User's Guide
SLVU314F – May 2009 – Revised March 2016
TPS23753AEVM-004: Evaluation Module for TPS23753A
This user’s guide describes the TPS23753AEVM (TPS23753AEVM-004). The TPS23753AEVM-004
contains evaluation and reference circuitry for the TPS23753A. The TPS23753A is an IEEE 802.3-2005
compliant powered-device controller and power supply controller optimized for isolated converter
topologies. The TPS23753AEVM-004 is targeted at general, efficient, synchronous rectifier, 10-W flyback
converter applications.
1
2
3
4
5
6
7
8
Contents
Description .................................................................................................................... 2
1.1
Features .............................................................................................................. 2
1.2
Applications .......................................................................................................... 2
Electrical Specifications ..................................................................................................... 3
Schematic ..................................................................................................................... 4
General Configuration and Description ................................................................................... 5
4.1
Physical Access ..................................................................................................... 5
Test Setup .................................................................................................................... 6
TPS23753AEVM-004 Typical Performance Data ....................................................................... 6
6.1
3.3-V Efficiency ..................................................................................................... 6
6.2
5-V DC/DC Efficiency .............................................................................................. 7
6.3
12-V DC/DC Efficiency ............................................................................................. 7
6.4
TPS23753AEVM-004 Conducted Emissions.................................................................... 8
EVM Assembly Drawings and Layout Guidelines ....................................................................... 8
7.1
PCB Drawings ....................................................................................................... 8
7.2
Layout Guidelines ................................................................................................. 10
7.3
EMI Containment .................................................................................................. 11
Bill of Materials ............................................................................................................. 12
List of Figures
1
TPS23753AEVM-004 Schematic .......................................................................................... 4
2
Typical TPS23753AEVM-004 Test Setup ................................................................................ 6
3
TPS23753AEVM-004 Efficiency With 3.3-V Output ..................................................................... 6
4
TPS23753AEVM-003 Efficiency With 5-V Output ....................................................................... 7
5
TPS23753AEVM-005 Efficiency With 12-V Output
6
7
8
9
10
..................................................................... 7
TPS23753AEVM-004 Conducted Emissions............................................................................. 8
Top Side Placement ......................................................................................................... 8
Top Side Routing ............................................................................................................ 9
Bottom Side Routing ........................................................................................................ 9
Bottom Side Placement ................................................................................................... 10
List of Tables
1
TPS23753AEVM-003, -004, and -005 Electrical and Performance Specifications at T = 25°C ................... 3
2
Connector Functionality ..................................................................................................... 5
3
Test Points .................................................................................................................... 5
4
TPS23753AEVM-003, -004, and -005 Bill of Materials................................................................ 12
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1
Description
1
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Description
TPS23753AEVM-004 allows users to evaluate the reference circuitry of the TPS23753A. It contains input
and output power connectors and an array of onboard test points for circuit evaluation. TPS23753AEVM003 (5-V output) and TPS23753AEVM-005 (12-V output) can be configured with simple bill of materials
(BOM) changes.
1.1
Features
•
1.2
Applications
•
•
•
2
Efficient, general market design
– Simple gate drive, synchronous rectified secondary
– 10-W output power from power over Ethernet (PoE), 48-V or 24-V adapter and 6-W output power
from a 12-V adapter
– 5-V or 12-V output voltage with simple BOM changes
Voice over Internet protocol – IP telephones
Wireless LAN – Wireless access points
Security – Wired IP cameras
TPS23753AEVM-004: Evaluation Module for TPS23753A
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Electrical Specifications
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2
Electrical Specifications
Table 1. TPS23753AEVM-003, -004, and -005 Electrical and Performance Specifications at T = 25°C
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
POWER INTERFACE
Input Voltage
Applied to the power pins of connectors J2, J4, or J6
Operating Voltage
After start up
Input UVLO
0
57
V
30
57
V
Rising input voltage
36
Falling input voltage
30
V
Detection voltage
At device terminals
3
10
mA
Classification voltage
At device terminals
10
23
mA
Classification current
Rclass = 1270 Ω
1.8
2.4
mA
90
190
mA
405
495
mA
Inrush current-limit
Operating current-limit
DC/DC CONVERTER
Output voltage
20 V ≤ Vin ≤ 57 V, ILOAD ≤ ILOAD (max)
10.8 V ≤ Vin ≤ 13.2 V, ILOAD ≤ ILOAD (max)
20 V ≤ Vin ≤ 57 V
Output current
10.8 V ≤ Vin ≤ 13.2 V
Output ripple voltage,
peak-to-peak
Efficiency, end-to-end
3.3-V output
(-004)
3.13
3.3
3.47
5-V output
(-003)
4.75
5.0
5.25
12-V output
(-005)
11.4
12.0
12.6
3.3-V output
3
5-V output
2
12-V output
0.9
3.3-V output
1.8
5-V output
1.2
12-V output
0.5
V
A
A
Vin = 44 V, ILOAD = 3 A
3.3-V output
Vin = 44 V, ILOAD = 2 A
5-V output
40
Vin = 44 V, ILOAD = 0.9 A
12-V output
100
Vin = 44 V, ILOAD = 2 A
3.3-V output
83
%
Vin = 44 V, ILOAD = 1.4 A
5-V output
82
%
Vin = 44 V, ILOAD = 0.9 A
12-V output
83
%
Switching frequency
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30
112
mV
138
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kHz
3
Schematic
3
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Schematic
2
2
1
1
3
2
2
1
1
2
2
2
3
2
1
2
2
2
2
3
2
3
2
2,3
The TPS23753AEVM-004 schematic follows.
Figure 1. TPS23753AEVM-004 Schematic
4
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General Configuration and Description
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4
General Configuration and Description
4.1
Physical Access
Table 2 lists the TPS23753AEVM-004 connector functionality and Table 3 describes the test point
availability.
Table 2. Connector Functionality
Connector
Label
J1
DATA PORT
Ethernet data port connector
J2
ETHERNET
POWER
Ethernet power input connector. Contains Ethernet transformer and cable terminations
J3
VOUT
J4
J6
ADP-VSS
AP-RTN
Description
Output voltage connector
VSS referenced external adapter input connector.
J4-1/J4-1 are used with a powered-device adapter input (VSS)
RTN referenced external adapter input connector.
J6-1/J6-2 are used with DC/DC converter adapter input (RTN) and
Table 3. Test Points
Test Point
TP9, TP12, TP29,
TP31
Color
Label
Description
BLK
GND
Secondary-side (output) grounds (GND)
TP14
RED
VC
TP15
ORG
DR-P
DC/DC converter bias supply
Drain terminal of the primary-side switching MOSFET
TP7
BLK
VSS
POE input, low side
DC/DC converter return
TP25, TP30, TP33
BLK
RTN
TP20.
ORG
LOOP
TP21
WHT
I-LOOP
TP11, TP17
RED
VOUT
DC/DC converter output voltage.
TP10
RED
VOUT1
DC/DC converter output voltage (before LC filter).
TP13
WHT
GTS
Gate drive for the secondary-side synchronous rectifier MOSFET
TP6
WHT
DR-S
Drain terminal of the secondary-side synchronous rectifier MOSFET
TP28
WHT
CTL
Control loop input to the pulse width modulator
TP24
WHT
RCS
DC/DC converter primary-side switching MOSFET current sense (resistor side)
TP23
WHT
CS
DC/DC converter primary-side switching MOSFET current sense input (chip side)
Bias voltage regulator
Can be used with TP17 for overall feedback loop measurements.
Can be used with TP17 for outer feedback loop measurements.
TP27
RED
VB
TP19
WHT
GATE
Gate drive for the primary-side switching MOSFET
TP8
RED
VPRI
Transformer primary high side.
TP26
WHT
VKAT
Error amplifier (secondary-side) output drive for opto-isolator
TP1
RED
PR78
Pair 7,8
TP4
RED
PR12
Pair 1,2
TP2
ORG
PR45
Pair 4,5
TP3
ORG
PR36
Pair 3,6
D9
RED
POWER
ON
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Output power indicator
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5
Test Setup
5
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Test Setup
Figure 2 shows a typical test setup for TPS23753AEVM-004. Input voltage can be applied as described in
Table 2.
AUX
Power Source
J4
PSE
Or
Power Supply
(Ethernet Cable )
J6
VOUT J3
GND
R LOAD
J2
TPS23753AEVM - 004
Data to PHY
(Ethernet Cable )
J1
Figure 2. Typical TPS23753AEVM-004 Test Setup
6
TPS23753AEVM-004 Typical Performance Data
6.1
3.3-V Efficiency
Figure 3 illustrates the efficiency at three different input voltage levels: 1) PoE 48V from J2, 2) 48V RTNbased adapter, and 3) 24V RTN-based adapter.
90
48 V to 3.3 V
85
24 V to 3.3 V
Efficiency - %
80
PoE 48 V to 3.3 V
75
70
65
60
0
0.5
1
1.5
2
2.5
3
IO - Output Current - A
Figure 3. TPS23753AEVM-004 Efficiency With 3.3-V Output
6
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6.2
5-V DC/DC Efficiency
Figure 4 illustrates the efficiency at three different input voltage levels: 1) PoE 48V from J2, 2) 48V RTNbased adapter, and 3) 24V RTN- based adapter.
90
48 V to 5 V
85
24 V to 5 V
Efficiency - %
80
PoE 48 V to 5 V
75
70
65
60
0
0.50
1
1.50
IO - Output Current - A
2
Figure 4. TPS23753AEVM-003 Efficiency With 5-V Output
6.3
12-V DC/DC Efficiency
Figure 5 illustrates the efficiency at three different input voltage levels: 1) PoE 48V from J2, 2) 48V RTNbased adapter, and 3) 24V RTN-based adapter.
95
90
48 V to 12 V
Efficiency - %
85
24 V to 12 V
80
PoE 48 V to 12 V
75
70
65
60
0
0.10
0.20
0.30
0.40
0.50
0.60
0.70
IO - Output Current - A
0.80
0.90
1
Figure 5. TPS23753AEVM-005 Efficiency With 12-V Output
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TPS23753AEVM-004 Typical Performance Data
6.4
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TPS23753AEVM-004 Conducted Emissions
TPS23753AEVM
- 004 Pre -Compliance Test
EN 55022 Telecommunication Port
48 Vin 3.3V 10 W Floating Output
Class B Quasi
-Peak Limit
Class B Average Limit
Figure 6. TPS23753AEVM-004 Conducted Emissions
7
EVM Assembly Drawings and Layout Guidelines
7.1
PCB Drawings
Figure 7 shows the component placement and layout.
Figure 7. Top Side Placement
8
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EVM Assembly Drawings and Layout Guidelines
Figure 8. Top Side Routing
Figure 9. Bottom Side Routing
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EVM Assembly Drawings and Layout Guidelines
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Figure 10. Bottom Side Placement
7.2
Layout Guidelines
The layout of the PoE front end should follow power and EMI/ESD best-practice guidelines. A basic set of
recommendations include:
• Parts placement must be driven by power flow in a point-to-point manner; RJ-45, Ethernet transformer,
diode bridges, TVS and 0.1-μF capacitor, and TPS23753A converter input bulk capacitor.
• Make all leads as short as possible with wide power traces and paired signal and return.
• No crossovers of signals from one part of the flow to another are allowed.
• Spacing consistent with safety standards like IEC60950 must be observed between the 48-V input
voltage rails and between the input and an isolated converter output.
• Place the TPS23753A over split, local ground planes referenced to VSS for the PoE input and to
COM/RTN for the converter. Whereas the PoE side may operate without a ground plane, the converter
side must have one. Do not place logic ground and power layers under the Ethernet input or the
converter primary side.
• Use large copper fills and traces on SMT power-dissipating devices, and use wide traces or overlay
copper fills in the power path.
The DC/DC Converter layout benefits from basic rules such as:
• Pair signals to reduce emissions and noise, especially the paths that carry high-current pulses which
include the power semiconductors and magnetics.
• Minimize trace length of high current, power semiconductors, and magnetic components.
• Where possible, use vertical pairing
• Use the ground plane for the switching currents carefully.
• Keep the high-current and high-voltage switching away from low-level sensing circuits including those
outside the power supply.
• Proper spacing around the high-voltage sections of the converter
10
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EVM Assembly Drawings and Layout Guidelines
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7.3
EMI Containment
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
Use compact loops for dv/dt and di/dt circuit paths (power loops and gate drives)
Use minimal, yet thermally adequate, copper areas for heat sinking of components tied to switching
nodes (minimize exposed radiating surface).
Use copper ground planes (possible stitching) and top-layer copper floods (surround circuitry with
ground floods)
Use a 4-layer PCB, if economically feasible (for better grounding)
Minimize the amount of copper area associated with input traces (to minimize radiated pickup)
Hide copper associated with switching nodes under shielded magnetics, where possible
Heat sink the quiet side of components instead of the switching side, where possible (like the output
side of inductor)
Use Bob Smith terminations, Bob Smith EFT capacitor, and Bob Smith plane
Use Bob Smith plane as ground shield on input side of PCB (creating a phantom or literal earth
ground)
Use LC filter at DC/DC input
Dampen high-frequency ringing on all switching nodes, if present (allow for possible snubbers)
Control rise times with gate-drive resistors and possibly snubbers
Switching frequency considerations
Use of EMI bridge capacitor across isolation boundary (isolated topologies)
Observe the polarity dot on inductors (embed noisy end)
Use of ferrite beads on input (allow for possible use of beads or 0-Ω resistors)
Maintain physical separation between input-related circuitry and power circuitry (use ferrite beads as
boundary line)
Balance efficiency versus acceptable noise margin
Possible use of common-mode inductors
Possible use of integrated RJ-45 jacks (shielded with internal transformer and Bob Smith terminations)
End-product enclosure considerations (shielding)
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Bill of Materials
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Bill of Materials
Table 4. TPS23753AEVM-003, -004, and -005 Bill of Materials
TPS23753AEVM-X
Outputs (V)
12
3.3
5
Ref Des
Value
Description
Size
Part Number
MFR
Count
X=005
X=004
X=003
4
4
4
C1, C2, C3, C4
0.01uF
Capacitor, Ceramic, 100V, X7R, 10%
0603
Std
Std
1
1
1
C11
0.01uF
Capacitor, Ceramic, 100V, X7R, 10%
1210
Std
Std
0
2
2
C12, C13
47uF
Capacitor, Ceramic, 6.3-V, X5R, 20%
1210
C3225X5R0J476M
TDK
2
0
0
C12, C13
10uF
Capacitor, Ceramic, 16-V, X5R, 20%
1210
C3225X5R1C106M
TDK
0
1
1
C14
330uF
Capacitor, Aluminum, 6.3V, 20%
0.260 x 0.276 inch
EEVFK0J331XP
Panasonic
1
0
0
C14
68uF
Capacitor, Aluminum, 16V, 20%
0.217 x 0.169
EEVFK1C680P
Panasonic
1
1
1
C15
0.22uF
Capacitor, Ceramic, 25V, X7R, 10%
0805
Std
Std
1
1
1
C16
10uF
Capacitor, Aluminum, 25V, ±20%
0.200 x 0.210 inch
EEVFK1E100R
Panasonic
0
0
0
C17
220pF
Capacitor, Ceramic, 16V, X7R, 10%
0603
Std
Std
0
1
1
C18
100pF
Capacitor, Ceramic, 16V, X7R, 10%
0603
Std
Std
1
0
0
C18
10pF
Capacitor, Ceramic, 16V, X7R, 10%
0603
Std
Std
0
0
1
C19
8.2nF
Capacitor, Ceramic, 16V, X7R, 10%
0603
Std
Std
0
1
0
C19
10nF
Capacitor, Ceramic, 16V, X7R, 10%
0603
Std
Std
1
0
0
C19
6.8nF
Capacitor, Ceramic, 16V, X7R, 10%
0603
Std
Std
2
2
2
C20, C22
0.1uF
Capacitor, Ceramic, 16V, X7R, 10%
0603
Std
Std
0
0
1
C21
22nF
Capacitor, Ceramic, 16V, X7R, 10%
0603
Std
Std
0
1
0
C21
47nF
Capacitor, Ceramic, 16V, X7R, 10%
0603
Std
Std
1
0
0
C21
15nF
Capacitor, Ceramic, 16V, X7R, 10%
0603
Std
Std
1
1
1
C23
0.1uF
Capacitor, Ceramic, 100V, X7R, 10%
1210
Std
Std
2
2
2
C24, C26
1nF
Capacitor, Ceramic, 100V, X7R, 10%
0805
Std
Std
0
0
0
C25
330pF
Capacitor, Ceramic, 200V, X7R, 10%
0805
Std
Std
1
1
1
C5
1000pF
Capacitor, Ceramic, 2kV, X7R 10%
1808
C4520X7R3D102K
TDK
1
1
1
C6
2200pF
Capacitor, Ceramic, 2KV, X7R, 20%
1812
C4532X7R3D222K
TDK
0
1
1
C7
2200pF
Capacitor, Ceramic, 100V, X7R, 10%
0805
Std
Std
1
0
0
C7
1000pF
Capacitor, Ceramic, 100V, X7R, 10%
0805
Std
Std
1
1
1
C8
22uF
Capacitor, Aluminum, 100V, 20%
8x10.2mm
EEVFK2A220P
Panasonic
2
2
2
C9, C10
1uF
Capacitor, Ceramic, 100V, X7R, 10%
1210
Std
Std
1
1
1
CL1
NA
Current Loop, AWG 28, 0.300 inch
0.300 X AWG 28
Std
Std
1
1
1
D1
SMAJ58A
Diode, TVS, 58-V, 1W
SMA
SMAJ58A
Diodes Inc.
1
1
1
D10
BAS16
Diode, Switching, 200mA, 75V, 225mW
SOT-23
BAS16LT1
On Semi
1
1
1
D12
BAV99
Diode, Dual Ultra Fast, Series, 200-mA, 70-V
SOT23
BAV99
Fairchild
2
2
2
D2, D3
HD01-T
Bridge Rectifier, 100V, 0.8A, Glass Passivated, SMD
MINI DIP4
HD01-T
Diodes, Inc
3
3
3
D8, D13, D14
MURA120
Diode, Rectifier, 1A, 200V
SMA
MURA120
On Semi
0
0
0
D5
MURA120
Diode, Rectifier, 1A, 200V
SMA
MURA120
On Semi
12
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Bill of Materials
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Table 4. TPS23753AEVM-003, -004, and -005 Bill of Materials (continued)
TPS23753AEVM-X
Outputs (V)
12
3.3
5
Ref Des
Value
Description
Size
Part Number
MFR
Count
X=005
X=004
X=003
2
2
2
D6, D7
BZT52C15S
Diode, Zener, 200mW, 15V
SOD-323
BZT52C15S
Diodes, Inc
1
1
1
D9
RED
Diode, LED, RED, 2.0-V, 850-mcd,SM
1210
LTST-C930KRKT
LITE-ON INC
2
2
2
FB1, FB2
15-Ohms
Bead, Ferrite, SMT, 15-Ohms, 1500mA
0805
MMZ2012R150A
TDK
2
2
2
J1, J2
5520252-4
Connector, Jack, Modular, 8 POS
0.705 x 0.820
5520252-4
AMP
3
3
3
J3, J4, J6
ED1514
Terminal Block, 2-pin, 6-A, 3.5mm
0.27 x 0.25
ED1514
OST
1
1
1
L1
10uH
Inductor, SMT, 1.1A, 160milliohm
4.45x6.6mm
DO1608C-103ML_
Coilcraft
1
1
1
L2
1.0uH
Inductor, SMT, 1.0-uH, 6.8-A, 9-milliohm
0.51x0.37
DO3316P-102HCB
Coilcraft
0
1
1
Q1
IRF8113
MOSFET, N-ch, 30-V, 17.2-A, 5.6-milliOhms
SO8
IRF8113
IR
1
0
0
Q1
IRF7855
MOSFET, N-ch, 60-V, 12-A, 9.4-milliOhms
SO8
IRF7855
IR
1
1
1
Q2
SI4848DY
MOSFET, N-ch, 150-V, 3.7-A, 85-milliOhms
SO8
SI4848DY
Vishay Siliconix
4
4
4
R1, R2, R3, R4
75
Resistor, Chip, 1/16W, 5%
0603
Std
Std
1
1
1
R10
118K
Resistor, Chip, 1/16W,1%
0603
Std
Std
1
1
1
R11
162K
Resistor, Chip, 1/16W,1%
0603
Std
Std
1
1
1
R12
1.27K
Resistor, Chip, 1/16W,1%
0603
Std
Std
1
1
1
R13
24.9
Resistor, Chip, 1/16W, 1%
0603
Std
Std
1
1
1
R15
4.7
Resistor, Chip, 1/16W, 5%
0603
Std
Std
1
1
1
R16
10K
Resistor, Chip, 1/16W,1%
0603
Std
Std
1
1
1
R17
49.9
Resistor, Chip, 1/16W,1%
0603
Std
Std
1
1
1
R18
0.39
Resistor, Chip, 1/2W, 1%
2010
Std
Std
0
1
1
R19
41.2K
Resistor, Chip, 1/16W,1%
0603
Std
Std
1
0
0
R19
12.4K
Resistor, Chip, 1/16W,1%
0603
Std
Std
2
2
2
R14, R20
0
Resistor, Chip, 1/16W, 1%
0603
Std
Std
0
0
1
R21
21K
Resistor, Chip, 1/16W, 1%
0603
Std
Std
0
1
0
R21
2K
Resistor, Chip, 1/16W, 1%
0603
Std
Std
1
0
0
R21
15K
Resistor, Chip, 1/16W, 1%
0603
Std
Std
0
0
1
R22
1K
Resistor, Chip, 1/16W,1%
0603
Std
Std
0
1
0
R22
422
Resistor, Chip, 1/16W,1%
0603
Std
Std
1
0
0
R22
2.49K
Resistor, Chip, 1/16W,1%
0603
Std
Std
1
1
1
R23
2K
Resistor, Chip, 1/16W,1%
0603
Std
Std
0
0
1
R24
13.3K
Resistor, Chip, 1/16W,1%
0603
Std
Std
0
1
0
R24
24.3K
Resistor, Chip, 1/16W,1%
0603
Std
Std
1
0
0
R24
3.24K
Resistor, Chip, 1/16W,1%
0603
Std
Std
0
0
0
R25
79
Resistor, Chip, 1/2W, 5%
2010
Std
Std
1
1
1
R26
392K
Resistor, Chip, 1/16W, 1%
0603
Std
Std
1
1
1
R27
39.2K
Resistor, Chip, 1/16W, 1%
0603
Std
Std
0
0
1
R28
249
Resistor, Chip, 1/16W, 1%
0603
Std
Std
SLVU314F – May 2009 – Revised March 2016
Submit Documentation Feedback
TPS23753AEVM-004: Evaluation Module for TPS23753A
Copyright © 2009–2016, Texas Instruments Incorporated
13
Bill of Materials
www.ti.com
Table 4. TPS23753AEVM-003, -004, and -005 Bill of Materials (continued)
TPS23753AEVM-X
Outputs (V)
12
3.3
5
Ref Des
Value
Description
Size
Part Number
MFR
Count
X=005
X=004
X=003
0
1
0
R28
348
Resistor, Chip, 1/16W, 1%
0603
Std
Std
1
0
0
R28
301
Resistor, Chip, 1/16W, 1%
0603
Std
Std
1
1
1
R5
10
Resistor, Chip, 1/2W, 5%
2010
Std
Std
1
1
1
R6
160K
Resistor, Chip, 1/10W, 5%
0805
Std
Std
1
1
1
R7
24.9K
Resistor, Chip, 1/16W,1%
0603
Std
Std
0
1
1
R8
1K
Resistor, Chip, 1/10-W, 5%
0805
Std
Std
1
0
0
R8
2.87K
1
1
1
R9
49.9
Resistor, Chip, 1/8W, 1%
0805
Std
Std
1
1
1
T1
H2019
Xfmr, Center-tapped, Voice Over IP
0.500 x 0.370
H2019
Pulse
Transformer, PoE 13W, Triple Secondary, 150uH, 5V, 2A
0.875 x 0.675
HA3802-BL or
835-01041FC
Coilcraft or E&E Magnetic
Products
14
0
0
1
T2
HA3802-BL or
835-01041FC
0
1
0
T2
HA3801-BL or
835-01040FC
Transformer, PoE 13W, Triple Secondary, 165uH, 3.3V, 3A
0.875 x 0.675
HA3801-BL or
835-01040FC
Coilcraft or E&E Magnetic
Products
1
0
0
T2
HA3803-BL or
835-01042FC or
750311805
Transformer, PoE 13W, Triple Secondary, 150uH, 12V, 1A
0.875 x 0.675
HA3803-BL or
835-01042FC or
750311805
Coilcraft or E&E Magnetic
Products or Wurth
1
1
1
U1
TPS23753APW
IC, IEEE 802.3-2005 Integrated Primary Side Controller
TSSOP14
TPS23753APW
TI
1
1
1
U2
TCMT1107
IC, Photocoupler, 3750VRMS, 80-160% CTR
MF4
TCMT1107
Vishay
0
1
1
U3
TLV431ACDBVR
IC, Shunt Regulator, 1.24-V ref, 6-V, 10-mA, 1%
SOT23-5
TLV431ACDBVR
TI
1
0
0
U3
TL431ACDBVR
IC, Shunt Regulator, 2.49-V ref, 36-V, 10-mA, 1%
SOT23-5
TL431ACDBVR
TI
1
1
1
—
—
PCB, 2.76 In x 4.50 In x 0.062 In
—
HPA305
Any
TPS23753AEVM-004: Evaluation Module for TPS23753A
SLVU314F – May 2009 – Revised March 2016
Submit Documentation Feedback
Copyright © 2009–2016, Texas Instruments Incorporated
Revision History
www.ti.com
Revision History
Changes from E Revision (March 2014) to F Revision ................................................................................................... Page
•
Added "or 750311805" to the -005 T2 transformer description in Table 4
......................................................
14
Revision History
Changes from D Revision (June 2013) to E Revision .................................................................................................... Page
•
•
Added the Layout Guidelines section ................................................................................................. 10
Added the EMI Containment section .................................................................................................. 11
Revision History
Changes from C Revision (August 2012) to D Revision ................................................................................................ Page
•
•
Added New row for TL431ACDBVR to the Bill of Materials ........................................................................ 14
Added new row for HPA305 to the Bill of Materials ................................................................................. 14
SLVU314F – May 2009 – Revised March 2016
Submit Documentation Feedback
Revision History
Copyright © 2009–2016, Texas Instruments Incorporated
15
STANDARD TERMS AND CONDITIONS FOR EVALUATION MODULES
1.
Delivery: TI delivers TI evaluation boards, kits, or modules, including any accompanying demonstration software, components, or
documentation (collectively, an “EVM” or “EVMs”) to the User (“User”) in accordance with the terms and conditions set forth herein.
Acceptance of the EVM is expressly subject to the following terms and conditions.
1.1 EVMs are intended solely for product or software developers for use in a research and development setting to facilitate feasibility
evaluation, experimentation, or scientific analysis of TI semiconductors products. EVMs have no direct function and are not
finished products. EVMs shall not be directly or indirectly assembled as a part or subassembly in any finished product. For
clarification, any software or software tools provided with the EVM (“Software”) shall not be subject to the terms and conditions
set forth herein but rather shall be subject to the applicable terms and conditions that accompany such Software
1.2 EVMs are not intended for consumer or household use. EVMs may not be sold, sublicensed, leased, rented, loaned, assigned,
or otherwise distributed for commercial purposes by Users, in whole or in part, or used in any finished product or production
system.
2
Limited Warranty and Related Remedies/Disclaimers:
2.1 These terms and conditions do not apply to Software. The warranty, if any, for Software is covered in the applicable Software
License Agreement.
2.2 TI warrants that the TI EVM will conform to TI's published specifications for ninety (90) days after the date TI delivers such EVM
to User. Notwithstanding the foregoing, TI shall not be liable for any defects that are caused by neglect, misuse or mistreatment
by an entity other than TI, including improper installation or testing, or for any EVMs that have been altered or modified in any
way by an entity other than TI. Moreover, TI shall not be liable for any defects that result from User's design, specifications or
instructions for such EVMs. Testing and other quality control techniques are used to the extent TI deems necessary or as
mandated by government requirements. TI does not test all parameters of each EVM.
2.3 If any EVM fails to conform to the warranty set forth above, TI's sole liability shall be at its option to repair or replace such EVM,
or credit User's account for such EVM. TI's liability under this warranty shall be limited to EVMs that are returned during the
warranty period to the address designated by TI and that are determined by TI not to conform to such warranty. If TI elects to
repair or replace such EVM, TI shall have a reasonable time to repair such EVM or provide replacements. Repaired EVMs shall
be warranted for the remainder of the original warranty period. Replaced EVMs shall be warranted for a new full ninety (90) day
warranty period.
3
Regulatory Notices:
3.1 United States
3.1.1
Notice applicable to EVMs not FCC-Approved:
This kit is designed to allow product developers to evaluate electronic components, circuitry, or software associated with the kit
to determine whether to incorporate such items in a finished product and software developers to write software applications for
use with the end product. This kit is not a finished product and when assembled may not be resold or otherwise marketed unless
all required FCC equipment authorizations are first obtained. Operation is subject to the condition that this product not cause
harmful interference to licensed radio stations and that this product accept harmful interference. Unless the assembled kit is
designed to operate under part 15, part 18 or part 95 of this chapter, the operator of the kit must operate under the authority of
an FCC license holder or must secure an experimental authorization under part 5 of this chapter.
3.1.2
For EVMs annotated as FCC – FEDERAL COMMUNICATIONS COMMISSION Part 15 Compliant:
CAUTION
This device complies with part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not
cause harmful interference, and (2) this device must accept any interference received, including interference that may cause
undesired operation.
Changes or modifications not expressly approved by the party responsible for compliance could void the user's authority to
operate the equipment.
FCC Interference Statement for Class A EVM devices
NOTE: This equipment has been tested and found to comply with the limits for a Class A digital device, pursuant to part 15 of
the FCC Rules. These limits are designed to provide reasonable protection against harmful interference when the equipment is
operated in a commercial environment. This equipment generates, uses, and can radiate radio frequency energy and, if not
installed and used in accordance with the instruction manual, may cause harmful interference to radio communications.
Operation of this equipment in a residential area is likely to cause harmful interference in which case the user will be required to
correct the interference at his own expense.
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FCC Interference Statement for Class B EVM devices
NOTE: This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to part 15 of
the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential
installation. This equipment generates, uses and can radiate radio frequency energy and, if not installed and used in accordance
with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference
will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which
can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more
of the following measures:
•
•
•
•
Reorient or relocate the receiving antenna.
Increase the separation between the equipment and receiver.
Connect the equipment into an outlet on a circuit different from that to which the receiver is connected.
Consult the dealer or an experienced radio/TV technician for help.
3.2 Canada
3.2.1
For EVMs issued with an Industry Canada Certificate of Conformance to RSS-210
Concerning EVMs Including Radio Transmitters:
This device complies with Industry Canada license-exempt RSS standard(s). Operation is subject to the following two conditions:
(1) this device may not cause interference, and (2) this device must accept any interference, including interference that may
cause undesired operation of the device.
Concernant les EVMs avec appareils radio:
Le présent appareil est conforme aux CNR d'Industrie Canada applicables aux appareils radio exempts de licence. L'exploitation
est autorisée aux deux conditions suivantes: (1) l'appareil ne doit pas produire de brouillage, et (2) l'utilisateur de l'appareil doit
accepter tout brouillage radioélectrique subi, même si le brouillage est susceptible d'en compromettre le fonctionnement.
Concerning EVMs Including Detachable Antennas:
Under Industry Canada regulations, this radio transmitter may only operate using an antenna of a type and maximum (or lesser)
gain approved for the transmitter by Industry Canada. To reduce potential radio interference to other users, the antenna type
and its gain should be so chosen that the equivalent isotropically radiated power (e.i.r.p.) is not more than that necessary for
successful communication. This radio transmitter has been approved by Industry Canada to operate with the antenna types
listed in the user guide with the maximum permissible gain and required antenna impedance for each antenna type indicated.
Antenna types not included in this list, having a gain greater than the maximum gain indicated for that type, are strictly prohibited
for use with this device.
Concernant les EVMs avec antennes détachables
Conformément à la réglementation d'Industrie Canada, le présent émetteur radio peut fonctionner avec une antenne d'un type et
d'un gain maximal (ou inférieur) approuvé pour l'émetteur par Industrie Canada. Dans le but de réduire les risques de brouillage
radioélectrique à l'intention des autres utilisateurs, il faut choisir le type d'antenne et son gain de sorte que la puissance isotrope
rayonnée équivalente (p.i.r.e.) ne dépasse pas l'intensité nécessaire à l'établissement d'une communication satisfaisante. Le
présent émetteur radio a été approuvé par Industrie Canada pour fonctionner avec les types d'antenne énumérés dans le
manuel d’usage et ayant un gain admissible maximal et l'impédance requise pour chaque type d'antenne. Les types d'antenne
non inclus dans cette liste, ou dont le gain est supérieur au gain maximal indiqué, sont strictement interdits pour l'exploitation de
l'émetteur
3.3 Japan
3.3.1
Notice for EVMs delivered in Japan: Please see http://www.tij.co.jp/lsds/ti_ja/general/eStore/notice_01.page 日本国内に
輸入される評価用キット、ボードについては、次のところをご覧ください。
http://www.tij.co.jp/lsds/ti_ja/general/eStore/notice_01.page
3.3.2
Notice for Users of EVMs Considered “Radio Frequency Products” in Japan: EVMs entering Japan may not be certified
by TI as conforming to Technical Regulations of Radio Law of Japan.
If User uses EVMs in Japan, not certified to Technical Regulations of Radio Law of Japan, User is required by Radio Law of
Japan to follow the instructions below with respect to EVMs:
1.
2.
3.
Use EVMs in a shielded room or any other test facility as defined in the notification #173 issued by Ministry of Internal
Affairs and Communications on March 28, 2006, based on Sub-section 1.1 of Article 6 of the Ministry’s Rule for
Enforcement of Radio Law of Japan,
Use EVMs only after User obtains the license of Test Radio Station as provided in Radio Law of Japan with respect to
EVMs, or
Use of EVMs only after User obtains the Technical Regulations Conformity Certification as provided in Radio Law of Japan
with respect to EVMs. Also, do not transfer EVMs, unless User gives the same notice above to the transferee. Please note
that if User does not follow the instructions above, User will be subject to penalties of Radio Law of Japan.
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【無線電波を送信する製品の開発キットをお使いになる際の注意事項】 開発キットの中には技術基準適合証明を受けて
いないものがあります。 技術適合証明を受けていないもののご使用に際しては、電波法遵守のため、以下のいずれかの
措置を取っていただく必要がありますのでご注意ください。
1.
2.
3.
電波法施行規則第6条第1項第1号に基づく平成18年3月28日総務省告示第173号で定められた電波暗室等の試験設備でご使用
いただく。
実験局の免許を取得後ご使用いただく。
技術基準適合証明を取得後ご使用いただく。
なお、本製品は、上記の「ご使用にあたっての注意」を譲渡先、移転先に通知しない限り、譲渡、移転できないものとします。
上記を遵守頂けない場合は、電波法の罰則が適用される可能性があることをご留意ください。 日本テキサス・イ
ンスツルメンツ株式会社
東京都新宿区西新宿６丁目２４番１号
西新宿三井ビル
3.3.3
Notice for EVMs for Power Line Communication: Please see http://www.tij.co.jp/lsds/ti_ja/general/eStore/notice_02.page
電力線搬送波通信についての開発キットをお使いになる際の注意事項については、次のところをご覧くださ
い。http://www.tij.co.jp/lsds/ti_ja/general/eStore/notice_02.page
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4
EVM Use Restrictions and Warnings:
4.1 EVMS ARE NOT FOR USE IN FUNCTIONAL SAFETY AND/OR SAFETY CRITICAL EVALUATIONS, INCLUDING BUT NOT
LIMITED TO EVALUATIONS OF LIFE SUPPORT APPLICATIONS.
4.2 User must read and apply the user guide and other available documentation provided by TI regarding the EVM prior to handling
or using the EVM, including without limitation any warning or restriction notices. The notices contain important safety information
related to, for example, temperatures and voltages.
4.3 Safety-Related Warnings and Restrictions:
4.3.1
User shall operate the EVM within TI’s recommended specifications and environmental considerations stated in the user
guide, other available documentation provided by TI, and any other applicable requirements and employ reasonable and
customary safeguards. Exceeding the specified performance ratings and specifications (including but not limited to input
and output voltage, current, power, and environmental ranges) for the EVM may cause personal injury or death, or
property damage. If there are questions concerning performance ratings and specifications, User should contact a TI
field representative prior to connecting interface electronics including input power and intended loads. Any loads applied
outside of the specified output range may also result in unintended and/or inaccurate operation and/or possible
permanent damage to the EVM and/or interface electronics. Please consult the EVM user guide prior to connecting any
load to the EVM output. If there is uncertainty as to the load specification, please contact a TI field representative.
During normal operation, even with the inputs and outputs kept within the specified allowable ranges, some circuit
components may have elevated case temperatures. These components include but are not limited to linear regulators,
switching transistors, pass transistors, current sense resistors, and heat sinks, which can be identified using the
information in the associated documentation. When working with the EVM, please be aware that the EVM may become
very warm.
4.3.2
EVMs are intended solely for use by technically qualified, professional electronics experts who are familiar with the
dangers and application risks associated with handling electrical mechanical components, systems, and subsystems.
User assumes all responsibility and liability for proper and safe handling and use of the EVM by User or its employees,
affiliates, contractors or designees. User assumes all responsibility and liability to ensure that any interfaces (electronic
and/or mechanical) between the EVM and any human body are designed with suitable isolation and means to safely
limit accessible leakage currents to minimize the risk of electrical shock hazard. User assumes all responsibility and
liability for any improper or unsafe handling or use of the EVM by User or its employees, affiliates, contractors or
designees.
4.4 User assumes all responsibility and liability to determine whether the EVM is subject to any applicable international, federal,
state, or local laws and regulations related to User’s handling and use of the EVM and, if applicable, User assumes all
responsibility and liability for compliance in all respects with such laws and regulations. User assumes all responsibility and
liability for proper disposal and recycling of the EVM consistent with all applicable international, federal, state, and local
requirements.
5.
Accuracy of Information: To the extent TI provides information on the availability and function of EVMs, TI attempts to be as accurate
as possible. However, TI does not warrant the accuracy of EVM descriptions, EVM availability or other information on its websites as
accurate, complete, reliable, current, or error-free.
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6.
Disclaimers:
6.1 EXCEPT AS SET FORTH ABOVE, EVMS AND ANY WRITTEN DESIGN MATERIALS PROVIDED WITH THE EVM (AND THE
DESIGN OF THE EVM ITSELF) ARE PROVIDED "AS IS" AND "WITH ALL FAULTS." TI DISCLAIMS ALL OTHER
WARRANTIES, EXPRESS OR IMPLIED, REGARDING SUCH ITEMS, INCLUDING BUT NOT LIMITED TO ANY IMPLIED
WARRANTIES OF MERCHANTABILITY OR FITNESS FOR A PARTICULAR PURPOSE OR NON-INFRINGEMENT OF ANY
THIRD PARTY PATENTS, COPYRIGHTS, TRADE SECRETS OR OTHER INTELLECTUAL PROPERTY RIGHTS.
6.2 EXCEPT FOR THE LIMITED RIGHT TO USE THE EVM SET FORTH HEREIN, NOTHING IN THESE TERMS AND
CONDITIONS SHALL BE CONSTRUED AS GRANTING OR CONFERRING ANY RIGHTS BY LICENSE, PATENT, OR ANY
OTHER INDUSTRIAL OR INTELLECTUAL PROPERTY RIGHT OF TI, ITS SUPPLIERS/LICENSORS OR ANY OTHER THIRD
PARTY, TO USE THE EVM IN ANY FINISHED END-USER OR READY-TO-USE FINAL PRODUCT, OR FOR ANY
INVENTION, DISCOVERY OR IMPROVEMENT MADE, CONCEIVED OR ACQUIRED PRIOR TO OR AFTER DELIVERY OF
THE EVM.
7.
USER'S INDEMNITY OBLIGATIONS AND REPRESENTATIONS. USER WILL DEFEND, INDEMNIFY AND HOLD TI, ITS
LICENSORS AND THEIR REPRESENTATIVES HARMLESS FROM AND AGAINST ANY AND ALL CLAIMS, DAMAGES, LOSSES,
EXPENSES, COSTS AND LIABILITIES (COLLECTIVELY, "CLAIMS") ARISING OUT OF OR IN CONNECTION WITH ANY
HANDLING OR USE OF THE EVM THAT IS NOT IN ACCORDANCE WITH THESE TERMS AND CONDITIONS. THIS OBLIGATION
SHALL APPLY WHETHER CLAIMS ARISE UNDER STATUTE, REGULATION, OR THE LAW OF TORT, CONTRACT OR ANY
OTHER LEGAL THEORY, AND EVEN IF THE EVM FAILS TO PERFORM AS DESCRIBED OR EXPECTED.
8.
Limitations on Damages and Liability:
8.1 General Limitations. IN NO EVENT SHALL TI BE LIABLE FOR ANY SPECIAL, COLLATERAL, INDIRECT, PUNITIVE,
INCIDENTAL, CONSEQUENTIAL, OR EXEMPLARY DAMAGES IN CONNECTION WITH OR ARISING OUT OF THESE
TERMS ANDCONDITIONS OR THE USE OF THE EVMS PROVIDED HEREUNDER, REGARDLESS OF WHETHER TI HAS
BEEN ADVISED OF THE POSSIBILITY OF SUCH DAMAGES. EXCLUDED DAMAGES INCLUDE, BUT ARE NOT LIMITED
TO, COST OF REMOVAL OR REINSTALLATION, ANCILLARY COSTS TO THE PROCUREMENT OF SUBSTITUTE GOODS
OR SERVICES, RETESTING, OUTSIDE COMPUTER TIME, LABOR COSTS, LOSS OF GOODWILL, LOSS OF PROFITS,
LOSS OF SAVINGS, LOSS OF USE, LOSS OF DATA, OR BUSINESS INTERRUPTION. NO CLAIM, SUIT OR ACTION SHALL
BE BROUGHT AGAINST TI MORE THAN ONE YEAR AFTER THE RELATED CAUSE OF ACTION HAS OCCURRED.
8.2 Specific Limitations. IN NO EVENT SHALL TI'S AGGREGATE LIABILITY FROM ANY WARRANTY OR OTHER OBLIGATION
ARISING OUT OF OR IN CONNECTION WITH THESE TERMS AND CONDITIONS, OR ANY USE OF ANY TI EVM
PROVIDED HEREUNDER, EXCEED THE TOTAL AMOUNT PAID TO TI FOR THE PARTICULAR UNITS SOLD UNDER
THESE TERMS AND CONDITIONS WITH RESPECT TO WHICH LOSSES OR DAMAGES ARE CLAIMED. THE EXISTENCE
OF MORE THAN ONE CLAIM AGAINST THE PARTICULAR UNITS SOLD TO USER UNDER THESE TERMS AND
CONDITIONS SHALL NOT ENLARGE OR EXTEND THIS LIMIT.
9.
Return Policy. Except as otherwise provided, TI does not offer any refunds, returns, or exchanges. Furthermore, no return of EVM(s)
will be accepted if the package has been opened and no return of the EVM(s) will be accepted if they are damaged or otherwise not in
a resalable condition. If User feels it has been incorrectly charged for the EVM(s) it ordered or that delivery violates the applicable
order, User should contact TI. All refunds will be made in full within thirty (30) working days from the return of the components(s),
excluding any postage or packaging costs.
10. Governing Law: These terms and conditions shall be governed by and interpreted in accordance with the laws of the State of Texas,
without reference to conflict-of-laws principles. User agrees that non-exclusive jurisdiction for any dispute arising out of or relating to
these terms and conditions lies within courts located in the State of Texas and consents to venue in Dallas County, Texas.
Notwithstanding the foregoing, any judgment may be enforced in any United States or foreign court, and TI may seek injunctive relief
in any United States or foreign court.
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2015, Texas Instruments Incorporated
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IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other
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TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI’s terms
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TI assumes no liability for applications assistance or the design of Buyers’ products. Buyers are responsible for their products and
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TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or
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No TI components are authorized for use in FDA Class III (or similar life-critical medical equipment) unless authorized officers of the parties
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Products
Applications
Audio
www.ti.com/audio
Automotive and Transportation
www.ti.com/automotive
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