TPD4S214EVM

User's Guide SLVU839 – February 2013 TPD4S214EVM 1 Introduction The TPD4S214 is a single-chip protection solution for USB On-the-Go and other current limited USB applications. This device includes an integrated low RDS(ON) N-channel current limited switch for OTG current supply to peripheral devices. TPD4S214 offers low capacitance TVS ESD clamps for the D+, D–, and ID pins for both USB2.0 and USB3.0 applications. The VBUS pin can handle continuous voltage ranging from –2V to 30V. The over voltage lock-out (OVLO) at the VBUS pin ensures that if there is a fault condition at the VBUS line, the TPD4S214 is able to isolate it and protects the system from damage. Similarly, the under voltage lock out (UVLO) at the VOTG_IN pin ensures that there is no power drain from the internal OTG supply to external VBUS if VOTG_IN drops below safe operating level. When EN is high, the OTG switch is activated and the FLT pin indicates whether there is a fault condition. The soft start feature waits 16 ms to turn on the OTG switch after all operating conditions are met. The FLT pin asserts low during any one of the following fault conditions: OVLO (VBUS > VOVLO), over temperature, over current, short circuit condition, or reverse-current-condition (VBUS > VOTG_IN). The OTG switch is turned off during any fault condition; in addition, it is also turned off during UVLO condition (VOTG_IN < VUVLO). Once the switch is turned off, the IC periodically rechecks the faults and UVLO internally. If the IC returns to normal operating conditions, the switch turns back on and FLT is reset to high. There is also a VBUS detection feature for facilitating USB communication between USB host and peripheral device. Refer to Table 2 in data sheet for detection scheme. If this is not used, DET pin can be either floating or connected to ground. SLVU839 – February 2013 Submit Documentation Feedback TPD4S214EVM Copyright © 2013, Texas Instruments Incorporated 1 Highlighted Features 2 www.ti.com Highlighted Features • • • • • • • • • • • • • • Input Voltage Protection at VBUS up to 30V Low RDS(ON) N-CH FET Switch for high efficiency Compliant with USB2.0 and USB3.0 OTG spec User Adjustable current limit from 250mA to beyond 900mA Built-in soft-start Reverse current blocking Over Voltage Lock Out for VBUS Under Voltage Lock Out for VOTG_IN Thermal shutdown and short circuit protection Auto retry on any fault; no latching off states Integrated VBUS detection circuit Low Capacitance TVS ESD Clamp for USB2.0 High speed Data Rate Internal 16ms startup delay ESD Performance D+/D–/ID/VBUS Pins: – ±15-kV Contact Discharge (IEC 61000-4-2) – ±15-kV Air Gap Discharge (IEC 61000-4-2) Space Saving WCSP (12-YFF) Package 3 EVM Description The TPD4S214EVM provides full functionality of TPD4S214. Dependent on the jumper configurations, VOTG_IN can be supplied through either the USB Type-A connector labeled USB_IN or the banana jack labeled VOTG_IN. VBUS can be output to either the Micro USB-B connector labeled USB_OUT or a two pin terminal block labeled VBUS_OUT. This configuration allows the device to be tested without the use of expensive breakout boards; yet one or two breakout boards can still be accommodated. D+/D– lines can only be characterized through the USB connectors. Test points are provided for monitoring the DET, EN, and FLT logic pins. VBUS current limiting adjustments are made by jumper selection of ADJ_SEL. R3 is left unpopulated to allow for a custom user preferred value. 2 TPD4S214EVM SLVU839 – February 2013 Submit Documentation Feedback Copyright © 2013, Texas Instruments Incorporated EVM Description www.ti.com Table 1. Jumper Configurations Jumper Configurations VOTG_IN Source selection USB_IN port VOTG_IN banana connector EN Sets EN pin low Sets EN pin high in reference to VCCA Table 2. Jumper Configurations VBUS_OUT VBUS_OUT USB_OUT USB_OUT Jumper Configurations VBUS Source selection VBUS_OUT Terminal block USB_OUT connector Table 3. Jumper Configurations VBUS current limiter adjust 56K ADJ_SELECT 110K ~ 1A R3 56K 110K R3 ~ 0.5A SLVU839 – February 2013 Submit Documentation Feedback 56K 110K ~ 1.5A R3 56K 110K R3 User supplied TPD4S214EVM Copyright © 2013, Texas Instruments Incorporated 3 Bill of Materials 4 www.ti.com Bill of Materials Table 4. Bill of Materials Qty 4 RefDes Size 1 U1 0.051 inch x 0.067 1 CBUS 603 1 COTG 603 3 J4 J6 J8 1 Value Description Part Number MFR IC, USB OTG COMPANION DEVICE TPD4S214YFF TI 1uF Capacitor, Ceramic Chip, 10V, ±10% STD STD 10uF Capacitor, Ceramic Chip, 10V, ±10% STD STD 0.300 inch dia Connector, Banana Jack, Uninsulated 3267 Pomona J5 0.354 inch x 0.628 Connector,15A, 300V Male 2 Pole, 5.08 mm ED120/2DS On Shore Technology Inc. 1 USB_OUT 0.201 inch x 0.295 Connector, SMT, Micro USB-B, flangeless SD-105017-1001 Molex 1 USB_IN 0.596 inch x 0.618 CONN USB 2.0 R/A FMAL TYPE-A SMD AU-Y1006-2-R Assman WSW Components 2 D1-2 603 SML-LX0603GW-TR Diode, LED, Red, 1.8, 2mA, 2.5 mcd SML-311UTT86 Rohm Semiconductor 3 J1-3 0.10 inch x 0.30 PEC03SAAN Header, Male 3-pin, 100mil spacing, PEC03SAAN Sullins 1 J7 0.20 inch x 0.30 PEC03DAAN Header, Male 2x3-pin, 100mil spacing PEC03DAAN Sullins 2 R4-5 1206 10K Resistor, Metal Film, 1/4 watt, ±5% STD STD 1 R2 1206 110K Resistor, Metal Film, 1/4 watt, ±5% STD STD 1 R1 1206 56K Resistor, Metal Film, 1/4 watt, ±5% STD STD 4 TP1-4 0.100 inch dia. 5002 Test Point, White, Thru Hole Color Keyed 5002K-ND Keystone TPD4S214EVM SLVU839 – February 2013 Submit Documentation Feedback Copyright © 2013, Texas Instruments Incorporated Schematic www.ti.com 5 Schematic Figure 1. Schematic Drawing SLVU839 – February 2013 Submit Documentation Feedback TPD4S214EVM Copyright © 2013, Texas Instruments Incorporated 5 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. All semiconductor products (also referred to herein as “components”) are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment. TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI’s terms and conditions of sale of semiconductor products. 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