TPA6201A1DGNR

12500 TI Boulevard, MS 8640, Dallas, Texas 75243 PCN# 20120907001 Add Cu as Alternative Wire Base Metal for Select Device(s) on MSOP package Change Notification / Sample Request Date: 9/13/2012 To: MOUSER PCN Dear Customer: This is an announcement of a change to a device that is currently offered by Texas Instruments. The details of this change are on the following pages. We request you acknowledge receipt of this notification within 30 days of the date of this notice. Lack of acknowledgement of this notice within 30 days constitutes acceptance of the change. If you require samples or additional data to support your evaluation, please request within 30 days. The changes discussed within this PCN will not take effect any earlier than 90 days from the date of this notification, unless customer agreement has been reached on an earlier implementation of the change. This notification period is per TI’s standard process. This notice does not change the end-of-life status of any product. Should product affected be on a previously issued product withdrawal/discontinuance notice, this notification does not extend the life of that product or change the life time buy offering/discontinuance plan. For questions regarding this notice, contact your local Field Sales Representative or the PCN Manager (PCN_ww_admin_team@list.ti.com). Sincerely, PCN Team SC Business Services Phone: +1(214) 480-6037 Fax: +1(214) 480-6659 Texas Instruments, Inc. PCN# 20120907001 20120907001 Attachment: 1 Products Affected: The devices listed on this page are a subset of the complete list of affected devices. According to our records, these are the devices that you have purchased within the past twenty-four (24) months. The corresponding customer part number is also listed, if available. DEVICE TPA6203A1DGN TPA6205A1DGN TPA6205A1DGNG4 TPS74001DGKT TPS74012DGKT CUSTOMER PART NUMBER null null null null null Technical details of this Product Change follow on the next page(s). Texas Instruments, Inc. PCN# 20120907001 PCN Number: 20120907001 PCN Date: 09/13/2012 Title: Add Cu as Alternative Wire Base Metal for Select Device(s) on MSOP package Customer PCN Manager Phone: +1(214)480-6037 Dept: Quality Services Contact: Estimated Sample Date provided at sample Proposed 1st Ship Date: 12/13/2012 Availability: request Change Type: Assembly Site Assembly Process Assembly Materials Design Electrical Specification Mechanical Specification Test Site Packing/Shipping/Labeling Test Process Wafer Bump Site Wafer Bump Material Wafer Bump Process Wafer Fab Site Wafer Fab Materials Wafer Fab Process PCN Details Description of Change: Texas Instruments is pleased to announce the qualification of Cu as an additional bond wire option for devices listed in “Product affected” section below. Devices will remain in current assembly facility and Material differences are shown in the following table: Wire From Au (1.0, 2.0 mil) To Cu (1.0, 2.0 mil) Reason for Change: Continuity of supply. 1) To align with world technology trends and use wiring with enhanced mechanical and electrical properties 2) Maximize flexibility within our Assembly/Test production sites. 3) Cu is easier to obtain and stock Anticipated impact on Fit, Form, Function, Quality or Reliability (positive / negative): None. Changes to product identification resulting from this PCN: None. Product Affected: HPA00194DGNR TPA6201A1DGN TPA6201A1DGNG4 TPA6201A1DGNR TPA6201A1DGNRG4 Texas Instruments, Inc. TPA6203A1DGN TPA6203A1DGNG4 TPA6203A1DGNR TPA6203A1DGNRG4 TPA6205A1DGN TPA6205A1DGNG4 TPA6205A1DGNR TPA6205A1DGNRG4 TPS74001DGKR TPS74001DGKT TPS74012DGKR TPS74012DGKT PCN# 20120907001 Qualification Data: Approved 7/20/2011 This qualification has been developed for the validation of this change. The qualification data validates that the proposed change meets the applicable released technical specifications. Qual Vehicle 1: TPS40009DGQ (MSL1-260C) Package Construction Details Assembly Site: ASESH # Pins-Designator, Family: 8-DGQ, VSSOP Lead frame (Finish, Base): NiPdAuAg, Cu Qualification: Plan Test Results Reliability Test Mold Compound: EN2000515 Mount Compound: Bond Wire: EY1000063 1.0 Mil Diameter, Cu Conditions Sample Size/Fail High Temp Operating Life 125C (1000 hrs) Electrical Characterization Manufacturability (Assembly) (per mfg. Site specification) Notes **- Preconditioning sequence: Level 1-260C. Qual Vehicle 2: TPS62040DGQ (MSL1-260C) Package Construction Details Assembly Site: ASESH Mold Compound: # Pins-Designator, Family: 10-DGQ, VSSOP Mount Compound: Lead frame (Finish, Base): NiPdAuAg, Cu Bond Wire: Qualification: Plan Test Results Reliability Test Conditions Electrical Characterization **High Temp. Storage Bake 150C (1000 Hrs) **Biased HAST 130C/85%RH (96 Hrs) **Temperature Cycle -65C/+150C (500 Cyc) Manufacturability (Assembly) (per mfg. Site specification) Moisture Sensitivity (level 1 @ 260C peak +5/-0C) Notes **- Preconditioning sequence: Level 1-260C. Qual Vehicle 3: TPS2066DGN (MSL1-260C) Package Construction Details Assembly Site: ASESH Mold Compound: # Pins-Designator, Family: 8-DGN, VSSOP Mount Compound: Lead frame (Finish, Base): NiPdAuAg, Cu Bond Wire: Qualification: Plan Test Results Reliability Test Conditions Electrical Characterization **Temperature Cycle -65C/+150C (500 Cyc) Manufacturability (Assembly) (per mfg. Site specification) Notes **- Preconditioning sequence: Level 1-260C. Texas Instruments, Inc. 76/0 Pass Pass EN2000515 EY1000063 1.0 Mil Diameter, Cu Sample Size (Pass/Fail) Lot#1 Lot#2 Lot#3 Pass 77/0 77/0 77/0 77/0 77/0 77/0 77/0 77/0 77/0 Pass Pass Pass 12/0 12/0 12/0 EN2000515 EY1000063 2.0 Mil Diameter, Cu Sample Size/Fail Pass 77/0 Pass PCN# 20120907001 Qual Vehicle 4: TPS51100DGQ (MSL1-260C) Package Construction Details Assembly Site: ASESH Mold Compound: # Pins-Designator, Family: 10-DGQ, VSSOP Mount Compound: Lead frame (Finish, Base): NiPdAuAg, Cu Bond Wire: Qualification: Plan Test Results Reliability Test Conditions Electrical Characterization **Temperature Cycle -65C/+150C (500 Cyc) Manufacturability (Assembly) (per mfg. Site specification) Notes **- Preconditioning sequence: Level 1-260C. EN2000515 EY1000063 1.0 Mil Diameter, Cu Sample Size/Fail Pass 77/0 Pass For questions regarding this notice, e-mails can be sent to the regional contacts shown below or your local Field Sales Representative. Location USA Europe Asia Pacific Japan Texas Instruments, Inc. E-Mail PCNAmericasContact@list.ti.com PCNEuropeContact@list.ti.com PCNAsiaContact@list.ti.com PCNJapanContact@list.ti.com PCN# 20120907001