User's Guide
SLVU315A – June 2009 – Revised March 2014
TPS23753AEVM-001 Evaluation Module for TPS23753A
This user’s guide describes the TPS23753A evaluation module (TPS23753AEVM-001). TPS23753AEVM001 contains evaluation and reference circuitry for the TPS23753A. The TPS23753A device is an IEEE
802.3-2005 compliant, powered-device (PD) controller and power supply controller optimized for isolated
converter topologies. TPS23753AEVM-001 is targeted at low-cost, simple, 7-W flyback converter
applications.
1
2
3
4
5
6
7
8
Contents
Description .................................................................................................................... 2
1.1
Features .............................................................................................................. 2
1.2
Applications .......................................................................................................... 2
Electrical Specifications ..................................................................................................... 2
Schematic ..................................................................................................................... 3
General Configuration and Description ................................................................................... 4
4.1
Physical Access ..................................................................................................... 4
Test Setup .................................................................................................................... 5
TPS23753AEVM-001 Typical Performance Data ....................................................................... 5
6.1
3.3-V Efficiency ..................................................................................................... 5
6.2
5-V DC/DC Efficiency .............................................................................................. 6
6.3
TPS23753AEVM-001 Conducted Emissions.................................................................... 7
EVM Assembly Drawings and Layout Guidelines ....................................................................... 7
7.1
PCB Drawings ....................................................................................................... 7
7.2
Layout Guidelines ................................................................................................... 9
7.3
EMI Containment .................................................................................................. 10
Bill of Materials ............................................................................................................. 11
List of Figures
1
TPS23753AEVM-001 Schematic .......................................................................................... 3
2
Typical TPS23753AEVM-001 Test Setup ................................................................................ 5
3
TPS23753AEVM-002 Efficiency With 3.3-V Output ..................................................................... 6
4
TPS23753AEVM-001 Efficiency With 5-V Output ....................................................................... 6
5
TPS23753AEVM-001 Conducted Emissions............................................................................. 7
6
Top-Side Placement ......................................................................................................... 7
7
Top-Side Routing ............................................................................................................ 8
8
Bottom-Side Routing
9
Bottom-Side Placement ..................................................................................................... 9
1
TPS23753AEVM-001 and -002 Electrical and Performance Specifications at T=25°C ............................ 2
2
Connector Functionality ..................................................................................................... 4
3
Test Points .................................................................................................................... 4
4
TPS23753AEVM-001 and -002 Bill of Materials ....................................................................... 11
........................................................................................................
8
List of Tables
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Description
1
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Description
The TPS23753AEVM-001 allows reference circuitry evaluation of the TPS23753A. It contains input and
output power connectors and an array of onboard test points for circuit evaluation. TPS23753AEVM-002
(3.3-V output) can be configured with simple bill of materials (BOM) changes.
1.1
Features
•
1.2
Applications
•
•
•
2
Low-cost, basic design
– Simple gate drive, Shottky diode rectified secondary
– 7-W output power from power over ethernet (PoE), 48-V or 24-V adapter and 4-W output power
from a 12-V adapter
– 3.3-V output voltage with simple BOM changes
Voice over Internet protocol – IP telephones
Wireless LAN – wireless access points
Security – wired IP cameras
Electrical Specifications
Table 1. TPS23753AEVM-001 and -002 Electrical and Performance Specifications at T=25°C
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
POWER INTERFACE
Input voltage
Applied to the power pins of connectors J2 or J4
Operating voltage
After start-up
Input UVLO
0
57
V
30
57
V
Rising input voltage
36
Falling input voltage
30
Detection voltage
At device terminals
3
Classification voltage
At device terminals
Classification current
Rclass = 1270 Ω
Inrush current-limit
Operating current-limit
V
10
mA
10
23
mA
1.8
2.4
mA
90
190
mA
405
495
mA
DC/DC CONVERTER
Output voltage
20 V ≤ Vin ≤ 57 V, ILOAD ≤ ILOAD (max)
10.8 V ≤ Vin ≤ 13.2 V, ILOAD ≤ ILOAD (max)
3.3-V output
(-002)
3.13
3.3
3.47
5-V output (001)
4.75
5
5.25
V
2
20 V ≤ Vin ≤ 57 V
3.3-V output
10.8 V ≤ Vin ≤ 13.2 V
5-V output
Vin = 44 V, ILOAD = 2 A
3.3-V output
65
Vin = 44 V, ILOAD = 1.4A
5-V output
50
Vin = 44 V, ILOAD = 2 A
3.3-V output
77
%
Vin = 44 V, ILOAD = 1.4 A
5-V output
80
%
1.4
Output current
Output ripple voltage,
peak-to-peak
Efficiency, end-to-end
Switching frequency
2
1.2
0.8
225
TPS23753AEVM-001 Evaluation Module for TPS23753A
A
A
mV
270
kHz
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Schematic
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Schematic
2
2
1
3
2
1
1
3
2
1
2
2
2
3
3
3
Figure 1. TPS23753AEVM-001 Schematic
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General Configuration and Description
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4
General Configuration and Description
4.1
Physical Access
Table 2 lists the TPS23753AEVM-001 connector functionality and Table 3 describes the test point
availability.
Table 2. Connector Functionality
Connector
Label
Description
J1
RTN
Input
Input
VSS
External adapter input connector.
J1-1/J1-2 are used with DC/DC converter adapter input (RTN) and J1-3/J1-4 are used with
a PD adapter input (VSS)
J2
ETHERNET
POWER
J3
VOUT
J4
12
36
45
78
J6
DATA PORT
Ethernet power input connector. Contains Ethernet transformer and cable terminations
Output voltage connector
PD side diode bridge input.
Used to apply 48-V input voltage to the diode bridges as would power application from the
J2 connector. J4-1/J4-2 and J4-3/J4-4 are used together.
Ethernet data port connector
Table 3. Test Points
Test Point
TP1, TP14, TP15
4
Color
Label
Description
BLK
GND
Secondary-side (output) grounds (GND)
TP2
RED
VC
TP3
ORG
DRAIN
TP4
BLK
VSS
PoE input, low side
TP5, TP13
BLK
RTN
DC/DC converter return
TP6
ORG
LOOP
Can be used with TP8 for feedback loop measurements.
TP8
RED
VOUT
DC/DC converter output voltage.
TP9
RED
CTL
Control loop input to the pulse width modulator
TP10
WHT
CS
DC/DC converter primary-side switching MOSFET current-sense input
TP11
RED
VB
Bias voltage regulator
TP12
WHT
GATE
D11
RED
POWER ON
TPS23753AEVM-001 Evaluation Module for TPS23753A
DC/DC converter bias supply
Drain terminal of the primary-side switching MOSFET
Gate drive for the primary-side switching MOSFET
Output power indicator
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Test Setup
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5
Test Setup
Figure 2 shows a typical test setup for TPS23753AEVM-001. Input voltage can be applied as described in
Table 2.
AUX
Power Source
J4
PSE
Or
Power Supply
(Ethernet Cable)
J1
J2
VOUT
TPS23753AEVM-001
Data to PHY
(Ethernet Cable )
J3
R LOAD
GND
J6
Figure 2. Typical TPS23753AEVM-001 Test Setup
6
TPS23753AEVM-001 Typical Performance Data
6.1
3.3-V Efficiency
Figure 3 illustrates the efficiency at three different input voltage levels: 1) PoE 48 V from J2, 2) 48 V RTNbased adapter, and 3) 24-V RTN-based adapter.
NOTE: TPS23753AEVM-001 contains options for two different type primary switch snubbers. An RC
slew rate snubber is included by default but if additional efficiency is demanded by the
application, the RC snubber may be removed and the clamp type snubber may be
populated. The RC snubber is best for applications requiring low conducted emissions via
the power lines.
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TPS23753AEVM-001 Typical Performance Data
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85
48 V 3.3 V
PoE 48 V to 3.3 V
Efficiency - %
80
75
24 V 3.3 V
70
65
60
0
0.50
1
1.50
2
2.50
IO - Output Current - A
Figure 3. TPS23753AEVM-002 Efficiency With 3.3-V Output
6.2
5-V DC/DC Efficiency
Figure 4 illustrates the efficiency at three different input voltage levels: 1) PoE 48 V from J2, 2) 48 V RTNbased adapter, and 3) 24-V RTN-based adapter.
85
48 V 5 V
PoE 48 V to 5 V
80
Efficiency %
24 V 5 V
75
70
65
60
0
0.20
0.40
0.60
0.80
1
IO - Output Current - A
1.20
1.40
1.60
Figure 4. TPS23753AEVM-001 Efficiency With 5-V Output
6
TPS23753AEVM-001 Evaluation Module for TPS23753A
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TPS23753AEVM-001 Typical Performance Data
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6.3
TPS23753AEVM-001 Conducted Emissions
TPS23753EVM-001 Pre-Compliance Test
EN 55022 Telecommunication Port
48Vin 5V 7W Floating Output
Class B Quasi-Peak Limit
Class B Average Limit
Figure 5. TPS23753AEVM-001 Conducted Emissions
7
EVM Assembly Drawings and Layout Guidelines
7.1
PCB Drawings
Figure 6 through Figure 9 show component placement and layout.
Figure 6. Top-Side Placement
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EVM Assembly Drawings and Layout Guidelines
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Figure 7. Top-Side Routing
Figure 8. Bottom-Side Routing
8
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EVM Assembly Drawings and Layout Guidelines
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Figure 9. Bottom-Side Placement
7.2
Layout Guidelines
The layout of the PoE front end should follow power and EMI/ESD best-practice guidelines. A basic set of
recommendations include:
• Parts placement must be driven by power flow in a point-to-point manner; RJ-45, Ethernet transformer,
diode bridges, TVS and 0.1-μF capacitor, and TPS23753A converter input bulk capacitor.
• Make all leads as short as possible with wide power traces and paired signal and return.
• No crossovers of signals from one part of the flow to another are allowed.
• Spacing consistent with safety standards like IEC60950 must be observed between the 48-V input
voltage rails and between the input and an isolated converter output.
• Place the TPS23753A over split, local ground planes referenced to VSS for the PoE input and to
COM/RTN for the converter. Whereas the PoE side may operate without a ground plane, the converter
side must have one. Do not place logic ground and power layers under the Ethernet input or the
converter primary side.
• Use large copper fills and traces on SMT power-dissipating devices, and use wide traces or overlay
copper fills in the power path.
The DC/DC Converter layout benefits from basic rules such as:
• Pair signals to reduce emissions and noise, especially the paths that carry high-current pulses which
include the power semiconductors and magnetics.
• Minimize trace length of high current, power semiconductors, and magnetic components.
• Where possible, use vertical pairing
• Use the ground plane for the switching currents carefully.
• Keep the high-current and high-voltage switching away from low-level sensing circuits including those
outside the power supply.
• Proper spacing around the high-voltage sections of the converter
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EVM Assembly Drawings and Layout Guidelines
7.3
EMI Containment
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
10
www.ti.com
Use compact loops for dv/dt and di/dt circuit paths (power loops and gate drives)
Use minimal, yet thermally adequate, copper areas for heat sinking of components tied to switching
nodes (minimize exposed radiating surface).
Use copper ground planes (possible stitching) and top-layer copper floods (surround circuitry with
ground floods)
Use a 4-layer PCB, if economically feasible (for better grounding)
Minimize the amount of copper area associated with input traces (to minimize radiated pickup)
Hide copper associated with switching nodes under shielded magnetics, where possible
Heat sink the quiet side of components instead of the switching side, where possible (like the output
side of inductor)
Use Bob Smith terminations, Bob Smith EFT capacitor, and Bob Smith plane
Use Bob Smith plane as ground shield on input side of PCB (creating a phantom or literal earth
ground)
Use LC filter at DC/DC input
Dampen high-frequency ringing on all switching nodes, if present (allow for possible snubbers)
Control rise times with gate-drive resistors and possibly snubbers
Switching frequency considerations
Use of EMI bridge capacitor across isolation boundary (isolated topologies)
Observe the polarity dot on inductors (embed noisy end)
Use of ferrite beads on input (allow for possible use of beads or 0-Ω resistors)
Maintain physical separation between input-related circuitry and power circuitry (use ferrite beads as
boundary line)
Balance efficiency versus acceptable noise margin
Possible use of common-mode inductors
Possible use of integrated RJ-45 jacks (shielded with internal transformer and Bob Smith terminations)
End-product enclosure considerations (shielding)
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Bill of Materials
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Bill of Materials
Table 4. TPS23753AEVM-001 and -002 Bill of Materials
TPS23753AEVM-X
Outputs (V)
3.3
5
RefDes
Value
Description
Size
Part Number
MFR
Count
X=002
X=001
1
1
C1
2200pF
Capacitor, Ceramic, 2KV, X7R, 10%
1812
C4532X7R3D222K
TDK
1
1
C10
10uF
Capacitor, Aluminum, 16V, ±20%
0.200 × 0.210 in
EEVFK1E100R
Panasonic
1
1
C11
100pF
Capacitor, Ceramic, 50V, C0G, 5%
0603
Std
Std
0
1
C12
22nF
Capacitor, Ceramic, 50V, X7R, 10%
0603
Std
Std
1
0
C12
47nF
Capacitor, Ceramic, 50V, X7R, 10%
0603
Std
Std
0
1
C13
8.2nF
Capacitor, Ceramic, 50V, X7R, 10%
0603
Std
Std
1
0
C13
6.8nF
Capacitor, Ceramic, 50V, X7R, 10%
0603
Std
Std
1
1
C14
1uF
Capacitor, Ceramic, 16V, X7R, 10%
0805
Std
Std
1
1
C15
680pF
Capacitor, Ceramic, 25V, X7R, 10%
0603
Std
Std
1
1
C16
1nF
Capacitor, Ceramic, 100V, X7R, 10%
0805
Std
Std
1
1
C2
22μF
Capacitor, Aluminum, 63V, ±20%
0.260 × 0.276 in
EEVFK1J220XP
Panasonic
1
1
C25
330pF
Capacitor, Ceramic, 200V, X7R, 10%
0805
Std
Std
2
2
C3, C17
1μF
Capacitor, Ceramic, 100V, X7R, 10%
1210
Std
Std
0
0
C4
10nF
Capacitor, Ceramic, 100V, X7R, 10%
0805
Std
Std
1
1
C5
47μF
Capacitor, Aluminum, 6.3V, ±20%
0.200 x 0.210 in
EEVFK0J470UR
Panasonic
2
2
C6, C18
47μF
Capacitor, Ceramic, 10V, X5R, 20%
1210
Std
TDK
1
1
C7
0.1μF
Capacitor, Ceramic, 50V, X7R, 10%
0603
Std
Std
1
1
C8
0.1μF
Capacitor, Ceramic, 100V, X7R, 10%
0805
Std
Std
1
1
C9
0.22μF
Capacitor, Ceramic, 25V, X7R, 10%
0805
Std
Std
2
2
D1, D2
MURA120
Diode, Rectifier, 1A, 200V
SMA
MURA120
On Semi
0
0
D5
MURA120
Diode, Rectifier, 1A, 200V
SMA
MURA120
On Semi
1
1
D10
BAS16
Diode, Switching, 150-mA, 75-V, 350mW
SOT23
BAS16
Fairchild
1
1
D3
MBRS540T3
Diode, Schottky, 5-A, 40-V
SMC
MBRS540T3
On Semi
2
2
D4, D8
HD01-T
Bridge Rectifier, 100V, 0.8A
MINI DIP4
HD01-T
Diodes, Inc
1
1
D6
SMAJ58A
Diode, TVS, 58-V, 1W
SMA
SMAJ58A
Diodes Inc.
1
1
D9
BAV99
Diode, Dual Ultra Fast, Series, 200-mA, 70-V
SOT23
BAV99
Fairchild
2
2
FB1,FB2
15-Ω
Bead, Ferrite, SMT, 15-Ω, 1500mA
0805
MMZ2012R150A
TDK
2
2
J1, J4
ED555/4DS
Terminal Block, 4-pin, 6-A, 3,5mm
0.55 × 0.25 in
ED555/4DS
OST
1
1
J2
MJFR0429
Connector, Module, RJ45
0.855 × 0.620
MJFR0429
E&E Magnetic Products
1
1
J3
ED1514
Terminal Block, 2-pin, 6-A, 3,5mm
0.27 × 0.25
ED1514
1
1
J6
5520252-4
Connector, Jack Modular, Rt. Angle,
0.655 × 0.615 in
5520252-4
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Bill of Materials
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Table 4. TPS23753AEVM-001 and -002 Bill of Materials (continued)
TPS23753AEVM-X
Outputs (V)
3.3
5
RefDes
Value
Description
Size
Part Number
MFR
Count
12
X=002
X=001
1
1
L1
4.7μH
Inductor, SMT, 1.5A, 90-mΩ
0.26 × 0.09 in
DO1608C-472ML
Coilcraft
1
1
Q1
FDC2512
MOSFET, N-ch, 150-V, 1.4-A, 425-mΩ
SSOT-6
FDC2512
Fairchild
1
1
R1
392K
Resistor, Chip, 1/16W, 1%
0603
Std
Std
1
1
R10
0.56
Resistor, Chip, 1/4W, 1%
1206
ERJ-8RQFR56V
Panasonic ECG
1
1
R11
2K
Resistor, Chip, 1/16W, 1%
0603
Std
Std
0
1
R12
1K
Resistor, Chip, 1/16W, 1%
0603
Std
Std
1
0
R12
402
Resistor, Chip, 1/16W, 1%
0603
Std
Std
1
1
R13
10K
Resistor, Chip, 1/16W, 1%
0603
Std
Std
1
1
R15
41.2K
Resistor, Chip, 1/16W, 1%
0603
Std
Std
0
1
R16
19.1K
Resistor, Chip, 1/16W, 1%
0603
Std
Std
1
0
R16
7.15K
Resistor, Chip, 1/16W, 1%
0603
Std
Std
0
1
R17
13.3K
Resistor, Chip, 1/16W, 1%
0603
Std
Std
1
0
R17
24.3K
Resistor, Chip, 1/16W, 1%
0603
Std
Std
1
1
R18
20
Resistor, Chip, 1/10W, 5%
0805
Std
Std
1
1
R2
39.2K
Resistor, Chip, 1/16W, 1%
0603
Std
Std
2
2
R20, R22
0
Resistor, Chip, 1/16W, 1%
0603
Std
Std
0
1
R21
499
Resistor, Chip, 1/16W, 1%
0603
Std
Std
1
0
R21
402
Resistor, Chip, 1/16W, 1%
0603
Std
Std
1
1
R3
24.9K
Resistor, Chip, 1/16W, 1%
0603
Std
Std
1
1
R30
82
Resistor, Chip, 1/2W, 5%
2010
Std
Std
0
0
R4
49.9K
Resistor, Chip, 1/10W, 1%
0805
Std
Std
1
1
R5
59.0K
Resistor, Chip, 1/16W, 1%
0603
Std
Std
1
1
R6
80.6K
Resistor, Chip, 1/16W, 1%
0603
Std
Std
1
1
R7
1.27K
Resistor, Chip, 1/16W,1%
0603
Std
Std
2
2
R8, R9
49.9
Resistor, Chip, 1/16W, 1%
0603
Std
Std
0
1
T1
POE70P-50L or
835-01046FC
Transformer, PoE 7W, 155 μH. 5V, 1.4A Output
0.500 × 0.600 in
POE70P-50L or
835-01046FC
Coilcraft or
E&E Magnetic Products
1
0
T1
POE70P-33L or
835-01045FC
Transformer, PoE 7W, 155 μH. 3.3V, 2.1A Output
0.500 × 0.600 in
POE70P-33L or
835-01045FC
Coilcraft or
E&E Magnetic Products
1
1
U1
TPS23753APW
IC, IEEE 802.3-2005 Integrated Primary Side Controller
TSSOP14
TPS23753APW
TI
1
1
U2
FOD817AS
IC, Optocoupler, 6-V, 80-160% CTR
SMT-4PDIP
FOD817AS
Fairchild
1
1
U3
TLV431ACDBZR
IC, Low-Voltage Adjustable Shunt Regulator
SOT23-3
TLV431ACDBZR
TI
1
1
—
—
PCB, 2.48 In × 4.33 In × 0.062 In
—
HPA304
Any
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Revision History
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Revision History
Changes from Original (June 2009) to A Revision ......................................................................................................... Page
•
•
Added the Layout Guidelines section................................................................................................... 9
Added the EMI Containment section .................................................................................................. 10
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
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ADDITIONAL TERMS AND CONDITIONS, WARNINGS, RESTRICTIONS, AND DISCLAIMERS FOR
EVALUATION MODULES
Texas Instruments Incorporated (TI) markets, sells, and loans all evaluation boards, kits, and/or modules (EVMs) pursuant to, and user
expressly acknowledges, represents, and agrees, and takes sole responsibility and risk with respect to, the following:
1.
User agrees and acknowledges that EVMs are intended to be handled and used for feasibility evaluation only in laboratory and/or
development environments. Notwithstanding the foregoing, in certain instances, TI makes certain EVMs available to users that do not
handle and use EVMs solely for feasibility evaluation only in laboratory and/or development environments, but may use EVMs in a
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and shall comply with all applicable terms, conditions, warnings, and restrictions in this document and are subject to the disclaimer and
indemnity provisions included in this document.
2. Unless otherwise indicated, EVMs are not finished products and not intended for consumer use. EVMs are intended solely for use by
technically qualified electronics experts who are familiar with the dangers and application risks associated with handling electrical
mechanical components, systems, and subsystems.
3. User agrees that EVMs shall not be used as, or incorporated into, all or any part of a finished product.
4. User agrees and acknowledges that certain EVMs may not be designed or manufactured by TI.
5. User must read the user's guide and all other documentation accompanying EVMs, including without limitation any warning or
restriction notices, prior to handling and/or using EVMs. Such notices contain important safety information related to, for example,
temperatures and voltages. For additional information on TI's environmental and/or safety programs, please visit www.ti.com/esh or
contact TI.
6. User assumes all responsibility, obligation, and any corresponding liability for proper and safe handling and use of EVMs.
7. Should any EVM not meet the specifications indicated in the user’s guide or other documentation accompanying such EVM, the EVM
may be returned to TI within 30 days from the date of delivery for a full refund. THE FOREGOING LIMITED WARRANTY IS THE
EXCLUSIVE WARRANTY MADE BY TI TO USER AND IS IN LIEU OF ALL OTHER WARRANTIES, EXPRESSED, IMPLIED, OR
STATUTORY, INCLUDING ANY WARRANTY OF MERCHANTABILITY OR FITNESS FOR ANY PARTICULAR PURPOSE. TI SHALL
NOT BE LIABLE TO USER FOR ANY INDIRECT, SPECIAL, INCIDENTAL, OR CONSEQUENTIAL DAMAGES RELATED TO THE
HANDLING OR USE OF ANY EVM.
8. No license is granted under any patent right or other intellectual property right of TI covering or relating to any machine, process, or
combination in which EVMs might be or are used. TI currently deals with a variety of customers, and therefore TI’s arrangement with
the user is not exclusive. TI assumes no liability for applications assistance, customer product design, software performance, or
infringement of patents or services with respect to the handling or use of EVMs.
9. User assumes sole responsibility to determine whether EVMs may be subject to any applicable federal, state, or local laws and
regulatory requirements (including but not limited to U.S. Food and Drug Administration regulations, if applicable) related to its handling
and use of EVMs and, if applicable, compliance in all respects with such laws and regulations.
10. User has sole responsibility to ensure the safety of any activities to be conducted by it and its employees, affiliates, contractors or
designees, with respect to handling and using EVMs. Further, user is responsible to ensure that any interfaces (electronic and/or
mechanical) between EVMs and any human body are designed with suitable isolation and means to safely limit accessible leakage
currents to minimize the risk of electrical shock hazard.
11. User shall employ reasonable safeguards to ensure that user’s use of EVMs will not result in any property damage, injury or death,
even if EVMs should fail to perform as described or expected.
12. User shall be solely responsible for proper disposal and recycling of EVMs consistent with all applicable federal, state, and local
requirements.
Certain Instructions. User shall operate EVMs within TI’s recommended specifications and environmental considerations per the user’s
guide, accompanying documentation, and any other applicable requirements. Exceeding the specified ratings (including but not limited to
input and output voltage, current, power, and environmental ranges) for EVMs may cause property damage, personal injury or death. If
there are questions concerning these ratings, user should contact a TI field representative prior to connecting interface electronics including
input power and intended loads. Any loads applied outside of the specified output range may result in unintended and/or inaccurate
operation and/or possible permanent damage to the EVM and/or interface electronics. Please consult the applicable EVM user's guide prior
to connecting any load to the EVM output. If there is uncertainty as to the load specification, please contact a TI field representative. During
normal operation, some circuit components may have case temperatures greater than 60°C as long as the input and output are maintained
at a normal ambient operating temperature. These components include but are not limited to linear regulators, switching transistors, pass
transistors, and current sense resistors which can be identified using EVMs’ schematics located in the applicable EVM user's guide. When
placing measurement probes near EVMs during normal operation, please be aware that EVMs may become very warm. As with all
electronic evaluation tools, only qualified personnel knowledgeable in electronic measurement and diagnostics normally found in
development environments should use EVMs.
Agreement to Defend, Indemnify and Hold Harmless. User agrees to defend, indemnify, and hold TI, its directors, officers, employees,
agents, representatives, affiliates, licensors and their representatives harmless from and against any and all claims, damages, losses,
expenses, costs and liabilities (collectively, "Claims") arising out of, or in connection with, any handling and/or use of EVMs. User’s
indemnity shall apply whether Claims arise under law of tort or contract or any other legal theory, and even if EVMs fail to perform as
described or expected.
Safety-Critical or Life-Critical Applications. If user intends to use EVMs in evaluations of safety critical applications (such as life support),
and a failure of a TI product considered for purchase by user for use in user’s product would reasonably be expected to cause severe
personal injury or death such as devices which are classified as FDA Class III or similar classification, then user must specifically notify TI
of such intent and enter into a separate Assurance and Indemnity Agreement.
RADIO FREQUENCY REGULATORY COMPLIANCE INFORMATION FOR EVALUATION MODULES
Texas Instruments Incorporated (TI) evaluation boards, kits, and/or modules (EVMs) and/or accompanying hardware that is marketed, sold,
or loaned to users may or may not be subject to radio frequency regulations in specific countries.
General Statement for EVMs Not Including a Radio
For EVMs not including a radio and not subject to the U.S. Federal Communications Commission (FCC) or Industry Canada (IC)
regulations, TI intends EVMs to be used only for engineering development, demonstration, or evaluation purposes. EVMs are not finished
products typically fit for general consumer use. EVMs may nonetheless generate, use, or radiate radio frequency energy, but have not been
tested for compliance with the limits of computing devices pursuant to part 15 of FCC or the ICES-003 rules. Operation of such EVMs may
cause interference with radio communications, in which case the user at his own expense will be required to take whatever measures may
be required to correct this interference.
General Statement for EVMs including a radio
User Power/Frequency Use Obligations: For EVMs including a radio, the radio included in such EVMs is intended for development and/or
professional use only in legally allocated frequency and power limits. Any use of radio frequencies and/or power availability in such EVMs
and their development application(s) must comply with local laws governing radio spectrum allocation and power limits for such EVMs. It is
the user’s sole responsibility to only operate this radio in legally acceptable frequency space and within legally mandated power limitations.
Any exceptions to this are strictly prohibited and unauthorized by TI unless user has obtained appropriate experimental and/or development
licenses from local regulatory authorities, which is the sole responsibility of the user, including its acceptable authorization.
U.S. Federal Communications Commission Compliance
For EVMs Annotated as FCC – FEDERAL COMMUNICATIONS COMMISSION Part 15 Compliant
Caution
This device complies with part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not cause
harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation.
Changes or modifications could void the user's authority to operate the equipment.
FCC Interference Statement for Class A EVM devices
This equipment has been tested and found to comply with the limits for a Class A digital device, pursuant to part 15 of the FCC Rules.
These limits are designed to provide reasonable protection against harmful interference when the equipment is operated in a commercial
environment. This equipment generates, uses, and can radiate radio frequency energy and, if not installed and used in accordance with the
instruction manual, may cause harmful interference to radio communications. Operation of this equipment in a residential area is likely to
cause harmful interference in which case the user will be required to correct the interference at its own expense.
FCC Interference Statement for Class B EVM devices
This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to part 15 of the FCC Rules.
These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment
generates, uses and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause
harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If
this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and
on, the user is encouraged to try to correct the interference by one or more of the following measures:
• Reorient or relocate the receiving antenna.
• Increase the separation between the equipment and receiver.
• Connect the equipment into an outlet on a circuit different from that to which the receiver is connected.
• Consult the dealer or an experienced radio/TV technician for help.
Industry Canada Compliance (English)
For EVMs Annotated as IC – INDUSTRY CANADA Compliant:
This Class A or B digital apparatus complies with Canadian ICES-003.
Changes or modifications not expressly approved by the party responsible for compliance could void the user’s authority to operate the
equipment.
Concerning EVMs Including Radio Transmitters
This device complies with Industry Canada licence-exempt RSS standard(s). Operation is subject to the following two conditions: (1) this
device may not cause interference, and (2) this device must accept any interference, including interference that may cause undesired
operation of the device.
Concerning EVMs Including Detachable Antennas
Under Industry Canada regulations, this radio transmitter may only operate using an antenna of a type and maximum (or lesser) gain
approved for the transmitter by Industry Canada. To reduce potential radio interference to other users, the antenna type and its gain should
be so chosen that the equivalent isotropically radiated power (e.i.r.p.) is not more than that necessary for successful communication.
This radio transmitter has been approved by Industry Canada to operate with the antenna types listed in the user guide with the maximum
permissible gain and required antenna impedance for each antenna type indicated. Antenna types not included in this list, having a gain
greater than the maximum gain indicated for that type, are strictly prohibited for use with this device.
Canada Industry Canada Compliance (French)
Cet appareil numérique de la classe A ou B est conforme à la norme NMB-003 du Canada
Les changements ou les modifications pas expressément approuvés par la partie responsable de la conformité ont pu vider l’autorité de
l'utilisateur pour actionner l'équipement.
Concernant les EVMs avec appareils radio
Le présent appareil est conforme aux CNR d'Industrie Canada applicables aux appareils radio exempts de licence. L'exploitation est
autorisée aux deux conditions suivantes : (1) l'appareil ne doit pas produire de brouillage, et (2) l'utilisateur de l'appareil doit accepter tout
brouillage radioélectrique subi, même si le brouillage est susceptible d'en compromettre le fonctionnement.
Concernant les EVMs avec antennes détachables
Conformément à la réglementation d'Industrie Canada, le présent émetteur radio peut fonctionner avec une antenne d'un type et d'un gain
maximal (ou inférieur) approuvé pour l'émetteur par Industrie Canada. Dans le but de réduire les risques de brouillage radioélectrique à
l'intention des autres utilisateurs, il faut choisir le type d'antenne et son gain de sorte que la puissance isotrope rayonnée équivalente
(p.i.r.e.) ne dépasse pas l'intensité nécessaire à l'établissement d'une communication satisfaisante.
Le présent émetteur radio a été approuvé par Industrie Canada pour fonctionner avec les types d'antenne énumérés dans le manuel
d’usage et ayant un gain admissible maximal et l'impédance requise pour chaque type d'antenne. Les types d'antenne non inclus dans
cette liste, ou dont le gain est supérieur au gain maximal indiqué, sont strictement interdits pour l'exploitation de l'émetteur.
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2014, Texas Instruments Incorporated
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Important Notice for Users of EVMs Considered “Radio Frequency Products” in Japan
EVMs entering Japan are NOT certified by TI as conforming to Technical Regulations of Radio Law of Japan.
If user uses EVMs in Japan, user is required by Radio Law of Japan to follow the instructions below with respect to EVMs:
1.
2.
3.
Use EVMs in a shielded room or any other test facility as defined in the notification #173 issued by Ministry of Internal Affairs and
Communications on March 28, 2006, based on Sub-section 1.1 of Article 6 of the Ministry’s Rule for Enforcement of Radio Law of
Japan,
Use EVMs only after user obtains the license of Test Radio Station as provided in Radio Law of Japan with respect to EVMs, or
Use of EVMs only after user obtains the Technical Regulations Conformity Certification as provided in Radio Law of Japan with respect
to EVMs. Also, do not transfer EVMs, unless user gives the same notice above to the transferee. Please note that if user does not
follow the instructions above, user will be subject to penalties of Radio Law of Japan.
http://www.tij.co.jp
【無線電波を送信する製品の開発キットをお使いになる際の注意事項】 本開発キットは技術基準適合証明を受けておりません。 本製品の
ご使用に際しては、電波法遵守のため、以下のいずれかの措置を取っていただく必要がありますのでご注意ください。
1.
2.
3.
電波法施行規則第6条第1項第1号に基づく平成18年3月28日総務省告示第173号で定められた電波暗室等の試験設備でご使用いただく。
実験局の免許を取得後ご使用いただく。
技術基準適合証明を取得後ご使用いただく。。
なお、本製品は、上記の「ご使用にあたっての注意」を譲渡先、移転先に通知しない限り、譲渡、移転できないものとします
上記を遵守頂けない場合は、電波法の罰則が適用される可能性があることをご留意ください。
日本テキサス・インスツルメンツ株式会社
東京都新宿区西新宿６丁目２４番１号
西新宿三井ビル
http://www.tij.co.jp
Texas Instruments Japan Limited
(address) 24-1, Nishi-Shinjuku 6 chome, Shinjuku-ku, Tokyo, Japan
IMPORTANT NOTICE
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DLP® Products
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