TPL1401
SNAS806 – SEPTEMBER 2020
TPL1401 256-Tap, High-Accuracy, Digital Potentiometer With Buffered Wiper
1 Features
3 Description
•
The TPL1401 is a digital potentiometer (digipot)
with a buffered wiper. Unlike standard digipots, this
device offers higher load regulation in voltage-divider
applications as a result of the integrated buffered
wiper.
•
•
•
•
•
•
•
•
•
•
•
256-position digital potentiometer for voltagedivider applications
1 LSB INL and DNL
Wide operating range
– Power supply: 1.8 V to 5.5 V
– Temperature range: –40°C to +125°C
Buffered wiper for improved load regulation
FB pin for precision current sink applications
Wiper lock function to protect from accidental
writes to the digital potentiometer
I2C interface
– Standard, fast, and fast plus modes
– 1.62-V VIH with VDD = 5.5 V
User-programmable nonvolatile memory
(NVM/EEPROM)
– Save and recall all register settings
Internal reference
Very low power: 0.2 mA at 1.8 V
Flexible startup: High impedance or 10K-GND
Tiny package: 8-pin WSON (2 mm × 2 mm)
2 Applications
•
•
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Exit and emergency lighting
Barcode scanner
Barcode reader
Smart speaker
Video doorbell
Cordless vacuum cleaner
Robotic lawn mower
Laser distance meter
The TPL1401 makes in-factory calibration and
trimming easier with integrated nonvolatile memory
(NVM), and a simple I2C digital interface to
communicate with the device. This device supports
I2C standard mode (100 kbps), fast mode (400 kbps),
and fast mode plus (1 Mbps).
The TPL1401 operates with either the internal
reference or with the power supply as the reference,
and provides a full-scale output of 1.8 V to 5.5 V. This
device also includes a wiper lock feature, a feedback
(FB) pin for current-sink applications, and two bytes
of user-programmable NVM space. The TPL1401 has
a power-on-reset (POR) circuit that makes sure all
the registers start with default or user-programmed
settings using NVM. The digipot output powers on in
high-impedance mode (default); this setting can be
programmed to 10kΩ-GND using NVM.
The TPL1401 is tiny, feature rich, and an easy-to-use
building block device that can be integrated into many
applications.
The TPL1401 operates within the temperature range
of –40°C to +125°C.
Device Information(1)
PART NUMBER
TPL1401
(1)
Functional Block Diagram
PACKAGE
WSON (8)
BODY SIZE (NOM)
2.00 mm × 2.00 mm
For all available packages, refer to the package option
addendum at the end of the data sheet.
Programmable Current Limit With TPL1401
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.
TPL1401
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Table of Contents
1 Features............................................................................1
2 Applications..................................................................... 1
3 Description.......................................................................1
4 Revision History.............................................................. 2
5 Pin Configuration and Functions...................................3
6 Specifications.................................................................. 4
6.1 Absolute Maximum Ratings ....................................... 4
6.2 ESD Ratings .............................................................. 4
6.3 Recommended Operating Conditions ........................4
6.4 Thermal Information ...................................................4
6.5 Electrical Characteristics ............................................5
6.6 Timing Requirements: I2C Standard Mode ................ 7
6.7 Timing Requirements: I2C Fast Mode ........................7
6.8 Timing Requirements: I2C Fast Mode Plus ................7
6.9 Typical Characteristics: VDD = 1.8 V (Reference
= VDD) or VDD = 2 V (Internal Reference)......................8
6.10 Typical Characteristics: VDD = 5.5 V (Reference
= VDD) or VDD = 5 V (Internal Reference)....................10
6.11 Typical Characteristics............................................ 12
7 Detailed Description......................................................17
7.1 Overview................................................................... 17
7.2 Functional Block Diagram......................................... 17
7.3 Feature Description...................................................18
7.4 Device Functional Modes..........................................21
7.5 Programming............................................................ 22
7.6 Register Map.............................................................26
8 Application and Implementation.................................. 30
8.1 Application Information............................................. 30
8.2 Typical Application.................................................... 30
9 Power Supply Recommendations................................32
10 Layout...........................................................................32
10.1 Layout Guidelines................................................... 32
10.2 Layout Example...................................................... 32
11 Device and Documentation Support..........................33
11.1 Documentation Support.......................................... 33
11.2 Receiving Notification of Documentation Updates.. 33
11.3 Support Resources................................................. 33
11.4 Trademarks............................................................. 33
11.5 Electrostatic Discharge Caution.............................. 33
11.6 Glossary.................................................................. 33
12 Mechanical, Packaging, and Orderable
Information.................................................................... 33
4 Revision History
2
DATE
REVISION
NOTES
September 2020
*
Initial release.
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5 Pin Configuration and Functions
A0
1
8
OUT
SCL
2
7
FB
SDA
3
6
VDD
CAP
4
5
AGND
Not to scale
Figure 5-1. DSG Package, 8-Pin WSON, Top View
Pin Functions
PIN
NAME
NO.
TYPE
DESCRIPTION
A0
1
Input
AGND
5
Ground
Four-state address input
CAP
4
Input
External capacitor for the internal LDO. Connect a capacitor (around 1.5 µF) between CAP and
AGND.
FB
7
Input
Voltage feedback pin
OUT
8
Output
SCL
2
Input
SDA
3
Input/output
VDD
6
Power or
reference
input
Ground reference point for all circuitry on the device
Analog output voltage from digipot buffer
Serial interface clock. This pin must be connected to the supply voltage with an external pullup
resistor.
Data are clocked into or out of the input register. This pin is a bidirectional, and must be connected to
the supply voltage with an external pullup resistor.
Analog supply voltage: 1.8 V to 5.5 V
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6 Specifications
6.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted)(1)
MIN
VDD
MAX
UNIT
Supply voltage / reference, VDD to AGND
–0.3
6
V
Digital input(s) to AGND
–0.3
VDD + 0.3
V
CAP to AGND
–0.3
1.65
V
VFB to AGND
–0.3
VDD + 0.3
V
VOUT to AGND
–0.3
VDD + 0.3
Current into any pin
–10
10
mA
TJ
Junction temperature
–40
150
°C
Tstg
Storage temperature
–65
150
°C
(1)
V
Stresses beyond those listed under Absolute Maximum Rating may cause permanent damage to the device. These are stress
ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated
under Recommended Operating Condition. Exposure to absolute-maximum-rated conditions for extended periods may affect device
reliability.
6.2 ESD Ratings
VALUE
V(ESD)
(1)
(2)
Electrostatic
discharge
Human body model (HBM), per ANSI/ESDA/JEDEC JS-001, all pins(1)
±2000
Charged device model (CDM), per JEDEC specification JESD22-C101,
pins 1, 4, 5, 8(2)
±750
Charged device model (CDM), per JEDEC specification JESD22-C101,
pins 2, 3, 6, 7(2)
±500
UNIT
V
JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
6.3 Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted)
MIN
VDD
Positive supply voltage to ground (AGND)
1.71
VIH
Digital input high voltage, 1.7 V < VDD ≤ 5.5 V
1.62
VIL
Digital input low voltage
TA
Ambient temperature
NOM
MAX UNIT
5.5
V
V
–40
0.4
V
125
°C
6.4 Thermal Information
TPL1401
THERMAL
METRIC(1)
DSG (WSON)
UNIT
8 PINS
RθJA
Junction-to-ambient thermal resistance
49
°C/W
RθJC(top)
Junction-to-case (top) thermal resistance
50
°C/W
RθJB
Junction-to-board thermal resistance
24.1
°C/W
ΨJT
Junction-to-top characterization parameter
1.1
°C/W
ΨJB
Junction-to-board characterization parameter
24.1
°C/W
RθJC(bot)
Junction-to-case (bottom) thermal resistance
8.7
°C/W
(1)
4
For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report.
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6.5 Electrical Characteristics
all minimum/maximum specifications at TA = –40°C to +125°C and typical specifications at TA = 25°C, 1.8 V ≤ VDD ≤ 5.5 V,
reference tied to VDD, gain = 1x, digipot output pin (OUT) loaded with resistive load (RL = 5 kΩ to AGND) and capacitive load
(CL = 200 pF to AGND), and digital inputs at VDD or AGND (unless otherwise noted)
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
STATIC PERFORMANCE
Resolution
INL
Relative
8
accuracy(1)
DNL Differential nonlinearity(1)
Zero code error
–1
1
LSB
–1
1
LSB
Code 0d into digipot
6
12
Internal VREF, gain = 4x, VDD = 5.5 V
6
15
Zero code error temperature
coefficient
±10
Offset error
VREF tied to VDD, measured between end-point codes
2d and 254d, output unloaded
Offset error temperature
coefficient
VREF tied to VDD, measured between end-point codes
2d and 254d, output unloaded
Gain error
VREF tied to VDD, measured between end-point codes
2d and 254d, output unloaded
Gain error temperature
coefficient
VREF tied to VDD, measured between end-point codes
2d and 254d, output unloaded
Full scale error
Bits
–0.5
0.25
µV/°C
0.5
±0.0003
–0.5
0.25
mV
%FSR
%FSR/°C
0.5
±0.0008
%FSR
%FSR/°C
1.8 V ≤ VDD < 2.7 V, code 511d into digipot,
no headroom
–1
0.5
1
2.7 V ≤ VDD ≤ 5.5 V, code 511d into digipot,
no headroom
–0.5
0.25
0.5
%FSR
Full scale error temperature
coefficient
±0.0008
%FSR/°C
OUTPUT CHARACTERISTICS
Output voltage
CL
Capacitive load(2)
Load regulation
Short circuit current
Output voltage headroom(1)
Reference tied to VDD
1
RL = 5 kΩ, phase margin = 30°
2
Digipot at midscale, –10 mA ≤ IOUT ≤ 10 mA,
VDD = 5.5 V
0.4
VDD = 1.8 V, full-scale output shorted to AGND or
zero-scale output shorted to VDD
10
VDD = 2.7 V, full-scale output shorted to AGND or
zero-scale output shorted to VDD
25
VDD = 5.5 V, full-scale output shorted to AGND or
zero-scale output shorted to VDD
50
To VDD (digipot output unloaded, internal reference =
1.21 V), VDD ≥ 1.21 ☓ gain + 0.2 V
0.2
To VDD (digipot output unloaded)
0.8
0.25
Digipot output enabled and digipot code = 2d
0.25
Digipot output enabled
VOUT + VFB dc output
leakage(2)
At start up, measured when digipot output is disabled
and held at VDD / 2 for VDD = 5.5 V
Power supply rejection ratio
(dc)
Internal VREF, gain = 2x, digipot at midscale;
VDD = 5 V ±10%
nF
mA
V
%FSR
Digipot output enabled and digipot code = midscale
VFB dc output impedance(3)
V
mV/mA
10
Digipot output enabled and digipot code = 254d
ZO
5.5
RL = Infinite, phase margin = 30°
To VDD (ILOAD = 10 mA at VDD = 5.5 V, ILOAD = 3 mA at
VDD = 2.7 V, ILOAD = 1 mA at VDD = 1.8 V), digipot code
= full scale
VOUT dc output impedance
0
Ω
0.26
160
200
0.25
240
kΩ
5
nA
mV/V
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6.5 Electrical Characteristics (continued)
all minimum/maximum specifications at TA = –40°C to +125°C and typical specifications at TA = 25°C, 1.8 V ≤ VDD ≤ 5.5 V,
reference tied to VDD, gain = 1x, digipot output pin (OUT) loaded with resistive load (RL = 5 kΩ to AGND) and capacitive load
(CL = 200 pF to AGND), and digital inputs at VDD or AGND (unless otherwise noted)
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
DYNAMIC PERFORMANCE
tsett
Output voltage settling time
8
1/4 to 3/4 scale and 3/4 to 1/4 scale settling to
10%FSR, VDD = 5.5 V, internal VREF, gain = 4x
12
Slew rate
VDD = 5.5 V
Power on glitch magnitude
At start up (buffer output disabled), RL = 5 kΩ,
CL = 200 pF
Output enable glitch
magnitude
Vn
1/4 to 3/4 scale and 3/4 to 1/4 scale settling to
10%FSR, VDD = 5.5 V
µs
1
V/µs
75
At start up (buffer output disabled), RL = 100 kΩ
200
Buffer output disabled to enabled (digipot registers at
zero scale, RL = 100 kΩ
250
mV
mV
0.1 Hz to 10 Hz, digipot at midscale, VDD = 5.5 V
34
Internal VREF, gain = 4x, 0.1 Hz to 10 Hz, digipot at
midscale, VDD = 5.5 V
70
Measured at 1 kHz, digipot at midscale, VDD = 5.5 V
0.2
Internal VREF, gain = 4x, measured at 1 kHz, digipot at
midscale, VDD = 5.5 V
0.7
Power supply rejection ratio
(ac)(3)
Internal VREF, gain = 4x, 200-mV 50 or 60 Hz sine
wave superimposed on power supply voltage, digipot
at midscale
–71
dB
Code change glitch impulse
±1 LSB change around mid code (including
feedthrough)
10
nV-s
Code change glitch impulse
magnitude
±1 LSB change around mid code (including
feedthrough)
15
mV
Output noise voltage (peak to
peak)
Output noise density
µVPP
µV/√Hz
VOLTAGE REFERENCE
Initial accuracy
TA = 25°C
1.212
Reference output temperature
coefficient(2)
V
50
ppm/°C
EEPROM
Endurance
Data retention(2)
–40°C ≤ TA ≤ 85°C
20000
TA > 85°C
1000
TA = 25°C
50
EEPROM programming write
cycle time(2)
10
Cycles
Years
20
ms
DIGITAL INPUTS
Digital feedthrough
Digipot output static at midscale, fast mode plus, SCL
toggling
20
nV-s
Pin capacitance
Per pin
10
pF
POWER
Load capacitor - CAP pin(2)
IDD
(1)
(2)
(3)
6
Current flowing into VDD
0.5
Normal mode, digipot at full scale, digital pins static
0.5
Digipot power-down, internal reference power down
80
15
µF
0.8
mA
µA
Measured with digipot output unloaded. For external reference between end-point codes 2d and 254d. For internal reference VDD ≥
1.21 x gain + 0.2 V, between end-point codes 2d and 254d.
Specified by design and characterization, not production tested.
Specified with 200-mV headroom with respect to reference value when internal reference is used.
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6.6 Timing Requirements: I2C Standard Mode
all input signals are timed from VIL to 70% of VDD, 1.8 V ≤ VDD ≤ 5.5 V, –40°C ≤ TA ≤ +125°C, and
1.8 V ≤ Vpull-up ≤ VDD (unless otherwise specified)
MIN
fSCLK
SCL frequency
tBUF
Bus free time between stop and start conditions
tHDSTA
Hold time after repeated start
tSUSTA
tSUSTO
NOM
MAX
UNIT
0.1
MHz
4.7
µs
4
µs
Repeated start setup time
4.7
µs
Stop condition setup time
4
µs
tHDDAT
Data hold time
0
ns
tSUDAT
Data setup time
250
ns
tLOW
SCL clock low period
4700
ns
tHIGH
SCL clock high period
4000
tF
Clock and data fall time
300
ns
tR
Clock and data rise time
1000
ns
MAX
UNIT
0.4
MHz
ns
6.7 Timing Requirements: I2C Fast Mode
all input signals are timed from VIL to 70% of VDD, 1.8 V ≤ VDD ≤ 5.5 V, –40°C ≤ TA ≤ +125°C, and
1.8 V ≤ Vpull-up ≤ VDD (unless otherwise specified)
MIN
NOM
fSCLK
SCL frequency
tBUF
Bus free time between stop and start conditions
1.3
µs
tHDSTA
Hold time after repeated start
0.6
µs
tSUSTA
Repeated start setup time
0.6
µs
tSUSTO
Stop condition setup time
0.6
µs
tHDDAT
Data hold time
0
ns
tSUDAT
Data setup time
100
ns
tLOW
SCL clock low period
1300
ns
tHIGH
SCL clock high period
600
tF
Clock and data fall time
300
ns
tR
Clock and data rise time
300
ns
MAX
UNIT
1
MHz
ns
6.8 Timing Requirements: I2C Fast Mode Plus
all input signals are timed from VIL to 70% of VDD, 1.8 V ≤ VDD ≤ 5.5 V, –40°C ≤ TA ≤ +125°C, and
1.8 V ≤ Vpull-up ≤ VDD (unless otherwise specified)
MIN
fSCLK
SCL frequency
tBUF
Bus free time between stop and start conditions
tHDSTA
tSUSTA
NOM
0.5
µs
Hold time after repeated start
0.26
µs
Repeated start setup time
0.26
µs
tSUSTO
Stop condition setup time
0.26
µs
tHDDAT
Data hold time
0
ns
tSUDAT
Data setup time
50
ns
tLOW
SCL clock low period
0.5
µs
tHIGH
SCL clock high period
0.26
tF
Clock and data fall time
120
ns
tR
Clock and data rise time
120
ns
µs
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6.9 Typical Characteristics: VDD = 1.8 V (Reference = VDD) or VDD = 2 V (Internal Reference)
at TA = 25°C and digipot outputs unloaded (unless otherwise noted)
Figure 6-1. Integral Linearity Error vs Digital Input Code
Figure 6-2. Differential Linearity Error vs Digital Input Code
Figure 6-3. Total Unadjusted Error vs Digital Input Code
Figure 6-4. Integral Linearity Error vs Temperature
1
Total Unadjusted Error (%FSR)
0.8
0.6
0.4
0.2
0
-0.2
-0.4
TUE max, reference = VDD, gain = 1x
TUE min, reference = VDD, gain = 1x
TUE max, internal reference, gain = 1.5x
TUE min, internal reference, gain = 1.5x
-0.6
-0.8
-1
-40 -25 -10
Figure 6-5. Differential Linearity Error vs Temperature
8
5
20 35 50 65
Temperature (°C)
80
95
110 125
Figure 6-6. Total Unadjusted Error vs Temperature
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6.9 Typical Characteristics: VDD = 1.8 V (Reference = VDD) or VDD = 2 V (Internal Reference)
(continued)
at TA = 25°C and digipot outputs unloaded (unless otherwise noted)
0.5
8
0.3
6
Offset Error (%FSR)
Zero Code Error (mV)
7
5
4
3
2
0.1
-0.1
-0.3
1
0
-40
-25
-10
5
20 35 50 65
Temperature (°C)
80
95
-0.5
-40 -25 -10
110 125
Reference = VDD
20 35 50 65
Temperature (qC)
80
95
110 125
Reference = VDD
Figure 6-7. Zero Code Error vs Temperature
Figure 6-8. Offset Error vs Temperature
0.5
0.5
Reference = VDD, gain = 1x
Internal reference, gain = 1.5x
0.4
Full Scale Error (%FSR)
0.3
Gain Error (%FSR)
5
0.1
-0.1
-0.3
0.3
0.2
0.1
0
-0.1
-0.2
-0.3
Reference = VDD, gain = 1x
Internal reference, gain = 1.5x
-0.4
-0.5
-40 -25 -10
5
20 35 50 65
Temperature (qC)
80
95
Figure 6-9. Gain Error vs Temperature
110 125
-0.5
-40 -25 -10
5
20 35 50 65
Temperature (qC)
80
95
110 125
Figure 6-10. Full-Scale Error vs Temperature
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6.10 Typical Characteristics: VDD = 5.5 V (Reference = VDD) or VDD = 5 V (Internal Reference)
at TA = 25°C and digipot outputs unloaded (unless otherwise noted)
Figure 6-11. Integral Linearity Error vs Digital Input Code
Figure 6-12. Differential Linearity Error vs Digital Input Code
Figure 6-13. Total Unadjusted Error vs Digital Input Code
Figure 6-14. Integral Linearity Error vs Temperature
0.5
TUE max, reference = VDD, gain = 1x
TUE min, reference = VDD, gain = 1x
TUE max, internal reference, gain = 4x
TUE min, internal reference, gain = 4x
Total Unadjusted Error (%FSR)
0.4
0.3
0.2
0.1
0
-0.1
-0.2
-0.3
-0.4
-0.5
-40 -25 -10
Figure 6-15. Differential Linearity Error vs Temperature
10
5
20 35 50 65
Temperature (°C)
80
95
110 125
Figure 6-16. Total Unadjusted Error vs Temperature
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6.10 Typical Characteristics: VDD = 5.5 V (Reference = VDD) or VDD = 5 V (Internal Reference)
(continued)
at TA = 25°C and digipot outputs unloaded (unless otherwise noted)
2
0.5
0.3
1
Offset Error (%FSR)
Zero Code Error (mV)
1.5
0.5
0
-0.5
-1
0.1
-0.1
-0.3
-1.5
-2
-40 -25 -10
5
20 35 50 65
Temperature (°C)
80
95
-0.5
-40 -25 -10
110 125
Reference = VDD
5
80
95
110 125
Reference = VDD
Figure 6-17. Zero Code Error vs Temperature
Figure 6-18. Offset Error vs Temperature
0.5
0.5
Reference = VDD, gain = 1x
Internal reference, gain = 4x
Reference = VDD, gain 1x
Internal reference, gain 4x
Full Scale Error (%FSR)
0.3
Gain Error (%FSR)
20 35 50 65
Temperature (qC)
0.1
-0.1
-0.3
-0.5
-40 -25 -10
5
20 35 50 65
Temperature (qC)
80
95
Figure 6-19. Gain Error vs Temperature
110 125
0.3
0.1
-0.1
-0.3
-0.5
-40 -25 -10
5
20 35 50 65
Temperature (qC)
80
95
110 125
Figure 6-20. Full-Scale Error vs Temperature
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6.11 Typical Characteristics
at TA = 25°C and digipot outputs unloaded (unless otherwise noted)
Reference = VDD
Reference = VDD
Figure 6-21. Integral Linearity Error
vs Supply Voltage
Figure 6-22. Differential Linearity Error
vs Supply Voltage
Reference = VDD
Reference = VDD
Figure 6-23. Total Unadjusted Error
vs Supply Voltage
Figure 6-24. Zero-Code Error
vs Supply Voltage
Reference = VDD
Reference = VDD
Figure 6-25. Offset Error vs Supply Voltage
12
Figure 6-26. Gain Error vs Supply Voltage
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6.11 Typical Characteristics (continued)
at TA = 25°C and digipot outputs unloaded (unless otherwise noted)
VDD = 1.8 V
Reference = VDD
Figure 6-28. Supply Current vs Digital Input Code
Figure 6-27. Full-Scale Error vs Supply Voltage
0.4
IDD, VDD = 1.8 V
IDD, VDD = 3.3 V
IDD, VDD = 5.5 V
Supply Current (mA)
0.35
0.3
0.25
0.2
0.15
0.1
0.05
0
-40 -25 -10
VDD = 5.5 V
5
20 35 50 65
Temperature (°C)
80
95
110 125
Reference = VDD, digipot at midscale
Figure 6-29. Supply Current vs Digital Input Code
Figure 6-30. Supply Current vs Temperature
0.4
IDD, VDD = 3.3 V
IDD, VDD = 5.5 V
Supply Current (mA)
0.35
0.3
0.25
0.2
0.15
0.1
0.05
0
-40 -25 -10
5
20 35 50 65
Temperature (°C)
80
95
Internal reference (gain = 4x), digipot at midscale
Figure 6-31. Supply Current vs Temperature
110 125
Digipot at midscale
Figure 6-32. Supply Current vs Supply Voltage
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6.11 Typical Characteristics (continued)
0.1
6
0.0875
5
0.075
4
Output Voltage (V)
Supply Current (mA)
at TA = 25°C and digipot outputs unloaded (unless otherwise noted)
0.0625
0.05
0.0375
0.025
IDD, VDD = 1.8 V
IDD, VDD = 3.3 V
IDD, VDD = 5.5 V
0.0125
0
-40 -25 -10
5
20 35 50 65
Temperature (°C)
80
95
110 125
3
2
1
0
-1
Reference = VDD = 1.8 V
Reference = VDD = 5.5 V
-2
-20
-15
Reference = VDD, digipot powered down
Figure 6-33. Power-Down Current vs Temperature
Reference = VDD = 5.5 V, digipot code transition from
midscale to midscale + 1 LSB, digipot load = 5 kΩ || 200 pF
Figure 6-35. Glitch Impulse, Rising Edge,
1-LSB Step
Reference = VDD = 5.5 V, digipot load = 5 kΩ || 200 pF
Figure 6-37. Full-Scale Settling Time, Rising Edge
14
-10
-5
0
5
Load Current (mA)
10
15
20
Figure 6-34. Source and Sink Capability
Reference = VDD = 5.5 V, digipot code transition from
midscale to midscale – 1 LSB, digipot load = 5 kΩ || 200 pF
Figure 6-36. Glitch Impulse, Falling Edge,
1-LSB Step
Reference = VDD = 5.5 V, digipot load = 5 kΩ || 200 pF
Figure 6-38. Full-Scale Settling Time, Falling Edge
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6.11 Typical Characteristics (continued)
at TA = 25°C and digipot outputs unloaded (unless otherwise noted)
Reference = VDD = 5.5 V
Reference = VDD = 5.5 V
Figure 6-39. Power-on Glitch
Figure 6-40. Power-off Glitch
-40
-50
PSRR (dB)
-60
-70
-80
-90
-100
10
Reference = VDD = 5.5 V, fast mode plus, digipot at midscale,
digipot load = 5 kΩ || 200 pF
20 30 50 70100
200
500 1000 2000
Frequency (Hz)
5000 10000
Internal reference (gain = 4x), VDD = 5.25 V + 0.25 VPP,
digipot at midscale, digipot load = 5 kΩ || 200 pF
Figure 6-42. Output AC PSRR vs Frequency
Figure 6-41. Clock Feedthrough
Reference = VDD = 5.5 V
Internal reference (gain = 4x), VDD = 5.5 V
Figure 6-43. Output Noise Spectral Density
Figure 6-44. Output Noise Spectral Density
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6.11 Typical Characteristics (continued)
at TA = 25°C and digipot outputs unloaded (unless otherwise noted)
Reference = VDD = 5.5 V, digipot at midscale
Internal reference (gain = 4x), VDD = 5.5 V, digipot at midscale
Figure 6-45. Digipot Output Noise: 0.1 Hz to 10 Hz
16
Figure 6-46. Digipot Output Noise: 0.1 Hz to 10 Hz
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7 Detailed Description
7.1 Overview
The TPL1401 is a digital potentiometer with buffered wiper. The buffered wiper helps achieve a higher load
regulation as compared to standard digital potentiometers used in voltage-divider applications. This digipot
contains nonvolatile memory (NVM) and an I2C interface. This makes the TPL1401 easy to use for factory
trimming and calibration device in analog set-point applications. The TPL1401 operates with either the internal
reference or the power supply as the reference, and provides a full-scale output of 1.8 V to 5.5 V.
The TPL1401 communicates through an I2C interface. This device supports I2C standard mode (100 kbps), fast
mode (400 kbps), and fast mode plus (1 Mbps). This device also includes a wiper lock feature, an FB pin for
current sink application, and 2 bytes of user-programmable NVM space.
The TPL1401 has a power-on-reset (POR) circuit that makes sure all the registers start with default or userprogrammed settings using NVM. The digipot output powers on in high-impedance mode (default); this setting
can be programmed to 10kΩ-GND using NVM.
7.2 Functional Block Diagram
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7.3 Feature Description
7.3.1 Digital Potentiometer (Digipot) Architecture
The TPL1401 consists of string architecture with an output buffer amplifier. Section 7.2 shows the digipot
architecture within the block diagram. This digipot architecture operates from a 1.8-V to 5.5-V power supply. This
device consume only 0.2 mA of current when using a 1.8-V power supply. The digipot output gets loaded from
the NVM at power up. Write the required code so that the load circuit starts with a predictable operating point at
power up.
7.3.1.1 Reference Selection and Digipot Transfer Function
The device writes the input data to the DPOT_POSITION register in straight-binary format. After a power-on or a
reset event, the device sets all digipot registers to the values set in the NVM.
7.3.1.1.1 Power Supply as Reference
By default, the TPL1401 operates with the power-supply pin (VDD) as a reference. Equation 1 shows the digipot
transfer function when the power-supply pin is used as a reference.
(1)
where:
•
•
•
DPOT_POS is the decimal equivalent of the binary code that is loaded to the digipot register.
DPOT_POS ranges from 0 to 255.
VDD is used as the digipot reference voltage.
7.3.1.1.2 Internal Reference
The TPL1401 also contains an internal reference that is disabled by default. Enable the internal reference by
writing 1 to REF_EN (address D1h). The internal reference generates a fixed 1.21-V voltage (typical). Using the
OUT_SPAN (address D1h) bits, a gain of 1.5x, 2x, 3x, 4x can be achieved for the digipot output voltage (VOUT)
Equation 2 shows digipot transfer function when the internal reference is used.
(2)
where:
•
•
•
•
DPOT_POS is the decimal equivalent of the binary code that is loaded to the digipot register
DPOT_POS ranges from 0 to 255.
VREF is the internal reference voltage = 1.21 V.
GAIN = 1.5x, 2x, 3x, 4x based on OUT_SPAN (address D1h) bits.
7.3.2 Digipot Update
The digipot output pin (OUT) is updated at the end of I2C digipot write frame.
18
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7.3.3 Nonvolatile Memory (EEPROM or NVM)
The TPL1401 contains nonvolatile memory (NVM) bits. These NVM bits are user programmable and erasable,
and retain the set values in the absence of a power supply. All the register bits, as shown in Table 7-1, can be
stored in the device NVM by setting NVM_PROG = 1 (address D3h). The NVM_BUSY bit (address D0h) is set
to 1 by the device when an NVM write or reload operation is ongoing. During this time, the device blocks all
write operations to the device. The NVM_BUSY bit is set to 0 after the write or reload operation is complete; at
this point, all write operations to the device are allowed. The default value for all the registers in the TPL1401 is
loaded from NVM as soon as a POR event is issued. Do not perform a read operation from the digipot register
while NVM_BUSY = 1.
The TPL1401 also implements NVM_RELOAD bit (address D3h). Set this bit to 1 for the device to start an NVM
reload operation. After the operation is complete, the device autoresets this bit to 0. During the NVM_RELOAD
operation, the NVM_BUSY bit is set to 1.
Table 7-1. NVM Programmable Registers
REGISTER ADDRESS
D1h
REGISTER NAME
GENERAL_CONFIG
BIT ADDRESS
BIT NAME
13
DEVICE_LOCK
4:3
DPOT_PDN
2
REF_EN
1:0
OUT_SPAN
10h
DPOT_POSITION
11:2
DPOT_POS
25h
USER_BYTE1
11:4
USER_BYTE1 (8 most significant bits)
26h
USER_BYTE2
11:4
USER_BYTE2 (8 most significant bits)
7.3.3.1 NVM Cyclic Redundancy Check
The TPL1401 implements a cyclic redundancy check (CRC) feature to make sure that the data stored in the
device NVM are uncorrupted. There are two types of CRC alarm bits implemented in TPL1401:
•
•
NVM_CRC_ALARM_USER (address D0h) — This bit indicates the status of the user-programmable NVM
bits.
NVM_CRC_ALARM_INTERNAL (address D0h) — This bit indicates the status of the internal NVM bits.
The CRC feature is implemented by storing a 10-bit CRC (CRC-10-ATM) along with the NVM data each time
NVM program operation (write or reload) is performed and during the device start up. The device reads the NVM
data and validates the data with the stored CRC. The CRC alarm bits report any errors after the data are read
from the device NVM.
7.3.3.1.1 NVM_CRC_ALARM_USER Bit
A logic 1 on NVM_CRC_ALARM_USER bit indicates that the user-programmable NVM data is corrupt. During
this condition, all registers in the digipot are initialized with factory reset values, and any digipot registers can
be written to or read from. To reset the alarm bits to 0, issue a Software Reset command, or cycle power to the
digipot. A power cycle reloads the user-programmable NVM bits. After the reset, write the desired data to the
registers and assert the NVM_PROG bit in the PROTECT register to program the NVM.
7.3.3.1.2 NVM_CRC_ALARM_INTERNAL Bit
A logic 1 on NVM_CRC_ALARM_INTERNAL bit indicates that the internal NVM data is corrupt. During
this condition, all registers in the digipot are initialized with factory reset values, and any digipot registers
can be written to or read from. To reset the alarm bits to 0, issue a Software Reset command, or cycle
power to the digipot. The NVM_PROG bit in the PROTECT register (address D3h) is blocked when the
NVM_CRC_ALARM_INTERNAL bit is set. The device reset or power cycle does not reset the CRC error if
there is a permanent NVM failure.
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7.3.4 Power-On Reset (POR)
The TPL1401 includes a power-on reset (POR) function that controls the output voltage at power up. After the
VDD supply has been established, a POR event is issued. The POR causes all registers to initialize to default
values, and communication with the device is valid only after a 30-ms POR delay. The default value for all the
registers in the TPL1401 is loaded from NVM as soon as the POR event is issued.
When the device powers up, a POR circuit sets the device to the default mode. The POR circuit requires specific
VDD levels, as indicated in Figure 7-1, in order to make sure that the internal capacitors discharge and reset the
device on power up. To make sure that a POR occurs, VDD must be less than 0.7 V for at least 1 ms. When VDD
drops to less than 1.65 V, but remains greater than 0.7 V (shown as the undefined region), the device may or
may not reset under all specified temperature and power-supply conditions. In this case, initiate a POR. When
VDD remains greater than 1.65 V, a POR does not occur.
VDD (V)
5.5 V
No power-on reset
Spe cified supply
voltage range
1.71 V
1.65 V
Undefined
0.7 V
Power-on reset
0V
Figure 7-1. Threshold Levels for VDD POR Circuit
7.3.5 Software Reset
To initiate a device software reset event, write reserved code 1010 to the SW_RESET bits (address D3h). A
software reset initiates a POR event.
7.3.6 Device Lock Feature
The TPL1401 implements a device lock feature that prevents an accidental or unintended write to the digipot
registers. The device locks all the registers when the DEVICE_LOCK bit (address D1h) is set to 1. To bypass the
DEVICE_LOCK setting, write 0101 to the DEVICE_UNLOCK_CODE bits (address D3h).
20
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7.4 Device Functional Modes
7.4.1 Power Down Mode
The TPL1401 output amplifier and internal reference can be independently powered down through the
DPOT_PDN bits (address D1h).
At power up, the digipot output and the internal reference are disabled by default.
In power-down mode, the digipot output (OUT pin) is in a high-impedance state.
To change this state to 10kΩ-AGND (at power up), use the DPOT_PDN bits (address D1h).
The digipot power-up state can be programmed to any state (power-down or normal mode) using the NVM.
Table 7-2 shows the digipot power-down bits.
Table 7-2. Digipot Power-Down Bits
REGISTER ADDRESS AND NAME
D1h, GENERAL_CONFIG
DPOT_PDN[1]
DPOT_PDN[0]
0
0
Power up
DESCRIPTION
0
1
Power down to 10 kΩ
1
0
Power down to high impedance (HiZ)
(default)
1
1
Power down to 10 kΩ
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7.5 Programming
The TPL1401 devices have a 2-wire serial interface (SCL and SDA), and one address pin (A0), as shown in
Section 5. The I2C bus consists of a data line (SDA) and a clock line (SCL) with pullup structures. When the bus
is idle, both SDA and SCL lines are pulled high. All the I2C-compatible devices connect to the I2C bus through
the open drain I/O pins, SDA and SCL.
The I2C specification states that the device that controls communication is called a master, and the devices that
are controlled by the master are called slaves. The master device generates the SCL signal. The master device
also generates special timing conditions (start condition, repeated start condition, and stop condition) on the bus
to indicate the start or stop of a data transfer. Device addressing is completed by the master. The master device
on an I2C bus is typically a microcontroller or digital signal processor (DSP). The TPL1401 operates as a slave
device on the I2C bus. A slave device acknowledges master commands, and upon master control, receives or
transmits data.
Typically, the TPL1401 operates as a slave receiver. A master device writes to the TPL1401, a slave receiver.
However, if a master device requires the TPL1401 internal register data, the TPL1401 operate as a slave
transmitter. In this case, the master device reads from the TPL1401. According to I2C terminology, read and write
refer to the master device.
The TPL1401 is a slave and supports the following data transfer modes:
•
•
•
Standard mode (100 kbps)
Fast mode (400 kbps)
Fast mode plus (1.0 Mbps)
The data transfer protocol for standard and fast modes is exactly the same; therefore, both modes are referred
to as F/S-mode in this document. The fast mode plus protocol is supported in terms of data transfer speed, but
not output current. The low-level output current would be 3 mA; similar to the case of standard and fast modes.
The TPL1401 supports 7-bit addressing. The 10-bit addressing mode is not supported. The device supports
the general call reset function. Sending the following sequence initiates a software reset within the device: start
or repeated start, 0x00, 0x06, stop. The reset is asserted within the device on the rising edge of the ACK bit,
following the second byte.
Other than specific timing signals, the I2C interface works with serial bytes. At the end of each byte, a ninth clock
cycle generates and detects an acknowledge signal. Acknowledge is when the SDA line is pulled low during the
high period of the ninth clock cycle. A not-acknowledge is when the SDA line is left high during the high period of
the ninth clock cycle as shown in Figure 7-2.
Data output
by transmitter
Not acknowledge
Data output
by receiver
Acknowledge
1
SCL from
master
2
9
8
S
Clock pulse for
acknowledgement
Start
condition
Figure 7-2. Acknowledge and Not Acknowledge on the I2C Bus
22
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7.5.1 F/S Mode Protocol
The following steps explain a complete transaction in F/S mode.
1. The master initiates data transfer by generating a start condition. The start condition is when a high-to-low
transition occurs on the SDA line while SCL is high, as shown in Figure 7-3. All I2C-compatible devices
recognize a start condition.
2. The master then generates the SCL pulses, and transmits the 7-bit address and the read/write direction bit
(R/W) on the SDA line. During all transmissions, the master makes sure that data are valid. A valid data
condition requires the SDA line to be stable during the entire high period of the clock pulse, as shown in
Figure 7-4. All devices recognize the address sent by the master and compare the address to the respective
internal fixed address. Only the slave device with a matching address generates an acknowledge by pulling
the SDA line low during the entire high period of the ninth SCL cycle, as shown in Figure 7-2. When the
master detects this acknowledge, the communication link with a slave has been established.
3. The master generates further SCL cycles to transmit (R/W bit 0) or receive (R/W bit 1) data to the slave. In
either case, the receiver must acknowledge the data sent by the transmitter. The acknowledge signal can be
generated by the master or by the slave, depending on which is the receiver. The 9-bit valid data sequences
consists of 8-data bits and 1 acknowledge-bit, and can continue as long as necessary.
4. To signal the end of the data transfer, the master generates a stop condition by pulling the SDA line
from low-to-high while the SCL line is high (see Figure 7-4). This action releases the bus and stops the
communication link with the addressed slave. All I2C-compatible devices recognize the stop condition. Upon
receipt of a stop condition, the bus is released, and all slave devices then wait for a start condition followed
by a matching address.
SDA
SDA
SCL
SCL
S
P
Start
condition
Stop
condition
Change of data
allowed
Data line stable
Data valid
Figure 7-3. Start and Stop Conditions
Figure 7-4. Bit Transfer on the I2C Bus
7.5.2 I2C Update Sequence
For a single update, the TPL1401 requires a start condition, a valid I2C address byte, a command byte, and two
data bytes, as listed in Table 7-3.
Table 7-3. Update Sequence
MSB
....
LSB
ACK
MSB
...
LSB
ACK
MSB
...
LSB
ACK
MSB
...
LSB
Address (A) byte
Section 7.5.3
Command byte
Section 7.5.4
Data byte - MSDB
Section 8.2.3
Data byte - LSDB
Section 8.2.3
DB [31:24]
DB [23:16]
DB [15:8]
DB [7:0]
ACK
After each byte is received, the TPL1401 acknowledges the byte by pulling the SDA line low during the high
period of a single clock pulse, as shown in Figure 7-5. These four bytes and acknowledge cycles make up the 36
clock cycles required for a single update to occur. A valid I2C address byte selects the TPL1401 device.
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Recognize
START or
REPEATED
START
condition
Recognize
STOP or
REPEATED
START
condition
Generate ACKNOWLEDGE
signal
P
SDA
MSB
Address
SCL
Sr
Acknowledgement
signal from Slave
R/W
1
7
8
1
9
2-8
9
Sr
or
P
S
or
Sr
ACK
ACK
START or
REPEATED
START
condition
REPEATED
START or
STOP
condition
Clock line held low while
interrupts are serviced
Figure 7-5. I2C Bus Protocol
The command byte sets the operating mode of the selected TPL1401. For a data update to occur when the
operating mode is selected by this byte, the TPL1401 must receive two data bytes: the most significant data
byte (MSDB) and least significant data byte (LSDB). The TPL1401 performs an update on the falling edge of the
acknowledge signal that follows the LSDB.
When using fast mode (clock = 400 kHz), the maximum digipot update rate is limited to 10 kSPS. Using the fast
mode plus (clock = 1 MHz), the maximum digipot update rate is limited to 25 kSPS. When a stop condition is
received, the TPL1401 releases the I2C bus and awaits a new start condition.
7.5.3 Address Byte
The address byte, as shown in Table 7-4, is the first byte received from the master device following the start
condition. The first four bits (MSBs) of the address are factory preset to 1001. The next three bits of the address
are controlled by the A0 pin. The A0 pin input can be connected to VDD, AGND, SCL, or SDA. The A0 pin is
sampled during the first byte of each data frame to determine the address. The device latches the value of the
address pin, and consequently responds to that particular address according to Table 7-5.
The TPL1401 supports broadcast addressing, which is used for synchronously updating or powering down
multiple TPL1401 devices. When the broadcast address is used, the TPL1401 responds regardless of the
address pin state. Broadcast is supported only in write mode.
Table 7-4. Address Byte
COMMENT
MSB
—
AD6
AD5
AD4
AD3
General address
1
0
0
1
Broadcast address
1
0
0
0
LSB
AD2
AD1
AD0
See Table 7-5
(slave address column)
1
1
R/ W
0 or 1
1
0
Table 7-5. Address Format
24
SLAVE ADDRESS
A0 PIN
000
AGND
001
VDD
010
SDA
011
SCL
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7.5.4 Command Byte
Table 7-6 lists the command byte.
Table 7-6. Command Byte (Register Names)
ADDRESS
REGISTER NAME
D0h
STATUS
D1h
GENERAL_CONFIG
D3h
PROTECT
21h
DPOT_POSITION
25h
USER_BYTE1
26h
USER_BYTE2
7.5.5 I2C Read Sequence
To read any register, the following command sequence must be used, as shown in Table 7-7:
1. Send a start or repeated start command with a slave address and the R/W bit set to 0 for writing. The device
acknowledges this event.
2. Send a command byte for the register to be read. The device acknowledges this event again.
3. Send a repeated start with the slave address and the R/W bit set to 1 for reading. The device acknowledges
this event.
4. The device writes the MSDB byte of the addressed register. The master must acknowledge this byte.
5. Finally, the device writes out the LSDB of the register.
An alternative reading method allows for reading back the value of the last register written. The sequence is a
start or repeated start with the slave address and the R/ W bit set to 1, and the two bytes of the last register are
read out.
The broadcast address cannot be used for reading.
Table 7-7. Read Sequence
S
MSB …
R/ W
(0)
ACK
ADDRESS
BYTE
Section 7.5.3
From Master
MSB … LSB
ACK
COMMAND
BYTE
Section 7.5.4
Slave
From Master
Sr MSB …
Sr
Slave
R/ W
(1)
ACK
ADDRESS
BYTE
Section 7.5.3
From Master
MSB … LSB
ACK
MSDB
Slave
From Slave
MSB … LSB
ACK
LSDB
Master
From Slave
Master
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7.6 Register Map
Table 7-8. Register Map
ADDRESS
D0h
D1h
(1)
MOST SIGNIFICANT DATA BYTE (MSDB)
BIT15
BIT14
BIT13
BIT12
NVM_CRC_
ALARM_
USER
NVM_CRC_
ALARM_
INTERNAL
NVM_BUSY
X(1)
BIT11
LEAST SIGNIFICANT DATA BYTE (LSDB)
BIT10
DEVICE_
LOCK
RESERVED
BIT9
BIT8
BIT6
BIT5
BIT4
BIT3
X
DEVICE_ID
RESERVED
DPOT_PDN
DEVICE_
CONFIG_
RESET
X
BIT7
RESERVED
NVM_
RELOAD
NVM_
PROG
BIT2
BIT1
BIT0
VERSION_ID
REF_EN
OUT_SPAN
D3h
DEVICE_UNLOCK_CODE
SW_RESET
21h
X
DPOT_POS[7:0]
X
25h
X
USER_BYTE1[7:0]
X
26h
X
USER_BYTE2[7:0]
X
X = Don't care.
Table 7-9. Register Names
ADDRESS
REGISTER NAME
SECTION
D0h
STATUS
Section 7.6.1
D1h
GENERAL_CONFIG
Section 7.6.2
D3h
PROTECT
Section 7.6.3
21h
DPOT_POSITION
Section 7.6.4
25h
USER_BYTE1
Section 7.6.5
26h
USER_BYTE2
Section 7.6.6
Table 7-10. Access Type Codes
Access Type
Code
Description
X
X
Don't care
R
Read
W
Write
Read Type
R
Write Type
W
Reset or Default Value
-n
26
Value after reset or the default value
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7.6.1 STATUS Register (address = D0h) (reset = 000Ch or 0014h)
Table 7-11. STATUS Register
15
14
13
12
NVM_CRC_
ALARM_
USER
NVM_CRC_
ALARM_
INTERNAL
NVM_
BUSY
X
11
10
9
X
8
7
6
5
DEVICE_ID
4
3
2
VERSION_ID
1
0
R-0h
R-0h
R-0h
R-0h
X-00h
R-14h
R-0h
Table 7-12. STATUS Register Field Descriptions
Bit
Field
Type
Reset
Description
15
NVM_CRC_ALARM_USER
R
0
0 : No CRC error in user NVM bits
1: CRC error in user NVM bits
14
NVM_CRC_ALARM_INTERNAL
R
0
0 : No CRC error in internal NVM
1: CRC error in internal NVM bits
13
NVM_BUSY
R
0
0 : NVM write or load completed, Write to digipot registers
allowed
1 : NVM write or load in progress, Write to digipot registers
not allowed
12
X
R
0
Don't care
11 - 6
X
X
00h
Don't care
5-2
DEVICE_ID
R
14h
14h
1-0
VERSION_ID
R
Version ID as per the silicon version
7.6.2 GENERAL_CONFIG Register (address = D1h) (reset = 01F0h)
Figure 7-5. GENERAL_CONFIG Register
15
14
13
12
11
10
9
8
7
6
5
4
3
2
1
0
RESERVED
DEVICE_
LOCK
RESERVED
DPOT_PDN
REF_EN
OUT_SPAN
R-0h
W-0h
R-0Fh
R/ W-2h
R/ W-0h
R/ W-0h
Table 7-13. GENERAL_CONFIG Register Field Descriptions
Bit
Field
Type
Reset
Description
RESERVED
R
00
Always write 00b
DEVICE_LOCK
W
0
0 : Device not locked
1: Device locked, the device locks all the registers. This
bit can be reset (unlock device) by writing 0101 to the
DEVICE_UNLOCK_CODE bits (address D3h)
12 - 5
RESERVED
R
0Fh
Always write 0Fh
4-3
DPOT_PDN
R/ W
10
00: Power up
01: Power down to 10K
10: Power down to high impedance (default)
11: Power down to 10K
REF_EN
R/ W
0
0: Internal reference disabled, VDD is digipot reference voltage,
digipot output range from 0 V to VDD.
1: Internal reference enabled, digipot reference = 1.21 V
OUT_SPAN
R/ W
00
Only applicable when internal reference is enabled.
00: Reference to VOUT gain 1.5x
01: Reference to VOUT gain 2x
10: Reference to VOUT gain 3x
11: Reference to VOUT gain 4x
15 - 14
13
2
1-0
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7.6.3 PROTECT Register (address = D3h) (reset = 0008h)
Figure 7-6. PROTECT Register
15
5
4
DEVICE_UNLOCK_CODE
14
13
12
11
X
10
DEVICE_
CONFIG_
RESET
9
8
RESERVED
7
6
NVM_
RELOAD
NVM_
PROG
3
SW_RESET
2
1
W-0h
X
W-0h
R-0h
W-0h
W-0h
W-8h
0
Table 7-14. PROTECT Register Field Descriptions
Bit
Field
Type
Reset
Description
15 - 12
DEVICE_UNLOCK_CODE
W
0000
Write 0101 to unlock the device to bypass DEVICE_LOCK bit.
11 - 10
X
X
0h
Don't care
DEVICE_CONFIG_RESET
W
0
0: Device configuration reset not initiated
1: Device configuration reset initiated. All registers loaded with
factory reset values.
9
8-6
RESERVED
R
000
Always write 000b
5
NVM_RELOAD
W
0
0: NVM reload not initiated
1: NVM reload initiated, applicable digipot registers loaded with
corresponding NVM. NVM_BUSY bit set to 1 while this operation
is in progress. This bit is self-resetting.
4
NVM_PROG
W
0
0: NVM write not initiated
1: NVM write initiated, NVM corresponding to applicable digipot
registers loaded with existing register settings. NVM_BUSY bit
set to 1 while this operation is in progress. This bit is selfresetting.
3-0
SW_RESET
W
1000
1000: Software reset not initiated
1010: Software reset initiated, digipot registers loaded with
corresponding NVMs, all other registers loaded with default
settings.
7.6.4 DPOT_POSITION Register (address = 21h) (reset = 0000h)
Table 7-15. DPOT_POSITION Register
15
14
13
12
11
10
9
8
7
6
5
4
3
2
1
0
X
DPOT_POS[7:0] – MSB Left aligned
X
X-0h
R/W-000h
X-0h
Table 7-16. DPOT_DATA Register Field Descriptions
Bit
Field
Type
Reset
Description
X
X
0h
Don't care
11-2
DPOT_POS[7:0]
R/W
000h
Writing to the DPOT_POSITION register forces the digipot to
update the active register data to the DPOT_POS.
Data are in straight binary format and use the following format:
{ DPOT_POS[7:0], X, X }
X = Don’t care bits
1-0
X
X
0h
Don't care
15-12
28
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7.6.5 USER_BYTE1 Register (address = 25h) (reset = 0000h)
Table 7-17. USER_BYTE1 Register
15
14
13
12
11
10
9
8
7
6
5
4
3
2
1
0
X
USER_BYTE1[7:0] – MSB Left aligned
X
X-0h
R/W-000h
X-0h
Table 7-18. USER_BYTE1 Register Field Descriptions
Bit
15-12
Field
Type
Reset
Description
X
X
0h
Don't care
11-2
USE_BYTE1[7:0] – MSB Left aligned R/W
000h
8-bit user-programmable data.
Data are in straight binary format and use the following format:
{ USER_BYTE1[7:0], X, X }
X = Don’t care bits
1-0
X
0h
Don't care
X
7.6.6 USER_BYTE2 Register (address = 26h) (reset = 0000h)
Table 7-19. USER_BYTE2 Register
15
14
13
12
11
10
9
8
7
6
5
4
3
2
1
0
X
USER_BYTE2[7:0] – MSB Left aligned
X
X-0h
R/W-000h
X-0h
Table 7-20. USER_BYTE2 Register Field Descriptions
Bit
Field
Type
Reset
Description
X
X
0h
Don't care
11-2
USER_BYTE2[7:0] – MSB Left
aligned
R/W
000h
8-bit user-programmable data.
Data are in straight binary format and follows the format below:
{ USER_BYTE2[7:0], X, X }
X = Don’t care bits
1-0
X
X
0h
Don't care
15-12
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8 Application and Implementation
Note
Information in the following applications sections is not part of the TI component specification,
and TI does not warrant its accuracy or completeness. TI’s customers are responsible for
determining suitability of components for their purposes, as well as validating and testing their design
implementation to confirm system functionality.
8.1 Application Information
The TPL1401 is a buffered, force-sense-output, single-channel, digipot that includes an internal reference and
NVM, and is available in a tiny 2 mm × 2 mm package. This device interfaces to a processor using I2C. There
are 4 I2C addresses possible by configuring the A0 pin as shown in Table 7-5. The NVM allows processor-less
operation of this device after programming at factory. The force-sense output can work with a transitor to create
a programmable current sink that can bias LEDs. These digipots are designed for general-purpose applications
in a wide range of end equipment. Some of the most common applications for these devices are programmable
current limits, adjustable power supplies, and offset and gain trimming in precision circuits.
8.2 Typical Application
Many analog and power devices, such as LED drivers, power amplifiers, high-side switches, e-fuses, and
DC-DC converters, provide an analog input for an adjustable output current limit. Some of these devices
recommend a resistor from this pin to ground for static settings. The TPL1401 is a very compact way to address
the adjustable current limit requirements of such devices enabling scalability and configurability of these power
devices. The integrated EEPROM makes sure the setting is retained even after power cycling, allowing the
current limit to work without a processor. This section explains the design details of a programmable current limit
application with an example LED driver, the TPS92692. Figure 8-1 shows the simplified circuit diagram of this
application.
Figure 8-1. Programmable Current Limit
8.2.1 Design Requirements
•
•
30
LED driver: TPS92692
LED driver current limit: 100 mA
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8.2.2 Detailed Design Procedure
The TPS92692 data sheet provides the equation for the voltage required to set a given LED current limit. Use a
sense resistor of 1-Ω for the TPS92692.The voltage at the IADJ pin, VIADJ, must be 1.4 V for an LED current of
100 mA. The range for VIADJ is 2.5 V. Enable the internal reference with 2x gain to set the digipot output range to
2.42 V that will fairly be in the range of current adjustment for the LED driver. Calculate the code needed to set
the digipot output to 1.4 V using the following equation:
(3)
The hex value for 148 is 0x94. Shift this value by 4 bits before writing to the DPOT_POSITION register, resulting
in 0x940.
The pseudocode for the programmable current limit application is as follows:
//SYNTAX: WRITE , ,
//Power-up the device, enable internal reference with 2x output span
WRITE GENERAL_CONFIG(0xD1), 0x11, 0xE5
//Write digipot code (12-bit aligned)
WRITE DPOT_POSITION(0x21), 0x09, 0x40
//Write settings to the NVM
WRITE PROTECT(0xD3), 0x00, 0x10
8.2.3 Application Curves
Figure 8-2. Digipot Code vs LED Current
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9 Power Supply Recommendations
The TPL1401 does not require specific supply sequencing. The device requires a single power supply, VDD. Use
a 0.1-µF decoupling capacitor for the VDD pin. Use a bypass capacitor with a value greater than 1.5-µF for the
CAP pin.
10 Layout
10.1 Layout Guidelines
The TPL1401 pin configuration separates the analog, digital, and power pins for an optimized layout. For signal
integrity, separate the digital and analog traces, and place decoupling capacitors close to the device pins.
10.2 Layout Example
Figure 10-1 shows an example layout drawing with decoupling capacitors and pullup resistors.
Figure 10-1. Layout Example
32
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11 Device and Documentation Support
11.1 Documentation Support
11.1.1 Related Documentation
For related documentation see the following:
Texas, Instruments TPL1401EVM user's guide
11.2 Receiving Notification of Documentation Updates
To receive notification of documentation updates, navigate to the device product folder on ti.com. Click on
Subscribe to updates to register and receive a weekly digest of any product information that has changed. For
change details, review the revision history included in any revised document.
11.3 Support Resources
TI E2E™ support forums are an engineer's go-to source for fast, verified answers and design help — straight
from the experts. Search existing answers or ask your own question to get the quick design help you need.
Linked content is provided "AS IS" by the respective contributors. They do not constitute TI specifications and do
not necessarily reflect TI's views; see TI's Terms of Use.
11.4 Trademarks
TI E2E™ is a trademark of Texas Instruments.
All trademarks are the property of their respective owners.
11.5 Electrostatic Discharge Caution
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled
with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may
be more susceptible to damage because very small parametric changes could cause the device not to meet its published
specifications.
11.6 Glossary
TI Glossary
This glossary lists and explains terms, acronyms, and definitions.
12 Mechanical, Packaging, and Orderable Information
The following pages include mechanical, packaging, and orderable information. This information is the most
current data available for the designated devices. This data is subject to change without notice and revision of
this document. For browser-based versions of this data sheet, refer to the left-hand navigation.
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PACKAGE OPTION ADDENDUM
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PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
(2)
Lead finish/
Ball material
MSL Peak Temp
Op Temp (°C)
Device Marking
(3)
(4/5)
(6)
TPL1401DSGR
ACTIVE
WSON
DSG
8
3000
RoHS & Green
NIPDAU
Level-1-260C-UNLIM
-40 to 125
14_1
TPL1401DSGT
ACTIVE
WSON
DSG
8
250
RoHS & Green
NIPDAU
Level-1-260C-UNLIM
-40 to 125
14_1
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of