin low at powerup until the signals at the inputs are stable. Also, take care to match the impedance seen at the positive and
negative inputs to avoid nuisance DC detect faults.
Table 5 lists the minimum output offset voltages required to trigger the DC detect. The outputs must remain at or
above the voltage listed in the table for more than 420 ms to trigger the DC detect.
Table 5. DC Detect Threshold
PVCC (V)
VOS - OUTPUT OFFSET VOLTAGE (V)
4.5
0.96
6
1.3
12
2.6
18
3.9
7.3.10 Short-Circuit Protection and Automatic Recovery Feature
The TPA31xxD2 family has protection from over current conditions caused by a short circuit on the output stage.
The short circuit protection fault is reported on the FAULTZ pin as a low state. The amplifier outputs are switched
to a high impedance state when the short circuit protection latch is engaged. The latch can be cleared by cycling
the SDZ pin through the low state.
If automatic recovery from the short circuit protection latch is desired, connect the FAULTZ pin directly to the
SDZ pin. This allows the FAULTZ pin function to automatically drive the SDZ pin low which clears the shortcircuit protection latch.
In systems where a possibility of a permanent short from the output to PVDD or to a high voltage battery like a
car battery can occur, pull the MUTE pin low with the FAULTZ signal with a inverting transistor to ensure a highZ restart, like shown in the figure below:
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> 1.4sec
SDZ
mP
MUTE
TPA3116D2
FAULTZ
SDZ
MUTE
FAULTZ
Copyright © 2016, Texas Instruments Incorporated
Figure 30. MUTE Driven by Inverted FAULTZ
Figure 31. Timing Requirement for SDZ
7.3.11 Thermal Protection
Thermal protection on the TPA31xxD2 family prevents damage to the device when the internal die temperature
exceeds 150°C. There is a ±15°C tolerance on this trip point from device to device. Once the die temperature
exceeds the thermal trip point, the device enters into the shutdown state and the outputs are disabled. This is a
latched fault.
Thermal protection faults are reported on the FAULTZ terminal as a low state.
If automatic recovery from the thermal protection latch is desired, connect the FAULTZ pin directly to the SDZ
pin. This allows the FAULTZ pin function to automatically drive the SDZ pin low which clears the thermal
protection latch.
7.3.12 Device Modulation Scheme
The TPA31xxD2 family has the option of running in either BD modulation or 1SPW modulation; this is set by the
MODSEL pin.
7.3.12.1 MODSEL = GND: BD-Modulation
This is a modulation scheme that allows operation without the classic LC reconstruction filter when the amp is
driving an inductive load with short speaker wires. Each output is switching from 0 volts to the supply voltage.
The OUTPx and OUTNx are in phase with each other with no input so that there is little or no current in the
speaker. The duty cycle of OUTPx is greater than 50% and OUTNx is less than 50% for positive output voltages.
The duty cycle of OUTPx is less than 50% and OUTNx is greater than 50% for negative output voltages. The
voltage across the load sits at 0V throughout most of the switching period, reducing the switching current, which
reduces any I2R losses in the load.
18
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SLOS708G – APRIL 2012 – REVISED DECEMBER 2017
OUTP
OUTN
No Output
OUTP- OUTN
0V
Speaker
Current
OUTP
OUTN
Positive Output
PVCC
OUTP-OUTN
0V
Speaker
Current
0A
OUTP
Negative Output
OUTN
OUTP - OUTN
0V
- PVCC
Speaker
Current
0A
Figure 32. BD Mode Modulation
7.3.12.2 MODSEL = HIGH: 1SPW-modulation
The 1SPW mode alters the normal modulation scheme in order to achieve higher efficiency with a slight penalty
in THD degradation and more attention required in the output filter selection. In 1SPW mode the outputs operate
at ~15% modulation during idle conditions. When an audio signal is applied one output will decrease and one will
increase. The decreasing output signal will quickly rail to GND at which point all the audio modulation takes place
through the rising output. The result is that only one output is switching during a majority of the audio cycle.
Efficiency is improved in this mode due to the reduction of switching losses. The THD penalty in 1SPW mode is
minimized by the high performance feedback loop. The resulting audio signal at each half output has a
discontinuity each time the output rails to GND. This can cause ringing in the audio reconstruction filter unless
care is taken in the selection of the filter components and type of filter used.
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OUTP
OUTN
OUTP -OUTN
No Output
0V
Speaker
Current
OUTP
OUTN
Positive Output
PVCC
OUTP -OUTN
0V
Speaker
Current
0A
OUTP
Negative Output
OUTN
OUTP -OUTN
0V
- PVCC
Speaker
Current
0A
Figure 33. 1SPW Mode Modulation
20
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SLOS708G – APRIL 2012 – REVISED DECEMBER 2017
7.3.13 Efficiency: LC Filter Required with the Traditional Class-D Modulation Scheme
The main reason that the traditional class-D amplifier-based on AD modulation needs an output filter is that the
switching waveform results in maximum current flow. This causes more loss in the load, which causes lower
efficiency. The ripple current is large for the traditional modulation scheme, because the ripple current is
proportional to voltage multiplied by the time at that voltage. The differential voltage swing is 2 × VCC, and the
time at each voltage is half the period for the traditional modulation scheme. An ideal LC filter is needed to store
the ripple current from each half cycle for the next half cycle, while any resistance causes power dissipation. The
speaker is both resistive and reactive, whereas an LC filter is almost purely reactive.
The TPA3116D2 modulation scheme has little loss in the load without a filter because the pulses are short and
the change in voltage is VCC instead of 2 × VCC. As the output power increases, the pulses widen, making the
ripple current larger. Ripple current could be filtered with an LC filter for increased efficiency, but for most
applications the filter is not needed.
An LC filter with a cutoff frequency less than the class-D switching frequency allows the switching current to flow
through the filter instead of the load. The filter has less resistance but higher impedance at the switching
frequency than the speaker, which results in less power dissipation, therefore increasing efficiency.
7.3.14 Ferrite Bead Filter Considerations
Using the Advanced Emissions Suppression Technology in the TPA3116D2 amplifier it is possible to design a
high efficiency class-D audio amplifier while minimizing interference to surrounding circuits. It is also possible to
accomplish this with only a low-cost ferrite bead filter. In this case it is necessary to carefully select the ferrite
bead used in the filter. One important aspect of the ferrite bead selection is the type of material used in the ferrite
bead. Not all ferrite material is alike, so it is important to select a material that is effective in the 10 to 100 MHz
range which is key to the operation of the class-D amplifier. Many of the specifications regulating consumer
electronics have emissions limits as low as 30 MHz. It is important to use the ferrite bead filter to block radiation
in the 30 MHz and above range from appearing on the speaker wires and the power supply lines which are good
antennas for these signals. The impedance of the ferrite bead can be used along with a small capacitor with a
value in the range of 1000 pF to reduce the frequency spectrum of the signal to an acceptable level. For best
performance, the resonant frequency of the ferrite bead/ capacitor filter should be less than 10 MHz.
Also, it is important that the ferrite bead is large enough to maintain its impedance at the peak currents expected
for the amplifier. Some ferrite bead manufacturers specify the bead impedance at a variety of current levels. In
this case it is possible to make sure the ferrite bead maintains an adequate amount of impedance at the peak
current the amplifier will see. If these specifications are not available, it is also possible to estimate the bead
current handling capability by measuring the resonant frequency of the filter output at low power and at maximum
power. A change of resonant frequency of less than fifty percent under this condition is desirable. Examples of
ferrite beads which have been tested and work well with the TPA3130D2 can be seen in the TPA3130D2EVM
user guide SLOU341.
A high quality ceramic capacitor is also needed for the ferrite bead filter. A low ESR capacitor with good
temperature and voltage characteristics will work best.
Additional EMC improvements may be obtained by adding snubber networks from each of the class-D outputs to
ground. Suggested values for a simple RC series snubber network would be 18 Ω in series with a 330 pF
capacitor although design of the snubber network is specific to every application and must be designed taking
into account the parasitic reactance of the printed circuit board as well as the audio amp. Take care to evaluate
the stress on the component in the snubber network especially if the amp is running at high PVCC. Also, make
sure the layout of the snubber network is tight and returns directly to the GND pins on the IC.
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Figure 34. TPA311xD2 Radiated Emissions
7.3.15 When to Use an Output Filter for EMI Suppression
The TPA3116D2 has been tested with a simple ferrite bead filter for a variety of applications including long
speaker wires up to 125 cm and high power. The TPA3116D2 EVM passes FCC class-B specifications under
these conditions using twisted speaker wires. The size and type of ferrite bead can be selected to meet
application requirements. Also, the filter capacitor can be increased if necessary with some impact on efficiency.
There may be a few circuit instances where it is necessary to add a complete LC reconstruction filter. These
circumstances might occur if there are nearby circuits which are sensitive to noise. In these cases a classic
second order Butterworth filter similar to those shown in the figures below can be used.
Some systems have little power supply decoupling from the AC line but are also subject to line conducted
interference (LCI) regulations. These include systems powered by "wall warts" and "power bricks." In these
cases, LC reconstruction filters can be the lowest cost means to pass LCI tests. Common mode chokes using
low frequency ferrite material can also be effective at preventing line conducted interference.
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SLOS708G – APRIL 2012 – REVISED DECEMBER 2017
10 µH
OUTP
L1
C2
0.68 µF
4W-8W
10 µH
OUTN
L2
C3
0.68 µF
Ferrite
Chip Bead
OUTP
1 nF
4W-8W
Ferrite
Chip Bead
OUTN
1 nF
Figure 35. TPA31xxD2 Output Filters
7.3.16 AM Avoidance EMI Reduction
To reduce interference in the AM radio band, the TPA3116D2 has the ability to change the switching frequency
via AM pins. The recommended frequencies are listed in Table 6. The fundamental frequency and its
second harmonic straddle the AM radio band listed. This eliminates the tones that can be present due to the
switching frequency being demodulated by the AM radio.
Table 6. AM Frequencies
US
EUROPEAN
AM FREQUENCY (kHz)
AM FREQUENCY (kHz)
SWITCHING FREQUENCY (kHz)
AM2
AM1
AM0
500
0
0
1
0
1
0
0
0
0
0
0
1
0
1
0
0
0
0
0
1
0
0
0
1
522-540
540-917
540-914
917-1125
914-1122
600 (or 400)
1125-1375
1122-1373
500
1375-1547
1373-1548
1547-1700
1548-1701
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600 (or 400)
600 (or 500)
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7.4 Device Functional Modes
7.4.1 Mono Mode (PBTL)
The TPA31xxD2 family can be connected in MONO mode enabling up to 100W output power. This is done by:
• Connect INPL and INNL directly to Ground (without capacitors) this sets the device in Mono mode during
power up.
• Connect OUTPR and OUTNR together for the positive speaker terminal and OUTNL and OUTPL together for
the negative pin.
• Analog input signal is applied to INPR and INNR.
TPA3116D2
4.5 V–26 V
PSU
OUTPR
OUTNR
Right
LC Filter
PBTL
Detect
Left
OUTPL
OUTNL
Figure 36. Mono Mode
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8 Application and Implementation
NOTE
Information in the following applications sections is not part of the TI component
specification, and TI does not warrant its accuracy or completeness. TI’s customers are
responsible for determining suitability of components for their purposes. Customers should
validate and test their design implementation to confirm system functionality.
8.1 Application Information
This section describes a 2.1 Master and Slave application. The Master is configured as stereo outputs and the
Slave is configured as mono PBTL output.
8.2 Typical Application
A 2.1 solution, U1 TPA3116D2 in Master mode 400 kHz, BTL, gain if 20 dB, power limit not implemented. U2 in
Slave, PBTL mode gain of 20 dB. Inputs are connected for differential inputs.
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Typical Application (continued)
OUTPUT LC FILTER
16
BSNL
AM1
PVCC
AM0
PVCC
SY NC
AVCC
19
C19
OUT_P_RIGHT
1
1 2
1
2
OUT_N_RIGHT
1
1 2
2
2
OUT_P_LEFT
1
C32
1nF
C38
10nF
+
GND
PVCC
17
C29
680nF
C25
220uF
SYNC
2
C24
100nF
L9
10uH
GND
C40
10nF
C33
1nF
4R
-
R18
3.3R
2
1
GND
PVCC DECOUPLING
PVCC DECOUPLING
1
1
1
2
PVCC
C47
220uF
2
2
2
C46
100nF
2
12
13
R22
100k
1
14
15
16
INNL
MUTE
GND
OUTNL
AM2
BSNL
AM1
PVCC
AM0
PVCC
SY NC
AVCC
22
1
20
C44
OUT_P_SUB
1
1 2
GND
C56
10nF
C54
1nF
2
1
19
2
2R
GND
C52
1uF
2
R24
3.3R
-
220nF
L16
18
10uH
PVCC
17
C48
1nF
C50
220uF
C49
100nF
2
2
TPA3116D2
+
220nF
220nF
2
23
1
C41
1nF
2
C43
C43
1
21
1
1
2
25
C55
10nF
2
1
BSPL
OUTPL
1
1
GND
INPL
26
24
C53
1nF
OUT_N_SUB
11
GND
MUTE_SUB
GND
GND
C51
1uF
1 2
12
2
10
GAIN/SLV
BSNR
27
R23
3.3R
2
9
8
GVDD
OUTNR
10uH
1
R21
75k
GND
PLIMIT
28
2
7
INNR
L15
29
1
R20
47k
OUTPR
EMI C-RC SNUBBER
2
2
1
6
BSPR
INPR
1
220nF
2
1
1uF
FAULTZ
OUTPUT LC FILTER
C42
1
30
1
5
PVCC
31
2
4
1
SDZ
GND
32
GND
3
PVCC
GND
1uF
1
MODSEL
GND
2
1
Power Pad
1
GND
U2
/SD_SUB
1
R17
3.3R
220nF
1
2
2
2
2
C45
1nF
R19
100k
C39
1uF
10uH
18
PVCC
C36
1
1
2
1
C23
1nF
R73
10k
2
L10
C28
680nF
20
TPA3116D2
C35
2
10uH
1 2
21
L8
1
1
22
R16
3.3R
2
2
OUTNL
220nF
220nF
2
23
GND
IN_N_SUB
1
2
AM2
GND
C17
C18
1
24
1
2
MUTE
OUTPL
25
2
1
R14 100k
INNL
BSPL
1
OUT_ N_LEFT
15
2
INPL
GND
27
26
GND
2
1
GND
BSNR
1
MUTE_LR
GAIN/SLV
OUTNR
C31
1nF
C27
680nF
1 2
14
GVDD
28
-
C37
10nF
2
C14 1uF
PLIMIT
GND
1
13
GND
GND
2
1
OUTPR
INNR
220nF
2
29
1
11
C13 1uF
2
1
INPR
C16
1
30
2
12
2
2
10
BSPR
1
9
8
FAULTZ
+
2
R12
20k
12
IN_P_SUB
C34
10nF
4R
1
7
2
IN_N_LEFT
R15
3.3R
C30
1nF
31
2
1
1
6
R11
100k
PVCC
2
5
1uF
PVCC
SDZ
1
1
C12
MODSEL
GND
3
1uF
1
2
IN_P_LEFT
10uH
C26
680nF
GND
32
GND
2
4
GND
C22
220uF
GND
C11
2
C15
1uF
L7
C21
100nF
2
GND
/SD_LR
IN_N_RIGHT
C20
1nF
GND
U1
1
IN_P_RIGHT
2
C58 100nF
EMI C-RC SNUBBER
2
2
1
1
1
GND
GND
PVCC
2
R10 3.3R
R13
100k
2
1
2
1
2
C57
10nF
Power Pad
PVCC
1
1
1
2
PVCC DECOUPLING
PVCC
GND
PVCC DECOUPLING
Copyright © 2016, Texas Instruments Incorporated
Figure 37. Schematic
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Typical Application (continued)
8.2.1 Design Requirements
DESIGN PARAMETERS
EXAMPLE VALUE
Input voltage range PVCC
4.5 V to 26 V
PWM output frequencies
400 kHz, 500 kHz, 600 kHz, 1 MHz or 1.2 MHz
Maximum output power
50 W
8.2.2 Detailed Design Procedure
The TPA31xxD2 family is a very flexible and easy to use Class D amplifier; therefore the design process is
straightforward. Before beginning the design, gather the following information regarding the audio system.
• PVCC rail planned for the design
• Speaker or load impedance
• Maximum output power requirement
• Desired PWM frequency
8.2.2.1 Select the PWM Frequency
Set the PWM frequency by using AM0, AM1 and AM2 pins.
8.2.2.2 Select the Amplifier Gain and Master/Slave Mode
In order to select the amplifier gain setting, the designer must determine the maximum power target and the
speaker impedance. Once these parameters have been determined, calculate the required output voltage swing
which delivers the maximum output power.
Choose the lowest analog gain setting that corresponds to produce an output voltage swing greater than the
required output swing for maximum power. The analog gain and master/slave mode can be set by selecting the
voltage divider resistors (R1 and R2) on the Gain/SLV pin.
8.2.2.3 Select Input Capacitance
Select the bulk capacitors at the PVCC inputs for proper voltage margin and adequate capacitance to support the
power requirements. In practice, with a well-designed power supply, two 100-μF, 50-V capacitors should be
sufficient. One capacitor should be placed near the PVCC inputs at each side of the device. PVCC capacitors
should be a low ESR type because they are being used in a high-speed switching application.
8.2.2.4 Select Decoupling Capacitors
Good quality decoupling capacitors need to be added at each of the PVCC inputs to provide good reliability,
good audio performance, and to meet regulatory requirements. X5R or better ratings should be used in this
application. Consider temperature, ripple current, and voltage overshoots when selecting decoupling capacitors.
Also, these decoupling capacitors should be located near the PVCC and GND connections to the device in order
to minimize series inductances.
8.2.2.5 Select Bootstrap Capacitors
Each of the outputs require bootstrap capacitors to provide gate drive for the high-side output FETs. For this
design, use 0.22-μF, 25-V capacitors of X5R quality or better.
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8.2.3 Application Curves
10
10
Gain = 26dB
PVCC = 12V
TA = 25°C
RL = 4Ω
Gain = 26dB
PVCC = 24V
TA = 25°C
RL = 4Ω
1
THD+N (%)
THD+N (%)
1
0.1
0.01
0.1
0.01
f = 20Hz
f = 1kHz
f = 6kHz
0.001
0.01
0.1
f = 20Hz
f = 1kHz
f = 6kHz
1
Output Power (W)
10
40
0.001
0.01
0.1
G009
Figure 38. Total Harmonic Distortion + Noise (BTL) vs
Output Power
1
Output Power (W)
10
100
G010
Figure 39. Total Harmonic Distortion + Noise (BTL) vs
Output Power
9 Power Supply Recommendations
The power supply requirements for the TPA3116D2 consist of one higher-voltage supply to power the output
stage of the speaker amplifier. Several on-chip regulators are included on the TPA3116D2 to generate the
voltages necessary for the internal circuitry of the audio path. It is important to note that the voltage regulators
which have been integrated are sized only to provide the current necessary to power the internal circuitry. The
external pins are provided only as a connection point for off-chip bypass capacitors to filter the supply.
Connecting external circuitry to these regulator outputs may result in reduced performance and damage to the
device. The high voltage supply, between 4.5 V and 26 V, supplies the analog circuitry (AVCC) and the power
stage (PVCC). The AVCC supply feeds internal LDO including GVDD. This LDO output are connected to
external pins for filtering purposes, but should not be connected to external circuits. GVDD LDO output have
been sized to provide current necessary for internal functions but not for external loading.
10 Layout
10.1 Layout Guidelines
The TPA3116D2 can be used with a small, inexpensive ferrite bead output filter for most applications. However,
since the class-D switching edges are fast, it is necessary to take care when planning the layout of the printed
circuit board. The following suggestions will help to meet EMC requirements.
• Decoupling capacitors — The high-frequency decoupling capacitors should be placed as close to the PVCC
and AVCC terminals as possible. Large (100 μF or greater) bulk power supply decoupling capacitors should
be placed near the TPA3116D2 on the PVCC supplies. Local, high-frequency bypass capacitors should be
placed as close to the PVCC pins as possible. These caps can be connected to the IC GND pad directly for
an excellent ground connection. Consider adding a small, good quality low ESR ceramic capacitor between
220 pF and 1 nF and a larger mid-frequency cap of value between 100 nF and 1 µF also of good quality to
the PVCC connections at each end of the chip.
• Keep the current loop from each of the outputs through the ferrite bead and the small filter cap and back to
GND as small and tight as possible. The size of this current loop determines its effectiveness as an antenna.
• Grounding — The PVCC decoupling capacitors should connect to GND. All ground should be connected at
the IC GND, which should be used as a central ground connection or star ground for the TPA3116D2.
• Output filter — The ferrite EMI filter (see Figure 35) should be placed as close to the output terminals as
possible for the best EMI performance. The LC filter should be placed close to the outputs. The capacitors
used in both the ferrite and LC filters should be grounded.
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Layout Guidelines (continued)
For an example layout, see the TPA3116D2 Evaluation Module (TPA3116D2EVM) User Guide (SLOU336). Both
the EVM user manual and the thermal pad application reports, SLMA002 and SLMA004, are available on the TI
Web site at http://www.ti.com.
10.2 Layout Example
Figure 40. Layout Example Top
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Layout Example (continued)
Figure 41. Layout Example Bottom
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10.3 Heat Sink Used on the EVM
The heat sink (part number ATS-TI 10 OP-521-C1-R1) used on the EVM is an 14x25x50 mm extruded aluminum
heat sink with three fins (see drawing below). For additional information on the heat sink, go to www.qats.com.
50.00±0.38
[1.969±.015]
SINK LENGTH
MACHINE THESE
3 EDGES AFTER
ANODIZATION
0.00
25.00
–0.60
+.000
.984 –.024
SINK HEIGHT
3.00
[.118]
1.00
[.118]
6.35
[.250]
3.00
[.118]
40.00
[1.575]
30.50
[1.201]
19.50
[.768]
10.00
[.394]
0
[.000]
13.90±0.38
[.547±.015]
BASE WIDTH
6.95
[.274]
5.00
[.197]
40.00
[1.575]
2X 4-40 x 6.5
Figure 42. EVM Heatsink
This size heat sink has shown to be sufficient for continuous output power. The crest factor of music and having
airflow will lower the requirement for the heat sink size and smaller types can be used.
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11 Device and Documentation Support
11.1 Related Links
The table below lists quick access links. Categories include technical documents, support and community
resources, tools and software, and quick access to sample or buy.
Table 7. Related Links
PARTS
PRODUCT FOLDER
ORDER NOW
TECHNICAL
DOCUMENTS
TOOLS &
SOFTWARE
SUPPORT &
COMMUNITY
TPA3116D2
Click here
Click here
Click here
Click here
Click here
TPA3118D2
Click here
Click here
Click here
Click here
Click here
TPA3130D2
Click here
Click here
Click here
Click here
Click here
11.2 Receiving Notification of Documentation Updates
To receive notification of documentation updates — go to the product folder for your device on ti.com. In the
upper right-hand corner, click the Alert me button to register and receive a weekly digest of product information
that has changed (if any). For change details, check the revision history of any revised document.
11.3 Community Resources
The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective
contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of
Use.
TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration
among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help
solve problems with fellow engineers.
Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and
contact information for technical support.
11.4 Trademarks
E2E is a trademark of Texas Instruments.
All other trademarks are the property of their respective owners.
11.5 Electrostatic Discharge Caution
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
11.6 Glossary
SLYZ022 — TI Glossary.
This glossary lists and explains terms, acronyms, and definitions.
12 Mechanical, Packaging, and Orderable Information
The following pages include mechanical, packaging, and orderable information. This information is the most
current data available for the designated devices. This data is subject to change without notice and revision of
this document. For browser-based versions of this data sheet, refer to the left-hand navigation.
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PACKAGE OPTION ADDENDUM
www.ti.com
15-Nov-2017
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
Lead/Ball Finish
MSL Peak Temp
(2)
(6)
(3)
Op Temp (°C)
Device Marking
(4/5)
TPA3116D2DAD
ACTIVE
HTSSOP
DAD
32
46
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-3-260C-168 HR
-40 to 85
TPA
3116
D2
TPA3116D2DADR
ACTIVE
HTSSOP
DAD
32
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-3-260C-168 HR
-40 to 85
TPA
3116
D2
TPA3118D2DAP
ACTIVE
HTSSOP
DAP
32
46
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-3-260C-168 HR
-40 to 85
TPA3118
TPA3118D2DAPR
ACTIVE
HTSSOP
DAP
32
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-3-260C-168 HR
-40 to 85
TPA3118
TPA3130D2DAP
ACTIVE
HTSSOP
DAP
32
46
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-3-260C-168 HR
-40 to 85
TPA3130
TPA3130D2DAPR
ACTIVE
HTSSOP
DAP
32
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-3-260C-168 HR
-40 to 85
TPA3130
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of
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