TPS22948DCKR

Product Folder Order Now Support & Community Tools & Software Technical Documents TPS22948 SLVSEZ7A – MARCH 2019 – REVISED OCTOBER 2019 TPS22948 5.5-V, 240-mA Current Limited Load Switch with Reverse Current Blocking 1 Features 3 Description • The TPS22948 device is a small, single channel load switch with robust protection against fault cases with output current limiting, reverse current blocking, and thermal shutdown. 1 • • • • • • • • Input operating voltage range (VIN): 2.5 V to 5.5 V Output current limit (ILIMIT): 240 mA (typical) Thermal shutdown (TSD) ON-Resistance (RON): 300 mΩ (typical) Slow Turn ON timing limits inrush current (typical): – Turn ON time (tON): 820 us at 6.6 mV/μs Always-ON Reverse Current Blocking (RCB): – ON State activation current (IRCB): –200 mA (typical) Fault indication (FLT) Smart ON pin pull down (RPD,ON): – ON VIH (ION): 25 nA (maximum) – ON VIL (RPD,ON): 500 kΩ (typical) Low power consumption: – ON State (IQ): 50 uA (typical) – OFF State (ISD): 0.3 uA (typical) The switch ON state is controlled by a digital input that is capable of interfacing directly with low-voltage control signals. When power is first applied, a smart pull down is used to keep the ON pin from floating until system sequencing is complete. Once the pin is deliberately driven high (>VIH), the smart pull down will be disconnected to prevent unnecessary power loss. TPS22948 is available in a standard SC-70 package characterized for operation over a temperature range of –40°C to 125°C. Device Information(1) PART NUMBER PACKAGE TPS22948 SC-70 (6) BODY SIZE (NOM) 2.1 mm x 2.0 mm (1) For all available packages, see the orderable addendum at the end of the data sheet. Simplified Schematic IN 2 Applications + • • • • • Personal electronics Set top box HDMI output ports Notebook, desktop PC Docking stations VIN ± H CIN RFLT RL CL L ON Fault GND TPS22948 1 An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications, intellectual property matters and other important disclaimers. PRODUCTION DATA. TPS22948 SLVSEZ7A – MARCH 2019 – REVISED OCTOBER 2019 www.ti.com Table of Contents 1 2 3 4 5 6 Features .................................................................. Applications ........................................................... Description ............................................................. Revision History..................................................... Pin Configuration and Functions ......................... Specifications......................................................... 1 1 1 2 3 4 6.1 6.2 6.3 6.4 6.5 6.6 6.7 4 4 4 4 5 5 6 Absolute Maximum Ratings ...................................... ESD Ratings.............................................................. Recommended Operating Conditions....................... Thermal Information .................................................. Electrical Characteristics........................................... Switching Characteristics .......................................... Typical Characteristics ............................................. 7 Parameter Measurement Information .................. 6 8 Detailed Description .............................................. 7 7.1 Timing Waveform Diagram ....................................... 6 8.1 Overview ................................................................... 7 8.2 Functional Block Diagram ......................................... 7 8.3 Feature Description................................................... 7 8.4 Device Functional Modes.......................................... 9 9 Application and Implementation ........................ 10 9.1 Application Information............................................ 10 9.2 Typical Application ................................................. 10 10 Power Supply Recommendations ..................... 12 11 Layout................................................................... 13 11.1 Layout Guidelines ................................................. 13 11.2 Layout Example .................................................... 13 12 Device and Documentation Support ................. 14 12.1 12.2 12.3 12.4 12.5 Receiving Notification of Documentation Updates Support Resources ............................................... Trademarks ........................................................... Electrostatic Discharge Caution ............................ Glossary ................................................................ 14 14 14 14 14 13 Mechanical, Packaging, and Orderable Information ........................................................... 14 4 Revision History Changes from Original (March 2019) to Revision A Page • Changed from Advance Information to Production Data ....................................................................................................... 1 • FIrst Public Release .............................................................................................................................................................. 1 2 Submit Documentation Feedback Copyright © 2019, Texas Instruments Incorporated Product Folder Links: TPS22948 TPS22948 www.ti.com SLVSEZ7A – MARCH 2019 – REVISED OCTOBER 2019 5 Pin Configuration and Functions DCK Package 6-Pin SC-70 Top View Pin Functions PIN NO. NAME I/O DESCRIPTION 1 IN I Switch input 2 GND – Device ground 3 ON I Active high switch control input. Do not leave floating. 4 N/C – No connect pin, leave floating or GND 5 FLT O Open-drain output, pulled low during thermal shutdown or reverse current-conditions. 6 OUT O Switch output Submit Documentation Feedback Copyright © 2019, Texas Instruments Incorporated Product Folder Links: TPS22948 3 TPS22948 SLVSEZ7A – MARCH 2019 – REVISED OCTOBER 2019 www.ti.com 6 Specifications 6.1 Absolute Maximum Ratings over operating free-air temperature range (unless otherwise noted) (1) MIN MAX VIN Maximum Input Voltage Range –0.3 6 V VOUT Maximum Output Voltage Range –0.3 6 V VON Maximum ON Pin Voltage Range –0.3 6 V VFLT Maximum FLT Pin Voltage –0.3 6 V IMAX Maximum Output Current Internally Limited A TJ Junction temperature Internally Limited °C TSTG Storage temperature TLEAD Maximum Lead Temperature (10 s soldering time) (1) –65 UNIT 150 °C 300 °C Stresses beyond those listed under Absolute Maximum Rating may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Condition. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. 6.2 ESD Ratings VALUE V(ESD) (1) (2) Electrostatic discharge Human body model (HBM), per ANSI/ESDA/JEDEC JS-001, allpins (1) ±2000 Charged device model (CDM), per JEDEC specificationJESD22-C101, all pins (2) ±500 UNIT V JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process. Manufacturing with less is possible with the necessary precautions. Pins listed may actually have higher performance. 6.3 Recommended Operating Conditions over operating free-air temperature range (unless otherwise noted) MIN VIN Input Voltage Range VOUT TYP MAX UNIT 2.5 5.5 V Output Voltage Range 0 5.5 V VIH ON Pin High Voltage Range 1 5.5 V VIL ON Pin Low Voltage Range 0 0.35 V IOUT Output Current Range 0 130 mA COUT (1) TA (1) Output Capacitance 18 Ambient temperature –40 nF 125 °C The recommended output capacitance is the capacitance placed next to the output of the device that will provide optimal hard short performance across different load cable lengths. 6.4 Thermal Information TPS22948 THERMAL METRIC (1) DCK (SC-70) UNIT 6 PINS RθJA Junction-to-ambient thermal resistance 213.5 °C/W RθJC(top) Junction-to-case (top) thermal resistance 148.8 °C/W RθJB Junction-to-board thermal resistance 66.9 °C/W ΨJT Junction-to-top characterization parameter 50.0 °C/W ΨJB Junction-to-board characterization parameter 66.7 °C/W (1) 4 For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report. Submit Documentation Feedback Copyright © 2019, Texas Instruments Incorporated Product Folder Links: TPS22948 TPS22948 www.ti.com SLVSEZ7A – MARCH 2019 – REVISED OCTOBER 2019 6.5 Electrical Characteristics Unless otherwise noted, the characteristics in the following table applies at 5 V with a load of CL = 0.1 µF, RL = 100 Ω. Typical Values are at 25°C. PARAMETER TEST CONDITIONS MIN TYP MAX UNIT Input Supply (VIN) IQ, VIN VIN Quiescent Current VON ≥ VIH, VOUT = Open -40°C to 125°C 50 85 µA ISD, VIN VIN Shutdown Current VON ≤ VIL, VOUT = GND -40°C to 125°C 0.3 5 µA 25°C 300 350 ON-Resistance (RON) RON ON-State Resistance IOUT = -50 mA -40°C to 85°C 450 -40°C to 125°C 500 mΩ Output Current Limit (ILIM) ILIM Output Current Limit tLIM Current Limit Response Time -40°C to 125°C 130 240 350 mA Output hard short (IOUT > ILIM) -40°C to 125°C 2 µs Activation Threshold VOUT Rising; VOUT > VIN -40°C to 125°C 60 mV Release Threshold VOUT Falling; VOUT > VIN -40°C to 125°C 44 mV tRCB Response Time VOUT = VIN + 1V -40°C to 125°C 3 µs IQ, RCB RCB Quiescent Current (VIN) VON ≤ VIL VOUT - VIN = 1V Reverse Current Blocking (RCB) VRCB VON ≤ VIL VOUT - VIN = 1V -40°C to 125°C 15 µA Fault Indication (FLT) VOL, FLT Output Low Voltage IFLT = 1 mA -40°C to 125°C tDG,FLT Fault Delay Time VON ≥ VIH -40°C to 125°C 0.1 IFLT Off State Leakage VON ≤ VIL -40°C to 125°C Smart Pull Down Resistance VON ≤ VIL -40°C to 85°C ON Pin Leakage VON ≥ VIH -40°C to 125°C Rising N/A 130 Falling (Hysteresis) N/A 100 10 V µs 25 nA Enable Pin (ON) RPD, ON ION 500 kΩ 25 nA 150 170 °C 120 140 °C Thermal Shutdown (TSD) TSD Thermal Shutdown 6.6 Switching Characteristics Unless otherwise noted, the typical characteristics in the following table applies at 5 V and 25°C PARAMETER TEST CONDITIONS MIN TYP MAX UNIT tON Turn ON Time CL = 18 nF, RL = 100 Ω 820 µs tR Output Rise Time CL = 18 nF, RL = 100 Ω 600 µs SRON Turn ON Slew Rate CL = 18 nF, RL = 100 Ω 6.6 mV/µs tOFF Turn OFF Time CL = 18 nF, RL = 100 Ω 15 µs tFALL Output Fall Time CL = 18 nF, RL = 100 Ω 6.9 µs Submit Documentation Feedback Copyright © 2019, Texas Instruments Incorporated Product Folder Links: TPS22948 5 TPS22948 SLVSEZ7A – MARCH 2019 – REVISED OCTOBER 2019 www.ti.com 6.7 Typical Characteristics VIN = 5 V TA = 25 °C VOUT = 0 V Figure 1. Startup Into Short on VOUT VIN = 5 V TA = 25 °C VIN = 5 V TA = 25 °C COUT = 18 nF Figure 2. Hot Short on VOUT with a 1ft Cable COUT = 18 nF VIN = 5 V Figure 3. Hot Short on VOUT with a 3ft Cable TA = 25 °C Figure 4. Reverse Current Blocking Behavior 7 Parameter Measurement Information 7.1 Timing Waveform Diagram VON VIH VII tON tOFF tFALL tRISE tDELAY 90% 90% VOUT 10% SRON Hi-Z 10% FLT Figure 5. Timing Waveforms 6 Submit Documentation Feedback Copyright © 2019, Texas Instruments Incorporated Product Folder Links: TPS22948 TPS22948 www.ti.com SLVSEZ7A – MARCH 2019 – REVISED OCTOBER 2019 8 Detailed Description 8.1 Overview The TPS22948 device is a 5.5-V, 240-mA current limited load switch in a 6-pin SC-70 package. The 300-mΩ Pchannel FET is used to switch power from input to output with minimal voltage drop across the device. The TPS22948 device has a slow slew rate which helps reduce or eliminate power supply droop because of large inrush currents. During shutdown, the device has very low leakage currents, thereby reducing unnecessary leakages for downstream modules during standby. Integrated control logic, and driver eliminates the need for any external components which reduces solution size and bill of materials (BOM) count. The TPS22948 load switch also provides protection features such as reverse current blocking, output current limiting and thermal shutdown. 8.2 Functional Block Diagram IN Reverse Current Blocking ON Control Logic Current Limiting OUT Driver Smart Pull Down FLT GND 8.3 Feature Description 8.3.1 On and Off Control The ON pin controls the state of the switch. The ON pin is compatible with standard GPIO logic threshold so it can be used in a wide variety of applications. When power is first applied to VIN, a smart pull down is used to keep the ON pin from floating until system sequencing is complete. Once the ON pin is deliberately driven high (≥VIH), the smart pull down is disconnected to prevent unnecessary power loss. See Table 1 when the ON pin smart pull down is active. Submit Documentation Feedback Copyright © 2019, Texas Instruments Incorporated Product Folder Links: TPS22948 7 TPS22948 SLVSEZ7A – MARCH 2019 – REVISED OCTOBER 2019 www.ti.com Table 1. Smart-ON Pull Down 8.3.2 VON Pull Down ≤ VIL Connected ≥ VIH Disconnected Fault Indication (FLT) The FLT pin is an open drain output that acts as a status indication for the device. It is pulled low during thermal shutdown or reverse-current events. The behavior of the FLT pin is shown in Figure 6. 8.3.3 Current Limiting (VSC) The TPS22948 responds to overcurrent conditions by limiting its output current to the ILIM level shown in Figure 6. 1 ON 0 Soft Short on VOUT IOUT Auto Restart Into Short ILIM 0 tILM VINx OUT 0 VFLT FLT 0 tDG,FLT TSD TJ TSDHYS TJ Time Figure 6. TPS22948 Current Limiting Behavior When an overcurrent condition is detected, the device maintains a constant output current and reduces the output voltage accordingly. Two possible overload conditions can occur. The first condition is when a short circuit or partial short circuit is present on the output and the ON pin is toggled high, turning the device on. The output voltage is held near zero potential with respect to ground and the TPS22948 ramps the output current to ILIM. The TPS22948 device will limit the current to ILIM until the overload condition is removed or the internal junction temperature of the device reaches thermal shutdown and the device turns itself off. The device remains off until the junction temperature has lowered by TSDHYS, and the device will turn itself back on. This will cycle until the overload condition is removed. 8 Submit Documentation Feedback Copyright © 2019, Texas Instruments Incorporated Product Folder Links: TPS22948 TPS22948 www.ti.com SLVSEZ7A – MARCH 2019 – REVISED OCTOBER 2019 The second condition is when a short circuit, partial short circuit, or transient overload occurs after the device has been fully powered on. The device responds to the overcurrent condition within time tLIM (see Figure 7), and before this time, the current is able to exceed ILIM. In the case of a fast transient, the current-sense amplifier is overdriven and momentarily disables the internal power FET. The current-sense amplifier recovers and limits the output current to ILIM. Similar to the previous case, the TPS22948 limits the current to ILIM until the overload condition is removed or the internal junction temperature of the device reaches thermal shutdown and begins thermally cycling on and off. Figure 7. Transient Current Limit Waveform 8.3.4 Reverse Current Blocking (RCB) In a scenario where the device is enabled and VOUT is greater than VIN, there is potential for reverse current to flow through the pass FET or the body diode. When the reverse current threshold is exceeded (about 200 mA), there is a delay time (tRCB) before the switch turns off to stop the current flow. The switch will remain off and block reverse current as long as the reverse voltage condition exists. Once VOUT has dropped below the release voltage threshold (VRCB) the device will turn back on. When the ON pin is pulled low, the device will constantly block reverse current. 8.4 Device Functional Modes Table 2 describes the connection of the VOUT pin depending on the state of the ON pin. Table 2. VOUT Connection ON TPS22919 VOUT L Open H VIN Submit Documentation Feedback Copyright © 2019, Texas Instruments Incorporated Product Folder Links: TPS22948 9 TPS22948 SLVSEZ7A – MARCH 2019 – REVISED OCTOBER 2019 www.ti.com 9 Application and Implementation NOTE Information in the following applications sections is not part of the TI component specification, and TI does not warrant its accuracy or completeness. TI’s customers are responsible for determining suitability of components for their purposes. Customers should validate and test their design implementation to confirm system functionality. 9.1 Application Information This section highlights some of the design considerations when implementing this device in various applications. 9.2 Typical Application This typical application demonstrates how the TPS22948 device can be used to power downstream modules. IN + VIN ± H CIN RL RFLT CL L ON Fault GND TPS22948 Figure 8. Typical Application Schematic 9.2.1 Design Requirements For this design example, use the values listed in Table 3 as the design parameters: Table 3. Design Parameters DESIGN PARAMETER EXAMPLE VALUE Input Voltage (VIN ) 5V Load Current / Resistance (RL) 1 kΩ Load Capacitance (CL) 10 µF Maximum Inrush Current (IINRUSH) 100 mA Although the load capacitance is 10 µF, this is assumed to be at the end of a cable or closer to the load. An 18nF capacitance close to the output of the device is recommended for optimal performance during short circuit conditions. 9.2.2 Detailed Design Procedure 9.2.2.1 Limiting Inrush Current Use Equation 1 to find the maximum output capacitance for a given inrush current requirement. CL = IINRUSH × tR ÷ (0.8 × VIN) where • • • 10 CL = capacitance on VOUT (μF) IINRUSH = maximum acceptable inrush current (A) tR = rise time of the TPS22948 (μs) Submit Documentation Feedback Copyright © 2019, Texas Instruments Incorporated Product Folder Links: TPS22948 TPS22948 www.ti.com SLVSEZ7A – MARCH 2019 – REVISED OCTOBER 2019 • VIN = input voltage (V) (1) Based on Equation 1, the maximum output capacitance that limits the inrush current to 100 mA is 12.5 μF. Therefore, the desired 10-μF load capacitance will not exceed the inrush current design requirement during turn on. 9.2.3 Application Curves The below scope shot shows the inrush current generated from a 10-μF capacitance on the output. A. VIN = 5 V CL = 10 μF Figure 9. TPS22948 Inrush Current Control with Slow Rise Time Submit Documentation Feedback Copyright © 2019, Texas Instruments Incorporated Product Folder Links: TPS22948 11 TPS22948 SLVSEZ7A – MARCH 2019 – REVISED OCTOBER 2019 www.ti.com 10 Power Supply Recommendations The device is designed to operate with a VIN range of 2.5 V to 5.5 V. The VIN power supply must be well regulated and placed as close to the device terminal as possible. The power supply must be able to withstand all transient load current steps. In most situations, using an input capacitance (CIN) of 1 μF is sufficient to prevent the supply voltage from dipping when the switch is turned on. In cases where the power supply is slow to respond to a large transient current or large load current step, additional bulk capacitance may be required on the input. A 18nF capacitance close to the output of the device is recommended for optimal performance during short circuit conditions. 12 Submit Documentation Feedback Copyright © 2019, Texas Instruments Incorporated Product Folder Links: TPS22948 TPS22948 www.ti.com SLVSEZ7A – MARCH 2019 – REVISED OCTOBER 2019 11 Layout 11.1 Layout Guidelines For best performance, all traces must be as short as possible. To be most effective, the input and output capacitors must be placed close to the device to minimize the effects that parasitic trace inductances may have on normal operation. Using wide traces for VIN, VOUT, and GND helps minimize the parasitic electrical effects. 11.2 Layout Example IN 1 6 OUT GND 2 5 FLT ON 3 4 N/C GND Via To GPIO To GPIO Figure 10. Recommended Board Layout Submit Documentation Feedback Copyright © 2019, Texas Instruments Incorporated Product Folder Links: TPS22948 13 TPS22948 SLVSEZ7A – MARCH 2019 – REVISED OCTOBER 2019 www.ti.com 12 Device and Documentation Support 12.1 Receiving Notification of Documentation Updates To receive notification of documentation updates, navigate to the device product folder on ti.com. In the upper right corner, click on Alert me to register and receive a weekly digest of any product information that has changed. For change details, review the revision history included in any revised document. 12.2 Support Resources TI E2E™ support forums are an engineer's go-to source for fast, verified answers and design help — straight from the experts. Search existing answers or ask your own question to get the quick design help you need. Linked content is provided "AS IS" by the respective contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of Use. 12.3 Trademarks E2E is a trademark of Texas Instruments. All other trademarks are the property of their respective owners. 12.4 Electrostatic Discharge Caution This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications. 12.5 Glossary SLYZ022 — TI Glossary. This glossary lists and explains terms, acronyms, and definitions. 13 Mechanical, Packaging, and Orderable Information The following pages include mechanical, packaging, and orderable information. This information is the most current data available for the designated devices. This data is subject to change without notice and revision of this document. For browser-based versions of this data sheet, refer to the left-hand navigation. 14 Submit Documentation Feedback Copyright © 2019, Texas Instruments Incorporated Product Folder Links: TPS22948 PACKAGE MATERIALS INFORMATION www.ti.com 11-Oct-2019 TAPE AND REEL INFORMATION *All dimensions are nominal Device TPS22948DCKR Package Package Pins Type Drawing SC70 DCK 6 SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) 3000 178.0 9.0 Pack Materials-Page 1 2.4 B0 (mm) K0 (mm) P1 (mm) 2.5 1.2 4.0 W Pin1 (mm) Quadrant 8.0 Q3 PACKAGE MATERIALS INFORMATION www.ti.com 11-Oct-2019 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) TPS22948DCKR SC70 DCK 6 3000 180.0 180.0 18.0 Pack Materials-Page 2 IMPORTANT NOTICE AND DISCLAIMER TI PROVIDES TECHNICAL AND RELIABILITY DATA (INCLUDING DATASHEETS), DESIGN RESOURCES (INCLUDING REFERENCE DESIGNS), APPLICATION OR OTHER DESIGN ADVICE, WEB TOOLS, SAFETY INFORMATION, AND OTHER RESOURCES “AS IS” AND WITH ALL FAULTS, AND DISCLAIMS ALL WARRANTIES, EXPRESS AND IMPLIED, INCLUDING WITHOUT LIMITATION ANY IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE OR NON-INFRINGEMENT OF THIRD PARTY INTELLECTUAL PROPERTY RIGHTS. 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