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Table of Contents
User's Guide
TPS23731EVM-095 Evaluation Module
ABSTRACT
This user’s guide describes the TPS23731 evaluation module (EVM). The TPS23731 evaluation module
(TPS23731EVM-095) contains evaluation and reference circuitry for the TPS23731, which is a IEEE802.3bt
Class 4 PoE PD, EA Gen 2 Ready, controller suitable for Class 4 (25.5 W) PoE PD applications. The
TPS23731EVM-095 is targeted for 5-V primary side regulated synch flyback with high efficiency 25-W solutions.
Table of Contents
1 Introduction.............................................................................................................................................................................2
1.1 Features............................................................................................................................................................................. 2
1.2 Applications........................................................................................................................................................................2
2 Electrical Specifications........................................................................................................................................................ 2
3 Description.............................................................................................................................................................................. 3
4 General Configuration and Description................................................................................................................................4
4.1 Physical Access................................................................................................................................................................. 4
5 TPS23731EVM-095 Performance Data.................................................................................................................................. 5
5.1 Startup Response.............................................................................................................................................................. 5
5.2 Transient Response........................................................................................................................................................... 5
5.3 Efficiency............................................................................................................................................................................ 6
5.4 Load Regulation................................................................................................................................................................. 6
5.5 Hiccup Performance During an Output Short and Recovery............................................................................................. 7
5.6 Bode Plots..........................................................................................................................................................................8
6 EVM Assembly Drawings and Layout Guidelines............................................................................................................... 9
6.1 PCB Drawings....................................................................................................................................................................9
6.2 Layout Guidelines.............................................................................................................................................................. 9
6.3 EMI Containment............................................................................................................................................................. 10
7 Schematic.............................................................................................................................................................................. 11
8 Bill of Materials..................................................................................................................................................................... 13
9 Revision History................................................................................................................................................................... 18
List of Figures
Figure 5-1. DC/DC Startup.......................................................................................................................................................... 5
Figure 5-2. Transient Response from 500 mA to 5 A for a 48-V Input.........................................................................................5
Figure 5-3. Efficiency of the TPS23731EVM-095........................................................................................................................ 6
Figure 5-4. TPS23731EVM-095 Load Regulation....................................................................................................................... 6
Figure 5-5. DC/DC Hiccup Performance During an Output Short............................................................................................... 7
Figure 5-6. Bode Plot Response of the TPS23731EVM-095 ......................................................................................................8
Figure 6-1. Top-Side Routing and Component Placement.......................................................................................................... 9
Figure 6-2. Layer 2 Routing......................................................................................................................................................... 9
Figure 6-3. Layer 3 Routing......................................................................................................................................................... 9
Figure 6-4. Bottom Side Routing and Component Placement.....................................................................................................9
Figure 7-1. TPS23731EVM-095 Schematic Page One..............................................................................................................11
Figure 7-2. TPS23731EVM-095 Schematic Page Two..............................................................................................................12
List of Tables
Table 2-1. TPS23731EVM-095 Electrical and Performance Specifications at 25°C....................................................................2
Table 4-1. Connector Inputs.........................................................................................................................................................4
Table 4-2. Jumper Functionality...................................................................................................................................................4
Table 8-1. TPS23731EVM-095 Bill of Materials.........................................................................................................................13
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Trademarks
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Trademarks
All trademarks are the property of their respective owners.
1 Introduction
The TPS23731EVM-095 allows reference circuitry evaluation of the TPS23731 device. It contains input and
output power connectors and an array of onboard test points for circuit evaluation.
1.1 Features
•
•
•
•
•
IEEE802.3bt Class 4 compliant PoE PD
Integrated PWM controller for active clamp forward configuration
Frequency dithering for EMI reduction
Soft-start control with advanced startup and Hiccup mode overload protection
Soft-stop shutdown
1.2 Applications
•
•
•
•
•
IEEE 802.3bt compliant devices up to Class 4
Video and VoIP telephones
Access points
Pass-through system
Security cameras
2 Electrical Specifications
Table 2-1. TPS23731EVM-095 Electrical and Performance Specifications at 25°C
Design Example Specifications
Parameter
Test Conditions
MIN
TYP
MAX
Applied to the PoE Input
37
48
57
Unit
Power interface
Input voltage range
Applied ot the Adapter Input
48
Detection voltage
At device terminals
2.7
Classification voltage
At device terminals
14.5
Classification
10.1
V
20.5
4
Inrush current limit
Operating current limit
140
mA
0.925
A
DC-to-DC Converter
Output voltage
VIN = 48 V, iload ≤ iload (MAX)
5
V
Output current
37 V ≤ VIN ≤ 57 V
5
A
VIN = 48 V, iload = 1 A
30
mV
VIN = 48 V, iload = 500 mA
58
VIN = 48 V, iload = 2.5 A
86
Output ripple voltage peak-topeak
Efficiency, end to end
VIN = 48 V, iload = 5 A
Switching frequency
2
TPS23731EVM-095 Evaluation Module
%
89
250
kHz
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Description
3 Description
The TPS23731VM-095 enables full evaluation of the TPS23731 device. Refer to the schematic shown in Figure
7-1 and Figure 7-2. Ethernet power is applied from J1 and is dropped to the bridge rectifier. The Power over
Ethernet (PoE) transformer needed to transfer power or data is T1. The Bob Smith Terminations help balance
the Ethernet cabled impedance and are critical for ESD and EMI or EMC performance. The EMI or EMC filter
and transient protection for the TPS23731 device are at the output of the bridge rectifier.
Input power can also be applied at J3 from a DC source when power at J1 is not present.
The TPS23731 (U1) PD and DC-to-DC converter circuitry is shown in Figure 1. R28 provides the detection
signature. The switched side of the PD controller is to the right of U1. The TPS23731 RTN pin(s) provides inrush
limited turn on and charge of the bulk capacitor, C12.
The DC-to-DC converter is a high-efficiency primary side regulated synch flyback.
R34 provides a means for error injection to measure the frequency response of the converter.
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General Configuration and Description
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4 General Configuration and Description
4.1 Physical Access
Table 4-1 lists the EVM connector inputs. Table 4-2 describes the jumper functionality.
Table 4-1. Connector Inputs
Connector
Description
J1
PoE (Power+Data) input
J2
Data-only Ethernet
J3
Adapter input
J4
Output voltage connector
Table 4-2. Jumper Functionality
Jumper
4
Description
J7
APD selection. Short Pins 1 and 2 to turn OFF APD, Short Pins 2
and 3 to turn ON APD. Leave floating for input voltage related APD
threshold
J14
Dithering selection. Short Pins 1 and 2 to turn OFF Dithering, Short
Pins 2 and 3 to turn ON Dithering. Do NOT leave floating.
J18
Short to disable autoMPS. Float to enable autoMPS
J6
Logic or visual signal for APDO and T2P. Short Pins 1 and 2 visual
LED signal, Short Pins 2 and 3 to use a logic voltage signal.
J11
Short to bypass the output inductor (recommended).
J15
Output LED indicator
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TPS23731EVM-095 Performance Data
5 TPS23731EVM-095 Performance Data
5.1 Startup Response
Figure 5-1 shows the DC/DC startup response of the TPS23731EVM-095.
Figure 5-1. DC/DC Startup
5.2 Transient Response
Figure 5-2 shows the transient response of the TPS23731EVM-095.
Figure 5-2. Transient Response from 500 mA to 5 A for a 48-V Input
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TPS23731EVM-095 Performance Data
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5.3 Efficiency
Figure 5-3 shows the efficiency of the TPS23731EVM-095
Figure 5-3. Efficiency of the TPS23731EVM-095
5.4 Load Regulation
Figure 5-4. TPS23731EVM-095 Load Regulation
6
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TPS23731EVM-095 Performance Data
5.5 Hiccup Performance During an Output Short and Recovery
Figure 5-5. DC/DC Hiccup Performance During an Output Short
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5.6 Bode Plots
Figure 5-6 show the 500mA- and 5-A load bode plots.
Figure 5-6. Bode Plot Response of the TPS23731EVM-095
8
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EVM Assembly Drawings and Layout Guidelines
6 EVM Assembly Drawings and Layout Guidelines
6.1 PCB Drawings
Figure 6-1. Top-Side Routing and Component
Placement
Figure 6-2. Layer 2 Routing
Figure 6-3. Layer 3 Routing
Figure 6-4. Bottom Side Routing and Component
Placement
6.2 Layout Guidelines
The layout of the PoE front end should follow power and EMI or ESD best-practice guidelines. A basic set of
recommendations includes:
•
•
•
•
•
•
•
•
It is recommended having at least 8 vias (PAD G) and 5 vias on (PAD S) connecting the exposed thermal pad
through a top layer plane (2 oz copper recommended) to a bottom VSS plane (2 oz. copper recommended) to
help with thermal dissipation.
Place the primary MOSFET near the power transformer and keep the current sense resistor close to source
of the MOSFET to minimize the primary loop. The same is true for the secondary MOSFETs. Keep the
MOSFETs close to the transformer, and associated components as close together as possible to minimize
the loop.
Parts placement must be driven by power flow in a point-to-point manner; RJ-45, Ethernet transformer, diode
bridges, TVS and 0.1-μF capacitor, and TPS23731 converter input bulk capacitor.
Make all leads as short as possible with wide power traces and paired signal and return.
No crossovers of signals from one part of the flow to another are allowed.
Spacing consistent with safety standards like IEC60950 must be observed between the 48-V input voltage
rails and between the input and an isolated converter output.
Use large copper fills and traces on SMT power-dissipating devices, and use wide traces or overlay copper
fills in the power path.
Place the Schotty diode between VSS and RTN as close to the IC as possible, preferably on directly on the
opposite side of the board (ex. The TPS23731EVM-095 places the IC on the top side, so the diode is on the
bottom side directly underneath it).
The DC-to-DC converter layout benefits from basic rules such as:
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EVM Assembly Drawings and Layout Guidelines
•
•
•
•
•
•
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Having at least 4 vias (VDD) near the power transformer pin connected to VDD through multiple layer planes
to help with thermal dissipation of the power transformer.
Pair signals to reduce emissions and noise, especially the paths that carry high-current pulses, which include
the power semiconductors and magnetics
Minimize the trace length of high current power semiconductors and magnetic components
Use the ground plane for the switching currents carefully
Keep the high-current and high-voltage switching away from low-level sensing circuits including those outside
the power supply
Proper spacing around the high-voltage sections of the converter
6.3 EMI Containment
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
10
Use compact loops for dv/dt and di/dt circuit paths (power loops and gate drives)
Use minimal, yet thermally adequate, copper areas for heat sinking of components tied to switching
nodes (minimize exposed radiating surface). Hide copper associated with switching nodes under shielded
magnetics, where possible
Use copper ground planes (possible stitching) and top-layer copper floods (surround circuitry with ground
floods)
Use a 4-layer PCB, if economically feasible (for better grounding)
Minimize the amount of copper area associated with input traces (to minimize radiated pickup)
Heat sink the quiet side of components instead of the switching side, where possible (like the output side of
inductor)
Use Bob Smith terminations, Bob Smith EFT capacitor, and Bob Smith plane. Use Bob Smith plane as a
ground shield on input side of PCB (creating a phantom or literal earth ground)
Use LC filter at DC-to-DC input
Dampen high-frequency ringing on all switching nodes, if present (allow for possible snubbers)
Control rise times with gate-drive resistors and possibly snubbers
Switching frequency considerations
Use of EMI bridge capacitor across isolation boundary (isolated topologies)
Observe the polarity dot on inductors (embed noisy end)
Use of ferrite beads on input (allow for possible use of beads or 0-Ω resistors)
Maintain physical separation between input-related circuitry and power circuitry (use ferrite beads as
boundary line)
Balance efficiency versus acceptable noise margin
Possible use of common-mode inductors
Possible use of integrated RJ-45 jacks (shielded with internal transformer and Bob Smith terminations)
End-product enclosure considerations (shielding)
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Schematic
7 Schematic
Figure 7-1 and Figure 7-2 illustrate the EVM schematics.
Figure 7-1. TPS23731EVM-095 Schematic Page One
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Schematic
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Figure 7-2. TPS23731EVM-095 Schematic Page Two
12
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Schematic
8 Bill of Materials
Table 8-1 lists the TPS23731EVM-095 Bill of Materials (BOM).
Table 8-1. TPS23731EVM-095 Bill of Materials
Designator
QTY
Value
Description
Package Reference
Printed Circuit Board
Part Number
Manufacturer Alternate Part Alternate
Number
Manufacturer
PSIL095
Any
!PCB1
1
C1, C6
2
1000 pF
CAP, CERM, 1000 pF, 2000 V, +/- 10%, X7R,
1812
1812
GR443QR73D102KW MuRata
01L
C2, C3, C4, C5
4
0.01uF
CAP, CERM, 0.01 uF, 100 V, +/- 10%, X7R,
0603
0603
GRM188R72A103KA0 MuRata
1D
C7, C8, C9, C23
4
1000 pF
CAP, CERM, 1000 pF, 100 V, +/- 10%, X7R,
0603
0603
C1608X7R2A102K080 TDK
AA
C12
1
33uF
CAP, AL, 33 uF, 63 V, +/- 20%, 0.65 ohm,
AEC-Q200 Grade 2, SMD
SMT Radial F
EEE-FK1J330P
Panasonic
C13, C14
2
2.2uF
CAP, CERM, 2.2 uF, 100 V, +/- 10%, X7R,
1210
1210
GRM32ER72A225KA
35L
MuRata
C15, C30, C43
3
0.1uF
CAP, CERM, 0.1 uF, 100 V, +/- 10%, X7R,
0805
0805
C2012X7R2A104K125 TDK
AA
C16
1
330uF
CAP, Aluminum Polymer, 330 uF, 10 V, +/20%, 0.017 ohm, 8x10 SMD
8x10
10SVP330M
C18, C19, C20, C21
4
100uF
CAP, CERM, 100 uF, 16 V, +/- 20%, X5R,
1210
1210
C1210C107M4PAC78 Kemet
00
C22
1
1uF
CAP, CERM, 1 uF, 35 V, +/- 10%, X7R, AECQ200 Grade 0, 0603
0603
GMK107AB7105KAH
T
Taiyo Yuden
C28
1
2200 pF
CAP, CERM, 2200 pF, 2000 V, +/- 10%, X7R,
1812
1812
C4532X7R3D222K13
0KA
TDK
C33
1
0.047uF
CAP, CERM, 0.047 uF, 16 V, +/- 10%, X7R,
0603
0603
GRM188R71C473KA0 MuRata
1D
C35
1
0.015uF
CAP, CERM, 0.015 uF, 50 V, +/- 10%, X7R,
AEC-Q200 Grade 1, 0603
0603
C1608X7R1H153K08
0AA
C36
1
220 pF
CAP, CERM, 220 pF, 50 V, +/- 10%, X7R,
0603
0603
GRM188R71H221KA0 MuRata
1D
C37
1
1uF
CAP, CERM, 1 µF, 25 V,+/- 10%, X7R, 0603
0603
GRJ188R71E105KE1 MuRata
1D
C38, C41
2
0.1uF
CAP, CERM, 0.1 uF, 25 V, +/- 5%, X7R, 0603
0603
C0603C104J3RACTU Kemet
C39
1
2200 pF
CAP, CERM, 2200 pF, 50 V, +/- 10%, X7R,
0603
0603
C0603C222K5RAC
C40
1
3.3uF
CAP, CERM, 3.3 uF, 25 V, +/- 10%, X7R, 1206 1206
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Panasonic
TDK
Kemet
GRM31CR71E335KA MuRata
88L
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Schematic
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Table 8-1. TPS23731EVM-095 Bill of Materials (continued)
Designator
QTY
Value
C42, C44
2
1000 pF
D1, D2, D3, D4, D11,
D13, D14, D15, D16
9
D7
D8, D9, D17
Package Reference
Part Number
CAP, CERM, 1000 pF, 50 V, +/- 10%, X7R,
0603
0603
GRM188R71H102KA0 MuRata
1D
100 V
Diode, Schottky, 100 V, 2 A, SMB
SMB
B2100-13-F
Diodes Inc.
1
200 V
Diode, Ultrafast, 200 V, 1 A, SMA
SMA
ES1D-13-F
Diodes Inc.
3
100 V
Diode, Switching, 100 V, 0.2 A, SOD-123
SOD-123
MMSD4148T1G
ON
Semiconducto
r
D12
1
58 V
Diode, TVS, Uni, 58 V, SMA
SMA
SMAJ58A-13-F
Diodes Inc.
D18, D19
2
12 V
Diode, Zener, 12 V, 500 mW, SOD-123
SOD-123
MMSZ5242B-7-F
Diodes Inc.
D21, D22, D23
3
Yellow
LED, Yellow, SMD
LED_0603
150060YS75000
Wurth
Elektronik
FID1, FID2, FID3,
FID4, FID5, FID6
6
Fiducial mark. There is nothing to buy or
mount.
N/A
N/A
N/A
H1, H2, H3, H4
4
Bumpon, Hemisphere, 0.44 X 0.20, Clear
Transparent Bumpon
SJ-5303 (CLEAR)
3M
J1, J2
2
RJ45, No LED, tab up, R/A, TH
16.26x14.54x15.75
1-406541-1
TE
Connectivity
J3, J4
2
Terminal Block, 3.5mm Pitch, 2x1, TH
7.0x8.2x6.5mm
ED555/2DS
On-Shore
Technology
J6, J7, J14
3
Header, 100mil, 3x1, Tin, TH
Header, 3x1, 100mil,
TH
5-146278-3
TE
Connectivity
J11, J18
2
Header, 100mil, 2x1, Tin, TH
Header, 2x1, 100mil,
TH
5-146278-2
TE
Connectivity
J15
1
Header, 100mil, 2x1, Gold, TH
2x1 Header
TSW-102-07-G-S
Samtec
L1, L5, L6, L8
4
742792641
Wurth
Elektronik
L3
1
3.3uH
Inductor, Shielded Drum Core, Ferrite, 3.3 uH, WE-TPC-M1
1.8 A, 0.055 ohm, SMD
744042003
Wurth
Elektronik
Q2
1
150 V
MOSFET, N-CH, 150 V, 4.6 A, PQFN08A
PQFN08A
FDMS86252
Fairchild
Semiconducto
r
Q10
1
30 V
MOSFET, N-CH, 30 V, 19 A, DNH0008A
(VSONP-8)
DNH0008A
CSD17577Q3A
Texas
Instruments
R1, R2, R3, R4, R5,
R6, R7, R8
8
75.0
RES, 75.0, 1%, 0.1 W, AEC-Q200 Grade 0,
0603
0603
CRCW060375R0FKE Vishay-Dale
A
R9
1
100k
RES, 100 k, 1%, 0.1 W, AEC-Q200 Grade 0,
0603
0603
CRCW0603100KFKE
A
Vishay-Dale
R10
1
4.42k
RES, 4.42 k, 1%, 0.1 W, AEC-Q200 Grade 0,
0603
0603
CRCW06034K42FKE
A
Vishay-Dale
14
Description
300 ohm Ferrite Bead, 300 ohm @ 100 MHz, 2 A, 0603 0603
TPS23731EVM-095 Evaluation Module
Manufacturer Alternate Part Alternate
Number
Manufacturer
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Schematic
Table 8-1. TPS23731EVM-095 Bill of Materials (continued)
Designator
QTY
Value
R13
1
39k
R14
1
R16
1
R18
R19
Description
Package Reference
Part Number
Manufacturer Alternate Part Alternate
Number
Manufacturer
RES, 39 k, 5%, 0.25 W, AEC-Q200 Grade 0,
1206
1206
CRCW120639K0JNE
A
Vishay-Dale
4.7
RES, 4.7, 5%, 0.1 W, AEC-Q200 Grade 0,
0603
0603
CRCW06034R70JNE
A
Vishay-Dale
3.90
RES, 3.90, 1%, 0.125 W, AEC-Q200 Grade 0, 0805
0805
ERJ-6RQF3R9V
Panasonic
1
0.1
RES, 0.1, 1%, 0.5 W, 2010
2010
ERJ-L1DKF10CU
Panasonic
1
1.00k
RES, 1.00 k, 1%, 0.1 W, 0603
0603
RC0603FR-071KL
Yageo
R24
1
49.9k
RES, 49.9 k, 1%, 0.1 W, AEC-Q200 Grade 0,
0603
0603
CRCW060349K9FKE
A
Vishay-Dale
R27
1
31.6
RES, 31.6, 1%, 0.125 W, AEC-Q200 Grade 0, 0805
0805
CRCW080531R6FKE Vishay-Dale
A
R28
1
25.5k
RES, 25.5 k, 1%, 0.1 W, 0603
R30, R55, R56, R57,
R58
5
0
R31
1
R32
RC0603FR-0725K5L
Yageo
RES, 0, 5%, 0.1 W, AEC-Q200 Grade 0, 0603 0603
0603
ERJ-3GEY0R00V
Panasonic
10.0
RES, 10.0, 1%, 0.1 W, AEC-Q200 Grade 0,
0603
0603
CRCW060310R0FKE Vishay-Dale
A
1
110k
RES, 110 k, 1%, 0.1 W, AEC-Q200 Grade 0,
0603
0603
CRCW0603110KFKE
A
Vishay-Dale
R33
1
10.0k
RES, 10.0 k, 1%, 0.1 W, 0603
0603
RC0603FR-0710KL
Yageo
R34
1
49.9
RES, 49.9, 1%, 0.1 W, AEC-Q200 Grade 0,
0603
0603
CRCW060349R9FKE Vishay-Dale
A
R35
1
24.9k
RES, 24.9 k, 1%, 0.1 W, 0603
0603
RC0603FR-0724K9L
Yageo
R36, R48, R59, R60,
R61
5
10.0k
RES, 10.0 k, 1%, 0.1 W, AEC-Q200 Grade 0,
0603
0603
CRCW060310K0FKE
A
Vishay-Dale
R37
1
39.0k
RES, 39.0 k, 1%, 0.1 W, 0603
0603
RC0603FR-0739KL
Yageo
R38
1
4.22k
RES, 4.22 k, 1%, 0.1 W, AEC-Q200 Grade 0,
0603
0603
CRCW06034K22FKE
A
Vishay-Dale
R40
1
237k
RES, 237 k, 1%, 0.1 W, 0603
0603
RC0603FR-07237KL
Yageo
R41
1
3.3k
RES, 3.3 k, 5%, 0.125 W, AEC-Q200 Grade 0, 0805
0805
CRCW08053K30JNE
A
Vishay-Dale
R42
1
60.4k
RES, 60.4 k, 1%, 0.1 W, AEC-Q200 Grade 0,
0603
0603
CRCW060360K4FKE
A
Vishay-Dale
R43
1
51
RES, 51, 5%, 0.25 W, AEC-Q200 Grade 0,
1206
1206
CRCW120651R0JNE
A
Vishay-Dale
R47
1
499k
RES, 499 k, 1%, 0.1 W, AEC-Q200 Grade 0,
0603
0603
CRCW0603499KFKE
A
Vishay-Dale
SLUUCD2A – NOVEMBER 2020 – REVISED AUGUST 2023
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TPS23731EVM-095 Evaluation Module
Copyright © 2023 Texas Instruments Incorporated
15
Schematic
www.ti.com
Table 8-1. TPS23731EVM-095 Bill of Materials (continued)
Designator
QTY
Value
R69
1
10
SH-J1, SH-J2, SHJ3, SH-J4, SH-J5,
SH-J6
6
T1
1
Package Reference
Part Number
Manufacturer Alternate Part Alternate
Number
Manufacturer
RES, 10, 5%, 0.75 W, AEC-Q200 Grade 0,
2010
2010
CRCW201010R0JNE
F
Vishay-Dale
Shunt, 2.54mm, Gold, Black
Shunt, 2.54mm, Black 60900213421
Wurth
Elektronik
Transformer, PoE+, SMT
Transformer, SOIC-24 749022016
Wide
Wurth
Elektronik
T2
1
Flyback transformer for PoE applications
SMD10
LDT1038-50R
LinkCom
TP1, TP6, TP12,
TP18, TP43, TP45
6
Test Point, Miniature, Red, TH
Red Miniature
Testpoint
5000
Keystone
TP2, TP7, TP8,
TP14, TP30, TP37,
TP38, TP44
8
Test Point, Miniature, Black, TH
Black Miniature
Testpoint
5001
Keystone
TP3, TP5, TP9,
TP10, TP15, TP16,
TP17, TP19, TP20,
TP22, TP23, TP24,
TP25, TP26, TP27,
TP32
16
Test Point, Miniature, White, TH
White Miniature
Testpoint
5002
Keystone
TP4, TP11, TP13,
TP21, TP28, TP29,
TP33, TP34, TP39,
TP40, TP42
11
Test Point, Miniature, Orange, TH
Orange Miniature
Testpoint
5003
Keystone
U1
1
IEEE 802.3bt Type 3 Class 1-4 PoE PD with
No-Opto Flyback DC-DC Controller
VQFN45
TPS23731RMT
Texas
Instruments
U2, U3
2
Optocoupler, 5 kV, 300-600% CTR, SMT
DIP-4L Gullwing
FOD817DS
Fairchild
Semiconducto
r
C10
0
680 pF
CAP, CERM, 680 pF, 50 V, +/- 10%, X7R,
0603
0603
GRM188R71H681KA0 MuRata
1D
C11
0
2200 pF
CAP, CERM, 2200 pF, 2000 V, +/- 10%, X7R,
1812
1812
C4532X7R3D222K13
0KA
TDK
C17
0
220uF
CAP, Tantalum Polymer, 220 uF, 10 V, +/20%, 0.025 ohm, 7343-30 SMD
7343-30
10TPE220ML
Panasonic
C24, C25, C27, C29,
C31
0
330 pF
CAP, CERM, 330 pF, 50 V, +/- 5%, C0G/NP0,
0603
0603
GRM1885C1H331JA0 MuRata
1D
C34
0
56 pF
CAP, CERM, 56 pF, 50 V, +/- 1%, C0G/NP0,
0603
0603
06035A560FAT2A
C45
0
0.1uF
CAP, CERM, 0.1 uF, 100 V, +/- 10%, X7R,
0805
0805
C2012X7R2A104K125 TDK
AA
16
350uH
Description
TPS23731EVM-095 Evaluation Module
750320321
Wurth
Elektronik
AVX
SLUUCD2A – NOVEMBER 2020 – REVISED AUGUST 2023
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www.ti.com
Schematic
Table 8-1. TPS23731EVM-095 Bill of Materials (continued)
Designator
QTY
Value
D5, D6
0
100 V
D20
0
D25
0
J17
0
L2, L7
0
250uH
L4
0
150nH
Q1
0
Q3
0
Q4, Q5, Q6, Q7
Description
Package Reference
Part Number
Manufacturer Alternate Part Alternate
Number
Manufacturer
Diode, Switching, 100 V, 0.2 A, SOD-123
SOD-123
MMSD4148T1G
ON
Semiconducto
r
24 V
Diode, Zener, 24 V, 3 W, SMA
SMA
3SMAJ5934B-TP
Micro
Commercial
Components
100 V
Diode, Schottky, 100 V, 3 A, SMC
SMC
B3100-13-F
Diodes Inc.
Header, 100mil, 2x1, Tin, TH
Header, 2x1, 100mil,
TH
5-146278-2
TE
Connectivity
Coupled inductor, 250 uH, A, 0.035 ohm, SMD 8.7x10mm
744272251
Wurth
Elektronik
Inductor, Shielded Drum Core, Ferrite, 150 nH, 7x5x7mm
30 A, 0.000235 ohm, SMD
744302015
Wurth
Elektronik
40 V
Transistor, PNP, 40 V, 0.2 A, SOT-23
SOT-23
MMBT3906-7-F
Diodes Inc.
40 V
MOSFET, N-CH, 40 V, 15 A, DQJ0008A
(VSONP-8)
DQJ0008A
CSD18504Q5A
Texas
Instruments
0
100 V
MOSFET, N-CH, 100 V, 4.5 A, DQK0006C
(WSON-6)
DQK0006C
CSD19538Q2
Texas
Instruments
R11
0
4.7
RES, 4.7, 5%, 0.1 W, AEC-Q200 Grade 0,
0603
0603
CRCW06034R70JNE
A
Vishay-Dale
R12
0
4.99k
RES, 4.99 k, 1%, 0.1 W, AEC-Q200 Grade 0,
0603
0603
CRCW06034K99FKE
A
Vishay-Dale
R15, R17, R20, R21
0
R22, R25, R26, R29
0
232k
RES, 232 k, 1%, 0.1 W, AEC-Q200 Grade 0,
0603
0603
CRCW0603232KFKE
A
Vishay-Dale
R64, R65
0
10.0k
RES, 10.0 k, 1%, 0.1 W, AEC-Q200 Grade 0,
0603
0603
CRCW060310K0FKE
A
Vishay-Dale
R68
0
750k
RES, 750 k, 5%, 0.1 W, AEC-Q200 Grade 0,
0603
0603
CRCW0603750KJNE
A
Vishay-Dale
1.00Meg RES, 1.00 M, 1%, 0.1 W, AEC-Q200 Grade 0, 0603
0603
SLUUCD2A – NOVEMBER 2020 – REVISED AUGUST 2023
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CRCW06031M00FKE Vishay-Dale
A
TPS23731EVM-095 Evaluation Module
Copyright © 2023 Texas Instruments Incorporated
17
Revision History
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9 Revision History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
Changes from Revision * (November 2020) to Revision A (August 2023)
Page
• Added alternate part for T2 in Bill of Materials ................................................................................................ 13
18
TPS23731EVM-095 Evaluation Module
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Copyright © 2023 Texas Instruments Incorporated
STANDARD TERMS FOR EVALUATION MODULES
1.
Delivery: TI delivers TI evaluation boards, kits, or modules, including any accompanying demonstration software, components, and/or
documentation which may be provided together or separately (collectively, an “EVM” or “EVMs”) to the User (“User”) in accordance
with the terms set forth herein. User's acceptance of the EVM is expressly subject to the following terms.
1.1 EVMs are intended solely for product or software developers for use in a research and development setting to facilitate feasibility
evaluation, experimentation, or scientific analysis of TI semiconductors products. EVMs have no direct function and are not
finished products. EVMs shall not be directly or indirectly assembled as a part or subassembly in any finished product. For
clarification, any software or software tools provided with the EVM (“Software”) shall not be subject to the terms and conditions
set forth herein but rather shall be subject to the applicable terms that accompany such Software
1.2 EVMs are not intended for consumer or household use. EVMs may not be sold, sublicensed, leased, rented, loaned, assigned,
or otherwise distributed for commercial purposes by Users, in whole or in part, or used in any finished product or production
system.
2
Limited Warranty and Related Remedies/Disclaimers:
2.1 These terms do not apply to Software. The warranty, if any, for Software is covered in the applicable Software License
Agreement.
2.2 TI warrants that the TI EVM will conform to TI's published specifications for ninety (90) days after the date TI delivers such EVM
to User. Notwithstanding the foregoing, TI shall not be liable for a nonconforming EVM if (a) the nonconformity was caused by
neglect, misuse or mistreatment by an entity other than TI, including improper installation or testing, or for any EVMs that have
been altered or modified in any way by an entity other than TI, (b) the nonconformity resulted from User's design, specifications
or instructions for such EVMs or improper system design, or (c) User has not paid on time. Testing and other quality control
techniques are used to the extent TI deems necessary. TI does not test all parameters of each EVM.
User's claims against TI under this Section 2 are void if User fails to notify TI of any apparent defects in the EVMs within ten (10)
business days after delivery, or of any hidden defects with ten (10) business days after the defect has been detected.
2.3 TI's sole liability shall be at its option to repair or replace EVMs that fail to conform to the warranty set forth above, or credit
User's account for such EVM. TI's liability under this warranty shall be limited to EVMs that are returned during the warranty
period to the address designated by TI and that are determined by TI not to conform to such warranty. If TI elects to repair or
replace such EVM, TI shall have a reasonable time to repair such EVM or provide replacements. Repaired EVMs shall be
warranted for the remainder of the original warranty period. Replaced EVMs shall be warranted for a new full ninety (90) day
warranty period.
WARNING
Evaluation Kits are intended solely for use by technically qualified,
professional electronics experts who are familiar with the dangers
and application risks associated with handling electrical mechanical
components, systems, and subsystems.
User shall operate the Evaluation Kit within TI’s recommended
guidelines and any applicable legal or environmental requirements
as well as reasonable and customary safeguards. Failure to set up
and/or operate the Evaluation Kit within TI’s recommended
guidelines may result in personal injury or death or property
damage. Proper set up entails following TI’s instructions for
electrical ratings of interface circuits such as input, output and
electrical loads.
NOTE:
EXPOSURE TO ELECTROSTATIC DISCHARGE (ESD) MAY CAUSE DEGREDATION OR FAILURE OF THE EVALUATION
KIT; TI RECOMMENDS STORAGE OF THE EVALUATION KIT IN A PROTECTIVE ESD BAG.
www.ti.com
3
Regulatory Notices:
3.1 United States
3.1.1
Notice applicable to EVMs not FCC-Approved:
FCC NOTICE: This kit is designed to allow product developers to evaluate electronic components, circuitry, or software
associated with the kit to determine whether to incorporate such items in a finished product and software developers to write
software applications for use with the end product. This kit is not a finished product and when assembled may not be resold or
otherwise marketed unless all required FCC equipment authorizations are first obtained. Operation is subject to the condition
that this product not cause harmful interference to licensed radio stations and that this product accept harmful interference.
Unless the assembled kit is designed to operate under part 15, part 18 or part 95 of this chapter, the operator of the kit must
operate under the authority of an FCC license holder or must secure an experimental authorization under part 5 of this chapter.
3.1.2
For EVMs annotated as FCC – FEDERAL COMMUNICATIONS COMMISSION Part 15 Compliant:
CAUTION
This device complies with part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not
cause harmful interference, and (2) this device must accept any interference received, including interference that may cause
undesired operation.
Changes or modifications not expressly approved by the party responsible for compliance could void the user's authority to
operate the equipment.
FCC Interference Statement for Class A EVM devices
NOTE: This equipment has been tested and found to comply with the limits for a Class A digital device, pursuant to part 15 of
the FCC Rules. These limits are designed to provide reasonable protection against harmful interference when the equipment is
operated in a commercial environment. This equipment generates, uses, and can radiate radio frequency energy and, if not
installed and used in accordance with the instruction manual, may cause harmful interference to radio communications.
Operation of this equipment in a residential area is likely to cause harmful interference in which case the user will be required to
correct the interference at his own expense.
FCC Interference Statement for Class B EVM devices
NOTE: This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to part 15 of
the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential
installation. This equipment generates, uses and can radiate radio frequency energy and, if not installed and used in accordance
with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference
will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which
can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more
of the following measures:
•
•
•
•
Reorient or relocate the receiving antenna.
Increase the separation between the equipment and receiver.
Connect the equipment into an outlet on a circuit different from that to which the receiver is connected.
Consult the dealer or an experienced radio/TV technician for help.
3.2 Canada
3.2.1
For EVMs issued with an Industry Canada Certificate of Conformance to RSS-210 or RSS-247
Concerning EVMs Including Radio Transmitters:
This device complies with Industry Canada license-exempt RSSs. Operation is subject to the following two conditions:
(1) this device may not cause interference, and (2) this device must accept any interference, including interference that may
cause undesired operation of the device.
Concernant les EVMs avec appareils radio:
Le présent appareil est conforme aux CNR d'Industrie Canada applicables aux appareils radio exempts de licence. L'exploitation
est autorisée aux deux conditions suivantes: (1) l'appareil ne doit pas produire de brouillage, et (2) l'utilisateur de l'appareil doit
accepter tout brouillage radioélectrique subi, même si le brouillage est susceptible d'en compromettre le fonctionnement.
Concerning EVMs Including Detachable Antennas:
Under Industry Canada regulations, this radio transmitter may only operate using an antenna of a type and maximum (or lesser)
gain approved for the transmitter by Industry Canada. To reduce potential radio interference to other users, the antenna type
and its gain should be so chosen that the equivalent isotropically radiated power (e.i.r.p.) is not more than that necessary for
successful communication. This radio transmitter has been approved by Industry Canada to operate with the antenna types
listed in the user guide with the maximum permissible gain and required antenna impedance for each antenna type indicated.
Antenna types not included in this list, having a gain greater than the maximum gain indicated for that type, are strictly prohibited
for use with this device.
2
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Concernant les EVMs avec antennes détachables
Conformément à la réglementation d'Industrie Canada, le présent émetteur radio peut fonctionner avec une antenne d'un type et
d'un gain maximal (ou inférieur) approuvé pour l'émetteur par Industrie Canada. Dans le but de réduire les risques de brouillage
radioélectrique à l'intention des autres utilisateurs, il faut choisir le type d'antenne et son gain de sorte que la puissance isotrope
rayonnée équivalente (p.i.r.e.) ne dépasse pas l'intensité nécessaire à l'établissement d'une communication satisfaisante. Le
présent émetteur radio a été approuvé par Industrie Canada pour fonctionner avec les types d'antenne énumérés dans le
manuel d’usage et ayant un gain admissible maximal et l'impédance requise pour chaque type d'antenne. Les types d'antenne
non inclus dans cette liste, ou dont le gain est supérieur au gain maximal indiqué, sont strictement interdits pour l'exploitation de
l'émetteur
3.3 Japan
3.3.1
3.3.2
Notice for EVMs delivered in Japan: Please see http://www.tij.co.jp/lsds/ti_ja/general/eStore/notice_01.page 日本国内に
輸入される評価用キット、ボードについては、次のところをご覧ください。
https://www.ti.com/ja-jp/legal/notice-for-evaluation-kits-delivered-in-japan.html
Notice for Users of EVMs Considered “Radio Frequency Products” in Japan: EVMs entering Japan may not be certified
by TI as conforming to Technical Regulations of Radio Law of Japan.
If User uses EVMs in Japan, not certified to Technical Regulations of Radio Law of Japan, User is required to follow the
instructions set forth by Radio Law of Japan, which includes, but is not limited to, the instructions below with respect to EVMs
(which for the avoidance of doubt are stated strictly for convenience and should be verified by User):
1.
2.
3.
Use EVMs in a shielded room or any other test facility as defined in the notification #173 issued by Ministry of Internal
Affairs and Communications on March 28, 2006, based on Sub-section 1.1 of Article 6 of the Ministry’s Rule for
Enforcement of Radio Law of Japan,
Use EVMs only after User obtains the license of Test Radio Station as provided in Radio Law of Japan with respect to
EVMs, or
Use of EVMs only after User obtains the Technical Regulations Conformity Certification as provided in Radio Law of Japan
with respect to EVMs. Also, do not transfer EVMs, unless User gives the same notice above to the transferee. Please note
that if User does not follow the instructions above, User will be subject to penalties of Radio Law of Japan.
【無線電波を送信する製品の開発キットをお使いになる際の注意事項】 開発キットの中には技術基準適合証明を受けて
いないものがあります。 技術適合証明を受けていないもののご使用に際しては、電波法遵守のため、以下のいずれかの
措置を取っていただく必要がありますのでご注意ください。
1.
2.
3.
電波法施行規則第6条第1項第1号に基づく平成18年3月28日総務省告示第173号で定められた電波暗室等の試験設備でご使用
いただく。
実験局の免許を取得後ご使用いただく。
技術基準適合証明を取得後ご使用いただく。
なお、本製品は、上記の「ご使用にあたっての注意」を譲渡先、移転先に通知しない限り、譲渡、移転できないものとします。
上記を遵守頂けない場合は、電波法の罰則が適用される可能性があることをご留意ください。 日本テキサス・イ
ンスツルメンツ株式会社
東京都新宿区西新宿６丁目２４番１号
西新宿三井ビル
3.3.3
Notice for EVMs for Power Line Communication: Please see http://www.tij.co.jp/lsds/ti_ja/general/eStore/notice_02.page
電力線搬送波通信についての開発キットをお使いになる際の注意事項については、次のところをご覧くださ
い。https://www.ti.com/ja-jp/legal/notice-for-evaluation-kits-for-power-line-communication.html
3.4 European Union
3.4.1
For EVMs subject to EU Directive 2014/30/EU (Electromagnetic Compatibility Directive):
This is a class A product intended for use in environments other than domestic environments that are connected to a
low-voltage power-supply network that supplies buildings used for domestic purposes. In a domestic environment this
product may cause radio interference in which case the user may be required to take adequate measures.
3
www.ti.com
4
EVM Use Restrictions and Warnings:
4.1 EVMS ARE NOT FOR USE IN FUNCTIONAL SAFETY AND/OR SAFETY CRITICAL EVALUATIONS, INCLUDING BUT NOT
LIMITED TO EVALUATIONS OF LIFE SUPPORT APPLICATIONS.
4.2 User must read and apply the user guide and other available documentation provided by TI regarding the EVM prior to handling
or using the EVM, including without limitation any warning or restriction notices. The notices contain important safety information
related to, for example, temperatures and voltages.
4.3 Safety-Related Warnings and Restrictions:
4.3.1
User shall operate the EVM within TI’s recommended specifications and environmental considerations stated in the user
guide, other available documentation provided by TI, and any other applicable requirements and employ reasonable and
customary safeguards. Exceeding the specified performance ratings and specifications (including but not limited to input
and output voltage, current, power, and environmental ranges) for the EVM may cause personal injury or death, or
property damage. If there are questions concerning performance ratings and specifications, User should contact a TI
field representative prior to connecting interface electronics including input power and intended loads. Any loads applied
outside of the specified output range may also result in unintended and/or inaccurate operation and/or possible
permanent damage to the EVM and/or interface electronics. Please consult the EVM user guide prior to connecting any
load to the EVM output. If there is uncertainty as to the load specification, please contact a TI field representative.
During normal operation, even with the inputs and outputs kept within the specified allowable ranges, some circuit
components may have elevated case temperatures. These components include but are not limited to linear regulators,
switching transistors, pass transistors, current sense resistors, and heat sinks, which can be identified using the
information in the associated documentation. When working with the EVM, please be aware that the EVM may become
very warm.
4.3.2
EVMs are intended solely for use by technically qualified, professional electronics experts who are familiar with the
dangers and application risks associated with handling electrical mechanical components, systems, and subsystems.
User assumes all responsibility and liability for proper and safe handling and use of the EVM by User or its employees,
affiliates, contractors or designees. User assumes all responsibility and liability to ensure that any interfaces (electronic
and/or mechanical) between the EVM and any human body are designed with suitable isolation and means to safely
limit accessible leakage currents to minimize the risk of electrical shock hazard. User assumes all responsibility and
liability for any improper or unsafe handling or use of the EVM by User or its employees, affiliates, contractors or
designees.
4.4 User assumes all responsibility and liability to determine whether the EVM is subject to any applicable international, federal,
state, or local laws and regulations related to User’s handling and use of the EVM and, if applicable, User assumes all
responsibility and liability for compliance in all respects with such laws and regulations. User assumes all responsibility and
liability for proper disposal and recycling of the EVM consistent with all applicable international, federal, state, and local
requirements.
5.
Accuracy of Information: To the extent TI provides information on the availability and function of EVMs, TI attempts to be as accurate
as possible. However, TI does not warrant the accuracy of EVM descriptions, EVM availability or other information on its websites as
accurate, complete, reliable, current, or error-free.
6.
Disclaimers:
6.1 EXCEPT AS SET FORTH ABOVE, EVMS AND ANY MATERIALS PROVIDED WITH THE EVM (INCLUDING, BUT NOT
LIMITED TO, REFERENCE DESIGNS AND THE DESIGN OF THE EVM ITSELF) ARE PROVIDED "AS IS" AND "WITH ALL
FAULTS." TI DISCLAIMS ALL OTHER WARRANTIES, EXPRESS OR IMPLIED, REGARDING SUCH ITEMS, INCLUDING BUT
NOT LIMITED TO ANY EPIDEMIC FAILURE WARRANTY OR IMPLIED WARRANTIES OF MERCHANTABILITY OR FITNESS
FOR A PARTICULAR PURPOSE OR NON-INFRINGEMENT OF ANY THIRD PARTY PATENTS, COPYRIGHTS, TRADE
SECRETS OR OTHER INTELLECTUAL PROPERTY RIGHTS.
6.2 EXCEPT FOR THE LIMITED RIGHT TO USE THE EVM SET FORTH HEREIN, NOTHING IN THESE TERMS SHALL BE
CONSTRUED AS GRANTING OR CONFERRING ANY RIGHTS BY LICENSE, PATENT, OR ANY OTHER INDUSTRIAL OR
INTELLECTUAL PROPERTY RIGHT OF TI, ITS SUPPLIERS/LICENSORS OR ANY OTHER THIRD PARTY, TO USE THE
EVM IN ANY FINISHED END-USER OR READY-TO-USE FINAL PRODUCT, OR FOR ANY INVENTION, DISCOVERY OR
IMPROVEMENT, REGARDLESS OF WHEN MADE, CONCEIVED OR ACQUIRED.
7.
4
USER'S INDEMNITY OBLIGATIONS AND REPRESENTATIONS. USER WILL DEFEND, INDEMNIFY AND HOLD TI, ITS
LICENSORS AND THEIR REPRESENTATIVES HARMLESS FROM AND AGAINST ANY AND ALL CLAIMS, DAMAGES, LOSSES,
EXPENSES, COSTS AND LIABILITIES (COLLECTIVELY, "CLAIMS") ARISING OUT OF OR IN CONNECTION WITH ANY
HANDLING OR USE OF THE EVM THAT IS NOT IN ACCORDANCE WITH THESE TERMS. THIS OBLIGATION SHALL APPLY
WHETHER CLAIMS ARISE UNDER STATUTE, REGULATION, OR THE LAW OF TORT, CONTRACT OR ANY OTHER LEGAL
THEORY, AND EVEN IF THE EVM FAILS TO PERFORM AS DESCRIBED OR EXPECTED.
www.ti.com
8.
Limitations on Damages and Liability:
8.1 General Limitations. IN NO EVENT SHALL TI BE LIABLE FOR ANY SPECIAL, COLLATERAL, INDIRECT, PUNITIVE,
INCIDENTAL, CONSEQUENTIAL, OR EXEMPLARY DAMAGES IN CONNECTION WITH OR ARISING OUT OF THESE
TERMS OR THE USE OF THE EVMS , REGARDLESS OF WHETHER TI HAS BEEN ADVISED OF THE POSSIBILITY OF
SUCH DAMAGES. EXCLUDED DAMAGES INCLUDE, BUT ARE NOT LIMITED TO, COST OF REMOVAL OR
REINSTALLATION, ANCILLARY COSTS TO THE PROCUREMENT OF SUBSTITUTE GOODS OR SERVICES, RETESTING,
OUTSIDE COMPUTER TIME, LABOR COSTS, LOSS OF GOODWILL, LOSS OF PROFITS, LOSS OF SAVINGS, LOSS OF
USE, LOSS OF DATA, OR BUSINESS INTERRUPTION. NO CLAIM, SUIT OR ACTION SHALL BE BROUGHT AGAINST TI
MORE THAN TWELVE (12) MONTHS AFTER THE EVENT THAT GAVE RISE TO THE CAUSE OF ACTION HAS
OCCURRED.
8.2 Specific Limitations. IN NO EVENT SHALL TI'S AGGREGATE LIABILITY FROM ANY USE OF AN EVM PROVIDED
HEREUNDER, INCLUDING FROM ANY WARRANTY, INDEMITY OR OTHER OBLIGATION ARISING OUT OF OR IN
CONNECTION WITH THESE TERMS, , EXCEED THE TOTAL AMOUNT PAID TO TI BY USER FOR THE PARTICULAR
EVM(S) AT ISSUE DURING THE PRIOR TWELVE (12) MONTHS WITH RESPECT TO WHICH LOSSES OR DAMAGES ARE
CLAIMED. THE EXISTENCE OF MORE THAN ONE CLAIM SHALL NOT ENLARGE OR EXTEND THIS LIMIT.
9.
Return Policy. Except as otherwise provided, TI does not offer any refunds, returns, or exchanges. Furthermore, no return of EVM(s)
will be accepted if the package has been opened and no return of the EVM(s) will be accepted if they are damaged or otherwise not in
a resalable condition. If User feels it has been incorrectly charged for the EVM(s) it ordered or that delivery violates the applicable
order, User should contact TI. All refunds will be made in full within thirty (30) working days from the return of the components(s),
excluding any postage or packaging costs.
10. Governing Law: These terms and conditions shall be governed by and interpreted in accordance with the laws of the State of Texas,
without reference to conflict-of-laws principles. User agrees that non-exclusive jurisdiction for any dispute arising out of or relating to
these terms and conditions lies within courts located in the State of Texas and consents to venue in Dallas County, Texas.
Notwithstanding the foregoing, any judgment may be enforced in any United States or foreign court, and TI may seek injunctive relief
in any United States or foreign court.
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2023, Texas Instruments Incorporated
5
IMPORTANT NOTICE AND DISCLAIMER
TI PROVIDES TECHNICAL AND RELIABILITY DATA (INCLUDING DATA SHEETS), DESIGN RESOURCES (INCLUDING REFERENCE
DESIGNS), APPLICATION OR OTHER DESIGN ADVICE, WEB TOOLS, SAFETY INFORMATION, AND OTHER RESOURCES “AS IS”
AND WITH ALL FAULTS, AND DISCLAIMS ALL WARRANTIES, EXPRESS AND IMPLIED, INCLUDING WITHOUT LIMITATION ANY
IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE OR NON-INFRINGEMENT OF THIRD
PARTY INTELLECTUAL PROPERTY RIGHTS.
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