User's Guide
SLOU405 – April 2015
TPA3140D2EVM User's Guide
This user’s guide describes the operation of the evaluation module for the TPA3140D2. The user’s guide
also provides design information such as the schematic, BOM, and PCB layout.
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Contents
Overview ......................................................................................................................
Operation .....................................................................................................................
2.1
Electrostatic Discharge Warning ..................................................................................
2.2
Unpacking the EVM ................................................................................................
2.3
Power Supply Setup ................................................................................................
2.4
Evaluation Module Preparations ..................................................................................
2.5
Inputs and Outputs .................................................................................................
2.6
Power Up ............................................................................................................
2.7
Automatic Gain Control (AGC) ....................................................................................
2.8
Thermal Foldback ...................................................................................................
Design Documentation ......................................................................................................
3.1
TPA3140D2 EVM Schematic......................................................................................
3.2
TPA3140D2 EVM PCB Layers ....................................................................................
3.3
TPA3140D2EVM Bill of Materials.................................................................................
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List of Figures
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TAS3140D2 PCB ............................................................................................................ 2
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TPA3140D2 EVM Schematic............................................................................................... 5
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TPA3140D2 Assembly Drawing
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TPA3140D2 EVM Top Side Layout .......................................................................................
TPA3140D2 EVM Bottom Side Layout ...................................................................................
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List of Tables
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Power Requirements ........................................................................................................ 3
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TPA3140D2EVM Parts List
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TPA3140D2EVM User's Guide
Copyright © 2015, Texas Instruments Incorporated
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1
Overview
1
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Overview
The TPA3140D2 EVM customer evaluation module demonstrates the integrated circuits TPA3140D2 from
Texas Instruments (TI).
The TPA3140D2 is a 10-W (per channel) efficient stereo digital amplifier power stage for driving 2 bridgetied speakers.
This document covers EVM specifications and design documentation that includes schematics, parts list
and layout design.
Figure 1. TAS3140D2 PCB
Table 1. TPA3140D2EVM Specification
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KEY PARAMETERS
VALUE
Power Supply Voltage
4.5 V to 14.4
Number of Channels
2 Bridge Tied Load (BTL) Stereo
Load Impedance
4 Ω (12 V) to 6 Ω (> 12 V)
Output Power BTL
10 W per channel into a 8 Ω load
TPA3140D2EVM User's Guide
SLOU405 – April 2015
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Operation
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2
Operation
This chapter describes the TPA3140D2EVM board in regards to power supply and system interfaces. The
chapter provides information regarding handling and unpacking, absolute operating conditions, and a
description of the factory default switch and jumper configuration.
The following is a step–by–step guide to configuring the TPA3140D2EVM for device evaluation.
2.1
Electrostatic Discharge Warning
Many of the components on the TPA3140D2EVM are susceptible to damage by electrostatic discharge
(ESD). Customers are advised to observe proper ESD handling precautions when unpacking and handling
the EVM, including the use of a grounded wrist strap at an approved ESD workstation.
CAUTION
Failure to observe ESD handling procedures may result in damage to EVM
components.
2.2
Unpacking the EVM
On opening the TPA3140D2EVM package, ensure that the following items are included:
• 1 piece TPA3140D2EVM board using one TPA3140D2.
If either of these items is missing, contact the Texas Instruments Product Information Center nearest you
to inquire about a replacement.
2.3
Power Supply Setup
A single power supply is required to power up the EVM. Since most of the pins are PVCC compliant, the
PVCC supply can also be used to power the analog supply (AVCC) and can be used to pull up the logic
pins for shutdown (SD) control, and fault detection (FAULT).
Table 1. Power Requirements
DESCRIPTION
VOLTAGE RANGE
CURRENT REQUIREMENT
MINIMUM WIRE SIZE
PVCC
4.5 to 14.4 V
4A
24 AWG
CAUTION
Applying voltages above the limitations given in table above may cause
permanent damage to your hardware.
2.4
Evaluation Module Preparations
1. Ensure that the external power source is set to OFF.
2. Connect the external regulated power supply adjusted from 4.5 V to 14.4 V to the module PVCC and
GND banana jacks taking care to observe marked polarity.
2.5
Inputs and Outputs
1. For a BTL Configuration, connect a Load(s) across the outputs (OUTL+ and OUTL–) and (OUTR+ and
OUTR–).
2. For PBTL configuration, connect a single load from one of the left speaker jacks to one of the right
speaker jacks depending on how the filters are loaded. Apply a single input, differential or singleended, to the RIN RCA phono plug and tie LINP and LINN directly to Ground (without capacitors) via
J3 and J4.
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Operation
2.6
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Power Up
1. Select the desired gain and mode of operation via J5, J8, and J9 headers. Verify correct voltage and
input polarity and turn the external power supplies ON. The EVM should begin operation.
2. Adjust the audio source for the correct volume.
2.7
Automatic Gain Control (AGC)
The AGC allows the adjustment of the maximum output voltage without signal clipping for enhancement
speaker protection and audio quality.
Gain limit threshold (LIMTHRES) adjust the input gain control with a fast attack such that the audio output
is largely attenuated to highest unclipped possible amplitude such that excessive input signals will not
result in hard distortion, and equally important it reduces the maximum output power as well as reduces
the amount of high frequency audio energy fed to a tweeter in a 2-way speaker; thus, protecting the
speaker and increase overall system reliability. Resistor pot R7 is used to adjust the gain limit threshold
level. The user can adjust the R7 pot such that LIMTHRES voltage equals to GVDD to defeat the limit
threshold.
The AGC release speed is set by an external voltage divider (J9) to select from fixed modes including
disabling AGC (J9 = OFF, hard clip action operation as TPA3110D2 PLIMIT) as well as a selection
between fast, nominal or slow rates.
2.8
Thermal Foldback
A thermal foldback circuit is implemented to enhance system reliability by reducing risk of thermal
runaway and/or shutdown by reducing the amplifier’s gain such that the output power is reduced. The
thermal foldback is activated when a thermal trip point at a lower level than the OTE (Over Temperature
Error) trip point is tripped. Thermal foldback acts as the AGC function, but with an attack speed chosen to
match thermal time constants in a system with a TPA3140D2 mounted with a realistic PCB layout.
Thermal foldback can be disabled with J9 set to OFF.
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TPA3140D2EVM User's Guide
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Design Documentation
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3
Design Documentation
3.1
TPA3140D2 EVM Schematic
Figure 2 shows the TPA3140D2 EVM schematic.
PVCC
PVCC
1
PVCC
PVCC
1
C1
LINP
3
4
1
LIN
2
SHUTDOWN
J10
100k
C3
1000pF
LIMTHRES = GVDD
1µF
GND
1
L1
PVCCL
R1
C4
0.1µF
C2
100 µF
GND
GND
1
2
RCA Jack White
SDz
J1
FAULTz
GND
C5
LINN
1
2
3
J2
1µF
LINP
LINN
GND
LIMRATE
GAIN
SSCTRL
J3
LIMTHRES
J4
1
2
PBTL
1
2
R6
GND
1
2
SD
FAULT
3
4
LINP
LINN
5
LIMRATE
6
GAIN
7
SSCTRL
8
LIMTHRES
9
R7
10.0k
GND
GND
GND
U1
2
1
100k
10
29
GVDD
C6
BSPL
26
OUTPL
25
PGND
24
2
4
6
8
11
RINN
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