TPS23734EVM-094

www.ti.com Table of Contents User’s Guide TPS23734EVM-094 Evaluation Module ABSTRACT This user’s guide describes the TPS23734 evaluation module (EVM). The TPS23734 evaluation module (TPS23734EVM-094) contains evaluation and reference circuitry for the TPS23734, which is a IEEE802.3bt Class 4 PoE PD, EA Gen 2 Ready, controller suitable for Class 4 (25.5 W) PoE PD applications. The TPS23734EVM-094 is targeted for a 5-V active clamp forward high efficiency 25-W solution. Table of Contents 1 Introduction.............................................................................................................................................................................3 1.1 Features............................................................................................................................................................................. 3 1.2 Applications........................................................................................................................................................................3 2 Electrical Specifications........................................................................................................................................................ 3 3 Description.............................................................................................................................................................................. 4 4 Schematic and Bill of Materials.............................................................................................................................................5 5 General Configuration and Description................................................................................................................................7 5.1 Physical Access................................................................................................................................................................. 7 6 TPS23734EVM-094 Performance Data.................................................................................................................................. 9 6.1 Startup to PSE and DC/DC Startup................................................................................................................................... 9 6.2 Transient Response........................................................................................................................................................... 9 6.3 Efficiency..........................................................................................................................................................................10 6.4 Load Regulation............................................................................................................................................................... 10 6.5 Hiccup Performance During an Output Short and Recovery............................................................................................11 6.6 Bode Plots........................................................................................................................................................................12 7 EVM Assembly Drawings and Layout Guidelines............................................................................................................. 13 7.1 PCB Drawings..................................................................................................................................................................13 7.2 Layout Guidelines............................................................................................................................................................ 13 7.3 EMI Containment............................................................................................................................................................. 14 8 Bill of Materials..................................................................................................................................................................... 15 9 Revision History................................................................................................................................................................... 22 List of Figures Figure 4-1. TPS23734EVM-094 Schematic Page One............................................................................................................... 5 Figure 4-2. TPS23734EVM-094 Schematic Page Two................................................................................................................6 Figure 6-1. DC/DC Start-up......................................................................................................................................................... 9 Figure 6-2. Transient Response from 0 mA to 5 A for a 48-V Input.............................................................................................9 Figure 6-3. Efficiency of the TPS23734EVM-094...................................................................................................................... 10 Figure 6-4. TPS23734EVM-094 Load Regulation..................................................................................................................... 10 Figure 6-5. DC/DC Hiccup Performance During an Output Short..............................................................................................11 Figure 6-6. Bode Plot Response of the TPS23734EVM-094 With 0-A Load.............................................................................12 Figure 6-7. Bode Plot Response of the TPS23734EVM-094 With 5-A Load.............................................................................12 Figure 7-1. Top-Side Routing and Component Placement........................................................................................................ 13 Figure 7-2. Layer 2 Routing....................................................................................................................................................... 13 Figure 7-3. Layer 3 Routing....................................................................................................................................................... 13 Figure 7-4. Bottom Side Routing and Component Placement...................................................................................................13 List of Tables Table 2-1. TPS23734EVM-094 Electrical and Performance Specifications at 25°C....................................................................3 Table 5-1. Connector Functionality.............................................................................................................................................. 7 Table 5-2. Test Points.................................................................................................................................................................. 7 Table 8-1. TPS23734EVM-094 Bill of Materials.........................................................................................................................15 SLUUCB6A – JUNE 2020 – REVISED AUGUST 2022 Submit Document Feedback TPS23734EVM-094 Evaluation Module Copyright © 2022 Texas Instruments Incorporated 1 Trademarks www.ti.com Trademarks All trademarks are the property of their respective owners. 2 TPS23734EVM-094 Evaluation Module SLUUCB6A – JUNE 2020 – REVISED AUGUST 2022 Submit Document Feedback Copyright © 2022 Texas Instruments Incorporated www.ti.com Introduction 1 Introduction The TPS23734EVM-094 allows reference circuitry evaluation of the TPS23734 device. The TPS23734EVM-094 contains input and output power connectors and an array of onboard test points for circuit evaluation. 1.1 Features • • • • • IEEE802.3bt Class 4 compliant PoE PD Integrated PWM controller for active clamp forward configuration Frequency dithering for EMI reduction Soft-start control with advanced start-up and hiccup mode overload protection Soft-stop shutdown 1.2 Applications • • • • • • IEEE 802.3bt compliant devices Video and VoIP telephones Access points Pass-through system Security cameras Redundant power feeds or power sharing 2 Electrical Specifications Table 2-1. TPS23734EVM-094 Electrical and Performance Specifications at 25°C Design Example Specifications Parameter Test Conditions MIN TYP MAX Applied to the PoE Input 37 48 57 Unit Power interface Input voltage range Applied ot the Adapter Input 48 Detection voltage At device terminals 2.7 Classification voltage At device terminals 14.5 Classification 10.1 V 20.5 4 Inrush current limit Operating current limit 140 mA 0.925 A DC-to-DC Converter Output voltage VIN = 48 V, iload ≤ iload (MAX) 5 V Output current 37 V ≤ VIN ≤ 57 V 5 A VIN = 48 V, iload = 1 A 15 mV VIN = 48 V, iload = 500 mA 82 VIN = 48 V, iload = 2.5 A 91 VIN = 48 V, iload = 5 A 90 Output ripple voltage peak-topeak Efficiency, end to end Switching frequency 250 SLUUCB6A – JUNE 2020 – REVISED AUGUST 2022 Submit Document Feedback % kHz TPS23734EVM-094 Evaluation Module Copyright © 2022 Texas Instruments Incorporated 3 Description www.ti.com 3 Description The TPS23734VM-094 enables full evaluation of the TPS23734 device. Refer to the schematic shown in Figure 4-1 and Figure 4-2. Ethernet power is applied from J2 and is dropped to the bridge rectifier. The Power over Ethernet (PoE) transformer needed to transfer power or data is T1. The Bob Smith Terminations help balance the Ethernet cabled impedance and are critical for ESD and EMI or EMC performance. The EMI or EMC filter and transient protection for the TPS23734 device are at the output of the bridge rectifier. Input power can also be applied at J3 from a DC source when power at J1 is not present. The TPS23734 (U1) PD and DC-to-DC converter circuitry is shown in Figure 1. R36 provides the detection signature. The switched side of the PD controller is to the right of U1. The TPS23734 RTN pins provide inrush limited turn-on and charge of the bulk capacitor, C19. The DC-to-DC converter is a high-efficiency active clamp forward converter. R43 provides a means for error injection to measure the frequency response of the converter. 4 TPS23734EVM-094 Evaluation Module SLUUCB6A – JUNE 2020 – REVISED AUGUST 2022 Submit Document Feedback Copyright © 2022 Texas Instruments Incorporated www.ti.com Schematic and Bill of Materials 4 Schematic and Bill of Materials Figure 4-1 and Figure 4-2 illustrate the EVM schematics. C16 2kV 2200pF PGND D25 GND DNP C17 60V C45 DNP DNP 2kV 2200pF VDD 100V 0.047uF GND D24 L9 R20 110k VCC D12 2.2mH LINEUV TP19 R24 10.0k GND C46 D13 C27 25V 1uF R61 DNP 10k DNP R62 5.1 4.7nF 50V VOUT TP13 L8 10 9 1 VDD 1 3.3uH C19 63V 47uF C20 100V 2.2uF C21 100V 2.2uF Q5 FCX493TA 3 2,4 R26 LDT6037 TP16 Q8 CSD17510Q5A 4 TP18 5,6, 7,8 R45 DNP 8.06k TP36 DNP DNP GND J9 4 100pF 25V D14 12V GND Q6 CSD17510Q5A Q7 499 C24 5V/5A 1 2 TP15 2 PGND VOUT 10uH DNPC23 100pF 25V DNP 3 C42 100V 0.1uF D10 R64 10.0 5 PGND 5,6, 7,8 L7 TP14 D11 R25 DNP 4.02k 1,2,3 TP28 6 7 1 T2 4 2,4 PGND PGND C37 10V 220uF C26 6.3V 100µF C25 6.3V 100µF D15 TP17 TP41 12V 1,2,3 R65 C28 TP38 7 8 9 PGND 2 1 J13 PGND BT TPH TPL R31 VSS J14 11 12 13 14 17 49.9k 2 18 DNP1 PPD R38 TP29 21 31.6 R39 DNP 31.6 VSS 19 20 R36 VDD 24 25.5k 30 31 R41 42.2k 32 VB APD LINEUV RTN RTN RTN PSRS VBG EMPS GAT2 NC GATE APDO T2P CP NC NC NC NC NC NC NC NC REF NC NC CLS NC AGND DEN GND TEST VSS VSS DT PAD_G PAD_S I_STP VB R66 DNP 10k TP46 COMP C31 4 36 VB C32 50V 0.1uF 37 38 Q9 FDMC2523P LINEUV D26 60V R29 10.0k D16 DNP 100nF TP35 VOUT 39 C34 40 41 TP23 100nF PGND TP24 TP25 R30 43 D17 6 10 15 16 22 25 26 29 Q10 FDMS86252 4 4.7 44 R43 49.9 VB TP33 2 C33 2.2nF 50V 5 EA_DIS FRS 35 DNP R44 511 TP27 R19 2.00k TP31 CS C35 50V 47pF 45 PGND 27 28 4 COMP R33 2 R35 0.1 VSS R49 10.0k R48 DNP D18 2.00k BAT54S-7-F 3 4.99k 2 TP32 TCMT1107 TP22 PGND C41 1µF 50V PGND TP47 C39 R51 1 3 2.49k PGND 46 47 R47 866 C36 68nF U2 1 APD R28 60.4k DTHR COMP 100V 0.047uF DNP PGND 47nF 50V 100pF 25V C40 R50 10.2k 22nF 50V 4 4 237k FB CS 34 3 R27 VCC 33 U3A TLV431IDBVR 5 3 VB SST 5,6, 7,8 1 2 3 1 CS VDD 1,2,3 TP37 42 5,6, 7,8 VCC PGND TP45 C29 23 TP21 C30 100nF J12 50V D27 TP34 U1 100V 0.1uF GND DNP 1,2,3 VSS TP20 C44 1nF C48 5.1 250V 0.047uF C38 TP40 R53 3.24k TPS23734RMT R46 TP30 499k TP39 D23 GND J6 VSS B3100-13-F TP42 VCC TPH R54 DNP 10.0k U4 1 4 DNP 2 DNP 2 D8 Yellow 1 1 DNP D7 Yellow R21 10.0k DNP D9 Yellow 1 R42 R59 R60 DNP 10.0k DNP 10.0kDNP 10.0k VOUT 2 PGND 2 3 2 1 PGND R22 10.0k R23 10.0k 3 DNP FOD817DS TP10 GND R55 VCC 10.0k TPL TP43 U5 1 4 2 3 FOD817DS TP11 GND TP44 VB BT R56 DNP 10.0k U6 1 2 4 DNP DNP 3 DNP FOD817DS TP12 GND Figure 4-1. TPS23734EVM-094 Schematic Page One SLUUCB6A – JUNE 2020 – REVISED AUGUST 2022 Submit Document Feedback TPS23734EVM-094 Evaluation Module Copyright © 2022 Texas Instruments Incorporated 5 Schematic and Bill of Materials www.ti.com J1 T1 42-57VDC Type 2 23 1 2 3 4 5 6 7 8 9 10 11 12 PR12 MX1+ TD1+ 2 TCT1 1 24 MCT4 22 MX1- TD1- 3 20 MX2+ TD2+ 5 21 MCT2 TCT2 4 19 MX2- TD2- 6 17 MX3+ TD3+ 8 TCT3 7 J2 1 2 3 4 5 6 7 8 PR12 PR36 PR45 PR78 9 10 11 12 TP1 TP2 TP3 TP4 PAIR12 PAIR36 PAIR45 PAIR78 C1 10nF 100V C2 10nF 100V C3 10nF 100V EARTH PR36 EARTH PR45 PR78 18 MCT3 16 MX3- TD3- 9 14 MX4+ TD4+ 11 15 MCT4 TCT4 10 13 MX4- TD4- R1 75.0 R2 75.0 R3 75.0 C4 10nF 100V R4 75.0 C5 2kV 1000pF R5 75.0 12 R6 75.0 R7 75.0 R8 75.0 TP5 EARTH 7490220122 C6 2kV 1000pF EARTH EARTH TP48 L4 C13 1nF 100V B2100-13-F D6 L5 250uH DNP 3 J3 0 R17 100k C14 1nF 100V TP9 APD 35V L6 R34 APD 3 2 1 2 GND 1 R32 1 2 4 42-57VDC R18 4.42k J15 0 TP26 PGND TP6 L1 R37 D3 B2100-13-F D4 B2100-13-F PR36 R13 DNPC9 DNP 50V 232k 330pF R14 DNP 232k DNPC10 50V 330pF D21 R12 DNP 1.00M 3 R15 DNPC11 DNP 50V 232k 330pF R16 DNP 232k C7 1nF 100V Q4 DNP DNP1 L2 250uH DNP J5 C8 1nF 100V D5 SMBJ58A-13-F 58V R57 TP8 DNP 100k DNP PPD 4 1,2, 5,6,8 R11 DNP 1.00M 3 3 DNP D20 Q2 4,7 Q3 DNP 4,7 3 5,6,8 1,2, R10 DNP 1.00M 3 4,7 R9 DNP 1.00M 1,2, 5,6,8 Q1 4,7 5,6,8 1,2, PR45 DNP D19 2 PR78 PR12 1 D2 B2100-13-F 2 D1 B2100-13-F VDD VDD 0 D22 DNPC12 50V 330pF TP7 R40 0 R58 DNPC47 470pF DNP 15.0k 100V L3 VSS VSS Figure 4-2. TPS23734EVM-094 Schematic Page Two 6 TPS23734EVM-094 Evaluation Module SLUUCB6A – JUNE 2020 – REVISED AUGUST 2022 Submit Document Feedback Copyright © 2022 Texas Instruments Incorporated www.ti.com General Configuration and Description 5 General Configuration and Description 5.1 Physical Access Table 5-1 lists the EVM connector functionality. Table 5-2 describes the test point availability and jumper functionality. Table 5-1. Connector Functionality Connector Description J12 Connects DTH to either FRS or VB J15 Enable or disable APD for adapter input from J3 J13 Enable or disable EMPS J6 Select T2P to output on resistor, LED, or leave open Table 5-2. Test Points Test Point Description TP1 Pair 12 TP2 Pair 36 TP3 Pair 45 TP4 Pair 78 TP5 Earth TP6 VDD TP7 VSS TP8 PPD TP9 APD TP11 T2P TP13 VOUT TP14 Gate of Q6 TP15 Drain of Q6 TP16 Gate of Q8 TP17 Secondary Ground: GND TP18 Drain of Q8 TP19 LINEUV TP20 VCC TP21 CS TP22 Primary Ground: PGND TP23 GAT2 TP24 GATE TP25 Gate of Q10 TP26 J3 Negative Input TP27 Primary Ground: PGND TP28 VDD TP29 VSS TP30 I_STP TP31 Sense Resistor R35 TP32 COMP TP33 VB TP34 SST TP35 Drain of Q10 TP36 GND TP37 DTHR SLUUCB6A – JUNE 2020 – REVISED AUGUST 2022 Submit Document Feedback TPS23734EVM-094 Evaluation Module Copyright © 2022 Texas Instruments Incorporated 7 General Configuration and Description www.ti.com Table 5-2. Test Points (continued) 8 Test Point Description TP38 PGND TP39 PGND TP40 GND TP41 GND TP43 T2P Opto Output TP45 Drain of Q9 TP46 Gate of Q9 TP47 Feedback Loop TP48 J3 Positive Input TPS23734EVM-094 Evaluation Module SLUUCB6A – JUNE 2020 – REVISED AUGUST 2022 Submit Document Feedback Copyright © 2022 Texas Instruments Incorporated www.ti.com TPS23734EVM-094 Performance Data 6 TPS23734EVM-094 Performance Data 6.1 Startup to PSE and DC/DC Startup Figure 6-1 shows the DC/DC start-up response of the TPS23734EVM-094. Figure 6-1. DC/DC Start-up 6.2 Transient Response Figure 6-2 shows the transient response of the TPS23734EVM-094. Figure 6-2. Transient Response from 0 mA to 5 A for a 48-V Input SLUUCB6A – JUNE 2020 – REVISED AUGUST 2022 Submit Document Feedback TPS23734EVM-094 Evaluation Module Copyright © 2022 Texas Instruments Incorporated 9 TPS23734EVM-094 Performance Data www.ti.com 6.3 Efficiency Figure 6-3 shows the efficiency of the TPS23734EVM-094 100% 90% 80% Efficiency 70% 60% 50% 40% 30% 20% PoE DCDC 10% 0 0 1 2 3 4 Iout (A) 5 D001 Figure 6-3. Efficiency of the TPS23734EVM-094 6.4 Load Regulation 5.3 5.25 Vout (V) 5.2 5.15 5.1 5.05 5 0 1 2 3 4 Iout (A) 5 D002 Figure 6-4. TPS23734EVM-094 Load Regulation 10 TPS23734EVM-094 Evaluation Module SLUUCB6A – JUNE 2020 – REVISED AUGUST 2022 Submit Document Feedback Copyright © 2022 Texas Instruments Incorporated www.ti.com TPS23734EVM-094 Performance Data 6.5 Hiccup Performance During an Output Short and Recovery Figure 6-5. DC/DC Hiccup Performance During an Output Short SLUUCB6A – JUNE 2020 – REVISED AUGUST 2022 Submit Document Feedback TPS23734EVM-094 Evaluation Module Copyright © 2022 Texas Instruments Incorporated 11 TPS23734EVM-094 Performance Data www.ti.com 6.6 Bode Plots Figure 6-6 and Figure 6-7 show the 0- and 5-A load bode plots. Figure 6-6. Bode Plot Response of the TPS23734EVM-094 With 0-A Load Figure 6-7. Bode Plot Response of the TPS23734EVM-094 With 5-A Load 12 TPS23734EVM-094 Evaluation Module SLUUCB6A – JUNE 2020 – REVISED AUGUST 2022 Submit Document Feedback Copyright © 2022 Texas Instruments Incorporated www.ti.com EVM Assembly Drawings and Layout Guidelines 7 EVM Assembly Drawings and Layout Guidelines 7.1 PCB Drawings Figure 7-1. Top-Side Routing and Component Placement Figure 7-2. Layer 2 Routing Figure 7-3. Layer 3 Routing Figure 7-4. Bottom Side Routing and Component Placement 7.2 Layout Guidelines The layout of the PoE front end must follow power and EMI or ESD best-practice guidelines. A basic set of recommendations includes: • • • • • • • TI recommends having at least 8 vias (PAD G) and 5 vias on (PAD S) connecting the exposed thermal pad through a top layer plane (2-oz copper recommended) to a bottom VSS plane (2-oz copper recommended) to help with thermal dissipation. Place the primary MOSFET near the power transformer and keep the current sense resistor close to source of the MOSFET to minimize the primary loop. The same is true for the secondary MOSFETs. Keep the MOSFETs close to the transformer, and associated components as close together as possible to minimize the loop. Parts placement must be driven by power flow in a point-to-point manner; RJ-45, Ethernet transformer, diode bridges, TVS and 0.1-μF capacitor, and TPS23734 converter input bulk capacitor. Make all leads as short as possible with wide power traces and paired signal and return. No crossovers of signals from one part of the flow to another are allowed. Spacing consistent with safety standards like IEC60950 must be observed between the 48-V input voltage rails and between the input and an isolated converter output. Use large copper fills and traces on SMT power-dissipating devices, and use wide traces or overlay copper fills in the power path. SLUUCB6A – JUNE 2020 – REVISED AUGUST 2022 Submit Document Feedback TPS23734EVM-094 Evaluation Module Copyright © 2022 Texas Instruments Incorporated 13 EVM Assembly Drawings and Layout Guidelines • www.ti.com Place the Schottky diode between VSS and RTN as close to the IC as possible, preferably on directly on the opposite side of the board (for example, the TPS23734EVM-094 places the IC on the top side, so the diode is on the bottom side directly underneath it). The DC-to-DC converter layout benefits from basic rules such as: • • • • • • Having at least 4 vias (VDD) near the power transformer pin connected to VDD through multiple layer planes to help with thermal dissipation of the power transformer. Pair signals to reduce emissions and noise, especially the paths that carry high-current pulses, which include the power semiconductors and magnetics. Minimize the trace length of high current power semiconductors and magnetic components. Use the ground plane for the switching currents carefully. Keep the high-current and high-voltage switching away from low-level sensing circuits including those outside the power supply. Proper spacing around the high-voltage sections of the converter. 7.3 EMI Containment • • • • • • • • • • • • • • • • • • • 14 Use compact loops for dv/dt and di/dt circuit paths (power loops and gate drives). Use minimal, yet thermally adequate, copper areas for heat sinking of components tied to switching nodes (minimize exposed radiating surface). Hide copper associated with switching nodes under shielded magnetics, where possible. Use copper ground planes (possible stitching) and top-layer copper floods (surround circuitry with ground floods). Use a 4-layer PCB, if economically feasible (for better grounding). Minimize the amount of copper area associated with input traces (to minimize radiated pickup). Heat sink the quiet side of components instead of the switching side, where possible (like the output side of inductor). Use Bob Smith terminations, Bob Smith EFT capacitor, and Bob Smith plane. Use Bob Smith plane as a ground shield on input side of PCB (creating a phantom or literal earth ground). Use the LC filter at DC-to-DC input. Dampen high-frequency ringing on all switching nodes, if present (allow for possible snubbers). Control rise times with gate-drive resistors and possibly snubbers. Switching frequency considerations. Use of EMI bridge capacitor across isolation boundary (isolated topologies). Observe the polarity dot on inductors (embed noisy end). Use of ferrite beads on input (allow for possible use of beads or 0-Ω resistors). Maintain physical separation between input-related circuitry and power circuitry (use ferrite beads as boundary line). Balance efficiency versus acceptable noise margin. Possible use of common-mode inductors. Possible use of integrated RJ-45 jacks (shielded with internal transformer and Bob Smith terminations). End-product enclosure considerations (shielding). TPS23734EVM-094 Evaluation Module SLUUCB6A – JUNE 2020 – REVISED AUGUST 2022 Submit Document Feedback Copyright © 2022 Texas Instruments Incorporated www.ti.com Bill of Materials 8 Bill of Materials Table 8-1 lists the TPS23734EVM-094 Bill of Materials (BOM). Table 8-1. TPS23734EVM-094 Bill of Materials Designator !PCB QTY Value Package Reference Description Part Number Manufacturer 1 Printed Circuit Board PSIL094 C1, C2, C3, C4 4 0.01 uF CAP, CERM, 0.01 uF, 100 V, ±10%, X7R, AEC-Q200 Grade 1, 0603 CGA3E2X7R2A103K080A TDK A C5, C6 2 1000 pF CAP, CERM, 1000 pF, 2000 V, ±10%, 1808 X7R, 1808 GR442QR73D102KW01L MuRata C7, C8, C13, C14 4 1000 pF CAP, CERM, 1000 pF, 100 V, ±10%, X7R, 0603 0603 C1608X7R2A102K080AA TDK C16 1 2200 pF CAP, CERM, 2200 pF, 2000 V, ±10%, 1812 X7R, 1812 C4532X7R3D222K130KA TDK C19 1 47 uF CAP, AL, 47 uF, 63 V, ±20%, 0.65 ohm, AEC-Q200 Grade 2, SMD SMT Radial F EEE-FK1J470P Panasonic C20, C21 2 2.2 uF CAP, CERM, 2.2 uF, 100 V, ±10%, X7R, 1210 1210 GRM32ER72A225KA35L MuRata C25, C26 2 100 uF CAP, CERM, 100 µF, 6.3 V,±20%, X7S, 1210 1210 GRM32EC70J107ME15L MuRata C27 1 1 uF CAP, CERM, 1 uF, 25 V, ±10%, X7R, 1206 1206 C3216X7R1E105K085AA TDK C28 1 0.047 uF CAP, CERM, 0.047 uF, 250 V, ±10%, X7R, 1206 1206 GRM31CR72E473KW03L MuRata C29 1 0.047 uF CAP, CERM, 0.047 uF, 50 V, ±10%, X7R, 0603 0603 C1608X7R1H473K080AA TDK C30 1 0.1 uF CAP, CERM, 0.1 uF, 50 V, ±10%, X7R, AEC-Q200 Grade 1, 0805 0805 GCM21BR71H104KA37K MuRata C31 1 0.1 uF CAP, CERM, 0.1 uF, 50 V, ±20%, X5R, 0805 0805 C2012X5R1H104M085AA TDK C32 1 0.1 uF CAP, CERM, 0.1 uF, 25 V, ±10%, X7R, AEC-Q200 Grade 1, 0603 0603 CGA3E2X7R1E104K080A TDK A C33 1 2200 pF CAP, CERM, 2200 pF, 50 V, ±10%, X7R, 0603 0603 C0603C222K5RAC Kemet C34 1 0.1 uF CAP, CERM, 0.1 uF, 25 V, ±5%, X7R, 0603 0603 C0603C104J3RACTU Kemet C35 1 47 pF CAP, CERM, 47 pF, 50 V, ±5%, C0G/ NP0, 0603 0603 GRM1885C1H470JA01D MuRata C36 1 0.068 uF CAP, CERM, 0.068 uF, 50 V, ±10%, X7R, AEC-Q200 Grade 1, 0603 0603 CGA3E2X7R1H683K080 AA TDK 0603 SLUUCB6A – JUNE 2020 – REVISED AUGUST 2022 Submit Document Feedback Alternate Part Number Alternate Manufacturer Any TPS23734EVM-094 Evaluation Module Copyright © 2022 Texas Instruments Incorporated 15 Bill of Materials www.ti.com Table 8-1. TPS23734EVM-094 Bill of Materials (continued) Designator Package Reference Value C37 1 220 uF CAP, AL, 220 uF, 10 V, ±20%, 0.34 ohm, AEC-Q200 Grade 2, SMD SMT Radial D8 EEE-FK1A221XP Panasonic C38, C42 2 0.1 uF CAP, CERM, 0.1 uF, 100 V, ±10%, X7R, 1206 1206 GRM319R72A104KA01D MuRata C39 1 100 pF CAP, CERM, 100 pF, 25 V, ±10%, X7R, 0603 0603 06033C101KAT2A AVX C40 1 0.022 uF CAP, CERM, 0.022 uF, 50 V, ±10%, X7R, 0603 0603 C0603C223K5RACTU Kemet C41 1 1 uF CAP, CERM, 1 uF, 50 V, ±10%, X7R, 0805 0805 C2012X7R1H105K125AB TDK C44 1 1000 pF CAP, CERM, 1000 pF, 100 V, ±10%, X7R, AEC-Q200 Grade 1, 0603 0603 CGA3E2X7R2A102K080A TDK A C46 1 4700 pF CAP, CERM, 4700 pF, 50 V, ±10%, X7R, 0603 0603 C0603X472K5RACTU Kemet D1, D2, D3, D4, D6, D19, D20, D21, D22 9 100 V Diode, Schottky, 100 V, 2 A, SMB SMB B2100-13-F Diodes Inc. D5 1 58 V Diode, TVS, Uni, 58 V, 93.6 Vc, SMB SMB SMBJ58A-13-F Diodes Inc. D8 1 Yellow LED, Yellow, SMD LED_0603 150060YS75000 Wurth Elektronik D10, D11, D12, D13, D16 5 100 V Diode, Switching, 100 V, 0.2 A, SOD-123 SOD-123 MMSD914T1G ON Semiconductor D15 1 12 V Diode, Zener, 12 V, 500 mW, SOD-123 SOD-123 MMSZ5242B-7-F Diodes Inc. D18 1 30 V Diode, Schottky, 30 V, 0.2 A, SOT-23 SOT-23 BAT54S-7-F Diodes Inc. D23 1 100 V Diode, Schottky, 100 V, 3 A, SMC SMC B3100-13-F Diodes Inc. H9, H10, H11, H12 4 Bumpon, Hemisphere, 0.44 X 0.20, Clear Transparent Bumpon SJ-5303 (CLEAR) 3M J1, J2 2 RJ45, No LED, tab up, R/A, TH 16.26x14.54x15.7 1-406541-1 5 TE Connectivity J3 1 Terminal Block, 3.5 mm, 2x1, Tin, TH Terminal Block, 3.5 mm, 2x1, TH 39357-0002 Molex J6, J12, J15 3 Header, 100mil, 3x1, Tin, TH Header, 3x1, 100mil, TH 5-146278-3 TE Connectivity J9 1 Terminal Block, 3.5mm Pitch, 2x1, TH 7.0x8.2x6.5mm ED555/2DS On-Shore Technology J13 1 Header, 100mil, 2x1, Tin, TH 5-146278-2 TE Connectivity 16 Description Header, 2x1, 100mil, TH Part Number Alternate Part Number QTY TPS23734EVM-094 Evaluation Module Manufacturer Alternate Manufacturer SLUUCB6A – JUNE 2020 – REVISED AUGUST 2022 Submit Document Feedback Copyright © 2022 Texas Instruments Incorporated www.ti.com Bill of Materials Table 8-1. TPS23734EVM-094 Bill of Materials (continued) Designator QTY Value L1, L3, L4, L6 4 300 ohm L7 1 L8 Package Reference Description Part Number Manufacturer Ferrite Bead, 300 ohm @ 100 MHz, 2 0603 A, 0603 742792641 Wurth Elektronik 3.3 uH Inductor, Shielded Drum Core, Ferrite, MSS5131 3.3 uH, 1.73 A, 0.03 ohm, SMD MSS5131-332MLB Coilcraft 1 10 uH Inductor, Shielded E Core, Ferrite, 10 µH, 7.2 A, 0.01081 ohm, AEC-Q200 Grade 3, SMD SER1360 SER1360-103KLB Coilcraft L9 1 2.2 mH Inductor, Unshielded Drum Core, Metal Composite, 2.2 mH, 0.15 A, 6 ohm, SMD 7x5x7.8mm 768775322 Wurth Elektronik Q6, Q8 2 30 V MOSFET, N-CH, 30 V, 100 A, DQJ0008A (VSONP-8) DQJ0008A CSD17510Q5A Texas Instruments Q7 1 100 V Transistor, NPN, 100 V, 1 A, SOT-89 SOT-89 FCX493TA Diodes Inc. Q9 1 –150 V MOSFET, P-CH, -150 V, -3 A, QFN-8 QFN-8 FDMC2523P Fairchild Semiconductor Q10 1 150 V MOSFET, N-CH, 150 V, 4.6 A, PQFN08A PQFN08A FDMS86252 Fairchild Semiconductor R1 1 75.0 RES, 75.0, 1%, 0.1 W, AEC-Q200 Grade 0, 0603 0603 CRCW060375R0FKEA Vishay-Dale R2, R3, R4, R5, R6, R7, R8 7 75.0 RES, 75.0, 1%, 0.1 W, 0603 0603 CRCW060375R0FKEA Vishay-Dale R17 1 100 k RES, 100 k, 1%, 0.1 W, AEC-Q200 Grade 0, 0603 0603 CRCW0603100KFKEA Vishay-Dale R18 1 4.42 k RES, 4.42 k, 1%, 0.1 W, AEC-Q200 Grade 0, 0603 0603 CRCW06034K42FKEA Vishay-Dale R19 1 2.00 k RES, 2.00 k, 1%, 0.1 W, AEC-Q200 Grade 0, 0603 0603 CRCW06032K00FKEA Vishay-Dale R20 1 110 k RES, 110 k, 1%, 0.1 W, AEC-Q200 Grade 0, 0603 0603 CRCW0603110KFKEA Vishay-Dale R21, R22, R23, R24, R29, R49, R55 7 10.0 k RES, 10.0 k, 1%, 0.1 W, AEC-Q200 Grade 0, 0603 0603 CRCW060310K0FKEA Vishay-Dale R26 1 499 RES, 499, 1%, 0.1 W, 0603 0603 CRCW0603499RFKEAC Vishay-Dale R27 1 237 k RES, 237 k, 1%, 0.1 W, 0603 0603 RC0603FR-07237KL Yageo RES, 60.4 k, 1%, 0.1 W, AEC-Q200 Grade 0, 0603 0603 CRCW060360K4FKEA Vishay-Dale RES, 4.7, 5%, 0.1 W, AEC-Q200 Grade 0, 0603 0603 CRCW06034R70JNEA Vishay-Dale R28 1 60.4 k R30 1 4.7 SLUUCB6A – JUNE 2020 – REVISED AUGUST 2022 Submit Document Feedback Alternate Part Number Alternate Manufacturer TPS23734EVM-094 Evaluation Module Copyright © 2022 Texas Instruments Incorporated 17 Bill of Materials www.ti.com Table 8-1. TPS23734EVM-094 Bill of Materials (continued) Designator Package Reference QTY Value Description Part Number Manufacturer R31 1 49.9 k RES, 49.9 k, 1%, 0.1 W, AEC-Q200 Grade 0, 0603 0603 CRCW060349K9FKEA Vishay-Dale R32, R34, R37, R40 4 0 RES, 0, 0%, W, AEC-Q200 Grade 0, 0805 0805 PMR10EZPJ000 Rohm R33 1 2.49 k RES, 2.49 k, 1%, 0.1 W, 0603 0603 RC0603FR-072K49L Yageo R35 1 0.1 RES, 0.1, 1%, 0.5 W, 1206 1206 CSR1206FKR100 Stackpole Electronics Inc R36 1 25.5 k RES, 25.5 k, 1%, 0.1 W, AEC-Q200 Grade 0, 0603 0603 CRCW060325K5FKEA Vishay-Dale R38 1 31.6 RES, 31.6, 1%, 0.125 W, AEC-Q200 Grade 0, 0805 0805 CRCW080531R6FKEA Vishay-Dale R41 1 42.2 k RES, 42.2 k, 1%, 0.1 W, AEC-Q200 Grade 0, 0603 0603 CRCW060342K2FKEA Vishay-Dale R43 1 49.9 RES, 49.9, 1%, 0.1 W, 0603 0603 RC0603FR-0749R9L Yageo R44 1 511 RES, 511, 1%, 0.1 W, 0603 0603 RC0603FR-07511RL Yageo 499k RES, 499 k, 1%, 0.1 W, AEC-Q200 Grade 0, 0603 0603 CRCW0603499KFKEA Vishay-Dale R46 1 R47 1 866 RES, 866, 1%, 0.1 W, 0603 0603 RC0603FR-07866RL Yageo R50 1 10.2 k RES, 10.2 k, 1%, 0.1 W, 0603 0603 RC0603FR-0710K2L Yageo R51 1 4.99 k RES, 4.99 k, 1%, 0.1 W, 0603 0603 RC0603FR-074K99L Yageo R53 1 3.24 k RES, 3.24 k, 1%, 0.1 W, 0603 0603 RC0603FR-073K24L Yageo R62, R65 2 5.1 RES, 5.1, 5%, 0.25 W, AEC-Q200 Grade 0, 1206 1206 CRCW12065R10JNEA Vishay-Dale R64 1 10.0 RES, 10.0, 1%, 0.25 W, AEC-Q200 Grade 0, 0603 0603 CRCW060310R0FKEAHP Vishay-Dale SH-J1, SH-J2, SH-J3, SH-J4, SH-J5 5 Shunt, 2.54mm, Gold, Black Shunt, 2.54mm, Black 60900213421 Wurth Elektronik T1 1 350 uH Transformer, 350 uH, SMT 14.7x18.29mm 7490220122 Wurth Elektronik T2 1 100 uH Transformer, 100uH, SMT 17.5x14x14mm LDT6037-50 Linkcom TP1, TP2, TP3, TP4 4 Test Point, Multipurpose, Red, TH Red Multipurpose Testpoint 5010 Keystone TP5 1 Test Point, Multipurpose, Black, TH Black Multipurpose Testpoint 5011 Keystone 18 TPS23734EVM-094 Evaluation Module Alternate Part Number 750320121 Alternate Manufacturer Wurth Elektronik SLUUCB6A – JUNE 2020 – REVISED AUGUST 2022 Submit Document Feedback Copyright © 2022 Texas Instruments Incorporated www.ti.com Bill of Materials Table 8-1. TPS23734EVM-094 Bill of Materials (continued) Designator QTY Value Package Reference Description Part Number Manufacturer TP6, TP13, TP14, TP15, TP16, TP18, TP19, TP20, TP23, TP24, TP25, TP28, TP31, TP35, TP45, TP46, TP48 17 Test Point, Miniature, Red, TH Red Miniature Testpoint 5000 Keystone TP7, TP17, TP22, TP26, TP27, TP29, TP36, TP38, TP39, TP40, TP41 11 Test Point, Miniature, Black, TH Black Miniature Testpoint 5001 Keystone TP9, TP21, TP30, TP32, TP33, TP34, TP37 7 Test Point, Miniature, White, TH White Miniature Testpoint 5002 Keystone TP11, TP43, TP47 3 Test Point, Miniature, Orange, TH Orange Miniature Testpoint 5003 Keystone U1 1 TPS23734RMT, RMT0045A (VQFN-45) RMT0045A TPS23734RMT Texas Instruments U2 1 Optocoupler, 3.75 kV, 80-160% CTR, SMT SOP-4 TCMT1107 VishaySemiconductor U3 1 Low Voltage Adjustable Precision Shunt Regulator, 39 ppm / degC, 15 mA, -40 to 85 degC, 5-pin SOT-23 (DBV), Green (RoHS and no Sb/Br) DBV0005A TLV431IDBVR Texas Instruments U5 1 Optocoupler, 5 kV, 300-600% CTR, SMT DIP-4L Gullwing FOD817DS Fairchild Semiconductor C9, C10, C11, C12 0 330 pF CAP, CERM, 330 pF, 50 V, ±5%, C0G/ 0603 NP0, 0603 885012006060 Wurth Elektronik C17 0 2200 pF CAP, CERM, 2200 pF, 2000 V, ±10%, 1812 X7R, 1812 C4532X7R3D222K130KA TDK C23, C24 0 100 pF CAP, CERM, 100 pF, 25 V, ±10%, X7R, 0603 0603 06033C101KAT2A C45, C48 0 0.047 uF CAP, CERM, 0.047 uF, 100 V, ±10%, X7R, AEC-Q200 Grade 1, 1206 1206 CGA5H2X7R2A473K115A TDK A C47 0 470 pF CAP, CERM, 470 pF, 100 V, ±10%, X7R, 0805 0805 08051C471KAT2A AVX D7, D9 0 Yellow LED, Yellow, SMD LED_0603 150060YS75000 Wurth Elektronik SLUUCB6A – JUNE 2020 – REVISED AUGUST 2022 Submit Document Feedback Alternate Part Number Alternate Manufacturer AVX TPS23734EVM-094 Evaluation Module Copyright © 2022 Texas Instruments Incorporated 19 Bill of Materials www.ti.com Table 8-1. TPS23734EVM-094 Bill of Materials (continued) Designator Package Reference Description Value D14 0 12 V Diode, Zener, 12 V, 500 mW, SOD-123 SOD-123 MMSZ5242B-7-F Diodes Inc. D17 0 100 V Diode, Switching, 100 V, 0.2 A, SOD-123 SOD-123 MMSD914T1G ON Semiconductor D24, D27 0 100 V Diode, Ultrafast, 100 V, 2 A, SMA SMA MURA110T3G ON Semiconductor D25, D26 0 60 V Diode, TVS, Uni, 60 V, SMC SMC SMCJ60A Fairchild Semiconductor FID1, FID2, FID3 0 Fiducial mark. There is nothing to buy N/A or mount. N/A N/A J5 0 Header, 100mil, 2x1, Tin, TH Header, 2 PIN, 100mil, Tin PEC02SAAN Sullins Connector Solutions J14 0 Header, 100mil, 2x1, Tin, TH Header, 2x1, 100mil, TH 5-146278-2 TE Connectivity L2, L5 0 250 uH Coupled inductor, 250 uH, A, 0.035 ohm, SMD 8.7x10mm 744272251 Wurth Elektronik Q1, Q2, Q3, Q4 0 100 V MOSFET, N-CH, 100 V, 4.5 A, DQK0006C (WSON-6) DQK0006C CSD19538Q2 Texas Instruments Q5 0 100 V Transistor, NPN, 100 V, 1 A, SOT-89 SOT-89 FCX493TA Diodes Inc. 0603 CRCW06031M00FKEA Vishay-Dale Manufacturer R9, R10, R11, R12 0 R13, R14, R15, R16 0 232 k RES, 232 k, 1%, 0.1 W, AEC-Q200 Grade 0, 0603 0603 CRCW0603232KFKEA Vishay-Dale R25 0 4.02 k RES, 4.02 k, 1%, 0.25 W, AEC-Q200 Grade 0, 1206 1206 CRCW12064K02FKEA Vishay-Dale R39 0 31.6 RES, 31.6, 1%, 0.125 W, AEC-Q200 Grade 0, 0805 0805 CRCW080531R6FKEA Vishay-Dale R42, R54, R56, R59, R60 0 10.0 k RES, 10.0 k, 1%, 0.1 W, AEC-Q200 Grade 0, 0603 0603 CRCW060310K0FKEA Vishay-Dale R45 0 8.06 k RES, 8.06 k, 1%, 0.25 W, AEC-Q200 Grade 0, 1206 1206 CRCW12068K06FKEA Vishay-Dale R48 0 2.00 k RES, 2.00 k, 1%, 0.1 W, 0603 0603 Y16362K00000F9R Vishay Foil Resistors R57 0 100 k RES, 100 k, 1%, 0.1 W, AEC-Q200 Grade 0, 0603 0603 CRCW0603100KFKEA Vishay-Dale R58 0 15.0 k RES, 15.0 k, 1%, 0.1 W, AEC-Q200 Grade 0, 0603 0603 CRCW060315K0FKEA Vishay-Dale R61, R66 0 10 k RES, 10 k, 5%, 1 W, AEC-Q200 Grade 0, 2512 2512 CRCW251210K0JNEG Vishay-Dale 20 RES, 1.00 M, 1%, 0.1 W, AEC-Q200 1.00Meg Grade 0, 0603 Part Number Alternate Part Number QTY TPS23734EVM-094 Evaluation Module Alternate Manufacturer SLUUCB6A – JUNE 2020 – REVISED AUGUST 2022 Submit Document Feedback Copyright © 2022 Texas Instruments Incorporated www.ti.com Bill of Materials Table 8-1. TPS23734EVM-094 Bill of Materials (continued) Designator QTY Value Description Package Reference Part Number Manufacturer TP8 0 Test Point, Miniature, White, TH White Miniature Testpoint 5002 Keystone TP10, TP12, TP42, TP44 0 Test Point, Miniature, Orange, TH Orange Miniature Testpoint 5003 Keystone U4, U6 0 Optocoupler, 5 kV, 300-600% CTR, SMT DIP-4L Gullwing FOD817DS Fairchild Semiconductor SLUUCB6A – JUNE 2020 – REVISED AUGUST 2022 Submit Document Feedback Alternate Part Number Alternate Manufacturer TPS23734EVM-094 Evaluation Module Copyright © 2022 Texas Instruments Incorporated 21 Revision History www.ti.com 9 Revision History NOTE: Page numbers for previous revisions may differ from page numbers in the current version. Changes from Revision * (June 2020) to Revision A (August 2022) Page • Updated the numbering format for tables, figures, and cross-references throughout the document..................3 • Corrected device name in Bill of Materials ...................................................................................................... 15 • Updated Table 8-1 ........................................................................................................................................... 15 22 TPS23734EVM-094 Evaluation Module SLUUCB6A – JUNE 2020 – REVISED AUGUST 2022 Submit Document Feedback Copyright © 2022 Texas Instruments Incorporated STANDARD TERMS FOR EVALUATION MODULES 1. Delivery: TI delivers TI evaluation boards, kits, or modules, including any accompanying demonstration software, components, and/or documentation which may be provided together or separately (collectively, an “EVM” or “EVMs”) to the User (“User”) in accordance with the terms set forth herein. User's acceptance of the EVM is expressly subject to the following terms. 1.1 EVMs are intended solely for product or software developers for use in a research and development setting to facilitate feasibility evaluation, experimentation, or scientific analysis of TI semiconductors products. EVMs have no direct function and are not finished products. EVMs shall not be directly or indirectly assembled as a part or subassembly in any finished product. For clarification, any software or software tools provided with the EVM (“Software”) shall not be subject to the terms and conditions set forth herein but rather shall be subject to the applicable terms that accompany such Software 1.2 EVMs are not intended for consumer or household use. EVMs may not be sold, sublicensed, leased, rented, loaned, assigned, or otherwise distributed for commercial purposes by Users, in whole or in part, or used in any finished product or production system. 2 Limited Warranty and Related Remedies/Disclaimers: 2.1 These terms do not apply to Software. The warranty, if any, for Software is covered in the applicable Software License Agreement. 2.2 TI warrants that the TI EVM will conform to TI's published specifications for ninety (90) days after the date TI delivers such EVM to User. Notwithstanding the foregoing, TI shall not be liable for a nonconforming EVM if (a) the nonconformity was caused by neglect, misuse or mistreatment by an entity other than TI, including improper installation or testing, or for any EVMs that have been altered or modified in any way by an entity other than TI, (b) the nonconformity resulted from User's design, specifications or instructions for such EVMs or improper system design, or (c) User has not paid on time. Testing and other quality control techniques are used to the extent TI deems necessary. TI does not test all parameters of each EVM. User's claims against TI under this Section 2 are void if User fails to notify TI of any apparent defects in the EVMs within ten (10) business days after delivery, or of any hidden defects with ten (10) business days after the defect has been detected. 2.3 TI's sole liability shall be at its option to repair or replace EVMs that fail to conform to the warranty set forth above, or credit User's account for such EVM. TI's liability under this warranty shall be limited to EVMs that are returned during the warranty period to the address designated by TI and that are determined by TI not to conform to such warranty. If TI elects to repair or replace such EVM, TI shall have a reasonable time to repair such EVM or provide replacements. Repaired EVMs shall be warranted for the remainder of the original warranty period. Replaced EVMs shall be warranted for a new full ninety (90) day warranty period. WARNING Evaluation Kits are intended solely for use by technically qualified, professional electronics experts who are familiar with the dangers and application risks associated with handling electrical mechanical components, systems, and subsystems. User shall operate the Evaluation Kit within TI’s recommended guidelines and any applicable legal or environmental requirements as well as reasonable and customary safeguards. Failure to set up and/or operate the Evaluation Kit within TI’s recommended guidelines may result in personal injury or death or property damage. Proper set up entails following TI’s instructions for electrical ratings of interface circuits such as input, output and electrical loads. NOTE: EXPOSURE TO ELECTROSTATIC DISCHARGE (ESD) MAY CAUSE DEGREDATION OR FAILURE OF THE EVALUATION KIT; TI RECOMMENDS STORAGE OF THE EVALUATION KIT IN A PROTECTIVE ESD BAG. www.ti.com 3 Regulatory Notices: 3.1 United States 3.1.1 Notice applicable to EVMs not FCC-Approved: FCC NOTICE: This kit is designed to allow product developers to evaluate electronic components, circuitry, or software associated with the kit to determine whether to incorporate such items in a finished product and software developers to write software applications for use with the end product. This kit is not a finished product and when assembled may not be resold or otherwise marketed unless all required FCC equipment authorizations are first obtained. Operation is subject to the condition that this product not cause harmful interference to licensed radio stations and that this product accept harmful interference. Unless the assembled kit is designed to operate under part 15, part 18 or part 95 of this chapter, the operator of the kit must operate under the authority of an FCC license holder or must secure an experimental authorization under part 5 of this chapter. 3.1.2 For EVMs annotated as FCC – FEDERAL COMMUNICATIONS COMMISSION Part 15 Compliant: CAUTION This device complies with part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation. Changes or modifications not expressly approved by the party responsible for compliance could void the user's authority to operate the equipment. FCC Interference Statement for Class A EVM devices NOTE: This equipment has been tested and found to comply with the limits for a Class A digital device, pursuant to part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference when the equipment is operated in a commercial environment. This equipment generates, uses, and can radiate radio frequency energy and, if not installed and used in accordance with the instruction manual, may cause harmful interference to radio communications. Operation of this equipment in a residential area is likely to cause harmful interference in which case the user will be required to correct the interference at his own expense. FCC Interference Statement for Class B EVM devices NOTE: This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates, uses and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more of the following measures: • • • • Reorient or relocate the receiving antenna. Increase the separation between the equipment and receiver. Connect the equipment into an outlet on a circuit different from that to which the receiver is connected. Consult the dealer or an experienced radio/TV technician for help. 3.2 Canada 3.2.1 For EVMs issued with an Industry Canada Certificate of Conformance to RSS-210 or RSS-247 Concerning EVMs Including Radio Transmitters: This device complies with Industry Canada license-exempt RSSs. Operation is subject to the following two conditions: (1) this device may not cause interference, and (2) this device must accept any interference, including interference that may cause undesired operation of the device. Concernant les EVMs avec appareils radio: Le présent appareil est conforme aux CNR d'Industrie Canada applicables aux appareils radio exempts de licence. L'exploitation est autorisée aux deux conditions suivantes: (1) l'appareil ne doit pas produire de brouillage, et (2) l'utilisateur de l'appareil doit accepter tout brouillage radioélectrique subi, même si le brouillage est susceptible d'en compromettre le fonctionnement. Concerning EVMs Including Detachable Antennas: Under Industry Canada regulations, this radio transmitter may only operate using an antenna of a type and maximum (or lesser) gain approved for the transmitter by Industry Canada. To reduce potential radio interference to other users, the antenna type and its gain should be so chosen that the equivalent isotropically radiated power (e.i.r.p.) is not more than that necessary for successful communication. This radio transmitter has been approved by Industry Canada to operate with the antenna types listed in the user guide with the maximum permissible gain and required antenna impedance for each antenna type indicated. Antenna types not included in this list, having a gain greater than the maximum gain indicated for that type, are strictly prohibited for use with this device. 2 www.ti.com Concernant les EVMs avec antennes détachables Conformément à la réglementation d'Industrie Canada, le présent émetteur radio peut fonctionner avec une antenne d'un type et d'un gain maximal (ou inférieur) approuvé pour l'émetteur par Industrie Canada. Dans le but de réduire les risques de brouillage radioélectrique à l'intention des autres utilisateurs, il faut choisir le type d'antenne et son gain de sorte que la puissance isotrope rayonnée équivalente (p.i.r.e.) ne dépasse pas l'intensité nécessaire à l'établissement d'une communication satisfaisante. Le présent émetteur radio a été approuvé par Industrie Canada pour fonctionner avec les types d'antenne énumérés dans le manuel d’usage et ayant un gain admissible maximal et l'impédance requise pour chaque type d'antenne. Les types d'antenne non inclus dans cette liste, ou dont le gain est supérieur au gain maximal indiqué, sont strictement interdits pour l'exploitation de l'émetteur 3.3 Japan 3.3.1 Notice for EVMs delivered in Japan: Please see http://www.tij.co.jp/lsds/ti_ja/general/eStore/notice_01.page 日本国内に 輸入される評価用キット、ボードについては、次のところをご覧ください。 http://www.tij.co.jp/lsds/ti_ja/general/eStore/notice_01.page 3.3.2 Notice for Users of EVMs Considered “Radio Frequency Products” in Japan: EVMs entering Japan may not be certified by TI as conforming to Technical Regulations of Radio Law of Japan. If User uses EVMs in Japan, not certified to Technical Regulations of Radio Law of Japan, User is required to follow the instructions set forth by Radio Law of Japan, which includes, but is not limited to, the instructions below with respect to EVMs (which for the avoidance of doubt are stated strictly for convenience and should be verified by User): 1. 2. 3. Use EVMs in a shielded room or any other test facility as defined in the notification #173 issued by Ministry of Internal Affairs and Communications on March 28, 2006, based on Sub-section 1.1 of Article 6 of the Ministry’s Rule for Enforcement of Radio Law of Japan, Use EVMs only after User obtains the license of Test Radio Station as provided in Radio Law of Japan with respect to EVMs, or Use of EVMs only after User obtains the Technical Regulations Conformity Certification as provided in Radio Law of Japan with respect to EVMs. Also, do not transfer EVMs, unless User gives the same notice above to the transferee. Please note that if User does not follow the instructions above, User will be subject to penalties of Radio Law of Japan. 【無線電波を送信する製品の開発キットをお使いになる際の注意事項】 開発キットの中には技術基準適合証明を受けて いないものがあります。 技術適合証明を受けていないもののご使用に際しては、電波法遵守のため、以下のいずれかの 措置を取っていただく必要がありますのでご注意ください。 1. 2. 3. 電波法施行規則第6条第1項第1号に基づく平成18年3月28日総務省告示第173号で定められた電波暗室等の試験設備でご使用 いただく。 実験局の免許を取得後ご使用いただく。 技術基準適合証明を取得後ご使用いただく。 なお、本製品は、上記の「ご使用にあたっての注意」を譲渡先、移転先に通知しない限り、譲渡、移転できないものとします。 上記を遵守頂けない場合は、電波法の罰則が適用される可能性があることをご留意ください。 日本テキサス・イ ンスツルメンツ株式会社 東京都新宿区西新宿６丁目２４番１号 西新宿三井ビル 3.3.3 Notice for EVMs for Power Line Communication: Please see http://www.tij.co.jp/lsds/ti_ja/general/eStore/notice_02.page 電力線搬送波通信についての開発キットをお使いになる際の注意事項については、次のところをご覧ください。http:/ /www.tij.co.jp/lsds/ti_ja/general/eStore/notice_02.page 3.4 European Union 3.4.1 For EVMs subject to EU Directive 2014/30/EU (Electromagnetic Compatibility Directive): This is a class A product intended for use in environments other than domestic environments that are connected to a low-voltage power-supply network that supplies buildings used for domestic purposes. In a domestic environment this product may cause radio interference in which case the user may be required to take adequate measures. 3 www.ti.com 4 EVM Use Restrictions and Warnings: 4.1 EVMS ARE NOT FOR USE IN FUNCTIONAL SAFETY AND/OR SAFETY CRITICAL EVALUATIONS, INCLUDING BUT NOT LIMITED TO EVALUATIONS OF LIFE SUPPORT APPLICATIONS. 4.2 User must read and apply the user guide and other available documentation provided by TI regarding the EVM prior to handling or using the EVM, including without limitation any warning or restriction notices. The notices contain important safety information related to, for example, temperatures and voltages. 4.3 Safety-Related Warnings and Restrictions: 4.3.1 User shall operate the EVM within TI’s recommended specifications and environmental considerations stated in the user guide, other available documentation provided by TI, and any other applicable requirements and employ reasonable and customary safeguards. Exceeding the specified performance ratings and specifications (including but not limited to input and output voltage, current, power, and environmental ranges) for the EVM may cause personal injury or death, or property damage. If there are questions concerning performance ratings and specifications, User should contact a TI field representative prior to connecting interface electronics including input power and intended loads. Any loads applied outside of the specified output range may also result in unintended and/or inaccurate operation and/or possible permanent damage to the EVM and/or interface electronics. Please consult the EVM user guide prior to connecting any load to the EVM output. If there is uncertainty as to the load specification, please contact a TI field representative. During normal operation, even with the inputs and outputs kept within the specified allowable ranges, some circuit components may have elevated case temperatures. These components include but are not limited to linear regulators, switching transistors, pass transistors, current sense resistors, and heat sinks, which can be identified using the information in the associated documentation. When working with the EVM, please be aware that the EVM may become very warm. 4.3.2 EVMs are intended solely for use by technically qualified, professional electronics experts who are familiar with the dangers and application risks associated with handling electrical mechanical components, systems, and subsystems. User assumes all responsibility and liability for proper and safe handling and use of the EVM by User or its employees, affiliates, contractors or designees. User assumes all responsibility and liability to ensure that any interfaces (electronic and/or mechanical) between the EVM and any human body are designed with suitable isolation and means to safely limit accessible leakage currents to minimize the risk of electrical shock hazard. User assumes all responsibility and liability for any improper or unsafe handling or use of the EVM by User or its employees, affiliates, contractors or designees. 4.4 User assumes all responsibility and liability to determine whether the EVM is subject to any applicable international, federal, state, or local laws and regulations related to User’s handling and use of the EVM and, if applicable, User assumes all responsibility and liability for compliance in all respects with such laws and regulations. User assumes all responsibility and liability for proper disposal and recycling of the EVM consistent with all applicable international, federal, state, and local requirements. 5. Accuracy of Information: To the extent TI provides information on the availability and function of EVMs, TI attempts to be as accurate as possible. However, TI does not warrant the accuracy of EVM descriptions, EVM availability or other information on its websites as accurate, complete, reliable, current, or error-free. 6. Disclaimers: 6.1 EXCEPT AS SET FORTH ABOVE, EVMS AND ANY MATERIALS PROVIDED WITH THE EVM (INCLUDING, BUT NOT LIMITED TO, REFERENCE DESIGNS AND THE DESIGN OF THE EVM ITSELF) ARE PROVIDED "AS IS" AND "WITH ALL FAULTS." TI DISCLAIMS ALL OTHER WARRANTIES, EXPRESS OR IMPLIED, REGARDING SUCH ITEMS, INCLUDING BUT NOT LIMITED TO ANY EPIDEMIC FAILURE WARRANTY OR IMPLIED WARRANTIES OF MERCHANTABILITY OR FITNESS FOR A PARTICULAR PURPOSE OR NON-INFRINGEMENT OF ANY THIRD PARTY PATENTS, COPYRIGHTS, TRADE SECRETS OR OTHER INTELLECTUAL PROPERTY RIGHTS. 6.2 EXCEPT FOR THE LIMITED RIGHT TO USE THE EVM SET FORTH HEREIN, NOTHING IN THESE TERMS SHALL BE CONSTRUED AS GRANTING OR CONFERRING ANY RIGHTS BY LICENSE, PATENT, OR ANY OTHER INDUSTRIAL OR INTELLECTUAL PROPERTY RIGHT OF TI, ITS SUPPLIERS/LICENSORS OR ANY OTHER THIRD PARTY, TO USE THE EVM IN ANY FINISHED END-USER OR READY-TO-USE FINAL PRODUCT, OR FOR ANY INVENTION, DISCOVERY OR IMPROVEMENT, REGARDLESS OF WHEN MADE, CONCEIVED OR ACQUIRED. 7. 4 USER'S INDEMNITY OBLIGATIONS AND REPRESENTATIONS. USER WILL DEFEND, INDEMNIFY AND HOLD TI, ITS LICENSORS AND THEIR REPRESENTATIVES HARMLESS FROM AND AGAINST ANY AND ALL CLAIMS, DAMAGES, LOSSES, EXPENSES, COSTS AND LIABILITIES (COLLECTIVELY, "CLAIMS") ARISING OUT OF OR IN CONNECTION WITH ANY HANDLING OR USE OF THE EVM THAT IS NOT IN ACCORDANCE WITH THESE TERMS. THIS OBLIGATION SHALL APPLY WHETHER CLAIMS ARISE UNDER STATUTE, REGULATION, OR THE LAW OF TORT, CONTRACT OR ANY OTHER LEGAL THEORY, AND EVEN IF THE EVM FAILS TO PERFORM AS DESCRIBED OR EXPECTED. www.ti.com 8. Limitations on Damages and Liability: 8.1 General Limitations. IN NO EVENT SHALL TI BE LIABLE FOR ANY SPECIAL, COLLATERAL, INDIRECT, PUNITIVE, INCIDENTAL, CONSEQUENTIAL, OR EXEMPLARY DAMAGES IN CONNECTION WITH OR ARISING OUT OF THESE TERMS OR THE USE OF THE EVMS , REGARDLESS OF WHETHER TI HAS BEEN ADVISED OF THE POSSIBILITY OF SUCH DAMAGES. EXCLUDED DAMAGES INCLUDE, BUT ARE NOT LIMITED TO, COST OF REMOVAL OR REINSTALLATION, ANCILLARY COSTS TO THE PROCUREMENT OF SUBSTITUTE GOODS OR SERVICES, RETESTING, OUTSIDE COMPUTER TIME, LABOR COSTS, LOSS OF GOODWILL, LOSS OF PROFITS, LOSS OF SAVINGS, LOSS OF USE, LOSS OF DATA, OR BUSINESS INTERRUPTION. NO CLAIM, SUIT OR ACTION SHALL BE BROUGHT AGAINST TI MORE THAN TWELVE (12) MONTHS AFTER THE EVENT THAT GAVE RISE TO THE CAUSE OF ACTION HAS OCCURRED. 8.2 Specific Limitations. IN NO EVENT SHALL TI'S AGGREGATE LIABILITY FROM ANY USE OF AN EVM PROVIDED HEREUNDER, INCLUDING FROM ANY WARRANTY, INDEMITY OR OTHER OBLIGATION ARISING OUT OF OR IN CONNECTION WITH THESE TERMS, , EXCEED THE TOTAL AMOUNT PAID TO TI BY USER FOR THE PARTICULAR EVM(S) AT ISSUE DURING THE PRIOR TWELVE (12) MONTHS WITH RESPECT TO WHICH LOSSES OR DAMAGES ARE CLAIMED. THE EXISTENCE OF MORE THAN ONE CLAIM SHALL NOT ENLARGE OR EXTEND THIS LIMIT. 9. Return Policy. Except as otherwise provided, TI does not offer any refunds, returns, or exchanges. Furthermore, no return of EVM(s) will be accepted if the package has been opened and no return of the EVM(s) will be accepted if they are damaged or otherwise not in a resalable condition. If User feels it has been incorrectly charged for the EVM(s) it ordered or that delivery violates the applicable order, User should contact TI. All refunds will be made in full within thirty (30) working days from the return of the components(s), excluding any postage or packaging costs. 10. Governing Law: These terms and conditions shall be governed by and interpreted in accordance with the laws of the State of Texas, without reference to conflict-of-laws principles. User agrees that non-exclusive jurisdiction for any dispute arising out of or relating to these terms and conditions lies within courts located in the State of Texas and consents to venue in Dallas County, Texas. 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