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TPS22944DCKR

TPS22944DCKR

  • 厂商:

    BURR-BROWN(德州仪器)

  • 封装:

    SC-70-5

  • 描述:

    IC PWR SWITCH P-CHAN 1:1 SC70-5

  • 数据手册
  • 价格&库存
TPS22944DCKR 数据手册
Product Folder Sample & Buy Support & Community Tools & Software Technical Documents TPS22941, TPS22942, TPS22943, TPS22944, TPS22945 SLVS832D – NOVEMBER 2008 – REVISED JULY 2014 TPS2294x Low-input-voltage Current-limited Load Switches With Shut Off And AutoRestart Feature 1 Features 3 Description • • The TPS22941/2/3/4/5 load switches provide protection to systems and loads in high-current conditions. The devices contain a 0.4-Ω currentlimited P-channel MOSFET that can operate over an input voltage range of 1.62 V to 5.5 V. Current is prevented from flowing when the MOSFET is off. The switch is controlled by an on/off input (ON), which is capable of interfacing directly with low-voltage control signals. The TPS22941/2/3/4/5 includes thermal shutdown protection that prevents damage to the device when a continuous over-current condition causes excessive heating by turning off the switch. 1 • • • • • • • • • • • • Input Voltage Range: 1.62 V to 5.5 V Low ON resistance – rON = 0.4 Ω at VIN = 5.5 V – rON = 0.5 Ω at VIN = 3.3 V – rON = 0.6 Ω at VIN = 2.5 V – rON = 0.8 Ω at VIN = 1.8 V Minimum Current Limit: 40 mA or 100 mA Undervoltage Lockout (UVLO) Thermal Shutdown Shutdown Current < 1 μA Fast Current Limit Response Time Fault Blanking Auto Restart 1.8-V Compatible Control Input Thresholds ESD Performance Tested Per JESD 22 – 4000-V Human-Body Model (A114-B, Class II) – 1000-V Charged-Device Model (C101) Tiny SC-70 (DCK) Package UL Recognized Component (UL File 169910) Evaluated to IEC 60950-1, Ed 2, Am1, Annex CC, Test Program 2 with CB Report 2 Applications • • • • • • • Low-Current Sensor Protection HDMI Connector Protection Notebooks PDAs GPS Devices MP3 Players Peripheral Ports These devices provide an integrated, robust solution to provide current limiting the output current to a safe level by switching into a constant-current mode when the ouptut load exceeds the current-limit threshold. The OC logic output asserts low during overcurrent, undervoltage, or overtemperature conditions. These additional features make the TPS22941/2/3/4/5 an ideal solution for applications where current limiting is necessary. This family of devices are available in a SC70-5 (DCK) package. It is characterized for operation over the free-air temperature range of –40°C to 85°C. Device Information(1) PART NUMBER PACKAGE BODY SIZE (NOM) TPS22941 TPS22942 TPS22943 SC70 (5) 2.00mm × 2.10 mm TPS22944 TPS22945 (1) For all available packages, see the orderable addendum at the end of the datasheet. 1.0 ON-State Resistance, rON (W) 0.9 0.8 0.7 0.6 0.5 0.4 0.3 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0 Input Voltage, VIN (V) 1 An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications, intellectual property matters and other important disclaimers. PRODUCTION DATA. TPS22941, TPS22942, TPS22943, TPS22944, TPS22945 SLVS832D – NOVEMBER 2008 – REVISED JULY 2014 www.ti.com Table of Contents 1 2 3 4 5 6 7 8 Features .................................................................. Applications ........................................................... Description ............................................................. Revision History..................................................... Device Comparison Table..................................... Pin Configuration and Functions ......................... Specifications......................................................... 1 1 1 2 3 3 3 7.1 7.2 7.3 7.4 7.5 7.6 7.7 3 3 4 4 4 5 6 Absolute Maximum Ratings ..................................... Handling Ratings....................................................... Recommended Operating Conditions....................... Thermal Information .................................................. Electrical Characteristics........................................... Switching Characteristics .......................................... Typical Characteristics .............................................. Detailed Description .............................................. 9 8.1 Overview ................................................................... 9 8.2 Functional Block Diagram ......................................... 9 8.3 Feature Description................................................... 9 8.4 Device Functional Modes........................................ 10 9 Application and Implementation ........................ 11 9.1 Application Information............................................ 11 9.2 Typical Application ................................................. 11 10 Power Supply Recommendations ..................... 15 11 Layout................................................................... 15 11.1 Layout Guidelines ................................................. 15 11.2 Layout Example .................................................... 15 11.3 Thermal Considerations ........................................ 16 12 Device and Documentation Support ................. 17 12.1 12.2 12.3 12.4 Related Links ........................................................ Trademarks ........................................................... Electrostatic Discharge Caution ............................ Glossary ................................................................ 17 17 17 17 13 Mechanical, Packaging, and Orderable Information ........................................................... 17 4 Revision History Changes from Revision C (November 2009) to Revision D • 2 Page Added Handling Rating table, Feature Description section, Device Functional Modes, Application and Implementation section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and Mechanical, Packaging, and Orderable Information section ............................................................... 1 Submit Documentation Feedback Copyright © 2008–2014, Texas Instruments Incorporated Product Folder Links: TPS22941 TPS22942 TPS22943 TPS22944 TPS22945 TPS22941, TPS22942, TPS22943, TPS22944, TPS22945 www.ti.com SLVS832D – NOVEMBER 2008 – REVISED JULY 2014 5 Device Comparison Table DEVICE MINIMUM CURRENT LIMIT (mA) CURRENT LIMIT BLANKING TIME (ms) AUTO-RESTART TIME (ms) ON PIN ACTIVITY TPS22941 40 10 80 Active LOW TPS22942 100 10 80 Active LOW TPS22943 40 0 N/A Active HIGH TPS22944 100 0 N/A Active HIGH TPS22945 100 10 80 Active HIGH 6 Pin Configuration and Functions DCK PACKAGE (TOP VIEW) VOUT 1 GND 2 OC 3 5 VIN 4 ON Pin Functions PIN NAME SOT (DCK) PIN NO. TYPE DESCRIPTION VOUT 1 O Switch Output. Place ceramic bypass capacitor(s) between this terminal and GND. See the Application Information section for more information. GND 2 – Ground OC 3 O Over current output flag: active LOW, open drain output that indicates an over current, supply under voltage, or over temperature state. ON 4 I Switch control input. Do not leave floating. VIN 5 I Switch Input. Place ceramic bypass capacitor(s) between this terminal and GND. See the Application Information section for more information. 7 Specifications 7.1 Absolute Maximum Ratings (1) VI Input voltage range TJ Operating junction temperature range (1) VIN, VOUT, ON MIN MAX –0.3 6 UNIT V Internally Limited °C Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. 7.2 Handling Ratings Tstg VESD (1) (2) MIN MAX UNIT –65 150 °C Human body model (HBM), per ANSI/ESDA/JEDEC JS-001, all pins (1) –4 4 Charged device model (CDM), per JEDEC specification JESD22-C101, all pins (2) –1 1 Storage temperature range Electrostatic discharge kV JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process. Copyright © 2008–2014, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: TPS22941 TPS22942 TPS22943 TPS22944 TPS22945 3 TPS22941, TPS22942, TPS22943, TPS22944, TPS22945 SLVS832D – NOVEMBER 2008 – REVISED JULY 2014 www.ti.com 7.3 Recommended Operating Conditions Over operating free-air temperature range (unless otherwise noted) MIN VIN Input voltage VOUT Output voltage TA Ambient free-air temperature MAX 1.62 UNIT 5.5 V VIN –40 85 °C 7.4 Thermal Information TPS22941/2/3/4/5 THERMAL METRIC (1) DCK UNIT 5 PINS θJA Junction-to-ambient thermal resistance 294 θJC(top) Junction-to-case (top) thermal resistance 59.2 θJB Junction-to-board thermal resistance 95.4 ψJT Junction-to-top characterization parameter 0.7 ψJB Junction-to-board characterization parameter 93.9 θJC(bot) Junction-to-case (bottom) thermal resistance N/A (1) °C/W For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953. 7.5 Electrical Characteristics VIN = 1.62 V to 5.5 V, TA = –40°C to 85°C (unless otherwise noted) PARAMETER IIN TEST CONDITIONS TA μA Full 1 μA Full 1 μA IOUT = 0 mA, VIN = 1.62 V to 5.5 V Full OFF-State supply current VON = 0 V (TPS22943/4/5) or VON = VIN (TPS22941/2) VIN = 3.6 V, VOUT open IOUT(LEAKAGE) OFF-State switch current VON = 0 V (TPS22943/4/5) or VON = VIN (TPS22941/2) VIN = 3.6 V, VOUT short to GND VIN = 5.5 V VIN = 3.3 V rON ON-state resistance IOUT = 20 mA VIN = 2.5 V VIN = 1.8 V VIN = 1.62 V ION ON input leakage current VON = VIN or GND ILIM Current limit VIN = 3.3 V, VOUT = 3 V TPS22941/3 TPS22942/4/5 Thermal shutdown Return from shutdown 4 0.4 Full 0.5 0.6 25°C 0.5 Full 0.6 0.7 25°C 0.6 Full 0.7 0.8 25°C 0.8 Full 0.9 0.9 1.1 Full 1.2 Full 1 Full Ω 1.1 25°C 40 65 80 100 150 200 μA mA 140 Full Hysteresis (1) 40 25°C Shutdown threshold TSD UNIT 80 Quiescent current IIN(OFF) MIN TYP (1) MAX 130 °C 10 Typical values are at VIN = 3.3 V and TA = 25°C. Submit Documentation Feedback Copyright © 2008–2014, Texas Instruments Incorporated Product Folder Links: TPS22941 TPS22942 TPS22943 TPS22944 TPS22945 TPS22941, TPS22942, TPS22943, TPS22944, TPS22945 www.ti.com SLVS832D – NOVEMBER 2008 – REVISED JULY 2014 Electrical Characteristics (continued) VIN = 1.62 V to 5.5 V, TA = –40°C to 85°C (unless otherwise noted) PARAMETER UVLO TEST CONDITIONS Undervoltage shutdown VIN increasing Undervoltage shutdown hysteresis TA MIN TYP (1) MAX Full 1.32 1.42 Full 1.52 45 UNIT V mV Control Output (OC) Vol OC output logic low voltage Ioz OC output high leakage current voltage VIN = 5 V, ISINK = 10 mA Full VIN = 1.8 V, ISINK = 10 mA 0.1 0.2 0.1 0.3 0.5 V μA VIN = 5 V, Switch ON Full VIN = 1.8 V Full 1.1 V VIN = 2.5 V Full 1.3 V VIN = 3.3 V Full 1.4 V VIN = 5.5 V Full 1.7 VIN = 1.8 V Full 0.5 V VIN = 2.5 V Full 0.7 V VIN = 3.3 V Full 0.8 V VIN = 5.5 V Full 0.9 V VIN = 1.8 V to 5 V, Switch ON Full 1 μA Control Input (ON) Vih Vil Ii ON high-level input voltage ON low-level input voltage ON high-level input leakage current V 7.6 Switching Characteristics VIN = 3.3 V, RL = 500 Ω, CL = 0.1 μF, TA = 25°C (unless otherwise noted) PARAMETER TEST CONDITIONS MIN TYP MAX UNIT tON Turn-ON time RL = 500 Ω, CL = 0.1 μF 60 μs tOFF Turn-OFF time RL = 500 Ω, CL = 0.1 μF 30 μs tr VOUT rise time RL = 500 Ω, CL = 0.1 μF 10 μs tf VOUT fall time RL = 500 Ω, CL = 0.1 μF tBLANK Over current blanking time TPS22941/2/5 5 10 20 ms tRSTART Auto-restart time TPS22941/2/5 40 80 160 ms Short-circuit response time μs 90 VIN = VON = 3.3 V, moderate overcurrent condition 9 μs VIN = VON = 3.3 V, hard short 4 μs Copyright © 2008–2014, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: TPS22941 TPS22942 TPS22943 TPS22944 TPS22945 5 TPS22941, TPS22942, TPS22943, TPS22944, TPS22945 SLVS832D – NOVEMBER 2008 – REVISED JULY 2014 www.ti.com 7.7 Typical Characteristics 1.0 1.0 0.9 VIN = 1.8 V 0.8 0.8 ON-State Resistance (W) ON-State Resistance, rON (W) 0.9 0.7 0.6 0.5 0.7 VIN = 3.3 V 0.6 0.5 0.4 VIN = 5 V 0.4 0.3 1.5 VIN = 3.6 V 0.3 0.2 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 –40 6.0 –10 25 50 85 Input Voltage, VIN (V) Temperature (°C) Figure 1. rON vs VIN Figure 2. rON vs Temperature 50 42 41 40 Quiescent Current (mA) 45 Quiescent Current (uA) 39 38 37 36 35 VIN = 5.5 V VIN = 3.3 V 40 35 VIN = 1.8 V 30 34 33 25 32 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0 –40 –10 25 50 85 Temperature (°C) Supply Voltage (V) Figure 4. Quiescent Current vs Temperature Figure 3. Quiescent Current vs VIN 600 500 450 500 IIN(leakage) Current (nA) 400 IIN(leakage) Current (nA) 400 VIN = 3.3 V 300 200 300 250 200 150 100 VIN = 1.8 V 100 350 50 0 –40 –10 25 50 Temperature (°C) Figure 5. IIN(Leakage) vs Temperature 6 Submit Documentation Feedback 85 0 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0 Supply Voltage (V) Figure 6. IIN(Leakage) vs VIN Copyright © 2008–2014, Texas Instruments Incorporated Product Folder Links: TPS22941 TPS22942 TPS22943 TPS22944 TPS22945 TPS22941, TPS22942, TPS22943, TPS22944, TPS22945 www.ti.com SLVS832D – NOVEMBER 2008 – REVISED JULY 2014 Typical Characteristics (continued) 250 500 450 VIN = 3.3 V 200 400 IIN(off) Current (nA) IIN(off) Current (nA) 350 150 100 VIN = 1.8 V 300 250 200 150 50 100 50 0 –40 –10 25 50 0 1.0 85 1.5 2.0 2.5 Figure 7. IIN(off) vs Temperature 3.5 4.0 4.5 5.0 5.5 6.0 1.6 1.8 2.0 Figure 8. IIN(off) vs VIN 100 6.0 50 0 VIN = 1.8 V –50 –100 VOUT (V) IOUT(leakage) Current (nA) 3.0 Supply Voltage (V) Temperature (°C) VIN = 3.3 V 5.5 VIN = 1.62 V 5.0 VIN = 1.8 V 4.5 VIN = 1.95 V 4.0 VIN = 2.3 V 3.5 VIN = 2.5 V 3.0 VIN = 2.7 V VIN = 3.0 V 2.5 VIN = 3.3 V 2.0 –150 VIN = 3.6 V 1.5 –200 –250 VIN = 4.5 V 1.0 VIN = 5.0 V 0.5 VIN = 5.5 V 0.0 –300 –40 –10 25 50 85 -0.5 0.0 0.2 0.4 1.0 1.2 1.4 180 0.16 160 85°C 0.14 140 Current Limit (mA) 0.12 Output Current (A) 0.8 Figure 10. VOUT vs ON Threshold Figure 9. IOUT(leakage) vs Temperature 0.18 –40°C 25°C 0.10 0.08 120 100 80 0.06 60 0.04 40 0.02 20 0 0.00 0.0 0.6 Input Voltage, VON (V) Temperature (°C) 0.4 0.8 1.2 1.6 2.0 2.4 2.8 3.2 –40 25 85 VIN-VOUT (V) Junction Temperature, TJ (°C) Figure 11. ILIM vs Output Voltage (TPS22942, TPS22944, TPS22945) Figure 12. ILIM vs Temperature (TPS22942, TPS22944, TPS22945) Copyright © 2008–2014, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: TPS22941 TPS22942 TPS22943 TPS22944 TPS22945 7 TPS22941, TPS22942, TPS22943, TPS22944, TPS22945 SLVS832D – NOVEMBER 2008 – REVISED JULY 2014 www.ti.com Typical Characteristics (continued) 80 80 TA = –40°C TA = 85°C TA = 25°C 70 75 Current Limit, ILIM (mA) Current Limit, ILIM (mA) 60 50 40 30 20 70 65 10 0 60 0 0.5 1 1.5 2 2.5 3 3.5 –40 VIN – VOUT (V) RL = 350 Ω VIN = 3.3 V VIN = 3.3 V Figure 16. tON/tOFF vs Temperature 13.5 100 13.0 90 12.5 80 Restart Time (ms) Blanking Time (ms) RL = 350 Ω CL = 0.1 µF Figure 15. trise/tfall vs Temperature 12.0 11.5 70 60 50 11.0 40 10.5 –40 –10 25 50 85 Temperature (°C) Figure 17. tBLANK vs Temperature (VIN = 3.3 V) 8 85 Figure 14. ILIM vs Temperature (TPS22941, TPS22943) Figure 13. ILIM vs (VIN-VOUT) (TPS22941, TPS22943) CL = 0.1 µF 25 Junction Temperature, TJ (°C) Submit Documentation Feedback –40 –10 25 50 85 Temperature (°C) Figure 18. tRESTART vs Temperature (VIN = 3.3 V) Copyright © 2008–2014, Texas Instruments Incorporated Product Folder Links: TPS22941 TPS22942 TPS22943 TPS22944 TPS22945 TPS22941, TPS22942, TPS22943, TPS22944, TPS22945 www.ti.com SLVS832D – NOVEMBER 2008 – REVISED JULY 2014 8 Detailed Description 8.1 Overview The TPS22941/2/3/4/5 load switches are 5.5V, current limited load switches in a SC-70 package. The devices contain a 0.4-Ω current-limited P-channel MOSFET that can operate over an input voltage range of 1.62 V to 5.5 V. When the switch current reaches the maximum limit, the TPS22941/2/3/4/5 operates in a constant-current mode to prohibit excessive currents from causing damage. TPS22941/3 has a current limit of 40 mA and TPS22942/4/5 has a current limit of 100 mA. For the TPS22941/2/5, if the constant current condition still persists after 10ms, these parts shut off the switch and pull the fault signal pin (OC) low. The TPS22941/2/5 have an auto-restart feature that turns the switch on again after 80 ms if the ON pin is still active. A current limit condition on the TPS22943 and on the TPS22944 immediately pull the fault signal pin low (OC pin) and the part remains in the constant-current mode until the switch current falls below the current limit. 8.2 Functional Block Diagram VIN 5 UVLO ON 4 Control Logic Current Limit 1 Thermal Shutdown VOUT 3 OC 2 GND 8.3 Feature Description 8.3.1 Fault Reporting When an overcurrent, input undervoltage, or overtemperature condition is detected, OC is set active low to signal the fault mode. OC is an open-drain MOSFET and requires a pullup resistor between VIN and OC. During shutdown, the pulldown on OC is disabled, reducing current draw from the supply. 8.3.2 Current Limiting When the switch current reaches the maximum limit, the TPS22921/2/3/4/5 operates in a constant-current mode to prohibit excessive currents from causing damage. TPS22921/3 has a current limit of 40 mA and TPS22922/4/5 has a current limit of 100 mA. A current limit condition immediately pulls the fault signal pin low (OC pin), and the part remains in the constant-current mode until the switch current falls below the current limit. Copyright © 2008–2014, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: TPS22941 TPS22942 TPS22943 TPS22944 TPS22945 9 TPS22941, TPS22942, TPS22943, TPS22944, TPS22945 SLVS832D – NOVEMBER 2008 – REVISED JULY 2014 www.ti.com Feature Description (continued) 8.3.3 Thermal Shutdown Thermal shutdown protects the part from internally or externally generated excessive temperatures. During an overtemperature condition the switch is turned off. The switch automatically turns on again if the temperature of the die drops below the threshold temperature. 8.4 Device Functional Modes When the ON pin is actively pulled high and no fault conditions are present, the switch will be turned on, connecting VIN to VOUT. When the ON pin is actively pulled low regardless of the fault condition, the switch will be turned off. In the event that the current limit is exceeded, the device will operate in a constant-current mode and pull the OC pin low until the fault condition is removed. If the condition persists after the current limit blanking time, the device will automatically turn off. During thermal shutdown conditions, the switch will automatically turn off and will turn back on again if the temperature of the die drops below the threshold temperature. 10 Submit Documentation Feedback Copyright © 2008–2014, Texas Instruments Incorporated Product Folder Links: TPS22941 TPS22942 TPS22943 TPS22944 TPS22945 TPS22941, TPS22942, TPS22943, TPS22944, TPS22945 www.ti.com SLVS832D – NOVEMBER 2008 – REVISED JULY 2014 9 Application and Implementation This section will highlight some of the design considerations when implementing this device in various applications. 9.1 Application Information 9.1.1 On/Off Control The ON pin controls the state of the switch. Activating ON continuously holds the switch in the on state as long as there is no fault. An undervoltage lockout or thermal shutdown event will override the ON pin control and turn off the switch. ON is active high and has a low threshold, making it capable of interfacing with low-voltage signals. 9.1.2 Undervoltage Lockout The undervoltage lockout turns off the switch if the input voltage drops below the undervoltage lockout threshold. With the ON pin active, the input voltage rising above the undervoltage lockout threshold causes a controlled turn-on of the switch, which limits current overshoots. 9.1.3 Reverse Voltage If the voltage at the VOUT pin is larger than the VIN pin, large currents may flow and can cause permanent damage to the device. TPS22941/2/3/4/5 is designed to control current flow only from VIN to VOUT. 9.1.4 Input Capacitor To limit the voltage drop on the input supply caused by transient in-rush currents when the switch turns on into a discharged load capacitor or a short-circuit, a capacitor needs to be placed between VIN and GND. A 1-μF ceramic capacitor, CIN, placed close to the pins is usually sufficient. Higher values of CIN can be used to further reduce the voltage drop. 9.1.5 Output Capacitor A 0.1-μF capacitor, COUT, should be placed between VOUT and GND. This capacitor will prevent parasitic board inductances from forcing VOUT below GND when the switch turns off. For the TPS22941/2/3/4/5, the total output capacitance needs to be kept below a maximum value, COUT(MAX), to prevent the part from registering an overcurrent condition and turning-off the switch. Due to the integrated body diode in the PMOS switch, a CIN greater than COUT is highly recommended. A COUT greater than CIN can cause VOUT to exceed VIN when the system supply is removed. This could result in current flow through the body diode from VOUT to VIN. 9.2 Typical Application VOUT VIN 100 kW On 5.5-V Battery ON 10 µF Off OC GND 0.1 µF 500 W Figure 19. Typical Application Circuit, Active-High Enabled Device (TPS22943, TPS22944 and TPS22945 Only) Copyright © 2008–2014, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: TPS22941 TPS22942 TPS22943 TPS22944 TPS22945 11 TPS22941, TPS22942, TPS22943, TPS22944, TPS22945 SLVS832D – NOVEMBER 2008 – REVISED JULY 2014 www.ti.com Typical Application (continued) 9.2.1 Design Requirements For this design example, use the following as the input parameters: DESIGN PARAMETER EXAMPLE VALUE VIN 5.0 V Load Current 50mA 9.2.2 Detailed Design Procedure To begin the design process, the designer needs to know the following: • VIN voltage • Load current 9.2.2.1 VIN to VOUT Voltage Drop The VIN to VOUT voltage drop in the device is determined by the RON of the device and the load current. The RON of the device depends upon the VIN condition of the device. Refer to the RON specification of the device in the Electrical Characteristics table of this datasheet. Once the RON of the device is determined based upon the VIN conditions, use Equation 1 to calculate the VIN to VOUT voltage drop: ∆V = ILOAD × RON where: • • • ΔV = voltage drop from VIN to VOUT ILOAD = load current RON = ON-resistance of the device for a specific VIN (1) 9.2.2.2 Maximum Output Capacitance When designing this device, it is important to ensure the inrush current of the output capacitance does not cause the device to exceed the current limiting time beyond the blanking time. The maximum output capacitance can be determined from Equation 2 : ILM(MAX) ´ tBLANK(MIN) COUT = VIN where: • • • • 12 COUT = output capacitance ILIM(MAX) = maximum current limit tBLANK(MIN) = minimum blanking time VIN = input voltage Submit Documentation Feedback (2) Copyright © 2008–2014, Texas Instruments Incorporated Product Folder Links: TPS22941 TPS22942 TPS22943 TPS22944 TPS22945 TPS22941, TPS22942, TPS22943, TPS22944, TPS22945 www.ti.com SLVS832D – NOVEMBER 2008 – REVISED JULY 2014 9.2.2.3 Power Dissipation During normal operation as a switch, the power dissipation is small and has little effect on the operating temperature of the part. The parts with the higher current limits will dissipate the most power and that will only be, PD = (ILIM)2 × rON (3) If the part goes into current limit the maximum power dissipation will occur when the output is shorted to ground. For TPS22941/2/5, the power dissipation scales by the auto-restart time (tRESTART) and the overcurrent blanking time (tBLANK) so that the maximum power dissipated is: tBLANK PD(MAX) = ( ) ´ VIN(MAX) ´ ILIM(MAX) tRESTART + tBLANK (4) When using the TPS22943 and TPS22944, a short on the output causes the part to operate in a constant current state, dissipating a worst-case power as calculated above until the thermal shutdown activates. It then cycles in and out of thermal shutdown so long as the ON pin is active and the short is present. 9.2.2.4 Application Curves VDRV 2 V/DIV VDRV 2 V/DIV VOUT 2 V/DIV VOUT 2 V/DIV IOUT 100 mA/DIV IOUT 100 mA/DIV VOC 2 V/DIV VOC 2 V/DIV 2 ms/DIV 20 ms/DIV VDRV signal forces the device to go into over-current mode. Figure 20. tBLANK Response CL = 0.1 µF RL = 500 Ω Figure 22. tON Response Copyright © 2008–2014, Texas Instruments Incorporated VDRV signal forces the device to go into over-current mode. Figure 21. tRESTART Response VIN = 3.3 V CL = 0.1 µF RL = 500 Ω VIN = 3.3 V Figure 23. tON Response Submit Documentation Feedback Product Folder Links: TPS22941 TPS22942 TPS22943 TPS22944 TPS22945 13 TPS22941, TPS22942, TPS22943, TPS22944, TPS22945 SLVS832D – NOVEMBER 2008 – REVISED JULY 2014 CIN = 10 µF www.ti.com COUT = 1 µF CIN = 10 µF Figure 24. Short-Circuit Response Time (Output Shorted to Ground) CIN = 10 µF COUT = 1 µF Figure 25. Short-Circuit Response Time (Switch Powerup to Hard Short) COUT = 1 µF Figure 26. Current Limit Response Time 14 Submit Documentation Feedback Copyright © 2008–2014, Texas Instruments Incorporated Product Folder Links: TPS22941 TPS22942 TPS22943 TPS22944 TPS22945 TPS22941, TPS22942, TPS22943, TPS22944, TPS22945 www.ti.com SLVS832D – NOVEMBER 2008 – REVISED JULY 2014 10 Power Supply Recommendations The device is designed to operate from a VIN range of 1.62-V to 5.5-V. This supply must be well regulated and placed as close to the device terminal as possible with the recommended 1µF bypass capacitor. If the supply is located more than a few inches from the device terminals, additional bulk capacitance may be required in addition to the ceramic bypass capacitors. If additional bulk capacitance is required, an electrolytic, tantalum, or ceramic capacitor of 10-µF may be sufficient. 11 Layout 11.1 Layout Guidelines • • • • • For best performance, all traces should be as short as possible. To be most effective, the input and output capacitors should be placed close to the device to minimize the effects that parasitic trace inductances may have on normal and short-circuit operation. The VIN terminal should be bypassed to grond with low ESR ceramic bypass capacitors. The typical recommended bypass capacitance is 1-µF ceramic with X5R or X7R dielectric. This capacitor should be placed as close to the device terminals as possible. The VOUT terminal should be bypassed to grond with low ESR ceramic bypass capacitors. The typical recommended bypass capacitance is one-tenth of the VIN bypass capacitor of X5R or X7R dielectric. This capacitor should be placed as close to the device terminals as possible. Using wide traces for VIN, VOUT, and GND will help minimize parasitic electrical effects along with minimizing the case to ambient thermal impedance. 11.2 Layout Example VOUT Plane VIN Plane VIN VOUT VIN Bypass Capacitor VOUT Bypass Capacitor Gnd Via GND Gnd Via To GPIO control ON Copyright © 2008–2014, Texas Instruments Incorporated To Microcontroller OC Submit Documentation Feedback Product Folder Links: TPS22941 TPS22942 TPS22943 TPS22944 TPS22945 15 TPS22941, TPS22942, TPS22943, TPS22944, TPS22945 SLVS832D – NOVEMBER 2008 – REVISED JULY 2014 www.ti.com 11.3 Thermal Considerations The maximum junction temperature will be internally limited by the thermal shutdown (TSD). To calculate the maximum allowable dissipation, PD(MAX) for a given ambient temperature, use Equation 5. TSD - TA PD(MAX) = qJA where: • • • • 16 PD(MAX) = maximum allowable power dissipation TSD = thermal shutdown threshold (140 °C typical) TA = ambient temperature of the device θJA = junction to air thermal impedance. See the section. This parameter is highly dependent upon board layout. Submit Documentation Feedback (5) Copyright © 2008–2014, Texas Instruments Incorporated Product Folder Links: TPS22941 TPS22942 TPS22943 TPS22944 TPS22945 TPS22941, TPS22942, TPS22943, TPS22944, TPS22945 www.ti.com SLVS832D – NOVEMBER 2008 – REVISED JULY 2014 12 Device and Documentation Support 12.1 Related Links The table below lists quick access links. Categories include technical documents, support and community resources, tools and software, and quick access to sample or buy. Table 1. Related Links PARTS PRODUCT FOLDER SAMPLE & BUY TECHNICAL DOCUMENTS TOOLS & SOFTWARE SUPPORT & COMMUNITY TPS22941 Click here Click here Click here Click here Click here TPS22942 Click here Click here Click here Click here Click here TPS22943 Click here Click here Click here Click here Click here TPS22944 Click here Click here Click here Click here Click here TPS22945 Click here Click here Click here Click here Click here 12.2 Trademarks All trademarks are the property of their respective owners. 12.3 Electrostatic Discharge Caution These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates. 12.4 Glossary SLYZ022 — TI Glossary. This glossary lists and explains terms, acronyms, and definitions. 13 Mechanical, Packaging, and Orderable Information The following pages include mechanical, packaging, and orderable information. This information is the most current data available for the designated devices. This data is subject to change without notice and revision of this document. For browser-based versions of this data sheet, refer to the left-hand navigation. Copyright © 2008–2014, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: TPS22941 TPS22942 TPS22943 TPS22944 TPS22945 17 PACKAGE OPTION ADDENDUM www.ti.com 13-Aug-2021 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan (2) Lead finish/ Ball material MSL Peak Temp Op Temp (°C) Device Marking (3) (4/5) (6) TPS22941DCKR ACTIVE SC70 DCK 5 3000 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 85 4AN TPS22942DCKR ACTIVE SC70 DCK 5 3000 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 85 (4BJ, 4BN) TPS22942DCKRG4 ACTIVE SC70 DCK 5 3000 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 85 (4BJ, 4BN) TPS22943DCKR ACTIVE SC70 DCK 5 3000 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 85 4CN TPS22944DCKR ACTIVE SC70 DCK 5 3000 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 85 4DN TPS22945DCKR ACTIVE SC70 DCK 5 3000 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 85 (4EJ, 4EN) TPS22945DCKRG4 ACTIVE SC70 DCK 5 3000 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 85 (4EJ, 4EN) (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may reference these types of products as "Pb-Free". RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption. Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of
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