TPPM0302DGNR

TPPM0302 400-mA LOW-DROPOUT REGULATOR WITH AUXILIARY POWER MANAGEMENT AND POK SLVS316 – NOVEMBER 2000 D D D D D D D Automatic Input Voltage Source Selection Glitch-Free Regulated Output 5-V Input Voltage Source Detector With Hysteresis 400-mA Load Current Capability With 5-V or 3.3-V Input Source Power OK Feature Based on Voltage Supervisor of 3.3VOUT Low rDS(on) Auxiliary Switch Thermally Enhanced PowerPAD Packaging Concept for Efficient Heat Management DGN PACKAGE (TOP VIEW) 5VAUX 5VCC 3.3VOUT 3.3VAUX 1 8 2 7 3 6 4 5 NC GND NC POK NC – No connect description The TPPM0302 is a low-dropout regulator with auxiliary power management that provides a constant 3.3-V supply at the output capable of driving a 400-mA load. The TPPM0302 provides a regulated power output for systems that have multiple input sources and require a constant voltage source with a low-dropout voltage. This is a single output, multiple input, intelligent power source selection device with a low-dropout regulator for either 5VCC or 5VAUX inputs, and a low-resistance bypass switch for the 3.3VAUX input. Transitions may occur from one input supply to another without generating a glitch, outside of the specification range, on the 3.3-V output. The device has an incorporated reverse blocking scheme to prevent excess leakage from the input terminals in the event that the output voltage is greater than the input voltage. The output voltage is continually monitored for constant output, and any deviation from the internal set limit (≈2.8 V) is reported by a low signal on the POK output. The input voltage is prioritized in the following order: 5VCC, 5VAUX, and 3.3VAUX. Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. PowerPAD is a trademark of Texas Instruments. Copyright  2000, Texas Instruments Incorporated PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 1 TPPM0302 400-mA LOW-DROPOUT REGULATOR WITH AUXILIARY POWER MANAGEMENT AND POK SLVS316 – NOVEMBER 2000 functional block diagram Linear Regulator With LDO 5VCC 3.3VOUT 5-V Detection Current Sensor Over Temperature Gate Drive and Control 5VAUX Linear Regulator With LDO 5VAUX Detection GND Current Sensor Gate Drive and Control 3.3VAUX Low ON Resistance Switch 3VAUX Detection Current Sensor Gate Drive 5-V Detection and Control Voltage Supervisor 3.3VOUT Terminal Functions TERMINAL NAME NO. I/O DESCRIPTION 3.3VAUX 4 I 3.3-V auxiliary input 3.3VOUT 3 O 3.3-V output with a typical capacitance load of 4.7 µF 5VAUX 1 I 5-V auxiliary input 5VCC 2 I 5-V main input GND NC POK 2 7 I Ground 6, 8 I No internal connection 5 O Power OK POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 Reset POK TPPM0302 400-mA LOW-DROPOUT REGULATOR WITH AUXILIARY POWER MANAGEMENT AND POK SLVS316 – NOVEMBER 2000 Table 1. Input Selection INPUT VOLTAGE STATUS (V) 3.3VAUX INPUT SELECTED OUTPUT (V) OUTPUT (I) 5VCC/5VAUX/3.3VAUX 3.3VOUT 5VCC 5VAUX 0 0 0 None 0 IL (mA) 0 0 0 3.3 3.3VAUX 3.3 375 0 5 0 5VAUX 3.3 400 0 5 3.3 5VAUX 3.3 400 5 0 0 5VCC 3.3 400 5 0 3.3 5VCC 3.3 400 5 5 0 5VCC 3.3 400 5 5 3.3 5VCC 3.3 400 absolute maximum ratings over operating free-air temperature (unless otherwise noted)† Supply voltage, 5-V main input, V(5VCC) (see Notes 1 and 2) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 V Auxiliary voltage, 5-V input, V(5VAUX) (see Notes 1 and 2) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 V Auxiliary voltage, 3.3-V input, V(3.3VAUX) (see Notes 1 and 2) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 V 3.3-V output current limit, I(LIMIT) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1.5 A Continuous power dissipation, PD (see Note 3) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1.36 W Electrostatic discharge susceptibility, human body model, V(HBMESD) . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 kV Operating ambient temperature range, TA . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0°C to 70°C Storage temperature range, Tstg . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –55°C to 150°C Operating junction temperature range, TJ . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –5°C to 120°C Lead temperature (soldering, 10 second), T(LEAD) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 260°C † Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. NOTES: 1. All voltage values are with respect to GND. 2. Absolute negative voltage on these terminal should not be below –0.5 V. 3. Refer to the Thermal Information Section. recommended operating conditions MIN TYP MAX UNIT 5-V main input, V(5VCC) 4.5 5.5 V 5-V auxiliary input, V(5VAUX) 4.5 5.5 V 3 3.6 V 5.17 µF 3.3-V auxiliary input, V(3.3VAUX) Load capacitance, CL 4.23 4.7 Load current, IL 0 400 mA Ambient temperature, TA 0 70 °C POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 3 TPPM0302 400-mA LOW-DROPOUT REGULATOR WITH AUXILIARY POWER MANAGEMENT AND POK SLVS316 – NOVEMBER 2000 electrical characteristics over recommended operating free-air temperature range, TA = 0°C to 70°C, CL = 4.7 µF (unless otherwise noted) PARAMETER TEST CONDITIONS V(5VCC)/ V(5VAUX) 5-V inputs I(Q) Quiescent supply current IL I(LIMIT) T(TSD)† Output load current Thys† V(3.3VOUT) Thermal hysteresis CL Load capacitance IL = 400 mA Minimal ESR to insure stability of regulated output Ilkg(REV) Reverse leakage output current Tested for input that is grounded. 3.3VAUX, 5VAUX, or 5VCC = GND, 3.3VOUT = 3.3 V MIN TYP MAX 4.5 5 5.5 2.5 5 mA From 3.3VAUX terminal, IL = 0 A 250 500 µA 1 1.5 3.3VOUT = 0 V Thermal shutdown 3 3VOUT output shorted to 0 V 3.3VOUT 3.3-V output V From 5VCC or 5VAUX terminals, IL = 0 mA to 400 mA 0.4 Output current limit UNIT A 150 180 15 3.135 3.3 3.465 A °C V µF 4.7 50 µA † Design targets only. Not tested in production. 5-V detect PARAMETER V(TO_LO) V(TO_HI) MIN TYP MAX UNIT Threshold voltage, low 5VAUX or 5VCC↓ TEST CONDITIONS 3.85 4.05 4.25 V Threshold voltage, high 5VAUX or 5VCC↑ 4.1 4.3 4.5 V MIN TYP MAX auxiliary switch PARAMETER TEST CONDITIONS R(SWITCH) Auxiliary switch resistance 5VAUX = 5VCC = 0 V, 3.3VAUX = 3.3 V, IL = 150 mA ∆VO(∆VI) ∆VO(∆IO) Line regulation voltage 5VAUX or 5VCC = 4.5 V to 5.5 V Load regulation voltage 20 mA < IL < 400 mA VI – VO Dropout voltage IL < 400 mA 0.4 2 UNIT Ω mV 40 mV 1 V Power OK (POK) PARAMETER V(TO_POK) VOL POK threshold voltage IOH Output high current VOH Output high voltage Output low voltage TEST CONDITIONS MIN TYP MAX 2.67 2.8 2.93 3.3VOUT = 0 → 3.3 V and starts POK delay timer 0.4 200 3.3 5K pullup to 3.3VOUT UNIT V µA V timing characteristics, TA = 0°C to 70°C, CL = 4.7 µF (unless otherwise noted)† PARAMETER TEST CONDITIONS MIN td Power OK delay 5VCC or 5VAUX or 3.3VAUX > VTO and POK ↑ † Design targets only. Not tested in production. TYP MAX 5 10 TYP MAX UNIT ms thermal characteristics‡ PARAMETER RθJC MIN Thermal impedance, junction-to-case RθJA Thermal impedance, junction-to-ambient ‡ Based on Texas Instrument recommended board for PowerPAD package. 4 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 UNIT 4.7 °C/W 59 °C/W TPPM0302 400-mA LOW-DROPOUT REGULATOR WITH AUXILIARY POWER MANAGEMENT AND POK SLVS316 – NOVEMBER 2000 PARAMETER MEASUREMENT INFORMATION VTO = 2.67 V to 2.93 V 85% 3.3VOUT td POK Figure 1. Power OK Timing Diagram TYPICAL CHARACTERISTICS 5VCC 3.3VAUX 3.3VOUT 3.3VOUT (400mA load) Figure 2. 5VCC Cold Start POST OFFICE BOX 655303 (375mA load) Figure 3. 3.3VAUX Cold Start • DALLAS, TEXAS 75265 5 TPPM0302 400-mA LOW-DROPOUT REGULATOR WITH AUXILIARY POWER MANAGEMENT AND POK SLVS316 – NOVEMBER 2000 TYPICAL CHARACTERISTICS 5VCC (offset = 4.5V) 3.3VAUX (offset = 3.3V) 5VAUX (offset = 4.8V) 5VCC (offset = 4.5V) 3.3VOUT (offset = 3.3V) 3.3VOUT (offset = 3.3V) (400mA load) Figure 4. 5VCC Power Up (5VAUX = 5 V) 3.3VAUX (offset = 3.3V) (400mA load) Figure 5. 5VCC Power Up (3.3VAUX = 3.3 V) 5VCC (offset = 4.3V) 5VAUX (offset = 4.5V) 3.3VOUT (offset = 3.3V) (400mA load) Figure 6. 5VAUX Power Up (3.3VAUX = 3.3 V) 6 POST OFFICE BOX 655303 (400mA load) Figure 7. 5VCC Power Down (3.3VAUX = 3.3 V) • DALLAS, TEXAS 75265 TPPM0302 400-mA LOW-DROPOUT REGULATOR WITH AUXILIARY POWER MANAGEMENT AND POK SLVS316 – NOVEMBER 2000 TYPICAL CHARACTERISTICS Sample (400mA load) Trig? 3.3VOUT (offset = 3.3V) 5VAUX (offset = 5 V) 3.3VOUT (offset = 3.3V) 400mA to 20mA step load 5VCC (offset = 4.5V) Figure 8. 5VCC Power Down (5VAUX = 5 V) Sample Figure 9. 5VCC Load Transient Responses Falling Trig? POK 3.3VOUT (offset = 3.3V) 3.3VOUT 20mA to 400mA step load (100mA load) Figure 10. 5VCC Load Transient Response Rising POST OFFICE BOX 655303 Figure 11. 5VCC Cold Start, POK Released • DALLAS, TEXAS 75265 7 TPPM0302 400-mA LOW-DROPOUT REGULATOR WITH AUXILIARY POWER MANAGEMENT AND POK SLVS316 – NOVEMBER 2000 THERMAL INFORMATION To ensure reliable operation of the device, the junction temperature of the output device must be within the safe operating area (SOA). This is achieved by having a means to dissipate the heat generated from the junction of the output structure. There are two components that contribute to thermal resistance. They consist of two paths in series. The first is the junction to case thermal resistance, RθJC; the second is the case to ambient thermal resistance, RθCA. The overall junction to ambient thermal resistance, RθJA, is determined by: RθJA = RθJC + RθCA The ability to efficiently dissipate the heat from the junction is a function of the package style and board layout incorporated in the application. The operating junction temperature is determined by the operating ambient temperature, TA, and the junction power dissipation, PJ. The junction temperature, TJ, is equal to the following thermal equation: TJ = TA + PJ (RθJC) + PJ (RθCA) TJ = TA + PJ (RθJA) This particular application uses the 8-pin DGN PowerPAD package with a standard lead frame with dedicated ground terminal. Using a multilayer printed-circuit board (PCB), the power pad is mounted as recommended in the TI packaging application. The power pad is electrically connected to the ground plane of the circuit board through the dedicated ground pin and the die mount power pad. This will provide a means for heat spreading through the copper plane associated within the PCB (GND Layer). This concept could provide a thermal resistance from junction to ambient, RθJA, of 59°C/W if implemented correctly. Hence, maximum power dissipation allowable for an operating ambient temperature of 70°C, and a maximum junction temperature of 150°C is determined as: PJ = (TJ – TA) / RθJA PJ = (150 – 70) /59 = 1.36 W Using a multilayer board and utilizing the ground plane for heat spreading. Power Dissipation Derate Curve Using High-K PCB Power – W 2.6 1.36 25 70 Ambient Temperature – °C 150 NOTE: This curve is to be used for guideline purposes only. For a particular application, a more specific thermal characterization is required. Figure 12. Power Dissipation Derating Curve 8 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 TPPM0302 400-mA LOW-DROPOUT REGULATOR WITH AUXILIARY POWER MANAGEMENT AND POK SLVS316 – NOVEMBER 2000 APPLICATION INFORMATION packaging To maximize the efficiency of this package for application on a single layer or multilayer PCB, certain guidelines must be followed. The following information is to be used as a guideline only. For further information, refer to the PowerPAD concept implementation document. multilayer PCB Guidelines for mounting the PowerPAD IC on a multilayer PCB with a ground plane. Solid Pad (Land Pattern) Package Thermal Pad Thermal Vias Package Outline Via = 0,33 mm Diameter, Minimum Pitch Between Vias is 1,52 mm Figure 13. Package and Land Configuration for a Multilayer PCB 0,18 mm (Square) Package Solder Pad Component Traces 1,5038 – 1,5748 mm Component Trace (2 oz. Cu) 2 Plane 4 Plane 1,5748 mm Thermal Via Thermal Isolation Power Plane Only Package Solder Pad (Bottom Trace) 1,0142 – 1,0502 mm Ground Plane (1 oz. Cu) 0,5246 – 0,5606 mm Power Plane (1 oz. Cu) 0 – 0,071 mm Board Base and Bottom Pad Figure 14. Multilayer Board (Side View) POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 9 TPPM0302 400-mA LOW-DROPOUT REGULATOR WITH AUXILIARY POWER MANAGEMENT AND POK SLVS316 – NOVEMBER 2000 APPLICATION INFORMATION In a multilayer board application, the thermal vias are the primary method of heat transfer from the package thermal pad to the internal ground plane. The efficiency of this method depends on several factors (die area, number of thermal vias, thickness of copper) Consult the PowerPAD Thermally Enhanced Package Technical Brief. single-layer PCB Use as Much Copper Area as Possible for Heat Spread Package Thermal Pad Package Outline Figure 15. Land Configuration for Single-layer PCB Layout recommendations for a single-layer PCB utilize as much copper area as possible for power management. In a single layer board application, the thermal pad is attached to a heat spreader (copper area) by using low thermal impedance attachment method (solder paste or thermal conductive epoxy). In both of the methods mentioned above, it is advisable to use as many copper traces as possible to dissipate the heat. IMPORTANT If the attachment method is NOT implemented correctly, the functionality of the product is not efficient. Power dissipation capability will be adversely affected if the device is incorrectly mounted onto the circuit board. 1 4.7 µF NC 8 0.1 µF 2 4.7 µF 5VAUX 0.1 µF 5VCC GND 7 TPPM0302 3 3.3VOUT NC 6 4.7 µF 3.3VOUT 4 4.7 µF 3.3VAUX POK 5 5 kΩ 0.1 µF Figure 16. Typical Application Schematic 10 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 TPPM0302 400-mA LOW-DROPOUT REGULATOR WITH AUXILIARY POWER MANAGEMENT AND POK SLVS316 – NOVEMBER 2000 MECHANICAL DATA DGN (S-PDSO-G8) PowerPAD PLASTIC SMALL-OUTLINE PACKAGE 0,38 0,25 0,65 8 0,25 M 5 Thermal Pad (See Note D) 0,15 NOM 3,05 2,95 4,98 4,78 Gage Plane 0,25 1 0°– 6° 4 3,05 2,95 0,69 0,41 Seating Plane 1,07 MAX 0,15 0,05 0,10 4073271/A 04/98 NOTES: A. B. C. D. All linear dimensions are in millimeters. This drawing is subject to change without notice. Body dimensions include mold flash or protrusions. The package thermal performance may be enhanced by attaching an external heat sink to the thermal pad. This pad is electrically and thermally connected to the backside of the die and possibly to selected leads. E. Falls within JEDEC MO-187 PowerPAD is a trademark of Texas Instruments. POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 11 IMPORTANT NOTICE Texas Instruments and its subsidiaries (TI) reserve the right to make changes to their products or to discontinue any product or service without notice, and advise customers to obtain the latest version of relevant information to verify, before placing orders, that information being relied on is current and complete. All products are sold subject to the terms and conditions of sale supplied at the time of order acknowledgment, including those pertaining to warranty, patent infringement, and limitation of liability. TI warrants performance of its semiconductor products to the specifications applicable at the time of sale in accordance with TI’s standard warranty. Testing and other quality control techniques are utilized to the extent TI deems necessary to support this warranty. Specific testing of all parameters of each device is not necessarily performed, except those mandated by government requirements. Customers are responsible for their applications using TI components. In order to minimize risks associated with the customer’s applications, adequate design and operating safeguards must be provided by the customer to minimize inherent or procedural hazards. TI assumes no liability for applications assistance or customer product design. TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or other intellectual property right of TI covering or relating to any combination, machine, or process in which such semiconductor products or services might be or are used. TI’s publication of information regarding any third party’s products or services does not constitute TI’s approval, warranty or endorsement thereof. Copyright  2000, Texas Instruments Incorporated