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TPA3251D2EVM

TPA3251D2EVM

  • 厂商:

    BURR-BROWN(德州仪器)

  • 封装:

    -

  • 描述:

    EVALUATION MODULE TPA3251D2

  • 数据手册
  • 价格&库存
TPA3251D2EVM 数据手册
User's Guide SLVUAG8A – September 2015 – Revised October 2015 TPA3251D2EVM This user’s guide describes the operation of the evaluation module (TPA3251D2EVM) for the TPA3251D2 175-W Stereo/350-W mono PurePath™ Ultra-HD Analog Input Power Stage. The user’s guide also provides design information, which includes schematic, BOM, and PCB layout. For questions and support go to the E2E forums (e2e.ti.com). The main contents of this document are: • Hardware descriptions and implementation • Design information Related documents: • TPA3251D2 Data Sheet (SLASE40) 1 2 3 4 Contents Hardware Overview.......................................................................................................... 2 1.1 TPA3251D2EVM Features ........................................................................................ 2 1.2 TPA3251D2EVM Frequency Adjust .............................................................................. 3 1.3 TPA3251D2EVM Single-Ended and Differential Input ......................................................... 3 1.4 TPA3251D2EVM Clip Overtemperature and Fault Indicators ................................................ 4 TPA3251D2EVM Setup ..................................................................................................... 5 2.1 TPA3251D2EVM Setup ............................................................................................ 5 2.2 Hardware Requirements ........................................................................................... 5 2.3 Hardware Default Setup BTL (2.0) ............................................................................... 6 Using TPA3251D2EVM in Different Output Configurations ............................................................ 7 3.1 BTL Plus Two SE (2.1) Operation ................................................................................ 7 3.2 PBTL (0.1) Output Operation ...................................................................................... 8 3.3 Single-Ended (SE) Output (4.0) Operation ...................................................................... 8 Board Layouts, Bill of Materials, and Schematic ........................................................................ 9 4.1 TPA3251D2EVM Board Layouts ................................................................................. 9 4.2 TPA3251D2EVM Board Dimension ............................................................................. 10 4.3 Bill of Materials .................................................................................................... 11 4.4 TPA3251D2EVM Schematic ..................................................................................... 14 List of Figures 1 TPA3251D2EVM ............................................................................................................. 2 2 TPA3251D2EVM Connections ............................................................................................. 5 3 TPA3251D2EVM Top Composite Assembly ............................................................................. 9 4 TPA3251D2EVM Bottom Composite Assembly ......................................................................... 9 5 TPA3251D2EVM Board Dimension ...................................................................................... 10 6 TPA3251D2EVM Schematic .............................................................................................. 14 List of Tables 1 Frequency Adjust Master Mode Selection ................................................................................ 3 2 Fault and Clip Overtemperature Status ................................................................................... 4 3 Mode Selection Pins......................................................................................................... 7 4 Bill of Materials ............................................................................................................. 11 PurePath is a trademark of Texas Instruments. SLVUAG8A – September 2015 – Revised October 2015 Submit Documentation Feedback Copyright © 2015, Texas Instruments Incorporated TPA3251D2EVM 1 Hardware Overview 1 www.ti.com Hardware Overview The TPA3251D2EVM PurePath™ Ultra-HD evaluation module demonstrates the TPA3251D2DDV integrated circuit from Texas Instruments. The TPA3251D2DDV is a high-performance, high-power, classD amplifier that enables true premium sound quality with high efficiency class-D technology. It features an advance integrated feedback design and high-speed gate driver error correction (PurePath Ultra-HD), which enables ultra-low distortion across the audio band and superior audio quality. This EVM supports 2 BTL (stereo 2.0) output channels, 1 PBTL (mono 0.1) output channel, 1 BTL plus 2 SE (2.1) output channels, and 4 SE (4.0) output channel configurations. The NE5532 is a high-performance audio op amp designed to allow TPA3251D2DDV operation with differential or single-ended input signals to the EVM with differential inputs yielding the optimal performance. TPA3251D2EVM is a complete 2 VRMS analog input 2 × 175-W stereo/1 × 350-W mono high-power amplifier ready for evaluation and excellent listening experience. Figure 1. TPA3251D2EVM 1.1 TPA3251D2EVM Features The TPA3251D2EVM has following features: • Stereo PurePath Ultra-HD evaluation module • Self-contained protection system (short circuit, clip, and thermal) • Standard 2 VRMS differential input or single-ended line input • BTL, PBTL, and SE output configuration support • Frequency adjust and oscillator sync interface • Single supply voltage range 18–38 V • Double-sided, plated-through, 2-oz Cu, 2-layer PCB layout 2 TPA3251D2EVM SLVUAG8A – September 2015 – Revised October 2015 Submit Documentation Feedback Copyright © 2015, Texas Instruments Incorporated Hardware Overview www.ti.com 1.2 TPA3251D2EVM Frequency Adjust The TPA3251D2EVM offers hardware trimmed oscillator frequency by external control of the FREQ_ADJ pin. The Frequency adjust can be used to reduce interference problems while using a radio receiver tuned within the AM band, the switching frequency can be changed from nominal to lower values. These values should be chosen such that the nominal and the lower value switching frequencies together results in the fewest cases of interference throughout the AM band. The oscillator frequency can be selected by the value of the FREQ_ADJ resistor connected to GND in master mode according to Table 1. Table 1. Frequency Adjust Master Mode Selection Master Mode Resistor to GND Nominal 10 kΩ AM1 20 kΩ AM2 30 kΩ For slave-mode operation, turn off the oscillator by pulling the FREQ_ADJ pin to DVDD. This configures the OSC_I/O pins as inputs to be slaved from an external differential clock. In a master/slave system interchannel delay is automatically setup between the switching phases of the audio channels, which can be illustrated by no idle channels switching at the same time. This will not influence the audio output, but only the switch timing to minimize noise coupling between audio channels through the power supply. This will optimize audio performance and result in better operating conditions for the power supply. The interchannel delay will be setup for a slave device depending on the polarity of the OSC_I/O connection such that slave mode 1 is selected by connecting OSC_I/O of the master device in phase with OSC_I/O of the slave device (+ to + and – to –), while slave mode 2 is selected by connecting the OSC_I/O's out of phase (+ to – and – to +). 1.3 TPA3251D2EVM Single-Ended and Differential Input The TPA3251D2EVM supports both differential and single-ended inputs. For single-ended inputs, J4 and/or J19 jumpers are set to the SE position, so that the TPA3251D2EVM uses the NE5532 to convert the single-ended input signal to differential to properly drive the differential inputs of the TPA3251D2. The input RCA jack, J3, is used to provide INA and INB inputs and RCA jack J18 is used to provide INC and IND inputs with single-ended inputs. For differential input operation, J4 and/or J19 jumpers are set to the DIFF position, and the TPA3251D2EVM uses the NE5532 to buffer the differential input signal to the differential inputs of the TPA3251D2. The input RCA jack, J3, is used to provide INA, RCA jack J14 provides INB, RCA jack J18 provides INC, and RCA jack J15 provides IND with differential inputs. NOTE: Single-ended input settings on the TPA3251D2EVM should only be used for channels with output configuration BTL or PBTL, not SE. For SE output configuration J4 and/or J19 jumpers for that channel must be set to the DIFF position, so the input signal INx is mapped directly to OUTx. SLVUAG8A – September 2015 – Revised October 2015 Submit Documentation Feedback Copyright © 2015, Texas Instruments Incorporated TPA3251D2EVM 3 Hardware Overview 1.4 www.ti.com TPA3251D2EVM Clip Overtemperature and Fault Indicators The TPA3251D2EVM is equipped with LED indicators that illuminate when the FAULT and/or CLIP_OTW pin goes low. See Table 2 and the TPA3251D2 data sheet (SLASE40) for more details. Table 2. Fault and Clip Overtemperature Status 4 FAULT CLIP_OTW 0 0 Overtemperature (OTE) or overload (OLP) or undervoltage (UVP). Junction temperature higher than 125°C (overtemperature warning). 0 0 Overload (OLP) or undervoltage (UVP). Junction temperature higher than 125°C (overtemperature warning). 0 1 Overload (OLP) or undervoltage (UVP). Junction temperature lower than 125°C. 1 0 Junction temperature higher than 125°C (overtemperature warning) 1 1 Junction temperature lower than 125°C and no OLP or UVP faults (normal operation) TPA3251D2EVM Description SLVUAG8A – September 2015 – Revised October 2015 Submit Documentation Feedback Copyright © 2015, Texas Instruments Incorporated TPA3251D2EVM Setup www.ti.com 2 TPA3251D2EVM Setup This section describes the TPA3251D2EVM hardware setup and connection. 2.1 TPA3251D2EVM Setup Figure 2 illustrates the TPA3251D2EVM connection. Power Supply 3-3 V LED OUTA SE A/B Input DIFF A Input OUTB DIFF B Input TPS3251D2 Device Under Heat Sink SE C/D Input DIFF C Input GND OUTC OUTD DIFF D Input Warning LEDs RESET Switch Figure 2. TPA3251D2EVM Connections 2.2 Hardware Requirements The following hardware is required for this EVM: • TPA3251D2EVM (AIP025-001) • Power supply 5–14 A/18–38 VDC • Two 3–8 Ω (≈100 W) speakers/resistor loads • Four speaker/banana cables • RCA input cables • Analog output audio source SLVUAG8A – September 2015 – Revised October 2015 Submit Documentation Feedback Copyright © 2015, Texas Instruments Incorporated TPA3251D2EVM 5 TPA3251D2EVM Setup 2.3 www.ti.com Hardware Default Setup BTL (2.0) BTL (2.0) default hardware setup is as follows: • Remove the EVM from the ESD bag. • Check that jumpers are in their default state as shown in Figure 1 for stereo BTL operation: – J4 and J19 pin 1-pin 2 position (SE Input) – J5 and J6 pin 2-pin 3 position (2 BTL Output) – J7, J8, J17, and J21 out – J16 pin 3-pin 4 position (Master Mode) – J22, J23, J24 and J25 in (BTL Outputs) • Set S1 to the RESET position. • Set power supply to 36 V (18- to 38-V range) and current to 10 A (5- to 14-A range). Do not power up until all connections are completed. • Connect power supply to TPA3251D2 EVM positive terminal to PVDD (RED) and negative terminal to GND (BLACK). • Connect left channel speaker/power resistor load (3–8 Ω) to TPA3251D2 EVM positive output terminal to OUTA (RED) and AP analog input channel A positive terminal. • Connect left channel speaker/power resistor load (3–8 Ω) to TPA3251D2 EVM negative output terminal to OUTB (BLACK) and AP analog input channel A negative terminal. • Connect right channel speaker/power resistor load (3–8 Ω) to TPA3251D2 EVM positive output terminal to OUTC (RED) and AP analog input channel B positive terminal. • Connect right channel speaker/power resistor load (3–8 Ω) to TPA3251D2 EVM negative output terminal to OUTD (BLACK) and AP analog input channel B negative terminal. • Be careful not to mix up PVDD and OUTA and OUTB terminals, since the colors are the same (RED). • For single-ended stereo inputs, connect AP channel A XLR to RCA male jacks to female RCA jacks input A/AB (RED) and AP channel B XLR to RCA male jacks to female RCA jacks input C/CD (WHITE) and set J4 and J19 jumper positions to SE. • For differential stereo inputs, connect positive RCA male jacks to female RCA jacks input A/AB (RED) and input C/CD (WHITE) and connect negative RCA male jacks to female RCA jacks input B (YELLOW) and input D (BLACK) and set J4 and J19 jumper positions to DIFF. • Power up power supply once all the connections are made correctly and the 3.3-V LED (GREEN) will illuminate. • Set S1 to the NORMAL position. • CLIP_OTWz (ORANGE) and FAULTz (RED) LEDs should be off, if the audio source is off. NOTE: J3/J10 and J18/J15 can be used for differential inputs to INA/INB and INC/IND, respectively. Using a smart phone/tablet/PC with headphone to RCA cable, audio streaming via headphone jack can begin once the EVM is powered up correctly with jumpers in their default state. Start the media player of your choice and enjoy the enhanced audio performance TPA3251D2 provides as a quick check of the setup. 6 TPA3251D2EVM SLVUAG8A – September 2015 – Revised October 2015 Submit Documentation Feedback Copyright © 2015, Texas Instruments Incorporated Using TPA3251D2EVM in Different Output Configurations www.ti.com 3 Using TPA3251D2EVM in Different Output Configurations The TPA3251D2EVM can be configured for four different output operations. The 2.0 BTL configuration is the default set up of the TPA3251D2EVM described in Section 2.3. The remaining three configurations are 2.1 BTL plus two single-ended (SE) outputs, 0.1 PBTL output, and 4.0 single-ended (SE) outputs. Table 3. Mode Selection Pins Mode Pins 3.1 Input Mode Output Configuration Description M2 M1 0 0 2N + 1 2 × BTL 0 1 2N/1N + 1 1 × BTL + 2 × SE 1 0 2N + 1 1 × PBTL 1 1 1N + 1 4 × SE Stereo BTL output configuration 2.1 BTL + SE mode Paralleled BTL configuration. Connect INPUT_C and INPUT_D to GND. Single-ended output configuration BTL Plus Two SE (2.1) Operation Configure the EVM as follows for 2 SE + 1 BTL operation: • Set J6 to L and J5 to H. • Connect left (stereo) speaker/power resistor load (2–4 Ω) positive terminal to OUTC and remove jumper J24. • Connect right (stereo) speaker/power resistor load (2–4 Ω) positive terminal to OUTD and remove jumper J25. • Connect subwoofer (mono) speaker/power resistor load (3–8 Ω) positive terminal to OUTA and negative terminal to OUTB. • Set J19 jumper position to DIFF. • Connect left (stereo) channel input to female RCA jack input C/CD (WHITE) for OUTC speaker. • Connect right (stereo) channel input to female RCA jack input D (BLACK) for OUTD speaker. • For single-ended subwoofer (mono) input, connect RCA male jack to female RCA jack input A/AB (RED) and set J4 jumper positions to SE. • For differential subwoofer (mono) inputs, connect positive RCA male jack to female RCA jack input A/AB (RED) and connect negative RCA male jack to female RCA jack input B (YELLOW) and set J4 jumper positions to DIFF. NOTE: OUTC and OUTD are the single-ended output channels and OUTA and OUTB are the BTL channel for 2.1 operations. SLVUAG8A – September 2015 – Revised October 2015 Submit Documentation Feedback Copyright © 2015, Texas Instruments Incorporated TPA3251D2EVM 7 Using TPA3251D2EVM in Different Output Configurations 3.2 www.ti.com PBTL (0.1) Output Operation Configure the EVM as follows for PBTL operations: • Set J6 to H and J5 to L. • Connect speaker/power resistor (2–4 Ω) positive terminal to OUTA and OUTC (OUT A and C shorted). • Connect speaker/power resistor (2–4 Ω) negative terminal to OUTB and OUTD (OUT B and D shorted). • Install PBTL jumpers J7 and J8 (pulls input C and input D to GND). • For single-ended mono input, connect RCA male jack to female RCA jack input A/AB (RED) and set J4 jumper positions to SE. • For differential mono inputs, connect positive RCA male jack to female RCA jack input A/AB (RED) and connect negative RCA male jack to female RCA jack input B (YELLOW) and set J4 jumper position to DIFF. NOTE: INA and INB are the inputs for PBTL and INC and IND are grounded for PBTL operation. 3.3 Single-Ended (SE) Output (4.0) Operation Configure the EVM as follows for 4 single-ended operations: • Set J6 to H and J5 to H. • Connect speaker/power resistor (2–4 Ω) positive terminal to OUTA and remove jumper J22. • Connect speaker/power resistor (2–4 Ω) positive terminal to OUTB and remove jumper J23. • Connect speaker/power resistor (2–4 Ω) positive terminal to OUTC and remove jumper J24. • Connect speaker/power resistor (2–4 Ω) positive terminal to OUTD and remove jumper J25. • Set both J4 and J19 jumpers position to DIFF. • Connect input to female RCA jack input A/AB (RED) for OUTA speaker. • Connect input to female RCA jack input B (YELLOW) for OUTB speaker. • Connect input to female RCA jack input C/CD (WHITE) for OUTC speaker. • Connect input to female RCA jack input D (BLACK) for OUTD speaker. spacer spacer spacer spacer spacer NOTE: The performance of the TPA3251D2EVM/TPA3251D2DDV is dependent on the power supply. Design the power supply with margins that can deliver the needed power. In lowfrequency applications additional bulk capacitance may be needed. Replacing the bulk capacitors on the TPA3251D2EVM with 3300 µF or more capacitance may be necessary, depending on the power supply used. 8 TPA3251D2EVM SLVUAG8A – September 2015 – Revised October 2015 Submit Documentation Feedback Copyright © 2015, Texas Instruments Incorporated Board Layouts, Bill of Materials, and Schematic www.ti.com 4 Board Layouts, Bill of Materials, and Schematic 4.1 TPA3251D2EVM Board Layouts Figure 3 and Figure 4 illustrate the board layouts for the EVM. Figure 3. TPA3251D2EVM Top Composite Assembly Figure 4. TPA3251D2EVM Bottom Composite Assembly SLVUAG8A – September 2015 – Revised October 2015 Submit Documentation Feedback Copyright © 2015, Texas Instruments Incorporated TPA3251D2EVM 9 Board Layouts, Bill of Materials, and Schematic 4.2 www.ti.com TPA3251D2EVM Board Dimension Figure 5 illustrates the TPA3251D2EVM board dimensions 140 mm × 120 mm. Figure 5. TPA3251D2EVM Board Dimension 10 TPA3251D2EVM SLVUAG8A – September 2015 – Revised October 2015 Submit Documentation Feedback Copyright © 2015, Texas Instruments Incorporated Board Layouts, Bill of Materials, and Schematic www.ti.com 4.3 Bill of Materials Table 4 displays the BOM for this EVM. Table 4. Bill of Materials Designator Qty Value Description Package Reference Part Number Manufacturer !PCB1 1 C1 1 0.047uF CAP, CERM, 0.047 µF, 25 V, +/- 10%, X7R, 0402 0402 AIP025 Any GRM155R71E473KA88D C2, C9, C13, C14, C15, C22, C51, C67, C69, C72, C82 11 0.1uF CAP, CERM, 0.1uF, 50V, +/-10%, X7R, 0603 Murata 0603 C0603C104K5RACTU Kemet C3 1 1uF C4 1 2.2uF CAP, CERM, 1 µF, 50 V, +/- 10%, X7R, 0805 0805 GRM21BR71H105KA12L Murata CAP, CERM, 2.2 µF, 50 V, +/- 10%, X5R, 0805 0805 C2012X5R1H225K125AB C5 1 TDK 47uF CAP, AL, 47 µF, 16 V, +/- 20%, 0.36 ohm, SMD SMT Radial D EEE-FK1C470P C6, C17, C20, C28, C55, C62, C63, C66, C71 Panasonic 9 10uF CAP, AL, 10 µF, 16 V, +/- 20%, 1.35 ohm, SMD SMT Radial B EEE-FK1C100R Panasonic C7 1 5600pF CAP, CERM, 5600 pF, 50 V, +/- 10%, X7R, 0603 0603 GRM188R71H562KA01D Murata C8, C50 2 0.47uF CAP, CERM, 0.47 µF, 25 V, +/- 10%, X7R, 0603 0603 GRM188R71E474KA12D Murata C10 1 100uF CAP, AL, 100 µF, 6.3 V, +/- 20%, 0.7 ohm, SMD SMT Radial C EEE-FK0J101UR Panasonic C11, C26, C37, C45, C49, C61 6 0.01uF CAP, CERM, 0.01 µF, 50 V, +/- 10%, X7R, 0603 0603 GRM188R71H103KA01D Murata C12 1 4700pF CAP, CERM, 4700 pF, 50 V, +/- 10%, X7R, 0603 0603 C0603X472K5RACTU Kemet C16, C53, C70, C81 4 10uF CAP, CERM, 10 µF, 16 V, +/- 10%, X5R, 0805 0805 EMK212BJ106KG-T Taiyo Yuden C18, C23, C57, C65 4 22pF CAP, CERM, 22 pF, 50 V, +/- 5%, C0G/NP0, 0603 0603 GRM1885C1H220JA01D Murata C19, C30, C58, C64 4 100pF CAP, CERM, 100 pF, 50 V, +/- 5%, C0G/NP0, 0603 0603 GRM1885C1H101JA01D Murata C21, C34, C42, C56 4 470uF CAP, AL, 470 µF, 63 V, +/- 20%, 0.059 ohm, TH D16xL20mm EEU-FC1J471 Panasonic C24, C35, C43, C59 4 0.68uF CAP, Film, 0.68 µF, 250 V, +/- 5%, TH 18x9x17.5mm B32652A3684J EPCOS Inc C25, C36, C44, C60 4 1000pF CAP, CERM, 1000 pF, 50 V, +/- 5%, C0G/NP0, 1206 1206 GRM3195C1H102JA01D Murata C27, C29, C52, C54 4 0.033uF CAP, CERM, 0.033 µF, 50 V, +/- 10%, X7R, 0603 0603 GRM188R71H333KA61D Murata C31, C46 2 2200uF CAP, AL, 2200 µF, 50 V, +/- 20%, 0.023 ohm, TH Dia 18mm EEU-FC1H222 Panasonic C32, C33, C47, C48, C83, C84 6 1uF CAP, CERM, 1 µF, 50 V, +/- 10%, X7R, 1206 1206 GRM31MR71H105KA88L Murata C38 1 4.7uF CAP, CERM, 4.7 µF, 25 V, +/- 10%, X7R, 1206 1206 GRM31CR71E475KA88L Murata C39 1 47uF CAP, AL, 47 µF, 50 V, +/- 20%, 0.3 ohm, SMD SMT Radial G EEE-FC1H470P Panasonic C40, C41 2 1uF CAP, CERM, 1 µF, 16 V, +/- 10%, X7R, 0603 0603 GRM188R71C105KA12D Murata C68 1 0.1uF CAP, CERM, 0.1 µF, 50 V, +/- 10%, X7R, 0603 0603 C0603C104K5RACTU Kemet D1 1 100V Diode, Schottky, 100 V, 1 A, SMA SMA B1100-13-F Diodes Inc. D2 1 Orange LED, Orange, SMD LED_0805 LTST-C170KFKT Lite-On D3 1 100V Diode, Schottky, 100 V, 3 A, SMA SMA SK310A-TP Micro Commercial Components D4 1 Red LED, Red, SMD LED_0805 LTST-C170KRKT Lite-On D5 1 Green LED, Green, SMD LED_0805 LTST-C170KGKT Lite-On H1, H2, H3, H4, H5 5 M3x5m m MACHINE SCREW PAN PHILLIPS M3 5mm Screw M3 Phillips head MPMS 003 0005 PH B&F Fastener Supply H6, H7 2 M3x8m m MACHINE SCREW PAN PHILLIPS M3 8mm Screw M3 Phillips head MPMS 003 0005 PH B&F Fastener Supply H8, H9, H10, H11, H12 5 M3 Standoff, Hex,25mm Length, M3, Aluminum Standoff M3 24438 Keystone HEATSINK 1 Heat Sink, Vertical Heatsink ATS-TI1OP-519-C1-R3 Advanced Thermal Solutions J1, J2, J9 3 Dual Binding Posts with Base, 2x1, TH Dual Binding Posts with Base, 2x1, TH 6883 Pomona Electronics J3 1 RCA Jack, Red, R/A, TH PC Mount Phono Jack-Red, TH 971 Keystone J4, J5, J6, J19 4 Header, 100mil, 3x1, Gold, TH PBC03SAAN PBC03SAAN Sullins Connector Solutions Printed Circuit Board 1x3 SLVUAG8A – September 2015 – Revised October 2015 Submit Documentation Feedback Copyright © 2015, Texas Instruments Incorporated TPA3251D2EVM 11 Board Layouts, Bill of Materials, and Schematic www.ti.com Table 4. Bill of Materials (continued) 12 Designator Qty J7, J8, J21 Description Package Reference Part Number Manufacturer 3 Header, 100mil, 2x1, Gold, TH Sullins 100mil, 1x2, 230 mil above insulator PBC02SAAN Sullins Connector Solutions J10, J12 2 Header, 2.54 mm, 3x1, TH Header, 2.54mm, 3x1, TH 22-11-2032 Molex J11, J20 2 Binding Post, BLACK, TH 11.4x27.2mm 7007 Keystone J14 1 RCA Jack, Yellow, R/A, TH RCA Jack, Yellow, R/A, TH 973 Keystone J15 1 RCA Jack, Black, R/A, TH RCA Jack, Black, R/A, TH 972 Keystone J16 1 Header, 100mil, 4x2, Tin, TH Header, 4x2, 100mil, Tin PEC04DAAN Sullins Connector Solutions J17 1 Header (friction lock), 100mil, 4x1, Gold, TH Header 4x1 keyed 0022112042 Molex J18 1 RCA Jack, White, R/A, TH PC Mount Phono Jack-White, TH 970 Keystone J22, J23, J24, J25 4 JUMPER TIN SMD 6.85x0.97x2.51 mm S1911-46R Harwin L1 1 100uH Inductor, Shielded Drum Core, Ferrite, 100 µH, 1.5 A, 0.165 ohm, SMD 10x5x10mm 7447714101 Wurth Elektronik eiSos L2, L3, L4, L5 4 7uH Inductor, Toroid, Powdered Iron, 7 µH, 6.5 A, 0.0215 ohm, TH 28.6x12.3mm MA5173-AE Coilcraft L6 1 10uH Inductor, Wirewound, 10 µH, 0.8 A, 0.204 ohm, SMD 2-Pin SMD, Body 4 x 4 mm, Height 1.2 mm NRS4012T100MDGJV Taiyo Yuden Q1, Q2 2 60V MOSFET, N-CH, 60 V, 0.17 A, SOT-23 SOT-23 2N7002-7-F Diodes Inc. R1, R3, R4, R12, R30, R44, R46 7 0 RES, 0, 5%, 0.1 W, 0603 0603 CRCW06030000Z0EA Vishay-Dale R2 1 182k RES, 182 k, 1%, 0.125 W, 0805 0805 ERJ-6ENF1823V Panasonic R5, R10, R19, R23, R33, R35 6 100 RES, 100, 1%, 0.1 W, 0603 0603 CRCW0603100RFKEA Vishay-Dale R6, R11, R14, R18, R22 5 3.3 RES, 3.3, 5%, 0.1 W, 0603 0603 CRCW06033R30JNEA Vishay-Dale R7, R8, R20, R21, R25, R27, R37, R38, R41, R42 10 10.0k RES, 10.0 k, 0.1%, 0.1 W, 0603 0603 RT0603BRD0710KL Yageo America R9, R43, R45, R48, R61 5 100k RES, 100 k, 1%, 0.063 W, 0402 0402 CRCW0402100KFKED Vishay-Dale R13 1 22.0k RES, 22.0 k, 1%, 0.1 W, 0603 0603 RC0603FR-0722KL Yageo America R15, R36, R52 3 10.0k RES, 10.0 k, 1%, 0.1 W, 0603 0603 CRCW060310K0FKEA Vishay-Dale R16 1 20.0k RES, 20.0 k, 1%, 0.1 W, 0603 0603 RC0603FR-0720KL Yageo America R17 1 30.0k RES, 30.0 k, 1%, 0.1 W, 0603 0603 RC0603FR-0730KL Yageo America R24, R28 2 47k RES, 47 k, 5%, 0.1 W, 0603 0603 RC0603JR-0747KL Yageo America R26 1 3.30k RES, 3.30 k, 1%, 0.1 W, 0603 0603 RC0603FR-073K3L Yageo America R29, R31 2 1.00k RES, 1.00 k, 1%, 0.1 W, 0603 0603 CRCW06031K00FKEA Vishay-Dale R32 1 12.0k RES, 12.0 k, 1%, 0.1 W, 0603 0603 ERJ-3EKF1202V Panasonic R39 1 4.99k RES, 4.99 k, 1%, 0.063 W, 0402 0402 CRCW04024K99FKED Vishay-Dale R40 1 1.00k RES, 1.00 k, 1%, 0.063 W, 0402 0402 CRCW04021K00FKED Vishay-Dale R53 1 499 RES, 499, 1%, 0.1 W, 0603 0603 CRCW0603499RFKEA Vishay-Dale S1 1 Switch, SPDT, On-On, 2 Pos, TH Switch, 7x4.5mm 200USP1T1A1M2RE E-Switch SH1, SH2, SH3, SH4, SH5 5 1x2 Shunt, 100mil, Gold plated, Black Shunt 969102-0000-DA 3M TP1, TP2, TP3, TP4, TP5, TP6, TP7, TP8, TP9, TP10, TP11, TP12, TP13, TP14 14 Grey Test Point, Multipurpose, Grey, TH Grey Multipurpose Testpoint 5128 Keystone U1 1 High Voltage 1A Step Down Switching Regulator, 10-pin LLP, Pb-Free SDC10A LM5010ASD/NOPB Texas Instruments U2 1 FIXED LOW-DROPOUT VOLTAGE REGULATOR, DCY0003A DCY0003A TLV1117-33IDCY Texas Instruments U3 1 1A Low Dropout Regulator, 4-pin SOT-223, Pb-Free MP04A LM2940IMP-12/NOPB Texas Instruments U4 1 150W Stereo/300W MONO PurePath HD Analoginput Power Stage, DDV0044D DDV0044D TPA3251D2DDVR Texas Instruments U5, U6 2 Dual Low-Noise Operational Amplifier, 10 to 30 V, 0 to 70 degC, 8-pin SOIC (D0008A), Green (RoHS & no Sb/Br) D0008A NE5532ADR Texas Instruments TPA3251D2EVM Value SLVUAG8A – September 2015 – Revised October 2015 Submit Documentation Feedback Copyright © 2015, Texas Instruments Incorporated Board Layouts, Bill of Materials, and Schematic www.ti.com Table 4. Bill of Materials (continued) Designator Qty U7 1 C73, C74, C75, C76 0 C77, C78, C79, C80 0 FID1, FID2, FID3, FID4, FID5, FID6 Value Description Package Reference Part Number Manufacturer ULTRA-SMALL SUPPLY VOLTAGE SUPERVISORS, DCK0005A DCK0005A TPS3802K33DCKR Texas Instruments 22pF CAP, CERM, 22 pF, 50 V, +/- 5%, C0G/NP0, 0603 0603 GRM1885C1H220JA01D Murata 1uF CAP, CERM, 1 µF, 50 V, +/- 10%, X7R, 1206 1206 GRM31MR71H105KA88L Murata 0 Fiducial mark. There is nothing to buy or mount. Fiducial N/A N/A J13 0 Header, 100mil, 2x1, Gold, TH Sullins 100mil, 1x2, 230 mil above insulator PBC02SAAN Sullins Connector Solutions R34, R58, R59, R60 0 0 RES, 0, 5%, 0.1 W, 0603 0603 CRCW06030000Z0EA Vishay-Dale R47, R49, R50, R51 0 10.0k RES, 10.0 k, 1%, 0.1 W, 0603 0603 CRCW060310K0FKEA Vishay-Dale R54, R55, R56, R57 0 3.3 RES, 3.3, 5%, 0.75 W, 2010 2010 CRCW20103R30JNEF Vishay-Dale SLVUAG8A – September 2015 – Revised October 2015 Submit Documentation Feedback Copyright © 2015, Texas Instruments Incorporated TPA3251D2EVM 13 Board Layouts, Bill of Materials, and Schematic 4.4 www.ti.com TPA3251D2EVM Schematic The schematic for TPA3251D2EVM is illustrated in Figure 6. MODE PIN SELECTION PVDD D3 U1 M2 C39 47µF 0 C11 0.01µF C3 1µF M1 INPUT MODE 0 2N + 1 OUTPUT DESCRIPTION 2xBTL STEREO BTL OUTPUT, AD MODE VIN 0 1 2N/1N + 1 1xBTL + 2xSE 2.1 BTL + SE MODE, AD MODE 1 0 2N + 1 1xPBTL PARALLEL BTL OUTPUT, AD MODE 1 1 1N + 1 4xSE SINGLE ENDED OUTPUT, AD MODE R2 0.1uF 8 182k GND RON/SD 7 GND SS 5 C12 4700pF BST 2 SW 1 C16 10µF C15 0.1uF GND C20 0 22pF R8 10.0k R7 10.0k 10µF R9 100k C17 10µF R5 TP4 1 2 3 0 22pF C28 10µF R10 +3.3V GND D5 R53 499 GND C33 1µF PVDD-CD VDD GND 8 R1 U5B 6 GND GVDD-AB DNP TP15 VDD DNP TP16 GVDD-CD DNP TP17 GVDD_CD 0 7 10.0k GND +12V GND R42 C47 1µF C69 0.1uF 5 NE5532ADR GND 4 R43 100k C40 1µF C41 1µF PVDD_AB PVDD_AB PVDD_AB 31 30 29 PVDD_CD PVDD_CD PVDD_CD 1 VDD 2 GVDD_CD DVDD DNP TP18 AVDD DNP TP19 22 11 14 +12V-OA GND R37 10.0k INA DNP TP20 INB DNP TP21 INC DNP TP22 IND DNP TP23 VMID GND R38 10.0k +3.3V GND M1 0.1uF J7 1 2 R36 1 2 R52 J8 M1 GND RESETz GND 10.0k GND GND IN=PBTL OUT=BTL/SE 0.1uF 10µF 1 2 3 J6 0 22pF R21 10.0k R20 10.0k VMID C55 OUT_B OUT_C 1 2 3 35 OUT_B OUT_C AVDD INPUT_B 6 INPUT_B 16 INPUT_C 17 INPUT_D 7 OC_ADJ OUT_D OUT_D 28 27 BST_C 24 BST_D 23 TP13 3 4 RESET 18 CLIP OTW VBG FAULT 21 20 19 1 2 J21 C_START 15 10 9 GND GND GND GND GND GND GND GND 42 41 34 33 26 25 13 12 10µF INPUT_C C49 0.01µF C50 0.47µF MODE SELECTION 100 C_START OC_IOP OC_IOM C58 100pF GND GND FREQ_ADJ FAULT R14 3.3 GND J11 GNDAB Black GND C42 OUT_C OC GND TP11 OUTC OUTC 7uH 6.5A MA5173 DNP VBG TP27 J2 2 1 470µF C43 0.68µF C44 1000pF C45 0.01µF C68 0.1µF GND R18 3.3 GND Hi Current Shunt GND J25 GND L5 C56 OD TP1 1 2 TP12 OUTD OUTD 7uH 6.5A MA5173 HEATSINK DNP FREQ_ADJ TP26 C37 0.01µF J24 TP14 GND Hi Current Shunt C52 0.033µF C54 0.033µF OUT_D GND C36 1000pF PWMD TP9 CLIP_OTW VBG TP10 OUTB OUTB 470µF C35 0.68µF GND SE DIFF C34 OB 7uH 6.5A MA5173 TPA3251D2DDVR 4 3 2 1 OSCILLATOR SYNC INTERFACE GND L3 OUT_B OUT_D GND RESET R11 3.3 GND J23 GND M1 M2 C26 0.01µF Hi Current Shunt L4 M1 M2 J9 2 1 C25 1000pF GND PWMC TP7 INPUT_A TP3 OUTA OUTA 470µF PWMA TP2 PWMB TP5 DVDD INPUT_D OC-ADJ DNP TP24 R13 OA C24 0.68µF OUT_A 32 GVDD_CD OUT = BTL M2 J17 R19 J19 8 R45 100k 40 39 VDD GND R44 OUT_A OUT_A GVDD_AB INPUT_C 8 GND C57 43 7uH 6.5A MA5173 C27 0.033µF C29 0.033µF 44 BST_B TP6 IN = SE +3.3V C51 C53 10µF 5 BST_A 22.0k DNP TP25 1 2 3 J5 10.0k GND +12V-OA C62 INPUT_A GND C72 C70 10µF GND R59 DNP0 DNP 38 37 36 GVDD_AB C21 OUT_A U4 C48 1µF 100 C30 100pF VMID C46 2200µF C22 0.1uF 10µF R58 DNP0 DNP Hi Current Shunt GND L2 TP8 INPUT_B 10.0k C71 3 4 1 GND 3.3 R12 R41 INPUT SE C SE CD DIFF C+ C10 100µF GND GND PVDD R6 GND C23 GND C32 1µF GND +12V DIFF GND INC/CD GND J22 SE 4 GND 3 4 1 GND PVDD-AB C31 2200µF GND U5A 2 1 2 3 J18 +3.3V 2 4 OUT PAD GND GND GND GVDD_AB C14 0.1uF INPUT_A 1 INPUT SE B DIFF A- LM2940IMP-12/NOPB GND IN C6 10µF C9 0.1uF PVDD C19 100pF NE5532ADR INB 3 C5 47µF 100 J4 8 R34 DNP0 DNP R4 3 J14 2 0 GND VMID J10 GND +12V R3 INPUT SE A SE AB DIFF A+ 3 GND Green C18 INA/AB OUT TAB 0.8A GND 3 4 1 IN 4 GND C81 10µF J3 1 +12V-OA L6 10uH C8 0.47µF R40 1.00k LM5010ASD/NOPB GND +12V C38 4.7µF GND 11 DAP U2 TLV1117-33IDCY +12V U3 R39 4.99k 6 FB SGND +15V C7 5600pF D1 100V/1A 3 ISEN RTN 4 GND C13 GND L1 0.1uF C1 0.047µF 100uH 1.5A 9 VCC C2 C4 2.2µF GND 10 2 1 1 PVDD J1 470µF C59 0.68µF FAULTz C60 1000pF C61 0.01µF CLIP_OTWz GND R22 3.3 GND J20 U6A 2 GNDCD Black 1 3 C65 R46 NE5532ADR GND 4 J12 1 2 3 0 22pF C63 10µF GND R23 INPUT_D +3.3V J16 100 C64 100pF R25 10.0k 8 GND GND 3 4 1 10.0k 10.0k R16 20.0k R17 30.0k 2 4 6 8 GND 7 GND 5 J13 DNP DNP NE5532ADR VMID 10µF R60 DNP0 DNP IND INPUT SE D DIFF C- R48 100k GND GND SLAVE MODE MASTER MODE MASTER MODE AM1 MASTER MODE AM2 FREQUENCY ADJUST U6B 6 GND 1 3 5 7 R30 4 J15 R27 C66 R15 R47 DNP 10.0k DNP C73 DNP 22pF DNP OUTA R49 DNP 10.0k DNP C74 DNP 22pF DNP OUTB R50 DNP 10.0k DNP C75 DNP 22pF DNP OUTC R51 DNP 10.0k DNP C76 OUTD FAULT 0 C77 DNP 1µF DNP C78 R54 DNP 3.3 DNP DNP 1µF DNP GND C79 R55 DNP 3.3 DNP DNP 1µF DNP C80 R56 DNP 3.3 DNP GND DNP 1µF DNP R57 DNP 3.3 DNP GND GND PVDD +15V R61 100k C82 R32 12.0k +3.3V C83 1µF 4 VDD RESET 5 R24 47k RESET FAULT C84 1µF R26 3.30k 5 C67 0.1uF 4 MR +12V R31 3 GND S1 6 +3.3V +12V U7 0.1uF DNP 22pF DNP GND GND 1 2 R29 R28 47k 1.00k R35 Q2 D4 Red FAULT 100 1.00k R33 Q1 D2 Orange OTW 100 MONITORS TPS3802K33DCKR 3 CLIP_OTW GND 1 GND RESET GND GND GND GND GND GND GND GND Figure 6. TPA3251D2EVM Schematic 14 TPA3251D2EVM SLVUAG8A – September 2015 – Revised October 2015 Submit Documentation Feedback Copyright © 2015, Texas Instruments Incorporated Revision History www.ti.com Revision History Changes from Original (September 2015) to A Revision ............................................................................................... Page • • • • • • • Changed Nominal value to 10 kΩ in Frequency Adjust Master Mode Selection table. .......................................... 3 Text of second paragraph of TPA3251D2EVM Frequency Adjust section improved............................................. 3 Text of TPA3251D2EVM Single-Ended and Differential Input section improved. ................................................ 3 Typos corrected in TPA3251D2EVM Connections image. .......................................................................... 5 Added instruction to not power up EVM until all connections are complete. ...................................................... 6 Added note regarding power supply usage to the end of the Single-Ended (SE) Output (4.0) Operation section. .......... 8 Changed part number in the HEATSINK row of the BOM. ......................................................................... 11 NOTE: Page numbers for previous revisions may differ from page numbers in the current version. SLVUAG8A – September 2015 – Revised October 2015 Submit Documentation Feedback Copyright © 2015, Texas Instruments Incorporated Revision History 15 STANDARD TERMS AND CONDITIONS FOR EVALUATION MODULES 1. Delivery: TI delivers TI evaluation boards, kits, or modules, including any accompanying demonstration software, components, or documentation (collectively, an “EVM” or “EVMs”) to the User (“User”) in accordance with the terms and conditions set forth herein. Acceptance of the EVM is expressly subject to the following terms and conditions. 1.1 EVMs are intended solely for product or software developers for use in a research and development setting to facilitate feasibility evaluation, experimentation, or scientific analysis of TI semiconductors products. EVMs have no direct function and are not finished products. EVMs shall not be directly or indirectly assembled as a part or subassembly in any finished product. For clarification, any software or software tools provided with the EVM (“Software”) shall not be subject to the terms and conditions set forth herein but rather shall be subject to the applicable terms and conditions that accompany such Software 1.2 EVMs are not intended for consumer or household use. EVMs may not be sold, sublicensed, leased, rented, loaned, assigned, or otherwise distributed for commercial purposes by Users, in whole or in part, or used in any finished product or production system. 2 Limited Warranty and Related Remedies/Disclaimers: 2.1 These terms and conditions do not apply to Software. The warranty, if any, for Software is covered in the applicable Software License Agreement. 2.2 TI warrants that the TI EVM will conform to TI's published specifications for ninety (90) days after the date TI delivers such EVM to User. Notwithstanding the foregoing, TI shall not be liable for any defects that are caused by neglect, misuse or mistreatment by an entity other than TI, including improper installation or testing, or for any EVMs that have been altered or modified in any way by an entity other than TI. Moreover, TI shall not be liable for any defects that result from User's design, specifications or instructions for such EVMs. Testing and other quality control techniques are used to the extent TI deems necessary or as mandated by government requirements. TI does not test all parameters of each EVM. 2.3 If any EVM fails to conform to the warranty set forth above, TI's sole liability shall be at its option to repair or replace such EVM, or credit User's account for such EVM. TI's liability under this warranty shall be limited to EVMs that are returned during the warranty period to the address designated by TI and that are determined by TI not to conform to such warranty. If TI elects to repair or replace such EVM, TI shall have a reasonable time to repair such EVM or provide replacements. Repaired EVMs shall be warranted for the remainder of the original warranty period. Replaced EVMs shall be warranted for a new full ninety (90) day warranty period. 3 Regulatory Notices: 3.1 United States 3.1.1 Notice applicable to EVMs not FCC-Approved: This kit is designed to allow product developers to evaluate electronic components, circuitry, or software associated with the kit to determine whether to incorporate such items in a finished product and software developers to write software applications for use with the end product. This kit is not a finished product and when assembled may not be resold or otherwise marketed unless all required FCC equipment authorizations are first obtained. Operation is subject to the condition that this product not cause harmful interference to licensed radio stations and that this product accept harmful interference. Unless the assembled kit is designed to operate under part 15, part 18 or part 95 of this chapter, the operator of the kit must operate under the authority of an FCC license holder or must secure an experimental authorization under part 5 of this chapter. 3.1.2 For EVMs annotated as FCC – FEDERAL COMMUNICATIONS COMMISSION Part 15 Compliant: CAUTION This device complies with part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation. Changes or modifications not expressly approved by the party responsible for compliance could void the user's authority to operate the equipment. FCC Interference Statement for Class A EVM devices NOTE: This equipment has been tested and found to comply with the limits for a Class A digital device, pursuant to part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference when the equipment is operated in a commercial environment. This equipment generates, uses, and can radiate radio frequency energy and, if not installed and used in accordance with the instruction manual, may cause harmful interference to radio communications. Operation of this equipment in a residential area is likely to cause harmful interference in which case the user will be required to correct the interference at his own expense. SPACER SPACER SPACER SPACER SPACER SPACER SPACER SPACER FCC Interference Statement for Class B EVM devices NOTE: This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates, uses and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more of the following measures: • • • • Reorient or relocate the receiving antenna. Increase the separation between the equipment and receiver. Connect the equipment into an outlet on a circuit different from that to which the receiver is connected. Consult the dealer or an experienced radio/TV technician for help. 3.2 Canada 3.2.1 For EVMs issued with an Industry Canada Certificate of Conformance to RSS-210 Concerning EVMs Including Radio Transmitters: This device complies with Industry Canada license-exempt RSS standard(s). Operation is subject to the following two conditions: (1) this device may not cause interference, and (2) this device must accept any interference, including interference that may cause undesired operation of the device. Concernant les EVMs avec appareils radio: Le présent appareil est conforme aux CNR d'Industrie Canada applicables aux appareils radio exempts de licence. L'exploitation est autorisée aux deux conditions suivantes: (1) l'appareil ne doit pas produire de brouillage, et (2) l'utilisateur de l'appareil doit accepter tout brouillage radioélectrique subi, même si le brouillage est susceptible d'en compromettre le fonctionnement. Concerning EVMs Including Detachable Antennas: Under Industry Canada regulations, this radio transmitter may only operate using an antenna of a type and maximum (or lesser) gain approved for the transmitter by Industry Canada. To reduce potential radio interference to other users, the antenna type and its gain should be so chosen that the equivalent isotropically radiated power (e.i.r.p.) is not more than that necessary for successful communication. This radio transmitter has been approved by Industry Canada to operate with the antenna types listed in the user guide with the maximum permissible gain and required antenna impedance for each antenna type indicated. Antenna types not included in this list, having a gain greater than the maximum gain indicated for that type, are strictly prohibited for use with this device. Concernant les EVMs avec antennes détachables Conformément à la réglementation d'Industrie Canada, le présent émetteur radio peut fonctionner avec une antenne d'un type et d'un gain maximal (ou inférieur) approuvé pour l'émetteur par Industrie Canada. Dans le but de réduire les risques de brouillage radioélectrique à l'intention des autres utilisateurs, il faut choisir le type d'antenne et son gain de sorte que la puissance isotrope rayonnée équivalente (p.i.r.e.) ne dépasse pas l'intensité nécessaire à l'établissement d'une communication satisfaisante. Le présent émetteur radio a été approuvé par Industrie Canada pour fonctionner avec les types d'antenne énumérés dans le manuel d’usage et ayant un gain admissible maximal et l'impédance requise pour chaque type d'antenne. Les types d'antenne non inclus dans cette liste, ou dont le gain est supérieur au gain maximal indiqué, sont strictement interdits pour l'exploitation de l'émetteur 3.3 Japan 3.3.1 Notice for EVMs delivered in Japan: Please see http://www.tij.co.jp/lsds/ti_ja/general/eStore/notice_01.page 日本国内に 輸入される評価用キット、ボードについては、次のところをご覧ください。 http://www.tij.co.jp/lsds/ti_ja/general/eStore/notice_01.page 3.3.2 Notice for Users of EVMs Considered “Radio Frequency Products” in Japan: EVMs entering Japan may not be certified by TI as conforming to Technical Regulations of Radio Law of Japan. If User uses EVMs in Japan, not certified to Technical Regulations of Radio Law of Japan, User is required by Radio Law of Japan to follow the instructions below with respect to EVMs: 1. 2. 3. Use EVMs in a shielded room or any other test facility as defined in the notification #173 issued by Ministry of Internal Affairs and Communications on March 28, 2006, based on Sub-section 1.1 of Article 6 of the Ministry’s Rule for Enforcement of Radio Law of Japan, Use EVMs only after User obtains the license of Test Radio Station as provided in Radio Law of Japan with respect to EVMs, or Use of EVMs only after User obtains the Technical Regulations Conformity Certification as provided in Radio Law of Japan with respect to EVMs. Also, do not transfer EVMs, unless User gives the same notice above to the transferee. Please note that if User does not follow the instructions above, User will be subject to penalties of Radio Law of Japan. SPACER SPACER SPACER SPACER SPACER 【無線電波を送信する製品の開発キットをお使いになる際の注意事項】 開発キットの中には技術基準適合証明を受けて いないものがあります。 技術適合証明を受けていないもののご使用に際しては、電波法遵守のため、以下のいずれかの 措置を取っていただく必要がありますのでご注意ください。 1. 2. 3. 電波法施行規則第6条第1項第1号に基づく平成18年3月28日総務省告示第173号で定められた電波暗室等の試験設備でご使用 いただく。 実験局の免許を取得後ご使用いただく。 技術基準適合証明を取得後ご使用いただく。 なお、本製品は、上記の「ご使用にあたっての注意」を譲渡先、移転先に通知しない限り、譲渡、移転できないものとします。 上記を遵守頂けない場合は、電波法の罰則が適用される可能性があることをご留意ください。 日本テキサス・イ ンスツルメンツ株式会社 東京都新宿区西新宿6丁目24番1号 西新宿三井ビル 3.3.3 Notice for EVMs for Power Line Communication: Please see http://www.tij.co.jp/lsds/ti_ja/general/eStore/notice_02.page 電力線搬送波通信についての開発キットをお使いになる際の注意事項については、次のところをご覧くださ い。http://www.tij.co.jp/lsds/ti_ja/general/eStore/notice_02.page SPACER 4 EVM Use Restrictions and Warnings: 4.1 EVMS ARE NOT FOR USE IN FUNCTIONAL SAFETY AND/OR SAFETY CRITICAL EVALUATIONS, INCLUDING BUT NOT LIMITED TO EVALUATIONS OF LIFE SUPPORT APPLICATIONS. 4.2 User must read and apply the user guide and other available documentation provided by TI regarding the EVM prior to handling or using the EVM, including without limitation any warning or restriction notices. The notices contain important safety information related to, for example, temperatures and voltages. 4.3 Safety-Related Warnings and Restrictions: 4.3.1 User shall operate the EVM within TI’s recommended specifications and environmental considerations stated in the user guide, other available documentation provided by TI, and any other applicable requirements and employ reasonable and customary safeguards. Exceeding the specified performance ratings and specifications (including but not limited to input and output voltage, current, power, and environmental ranges) for the EVM may cause personal injury or death, or property damage. If there are questions concerning performance ratings and specifications, User should contact a TI field representative prior to connecting interface electronics including input power and intended loads. Any loads applied outside of the specified output range may also result in unintended and/or inaccurate operation and/or possible permanent damage to the EVM and/or interface electronics. Please consult the EVM user guide prior to connecting any load to the EVM output. If there is uncertainty as to the load specification, please contact a TI field representative. During normal operation, even with the inputs and outputs kept within the specified allowable ranges, some circuit components may have elevated case temperatures. These components include but are not limited to linear regulators, switching transistors, pass transistors, current sense resistors, and heat sinks, which can be identified using the information in the associated documentation. When working with the EVM, please be aware that the EVM may become very warm. 4.3.2 EVMs are intended solely for use by technically qualified, professional electronics experts who are familiar with the dangers and application risks associated with handling electrical mechanical components, systems, and subsystems. User assumes all responsibility and liability for proper and safe handling and use of the EVM by User or its employees, affiliates, contractors or designees. User assumes all responsibility and liability to ensure that any interfaces (electronic and/or mechanical) between the EVM and any human body are designed with suitable isolation and means to safely limit accessible leakage currents to minimize the risk of electrical shock hazard. User assumes all responsibility and liability for any improper or unsafe handling or use of the EVM by User or its employees, affiliates, contractors or designees. 4.4 User assumes all responsibility and liability to determine whether the EVM is subject to any applicable international, federal, state, or local laws and regulations related to User’s handling and use of the EVM and, if applicable, User assumes all responsibility and liability for compliance in all respects with such laws and regulations. User assumes all responsibility and liability for proper disposal and recycling of the EVM consistent with all applicable international, federal, state, and local requirements. 5. Accuracy of Information: To the extent TI provides information on the availability and function of EVMs, TI attempts to be as accurate as possible. However, TI does not warrant the accuracy of EVM descriptions, EVM availability or other information on its websites as accurate, complete, reliable, current, or error-free. SPACER SPACER SPACER SPACER SPACER SPACER SPACER 6. Disclaimers: 6.1 EXCEPT AS SET FORTH ABOVE, EVMS AND ANY WRITTEN DESIGN MATERIALS PROVIDED WITH THE EVM (AND THE DESIGN OF THE EVM ITSELF) ARE PROVIDED "AS IS" AND "WITH ALL FAULTS." TI DISCLAIMS ALL OTHER WARRANTIES, EXPRESS OR IMPLIED, REGARDING SUCH ITEMS, INCLUDING BUT NOT LIMITED TO ANY IMPLIED WARRANTIES OF MERCHANTABILITY OR FITNESS FOR A PARTICULAR PURPOSE OR NON-INFRINGEMENT OF ANY THIRD PARTY PATENTS, COPYRIGHTS, TRADE SECRETS OR OTHER INTELLECTUAL PROPERTY RIGHTS. 6.2 EXCEPT FOR THE LIMITED RIGHT TO USE THE EVM SET FORTH HEREIN, NOTHING IN THESE TERMS AND CONDITIONS SHALL BE CONSTRUED AS GRANTING OR CONFERRING ANY RIGHTS BY LICENSE, PATENT, OR ANY OTHER INDUSTRIAL OR INTELLECTUAL PROPERTY RIGHT OF TI, ITS SUPPLIERS/LICENSORS OR ANY OTHER THIRD PARTY, TO USE THE EVM IN ANY FINISHED END-USER OR READY-TO-USE FINAL PRODUCT, OR FOR ANY INVENTION, DISCOVERY OR IMPROVEMENT MADE, CONCEIVED OR ACQUIRED PRIOR TO OR AFTER DELIVERY OF THE EVM. 7. USER'S INDEMNITY OBLIGATIONS AND REPRESENTATIONS. USER WILL DEFEND, INDEMNIFY AND HOLD TI, ITS LICENSORS AND THEIR REPRESENTATIVES HARMLESS FROM AND AGAINST ANY AND ALL CLAIMS, DAMAGES, LOSSES, EXPENSES, COSTS AND LIABILITIES (COLLECTIVELY, "CLAIMS") ARISING OUT OF OR IN CONNECTION WITH ANY HANDLING OR USE OF THE EVM THAT IS NOT IN ACCORDANCE WITH THESE TERMS AND CONDITIONS. THIS OBLIGATION SHALL APPLY WHETHER CLAIMS ARISE UNDER STATUTE, REGULATION, OR THE LAW OF TORT, CONTRACT OR ANY OTHER LEGAL THEORY, AND EVEN IF THE EVM FAILS TO PERFORM AS DESCRIBED OR EXPECTED. 8. Limitations on Damages and Liability: 8.1 General Limitations. IN NO EVENT SHALL TI BE LIABLE FOR ANY SPECIAL, COLLATERAL, INDIRECT, PUNITIVE, INCIDENTAL, CONSEQUENTIAL, OR EXEMPLARY DAMAGES IN CONNECTION WITH OR ARISING OUT OF THESE TERMS ANDCONDITIONS OR THE USE OF THE EVMS PROVIDED HEREUNDER, REGARDLESS OF WHETHER TI HAS BEEN ADVISED OF THE POSSIBILITY OF SUCH DAMAGES. EXCLUDED DAMAGES INCLUDE, BUT ARE NOT LIMITED TO, COST OF REMOVAL OR REINSTALLATION, ANCILLARY COSTS TO THE PROCUREMENT OF SUBSTITUTE GOODS OR SERVICES, RETESTING, OUTSIDE COMPUTER TIME, LABOR COSTS, LOSS OF GOODWILL, LOSS OF PROFITS, LOSS OF SAVINGS, LOSS OF USE, LOSS OF DATA, OR BUSINESS INTERRUPTION. NO CLAIM, SUIT OR ACTION SHALL BE BROUGHT AGAINST TI MORE THAN ONE YEAR AFTER THE RELATED CAUSE OF ACTION HAS OCCURRED. 8.2 Specific Limitations. IN NO EVENT SHALL TI'S AGGREGATE LIABILITY FROM ANY WARRANTY OR OTHER OBLIGATION ARISING OUT OF OR IN CONNECTION WITH THESE TERMS AND CONDITIONS, OR ANY USE OF ANY TI EVM PROVIDED HEREUNDER, EXCEED THE TOTAL AMOUNT PAID TO TI FOR THE PARTICULAR UNITS SOLD UNDER THESE TERMS AND CONDITIONS WITH RESPECT TO WHICH LOSSES OR DAMAGES ARE CLAIMED. THE EXISTENCE OF MORE THAN ONE CLAIM AGAINST THE PARTICULAR UNITS SOLD TO USER UNDER THESE TERMS AND CONDITIONS SHALL NOT ENLARGE OR EXTEND THIS LIMIT. 9. Return Policy. Except as otherwise provided, TI does not offer any refunds, returns, or exchanges. Furthermore, no return of EVM(s) will be accepted if the package has been opened and no return of the EVM(s) will be accepted if they are damaged or otherwise not in a resalable condition. If User feels it has been incorrectly charged for the EVM(s) it ordered or that delivery violates the applicable order, User should contact TI. All refunds will be made in full within thirty (30) working days from the return of the components(s), excluding any postage or packaging costs. 10. Governing Law: These terms and conditions shall be governed by and interpreted in accordance with the laws of the State of Texas, without reference to conflict-of-laws principles. User agrees that non-exclusive jurisdiction for any dispute arising out of or relating to these terms and conditions lies within courts located in the State of Texas and consents to venue in Dallas County, Texas. Notwithstanding the foregoing, any judgment may be enforced in any United States or foreign court, and TI may seek injunctive relief in any United States or foreign court. Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265 Copyright © 2015, Texas Instruments Incorporated spacer IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. All semiconductor products (also referred to herein as “components”) are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment. TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI’s terms and conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarily performed. TI assumes no liability for applications assistance or the design of Buyers’ products. Buyers are responsible for their products and applications using TI components. To minimize the risks associated with Buyers’ products and applications, Buyers should provide adequate design and operating safeguards. TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or other intellectual property right relating to any combination, machine, or process in which TI components or services are used. Information published by TI regarding third-party products or services does not constitute a license to use such products or services or a warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI. Reproduction of significant portions of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties, conditions, limitations, and notices. TI is not responsible or liable for such altered documentation. Information of third parties may be subject to additional restrictions. 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Buyer will fully indemnify TI and its representatives against any damages arising out of the use of any TI components in safety-critical applications. In some cases, TI components may be promoted specifically to facilitate safety-related applications. With such components, TI’s goal is to help enable customers to design and create their own end-product solutions that meet applicable functional safety standards and requirements. Nonetheless, such components are subject to these terms. No TI components are authorized for use in FDA Class III (or similar life-critical medical equipment) unless authorized officers of the parties have executed a special agreement specifically governing such use. Only those TI components which TI has specifically designated as military grade or “enhanced plastic” are designed and intended for use in military/aerospace applications or environments. Buyer acknowledges and agrees that any military or aerospace use of TI components which have not been so designated is solely at the Buyer's risk, and that Buyer is solely responsible for compliance with all legal and regulatory requirements in connection with such use. TI has specifically designated certain components as meeting ISO/TS16949 requirements, mainly for automotive use. In any case of use of non-designated products, TI will not be responsible for any failure to meet ISO/TS16949. 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