TPD1S514-2EVM

User's Guide SLVUA97 – July 2014 TPD1S514-2EVM This user's guide describes the characteristics, operation, and use of the TPD1S514-2EVM evaluation module (EVM). This EVM includes 4 TPD1S514-2’s in various configurations for testing. One TPD1S514-2 is configured with pin-outs and one TPD1S514-2 is configured with USB 2.0 Type A connectors for throughput analysis. This user's guide includes setup instructions, schematic diagrams, a bill of materials, and printed-circuit board layout drawings for the EVM. SLVUA97 – July 2014 Submit Documentation Feedback TPD1S514-2EVM Copyright © 2014, Texas Instruments Incorporated 1 Introduction 1 2 3 4 5 www.ti.com Contents Introduction ................................................................................................................... Board Setup .................................................................................................................. 2.1 U1 ..................................................................................................................... 2.2 U2 ..................................................................................................................... Schematics ................................................................................................................... Board Layout ................................................................................................................. Bill of Materials ............................................................................................................... 2 3 3 4 5 6 8 List of Figures 1 TPD1S514-2 Board Configuration for U1 ................................................................................. 3 2 TPD1S514 Board Configuration for U2 ................................................................................... 4 3 TPD1S514-2EVM Schematic 4 5 6 7 .............................................................................................. Top Layer Copper ........................................................................................................... Second Layer Copper ....................................................................................................... Layer 3 Copper............................................................................................................... Bottom Layer Copper........................................................................................................ 5 6 6 6 6 List of Tables 1 1 EVM Configuration........................................................................................................... 2 2 Bill of Materials ............................................................................................................... 8 Introduction Texas Instrument’s TPD1S514-2 evaluation module helps designers evaluate the operation and performance of the TPD1S514-2 device. The TPD1S514-2 is a single-chip solution for USB connector’s VBUS line protection. The bi-directional nFET switch ensures safe current flow in both charging and host mode while protecting the internal system circuits from any over-voltage conditions at the VBUS_CON pin. On the VBUS_CON pin, this device can handle over-voltage protection up to 30 V. After the EN pin toggles low, the TPD1S514-2 waits 21 ms before turning ON the nFET through a startup delay. VBUS_POWER pin indicates the nFET is completely turned ON. Table 1. EVM Configuration 2 Reference Designator TI Part Number U1 TPD1S514-2 Surge U2 and U3 TPD1S514-2 and TPD3E001 Surge and ESD TPD1S514-2EVM Configuration SLVUA97 – July 2014 Submit Documentation Feedback Copyright © 2014, Texas Instruments Incorporated Board Setup www.ti.com 2 Board Setup This section describes the intended use of the TPD1S514-2EVM. A generalized outline of the procedure given in IEC-61000-4-5 is described here. IEC-61000-4-5 should be referred to for a more specific testing outline. Connect +5V and GND during any tests. 2.1 U1 TPD1S514-2 (U1) is pinned out to allow evaluating device performance during normal operating conditions as well as during surge events. VBUS_CON is J1 and VBUS_SYS is J2. A 3-pin header (JP2) allows shunting the EN pin on or off. Test points allow monitoring of VBUS_CON, VBUS_SYS, and VBUS_POWER. TPD1S514-2 can pass up to 3.5 A continuous current from VBUS_CON to VBUS_SYS. RDYN can be measured under these conditions using the test points VBUS_CON and VBUS_SYS, where RDYN = (VVBUS_CON – VVBUS_SYS)/IVBUS. Surge can be injected onto VBUS_CON using J1. Over Voltage Protection (OVP) and Under Voltage Lockout (UVLO) can be measured by sweeping 0 V - 30 V on VBUS_CONN and measuring at the three test points. VBUS_SYS should have a load typical to the expected operational condition. Figure 1. TPD1S514-2 Board Configuration for U1 Timing measurements should be performed after removal of C1, C2, and C3. SLVUA97 – July 2014 Submit Documentation Feedback TPD1S514-2EVM Copyright © 2014, Texas Instruments Incorporated 3 Board Setup 2.2 www.ti.com U2 Figure 2. TPD1S514 Board Configuration for U2 A pass through USB2.0 port is included for system level testing. The female USB connector (USB1) is the “Connector” side of TPD1S514-2 and a male USB connector (USB2) is the “System” side. ESD protection has been added to the Hi-Speed data lines and ID pin in the form of TPD3E001DRL to complete the port protection example scheme. Surge can be injected into VBUS_CON using J3. A 3-pin header (JP2) allows shunting the EN pin on or off. Test points allow monitoring of VBUS_CON, VBUS_SYS, and VBUS_POWER. 4 TPD1S514-2EVM SLVUA97 – July 2014 Submit Documentation Feedback Copyright © 2014, Texas Instruments Incorporated Schematics www.ti.com 3 Schematics +5V TP8 J1 TP1 JP1 TP2 1 OFF B3 C2 C3 2 EN C1 3 ON 1uF J2 TP3 U1 VBUS_CON VBUS_CON VBUS_CON VBUS_SYS VBUS_SYS VBUS_SYS A2 A3 B2 C2 A1 EN VBUS_POWER GND GND GND GND JP2 C1 A4 B4 C4 C5 —) TPD1S514-2YZ 1 OFF 2.2uF B1 2 EN TP5 3 ON TP6 TP4 U2 B3 C2 C3 VBUS_CON VBUS_CON VBUS_CON VBUS_SYS VBUS_SYS VBUS_SYS A2 A3 B2 C3 2.2uF A1 EN VBUS_POWER GND GND GND GND J3 B1 C1 A4 B4 C4 C6 —) 6 5 1 8 USB1 7 5 TPD1S514-2YZ USB2 1 2 USB_DATA_N 2 3 USB_DATA_P 3 4 4 6 U3 5 VCC IO1 IO2 4 IO3 GND 1 2 3 C4 1uF TP7 TPD3E001DRLR PS2 GND Figure 3. TPD1S514-2EVM Schematic SLVUA97 – July 2014 Submit Documentation Feedback TPD1S514-2EVM Copyright © 2014, Texas Instruments Incorporated 5 Board Layout 4 www.ti.com Board Layout This section provides the TPD1S514-2EVM board layout. TPD1S514-2EVM is a 4-layer board of FR-4 at 0.062" thickness, with ½ oz. copper outer layers and 1 oz. copper inner layers. Figure 4. Top Layer Copper 6 Figure 5. Second Layer Copper TPD1S514-2EVM SLVUA97 – July 2014 Submit Documentation Feedback Copyright © 2014, Texas Instruments Incorporated Board Layout www.ti.com Figure 6. Layer 3 Copper Figure 7. Bottom Layer Copper SLVUA97 – July 2014 Submit Documentation Feedback TPD1S514-2EVM Copyright © 2014, Texas Instruments Incorporated 7 Bill of Materials 5 www.ti.com Bill of Materials Table 2. Bill of Materials Designator Quantity Value Description Package Reference Part Number Manufacturer C1, C4, C5, C6 4 1µF CAP, CERM, 1µF, 25V, ±10%, X7R, 1206 1206 12063C105KAT2A AVX C2, C3 2 2.2µF CAP, CERM, 2.2µF, 100V, ±10%, X7R, 1210 1210 GRM32ER72A225 KA35L MuRata H1, H2, H3, H4 4 Machine Screw, Round, #4-40 x 1/4, Nylon, Philips panhead Screw NY PMS 440 0025 PH B&F Fastener Supply H5, H6, H7, H8 4 Standoff, Hex, 0.5"L #4-40 Nylon Standoff 1902C Keystone J1, J2, J3, PS2 4 Standard Banana Jack, Uninsulated, 5.5mm Keystone_575-4 575-4 Keystone JP1, JP2 2 PEC03SAAN Header, Male 3-pin, 100mil spacing, 0.100 inch x 3 PEC03SAAN Sullins SH-J1A, SH-J2A 2 1x2 Shunt, 100mil, Gold plated, Black Shunt 969102-0000-DA 3M TP1, TP2, TP3, TP4, TP5, TP6, TP8 7 Red Test Point, Miniature, Red, TH Red Miniature Testpoint 5000 Keystone TP7 1 Black Test Point, Multipurpose, Black, TH Black Multipurpose Testpoint 5011 Keystone U1, U2 2 USB Charger Over Voltage, Surge and ESD Protection for VBUS_CON Pin, YZ0012AFAV YZ0012AFAV TPD1S514-2YZ Texas Instruments U3 1 IC, LOW-CAPACITANCE 3-CHANNEL ±15-kV ESDPROTECTION ARRAY FOR HIGH-SPEED DATA INTERFACES SOP-5 (DRL) TPD3E001DRL Texas Instruments USB1 1 Connector, Receptacle, USB TYPE A, 4POS SMD USB TYPE A CONNECTOR RECEPTACLE 4POS SMD 896-43-004-00000000 Mill-Max USB2 1 Connector, USB Type A, 4POS R/A, SMD USB Type A right angle 48037-1000 Molex 8 TPD3E001DRLR TPD1S514-2EVM SLVUA97 – July 2014 Submit Documentation Feedback Copyright © 2014, Texas Instruments Incorporated IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. All semiconductor products (also referred to herein as “components”) are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment. TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI’s terms and conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarily performed. TI assumes no liability for applications assistance or the design of Buyers’ products. Buyers are responsible for their products and applications using TI components. To minimize the risks associated with Buyers’ products and applications, Buyers should provide adequate design and operating safeguards. TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or other intellectual property right relating to any combination, machine, or process in which TI components or services are used. Information published by TI regarding third-party products or services does not constitute a license to use such products or services or a warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI. Reproduction of significant portions of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties, conditions, limitations, and notices. TI is not responsible or liable for such altered documentation. Information of third parties may be subject to additional restrictions. Resale of TI components or services with statements different from or beyond the parameters stated by TI for that component or service voids all express and any implied warranties for the associated TI component or service and is an unfair and deceptive business practice. TI is not responsible or liable for any such statements. Buyer acknowledges and agrees that it is solely responsible for compliance with all legal, regulatory and safety-related requirements concerning its products, and any use of TI components in its applications, notwithstanding any applications-related information or support that may be provided by TI. Buyer represents and agrees that it has all the necessary expertise to create and implement safeguards which anticipate dangerous consequences of failures, monitor failures and their consequences, lessen the likelihood of failures that might cause harm and take appropriate remedial actions. Buyer will fully indemnify TI and its representatives against any damages arising out of the use of any TI components in safety-critical applications. In some cases, TI components may be promoted specifically to facilitate safety-related applications. With such components, TI’s goal is to help enable customers to design and create their own end-product solutions that meet applicable functional safety standards and requirements. Nonetheless, such components are subject to these terms. No TI components are authorized for use in FDA Class III (or similar life-critical medical equipment) unless authorized officers of the parties have executed a special agreement specifically governing such use. Only those TI components which TI has specifically designated as military grade or “enhanced plastic” are designed and intended for use in military/aerospace applications or environments. Buyer acknowledges and agrees that any military or aerospace use of TI components which have not been so designated is solely at the Buyer's risk, and that Buyer is solely responsible for compliance with all legal and regulatory requirements in connection with such use. TI has specifically designated certain components as meeting ISO/TS16949 requirements, mainly for automotive use. In any case of use of non-designated products, TI will not be responsible for any failure to meet ISO/TS16949. Products Applications Audio www.ti.com/audio Automotive and Transportation www.ti.com/automotive Amplifiers amplifier.ti.com Communications and Telecom www.ti.com/communications Data Converters dataconverter.ti.com Computers and Peripherals www.ti.com/computers DLP® Products www.dlp.com Consumer Electronics www.ti.com/consumer-apps DSP dsp.ti.com Energy and Lighting www.ti.com/energy Clocks and Timers www.ti.com/clocks Industrial www.ti.com/industrial Interface interface.ti.com Medical www.ti.com/medical Logic logic.ti.com Security www.ti.com/security Power Mgmt power.ti.com Space, Avionics and Defense www.ti.com/space-avionics-defense Microcontrollers microcontroller.ti.com Video and Imaging www.ti.com/video RFID www.ti-rfid.com OMAP Applications Processors www.ti.com/omap TI E2E Community e2e.ti.com Wireless Connectivity www.ti.com/wirelessconnectivity Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265 Copyright © 2014, Texas Instruments Incorporated