TPS22925BYPHR

Sample & Buy Product Folder Technical Documents Support & Community Tools & Software TPS22925 SLVS840D – NOVEMBER 2015 – REVISED AUGUST 2016 TPS22925 3.6-V, 3-A, 9-mΩ On-Resistance Load Switch 1 Features 3 Description • • The TPS22925 product family consists of four devices: TPS22925B, TPS22925BN, TPS22925C, and TPS22925CN. Each device is a 9-mΩ, singlechannel load switch with a controlled slew rate. 1 • • • • • • • • Input Voltage Range: 0.65 V to 3.6 V On-Resistance – RON = 9.2 mΩ at VIN = 3.6 V – RON = 9.2 mΩ at VIN = 1.8 V – RON = 10.2 mΩ at VIN = 1 V – RON = 13.1 mΩ at VIN = 0.65 V 3-A Maximum Continuous Switch Current Quiescent Current, IQ,VIN = 29 µA at VIN = 3.6 V Low Control Input Threshold Enables 1.5-, 1.8-, 2.5-, or 3.3-V Logic Controlled Slew Rate – tR = 97 µs at VIN = 3.6 V (TPS22925Bx) – tR = 810 µs at VIN = 3.6 V (TPS22925Cx) Reverse Current Blocking (When Disabled) Quick Output Discharge (QOD) (TPS22925B and TPS22925C only) Wafer Chip Scale Package: – 0.9 mm x 1.4 mm, 0.5-mm Pitch, 0.4-mm Height ESD Performance Tested per JESD 22 – 2-kV HBM and 1-kV CDM 2 Applications • • • • • Computing SSD Tablets Wearables EPOS The devices contain an N–channel MOSFET that can operate over an input voltage range of 0.65 V to 3.6 V and can support a maximum continuous current of 3 A. This continuous current enables the devices to be used across multiple designs and end equipments. Each of the TPS22925 devices provides reverse current blocking when disabled allowing for power supply protection and power multiplexing capabilities. The controlled rise time for the device greatly reduces inrush current caused by large bulk load capacitances, thereby reducing or eliminating power supply droop. When operating with an input voltage of 3.6 V, the TPS22925Bx devices feature a 97 μs rise time and the TPS22925Cx devices feature an 810 μs rise time. The TPS22925 family of devices can help reduce the total solution size by offering an optional integrated, 150-Ω pull–down resistor for quick output discharge (QOD) when the switch is turned off. Each of the TPS22925 devices is available in a 0.9 mm × 1.4 mm, 0.5-mm pitch, 0.4-mm height 6–pin wafer chip scale package (WCSP) allowing for smaller, more integrated designs. The WCSP and 9 mΩ of onresistance allow use in space constrained, battery powered applications. The device is characterized for operation over the free–air temperature range of –40°C to +105°C. Device Information(1) PART NUMBER PACKAGE BODY SIZE (NOM) TPS22925B TPS22925BN DSBGA (6) TPS22925C 0.90 mm × 1.40 mm TPS22925CN (1) For all available packages, see the orderable addendum at the end of the data sheet. On-Resistance vs Input Voltage Simplified Application 18 VBATT SMPS TPS22925 TA = -40°C TA = 25°C TA = 85°C TA = 105°C 17 VIN VOUT CIN CL On Off ON GND RL On-Resistance (m:) 16 15 14 13 12 11 10 9 8 7 0.6 0.9 1.2 1.5 1.8 2.1 2.4 Input Voltage (V) 2.7 3 3.3 3.6 D005 1 An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications, intellectual property matters and other important disclaimers. PRODUCTION DATA. TPS22925 SLVS840D – NOVEMBER 2015 – REVISED AUGUST 2016 www.ti.com Table of Contents 1 2 3 4 5 6 7 Features .................................................................. Applications ........................................................... Description ............................................................. Revision History..................................................... Device Comparison Table..................................... Pin Configuration and Functions ......................... Specifications......................................................... 7.1 7.2 7.3 7.4 7.5 7.6 7.7 7.8 8 1 1 1 2 3 3 4 Absolute Maximum Ratings ...................................... 4 ESD Ratings.............................................................. 4 Recommended Operating Conditions....................... 4 Thermal Information .................................................. 4 Electrical Characteristics........................................... 5 Switching Characteristics .......................................... 6 Typical Characteristics .............................................. 8 Typical Characteristics ............................................ 11 Detailed Description ............................................ 13 8.1 Overview ................................................................. 13 8.2 Functional Block Diagram ....................................... 13 8.3 Feature Description................................................. 13 8.4 Device Functional Modes........................................ 15 9 Application and Implementation ........................ 16 9.1 Application Information............................................ 16 9.2 Typical Application ................................................. 18 10 Power Supply Recommendations ..................... 19 11 Layout................................................................... 20 11.1 Layout Guidelines ................................................. 20 11.2 Layout Example .................................................... 20 12 Device and Documentation Support ................. 21 12.1 12.2 12.3 12.4 12.5 12.6 Documentation Support ....................................... Receiving Notification of Documentation Updates Community Resources.......................................... Trademarks ........................................................... Electrostatic Discharge Caution ............................ Glossary ................................................................ 21 21 21 21 21 21 13 Mechanical, Packaging, and Orderable Information ........................................................... 21 4 Revision History Changes from Revision C (February 2016) to Revision D • Made changes to the ESD Ratings table ............................................................................................................................... 4 Changes from Revision B (January 2016) to Revision C • 2 Page Deleted the STATUS column from the Device Comparison Table ........................................................................................ 3 Changes from Original (November 2015) to Revision A • Page Made changes to Device Comparison Table ........................................................................................................................ 1 Changes from Revision A (December 2015) to Revision B • Page Page Updated document status from Product Preview to Production Data .................................................................................... 1 Submit Documentation Feedback Copyright © 2015–2016, Texas Instruments Incorporated Product Folder Links: TPS22925 TPS22925 www.ti.com SLVS840D – NOVEMBER 2015 – REVISED AUGUST 2016 5 Device Comparison Table DEVICE QOD TPS22925B Yes TPS22925BN No TPS22925C Yes TPS22925CN No RON (mΩ) at VIN = 3.6 V tR (µs) at VIN = 3.6 V MAXIMUM OUTPUT CURRENT IMAX (A) ENABLE (ON PIN) 3 Active High 97 9.2 810 6 Pin Configuration and Functions YPH Package 6-Pin DSBGA Top View C C B B A A 2 1 Laser Marking View 1 2 Bump View Pin Assignments C GND ON B VOUT VIN A VOUT VIN 1 2 Pin Functions PIN TYPE DESCRIPTION NAME NO. GND C1 GND ON C2 I Switch control input. Active high. Do not leave floating. I Switch input; bypass this input with a ceramic capacitor to ground. See the Application Information section for more detail. O Switch output VIN VOUT A2 B2 A1 B1 Ground Submit Documentation Feedback Copyright © 2015–2016, Texas Instruments Incorporated Product Folder Links: TPS22925 3 TPS22925 SLVS840D – NOVEMBER 2015 – REVISED AUGUST 2016 www.ti.com 7 Specifications 7.1 Absolute Maximum Ratings over operating free–air temperature range (unless otherwise noted) (1) MIN MAX UNIT VIN, ON Input voltage –0.3 4 V VOUT Output voltage –0.3 4 V IMAX Maximum continuous switch current at TA = 60°C 3 A IPLS Maximum pulsed switch current, 100–μs pulse, 2% duty cycle 4 A TJ Junction temperature 125 °C Tstg Storage temperature 150 °C (1) –65 Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute–maximum–rated conditions for extended periods may affect device reliability. 7.2 ESD Ratings VALUE V(ESD) (1) (2) Electrostatic discharge Human–body model (HBM), per ANSI/ESDA/JEDEC JS–001 (1) ±2000 Charged–device model (CDM), per JEDEC specification JESD22–C101 (2) ±1000 UNIT V JEDEC document JEP155 states that 500–V HBM allows safe manufacturing with a standard ESD control process. Manufacturing with less than 500–V HBM is possible with the necessary precautions. JEDEC document JEP157 states that 250–V CDM allows safe manufacturing with a standard ESD control process. Manufacturing with less than 250–V CDM is possible with the necessary precautions. 7.3 Recommended Operating Conditions over operating free-air temperature range (unless otherwise noted) MIN MAX 0.65 3.6 V 0 3.6 V 0.9 3.6 V 0 0.45 VIN Input voltage VOUT Output voltage VIH High–level input voltage, ON VIL Low–level input voltage, ON CIN Input capacitance 1 TA Operating free–air temperature UNIT V µF –40 105 °C 7.4 Thermal Information TPS22925xx THERMAL METRIC (1) YPH (DSBGA) UNIT 6 PINS RθJA Junction–to–ambient thermal resistance 110.9 °C/W RθJC(top) RθJB Junction–to–case (top) thermal resistance 1.2 °C/W Junction–to–board thermal resistance 30.4 °C/W ψJT Junction–to–top characterization parameter 0.8 °C/W ψJB Junction–to–board characterization parameter 30.4 °C/W (1) 4 For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report, SPRA953. Submit Documentation Feedback Copyright © 2015–2016, Texas Instruments Incorporated Product Folder Links: TPS22925 TPS22925 www.ti.com SLVS840D – NOVEMBER 2015 – REVISED AUGUST 2016 7.5 Electrical Characteristics over operating free–air temperature range (unless otherwise noted). Typical values are for TA = 25°C. PARAMETER TEST CONDITIONS VIN = 3.6 V VIN = 2.5 V VIN = 1.8 V IQ,VIN Quiescent current VON = 3.6 V, IOUT = 0 A VIN = 1.2 V VIN = 1 V VIN = 0.65 V VIN = 3.6 V VIN = 2.5 V VIN = 1.8 V ISD,VIN VIN shutdown current VON = 0 V, VOUT = 0 V VIN = 1.2 V VIN = 1 V VIN = 0.65 V ION ON pin input leakage current 0.9 V ≤ VON ≤ 3.6 V IRC,VIN Reverse current when disabled VIN = VON = 0 V, VOUT = 3.6 V TA –40°C to +85°C –40°C to +85°C RON On-resistance IOUT = –200 mA –40°C to +85°C –40°C to +85°C 71 –40°C to +85°C 26 10 0.5 4 3 0.5 3 5 0.5 3 5 –40°C to +105°C 0.1 –40°C to +85°C –0.2 –40°C to +105°C –2.5 –6 9.2 15 –40°C to +105°C 16 9.2 15 –40°C to +105°C 16 13 –40°C to +85°C 15 –40°C to +105°C 16 9.5 –40°C to +85°C 14 17 10.2 –40°C to +85°C 15 17 18 13.1 20 –40°C to +85°C 23 –40°C to +105°C 25 Submit Documentation Feedback Product Folder Links: TPS22925 mΩ 16 –40°C to +105°C Copyright © 2015–2016, Texas Instruments Incorporated µA 13 –40°C to +85°C 9.2 µA 13 –40°C to +85°C 25°C µA 5 –40°C to +105°C 25°C VIN = 0.65 V 4 6 0.5 –40°C to +105°C VIN = 1 V 5 6 0.5 –40°C to +105°C –40°C to +85°C 39 9 –40°C to +105°C –40°C to +85°C 50 49 0.5 –40°C to +105°C –40°C to +85°C µA 60 –40°C to +105°C –40°C to +85°C 55 66 16 –40°C to +105°C –40°C to +85°C 65 76 20 –40°C to +105°C –40°C to +85°C 67 79 –40°C to +105°C –40°C to +85°C UNIT 84 28 –40°C to +105°C 25°C VIN = 1.2 V 29 –40°C to +105°C 25°C VIN = 1.8 V MAX –40°C to +105°C 25°C VIN = 2.5 V TYP –40°C to +105°C 25°C VIN = 3.6 V MIN 5 TPS22925 SLVS840D – NOVEMBER 2015 – REVISED AUGUST 2016 www.ti.com Electrical Characteristics (continued) over operating free–air temperature range (unless otherwise noted). Typical values are for TA = 25°C. PARAMETER VHYS ON pin hysteresis TEST CONDITIONS TA MIN TYP VIN = 3.6 V 86 VIN = 2.5 V 83 VIN = 1.8 V 82 25°C VIN = 1.2 V 79 VIN = 0.65 V (1) Output pull-down resistance UNIT mV 80 VIN = 1 V RPD (1) MAX 79 –40°C to +85°C VIN = VOUT = 3.6 V, VON = 0 V 150 –40°C to +105°C 205 215 Ω Applies to TPS22925B and TPS22925C only. 7.6 Switching Characteristics (1) over operating free-air temperature range (unless otherwise noted) VON = 3.6 V, RL = 10 Ω, CIN = 1 µF, CL = 0.1 µF,TA = 25°C PARAMETER tON tOFF tR tF tD (1) 6 Turnon time Turnoff time Output voltage rise time Output voltage fall time Delay time TYP (TPS22925Bx) TYP (TPS22925Cx) VIN = 3.6 V 110 900 VIN = 1.8 V 94 730 VIN = 0.65 V 86 620 VIN = 3.6 V 3 3 TEST CONDITIONS VIN = 1.8 V 2.7 2.7 VIN = 0.65 V 10.9 10.9 VIN = 3.6 V 97 810 VIN = 1.8 V 61 520 VIN = 0.65 V 36 300 VIN = 3.6 V 2.2 2.2 VIN = 1.8 V 2.1 2.1 VIN = 0.65 V 3.6 3.6 VIN = 3.6 V 64 500 VIN = 1.8 V 66 490 VIN = 0.65 V 68 470 UNIT µs µs µs µs µs Turn-off time and fall time are dependent on the time constant at the load. For TPS22925BN and TPS22925CN, there is no QOD. The time constant is RL× CL. For TPS22925B and TPS22925C, internal pull-down resistor RPD is enabled when the switch is disabled. The time constant is (RPD || RL) × CL. Submit Documentation Feedback Copyright © 2015–2016, Texas Instruments Incorporated Product Folder Links: TPS22925 TPS22925 www.ti.com SLVS840D – NOVEMBER 2015 – REVISED AUGUST 2016 TPS22925 VIN + ± VBATT VOUT CL CIN On Off ON RL GND Figure 1. Timing Test Circuit VON 50% 50% tOFF tON VOUT 50% 50% tF tR 90% VOUT 10% 10% 90% 10% tD Rise times and fall times of the control signal is 100 ns. Figure 2. Timing Waveforms Submit Documentation Feedback Copyright © 2015–2016, Texas Instruments Incorporated Product Folder Links: TPS22925 7 TPS22925 SLVS840D – NOVEMBER 2015 – REVISED AUGUST 2016 www.ti.com 45 3.5 40 3 VIN Shutdown Current (PA) Quiescent Current (PA) 7.7 Typical Characteristics 35 30 25 20 15 TA = -40°C TA = 25°C TA = 85°C TA = 105°C 10 5 0.6 0.9 1.2 1.5 VON = 3.6 V 1.8 2.1 2.4 Input Voltage (V) 2.7 3 3.3 TA = -40°C TA = 25°C TA = 85°C TA = 105°C 2.5 2 1.5 1 0.5 0 0.6 3.6 IOUT = 0 A Figure 3. Quiescent Current vs Input Voltage 1.8 2.1 2.4 Input Voltage (V) 2.7 3 3.3 3.6 D001 D002 VOUT = 0 V Figure 4. Input Shutdown Current vs Input Voltage VIN = 0.65V VIN = 1.8V VIN = 3.6V VIN = 0.65V VIN = 1.8V VIN = 3.6V 17 16 18 On-Resistance (m:) On-Resistance (m:) 1.5 18 20 16 14 12 10 15 14 13 12 11 8 10 9 -20 0 20 40 60 80 100 Junction Temperature (qC) VON = 3.6 V 120 140 160 0 0.3 0.6 0.9 D003 IOUT = –200 mA VON = 3.6 V Figure 5. On-Resistance vs Temperature 1.2 1.5 1.8 2.1 Output Current (A) 2.4 2.7 3 D004 TA = 25°C Figure 6. On-Resistance vs Output Current 18 24 TA = -40°C TA = 25°C TA = 85°C TA = 105°C 16 15 TA = -40°C TA = 25°C TA = 85°C TA = 105°C 22 On-Resistance (m:) 17 On-Resistance (m:) 1.2 VON = 0 V 22 6 -40 0.9 D001 14 13 12 11 10 20 18 16 14 12 9 10 8 7 0.6 VON = 3.6 V 0.9 1.2 1.5 1.8 2.1 2.4 Input Voltage (V) 2.7 3 3.3 3.6 8 0.6 0.9 D005 IOUT = –200 mA VON = 3.6 V Figure 7. On-Resistance vs Input Voltage 8 Submit Documentation Feedback 1.2 1.5 1.8 2.1 2.4 Input Voltage (V) 2.7 3 3.3 3.6 D006 IOUT = –3 A Figure 8. On-Resistance vs Input Voltage Copyright © 2015–2016, Texas Instruments Incorporated Product Folder Links: TPS22925 TPS22925 www.ti.com SLVS840D – NOVEMBER 2015 – REVISED AUGUST 2016 Typical Characteristics (continued) 100 TA = -40°C TA = 25°C TA = 85°C TA = 105°C 800 TA = -40°C TA = 25°C 95 ON Pin Hysteresis (mV) Output Pull-Down Resistance (:) 1000 600 400 90 85 80 75 70 200 65 0 0.6 0.9 1.2 1.5 VON = 0 V 1.8 2.1 2.4 Input Voltage (V) 2.7 3 3.3 60 0.6 3.6 0.9 TA = 85°C TA = 105°C 750 740 730 720 710 0.6 0.9 1.2 1.5 1.8 2.1 2.4 Input Voltage (V) 1.8 2.1 2.4 Input Voltage (V) 2.7 2.7 3 3.3 3.6 D008 Figure 10. Hysteresis vs Input Voltage Maximum Low-Level Input Voltage, ON (mV) Minimum High-Level Input Voltage, ON (mV) 770 760 1.5 IOUT = 0 A VOUT = VIN TA = -40°C TA = 25°C 1.2 D007 Figure 9. Output Pull-Down Resistance vs Input Voltage 3 3.3 3.6 675 TA = -40°C TA = 25°C 670 TA = 85°C TA = 105°C 665 660 655 650 645 0.6 0.9 1.2 1.5 1.8 2.1 2.4 Input Voltage (V) D009 IOUT = 0 A 2.7 3 3.3 3.6 D0010 IOUT = 0 A Figure 11. High-Level Input Voltage vs Input Voltage Figure 12. Low-Level Input Voltage vs Input Voltage 140 1200 TA = -40°C TA = 25°C TA = 85°C TA = 105°C 120 Turn-on Time (Ps) 1000 Turn-on Time (Ps) TA = 85°C TA = 105°C 100 80 800 600 60 TA = -40°C TA = 25°C 40 0.6 0.9 1.2 1.5 VON rising from 0 V to 3.6 V CL = 0.1 μF 1.8 2.1 2.4 Input Voltage (V) 2.7 TA = 85°C TA = 105°C 3 3.3 3.6 400 0.6 0.9 1.2 1.5 1.8 2.1 2.4 Input Voltage (V) D0011 CIN = 1 μF RL = 10 Ω VON rising from 0 V to 3.6 V CL = 0.1 μF Figure 13. Turn-on Time vs Input Voltage (TPS22925Bx) 2.7 3 3.3 3.6 D0012 CIN = 1 μF RL = 10 Ω Figure 14. Turn-On Time vs Input Voltage (TPS22925Cx) Submit Documentation Feedback Copyright © 2015–2016, Texas Instruments Incorporated Product Folder Links: TPS22925 9 TPS22925 SLVS840D – NOVEMBER 2015 – REVISED AUGUST 2016 www.ti.com Typical Characteristics (continued) 12 120 TA = -40°C TA = 25°C TA = 85°C TA = 105°C 100 Rise Time (Ps) Turn-off Time (Ps) 10 8 6 4 80 60 40 2 0.6 0.9 1.2 1.5 1.8 2.1 2.4 Input Voltage (V) VON falling from 3.6 V to 0 V CL = 0.1 μF 2.7 3 3.3 20 0.6 3.6 0.9 1.2 1.5 1.8 2.1 2.4 Input Voltage (V) D0013 CIN = 1 μF RL = 10 Ω VON rising from 0 V to 3.6 V CL = 0.1 μF Figure 15. Turn-Off Time vs Input Voltage 2.7 3 3.3 3.6 D0014 CIN = 1 μF RL = 10 Ω Figure 16. Rise Time vs Input Voltage (TPS22925Bx) 3.8 1000 TA = -40°C TA = 25°C TA = 85°C TA = 105°C TA = -40°C TA = 25°C TA = 85°C TA = 105°C 3.6 3.4 Fall Time (Ps) 800 Rise Time (Ps) TA = -40°C TA = 25°C TA = 85°C TA = 105°C 600 400 3.2 3 2.8 2.6 2.4 2.2 200 0.6 0.9 1.2 1.5 1.8 2.1 2.4 Input Voltage (V) VON rising from 0 V to 3.6 V CL = 0.1 μF 2.7 3 3.3 2 0.6 3.6 0.9 1.2 1.5 D0015 CIN = 1 μF RL = 10 Ω 1.8 2.1 2.4 Input Voltage (V) VON falling from 3.6 V to 0 V CL = 0.1 μF Figure 17. Rise Time vs Input Voltage (TPS22925Cx) 2.7 3 3.3 3.6 D0016 CIN = 1 μF RL = 10 Ω Figure 18. Fall Time vs Input Voltage 90 700 80 70 TA = 85°C TA = 105°C Delay Time (Ps) Delay Time (Ps) 600 TA = -40°C TA = 25°C 60 TA = 85°C TA = 105°C 500 400 50 40 0.6 0.9 1.2 1.5 1.8 2.1 2.4 Input Voltage (V) VON rising from 0 V to 3.6 V CL = 0.1 μF 2.7 3 3.3 3.6 300 0.6 0.9 1.2 1.5 D0017 CIN = 1 μF RL = 10 Ω VON rising from 0 V to 3.6 V CL = 0.1 μF Figure 19. Delay Time vs Input Voltage (TPS22925Bx) 10 TA = -40°C TA = 25°C 1.8 2.1 2.4 Input Voltage (V) 2.7 3 3.3 3.6 D0018 CIN = 1 μF RL = 10 Ω Figure 20. Delay Time vs Input Voltage (TPS22925Cx) Submit Documentation Feedback Copyright © 2015–2016, Texas Instruments Incorporated Product Folder Links: TPS22925 TPS22925 www.ti.com SLVS840D – NOVEMBER 2015 – REVISED AUGUST 2016 7.8 Typical Characteristics CIN = 1 μF, CL = 0.1 μF, RL = 10 Ω, TA = 25°C VIN = 3.6 V VIN = 1.8 V Figure 21. Turnon Response (TPS22925Bx) VIN = 0.65 V Figure 22. Turnon Response (TPS22925Bx) VIN = 3.6 V Figure 23. Turnon Response (TPS22925Bx) VIN = 1.8 V Figure 24. Turnon Response (TPS22925Cx) VIN = 0.65 V Figure 25. Turnon Response (TPS22925Cx) Figure 26. Turnon Response (TPS22925Cx) Submit Documentation Feedback Copyright © 2015–2016, Texas Instruments Incorporated Product Folder Links: TPS22925 11 TPS22925 SLVS840D – NOVEMBER 2015 – REVISED AUGUST 2016 www.ti.com Typical Characteristics (continued) CIN = 1 μF, CL = 0.1 μF, RL = 10 Ω, TA = 25°C VIN = 3.6 V VIN =1.8 V Figure 27. Turnoff Response (TPS22925xx) Figure 28. Turnoff Response (TPS22925xx) VIN = 0.65 V Figure 29. Turnoff Response (TPS22925xx) 12 Submit Documentation Feedback Copyright © 2015–2016, Texas Instruments Incorporated Product Folder Links: TPS22925 TPS22925 www.ti.com SLVS840D – NOVEMBER 2015 – REVISED AUGUST 2016 8 Detailed Description 8.1 Overview The TPS22925 is a single channel, 3-A load switch in a WCSP-6 package. This device implements an N-channel MOSFET with a controlled rise time for applications that need to limit inrush current. The device is also designed to have low leakage current during off state. This prevents downstream circuits from pulling high standby current from the supply. The TPS22925 provides reverse current blocking when the power switch is disabled. Integrated control logic, driver, and output discharge FET eliminates the need for additional external components, which reduces solution size and bill of material (BOM) count. 8.2 Functional Block Diagram VIN Charge Pump Control Logic ON Reverse Current Blocking Driver VOUT TPS22925B TPS22925C only QOD GND 8.3 Feature Description 8.3.1 ON and OFF Control The ON pin controls the state of the switch. Asserting the ON pin high enables the switch. The ON pin is compatible with GPIOs of 1.5 V and above. 8.3.2 Quick Output Discharge (QOD) (TPS22925B and TPS22925C Only) When the switch is disabled, a discharge path is enabled between the output and ground with a typical resistance of 150 Ω. The resistance pulls down the output and prevents it from floating when the device is disabled. Submit Documentation Feedback Copyright © 2015–2016, Texas Instruments Incorporated Product Folder Links: TPS22925 13 TPS22925 SLVS840D – NOVEMBER 2015 – REVISED AUGUST 2016 www.ti.com Feature Description (continued) 8.3.3 Reverse Current Blocking The reverse current blocking feature prevents current flow from the VOUT pin to the VIN pin when the TPS22925 devices are disabled. This feature is particularly useful when the output of the device needs to be driven by another voltage source after TPS22925 is disabled (for example in a power multiplexer application). In order for this feature to work, the TPS22925 must be disabled and either of the following conditions must be met: • VIN ≥ 0.65 V or • VOUT ≥ 0.65 V Figure 30 describes the ideal behavior of reverse current blocking circuit in TPS22925 devices where • IVIN is the current through the VIN pin • VSRC is the input voltage applied to the device • VFORCE is the external voltage source forced at the VOUT pin • IOUT is the output load current VIN VSRC VON VIH Reverse current blocking disabled Reverse current blocking enabled VOUT VSRC ± (IOUT × RON) VFORCE Due to QOD in TPS22925B and TPS22925C IVIN IOUT IRC,VIN Time Figure 30. Reverse Current Blocking After the device is disabled via the ON pin and VOUT is forced to an external voltage (VFORCE), less than 6 µA of current flows from the VOUT pin to the VIN pin. This limitation prevents any extra current loading on the voltage source supplying the VFORCE voltage. 14 Submit Documentation Feedback Copyright © 2015–2016, Texas Instruments Incorporated Product Folder Links: TPS22925 TPS22925 www.ti.com SLVS840D – NOVEMBER 2015 – REVISED AUGUST 2016 8.4 Device Functional Modes Table 1 shows the function table for the TPS22925xx devices. Table 1. Function Table (1) OUTPUT DISCHARGE (1) ON VIN to VOUT L OFF ENABLED H ON DISABLED This feature is in the TPS22925B and TPS22925C only (not in the TPS22925BN and TPS22925CN). Submit Documentation Feedback Copyright © 2015–2016, Texas Instruments Incorporated Product Folder Links: TPS22925 15 TPS22925 SLVS840D – NOVEMBER 2015 – REVISED AUGUST 2016 www.ti.com 9 Application and Implementation NOTE Information in the following applications sections is not part of the TI component specification, and TI does not warrant its accuracy or completeness. TI’s customers are responsible for determining suitability of components for their purposes. Customers should validate and test their design implementation to confirm system functionality. 9.1 Application Information The TPS22925 device is a 9-mΩ, single-channel load switch with a controlled slew rate. This design example describes a device containing an N–channel MOSFET that operates at an input voltage range of 3.6 V and supports a maximum continuous current of 3 A. The devices provides reverse current blocking when disabled allowing for power supply protection and power multiplexing capabilities. 9.1.1 VIN to VOUT Voltage Drop The VIN pin to VOUT pin voltage drop in the device is determined by the RON of the device and the load current. The on-resistance of the device depends upon the VIN condition of the device. See the on-resistance specification in the Electrical Characteristics table. After the on-resistance of the device is determined based upon the input voltage conditions, use Equation 1 to calculate the VIN-to-VOUT voltage drop. ¿V = IL × R ON where • • • • ΔV is the voltage drop from the VIN pin to the VOUT pin IL is the load current RON is the on-resistance of the device for a specific input voltage Choose an appropriate IL so that the maximum current (IMAX) specification of the device is not violated (1) 9.1.2 Input Capacitor (CIN) To limit the voltage drop on the input supply caused by transient inrush currents when the switch turns on into a discharged load capacitor, place a capacitor between VIN and GND close to the pins. A 1-μF ceramic capacitor, CIN, is usually sufficient. Higher values of CIN can be used to further reduce the voltage drop. 9.1.3 Load Capacitor (CL) A CIN to CL ratio of 10-to-1 is recommended for minimizing the input voltage dip caused by inrush currents during startup. 16 Submit Documentation Feedback Copyright © 2015–2016, Texas Instruments Incorporated Product Folder Links: TPS22925 TPS22925 www.ti.com SLVS840D – NOVEMBER 2015 – REVISED AUGUST 2016 Application Information (continued) 9.1.4 Standby Power Reduction Any end equipment that is being powered from the battery has a need to reduce current consumption in order to maintain the battery charge for a longer time. TPS22925 devices help to accomplish this reduction by turning off the supply to the modules that are in standby state and hence significantly reducing the leakage current overhead of the standby modules. See Figure 31. Always ON Module TPS22925 Li-Ion 1S battery or DC/DC controller Micro-processor VIN Standby Module VOUT CIN GPIO CIN ON GND Figure 31. Standby Power Reduction 9.1.5 Power Multiplexing Figure 32 shows a power multiplexing application using two TPS22925xN devices. Use the non-QOD version in order to maintain the output voltage. Configure the GPIO control from the microprocessor unit as break-beforemake (BBM). TPS22925xN Power Supply 1 VIN VOUT CIN CL ON RL GND GPIO1 MCU GPIO2 TPS22925xN Power Supply 2 VIN VOUT ON GND CIN Figure 32. Power Multiplexing with Two TPS22925xN Devices Submit Documentation Feedback Copyright © 2015–2016, Texas Instruments Incorporated Product Folder Links: TPS22925 17 TPS22925 SLVS840D – NOVEMBER 2015 – REVISED AUGUST 2016 www.ti.com Application Information (continued) 9.1.6 Thermal Considerations Restrict the maximum junction temperature lower than 125°C. Use Equation 2 to calculate the maximum allowable dissipation, PD(max) for a given output load current and ambient temperature. PD:max ; = TJ:max ; F TA R EJA where • • • • PD(max) is the maximum allowable power dissipation TJ(max) is the maximum allowable junction temperature TA is the ambient temperature of the device RθJA is the junction-to-air thermal impedance (2) NOTE The RθJA parameter is highly dependent upon board layout. (See the Thermal Information table) 9.2 Typical Application SMPS VBATT TPS22925 VIN VOUT CIN CL On RL Off ON GND Figure 33. Typical Application Schematic 9.2.1 Design Requirements For this design example, use the values listed in Table 2 as the input parameters. Table 2. Design Parameters DESIGN PARAMETER EXAMPLE VALUE VIN 3.6 V CL 1 µF Maximum Acceptable Inrush Current 40 mA 9.2.2 Detailed Design Procedure 9.2.2.1 Managing Inrush Current When the switch is enabled, the VIN capacitors must be charged up from 0 V to VIN. This charge arrives in the form of inrush current. Calculate the inrush current using Equation 3. IINRUSH = CL × dv dt where • • • 18 IINRUSH is the inrush current CL is the load capacitance dv/dt is the output slew rate (3) Submit Documentation Feedback Copyright © 2015–2016, Texas Instruments Incorporated Product Folder Links: TPS22925 TPS22925 www.ti.com SLVS840D – NOVEMBER 2015 – REVISED AUGUST 2016 The TPS22925Bx and TPS22925Cx have different controlled rise time. TPS22925Bx has shorter rise time than TPS22925Cx. In the application where fast rise time is required and higher inrush current can be tolerated, consider using the TPS22925Bx. For an application that requires a longer rise time and lower inrush current, consider using the TPS22925Cx. Calculate the maximum acceptable slew rate using the design requirements and Equation 4. dv IINRUSH 40 mA = = = 40 V/ms CL dt 1.0 JF (4) The TPS22925Bx has a typical rise time of 97 μs at 3.6 V. This results in a slew rate of 29.7 V/ms which meets the above design requirements. The TPS22925Cx has a typical rise time of 810 μs at 3.6 V. This results in a slew rate of 3.6 V/ms which also meets the above design requirements. Base on inrush current requirement, either devices can be used. 9.2.3 Application Curve CL = 1 µF Figure 34. Inrush Current (TPS22925C) 10 Power Supply Recommendations This family of devices is designed to operate with a VIN range of 0.65 V to 3.6 V. This supply must be well regulated and placed as close to the device terminal as possible with the recommended 1 μF bypass capacitor. If the supply is located more than a few inches from the device terminals, additional bulk capacitance may be required in addition to the ceramic bypass capacitors. If additional bulk capacitance is required, an electrolytic, tantalum, or ceramic capacitor of 10 μF may be sufficient. Submit Documentation Feedback Copyright © 2015–2016, Texas Instruments Incorporated Product Folder Links: TPS22925 19 TPS22925 SLVS840D – NOVEMBER 2015 – REVISED AUGUST 2016 www.ti.com 11 Layout 11.1 Layout Guidelines For best performance, all traces must be as short as possible. To be most effective, the input and load capacitors must be placed close to the device to minimize the effects that parasitic trace inductances may have on operation. Using wide traces for VIN, VOUT, and GND helps minimize the parasitic electrical effects. 11.2 Layout Example VIA to Power Ground Plane V IN Bypass Capacitor VOUT Bypass Capacitor VOUT VIN VOUT VIN GND ON To GPIO control Figure 35. TPS22925xx Layout Example 20 Submit Documentation Feedback Copyright © 2015–2016, Texas Instruments Incorporated Product Folder Links: TPS22925 TPS22925 www.ti.com SLVS840D – NOVEMBER 2015 – REVISED AUGUST 2016 12 Device and Documentation Support 12.1 Documentation Support 12.1.1 Related Documentation For related documentation see the following: • Reverse Current Protection in Load Switches • Quiescent Current vs Shutdown Current for Load Switch Power Consumption • TPS22925EVM User's Guide 12.2 Receiving Notification of Documentation Updates To receive notification of documentation updates—including silicon errata—go to the product folder for your device on ti.com. In the upper right-hand corner, click the Alert me button. This registers you to receive a weekly digest of product information 12.3 Community Resources The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of Use. TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help solve problems with fellow engineers. Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and contact information for technical support. 12.4 Trademarks E2E is a trademark of Texas Instruments. All other trademarks are the property of their respective owners. 12.5 Electrostatic Discharge Caution This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications. 12.6 Glossary SLYZ022 — TI Glossary. This glossary lists and explains terms, acronyms, and definitions. 13 Mechanical, Packaging, and Orderable Information The following pages include mechanical, packaging, and orderable information. This information is the most current data available for the designated devices. This data is subject to change without notice and revision of this document. For browser–based versions of this data sheet, refer to the left–hand navigation. Submit Documentation Feedback Copyright © 2015–2016, Texas Instruments Incorporated Product Folder Links: TPS22925 21 PACKAGE OPTION ADDENDUM www.ti.com 10-Dec-2020 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan (2) Lead finish/ Ball material MSL Peak Temp Op Temp (°C) Device Marking (3) (4/5) (6) TPS22925BNYPHR ACTIVE DSBGA YPH 6 3000 RoHS & Green SAC396 | SNAGCU Level-1-260C-UNLIM -40 to 105 12D9 TPS22925BNYPHT ACTIVE DSBGA YPH 6 250 RoHS & Green SAC396 | SNAGCU Level-1-260C-UNLIM -40 to 105 12D9 TPS22925BYPHR ACTIVE DSBGA YPH 6 3000 RoHS & Green SAC396 | SNAGCU Level-1-260C-UNLIM -40 to 105 12A8 TPS22925BYPHT ACTIVE DSBGA YPH 6 250 RoHS & Green SAC396 | SNAGCU Level-1-260C-UNLIM -40 to 105 12A8 TPS22925CNYPHR ACTIVE DSBGA YPH 6 3000 RoHS & Green SAC396 | SNAGCU Level-1-260C-UNLIM -40 to 105 12C9 TPS22925CNYPHT ACTIVE DSBGA YPH 6 250 RoHS & Green SAC396 | SNAGCU Level-1-260C-UNLIM -40 to 105 12C9 TPS22925CYPHR ACTIVE DSBGA YPH 6 3000 RoHS & Green SAC396 | SNAGCU Level-1-260C-UNLIM -40 to 105 12B9 TPS22925CYPHT ACTIVE DSBGA YPH 6 250 RoHS & Green SAC396 | SNAGCU Level-1-260C-UNLIM -40 to 105 12B9 (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may reference these types of products as "Pb-Free". RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption. Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of