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TPA6132A2
SLOS597B – DECEMBER 2008 – REVISED JULY 2017
TPA6132A2 25-mW DirectPath™ Stereo Headphone Amplifier With Pop Suppression
1 Features
3 Description
•
The TPA6132A2 (sometimes referred to as TPA6132)
is a DirectPath™ stereo headphone amplifier that
eliminates the need for external dc-blocking output
capacitors. Differential stereo inputs and built-in
resistors set the device gain, further reducing external
component count. Gain is selectable at –6 dB, 0 dB,
3 dB or 6 dB. The amplifier drives 25 mW into 16 Ω
speakers from a single 2.3 V supply. The TPA6132A2
(TPA6132) provides a constant maximum output
power independent of the supply voltage, thus
facilitating the design for prevention of acoustic
shock.
1
•
•
•
•
•
•
•
•
•
•
•
•
Patented DirectPath™ Technology Eliminates
Need for DC-Blocking Capacitors
– Outputs Biased at 0 V
– Excellent Low Frequency Fidelity
Active Click and Pop Suppression
2.1 mA Typical Supply Current
Fully Differential or Single-Ended Inputs
– Built-In Resistors Reduces Component Count
– Improves System Noise Performance
Constant Maximum Output Power from 2.3 V to
5.5 V Supply
– Simplifies Design to Prevent Acoustic Shock
Improved RF Noise Immunity
MicrosoftTM Windows VistaTM Compliant
High Power Supply Noise Rejection
– 100 dB PSRR at 217 Hz
– 90 dB PSRR at 10 kHz
Wide Power Supply Range: 2.3 V to 5.5 V
Gain Settings: –6 dB, 0 dB, 3 dB, and 6 dB
Short-Circuit and Thermal-Overload Protection
±8 kV HBM ESD Protected Outputs
Small Package Available
– 16-Pin, 3 mm × 3 mm Thin QFN
The TPA6132A2 features fully differential inputs to
reduce system noise pickup between the audio
source and the headphone amplifier. The high power
supply noise rejection performance and differential
architecture provides increased RF noise immunity.
For single-ended input signals, connect INL+ and
INR+ to ground.
The device has built-in pop suppression circuitry to
completely eliminate disturbing pop noise during turnon and turn-off. The amplifier outputs have shortcircuit and thermal-overload protection along with
±8 kV HBM ESD protection, simplifying end
equipment compliance to the IEC 61000-4-2 ESD
standard.
The TPA6132A2 operates from a single 2.3 V to
5.5 V supply with 2.1 mA of typical supply current.
Shutdown mode reduces supply current to less than
1 μA.
2 Applications
•
•
•
•
Smart Phones / Cellular Phones
Notebook Computers
CD / MP3 Players
Portable Gaming
Device Information(1)
PART NUMBER
TPA6132A2
PACKAGE
WQFN (16)
BODY SIZE (NOM)
3.00 mm x 3.00 mm
(1) For all available packages, see the orderable addendum at
the end of the datasheet.
Simplified Schematic
OUTR+
INR+
OUTR-
INR-
OUTL+
INL+
OUTL-
INL-
CODEC
OUTR
TPA6132A2
OUTL
SGND
ENABLE
GAIN0
GAIN1
VBAT
EN
PGND
G0
G1
VDD
HPVSS
HPVDD
CPP
CPN
1
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.
TPA6132A2
SLOS597B – DECEMBER 2008 – REVISED JULY 2017
www.ti.com
Table of Contents
1
2
3
4
5
6
7
Features ..................................................................
Applications ...........................................................
Description .............................................................
Revision History.....................................................
Pin Configuration and Functions .........................
Specifications.........................................................
1
1
1
2
3
4
6.1
6.2
6.3
6.4
6.5
6.6
6.7
4
4
4
4
5
5
6
Absolute Maximum Ratings ......................................
ESD Ratings ............................................................
Recommended Operating Condtions........................
Thermal Information ..................................................
Electrical Characteristics...........................................
Operating Characteristics..........................................
Typical Characteristics ..............................................
Detailed Description ............................................ 10
7.1 Overview ................................................................. 10
7.2 Functional Block Diagram ....................................... 10
7.3 Feature Description................................................. 11
7.4 Device Functional Modes........................................ 13
8
Application and Implementation ........................ 14
8.1 Application Information............................................ 14
8.2 Typical Applications ................................................ 14
9
Power Supply Recommendations...................... 17
9.1 Power Supply and HPVDD Decoupling Capacitors 17
10 Layout................................................................... 18
10.1 Layout Guidelines ................................................. 18
10.2 Layout Example .................................................... 18
10.3 GND Connections ................................................. 18
11 Device and Documentation Support ................. 19
11.1
11.2
11.3
11.4
11.5
Receiving Notification of Documentation Updates
Community Resources..........................................
Trademarks ...........................................................
Electrostatic Discharge Caution ............................
Glossary ................................................................
19
19
19
19
19
12 Mechanical, Packaging, and Orderable
Information ........................................................... 19
4 Revision History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
Changes from Revision A (December 2008) to Revision B
Page
•
Corrected the I/O/P column of the Pin Functions table .......................................................................................................... 3
•
Changed the Input voltage for EN, G0, G1 MAX value From: HVDD + 0.3 To: VDD + 0.3 in the Absolute Maximum
Ratings ................................................................................................................................................................................... 4
•
Changed Handling Ratings to ESD Ratings and moved the Storage temperature range to the Absolute Maximum
Ratings ................................................................................................................................................................................... 4
Changes from Original (December 2008) to Revision A
Page
•
Added Handling Rating table, Feature Description section, Device Functional Modes, Application and
Implementation section, Power Supply Recommendations section, Layout section, Device and Documentation
Support section, and Mechanical, Packaging sections. ........................................................................................................ 1
•
Added Input voltage: EN, G0, G1 to the Absolute Maximum Ratings table........................................................................... 4
•
Added Input voltage: INR+, INR-, INL+, INL- to the Recommended Operating Condtions table........................................... 4
•
Changed Output impedance in shutdown From: TYP = 50 Ω To: TYP = 20 Ω in the Operating Characteristics table......... 5
2
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SLOS597B – DECEMBER 2008 – REVISED JULY 2017
5 Pin Configuration and Functions
OUTL
SGND
VDD
EN
16
15
14
13
RTE (WQFN) Package
(Top View)
10
PGND
INR- 4
9
OUTR
8
INR+ 3
HPVSS
CPP
7
11
G1
INL+ 2
6
HPVDD
G0
12
5
INL- 1
CPN
Pin Functions
PIN
NAME
NO.
I/O/P
DESCRIPTION
INL-
1
I
Inverting left input for differential signals; left input for single-ended signals
INL+
2
I
Non-inverting left input for differential signals. Connect to ground for single-ended input
applications
INR+
3
I
Non-inverting right input for differential signals. Connect to ground for single-ended input
applications
INR-
4
I
Inverting right input for differential signals; right input for single-ended signals
OUTR
5
O
Right headphone amplifier output. Connect to right terminal of headphone jack
G0
6
I
GAIN0
G1
I
7
GAIN1
I
I
Gain select
Gain select
HPVSS
8
P
Charge pump output and negative power supply for output amplifiers; connect 1μF
capacitor to GND
CPN
9
P
Charge pump negative flying cap. Connect to negative side of 1μF capacitor between
CPP and CPN
PGND
10
P
Ground
CPP
11
P
Charge pump positive flying cap. Connect to positive side of 1μF capacitor between CPP
and CPN
HPVDD
12
P
Positive power supply for headphone amplifiers. Connect to a 2.2μF capacitor. Do not
connect to VDD
EN
13
I
Amplifier enable. Connect to logic low to shutdown; connect to logic high to activate
VDD
14
P
Positive power supply for TPA6132A2
SGND
15
P
Amplifier reference voltage. Connect to ground terminal of headphone jack
OUTL
16
O
Left headphone amplifier output. Connect to left terminal of headphone jack
Thermal Pad
–
Solder the exposed metal pad on the TPA6132A2RTE QFN package to the landing pad
on the PCB. Connect the landing pad to ground or leave it electrically unconnected
(floating).
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6 Specifications
6.1 Absolute Maximum Ratings
over operating free-air temperature range, TA = 25°C (unless otherwise noted)
Supply voltage
VDD
Headphone amplifier supply voltage
HPVDD (do not connect to external supply)
INR+, INR-, INL+, INL-
Input voltage, VI
EN, G0, G1
MIN
MAX
UNIT
–0.3
6
V
–0.3
1.9
V
HPVSS
–0.3
HPVDD +
0.3
V
–0.3
VDD + 0.3
V
Output continuous total power dissipation
See Thermal Information
Operating free-air temperature range, TA
–40
85
°C
Operating junction temperature range, TJ
–40
150
°C
Storage temperature range, Tstg
–65
85
°C
6.2 ESD Ratings
VALUE
Electrostatic
discharge
V(ESD)
(1)
(2)
Human body model (HBM), per ANSI/ESDA/JEDEC JS001, all pins (1)
OUTL, OUTR
±8000
All Other Pins
±2000
Charged device model (CDM), per JEDEC specification JESD22-C101, all pins (2)
±1500
UNIT
V
V
JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
6.3 Recommended Operating Condtions
MIN
MAX
Supply voltage, VDD
2.3
5.5
VIH
High-level input voltage; EN, G0, G1
1.3
VIL
Low-level input voltage; EN, G0, G1
VI
Input voltage; INR+, INR-, INL+, INL-
TA
UNIT
V
V
0.6
V
0
HPVDD +
0.3
V
Voltage applied to Output; OUTR, OUTL (when EN = 0 V)
–0.3
3.6
V
Operating free-air temperature
–40
85
°C
6.4 Thermal Information
THERMAL METRIC (1)
RTE
16 PINS
RθJA
Junction-to-ambient thermal resistance
51.1
RθJC(top)
Junction-to-case (top) thermal resistance
53.9
RθJB
Junction-to-board thermal resistance
24.3
ψJT
Junction-to-top characterization parameter
0.9
ψJB
Junction-to-board characterization parameter
24.3
RθJC(bot)
Junction-to-case (bottom) thermal resistance
9.0
(1)
4
UNIT
°C/W
For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report.
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SLOS597B – DECEMBER 2008 – REVISED JULY 2017
6.5 Electrical Characteristics
TA = 25°C (unless otherwise noted)
PARAMETER
TEST CONDITIONS
MIN
Output offset voltage
TYP
–0.5
MAX
UNIT
0.5
mV
High-level output current (EN, G0, G1)
1
µA
Low-level output current (EN, G0, G1)
1
µA
Power supply rejection ratio
VDD = 2.3 V to 5.5 V
Supply Current
100
dB
VDD = 2.3 V, No load, EN = VDD
2.1
3.1
VDD = 3.6 V, No load, EN = VDD
2.1
3.1
VDD = 5.5 V, No load, EN = VDD
2.2
3.2
EN = 0 V, VDD = 2.3 V to 5.5 V
0.7
1.2
TYP
MAX
mA
µA
6.6 Operating Characteristics
VDD = 3.6 V , TA = 25°C, RL = 16 Ω (unless otherwise noted)
PARAMETER
PO
Output power (1) (Outputs in phase)
VO
Output voltage
AV
(1)
(Outputs in phase)
Closed-loop voltage gain (OUT / IN–)
Gain matching
ΔAv
Input impedance (per input pin)
RIN
Input impedance in shutdown
(per input pin)
VCM
TEST CONDITIONS
MIN
THD = 1%, f = 1 kHz
25
THD = 1%, f = 1 kHz, RL = 32 Ω
22
THD = 1%, VDD = 3.6 V, f = 1 kHz, RL = 100 Ω
mW
1.1
G0 = 0 V, G1 = 0 V, (–6 dB)
–0.45
G0 ≥ 1.3 V, G1 = 0 V, (0 dB)
G0 = 0 V, G1 ≥ 1.3 V, (3 dB)
G0 ≥ 1.3 V, G1 ≥ 1.3 V, (6 dB)
VRMS
–0.5
–0.55
–0.95
–1.0
–1.05
–1.36
–1.41
–1.46
–1.95
–2.0
–2.05
Between Left and Right channels
V/V
1%
G0 = 0 V, G1 = 0 V, (–6 dB)
26.4
G0 ≥ 1.3 V, G1 = 0 V, (0 dB)
19.8
G0 = 0 V, G1 ≥ 1.3 V, (3 dB)
16.5
G0 ≥ 1.3 V, G1 ≥ 1.3 V, (6 dB)
13.2
EN = 0 V
kΩ
10
Input common-mode voltage range
–0.5
Output impedance in shutdown
Input-to-output attenuation in shutdown
UNIT
EN = 0 V
1.5
V
20
Ω
80
dB
200 mVpp ripple, f = 217 Hz
-100
200 mVpp ripple, f = 10 kHz
-90
kSVR
AC-power supply rejection ratio
THD+N
Total harmonic distortion plus noise (2)
SNR
Signal-to-noise ratio
PO = 20 mW; G0 ≥ 1.3 V, G1 = 0 V, (AV = 0 dB)
100
dB
En
Noise output voltage
A-weighted
5.5
μVRMS
fosc
Charge pump switching frequency
tON
Start-up time from shutdown
Crosstallk
Thermal shutdown
(1)
(2)
PO = 20 mW, f = 1 kHz
0.02%
PO = 25 mW into 32 Ω, VDD = 5.5 V, f = 1 kHz
0.01%
1200
1275
dB
1350
kHz
5
ms
PO = 20 mW, f = 1 kHz
–80
dB
Threshold
150
°C
Hysteresis
20
°C
Per output channel
A-weighted
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6.7 Typical Characteristics
TA = 25°C, VDD = 3.6 V, Gain = 0 dB, EN = 3.6 V, CHPVDD = CHPVSS = 2.2 μF, CINPUT = CFLYING = 1 μF, Outputs in
Phase
10
THD+N - Total Harmonic Distortion + Noise - %
THD+N - Total Harmonic Distortion + Noise - %
10
RL = 16 W,
f = 1kHz
VDD = 2.5 V, In Phase
VDD = 3.6 V, In Phase
1
VDD = 2.5 V, Out of Phase
VDD = 3.6 V, Out of Phase
0.1
0.01
0.1
1
10
PO - Output Power per Channel - mW
RL = 32 W,
f = 1kHz
1
VDD = 2.5 V, Out of Phase
0.01
0.1
50
THD+N - Total Harmonic Distortion + Noise - %
THD+N - Total Harmonic Distortion + Noise - %
50
1
RL = 16 W,
VDD = 2.5 V
PO = 1 mW per Channel
0.1
0.01
PO = 4 mW per Channel
PO = 10 mW per Channel
0.001
20
100
1k
f - Frequency - Hz
10k
RL = 16 W,
VDD = 3.6 V
PO = 1 mW per Channel
0.1
PO = 20 mW per Channel
0.01
PO = 10 mW per Channel
0.001
20
20k
Figure 3. Total Harmonic Distortion + Noise vs Frequency
100
1k
f - Frequency - Hz
10k
20k
Figure 4. Total Harmonic Distortion + Noise vs Frequency
1
1
THD+N - Total Harmonic Distortion + Noise - %
THD+N - Total Harmonic Distortion + Noise - %
1
10
PO - Output Power per Channel - mW
Figure 2. Total Harmonic Distortion + Noise vs
Output Power
1
RL = 16 W,
VDD = 5 V
PO = 1 mW per Channel
0.1
PO = 20 mW per Channel
0.01
PO = 10 mW per Channel
100
1k
f - Frequency - Hz
10k
20k
Figure 5. Total Harmonic Distortion + Noise vs Frequency
6
VDD = 3.6 V, Out of Phase
0.1
Figure 1. Total Harmonic Distortion + Noise vs
Output Power
0.001
20
VDD = 2.5 V, In Phase
VDD = 3.6 V, In Phase
RL = 32 W,
VDD = 2.5 V
PO = 1 mW per Channel
0.1
PO = 4 mW per Channel
0.01
PO = 10 mW per Channel
0.001
20
100
1k
f - Frequency - Hz
10k
20k
Figure 6. Total Harmonic Distortion + Noise vs Frequency
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Typical Characteristics (continued)
1
THD+N - Total Harmonic Distortion + Noise - %
THD+N - Total Harmonic Distortion + Noise - %
1
RL = 32 W,
VDD = 3.6 V
PO = 1 mW per Channel
0.1
PO = 10 mW per Channel
0.01
PO = 20 mW per Channel
0.001
20
100
1k
f - Frequency - Hz
10k
20k
Figure 7. Total Harmonic Distortion + Noise vs Frequency
RL = 32 W,
VDD = 5 V
PO = 1 mW per Channel
0.1
PO = 20 mW per Channel
0.01
PO = 10 mW per Channel
0.001
20
1k
f - Frequency - Hz
10k
20k
Figure 8. Total Harmonic Distortion + Noise vs Frequency
50
50
RL = 16 W
45
45
PO - Output Power per Channel - mW
PO - Output Power per Channel - mW
100
40
THD+N = 10%
35
30
THD+N = 1%
25
20
15
10
5
RL = 32 W
40
35
THD+N = 10%
30
25
THD+N = 1%
20
15
10
5
0
2.5
3
3.5
4
4.5
VDD - Supply Voltage - V
5
0
2.5
5.5
Figure 9. Output Power vs Supply Voltage
3
3.5
4
4.5
VDD - Supply Voltage - V
5
5.5
Figure 10. Output Power vs Supply Voltage
30
40
VDD = 3.6 V, 10% THD+N
10
VDD = 2.5 V, 10% THD+N
VDD = 2.5 V, 1% THD+N
VDD = 3.6 V, 1% THD+N
25
HPVSS and Flying Cap = 2.2 mF
20
15
HPVSS and Flying Cap = 0.47 mF
10
5
THD+N = 1%,
VDD = 3.6 V
f = 1 kHz
1
10
PO - Output Power per Channel - mW
PO - Output Power per Channel - mW
HPVSS and Flying Cap = 1 mF
100
RL - Load Resistance - W
1000
0
10
100
200
RL - Load Resistance - W
Figure 11. Output Power vs Load Resistance
Figure 12. Output Power vs Load Resistance
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Typical Characteristics (continued)
2
VO - Output Voltage - Vrms
1.6
1.4
Load = 600 W
1.2
1
Load = 32 W
0.8
0.6
Load = 16 W
0.4
0.2
0
2.5
3
3.5
4
4.5
5
-10
Ksvr - Supply Voltage Rejection Ratio - dB
f = 1 kHz,
THD+N = 1%
1.8
5.5
RL = 16 W
-30
-50
-70
VDD = 5 V
VDD = 2.5 V
VDD = 3.6 V
-90
-110
20
100
VDD - Supply Voltage - V
Figure 13. Output Voltage vs Supply Voltage
1k
f - Frequency - Hz
10k
20k
Figure 14. Supply Voltage Rejection Ratio vs Frequency
9
RL = 32 W
-30
-50
-70
VDD = 3.6 V
VDD = 5 V
VDD = 2.5 V
-90
EN = 1.3 V,
No Load
8
Quiescent Supply Current - mA
Ksvr - Supply Voltage Rejection Ratio - dB
10
-10
7
6
5
4
3
2
1
-110
20
100
1k
f - Frequency - Hz
10k
0
2.5
20k
Figure 15. Supply Voltage Rejection Ratio vs Frequency
3
5
5.5
Figure 16. Quiescent Supply Current vs Supply Voltage
100
100
RL = 16 W,
f = 1kHz
RL = 32 W,
f = 1kHz
IDD - Supply Current - mA
VDD = 3 V
IDD - Supply Current - mA
3.5
4
4.5
VDD - Supply Voltage - V
VDD = 5 V
10
VDD = 2.5 V
VDD = 5 V
10
VDD = 3.6 V
VDD = 3 V
VDD = 3.6 V
1
0.001
0.01
0.1
1
PO - Total Output Power - mW
VDD = 2.5 V
10
50
Figure 17. Supply Current vs Total Output Power
8
1
0.001
0.01
0.1
1
PO - Total Output Power - mW
10
50
Figure 18. Supply Current vs Total Output Power
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Typical Characteristics (continued)
0
-10
RL = 16 W,
Power = 15 mW,
VDD = 3.6 V
-30
VO - Output Amplitude - dBV
-20
Crosstalk - dB
-40
-60
-80
-100
Single Channel,
Load = 16 W,
VDD = 3.6 V
-50
-70
-90
-110
-130
-120
-140
20
100
1k
f - Frequency - Hz
10k
20k
-150
0
5000
10000
f - Frequency - Hz
20000
Figure 20. Output Spectrum vs Frequency
Figure 19. Crosstalk vs Frequency
5
5
4
4
EN
EN
Load = 16 W,
VDD = 3.6 V,
VI = 0.5 VRMS at 20 kHz
3
V - Voltage - V
3
V - Voltage - V
15000
2
1
VOUT
0
2
1
VOUT
0
-1
-1
Load = 16 W,
VDD = 3.6 V,
VI = 0.5 VRMS at 1 kHz
-2
-2
-3
-3
0
2
4
6
t - Time - ms
8
10
Figure 21. Startup Waveforms vs Time
0
50
100
t - Time - ms
150
200
Figure 22. Shutdown Waveforms vs Time
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TPA6132A2
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7 Detailed Description
7.1 Overview
The TPA6132A2 is a DirectPath™ stereo headphone amplifier that requires no output DC blocking capacitors
and is capable of delivering 25m-W/Ch into16-Ω speakers. The device has built-in pop suppression circuitry to
completely eliminate pop noise during turn- on and turn-off. The amplifier outputs have short- circuit and thermaloverload protection.
The TPA6132A2 features fully differential inputs to reduce system noise pickup between the audio source and
the headphone amplifier. The high power supply noise rejection performance and differential architecture
provides increased RF noise immunity.
Differential stereo inputs and built-in resistors set the device gain, reducing external component count. The
TPA6132A2 has four gain settings which are controlled with pins G0 and G1. The combination of these pins set
the device to –6-dB, 0-dB, 3-dB or 6-dB gain.
The TPA6132A2 operates from a single 2.3-V to 5.5-V supply with 2.1 mA of typical supply current, as it uses a
built-in charge pump to generate a negative voltage supply for the headphone amplifiers. Shutdown mode
reduces supply current to less than 1 μA
7.2 Functional Block Diagram
VDD
HPVDD
Supply
Control
2.2 mF
PGND
HPVDD
OUTL
+
INL+
Resistor
Array
–
INL-
Short-Circuit
Protection
HPVSS
Thermal
Protection
HPVDD
Resistor
Array
OUTR
+
INR+
–
INR-
HPVDD
HPVSS
CPP
G0
G1
Click-and-Pop
Suppression
Gain
Select
Charge
Pump
1 mF
CPN
HPVSS
1 mF
SGND
10
EN
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7.3 Feature Description
7.3.1 Headphone Amplifiers
Single-supply headphone amplifiers typically require dc-blocking capacitors to remove dc bias from their output
voltage. The top drawing in Figure 23 illustrates this connection. If dc bias is not removed, large dc current will
flow through the headphones which wastes power, clip the output signal, and potentially damage the
headphones.
These dc-blocking capacitors are often large in value and size. Headphone speakers have a typical resistance
between 16 Ω and 32 Ω. This combination creates a high-pass filter with a cutoff frequency as shown in
Equation 1, where RL is the load impedance, CO is the dc-block capacitor, and fC is the cutoff frequency.
1
fc =
2pRLCO
(1)
For a given high-pass cutoff frequency and load impedance, the required dc-blocking capacitor is found as:
CO =
1
2p ¦C RL
(2)
Reducing fC improves low frequency fidelity and requires a larger dc-blocking capacitor. To achieve a 20 Hz
cutoff with 16 Ω headphones, CO must be at least 500 μF. Large capacitor values require large packages,
consuming PCB area, increasing height, and increasing cost of assembly. During start-up or shutdown the dcblocking capacitor has to be charged or discharged. This causes an audible pop on start-up and power-down.
Large dc-blocking capacitors also reduce audio output signal fidelity.
Two different headphone amplifier architectures are available to eliminate the need for dc-blocking capacitors.
The Capless amplifier architecture is similar provides a reference voltage to the headphone connector shield pin
as shown in the middle drawing of Figure 23. The audio output signals are centered around this reference
voltage, which is typically half of the supply voltage to allow symmetrical output voltage swing.
When using a Capless amplifier do not connect the headphone jack shield to any ground reference or large
currents will result. This makes Capless amplifiers ineffective for plugging non-headphone accessories into the
headphone connector. Capless amplifiers are useful only with floating GND headphones.
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Feature Description (continued)
Conventional
CO
VOUT
CO
GND
Capless
VOUT
GND
VBIAS
DirectPath™
VDD
GND
VSS
Figure 23. Amplifier Applications
The DirectPath™ amplifier architecture operates from a single supply voltage and uses an internal charge pump
to generate a negative supply rail for the headphone amplifier. The output voltages are centered around 0 V and
are capable of positive and negative voltage swings as shown in the bottom drawing of Figure 23. DirectPath
amplifiers require no output dc-blocking capacitors. The headphone connector shield pin connects to ground and
will interface will headphones and non-headphone accessories. The TPA6132A2 is a DirectPath amplifier.
7.3.2 Eliminating Turn-on Pop and Power Supply Sequencing
The TPA6132A2 has excellent noise and turn-on / turn-off pop performance. It uses an integrated click-and-pop
suppression circuit to allow fast start-up and shutdown without generating any voltage transients at the output
pins. Typical start-up time from shutdown is 5 ms.
DirectPath technology keeps the output dc voltage at 0 V even when the amplifier is powered up. The DirectPath
technology together with the active pop-and-click suppression circuit eliminates audible transients during start up
and shutdown.
Use input coupling capacitors to ensure inaudible turn-on pop. Activate the TPA6132A2 after all audio sources
have been activated and their output voltages have settled. On power-down, deactivate the TPA6132A2 before
deactivating the audio input source. The EN pin controls device shutdown: Set to 0.6 V or lower to deactivate the
TPA6132A2; set to 1.3 V or higher to activate.
12
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Feature Description (continued)
7.3.3 RF and Power Supply Noise Immunity
The TPA6132A2 employs a new differential amplifier architecture to achieve high power supply noise rejection
and RF noise rejection. RF and power supply noise are common in modern electronics. Although RF frequencies
are much higher than the 20 kHz audio band, signal modulation often falls in-band. This, in turn, modulates the
supply voltage, allowing a coupling path into the audio amplifier. A common example is the 217 Hz GSM framerate buzz often heard from an active speaker when a cell phone is placed nearby during a phone call.
The TPA6132A2 has excellent rejection of power supply and RF noise, preventing audio signal degradation.
7.3.4 Constant Maximum Output Power and Acoustic Shock Prevention
Typically the output power increases with increasing supply voltage on an unregulated headphone amplifier. The
TPA6132A2 maintains a constant output power independent of the supply voltage. Thus the design for
prevention of acoustic shock (hearing damage due to exposure to a loud sound) is simplified since the output
power will remain constant, independent of the supply voltage. This feature allows maximizing the audio signal at
the lowest supply voltage.
7.4 Device Functional Modes
7.4.1 Gain Control
The TPA6132A2 has four gain settings which are controlled with pins G0 and G1. Table 1 gives an overview of
the gain function.
G0 VOLTAGE
G1 VOLTAGE
AMPLIFIER GAIN
≤ 0.5 V
≤ 0.5 V
–6 dB
≥ 1.3 V
≤ 0.5 V
0 dB
≤ 0.5 V
≥ 1.3 V
3 dB
≥ 1.3 V
≥ 1.3 V
6 dB
Table 1. Windows Vista™ Premium Mobile Mode Specifications
Device Type
Analog Speaker Line Jack
(RL = 10 kΩ, FS = 0.707
Vrms)
Analog Headphone Out Jack
(RL = 32Ω, FS = 0.300
Vrms)
Requirement
Windows Premium Mobile Vista
Specifications
TPA6132A2 Typical Performance
THD+N
≤ –65 dB FS [20 Hz, 20 kHz]
–75 dB FS[20 Hz, 20 kHz]
Dynamic Range with Signal
Present
≤ –80 dB FS A-Weight
–100 dB FS A-Weight
Line Output Crosstalk
≤ –60 dB [20 Hz, 20 kHz]
–90 dB [20 Hz, 20 kHz]
THD+N
≤ –45 dB FS [20 Hz, 20 kHz]
–65 dB FS [20 Hz, 20 kHz]
Dynamic Range with Signal
Present
≤ –80 dB FS A-Weight
–94 dB FS A-Weight
Headphone Output Crosstalk
≤ –60 dB [20 Hz, 20 kHz]
–90 dB [20 Hz, 20 kHz]
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8 Application and Implementation
NOTE
Information in the following applications sections is not part of the TI component
specification, and TI does not warrant its accuracy or completeness. TI’s customers are
responsible for determining suitability of components for their purposes. Customers should
validate and test their design implementation to confirm system functionality.
8.1 Application Information
The TPA6132A2 starts its operation by asserting the EN pin to logic 1. The device enters in shutdown mode
when pulling low EN pin. The charge pump generates a negative supply voltage. The charge pump flying
capacitor connected between CPP and CPN transfers charge to generate the negative supply voltage. The
output voltages are capable of positive and negative voltage swings and are centered close to 0 V, eliminating
the need for output capacitors. Input coupling capacitors block any dc bias from the audio source and ensure
maximum dynamic range. The device has built-in pop suppression circuitry to completely eliminate pop noise
during turn- on, turn-off and enter or exit shutdown mode.
8.2 Typical Applications
8.2.1 Configuration with Differential Input Signals
Figure 24 shows a typical application circuit for the TPA6132A2 with a stereo headphone jack output and
differential input signals. Also supports charge pump flying capacitor and power supply decoupling capacitors.
RIGHT IN+
INR+
RIGHT IN-
INR-
LEFT IN+
INL+
LEFT IN-
INL-
ENABLE
EN
GAIN0
G0
GAIN1
G1
OUTR
TPA6132A2
OUTL
SGND
VBAT
2.2 µF
PGND
PVDD
HPVDD
HPVSS
CPP
CPN
1 µF
2.2 µF
1 µF
Figure 24. Typical Application Configuration with Differential Input Signals
8.2.1.1 Design Requirements
For this design example, use the parameters shown in Table 2.
Table 2. Design Parameters
14
PARAMETERS
VALUES
Input voltage range
2.2 V to 5.3 V
Output voltage
1.1-VRMS
Current
2 mA to 3.2 mA
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8.2.1.2 Detailed Design Procedure
8.2.1.2.1 Input Coupling Capacitors
Input coupling capacitors block any dc bias from the audio source and ensure maximum dynamic range. Input
coupling capacitors also minimize TPA6132A2 turn-on pop to an inaudible level.
The input capacitors are in series with TPA6132A2 internal input resistors, creating a high-pass filter. Equation 3
calculates the high-pass filter corner frequency. The input impedance, RIN, is dependent on device gain. Larger
input capacitors decrease the corner frequency. See the Operating Characteristics table for input impedance
values.
1
fC =
2 p RIN CIN
(3)
For a given high-pass cutoff frequency, the minimum input coupling capacitor is found as:
1
CIN =
2 p ¦ C RIN
(4)
Example: Design for a 20 Hz corner frequency with a TPA6132A2 gain of +6 dB. The Operating Characteristics
table gives RIN as 13.2 kΩ. Equation 4 shows the input coupling capacitors must be at least 0.6 μF to achieve a
20 Hz high-pass corner frequency. Choose a 0.68 μF standard value capacitor for each TPA6132A2 input (X5R
material or better is required for best performance).
Input capacitors can be removed provided the TPA6132A2 inputs are driven differentially with less than ±1 V and
the common-mode voltage is within the input common-mode range of the amplifier. Without input capacitors turnon pop performance may be degraded and should be evaluated in the system.
8.2.1.2.2 Charge Pump Flying Capacitor and HPVSS Capacitor
The TPA6132A2 uses a built-in charge pump to generate a negative voltage supply for the headphone
amplifiers. The charge pump flying capacitor connects between CPP and CPN. It transfers charge to generate
the negative supply voltage. The HPVSS capacitor must be at least equal in value to the flying capacitor to allow
maximum charge transfer. Use low equivalent-series-resistance (ESR) ceramic capacitors (X5R material or
better is required for best performance) to maximize charge pump efficiency. Typical values are 1 μF to 2.2 μF
for the HPVSS and flying capacitors. Although values down to 0.47 μF can be used, total harmonic distortion
(THD) will increase.
8.2.1.3 Application Curves
0.8
1
0.6
EN Disabled
0.75
EN Enabled
0.4
0.5
0.2
0.25
Volatge (V)
Voltage (V)
Output
Output
0
-0.2
0
-0.25
-0.4
-0.5
-0.6
-0.75
-0.8
-1
0
1m
2m
3m
4m
5m 6m
Time (s)
7m
8m
9m 10m
D001
0
200m 400m 600m 800m 1m 1.2m 1.4m 1.6m 1.8m 2m
Time (s)
Figure 26. Shutdown
Figure 25. Start-Up Time
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8.2.2 Configuration with Single-Ended Input Signals
Figure 27 shows a typical application circuit for the TPA6132A2 with a stereo headphone jack output and singleended input signals. Also supports charge pump flying capacitor and power supply decoupling capacitors.
1 µF
RIGHT IN
INRINR+
OUTR
TPA6132A2
INL-
LEFT IN
1 µF
OUTL
INL+
SGND
ENABLE
EN
GAIN0
G0
GAIN1
G1
VBAT
PGND
PVDD
HPVDD
2.2 µF
HPVSS
CPP
CPN
1 µF
2.2 µF
1 µF
Figure 27. Typical Application Configuration with Single-Ended Input Signals
8.2.2.1 Design Requirements
Refer to the Configuration with Differential Input Signals design requirements
8.2.2.2 Detailed Design Procedure
Refer to the Configuration with Differential Input Signals detailed design procedures.
8.2.2.3 Application Curves
0.8
1
0.6
EN Disabled
0.75
EN Enabled
0.4
0.5
0.2
0.25
Volatge (V)
Voltage (V)
Output
Output
0
-0.2
0
-0.25
-0.4
-0.5
-0.6
-0.75
-0.8
-1
0
1m
2m
3m
4m
5m 6m
Time (s)
7m
8m
9m 10m
D001
0
200m 400m 600m 800m 1m 1.2m 1.4m 1.6m 1.8m 2m
Time (s)
Figure 29. Shutdown
Figure 28. Start-Up Time
16
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9 Power Supply Recommendations
Connect the supply voltage to the VDD pin and decouple it with an X5R or better capacitor. Connect the HPVDD
pin only to a 2.2 μF, X5R or better, capacitor. Do not connect HPVDD to an external voltage supply. Place both
capacitors within 5 mm of their associated pins on the TPA6132A2. Ensure that the ground connection of each of
the capacitors has a minimum length return path to the device. Failure to properly decouple the TPA6132A2 may
degrade audio or EMC performance.
9.1 Power Supply and HPVDD Decoupling Capacitors
The TPA6132A2 DirectPath headphone amplifier requires adequate power supply decoupling to ensure that
output noise and total harmonic distortion (THD) remain low. Use good low equivalent-series-resistance (ESR)
ceramic capacitors (X5R material or better is required for best performance). Place a 2.2 μF capacitor within
5 mm of the VDD pin. Reducing the distance between the decoupling capacitor and VDD minimizes parasitic
inductance and resistance, improving TPA6132A2 supply rejection performance. Use 0402 or smaller size
capacitors if possible.
For additional supply rejection, connect an additional 10 μF or higher value capacitor between VDD and ground.
This will help filter lower frequency power supply noise. The high power supply rejection ratio (PSRR) of the
TPA6132A2 makes the 10 μF capacitor unnecessary in most applications.
Connect a 2.2 μF capacitor between HPVDD and ground. This ensures the amplifier internal bias supply remains
stable and maximizes headphone amplifier performance.
WARNING
DO NOT connect HPVDD directly to VDD or an external supply voltage. The
voltage at HPVDD is generated internally. Connecting HPVDD to an external
voltage can damage the device.
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10 Layout
10.1 Layout Guidelines
•
•
•
•
•
Solder the exposed metal pad on the TPA6132A2RTE QFN package to the landing pad on the PCB.
Connect the landing pad to ground or leave it electrically unconnected (floating). Do not connect the landing
pad to VDD or to any other power supply voltage.
If the pad is grounded, it must be connected to the same ground as the PGND pin (10).
See the layout and mechanical drawings at the end of the data sheet for proper sizing.
Soldering the thermal pad is required for mechanical reliability and enhances thermal conductivity of the
package.
WARNING
DO NOT connect the TPA6132A2RTE exposed metal pad to VDD or any other
power supply voltage.
10.2 Layout Example
Enable
Control
13
14
15
16
To Battery
1
Matched Board Layout for
Differential Input Signals
2.2 mF
2.2 mF
12
Paddle
Soldered /
Electrical Float
2
11
3
10
4
9
Gain
Control
8
7
6
5
1 mF
1 mF
Figure 30. Board Layout Concept
10.3 GND Connections
The SGND pin is an input reference and must be connected to the headphone ground connector pin. This
ensures no turn-on pop and minimizes output offset voltage. Do not connect more than ±0.3 V to SGND.
PGND is a power ground. Connect supply decoupling capacitors for VDD, HPVDD, and HPVSS to PGND.
18
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11 Device and Documentation Support
11.1 Receiving Notification of Documentation Updates
To receive notification of documentation updates, navigate to the device product folder on ti.com. In the upper
right corner, click on Alert me to register and receive a weekly digest of any product information that has
changed. For change details, review the revision history included in any revised document.
11.2 Community Resources
The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective
contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of
Use.
TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration
among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help
solve problems with fellow engineers.
Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and
contact information for technical support.
11.3 Trademarks
DirectPath, E2E are trademarks of Texas Instruments.
Windows Vista is a trademark of Microsoft Corporation.
All other trademarks are the property of their respective owners.
11.4 Electrostatic Discharge Caution
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
11.5 Glossary
SLYZ022 — TI Glossary.
This glossary lists and explains terms, acronyms, and definitions.
12 Mechanical, Packaging, and Orderable Information
The following pages include mechanical, packaging, and orderable information. This information is the most
current data available for the designated devices. This data is subject to change without notice and revision of
this document. For browser-based versions of this data sheet, refer to the left-hand navigation.
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PACKAGE OPTION ADDENDUM
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19-Oct-2022
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
(2)
Lead finish/
Ball material
MSL Peak Temp
Op Temp (°C)
Device Marking
(3)
Samples
(4/5)
(6)
TPA6132A2RTER
ACTIVE
WQFN
RTE
16
3000
RoHS & Green
NIPDAU
Level-2-260C-1 YEAR
-40 to 85
AIWI
Samples
TPA6132A2RTET
ACTIVE
WQFN
RTE
16
250
RoHS & Green
NIPDAU
Level-2-260C-1 YEAR
-40 to 85
AIWI
Samples
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of
