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TPA3116D2-Q1, TPA3118D2-Q1
SLOS862B – JULY 2015 – REVISED OCTOBER 2016
TPA311xD2-Q1 100-W and 50-W Class-D Stereo Automotive Amplifiers
1 Features
2 Applications
•
•
•
•
1
•
•
•
•
•
•
•
•
•
•
•
•
•
Supports Multiple Output Configurations
– 2 × 50 W Into a 4-Ω BTL Load at 21 V
(TPA3116D2-Q1)
– 2 × 30 W Into an 8-Ω BTL Load at 24 V
(TPA3118D2-Q1)
Wide Voltage Range: 4.5 V to 26 V
Efficient Class-D Operation
– >90% Power Efficiency Combined With Low
Idle Loss Greatly Reduces Heat Sink Size
– Advanced Modulation Schemes
Multiple Switching Frequencies
– AM Avoidance
– Master and Slave Synchronization
– Up to 1.2-MHz Switching Frequency
Feedback Power-Stage Architecture With High
PSRR Reduces PSU Requirements
Programmable Power Limit
Differential and Single-Ended Inputs
Stereo BTL and Mono PBTL Modes
Single Power Supply Reduces Component Count
Integrated Self-Protection Circuits Including
Overvoltage, Undervoltage, Overtemperature, DCDetect, and Short Circuit With Error Reporting
Designed for Automotive EMC Requirements
Thermally Enhanced Packages
– DAD (32-pin HTSSOP Pad Up)
– DAP (32-pin HTSSOP Pad Down)
– –40°C to 125°C Ambient Temperature Range
Qualified for Automotive Applications
AEC-Q100 Qualified With the Following Results:
– Device Temperature Grade 1: –40°C to 125°C
Ambient Operating Temperature Range
– Device HBM ESD Classification Level H2
– Device CDM ESD Classification Level C4B
Automotive Audio
Emergency Call
Driver Notifications
3 Description
The TPA311xD2-Q1 devices are automotive stereo,
efficient, digital-amplifier power stages for driving
speakers up to 100 W into 2 Ω in mono. The
TPA3118D2-Q1 can even drive 2 × 30 W into 8 Ω
without a heat sink on a dual-layer PCB. If even
higher power is needed, the TPA3116D2-Q1 drives
2 × 50 W into 4 Ω with a small heat sink attached to
its top-side thermal pad.
The TPA311xD2-Q1 advanced oscillator and PLL
circuit employ a multiple-switching-frequency option
to avoid AM interference; this is achieved together
with an option of either master or slave selection,
making it possible to synchronize multiple devices.
The TPA311xD2-Q1 devices are fully protected
against faults with short-circuit protection and thermal
protection as well as overvoltage, undervoltage and
dc protection. Faults are reported back to the
processor to prevent devices from being damaged
during overload conditions.
Device Information(1)
DEVICE
TPA3116D2-Q1
TPA3118D2-Q1
PACKAGE
BODY SIZE (NOM)
HTSSOP (32)
11.00 mm × 6.20 mm
(1) For all available packages, see the orderable addendum at
the end of the datasheet.
Simplified Application Circuit
AM/FM Tuner
CD or MP3
Audio Processor
and Control
Right
TPA3116D2-Q1
PBTL
Detect
Left
4.5-V to
26-V PSU
Right
LC Filter
Left
LC Filter
SD
MUTE
Aux In
FAULT
AM /FM Avoidance
Control
GAIN Control and Master or Slave Setting
Power Limit
Capable of Synchronizing
to Other Devices
AM2,1,0
GAIN/SLV
PLIMIT
SYNC
1
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.
TPA3116D2-Q1, TPA3118D2-Q1
SLOS862B – JULY 2015 – REVISED OCTOBER 2016
www.ti.com
Table of Contents
1
2
3
4
5
6
7
Features ..................................................................
Applications ...........................................................
Description .............................................................
Revision History.....................................................
Pin Configuration and Functions .........................
Specifications.........................................................
1
1
1
2
3
5
6.1
6.2
6.3
6.4
6.5
6.6
6.7
6.8
5
5
5
6
6
7
7
8
Absolute Maximum Ratings ......................................
ESD Ratings ............................................................
Recommended Operating Conditions.......................
Thermal Information ..................................................
DC Electrical Characteristics ....................................
AC Electrical Characteristics.....................................
Timing Requirements ................................................
Typical Characteristics ..............................................
Detailed Description ............................................ 10
7.1 Overview ................................................................. 10
7.2 Functional Block Diagram ....................................... 10
7.3 Feature Description................................................. 10
7.4 Device Functional Mode ......................................... 18
8
Application and Implementation ........................ 19
8.1 Application Information............................................ 19
8.2 Typical Application .................................................. 19
9 Power Supply Recommendations...................... 22
10 Layout................................................................... 22
10.1 Layout Guidelines ................................................. 22
10.2 Layout Example .................................................... 23
10.3 Heat Sink Used on the EVM ................................. 25
11 Device and Documentation Support ................. 26
11.1
11.2
11.3
11.4
11.5
11.6
11.7
Device Support......................................................
Related Links ........................................................
Receiving Notification of Documentation Updates
Community Resources..........................................
Electrostatic Discharge Caution ............................
Trademarks ...........................................................
Glossary ................................................................
26
26
26
26
26
27
27
12 Mechanical, Packaging, and Orderable
Information ........................................................... 27
4 Revision History
Changes from Revision A (August 2015) to Revision B
Page
•
Changed Table 3, column R to GND From: Short To: Open and column R to GVDD From: Open To: Short .................... 13
•
Changed Figure 19 .............................................................................................................................................................. 19
Changes from Original (July 2015) to Revision A
•
2
Page
Added all information following the pin description diagrams................................................................................................. 4
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SLOS862B – JULY 2015 – REVISED OCTOBER 2016
5 Pin Configuration and Functions
DAD PowerPAD™ Package
32-Pin HTSSOP With Exposed Thermal Pad Up
TPA3116D2-Q1 Top View
MODSEL
1
32
PVCC
SD
2
31
PVCC
FAULT
3
30
BSPR
RINP
4
29
OUTPR
RINN
5
28
GND
PLIMIT
6
27
OUTNR
GVDD
7
26
BSNR
GAIN/SLV
8
25
GND
Thermal
Pad
GND
9
24
BSPL
LINP
10
23
OUTPL
LINN
11
22
GND
MUTE
12
21
OUTNL
AM2
13
20
BSNL
AM1
14
19
PVCC
AM0
15
18
PVCC
SYNC
16
17
AVCC
DAP PowerPAD™ Package
32-Pin HTSSOP With Exposed Thermal Pad Down
TPA3118D2-Q1 Top View
MODSEL
1
32
PVCC
SD
2
31
PVCC
FAULT
3
30
BSPR
RINP
4
29
OUTPR
RINN
5
28
GND
PLIMIT
6
27
OUTNR
GVDD
7
26
BSNR
GAIN/SLV
8
25
GND
GND
9
24
BSPL
Thermal
Pad
LINP
10
23
OUTPL
LINN
11
22
GND
MUTE
12
21
OUTNL
AM2
13
20
BSNL
AM1
14
19
PVCC
AM0
15
18
PVCC
SYNC
16
17
AVCC
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Pin Functions
PIN
NAME
AM[2:0]
NO.
TYPE (1)
DESCRIPTION
13–15
I
AM avoidance frequency selection
AVCC
17
P
Analog supply
BSNL
20
BST
Bootstrap for negative left channel output, connect to 220-nF X5R, or better ceramic cap to OUTPL
BSNR
26
BST
Bootstrap for negative right channel output, connect to 220-nF X5R, or better ceramic cap to OUTNR
BSPL
24
BST
Bootstrap for positive left channel output, connect to 220-nF X5R, or better ceramic cap to OUTNL
BSPR
30
BST
Bootstrap for positive right channel output, connect to 220-nF X5R or better ceramic cap to OUTPR
FAULT
3
DO
General fault reporting including overtemperature, dc detect, open drain.
FAULT = High, normal operation
FAULT = Low, fault condition
GAIN/SLV
8
I
Selects gain and selects between master and slave modes depending on pin voltage divider.
9, 22,
25, 28
G
Ground
GVDD
7
PO
LINN
11
I
Negative audio input for left channel. Biased at 3 V. Connect to GND for PBTL mode.
LINP
10
I
Positive audio input for left channel. Biased at 3 V. Connect to GND for PBTL mode.
MODSEL
1
I
Mode selection logic input (LOW = BD mode, HIGH = 1 SPW mode). TTL logic levels with compliance
to AVCC.
MUTE
12
I
Mute signal for fast disable or enable of outputs (HIGH = outputs Hi-Z, LOW = outputs enabled). TTL
logic levels with compliance to AVCC.
OUTNL
21
PO
Negative left-channel output
OUTNR
27
PO
Negative right-channel output
OUTPL
23
PO
Positive left-channel output
OUTPR
29
PO
Positive right-channel output
PLIMIT
6
I
Power limit level adjust. Connect a resistor divider from GVDD to GND to set power limit. Connect
directly to GVDD for no power limit.
PVCC
18, 19,
31, 32
P
Power supply
RINN
5
I
Negative audio input for right channel. Biased at 3 V.
RINP
4
I
Positive audio input for right channel. Biased at 3 V.
SD
2
I
Shutdown logic input for audio amp (LOW = outputs Hi-Z, HIGH = outputs enabled). TTL logic levels
with compliance to AVCC.
SYNC
16
DIO
Clock input/output for synchronizing multiple class-D devices. Direction determined by GAIN/SLV pin.
Thermal pad
—
G
GND
(1)
4
Internally generated gate voltage supply. Not to be used as a supply or connected to any component
other than a 1-µF X7R ceramic decoupling capacitor and the PLIMIT and GAIN/SLV resistor dividers.
Connect to GND for best system performance. If not connected to GND, leave floating.
TYPE: DO = Digital output, I = Analog input, G = General ground, PO = Power output, BST = Bootstrap.
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SLOS862B – JULY 2015 – REVISED OCTOBER 2016
6 Specifications
6.1 Absolute Maximum Ratings
over operating ambient temperature range (unless otherwise noted) (1)
MIN
MAX
UNIT
PVCC, AVCC
–0.3
30
V
INPL, INNL, INPR, INNR
–0.3
6.3
V
PLIMIT, GAIN/SLV, SYNC
–0.3
GVDD + 0.3
V
AM0, AM1, AM2, MUTE, SD, MODSEL
–0.3
PVCC + 0.3
V
10
V/ms
Operating ambient temperature, TA
–40
125
°C
Operating junction temperature range, TJ
–40
150
°C
Storage temperature range, Tstg
–40
125
°C
Supply voltage, VCC
Input voltage, VI
Slew rate, maximum
(1)
(2)
(2)
AM0, AM1, AM2, MUTE, SD, MODSEL
Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating
Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
100-kΩ series resistor is needed if maximum slew rate is exceeded.
6.2 ESD Ratings
VALUE
Human-body model (HBM), per AEC Q100-002 (1)
V(ESD)
(1)
Electrostatic discharge
Charged-device model (CDM), per AEC
Q100-011
UNIT
±2000
All pins
±450
Corner pins (1, 16, 17,
and 32)
±450
V
AEC Q100-002 indicates that HBM stressing shall be in accordance with the ANSI/ESDA/JEDEC JS-001 specification.
6.3 Recommended Operating Conditions
over operating ambient temperature range (unless otherwise noted)
MIN
NOM
4.5
MAX
VCC
Supply voltage
PVCC, AVCC
VIH
High-level input
voltage
AM0, AM1, AM2, MUTE, SD, SYNC, MODSEL
VIL
Low-level input
voltage
AM0, AM1, AM2, MUTE, SD, SYNC, MODSEL
0.8
V
VOL
Low-level output
voltage
FAULT, RPULLUP = 100 kΩ, V(PVCC) = 26 V
0.8
V
IIH
High-level input
current
AM0, AM1, AM2, MUTE, SD, MODSEL (VI = 2 V, VCC = 18 V)
50
µA
RL
Minimum load
impedance
Lo
Output-filter
inductance
2
Output filter: L = 10 µH, C = 680 nF, BTL
3.2
Output filter: L = 10 µH, C = 1 µF, PBTL
1.6
Minimum output filter inductance under short-circuit condition
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26
UNIT
V
V
4
1
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Ω
µH
5
TPA3116D2-Q1, TPA3118D2-Q1
SLOS862B – JULY 2015 – REVISED OCTOBER 2016
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6.4 Thermal Information
TPA3116D2-Q1
THERMAL METRIC (1)
TPA3118D2-Q1
DAD
DAP
32 PINS
32 PINS
UNIT
44.7 (2)
32.4
°C/W
RθJA
Junction-to-ambient thermal resistance
RθJC(top)
Junction-to-case (top) thermal resistance
1.2
17.2
°C/W
RθJB
Junction-to-board thermal resistance
21.5
17.3
°C/W
ψJT
Junction-to-top characterization parameter
1.2
0.4
°C/W
ψJB
Junction-to-board characterization parameter
21
17.2
°C/W
RθJC(bot)
Junction-to-case (bottom) thermal resistance
N/A
1
°C/W
(1)
(2)
For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report.
Modeled with a 15-mm × 15-mm × 2-mm copper heat slug heat sink. A better heat sink or airflow would yield a much better RθJA.
Perfect heat sink results could be as low as RθJC(top) = 1.2 ºC/W.
6.5 DC Electrical Characteristics
TA = 25°C, AVCC = PVCC = 12 V to 24 V, RL = 4 Ω (unless otherwise noted)
PARAMETER
TEST CONDITIONS
| VOS |
Class-D output offset voltage (measured
differentially)
ICC
Quiescent supply current
ICC(SD)
Quiescent supply current in shutdown
mode
rDS(on)
Drain-source on-state resistance,
measured pin-to-pin
G
G
Gain (BTL)
Gain (SLV)
TYP
MAX
VI = 0 V, gain = 36 dB
1.5
15
SD = 2 V, no load or filter, V(PVCC) = 12 V
20
35
SD = 2 V, no load or filter, V(PVCC) = 24 V
32
50
SD = 0.8 V, no load or filter, V(PVCC) = 12 V
150°C
Low
Output high impedance
Latched
Too-high dc offset
DC output voltage
Low
Output high impedance
Latched
Undervoltage on
PVCC
V(PVCC) < 4.5 V
–
Output high impedance
Self-clearing
Overvoltage on PVCC
V(PVCC) > 27 V
–
Output high impedance
Self-clearing
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7.3.9 DC-Detect Protection
The TPA311xD2-Q1 family has circuitry which protects the speakers from dc current, which might occur due to
defective capacitors on the input or shorts on the printed circuit board at the inputs. A dc-detect fault is reported
on the FAULT pin as a low state. The dc-detect fault also causes the amplifier to shut down by changing the
state of the outputs to Hi-Z.
If automatic recovery from the short-circuit protection latch is desired, connect the FAULT pin directly to the SD
pin. This allows the FAULT pin function to automatically drive the SD pin low which clears the dc-detect
protection latch.
A dc-detect fault is issued when the output differential duty-cycle of either channel exceeds 60% for more than
420 ms at the same polarity. For several values of the supply voltage, Table 5 shows some examples of the
typical output offset voltages that trigger dc-detect protection. This feature protects the speaker from large dc
currents or ac currents less than 2 Hz. To avoid nuisance faults due to the dc-detect circuit, hold the SD pin low
at power up until the signals at the inputs are stable. Also, take care to match the impedance seen at the positive
and negative inputs to avoid nuisance dc-detect faults.
Table 5 lists the minimum output offset voltages required to trigger the dc detect. The outputs must remain at or
above the voltage listed in the table for more than 420 ms to trigger the dc detect.
Table 5. DC Detect Threshold
V(PVCC) (V)
VOS - OUTPUT OFFSET VOLTAGE (V)
4.5
0.96
6
1.3
12
2.6
18
3.9
7.3.10 Short-Circuit Protection and Automatic Recovery Feature
The TPA311xD2-Q1 family has protection from overcurrent conditions caused by a short circuit on the output
stage. The short-circuit protection fault is reported on the FAULT pin as a low state. The amplifier outputs are
switched to a high-impedance state when the short-circuit protection latch is engaged. The latch can be cleared
by cycling the SD pin through the low state.
If automatic recovery from the short-circuit protection latch is desired, connect the FAULT pin directly to the SD
pin. This allows the FAULT pin function to automatically drive the SD pin low, which clears the short-circuit
protection latch.
In systems where a possibility of a permanent short from the output to PVDD or to a high-voltage battery like a
car battery can occur, pull the MUTE pin low with the FAULT signal and an inverting transistor to ensure a high-Z
restart, as shown in Figure 15.
14
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GVDD
1
100K
2
SD
3
FAULT
4
5
GVDD
GVDD
6
7
100K
MODSEL
PVCC
SD
PVCC
FAULT
BSPR
INPR
OUTPR
INNR
GND
PLIMIT
GVDD
8
100K
1uF
MUTE
32
31
GAIN/SLV
9
GND
10
INPL
11
INNL
12
MUTE
13
AM2
14
AM1
15
AM0
16
SYNC
Thermal Pad
100K
OUTNR
BSNR
30
29
28
27
26
25
GND
24
BSPL
23
OUTPL
22
GND
21
OUTNL
20
BSNL
19
PVCC
18
PVCC
17
AVCC
TPA3116D2-Q1
Copyright © 2016, Texas Instruments Incorporated
Figure 15. MUTE Driven by Inverted FAULT
7.3.11 Thermal Protection
Thermal protection on the TPA311xD2-Q1 family prevents damage to the device when the internal die
temperature exceeds 150°C. There is a ±15°C tolerance on this trip point from device to device. Once the die
temperature exceeds the thermal trip point, the device enters the shutdown state and the outputs are disabled.
This is a latched fault.
Thermal protection faults are reported on the FAULT pin as a low state.
If automatic recovery from the thermal protection latch is desired, connect the FAULT pin directly to the SD pin.
This allows the FAULT pin function to automatically drive the SD pin low, which clears the thermal protection
latch.
7.3.12 TPA311xD2-Q1 Modulation Scheme
The TPA311xD2-Q1 family has the option of running in either BD modulation or 1SPW modulation; this is set by
the MODSEL pin.
7.3.12.1 MODSEL = GND: BD Modulation
Each output is switching from 0 volts to the supply voltage. The OUTPx and OUTNx are in phase with each other
with no input so that there is little or no current in the speaker. The duty cycle of OUTPx is greater than 50% and
OUTNx is less than 50% for positive output voltages. The duty cycle of OUTPx is less than 50% and OUTNx is
greater than 50% for negative output voltages. The voltage across the load sits at 0 V throughout most of the
switching period, reducing the switching current, which reduces any I2R losses in the load.
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OUTP
OUTN
No Output
OUTP- OUTN
0V
Speaker
Current
OUTP
OUTN
Positive Output
PVCC
OUTP-OUTN
0V
Speaker
Current
0A
OUTP
Negative Output
OUTN
OUTP - OUTN
0V
- PVCC
Speaker
Current
0A
Figure 16. BD Mode Modulation
7.3.12.2 MODSEL = HIGH: 1SPW Modulation
The 1SPW mode alters the normal modulation scheme in order to achieve higher efficiency with a slight penalty
in THD degradation, and more attention required in the output filter selection. In 1SPW mode, the outputs
operate at approximately 15% modulation during idle conditions. When an audio signal is applied, one output
decreases and one increases. The decreasing output signal quickly rails to GND at which point all the audio
modulation takes place through the rising output. The result is that only one output is switching during a majority
of the audio cycle. Efficiency is improved in this mode due to the reduction of switching losses. The THD penalty
in 1SPW mode is minimized by the high-performance feedback loop. The resulting audio signal at each halfoutput has a discontinuity each time the output rails to GND. This can cause ringing in the audio reconstruction
filter unless care is taken in the selection of the filter components and type of filter used.
16
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OUTP
OUTN
OUTP -OUTN
No Output
0V
Speaker
Current
OUTP
OUTN
Positive Output
PVCC
OUTP -OUTN
0V
Speaker
Current
0A
OUTP
Negative Output
OUTN
OUTP -OUTN
0V
- PVCC
Speaker
Current
0A
Figure 17. 1SPW Mode Modulation
7.3.13 AM Avoidance EMI Reduction
To reduce interference in the AM radio band, the TPA3116D2-Q1 has the ability to change the switching
frequency via the AM[2:0] pins. The recommended frequencies are listed in Table 6. The fundamental frequency
and its second harmonic straddle the AM radio band listed. This eliminates the tones that can be present due to
the switching frequency being demodulated by the AM radio.
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Table 6. AM Frequencies
US
EUROPEAN
AM FREQUENCY (kHz)
AM FREQUENCY (kHz)
SWITCHING FREQUENCY (kHz)
AM2
AM1
AM0
500
0
0
1
0
1
0
0
0
0
0
0
1
0
1
0
0
0
0
0
1
0
0
0
1
522–540
540–917
540–914
917–1125
914–1122
600 (or 400)
1125–1375
1122–1373
500
1375–1547
1373–1548
600 (or 400)
1547–1700
1548–1701
600 (or 500)
7.4 Device Functional Mode
7.4.1 Mono Mode (PBTL)
The TPA311xD2-Q1 family can be connected in MONO mode enabling up to 100-W output power. This is done
by:
• Connecting INPL and INNL directly to ground (without capacitors) to set the device in mono mode during
power up
• Connecting OUTPR and OUTNR together for the positive speaker terminal and OUTNL and OUTPL together
for the negative terminal
• Applying the analog input signal to INPR and INNR
TPA3116D2-Q1
4.5 V–26 V
PSU
OUTPR
OUTNR
Right
LC Filter
Left
PBTL
Detect
OUTPL
OUTNL
Figure 18. Mono Mode (PBTL)
18
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8 Application and Implementation
NOTE
Information in the following applications sections is not part of the TI component
specification, and TI does not warrant its accuracy or completeness. TI’s customers are
responsible for determining suitability of components for their purposes. Customers should
validate and test their design implementation to confirm system functionality.
8.1 Application Information
This section describes a 2.1 master-and-slave application. The master is configured as stereo outputs and the
slave is configured as a mono PBTL output.
8.2 Typical Application
A 2.1 solution, U1 TPA3116D2-Q1 in master mode 400 kHz, BTL, gain if 20 dB, power limit not implemented. U2
in Slave, PBTL mode gain of 20 dB. Inputs are connected for differential inputs.
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Typical Application (continued)
OUTPUT LC FILTER
PVCC DECOUPLING
PVCC
EMI C-RC SNUBBER
10uH
10nF
3.3R
3.3R
1nF
100nF
220uF
100nF
680nF
100K
1nF
10nF
2
SD_LR
3
1nF
IN_P_RIGHT
4
IN_N_RIGHT
5
1nF
6
7
100K
8
1uF
9
20K
10
11
1nF
IN_P_LEFT
12
IN_N_LEFT
13
1nF
14
MUTE_LR
15
16
100K
MODSEL
PVCC
SD
PVCC
FAULT
BSPR
32
31
INPR
OUTPR
INNR
GND
PLIMIT
GVDD
GAIN/SLV
GND
INPL
INNL
Thermal Pad
1
MUTE
AM2
AM1
AM0
SYNC
OUTNR
BSNR
220nF
30
29
10nF
28
680nF
1nF
27
3.3R
26
25
GND
24
BSPL
23
OUTPL
22
GND
21
OUTNL
20
BSNL
19
PVCC
18
PVCC
17
AVCC
10uH
220nF
220nF
10uH
3.3R
680nF
1nF
10nF
220nF
PVCC
10nF
680nF
1nF
TPA3116D2-Q1
1nF
220uF
100nF
3.3R
10uH
PVCC DECOUPLING
10K
PVCC
PVCC
PVCC DECOUPLING
1nF
220uF
100nF
100K
2
SD_SUB
3
1nF
IN_P_SUB
4
IN_N_SUB
5
1nF
6
7
47K
MODSEL
SD
MUTE_SUB
100K
PVCC
FAULT
BSPR
INPR
OUTPR
INNR
PLIMIT
GVDD
GAIN/SLV
9
GND
10
INPL
11
INNL
12
MUTE
13
AM2
14
AM1
15
AM0
16
SYNC
75K
32
OUTPUT LC FILTER
31
8
1uF
PVCC
TPA3116D2-Q1
GND
Thermal Pad
1
OUTNR
BSNR
EMI C-RC SNUBBER
220nF
30
10uH
29
3.3R
28
27
1uF
1nF
26
10nF
25
GND
24
BSPL
23
OUTPL
22
GND
21
OUTNL
20
BSNL
19
PVCC
18
PVCC
17
AVCC
220nF
220nF
10nF
1uF
3.3R
220nF
PVCC
1nF
1nF
10uH
220uF
100nF
1nF
PVCC DECOUPLING
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Figure 19. Typical Application Schematic
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Typical Application (continued)
8.2.1 Design Requirements
DESIGN PARAMETERS
EXAMPLE VALUE
Input voltage range, V(PVCC)
4.5 V to 26 V
PWM output frequencies
400 kHz, 500 kHz, 600 kHz, 1 MHz or 1.2 MHz
Maximum output power
50 W
8.2.2 Detailed Design Procedure
The TPA311xD2-Q1 family is a very flexible and easy-to-use class-D amplifier; therefore, the design process is
straightforward. Before beginning the design, gather the following information regarding the audio system.
• PVCC rail planned for the design
• Speaker or load impedance
• Maximum output-power requirement
• Desired PWM frequency
8.2.2.1 Select the PWM Frequency
Set the PWM frequency by using AM0, AM1 and AM2 pins.
8.2.2.2 Select the Amplifier Gain and Master or Slave Mode
In order to select the amplifier gain setting, the designer must determine the maximum power target and the
speaker impedance. Once these parameters have been determined, calculate the required output-voltage swing
which delivers the maximum output power.
Choose the lowest analog gain setting that produces an output-voltage swing greater than the required output
swing for maximum power. The analog gain and master or slave mode can be set by selecting the voltage
divider resistors (R1 and R2) on the GAIN/SLV pin.
8.2.2.3 Select Input Capacitance
Select the bulk capacitors at the PVCC inputs for proper voltage margin and adequate capacitance to support the
power requirements. In practice, with a well-designed power supply, two 100-μF, 50-V capacitors should be
sufficient. One capacitor should be placed near the PVCC inputs at each side of the device. PVCC capacitors
should be a low-ESR type because they are being used in a high-speed switching application.
8.2.2.4 Select Decoupling Capacitors
Good-quality decoupling capacitors must be added at each of the PVCC inputs to provide good reliability, good
audio performance, and to meet regulatory requirements. X5R or better ratings should be used in this
application. Consider temperature, ripple current, and voltage overshoots when selecting decoupling capacitors.
Also, these decoupling capacitors should be located near the PVCC and GND connections to the device in order
to minimize series inductances.
8.2.2.5 Select Bootstrap Capacitors
Each of the outputs requires bootstrap capacitors to provide gate drive for the high-side output FETs. For this
design, use 0.22-μF, 25-V capacitors of X5R quality or better.
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8.2.3 Application Curves
10
10
20 Hz
1 kHz
6 kHz
20 Hz
1 kHz
6 kHz
1
THD+N (%)
THD+N (%)
1
0.1
0.01
0.001
10m
Gain = 26 dB
RL = 4 Ω
0.1
0.01
100m
1
Output Power (W)
PVCC = 12 V
10
40
0.001
10m
100m
D005
TA = 25°C
10-µH + 0.68-µF filter
Figure 20. Total Harmonic Distortion + Noise (BTL) vs
Output Power
Gain = 26 dB
RL = 4 Ω
1
Output Power (W)
PVCC = 14.4 V
10
40
D006
TA = 25°C
10-µH + 0.68-µF filte
Figure 21. Total Harmonic Distortion + Noise (BTL) vs
Output Power
9 Power Supply Recommendations
The power supply requirements for the TPA3116D2-Q1 consist of one higher-voltage supply to power the output
stage of the speaker amplifier. Several on-chip regulators are included on the TPA3116D2-Q1 to generate the
voltages necessary for the internal circuitry of the audio path. It is important to note that the voltage regulators
which have been integrated are sized only to provide the current necessary to power the internal circuitry. The
external pins are provided only as a connection point for off-chip bypass capacitors to filter the supply.
Connecting external circuitry to these regulator outputs may result in reduced performance and damage to the
device. The high-voltage supply, between 4.5 V and 26 V, supplies the analog circuitry (AVCC) and the power
stage (PVCC). The AVCC supply feeds the internal LDOs, including GVDD. The LDO outputs are connected to
external pins for filtering purposes, but should not be connected to external circuits. The GVDD LDO output has
been sized to provide current necessary for internal functions but not for external loading.
10 Layout
10.1 Layout Guidelines
Because the class-D switching edges are fast, it is necessary to take care when planning the layout of the
printed circuit board. The following suggestions help to meet EMC requirements.
• Decoupling capacitors — The high-frequency decoupling capacitors should be placed as close to the PVCC
and AVCC terminals as possible. Large (100 μF or greater) bulk power supply decoupling capacitors should
be placed near the TPA3116D2-Q1 on the PVCC supplies. Local, high-frequency bypass capacitors should
be placed as close to the PVCC pins as possible. These capacitors can be connected to the IC GND pad
directly for an excellent ground connection. Consider adding a small, good-quality, low-ESR ceramic capacitor
between 220 pF and 1 nF and a larger mid-frequency capacitor of value between 100 nF and 1 µF, also of
good quality, to the PVCC connections at each end of the chip.
• Keep the current loop from each of the outputs through the filter and back to GND as small and tight as
possible. The size of this current loop determines its effectiveness as an antenna.
• Grounding — The PVCC decoupling capacitors should connect to GND. All ground should be connected at
the IC GND, which should be used as a central ground connection or star ground for the TPA3116D2-Q1.
• Output filter — The LC filter should be placed close to the outputs. The capacitor used in the LC filter should
be grounded.
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Layout Guidelines (continued)
For an example layout, see the TPA3116D2 Evaluation Module (TPA3116D2EVM) User Guide (SLOU336). Both
the EVM user manual and the thermal pad application reports, SLMA002 and SLMA004, are available on the TI
Web site at http://www.ti.com.
10.2 Layout Example
Figure 22. Layout Example Top
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Layout Example (continued)
Figure 23. Layout Example Bottom
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SLOS862B – JULY 2015 – REVISED OCTOBER 2016
10.3 Heat Sink Used on the EVM
The heat sink (part number ATS-TI 10 OP-521-C1-R1 or equivalent) used on the EVM is a 14-mm × 25-mm ×
50-mm extruded aluminum heat sink with three fins (see Figure 24). For additional information on the heat sink,
go to www.qats.com.
50.00±0.38
[1.969±.015]
SINK LENGTH
MACHINE THESE
3 EDGES AFTER
ANODIZATION
0.00
25.00
–0.60
+.000
.984 –.024
SINK HEIGHT
3.00
[.118]
1.00
[.118]
6.35
[.250]
3.00
[.118]
40.00
[1.575]
30.50
[1.201]
19.50
[.768]
10.00
[.394]
0
[.000]
13.90±0.38
[.547±.015]
BASE WIDTH
6.95
[.274]
5.00
[.197]
40.00
[1.575]
2X 4-40 x 6.5
Figure 24. EVM Heatsink
This size heat sink has shown to be sufficient for continuous output power. The crest factor of music and having
airflow lowers the requirement for heat sinking, and smaller types of heat sinks can be used.
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11 Device and Documentation Support
11.1 Device Support
11.1.1 Third-Party Products Disclaimer
TI'S PUBLICATION OF INFORMATION REGARDING THIRD-PARTY PRODUCTS OR SERVICES DOES NOT
CONSTITUTE AN ENDORSEMENT REGARDING THE SUITABILITY OF SUCH PRODUCTS OR SERVICES
OR A WARRANTY, REPRESENTATION OR ENDORSEMENT OF SUCH PRODUCTS OR SERVICES, EITHER
ALONE OR IN COMBINATION WITH ANY TI PRODUCT OR SERVICE.
11.2 Related Links
The table below lists quick access links. Categories include technical documents, support and community
resources, tools and software, and quick access to sample or buy.
Table 7. Related Links
PARTS
PRODUCT FOLDER
SAMPLE & BUY
TECHNICAL
DOCUMENTS
TOOLS &
SOFTWARE
SUPPORT &
COMMUNITY
TPA3116D2-Q1
Click here
Click here
Click here
Click here
Click here
TPA3118D2-Q1
Click here
Click here
Click here
Click here
Click here
11.3 Receiving Notification of Documentation Updates
To receive notification of documentation updates, navigate to the device product folder on ti.com. In the upper
right corner, click on Alert me to register and receive a weekly digest of any product information that has
changed. For change details, review the revision history included in any revised document.
11.4 Community Resources
The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective
contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of
Use.
TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration
among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help
solve problems with fellow engineers.
Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and
contact information for technical support.
The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective
contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of
Use.
TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration
among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help
solve problems with fellow engineers.
Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and
contact information for technical support.
11.5 Electrostatic Discharge Caution
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
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11.6 Trademarks
PowerPAD, E2E are trademarks of Texas Instruments.
All other trademarks are the property of their respective owners.
11.7 Glossary
SLYZ022 — TI Glossary.
This glossary lists and explains terms, acronyms, and definitions.
12 Mechanical, Packaging, and Orderable Information
The following pages include mechanical, packaging, and orderable information. This information is the mostcurrent data available for the designated devices. This data is subject to change without notice and without
revision of this document. For browser-based versions of this data sheet, see the left-hand navigation pane.
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PACKAGE OPTION ADDENDUM
www.ti.com
10-Dec-2020
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
(2)
Lead finish/
Ball material
MSL Peak Temp
Op Temp (°C)
Device Marking
(3)
(4/5)
(6)
TPA3116D2QDADRQ1
ACTIVE
HTSSOP
DAD
32
2000
RoHS & Green
NIPDAU
Level-3-260C-168 HR
-40 to 125
TPA
3116Q
D2
TPA3118D2QDAPRQ1
ACTIVE
HTSSOP
DAP
32
2000
RoHS & Green
NIPDAU
Level-3-260C-168 HR
-40 to 125
TPA3118Q
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of
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