TPIC71004TDCARQ1

TPIC71004-Q1 SLVSAT2 – FEBRUARY 2011 www.ti.com Quad-Channel Driver for Airbag Deployment Check for Samples: TPIC71004-Q1 FEATURES 1 • 2 • • • • • • • • • • • • • • • • Quad-Channel Squib Drivers for Airbag Application Loop Diagnostics Monitor and Reporting Two Logic Inputs Providing Independent Safety Logic for Enabling/Disabling Deployment Four Independent Thermally Protected High-Side Drivers That can Source Deployment or Diagnostic Current Level to Each Squib Load Four Independent Avalanche Voltage and Thermally Protected Low-Side Drivers That Can Sink Deployment or Diagnostic Current Level From Each Squib Load Each Output Capable of 1.2 A/1.75 A Firing Current for Typical 2 ms/0.5 ms SPI Slave Interface for Serial Bus Communication with Parity Check Firing VZx Voltage Range 10 V to 35 V, Transients up to 40 V Programmable Firing Time up to 8.2 ms Common Load Current Settings for All Deployment Loops, Using Registers Individual Firing Current Timer Limit Set for Each Deployment Loop, Using Registers Firing Current Timer to Monitor Firing Current Over Deployment Time for Each Deployment Loop Independent Switch Control for Both High- and Low-Side Switches Diagnostic Mode for Fault Checking Internal Fault Monitoring for Safe Operation A Multiplex-able Output Buffer for Analog Voltage Measurements Use of External Clamping devices on Squib Pins is Not Required to Protect the Deployment ASIC Against Substrate Injection Effects During Deployment Due to Dynamic Shorts to Ground • • • • An External Pin Connection to the Microprocessor ADC Supply for Ratio-metric Squib Resistance Measurement 40-V Pin Capability on All Pins (Except GNDx, AGND, DGND, VCC5, VDDIO, AMX_OUT) Operating Ambient Temperature Range: –40°C to 105°C Thermally Enhanced 48-Pin TSSOP DCA PowerPad™ Package APPLICATIONS • Squib Drivers for Airbag Application NC 1 48 NC NC 2 47 NC VZ0 3 46 VZ3 Z0 4 45 Z3 ZM0 5 44 ZM3 GND0 6 43 GND3 TEST 7 42 DGND2 VCC5 8 41 SOMI IWD 9 AMX_OUT 10 DIAG SPI/ Digital 40 SIMO 39 SCLK DGND1 11 38 CS_N AGND1 12 37 TZ0 SQREF1 13 SQREF2 14 VADC 15 TEST2 16 VA2 17 TEST3 18 GND1 19 ZM1 20 Z1 21 BIAS 36 RESET_N 35 VDDIO 34 AGND 33 VA1 32 TEST4 31 NC 30 GND2 29 ZM2 28 Z2 VZ1 22 27 VZ2 NC 23 26 NC NC 24 25 NC 1 2 Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. PowerPad is a trademark of Texas Instruments. PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. © 2011, Texas Instruments Incorporated TPIC71004-Q1 SLVSAT2 – FEBRUARY 2011 www.ti.com DESCRIPTION The TPIC71004-Q1 is a quad channel squib driver for airbags deployment in automotive applications. Each channel consists of a high side and a low side switch with independent control logic for protection against inadvertent deployment. Both the high and the low side switches have internal current limits, over-temperature protection. The IC registers are used for four channel configuration, control and status monitoring. To prevent inadvertent deployment, the high and the low side switches will be turned on only if the proper configuration sequence is used and multiple inputs to the deploy controller logic are at the correct level. The registers are programmed using a serial communications interface. The maximum on time for each channel is limited by programmable Firing Time Out Timer to prevent excessive power dissipation. In addition, a current limit register is used to program the maximum current through the switches during a deployment. The current limitation on the low side switch is larger than the corresponding high side switch. During deployment, the low side switch will be full enhanced and operate with RDS_ON mode and the high side switch will be in current regulation mode. The implemented diagnostic functions monitor deployment ASIC pin voltages to provide High Side switch test, Low Side switch test, squib resistance measurements, squib leakage measurement to battery, ground and between any squib channels. Furthermore, the squib leakage measurement is provided for both Zx and ZMx pins and does not require the squib load to be present to operate properly. Diagnostic information is communicated through the AMX_OUT pin (for analog signals) and SPI mapped status registers (for status signals latched in digital core). The high-side and low-side squib drivers have a diagnostic level current limit and a deployment level current limit. The default current limit for high-side and low-side squib drivers is the diagnostic level current limit. The high-side switch deployment current limit for all high-side drivers can be set to either 1.2 A min or 1.75 A min (see Table 1) through SPI mapped registers, device EEPROM settings (see Table 2). The low-side switch deployment current limit is not programmable and is fixed to a level greater than the high-side driver current limit. The ON time duration for each individual squib driver can be programmed through SPI mapped registers. The deployment sequence requires a specific set of software commands combined with external hardware enable logic lines (TZ0=H, IWD=L) to provide deployment capability. The turn-on sequence of the high-side driver and low-side drivers is software controlled via SPI commands, but the turn-off procedure is automatically provided by the deployment ASIC. After the programmed ON time duration has been achieved, the high-side switch is deactivated first then followed by the low-side driver deactivation by approximately 100µsec. The RESET_N is an active low input reset signal. This input will be released high by the power supply unit and/or the µC once the external voltage supplies are within the specified limits. The external microcontroller is required to configure and control device through the serial communication interface. Reliable software is critical for the system operation. Table 1. Potential Deployment Settings for Typical Firing Current FIRING VOLTAGE MAXIMUM AVERAGE FIRING VOLTAGE BETWEEN VZx AND Zx PINS TO ACHIEVE DEPLOYMENT 35 V 32.56 V 1.2 A 2 ms 35 V 35.0 V 1.75 A 0.5 ms (1) TYPICAL FIRING CURRENT DWELL (FIRING) TIME (1) For programming desired dwell (firing) time. Extended deployment duration activates the over temperature protection circuit and terminates deployment. If short-to-ground condition occurs during deployment, 35V firing voltage is completely dropped across the HS_FET: therefore, thermal shut down protection kicks in to protect the device. 2 Submit Documentation Feedback © 2011, Texas Instruments Incorporated Product Folder Link(s): TPIC71004-Q1 TPIC71004-Q1 SLVSAT2 – FEBRUARY 2011 www.ti.com Table 2. Potential Deployment Settings for Maximum Firing Current FIRING VOLTAGE MAXIMUM AVERAGE FIRING VOLTAGE BETWEEN VZx AND Zx PINS TO ACHIEVE DEPLOYMENT MAX FIRING CURRENT (1) DWELL (FIRING) TIME (2) 35 V 30 V 2.6 A (for 1.75 A current setting) 0.7 ms 35 V 31 V 2.0 A (for 1.2 A current setting) 2.0 ms (1) (2) The max firing current levels are set through device EEPROM setting For programming desired dwell (firing) time For the full version of this document, please contact msamktg@list.ti.com . ORDERING INFORMATION –40°C to 125°C ORDERABLE PART NUMBER PACKAGE (1) TA HTSSOP – DCA Tape and reel TPIC71004TDCAQ1 TOP-SIDE MARKING TPIC71004 TPIC71004TDCARQ1 (1) “Pb-Free” is defined to be compliant with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials unless exempt. Where designed to be soldered at high temperatures, TI "Pb-Free" and "RoHS Compliant" products are suitable for use in specified lead-free processes. 48 NC NC 2 VZ0 3 47 NC 46 VZ3 Z0 4 ZM0 5 45 Z3 44 ZM3 GND0 6 43 GND3 TEST 7 VCC5 8 42 DGND2 AGND1 12 SQREF1 13 SQREF2 14 VADC 15 squib squib 41 SOMI IWD 9 AMX_OUT 10 DGND1 11 VA1 to mC squib NC 1 VDDIO VCC5 VA2 Functional Block Diagram DIAG SPI/ Digital 40 SIMO 39 SCLK 38 CS_N 37 TZ0 BIAS 36 RESET_N 35 VDDIO 34 AGND TEST2 16 VA2 17 33 VA1 TEST3 18 GND1 19 31 NC 32 TEST4 30 GND2 ZM1 20 Z1 21 29 ZM2 VZ1 22 27 VZ2 NC 23 26 NC NC 24 25 NC 28 Z2 squib Submit Documentation Feedback © 2011, Texas Instruments Incorporated Product Folder Link(s): TPIC71004-Q1 3 PACKAGE OPTION ADDENDUM www.ti.com 10-Dec-2020 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan (2) Lead finish/ Ball material MSL Peak Temp Op Temp (°C) (3) Device Marking (4/5) (6) TPIC71004TDCARQ1 ACTIVE HTSSOP DCA 48 2000 RoHS & Green NIPDAU Level-3-260C-168 HR -40 to 105 TPIC71004T (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may reference these types of products as "Pb-Free". RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption. Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of