TPD4F202, TPD6F202
SLLS800B – JUNE 2010 – REVISED MAY 2021
TPDxF202 Four or Six-Channel EMI Filter With ESD Protection For LCD Display
1 Features
3 Description
•
The TPDxF202 devices are four or six-channel EMI
filters, designed particularly to suppress EMI noise in
the cell phone and other portable applications. These
filters also provide a Transient Voltage Suppressor
(TVS) diode circuit for Electrostatic Discharge (ESD)
protection which prevents damage to the application
when subjected to ESD stress far exceeding IEC
61000-4-2 (Level 4). The pi-style C-R-C filter provides
symmetric filter performance in the data lines to and
from either side of the filter.
•
•
•
•
•
Four or six-channel EMI filtering and ESD
protection for data lines
Excellent filter performance
– > 40-dB attenuation at 1 GHz to 3G Hz
– –3-dB bandwidth at 108 MHz
– 70-dB crosstalk attenuation at 100 MHz
Exceeds IEC 61000-4-2 (Level 4) ESD protection
requirements
– ±25-kV IEC 61000-4-2 contact discharge
– ±25-kV IEC 61000-4-2 air-gap discharge
– ±15-kV human body model (HBM)
Pi-style C-R-C filter configuration offers symmetric
filter performance
(R = 100 Ω, CTOTAL = 30 pF)
Low 10-nA leakage current
Space-saving DSBGA package and flow-through
pin mapping provide optimum performance in
portable applications
2 Applications
•
•
End equipment:
– LCD displays
– Memory interface
– Keypads
– Portables
Interfaces:
– DVI
– VGA, SVGA
– SIM cards
– Data lines
Due to the tiny parasitics of the DSBGA package, the
TPDxF202 filters provide excellent signal attenuation
(–40 dB at 1 GHz) at the typical cell-phone carrier
frequency ranges.
The ultra thin (0.3-mm package height, when mounted
on board) space-saving YFU package enables the
TPDxF202 devices to mount on the printed-circuitboards where height is a key constraint.
The TPDxF202 devices are specified for –40°C to
85°C operation.
A typical application for TPDxF202 devices are in
portable equipment with DVI, VGA, SVGA, SIM Card,
and other data interfaces.
Device Information(1)
PART NUMBER
PACKAGE
BODY SIZE (NOM)
TPD4F202
DSBGA (10)
1.06 mm × 1.57 mm
TPD6F202
DSBGA (15)
1.06 mm × 2.36 mm
(1)
For all available packages, see the orderable addendum at
the end of the data sheet.
Functional Block Diagram
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.
TPD4F202, TPD6F202
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Table of Contents
1 Features............................................................................1
2 Applications..................................................................... 1
3 Description.......................................................................1
4 Revision History.............................................................. 2
5 Pin Configuration and Functions...................................3
6 Specifications.................................................................. 5
6.1 Absolute Maximum Ratings........................................ 5
6.2 ESD Ratings — JEDEC.............................................. 5
6.3 ESD Ratings — IEC....................................................5
6.4 Recommended Operating Conditions.........................5
6.5 Thermal Information....................................................5
6.6 Electrical Characteristics.............................................6
6.7 Typical Characteristics................................................ 7
7 Detailed Description........................................................8
7.1 Overview..................................................................... 8
7.2 Functional Block Diagram........................................... 8
7.3 Feature Description.....................................................8
7.4 Device Functional Modes............................................8
8 Application and Implementation.................................... 9
8.1 Application Information............................................... 9
8.2 Typical Application...................................................... 9
9 Power Supply Recommendations................................10
10 Layout........................................................................... 11
10.1 Layout Guidelines................................................... 11
10.2 Layout Example...................................................... 11
11 Device and Documentation Support..........................12
11.1 Documentation Support.......................................... 12
11.2 Related Links.......................................................... 12
11.3 Support Resources................................................. 12
11.4 Trademarks............................................................. 12
11.5 Electrostatic Discharge Caution.............................. 12
11.6 Glossary.................................................................. 12
12 Mechanical, Packaging, and Orderable
Information.................................................................... 12
4 Revision History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
Changes from Revision A (November 2015) to Revision B (May 2021)
Page
• Updated the numbering format for tables, figures, and cross-references throughout the document .................1
• Changed the dimensions for the DSBGA (15) package from 1.06 mm × 2.63 mm to 1.06 mm × 2.36 mm in
the Device Information table............................................................................................................................... 1
Changes from Revision * (June 2010) to Revision A (November 2015)
Page
• Added Pin Configuration and Functions section, ESD Ratings table, Feature Description section, Device
Functional Modes, Application and Implementation section, Power Supply Recommendations section, Layout
section, Device and Documentation Support section, and Mechanical, Packaging, and Orderable Information
section ............................................................................................................................................................... 1
• Deleted Ordering Information section ................................................................................................................ 1
2
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5 Pin Configuration and Functions
Figure 5-1. YFU Package 10-Pin DSBGA Top View
Table 5-1. Pin Functions — TPD4F202
PIN
TYPE
DESCRIPTION
NO.
NAME
A1
Ch1_In
I/O
ESD-protected channel, route to connector. Corresponds with CH1_Out.
A3
Ch1_Out
I/O
ESD-protected channel, route to system. Corresponds with CH1_In.
B2
GND
G
Ground
C1
Ch2_In
I/O
ESD-protected channel, route to connector. Corresponds with CH2_Out.
C3
Ch2_Out
I/O
ESD-protected channel, route to system. Corresponds with CH2_In.
D1
Ch3_In
I/O
ESD-protected channel, route to connector. Corresponds with CH3_Out.
D3
Ch3_Out
I/O
ESD-protected channel, route to system. Corresponds with CH3_In.
E2
GND
G
Ground
F1
Ch4_In
I/O
ESD-protected channel, route to connector. Corresponds with CH4_Out.
F3
Ch4_Out
I/O
ESD-protected channel, route to system. Corresponds with CH4_In.
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Figure 5-2. YFU Package 15-Pin DSBGA Top View
Table 5-2. Pin Functions — TPD6F202
PIN
NO.
4
NAME
TYPE
DESCRIPTION
A1
Ch1_In
I/O
ESD-protected channel, route to connector. Corresponds with CH1_Out.
A3
Ch1_Out
I/O
ESD-protected channel, route to system. Corresponds with CH1_In.
B2
GND
G
Ground
C1
Ch2_In
I/O
ESD-protected channel, route to connector. Corresponds with CH2_Out.
C3
Ch2_Out
I/O
ESD-protected channel, route to system. Corresponds with CH2_In.
D1
Ch3_In
I/O
ESD-protected channel, route to connector. Corresponds with CH3_Out.
D3
Ch3_Out
I/O
ESD-protected channel, route to system. Corresponds with CH3_In.
E2
GND
G
Ground
F1
Ch4_In
I/O
ESD-protected channel, route to connector. Corresponds with CH4_Out.
F3
Ch4_Out
I/O
ESD-protected channel, route to system. Corresponds with CH4_In.
G1
Ch5_In
I/O
ESD-protected channel, route to connector. Corresponds with CH5_Out.
G3
Ch5_Out
I/O
ESD-protected channel, route to system. Corresponds with CH5_In.
H2
GND
G
Ground
J1
Ch6_In
I/O
ESD-protected channel, route to connector. Corresponds with CH6_Out.
J3
Ch6_Out
I/O
ESD-protected channel, route to system. Corresponds with CH6_In.
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6 Specifications
6.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted)(1)
VIO
MIN
MAX
UNIT
–0.3
6
V
Continuous power dissipation (TA = 70°C)
100
mW
Junction temperature
150
°C
300
°C
150
°C
IO to GND
TJ
Lead temperature (soldering, 10 s)
Tstg
(1)
Storage temperature
–65
Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress
ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under
Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device
reliability.
6.2 ESD Ratings — JEDEC
VALUE
V(ESD)
(1)
(2)
Electrostatic
discharge
Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1)
±15000
Charged-device model (CDM), per JEDEC specification JESD22-C101(2)
±1500
UNIT
V
JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
6.3 ESD Ratings — IEC
VALUE
V(ESD)
Electrostatic
discharge
IEC 61000-4-2 contact discharge
±25000
IEC 61000-4-2 air-gap discharge
±25000
UNIT
V
6.4 Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted)
VIO
I/O to GND
TA
Ambient temperature
MIN
MAX
0
5.5
UNIT
V
–40
85
°C
6.5 Thermal Information
THERMAL METRIC(1)
TPD4F202
TPD6F202
YFU (DSBGA)
YFU (DSBGA)
10 PINS
15 PINS
91.8
72
°C/W
1
0.6
°C/W
19.7
14.1
°C/W
UNIT
RθJA
Junction-to-ambient thermal resistance
RθJC(top)
Junction-to-case (top) thermal resistance
RθJB
Junction-to-board thermal resistance
ψJT
Junction-to-top characterization parameter
0.5
0.3
°C/W
ψJB
Junction-to-board characterization parameter
19.7
14.1
°C/W
RθJC(bot)
Junction-to-case (bottom) thermal resistance
n/a
n/a
°C/W
(1)
For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report, SPRA953.
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6.6 Electrical Characteristics
TA = –40°C to 85°C (Unless otherwise noted)
PARAMETER
VBR
DC breakdown voltage
R
Resistance
C
Capacitance (C1 or C2)
VIO = 3.3 V, ƒ = 1 MHz
IIO
Channel leakage current
VIO = 3.3 V
fC
Cut-off frequency
ZSOURCE = 50 Ω, ZLOAD = 50 Ω
(1)
6
TEST CONDITIONS
IIO = 10 μA
MIN
TYP(1)
MAX
100
115
6
85
UNIT
V
15
Ω
pF
10
nA
108
MHz
Typical values are at TA = 25°C.
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6.7 Typical Characteristics
Figure 6-1. Channel-to-Channel Crosstalk
Figure 6-2. Frequency Response Data (0-V Bias)
5
50
Out Pin (ESD Strike Terminal)
Input Pin (Internal Terminal)
0
40
-5
35
-10
30
-15
Amplitude (V)
Amplitude (V)
45
25
20
15
-20
-25
-30
10
-35
5
-40
0
-45
Out Pin (ESD Strike Terminal)
Input Pin (Internal Terminal)
-50
-5
0
25
50
75
100 125 150
Time (nS)
175
200
225
250
0
25
50
75
100
125
150
175
200
225
250
Time (nS)
Figure 6-3. IEC Clamping Waveforms +8-kV
Contact
Figure 6-4. IEC Clamping Waveforms –8-kV
Contact
Figure 6-5. DC Characteristics (IIN vs VIN), TA =
25°C
Figure 6-6. C1 or C2 Capacitance vs VBIAS
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7 Detailed Description
7.1 Overview
The TPDxF202 family is a series of highly integrated devices designed to provide EMI filtering in all systems
subjected to electromagnetic interference. These filters also provide a Transient Voltage Suppressor (TVS) diode
circuit for ESD protection which prevents damage to the application when subjected to ESD stress far exceeding
IEC 61000-4-2 (Level 4).
7.2 Functional Block Diagram
7.3 Feature Description
The TPDxF202 family is a line of ESD and EMI filtering devices designed to reduce EMI emissions and provide
system level ESD protection. Each device can dissipate ESD strikes above the maximum level specified by IEC
61000-4-2 international standard. Additionally, the EMI filtering structure reduces EMI emissions by providing
high frequency roll-off.
7.3.1 Exceeds IEC61000-4-2 (Level 4) ESD Protection Requirements
The ESD protection on all pins exceeds the IEC 61000-4-2 level 4 standard. Contact and Air-Gap ESD are rated
at ±25 kV.
7.3.2 Pi-Style C-R-C Filter Configuration
This family of devices has a pi-style filtering configuration composed of a series resistor and two capacitors in
parallel with the I/O pins. The typical resistor value is 100 Ω and the typical capacitor values are 15 pF each.
Signal attenuation is above 40 dB at 1 GHz to 3 GHz, which provides significant reduction in spurious emissions,
with a bandwidth (3-dB loss) of 108 MHz. Crosstalk is attenuated 70 dB at 100 MHz.
7.3.3 Low 10-nA Leakage Current
The I/O pins feature an ultra-low leakage current of 10 nA (typical) with a bias of 3.3 V.
7.3.4 Space-Saving DSBGA Package
The DSBGA package is characterized by a minimal footprint for savings in board space, fitting the design
philosophy of portable devices.
7.3.4.1 Flow-Through Pin Mapping
The pinout of this device makes it easy to add protection to existing board layouts. The packages offer flowthrough routing which requires minimal changes to existing board layout for addition of these devices.
7.4 Device Functional Modes
The TPDxF202 family of devices are passive-integrated circuits that passively filter EMI and trigger when
voltages are above VBR or below the lower diode voltage (–0.6 V). During IEC 61000-4-2 ESD events, transient
voltages as high as ±25 kV can be directed to ground through the internal diode network. Once the voltages on
the protected line falls below the trigger levels, the device reverts to passive.
8
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8 Application and Implementation
Note
Information in the following applications sections is not part of the TI component specification,
and TI does not warrant its accuracy or completeness. TI’s customers are responsible for
determining suitability of components for their purposes, as well as validating and testing their design
implementation to confirm system functionality.
8.1 Application Information
The TPDxF202 family are diode-type TVSs integrated with series resistors and parallel capacitors for filtering
emitted EMI. As a signal passes through the device, higher frequency components are filtered out. This device
also provides a path to ground during ESD events and isolates the protected IC. As the current from ESD
passes through the TVS, only a small voltage drop is present across the diode. This is the voltage presented
to the protected IC. In particular, these filters are ideal for EMI filtering and protecting data lines from ESD at
display, keypad, and memory interfaces.
8.2 Typical Application
TPD6F202
R0
A1
R1
C1
R2
D1
R3
F1
F3
R4
G1
G3
R5
J1
A3
B2
C3
D3
E2
H2
J3
TPD6F202
G0
A1
G1
C1
G2
D1
G3
F1
F3
G4
G1
G3
G5
J1
A3
B2
C3
D3
E2
Connector
Display Panel Connector
GND
H2
TPD6F202
J3
GND
B0
A1
B1
C1
B2
D1
B3
F1
F3
B4
G1
G3
B5
J1
A3
B2
C3
D3
E2
H2
J3
GND
Figure 8-1. Display Panel Schematic
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8.2.1 Design Requirements
For this design example, three TPD6F202 devices are used in an 18-bit display panel application. This
application provides a complete ESD and EMI protection solution for the display connector. For the display
panel application, the following parameters are in shown Table 8-1.
Table 8-1. Design Parameters
DESIGN PARAMETER
VALUE
Signal range on all pins except GND
0 V to 5 V
Data Rate
200 Mbps
ESD Protection Level
IEC 61000-4-2 Level 4
8.2.2 Detailed Design Procedure
To begin the design process, some design parameters must be decided; the designer needs to know the
operating frequency and the signal range on all the protected lines.
8.2.2.1 Signal Range on All Protected Lines
The TPD6F202 has 6 identical protection channels for signal lines. All I/O pins will support a signal range from 0
to 5.5 V.
8.2.2.2 Data Rate
The TPD6F202 has a 108-MHz, –3-dB bandwidth, which supports the data rate for this display.
8.2.2.3 ESD Protection Level
The contact and air-gap ratings of ± 25 kV for TPD6F202 exceeds the IEC 61000-4-2 Level 4 rating of ± 8-kV
contact and ± 15-kV air-gap ratings.
8.2.3 Application Curve
Figure 8-2. Frequency Response Data (0-V Bias)
9 Power Supply Recommendations
The TPDxF202 device is a passive ESD-protection device, and therefore, does not require a power supply. Take
care to avoid violating the maximum-voltage specification to ensure that the device functions properly. The IO
lines can tolerate up to 6-V DC.
10
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10 Layout
10.1 Layout Guidelines
Typically, there are multiple EMI filters being used in portable applications to suppress the EMI interference.
This means the total board area consumed by EMI filters are relatively large. One example of space-saving
innovation is to place the EMI filters right under the connectors so that the main PCB space is not used. The
YFU packages of the TPDxF202 series offer ultra low-profile package height which enables such innovative
component placement in portable applications. Package under-fill is recommended while using the YFU
packages in flex boards.
•
•
•
The optimum placement is as close to the connector as possible.
– EMI during an ESD event can couple from the trace being struck to other nearby unprotected traces,
resulting in early system failures.
– The PCB designer needs to minimize the possibility of EMI coupling by keeping any unprotected traces
away from the protected traces which are between the TVS and the connector.
Route the protected traces as straight as possible.
Eliminate any sharp corners on the protected traces between the TVS and the connector by using rounded
corners with the largest radii possible.
– Electric fields tend to build up on corners, increasing EMI coupling.
For maximum efficiency of filtering and ESD protection, while doing the board layout, take care to reduce board
parasitic series inductances from package GND pins to board GND plane. The TPDxF202 devices must be
connected to a ground plane with a micro via adjacent to the device GND pad. If this is not possible, the
connection to the ground plane must be as direct as possible to minimize the inductance. Due to flow-through
pin mapping, the signal pins routing is easily achieved in a single layer.
10.2 Layout Example
TPD4F202
A1
TPD6F202
A3
A1
B2
A3
B2
C1
C3
C1
C3
D1
D3
D1
D3
E2
F1
E2
F3
Legend
F1
F3
G1
G3
H2
J1
VIA to Ground Plane
J3
PCB Trace
Figure 10-1. Board Layout With TPDxF202
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11 Device and Documentation Support
11.1 Documentation Support
11.1.1 Related Documentation
The following documents contain additional information related to the use of the TPDxF202 device:
•
•
Texas Instruments, ESD Protection Layout Guide application report
Texas Intruments, Reading and Understanding an ESD Protection Data Sheet application report
11.2 Related Links
The table below lists quick access links. Categories include technical documents, support and community
resources, tools and software, and quick access to sample or buy.
Table 11-1. Related Links
PARTS
PRODUCT FOLDER
SAMPLE & BUY
TECHNICAL
DOCUMENTS
TOOLS &
SOFTWARE
SUPPORT &
COMMUNITY
TPD4F202
Click here
Click here
Click here
Click here
Click here
TPD6F202
Click here
Click here
Click here
Click here
Click here
11.3 Support Resources
TI E2E™ support forums are an engineer's go-to source for fast, verified answers and design help — straight
from the experts. Search existing answers or ask your own question to get the quick design help you need.
Linked content is provided "AS IS" by the respective contributors. They do not constitute TI specifications and do
not necessarily reflect TI's views; see TI's Terms of Use.
11.4 Trademarks
TI E2E™ is a trademark of Texas Instruments.
All trademarks are the property of their respective owners.
11.5 Electrostatic Discharge Caution
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled
with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may
be more susceptible to damage because very small parametric changes could cause the device not to meet its published
specifications.
11.6 Glossary
TI Glossary
This glossary lists and explains terms, acronyms, and definitions.
12 Mechanical, Packaging, and Orderable Information
The following pages include mechanical, packaging, and orderable information. This information is the most
current data available for the designated devices. This data is subject to change without notice and revision of
this document. For browser-based versions of this data sheet, refer to the left-hand navigation.
12
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PACKAGE OPTION ADDENDUM
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13-May-2021
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
(2)
Lead finish/
Ball material
MSL Peak Temp
Op Temp (°C)
Device Marking
(3)
(4/5)
(6)
TPD4F202YFUR
ACTIVE
DSBGA
YFU
10
3000
RoHS & Green
SNAGCU
Level-1-260C-UNLIM
-40 to 85
57S
TPD6F202YFUR
ACTIVE
DSBGA
YFU
15
3000
RoHS & Green
SNAGCU
Level-1-260C-UNLIM
-40 to 85
5WS
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of
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