TPS22924BYZZR

Product Folder Sample & Buy Tools & Software Technical Documents Support & Community TPS22924B, TPS22924C SLVSAR3E – APRIL 2011 – REVISED DECEMBER 2015 TPS22924x 3.6-V, 2-A, 18.3-mΩ On-Resistance Load Switch 1 Features 3 Description • • • The TPS22924x is a small, low RON load switch with controlled turn on. The device contains a N-channel MOSFET that can operate over an input voltage range of 0.75 V to 3.6 V. An integrated charge pump biases the NMOS switch to achieve a minimum switch ON resistance. The switch is controlled by an on/off input (ON), which is capable of interfacing directly with low-voltage control signals. 1 • • • • • • • Integrated Single Load Switch Input Voltage: 0.75 V to 3.6 V On-Resistance – RON = 18.3 mΩ at VIN = 3.6 V – RON = 19.6 mΩ at VIN = 1.8 V – RON = 19.4 mΩ at VIN = 1.2 V – RON = 22.7 mΩ at VIN = 0.75 V Small CSP-6 package 0.9 mm x 1.4 mm, 0.5-mm Pitch 2 A Maximum Continuous Switch Current Low Shutdown Current Low Threshold Control Input Controlled Slew Rate to Avoid Inrush Currents Quick Output Discharge Transistor ESD Performance Tested Per JESD 22 – 5000-V Human-Body Model (A114-B, Class II) – 1000-V Charged-Device Model (C101) A 1250 Ω on-chip load resistor is added for output quick discharge when the switch is turned off. The rise time of the device is internally controlled to avoid inrush current. The TPS22924B features a rise time of 100 µs at VIN = 3.6 V while the TPS22924C has a rise time of 800 µs at VIN = 3.6 V. The TPS22924x is available in an ultra-small spacesaving 6-pin CSP package and is characterized for operation over the free-air temperature range of –40ºC to 85ºC. Device Information PART NUMBER PACKAGE (1) BODY SIZE (NOM) TPS22924B DSBGA (6) 1.40 mm × 0.90 mm 2 Applications TPS22924C DSBGA (6) 1.40 mm × 0.90 mm • • • • • • • • • (1) For all available packages, see the orderable addendum at the end of the datasheet. Battery Powered Equipment Portable Industrial Equipment Portable Medical Equipment Portable Media Players Point Of Sales Terminal GPS Devices Digital Cameras Notebooks / Tablet PCs / eReaders Smartphones Simplified Schematic NOTE: SMPS = Switched-mode power supply 1 An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications, intellectual property matters and other important disclaimers. PRODUCTION DATA. TPS22924B, TPS22924C SLVSAR3E – APRIL 2011 – REVISED DECEMBER 2015 www.ti.com Table of Contents 1 2 3 4 5 6 7 Features .................................................................. Applications ........................................................... Description ............................................................. Revision History..................................................... Device Comparison Table..................................... Pin Configuration and Functions ......................... Specifications......................................................... 7.1 7.2 7.3 7.4 7.5 7.6 7.7 7.8 7.9 7.10 8 9 1 1 1 2 3 3 4 Absolute Maximum Ratings ..................................... 4 ESD Ratings.............................................................. 4 Recommended Operating Conditions....................... 4 Thermal Information .................................................. 4 Electrical Characteristics........................................... 5 Switching Characteristics, VIN = 3.6 V ...................... 5 Switching Characteristics, VIN = 0.9 V ...................... 5 Typical Characteristics .............................................. 6 AC Characteristics (TPS22924B) ............................. 7 AC Characteristics (TPS22924C) ......................... 10 Parameter Measurement Information ................ 13 Detailed Description ............................................ 14 9.1 9.2 9.3 9.4 Overview ................................................................. Functional Block Diagram ....................................... Feature Description................................................. Device Functional Modes........................................ 14 14 14 15 10 Application and Implementation........................ 16 10.1 Application Information.......................................... 16 10.2 Typical Application ................................................ 16 11 Power Supply Recommendations ..................... 18 12 Layout................................................................... 18 12.1 Layout Guidelines ................................................. 18 12.2 Layout Example .................................................... 18 13 Device and Documentation Support ................. 19 13.1 13.2 13.3 13.4 13.5 Related Links ........................................................ Community Resources.......................................... Trademarks ........................................................... Electrostatic Discharge Caution ............................ Glossary ................................................................ 19 19 19 19 19 14 Mechanical, Packaging, and Orderable Information ........................................................... 19 4 Revision History NOTE: Page numbers for previous revisions may differ from page numbers in the current version. Changes from Revision D (August 2014) to Revision E Page • Added device TPS22924C .................................................................................................................................................... 1 • Deleted Features: rON = 18.5 mΩ at VIN = 2.5 V..................................................................................................................... 1 • Deleted Features: rON = 20.3 mΩ at VIN = 1.0 V..................................................................................................................... 1 • Added text to the Description "while the TPS22924C has a rise time of 800 µs at VIN = 3.6 V. " ......................................... 1 • Added: TPS22924CYZPR and TPS22924CYZPRB information to Device Comparison Table ............................................ 3 • Added "Storage temperature" to the Absolute Maximum Ratings • Changed Handling Ratings to ESD Ratings........................................................................................................................... 4 • Added section AC Characteristics (TPS22924C) ................................................................................................................ 10 • Changed the Application Curve section ............................................................................................................................... 17 (1) table ............................................................................ 4 Changes from Revision C (July 2014) to Revision D • Page Added Pin Configuration and Functions section, Overview section, Feature Description section, Power Supply Recommendations section .................................................................................................................................................... 1 Changes from Revision B (June 2013) to Revision C Page • Added Device Information table. ............................................................................................................................................ 1 • Added Handling Ratings table. ............................................................................................................................................... 4 • Added Detailed Description section. .................................................................................................................................... 14 2 Submit Documentation Feedback Copyright © 2011–2015, Texas Instruments Incorporated Product Folder Links: TPS22924B TPS22924C TPS22924B, TPS22924C www.ti.com SLVSAR3E – APRIL 2011 – REVISED DECEMBER 2015 5 Device Comparison Table TA (1) (2) (3) PACKAGE (1) ORDERABLE PART NUMBER TOP-SIDE MARKING (2) BACKSIDE COATING (3) RISE TIME AT VIN = 3.3V (TYP.) –40°C to 85°C YZ (0.4mm height) TPS22924BYZR _ _ _ 5N _ No 96µs –40°C to 85°C YZP (0.5mm height) TPS22924BYZPRB _ _ _ 5N _ Yes 96µs –40°C to 85°C YZZ (0.35mm height) TPS22924BYZZR _ _ _ 7A _ No 96µs –40°C to 85°C YZP (0.5mm height) TPS22924CYZPR _ _ _ 5L _ No 800µs –40°C to 85°C YZP (0.4mm height) TPS22924CYZPRB _ _ _ 5L _ Yes 800µs Package drawings, thermal data, and symbolization are available at www.ti.com/packaging. The actual top-side marking has three preceding characters to denote year, month, and sequence code, and one following character to designate the wafer fab/assembly site. Pin 1 identifier indicates solder-bump composition (1 = SnPb, • = Pb-free). CSP (DSBGA) devices manufactured with backside coating have an increased resistance to cracking due to the increased physical strength of the package. Devices with backside coating are highly encouraged for new designs. 6 Pin Configuration and Functions YZ/YZP/YZZ PACKAGE C C B B A A 2 1 Laser Marking View 1 2 Bump View Table 1. Pin Assignments (YZ/YZP/YZZ Package) C GND ON B VOUT VIN A VOUT VIN 1 2 Pin Functions NO. NAME DESCRIPTION C1 GND Ground C2 ON Switch control input, active high. Do not leave floating A1, B1 VOUT Switch output A2, B2 VIN Switch input, bypass this input with a ceramic capacitor to ground Copyright © 2011–2015, Texas Instruments Incorporated Product Folder Links: TPS22924B TPS22924C Submit Documentation Feedback 3 TPS22924B, TPS22924C SLVSAR3E – APRIL 2011 – REVISED DECEMBER 2015 www.ti.com 7 Specifications 7.1 Absolute Maximum Ratings (1) MIN MAX –0.3 4 V VIN + 0.3 V 4 V Maximum continuous switch current, TA = –40°C to 85°C 2 A Maximum pulsed switch current, 100-µs pulse, 2% duty cycle, TA = –40°C to 85°C 4 A –40 85 °C –65 150 °C VIN Input voltage range VOUT Output voltage range VON Input voltage range IMAX IPLS TA Operating free-air temperature range Tstg Storage temperature (1) –0.3 UNIT Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. 7.2 ESD Ratings VALUE ±5000 Charged device model (CDM), per JEDEC specification JESD22-C101, all pins (2) ±1000 Human body model (HBM), per ANSI/ESDA/JEDEC JS-001, all pins V(ESD) (1) (2) Electrostatic discharge UNIT (1) V JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process. 7.3 Recommended Operating Conditions VIN Input voltage VOUT Output voltage VIH High-level input voltage, ON VIL Low-level input voltage, ON CIN Input capacitance (1) MIN MAX 0.75 3.6 V VIN V VIN = 2.5 V to 3.6 V 1.2 3.6 VIN = 0.75 V to 2.5 V 0.9 3.6 VIN = 2.5 V to 3.6 V 0.6 VIN = 0.75 V to 2.49 V 0.4 1 (1) UNIT V V μF See the Input Capacitor section in Application Information. 7.4 Thermal Information TPS22924x THERMAL METRIC (1) YZ/YZZ/YZP UNIT 6 PINS RθJA Junction-to-ambient thermal resistance 123 RθJC(top) Junction-to-case (top) thermal resistance 17.6 RθJB Junction-to-board thermal resistance 22.8 ψJT Junction-to-top characterization parameter 5.7 ψJB Junction-to-board characterization parameter 22.6 RθJC(bot) Junction-to-case (bottom) thermal resistance N/A (1) 4 °C/W For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953. Submit Documentation Feedback Copyright © 2011–2015, Texas Instruments Incorporated Product Folder Links: TPS22924B TPS22924C TPS22924B, TPS22924C www.ti.com SLVSAR3E – APRIL 2011 – REVISED DECEMBER 2015 7.5 Electrical Characteristics VIN = 0.75 V to 3.6 V (unless otherwise noted) PARAMETER IIN Quiescent current IIN(LEAK) TEST CONDITIONS IOUT = 0, VIN = VON 42 70 VIN = 1.8 V 50 350 95 200 VIN = 1.0 V 65 110 VIN = 0.75 V 35 70 18.3 19.7 VIN = 1.2 V Full Full VIN = 1.8 V IOUT = –200 mA VIN = 1.2 V VIN = 1.0 V VIN = 0.75 V RPD Output pulldown resistance (2) VIN = 3.3 V, VON = 0, IOUT = 3 mA ION ON-state input leakage current VON = 0.9 V to 3.6 V or GND 25°C 19.4 21.8 mΩ 21.8 28.0 20.3 Full 25°C 19.5 27.4 Full 25°C µA 25.8 19.6 Full 25°C µA 26.0 18.5 Full 25°C 160 3.5 Full 25°C UNIT (1) 75 VIN = 2.5 V (1) (2) TYP MAX VIN = 2.5 V OFF-state supply current VON = GND, OUT = 0V ON-state resistance MIN VIN = 3.6 V VIN = 3.6 V RON TA 21.2 28.6 22.7 25.3 Full 34.8 25°C 1250 1500 Ω Full 0.1 µA Typical values are at VIN = 3.3 V and TA = 25°C. See Output Pulldown in the Application and Implementation section. 7.6 Switching Characteristics, VIN = 3.6 V VIN = 3.6 V, TA = 25°C (unless otherwise noted) PARAMETER TEST CONDITIONS TPS22924B (TYP) TPS22924C (TYP) UNIT tON Turn-ON time RL = 10 Ω, CL = 0.1 μF, VIN = 3.6V 111 800 μs tOFF Turn-OFF time RL = 10 Ω, CL = 0.1 μF, VIN = 3.6V 3 3 μs tr VOUT rise time RL = 10 Ω, CL = 0.1 μF, VIN = 3.6V 96 800 μs tf VOUT fall time RL = 10 Ω, CL = 0.1 μF, VIN = 3.6V 2.5 2.5 μs TPS22924B (TYP) TPS22924C (TYP) UNIT 865 μs 7.7 Switching Characteristics, VIN = 0.9 V VIN = 0.9 V, TA = 25°C (unless otherwise noted) PARAMETER TEST CONDITIONS tON Turn-ON time RL = 10 Ω, CL = 0.1 μF, VIN = 0.9V 160 tOFF Turn-OFF time RL = 10 Ω, CL = 0.1 μF, VIN = 0.9V 20 20 μs tr VOUT rise time RL = 10 Ω, CL = 0.1 μF, VIN = 0.9V 81 500 μs tf VOUT fall time RL = 10 Ω, CL = 0.1 μF, VIN = 0.9V 5 5 μs Copyright © 2011–2015, Texas Instruments Incorporated Product Folder Links: TPS22924B TPS22924C Submit Documentation Feedback 5 TPS22924B, TPS22924C SLVSAR3E – APRIL 2011 – REVISED DECEMBER 2015 www.ti.com 7.8 Typical Characteristics Figure 1. On-State Resistance vs Input Voltage Figure 2. On-State Resistance vs Temperature Figure 3. Input Current, Quiescent vs Input Voltage Figure 4. Input Current, Leak vs Input Voltage Figure 5. On Input Threshold 6 Submit Documentation Feedback Copyright © 2011–2015, Texas Instruments Incorporated Product Folder Links: TPS22924B TPS22924C TPS22924B, TPS22924C www.ti.com SLVSAR3E – APRIL 2011 – REVISED DECEMBER 2015 7.9 AC Characteristics (TPS22924B) VIN = 3.6 V, CL = 0.1 µF, RL = 10 Ω VIN = 3.6 V, CL = 0.1 µF, RL = 10 Ω Figure 7. Turn-Off Time vs Temperature Figure 6. Turn-On Time vs Temperature VIN = 3.6 V, CL = 0.1 µF, RL = 10 Ω VIN = 3.6 V, CL = 0.1 µF, RL = 10 Ω Figure 8. Rise Time vs Temperature VIN = 0.9 V, CL = 0.1 µF, RL = 10 Ω Figure 9. Fall Time vs Temperature VIN = 0.9 V, CL = 0.1 µF, RL = 10 Ω Figure 10. Turn-On Time vs Temperature Figure 11. Turn-Off Time vs Temperature Copyright © 2011–2015, Texas Instruments Incorporated Product Folder Links: TPS22924B TPS22924C Submit Documentation Feedback 7 TPS22924B, TPS22924C SLVSAR3E – APRIL 2011 – REVISED DECEMBER 2015 www.ti.com AC Characteristics (TPS22924B) (continued) VIN = 0.9 V, CL = 0.1 µF, RL = 10 Ω VIN = 0.9 V, CL = 0.1 µF, RL = 10 Ω Figure 12. Rise Time vs Temperature VON = 1.8 V, CL = 0.1 µF, RL = 10 Ω Figure 13. Fall Time vs Temperature VON = 1.8 V, CL = 20 µF, RL = 10 Ω Figure 14. Rise Time vs Input Voltage Figure 15. Rise Time vs Input Voltage CIN = 1 µF, CL = 0.1 µF, RL = 10 Ω, VIN = 0.9 V, TA = 25°C CIN = 1 µF, CL = 0.1 µF, RL = 10 Ω, VIN = 0.9 V, TA = 25°C Figure 17. Turn-Off Response Figure 16. Turn-On Response 8 Submit Documentation Feedback Copyright © 2011–2015, Texas Instruments Incorporated Product Folder Links: TPS22924B TPS22924C TPS22924B, TPS22924C www.ti.com SLVSAR3E – APRIL 2011 – REVISED DECEMBER 2015 AC Characteristics (TPS22924B) (continued) CIN = 47 µF, CL = 20 µF, RL = 10 Ω, VIN = 0.9 V, TA = 25°C CIN = 47 µF, CL = 20 µF, RL = 10 Ω, VIN = 0.9 V, TA = 25°C Figure 18. Turn-On Response Figure 19. Turn-Off Response CIN = 1 µF, CL = 0.1 µF, RL = 10 Ω, VIN = 3.6 V, TA = 25°C CIN = 1 µF, CL = 0.1 µF, RL = 10 Ω, VIN = 3.6 V, TA = 25°C Figure 20. Turn-On Response Figure 21. Turn-Off Response CIN = 47 µF, CL = 20 µF, RL = 10 Ω, VIN = 3.6 V, TA = 25°C Figure 22. Turn-On Response CIN = 47 µF, CL = 20 µF, RL = 10 Ω, VIN = 3.6 V, TA = 25°C Figure 23. Turn-Off Response Copyright © 2011–2015, Texas Instruments Incorporated Product Folder Links: TPS22924B TPS22924C Submit Documentation Feedback 9 TPS22924B, TPS22924C SLVSAR3E – APRIL 2011 – REVISED DECEMBER 2015 www.ti.com 7.10 AC Characteristics (TPS22924C) 3.1 1200 3.05 1000 3 800 tOFF (µs) tON (µs) 2.95 600 2.9 2.85 400 2.8 200 2.75 0 -40 -15 10 35 60 2.7 -40 85 -15 10 35 60 85 Tem perature (°C) Tem perature (°C) VIN = 3.6 V, CL = 0.1 µF, RL = 10 Ω VIN = 3.6 V, CL = 0.1 µF, RL = 10 Ω Figure 25. Turn-Off Time vs Temperature 1000 2.4 900 2.38 800 2.36 700 2.34 600 2.32 tF (µs) tR (µs) Figure 24. Turn-On Time vs Temperature 500 2.3 400 2.28 300 2.26 200 2.24 100 2.22 0 -40 -15 10 35 60 2.2 -40 85 -15 Tem perature (°C) 10 35 60 85 Tem perature (°C) VIN = 3.6 V, CL = 0.1 µF, RL = 10 Ω VIN = 3.6 V, CL = 0.1 µF, RL = 10 Ω Figure 26. Rise Time vs Temperature Figure 27. Fall Time vs Temperature 1400 20 18 1200 16 14 12 800 tOFF (µs) tON (µs) 1000 600 10 8 6 400 4 200 2 0 -40 -15 10 35 60 85 0 -40 -15 Tem perature (°C) VIN = 0.9 V, CL = 0.1 µF, RL = 10 Ω Submit Documentation Feedback 35 60 85 VIN = 0.9 V, CL = 0.1 µF, RL = 10 Ω Figure 28. Turn-On Time vs Temperature 10 10 Tem perature (°C) Figure 29. Turn-Off Time vs Temperature Copyright © 2011–2015, Texas Instruments Incorporated Product Folder Links: TPS22924B TPS22924C TPS22924B, TPS22924C www.ti.com SLVSAR3E – APRIL 2011 – REVISED DECEMBER 2015 AC Characteristics (TPS22924C) (continued) 700 6 600 5 500 tF (µs) tR (µs) 4 400 3 300 2 200 1 100 0 -40 -15 10 35 60 0 -40 85 -15 10 Tem perature (°C) 35 60 85 Tem perature (°C) VIN = 0.9 V, CL = 0.1 µF, RL = 10 Ω VIN = 0.9 V, CL = 0.1 µF, RL = 10 Ω Figure 30. Rise Time vs Temperature Figure 31. Fall Time vs Temperature 1400 1200 TA = -40°C TA = -40°C 1200 TA = 25°C 1000 TA = 25°C TA = 85°C TA = 85°C 1000 tR (µs) tR (µs) 800 800 600 600 400 400 200 200 0 0 0 0.5 1 1.5 2 2.5 3 3.5 4 0 0.5 V IN (V) 1 1.5 2 2.5 3 3.5 4 V IN (V) VON = 1.8 V, CL = 0.1 µF, RL = 10 Ω VON = 1.8 V, CL = 20 µF, RL = 10 Ω Figure 32. Rise Time vs Input Voltage Figure 33. Rise Time vs Input Voltage CIN = 1 µF, CL = 0.1 µF, RL = 10 Ω, VIN = 0.9 V, TA = 25°C CIN = 1 µF, CL = 0.1 µF, RL = 10 Ω, VIN = 0.9 V, TA = 25°C Figure 35. Turn-Off Response Figure 34. Turn-On Response Copyright © 2011–2015, Texas Instruments Incorporated Product Folder Links: TPS22924B TPS22924C Submit Documentation Feedback 11 TPS22924B, TPS22924C SLVSAR3E – APRIL 2011 – REVISED DECEMBER 2015 www.ti.com AC Characteristics (TPS22924C) (continued) CIN = 47 µF, CL = 20 µF, RL = 10 Ω, VIN = 0.9 V, TA = 25°C CIN = 47 µF, CL = 20 µF, RL = 10 Ω, VIN = 0.9 V, TA = 25°C Figure 36. Turn-On Response Figure 37. Turn-Off Response CIN = 1 µF, CL = 0.1 µF, RL = 10 Ω, VIN = 3.6 V, TA = 25°C CIN = 1 µF, CL = 0.1 µF, RL = 10 Ω, VIN = 3.6 V, TA = 25°C Figure 38. Turn-On Response Figure 39. Turn-Off Response CIN = 47 µF, CL = 20 µF, RL = 10 Ω, VIN = 3.6 V, TA = 25°C Figure 40. Turn-On Response 12 Submit Documentation Feedback CIN = 47 µF, CL = 20 µF, RL = 10 Ω, VIN = 3.6 V, TA = 25°C Figure 41. Turn-Off Response Copyright © 2011–2015, Texas Instruments Incorporated Product Folder Links: TPS22924B TPS22924C TPS22924B, TPS22924C www.ti.com SLVSAR3E – APRIL 2011 – REVISED DECEMBER 2015 8 Parameter Measurement Information Figure 42. Test Circuit and tON/tOFF Waveforms Copyright © 2011–2015, Texas Instruments Incorporated Product Folder Links: TPS22924B TPS22924C Submit Documentation Feedback 13 TPS22924B, TPS22924C SLVSAR3E – APRIL 2011 – REVISED DECEMBER 2015 www.ti.com 9 Detailed Description 9.1 Overview The TPS22924x is a single channel, 2-A load switch in a small, space-saving CSP-6 package. This device implements a low resistance N-channel MOSFET with a controlled rise time for applications that need to limit the inrush current. This device is also designed to have very low leakage current during off state. This prevents downstream circuits from pulling high standby current from the supply. Integrated control logic, driver, power supply, and output discharge FET eliminates the need for additional external components, which reduces solution size and bill of materials (BOM) count. 9.2 Functional Block Diagram VIN Charge Pump ON Control Logic VOUT GND 9.3 Feature Description 9.3.1 ON/OFF Control The ON pin controls the state of the switch. Asserting ON high enables the switch. ON is active high and has a low threshold, making it capable of interfacing with low-voltage signals. The ON pin is compatible with standard GPIO logic threshold. It can be used with any microcontroller with 1.2-V, 1.8-V, 2.5-V or 3.3-V GPIOs. 9.3.2 Output Capacitor Due to the integral body diode in the NMOS switch, a CIN greater than CL is highly recommended. A CL greater than CIN can cause VOUT to exceed VIN when the system supply is removed. This could result in current flow through the body diode from VOUT to VIN. A CIN to CL ratio of 10 to 1 is recommended for minimizing VIN dip caused by inrush currents during startup. 9.3.3 Output Pulldown The output pulldown is active when the user is turning off the main pass FET. The pulldown discharges the output rail to approximately 10% of the rail, then the output pulldown is automatically disconnected to optimize the shutdown current. 14 Submit Documentation Feedback Copyright © 2011–2015, Texas Instruments Incorporated Product Folder Links: TPS22924B TPS22924C TPS22924B, TPS22924C www.ti.com SLVSAR3E – APRIL 2011 – REVISED DECEMBER 2015 9.4 Device Functional Modes (1) ON (CONTROL SIGNAL) VIN to VOUT VOUT to GND L OFF ON H ON OFF (1) See application section Output Pulldown . Copyright © 2011–2015, Texas Instruments Incorporated Product Folder Links: TPS22924B TPS22924C Submit Documentation Feedback 15 TPS22924B, TPS22924C SLVSAR3E – APRIL 2011 – REVISED DECEMBER 2015 www.ti.com 10 Application and Implementation NOTE Information in the following applications sections is not part of the TI component specification, and TI does not warrant its accuracy or completeness. TI’s customers are responsible for determining suitability of components for their purposes. Customers should validate and test their design implementation to confirm system functionality. 10.1 Application Information 10.1.1 VIN to VOUT Voltage Drop The VIN to VOUT voltage drop in the device is determined by the RON of the device and the load current. The RON of the device depends upon the VIN condition of the device. Refer to the RON specification of the device in the Electrical Characteristics table of this datasheet. Once the RON of the device is determined based upon the VIN conditions, use Equation 1 to calculate the VIN to VOUT voltage drop: ΔV = ILOAD × RON where • • • • ΔV = Voltage drop from VIN to VOUT ILOAD = Load current RON = On-resistance of the device for a specific VIN An appropriate ILOAD must be chosen such that the IMAX specification of the device is not violated. (1) 10.1.2 Input Capacitor To limit the voltage drop on the input supply caused by transient inrush currents, when the switch turns on into a discharged load capacitor or short-circuit, a capacitor needs to be placed between VIN and GND. A 1-μF ceramic capacitor, CIN, placed close to the pins is usually sufficient. Higher values of CIN can be used to further reduce the voltage drop. 10.1.3 Output Capacitor A CIN to CL ratio of 10 to 1 is recommended for minimizing VIN dip caused by inrush currents during startup. 10.2 Typical Application Figure 43. Typical Application 10.2.1 Design Requirements DESIGN PARAMETER EXAMPLE VALUE VIN 3.6 V CL 1 µF Maximum Acceptable Inrush Current 40 mA 16 Submit Documentation Feedback Copyright © 2011–2015, Texas Instruments Incorporated Product Folder Links: TPS22924B TPS22924C TPS22924B, TPS22924C www.ti.com SLVSAR3E – APRIL 2011 – REVISED DECEMBER 2015 10.2.2 Detailed Design Procedure 10.2.2.1 Managing Inrush Current When the switch is enabled, the output capacitors must be charged up from 0-V to VIN. This charge arrives in the form of inrush current. Inrush current can be calculated using the following equation: dv Inrush Current = C ´ dt where • C = Output capacitance • dv dt = Output slew rate (2) The TPS22924B offers a very slow controlled rise time for minimizing inrush current. This device can be selected based upon the maximum acceptable slew rate which can be calculated using the design requirements and the inrush current equation. An output capacitance of 1.0 μF will be used since the amount of inrush increases with output capacitance: dv 40 mA = 1.0 mF ´ dt (3) dv = 40 V/ms dt (4) To ensure an inrush current of less than 40 mA, a device with a slew rate less than 40 V/ms must be used. The TPS22924B has a typical rise time of 96 μs at 3.6 V. This results in a slew rate of 37.5 V/ms which meets the above design requirements. For an even lower inrush current requirement, the TPS22924C can be used. The slower rise time of 800 μs at 3.6V results in a slew rate of 4.5 V/ms, well below the design requirements. 10.2.3 Application Curve VIN = 3.6 V CL = 1 µF TA = 25°C Figure 44. TPS22924B Inrush Current With a 1 µF Capacitor VIN = 3.6 V CL = 1 µF TA = 25°C Figure 45. TPS22924C Inrush Current With a 1 µF Capacitor Copyright © 2011–2015, Texas Instruments Incorporated Product Folder Links: TPS22924B TPS22924C Submit Documentation Feedback 17 TPS22924B, TPS22924C SLVSAR3E – APRIL 2011 – REVISED DECEMBER 2015 www.ti.com 11 Power Supply Recommendations The device is designed to operate with a VIN range of 0.75 V to 3.6 V. This supply must be well regulated and placed as close to the device terminal as possible with the recommended 1 µF bypass capacitor. If the supply is located more than a few inches from the device terminals, additional bulk capacitance may be required in addition to the ceramic bypass capacitors. If additional bulk capacitance is required, an electrolytic, tantalum, or ceramic capacitor of 10 µF may be sufficient. 12 Layout 12.1 Layout Guidelines For best performance, all traces should be as short as possible. To be most effective, the input and output capacitors should be placed close to the device to minimize the effects that parasitic trace inductances may have on normal and short-circuit operation. Using wide traces for VIN, VOUT, and GND helps minimize the parasitic electrical effects. 12.2 Layout Example Figure 46. TPS22924x Layout Example 18 Submit Documentation Feedback Copyright © 2011–2015, Texas Instruments Incorporated Product Folder Links: TPS22924B TPS22924C TPS22924B, TPS22924C www.ti.com SLVSAR3E – APRIL 2011 – REVISED DECEMBER 2015 13 Device and Documentation Support 13.1 Related Links The table below lists quick access links. Categories include technical documents, support and community resources, tools and software, and quick access to sample or buy. Table 2. Related Links PARTS PRODUCT FOLDER SAMPLE & BUY TECHNICAL DOCUMENTS TOOLS & SOFTWARE SUPPORT & COMMUNITY TPS22924B Click here Click here Click here Click here Click here TPS22924C Click here Click here Click here Click here Click here 13.2 Community Resources The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of Use. TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help solve problems with fellow engineers. Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and contact information for technical support. 13.3 Trademarks E2E is a trademark of Texas Instruments. All other trademarks are the property of their respective owners. 13.4 Electrostatic Discharge Caution These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates. 13.5 Glossary SLYZ022 — TI Glossary. This glossary lists and explains terms, acronyms, and definitions. 14 Mechanical, Packaging, and Orderable Information The following pages include mechanical, packaging, and orderable information. This information is the most current data available for the designated devices. This data is subject to change without notice and revision of this document. For browser-based versions of this data sheet, refer to the left-hand navigation. Copyright © 2011–2015, Texas Instruments Incorporated Product Folder Links: TPS22924B TPS22924C Submit Documentation Feedback 19 PACKAGE OPTION ADDENDUM www.ti.com 10-Dec-2020 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan (2) Lead finish/ Ball material MSL Peak Temp Op Temp (°C) Device Marking (3) (4/5) (6) TPS22924BYZPRB ACTIVE DSBGA YZP 6 3000 RoHS & Green SNAGCU Level-1-260C-UNLIM -40 to 85 5N TPS22924BYZR ACTIVE DSBGA YZ 6 3000 RoHS & Green SNAGCU Level-1-260C-UNLIM -40 to 85 5N TPS22924BYZT ACTIVE DSBGA YZ 6 250 RoHS & Green SNAGCU Level-1-260C-UNLIM -40 to 85 5N TPS22924BYZZR ACTIVE DSBGA YZZ 6 3000 RoHS & Green SNAGCU Level-1-260C-UNLIM -40 to 85 7A TPS22924BYZZT ACTIVE DSBGA YZZ 6 250 RoHS & Green SNAGCU Level-1-260C-UNLIM -40 to 85 7A TPS22924CYZPR ACTIVE DSBGA YZP 6 3000 RoHS & Green SNAGCU Level-1-260C-UNLIM -40 to 85 (5L, 5LG) TPS22924CYZPRB ACTIVE DSBGA YZP 6 3000 RoHS & Green SNAGCU Level-1-260C-UNLIM -40 to 85 5L TPS22924CYZPT ACTIVE DSBGA YZP 6 250 RoHS & Green SNAGCU Level-1-260C-UNLIM -40 to 85 (5LF, 5LG) (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may reference these types of products as "Pb-Free". RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption. Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of