User's Guide
SLVUA27A – January 2014 – Revised March 2014
TPS23753AEVM-235 Evaluation Module
This user’s guide describes the TPS23753A evaluation module (EVM) (TPS23753AEVM-235). The
TPS23753AEVM-235 contains evaluation and reference circuitry for the TPS23753A device. The
TPS23753A device is an IEEE 802.3-2005 compliant, powered-device (PD) controller and power supply
controller optimized for isolated converter topologies. TPS23753AEVM-235 is targeted at a high efficiency
10-W PD solution.
1
2
3
4
5
6
7
8
Contents
Introduction ................................................................................................................... 2
1.1
Features .............................................................................................................. 2
1.2
Applications .......................................................................................................... 2
Electrical Specifications ..................................................................................................... 2
Description .................................................................................................................... 3
Schematic ..................................................................................................................... 4
General Configuration and Description ................................................................................... 5
5.1
Physical Access ..................................................................................................... 5
5.2
Test Setup ........................................................................................................... 5
TPS23753AEVM-235 Performance Data ................................................................................. 6
6.1
Startup................................................................................................................ 6
6.2
Transient Response ................................................................................................ 6
6.3
Efficiency ............................................................................................................. 7
EVM Assembly Drawings and Layout Guidelines ....................................................................... 8
7.1
PCB Drawings ....................................................................................................... 8
7.2
Layout Guidelines ................................................................................................. 11
7.3
EMI Containment .................................................................................................. 12
Bill of Materials ............................................................................................................. 13
List of Figures
1
TPS23753AEVM-235 Schematic .......................................................................................... 4
2
Typical TPS23753AEVM-235 Test Setup ................................................................................ 5
3
Startup Response to Full Load (2 A) for a 48-V Input .................................................................. 6
4
Transient Response from 1 to 2 A for a 48-V Input ..................................................................... 6
5
Efficiency of the TPS23753AEVM-235.................................................................................... 7
6
Top-Side Component Placement .......................................................................................... 8
7
Top-Side Routing ............................................................................................................ 8
8
Layer 2 Routing .............................................................................................................. 9
9
Layer 3 Routing .............................................................................................................. 9
10
Bottom-Side Routing ....................................................................................................... 10
11
Bottom Component Placement ........................................................................................... 10
List of Tables
1
TPS23753AEVM-235 Electrical and Performance Specifications at 25°C ........................................... 2
2
Connector Functionality ..................................................................................................... 5
3
Test Points .................................................................................................................... 5
4
TPS23753AEVM-235 BOM
..............................................................................................
SLVUA27A – January 2014 – Revised March 2014
Submit Documentation Feedback
TPS23753AEVM-235 Evaluation Module
Copyright © 2014, Texas Instruments Incorporated
13
1
Introduction
1
www.ti.com
Introduction
The TPS23753AEVM-235 allows reference circuitry evaluation of the TPS23753A device. It contains input
and output power connectors and an array of onboard test points for circuit evaluation.
1.1
Features
•
•
1.2
Applications
•
•
•
2
High-efficiency synchronous flyback converter
Class 3, 5-V 2-A 10-W DC output
Voice over internet protocol – IP telephones
Wireless LAN – wireless access points
Security – wired IP cameras
Electrical Specifications
Table 1. TPS23753AEVM-235 Electrical and Performance Specifications at 25°C
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
POWER INTERFACE
Input voltage
Applied to the power pins of connectors J2 or J4
0
57
Rising input voltage
Input UVLO, POE input J2
36
Falling input voltage
30
Detection voltage
At device terminals
3
Classification voltage
At device terminals
Classification current
RCLASS = 90.9 Ω
10
V
V
V
10
23
26.5
29.3
mA
V
Inrush current-limit
100
180
mA
Operating current-limit
405
505
mA
4.988
4.989
V
2
A
DC-TO-DC CONVERTER
Output voltage
VIN = 48 V, ILOAD ≤ ILOAD (max)
Output current
34 V ≤ VIN ≤ 57 V
Output ripple voltage peak-to-peak
VIN = 48 V, ILOAD = 2 A
52.5
VIN = 48 V, ILOAD= 500 mA
88.2
VIN = 48 V, ILOAD = 1 A
92.7
VIN = 48 V, ILOAD = 2 A
93.7
Efficiency, end-to-end
Switching frequency
2
250
TPS23753AEVM-235 Evaluation Module
mV
%
kHz
SLVUA27A – January 2014 – Revised March 2014
Submit Documentation Feedback
Copyright © 2014, Texas Instruments Incorporated
Description
www.ti.com
3
Description
The TPS23753AEVM-235 enables full evaluation of the TPS23753A device. Refer to the schematic shown
in Figure 1. Ethernet power is applied from J1 and is dropped to the bridge rectifier (D1, D2, D3, D4, Q1,
Q2, R1, R2, R3, R4, R5, R6, R7, R8). The Power over Ethernet (PoE) transformer needed to transfer
power or data is internal to J1. The internal RC circuits in J1 help balance the Ethernet cable impedance
and are critical for ESD and EMO or EMC performance. The EMI or EMC filter and transient protection for
the TPS23753A device are at the output of the diode bridge.
Input power can also be applied at J4 from a DC source when power at J1 is not present, or when the DCto-DC converter is being evaluated and not the PoE frontend.
The TPS23753A (U2) PD and DC-to-DC converter circuitry is shown in Figure 1. R15 provides the
detection signature and R25 provides the classification (class 3) signature. The switched side of the PD
controller is to the right of U2. The TPS23753A RTN pin provides inrush limited turn on and charge of the
bulk capacitor, C13.
The DC-to-DC converter is a high-efficiency synchronous flyback converter. The primary (Q4) switching
MOSFET is driven from U2 GATE pin. The secondary (Q3) switching MOSFET is driven from a drive
circuit (D9, D10, D11, R10) on T1.
Output voltage feedback is provided with U3 and associated error amplifier (U4) circuitry. R14 provides a
means for error injection to measure the frequency response of the converter. This feedback circuit drives
the U2 CTL pin, which provides a voltage proportional to the output load current. As the output load
current decreases, the CTL pin voltage decreases.
SLVUA27A – January 2014 – Revised March 2014
Submit Documentation Feedback
TPS23753AEVM-235 Evaluation Module
Copyright © 2014, Texas Instruments Incorporated
3
Schematic
4
www.ti.com
Schematic
J1
7499511611A
J2
11
J1
1
2
3
4
5
6
7
8
12
J2
10
J3
4
DATA
PORT
POE+
6
D5
7
1
ETHERNET
POWER
36-57VDC
13 W MAX
13
PR12
14
PR36
15
PR45
16
PR78
ORN
YEL
PR78
C2
330 pF
Q2-A
FDS89161
D6
4
C1
330 pF
D7
Q2-B
FDS89161
R8
R7 150 kΩ
150 kΩ
C4
330 pF
D8
4
C3
330 pF
1
POE–
17
19
18
20
22
21
GRN
D9
MBR0530
Additioinal EMI filtering may be required
3
L1
10 µH
FB1
6
D11
15 V
R10
10 Ω
D10
15 V
4
T1
NA6223-AL
1
C13
22 µF
100 V
2
C14
2.2 µF
100 V
+
C15
2.2 µF
100 V
C16
0.1 µF
100V
R13
39K
C18
1000 pF
100 V
FB2
D13
MMSD4148
R15
24.9 kΩ
POE–
R24
R20
R21
59 kΩ 80.6 kΩ 0
U2
TPS23753APW
1
C20
22 µF
BLNK
VB
2
16 V
APD
CS
3
11
CLS
VC
4
10
DEN
GATE
5
9
VDD
RTN
6
8
VDD1
FRS
13
12
VSS
7
250KHz
R25
90.9 Ω
C6
0.1 µF
100 V
5
10
R11
10 Ω
1
D12
MURA120
TP1
TP3
R16
20 Ω
0.1 W
2
C12
1000 pF
C7
100 µF
6.3 V
C8
100 µF
6.3 V
C10
1 µF
10 V
C9
100 µF
6.3 V
TP2
R17
681 Ω
R22
10 Ω
R18
10 kΩ
50V
3
50V
R23
10 kΩ
4
U3
TCMT1107
R27
0.5 Ω
0.25 W
VSS
R19
44.2 kΩ
C23
100 pF
D14
BAT54S
Q4
FDC86244
R26
1 kΩ
D15
SMAJ58A
TP4
R14
0
1 2 5 6
50 V
C24
1 µF
25 V
J3
50 V
C21
2200 pF
2 kV
C22
0.1 µF
5 V at 2 A
GND
1
C11
0.1 µF
50 V
C19
2200 pF
2 kV
+
CTL
14
1
J4
34-57VDC
RTN
3 2
2
5
7
100 V
Q3
CSD17527Q5A
4
POE+
C17
1000 pF
R4
R3 499 kΩ
499 kΩ
2
1
1
6
5
R6
R5 150 kΩ
150 kΩ
2
9
J8
Q1-B
FDS89161
3
8
R2
R1 499 kΩ
499 kΩ
7
8
7
8
Q1-A
FDS89161
1
J7
D4
B1100
PR45
2
J5
PR36
PR12
1
1
3
6
5
5
J4
D3
B1100
3
J6
D2
B1100
D1
B1100
C25
6800 pF
3
C26
1 µF
10 V
4
5
U1
TLV431AIDBVR
R28
14.3 kΩ
C5
0.047 µF
50 V
R9
681
R12
2 kΩ
1
Not Installed
Figure 1. TPS23753AEVM-235 Schematic
4
TPS23753AEVM-235 Evaluation Module
SLVUA27A – January 2014 – Revised March 2014
Submit Documentation Feedback
Copyright © 2014, Texas Instruments Incorporated
General Configuration and Description
www.ti.com
5
General Configuration and Description
5.1
Physical Access
Table 2 lists the EVM connector functionality. Table 3 describes the test point availability and jumper
functionality.
Table 2. Connector Functionality
Connector
Label
Description
J1
PWR+DATA
J2
DATA
Ethernet data passthrough; connect to downstream Ethernet device
J3
Output
Output connector to load
J4
DCDC Input
PoE input; connect to PSE power and data source
DC-to-DC converter input bypassing the PoE frontend; connect a 34-V to 57-V DC power
supply, if there is no J1 connection to power the converter
Table 3. Test Points
5.2
Test Point
Color
Label
TP3
RED
Output Load
Voltage taken directly at the load
Description
TP1
RED
Output Load
Voltage taken directly at the output capacitors
Test Setup
Figure 2 shows the typical test setup for the EVM.
Ethernet
Device
VOUT
J2
J3
TPS23753AEVM-235
PSE
Ethernet Cable
GND
J1
J4
+
t
DC Supply
(If No PSE)
Figure 2. Typical TPS23753AEVM-235 Test Setup
SLVUA27A – January 2014 – Revised March 2014
Submit Documentation Feedback
TPS23753AEVM-235 Evaluation Module
Copyright © 2014, Texas Instruments Incorporated
5
TPS23753AEVM-235 Performance Data
www.ti.com
6
TPS23753AEVM-235 Performance Data
6.1
Startup
Figure 3 shows the startup response of the TPS23753AEVM-235.
Figure 3. Startup Response to Full Load (2 A) for a 48-V Input
6.2
Transient Response
Figure 4 shows the transient response of the TPS23753AEVM-235.
Figure 4. Transient Response from 1 to 2 A for a 48-V Input
6
TPS23753AEVM-235 Evaluation Module
SLVUA27A – January 2014 – Revised March 2014
Submit Documentation Feedback
Copyright © 2014, Texas Instruments Incorporated
TPS23753AEVM-235 Performance Data
www.ti.com
6.3
Efficiency
Figure 5 shows the efficiency of the TPS23753AEVM-235.
100
Efficiency (%)
90
80
70
60
48 V at J1
48 V at J4
50
0.0
0.5
1.0
1.5
2.0
Iout (A)
C001
Figure 5. Efficiency of the TPS23753AEVM-235
SLVUA27A – January 2014 – Revised March 2014
Submit Documentation Feedback
TPS23753AEVM-235 Evaluation Module
Copyright © 2014, Texas Instruments Incorporated
7
EVM Assembly Drawings and Layout Guidelines
www.ti.com
7
EVM Assembly Drawings and Layout Guidelines
7.1
PCB Drawings
Figure 6 to Figure 11 show the component placement and layout of the TPS23753AEVM-235.
C22
C5
D15
R15
R21
R24
+
R25
J3
D5
TP3
R20
D4
U2
C6
D1
J2
D8
C24
1
FRONT
D6
D2
R12
R9
R22
D3
D7
C20
1
FB2
FB1
U3
C13
R11
TP4
C12
1
J1
Q3
C9
1
C8
C14
C15
D12
C7
C16
R13
L1
+
J4
T1
TP1
TP2
Figure 6. Top-Side Component Placement
Figure 7. Top-Side Routing
8
TPS23753AEVM-235 Evaluation Module
SLVUA27A – January 2014 – Revised March 2014
Submit Documentation Feedback
Copyright © 2014, Texas Instruments Incorporated
EVM Assembly Drawings and Layout Guidelines
www.ti.com
Figure 8. Layer 2 Routing
Figure 9. Layer 3 Routing
SLVUA27A – January 2014 – Revised March 2014
Submit Documentation Feedback
TPS23753AEVM-235 Evaluation Module
Copyright © 2014, Texas Instruments Incorporated
9
EVM Assembly Drawings and Layout Guidelines
www.ti.com
Figure 10. Bottom-Side Routing
R1
C4
R8
C1
R5
Q1
Q2
1
R2
R7
C3
R6
C2
R3
R18
D14
C17
R17
C26
R4
1
D9
D13
C19
Q4
1
C11
C10
R27
R19
D10
C21
R26
R14
D11
R28
R10
R23
C23
1
U1
C25
R16
C18
Figure 11. Bottom Component Placement
10
TPS23753AEVM-235 Evaluation Module
SLVUA27A – January 2014 – Revised March 2014
Submit Documentation Feedback
Copyright © 2014, Texas Instruments Incorporated
EVM Assembly Drawings and Layout Guidelines
www.ti.com
7.2
Layout Guidelines
The layout of the PoE frontend should follow power and EMI or ESD best-practice guidelines. A basic set
of recommendations includes:
• Parts placement must be driven by power flow in a point-to-point manner; RJ-45, Ethernet transformer,
diode bridges, TVS and 0.1-μF capacitor, and TPS23753A converter input bulk capacitor.
• Make all leads as short as possible with wide power traces and paired signal and return.
• No crossovers of signals from one part of the flow to another are allowed.
• Spacing consistent with safety standards like IEC60950 must be observed between the 48-V input
voltage rails and between the input and an isolated converter output.
• Place the TPS23753A over split, local ground planes referenced to VSS for the PoE input and to
COM/RTN for the converter. Whereas the PoE side may operate without a ground plane, the converter
side must have one. Do not place logic ground and power layers under the Ethernet input or the
converter primary side.
• Use large copper fills and traces on SMT power-dissipating devices, and use wide traces or overlay
copper fills in the power path.
The DC-to-DC converter layout benefits from basic rules such as:
• Pair signals to reduce emissions and noise, especially the paths that carry high-current pulses, which
include the power semiconductors and magnetics
• Minimize the trace length of high current power semiconductors and magnetic components
• Where possible, use vertical pairing
• Use the ground plane for the switching currents carefully
• Keep the high-current and high-voltage switching away from low-level sensing circuits including those
outside the power supply
• Proper spacing around the high-voltage sections of the converter
SLVUA27A – January 2014 – Revised March 2014
Submit Documentation Feedback
TPS23753AEVM-235 Evaluation Module
Copyright © 2014, Texas Instruments Incorporated
11
EVM Assembly Drawings and Layout Guidelines
7.3
EMI Containment
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
12
www.ti.com
Use compact loops for dv/dt and di/dt circuit paths (power loops and gate drives)
Use minimal, yet thermally adequate, copper areas for heat sinking of components tied to switching
nodes (minimize exposed radiating surface). Hide copper associated with switching nodes under
shielded magnetics, where possible.
Use copper ground planes (possible stitching) and top-layer copper floods (surround circuitry with
ground floods)
Use a 4-layer PCB, if economically feasible (for better grounding)
Minimize the amount of copper area associated with input traces (to minimize radiated pickup)
Heat sink the quiet side of components instead of the switching side, where possible (like the output
side of inductor)
Use Bob Smith terminations, Bob Smith EFT capacitor, and Bob Smith plane. Use Bob Smith plane as
a ground shield on input side of PCB (creating a phantom or literal earth ground)
Use LC filter at DC-to-DC input
Dampen high-frequency ringing on all switching nodes, if present (allow for possible snubbers)
Control rise times with gate-drive resistors and possibly snubbers
Switching frequency considerations
Use of EMI bridge capacitor across isolation boundary (isolated topologies)
Observe the polarity dot on inductors (embed noisy end)
Use of ferrite beads on input (allow for possible use of beads or 0-Ω resistors)
Maintain physical separation between input-related circuitry and power circuitry (use ferrite beads as
boundary line)
Balance efficiency versus acceptable noise margin
Possible use of common-mode inductors
Possible use of integrated RJ-45 jacks (shielded with internal transformer and Bob Smith terminations)
End-product enclosure considerations (shielding)
TPS23753AEVM-235 Evaluation Module
SLVUA27A – January 2014 – Revised March 2014
Submit Documentation Feedback
Copyright © 2014, Texas Instruments Incorporated
Bill of Materials
www.ti.com
8
Bill of Materials
Table 4. TPS23753AEVM-235 BOM (1) (2) (3)
(1)
(2)
(3)
COUNT
REFDES
2
FB1, FB2
1
C5
2
C11, C22
1
C12
2
VALUE
DESCRIPTION
SIZE
PART NUMBER
MFR
Bead, Ferrite, SMT, 600 Ohms, 2A
805
MPZ2012S601A
TDK
0.047uF
Capacitor, Ceramic, 50V, X7R, 10%
603
C1608X7R1H473K080AA
TDK
0.1uF
Capacitor, Ceramic, 50V, X7R, 10%
603
06035C104KAT2A
AVX
1000pF
Capacitor, Ceramic, 50V, C0G, 10%
603
C1608C0G1H102J080AA
TDK
C17, C18
1000pF
Capacitor, Ceramic, 100V, X7R, 10%
603
C1608X7R2A102K080AA
TDK
1
C23
100pF
Capacitor, Ceramic, 50V, C0G, 10%
603
C1608C0G1H101J080AA
TDK
2
C10, C26
1uF
Capacitor, Ceramic, 10V, X5R, 20%
603
C0603C105K8PACTU
Kemet
1
C1, C2,C3, C4
330pF
Capacitor, Ceramic, 50V, C0G, 10%
603
06035A331JAT2A
Farnell
1
C25
6800pF
Capacitor, Ceramic, 50V, X7R, 10%
603
C0603C682K5RACTU
Kemet
2
C6, C16
0.1uF
Capacitor, Ceramic, 100V, X7R, 10%
805
GRM188R72A104KA35D
Murata
1
C24
1uF
Capacitor, Ceramic, 25V, X7R, 10%
805
C1608X5R1E105K080AC
TDK
3
C7, C8, C9
100uF
Capacitor, Ceramic, 6.3V, 20%
1210
C3225X5R0J107M
TDK
2
C14, C15
2.2uF
Capacitor, Ceramic, 100V, X7R, 10%
1210
HMK325B7225KN-T
Taiyo Yuden
2
C19, 21
2200pF
Capacitor, Ceramic, 2KV, X7R, 20%
1812
C4532X7R3D222K130KA
TDK
1
C13
22uF
Capacitor, Aluminum, 100V, 20%
8x10.2mm
EEEFK2A220P
Panasonic
1
C20
22uF
Capacitor, Aluminum, 16V, ±20%
4x5.8mm
EEEFK1C220UR
Panasonic
1
J1
7499511611A
Connector, RJ45, PoE+ Enabled,
10/100/1000 BaseT
0.670 x 1.300
inch
7499511611A
WE
1
J2
55520252-4
Connector, Jack, Modular, 8 POS
0.705 x 0.820
5520252-4
AMP
1
D14
BAT54S
Diode, Dual Schottky, 200-mA, 30-V
BAT54S
Zetex
1
D13
MMSD4148
Diode, Switching, 100V, 200mA, 400mW,
SOD-123
MMSD4148G
On Semi
2
D10, D11
15V
Diode, Zener, 15V, 500mW
SOD123
MMSZ5245BT3G
On Semi
1
D12
MURA120
Rectifier, Ultrafast Power, 200V 1A
MURA120T3G
On Semi
1
D9
MBR0530
Diode, Schottky, 0.5A, 30V
SOD-123
MBR0530G
On Semi
4
D1, D2, D3, D4
B1100
Diode, Schottky, 1A, 100V
SMA
B1100-13-F
Diodes, Inc
0
D5, D6, D7, D8
DNP
Diode, Schottky, 1A, 100V
SMA
B1100-13-F
Diodes, Inc
1
D15
SMAJ58A
Diode, TVS, 58-V, 1W
SMA
SMAJ58A-13-F
Diodes Inc.
1
J4
PEC02SAAN
Header, Male 2-pin, 100mil spacing,
PEC02SAAN
Sullins
1
L1
10uH
Inductor, SMT, 1.25A, 200milliohm
LPS4018-103ML
Coilcraft
1
U3
TCMT1107
IC, Photocoupler, 3750VRMS, 80-160%
CTR
MF4
TCMT1107
Vishay
2
R14, R24
0
Resistor, Chip, 1/16W, 1%
603
ERJ-3GEY0R00V
Panasonic
SOT23
SMA
0.100 inch x 2
4x4mm
Alternative Part
Number
Alternative MFR
742792040
Wurth Electronics
74437324100
Wurth Electronics
These assemblies are ESD sensitive, ESD precautions shall be observed.
These assemblies must be clean and free from flux and all contaminants. Use of no clean flux is not acceptable.
These assemblies must comply with workmanship standards IPC-A-610 Class 2.
SLVUA27A – January 2014 – Revised March 2014
Submit Documentation Feedback
TPS23753AEVM-235 Evaluation Module
Copyright © 2014, Texas Instruments Incorporated
13
Bill of Materials
www.ti.com
Table 4. TPS23753AEVM-235 BOM (1) (2) (3) (continued)
COUNT
REFDES
2
R10, R22
10
2
R18, R23
10K
1
R28
4
R5, R6, R7, R8
1
14
VALUE
DESCRIPTION
SIZE
PART NUMBER
Resistor, Chip, 1/16W, 5%
603
CRCW060310R0JNEA
Vishay
Resistor, Chip, 1/16W, 1%
603
CRCW060310k0FKEA
Vishay
14.3K
Resistor, Chip, 1/16W,1%
603
CRCW060314K3FKEA
Vishay
150K
Resistor, Chip, 1/16W, 1%
603
CRCW0603150KFKEA
Vishay
R26
1K
Resistor, Chip, 1/16W, 1%
603
CRCW06031K00FKEA
Vishay
1
R15
24.9K
Resistor, Chip, 1/16W, 1%
603
CRCW060324K9FKEA
Vishay
1
R12
2K
Resistor, Chip, 1/16W, 1%
603
CRCW06032K00FKEA
Vishay
1
R19
44.2K
Resistor, Chip, 1/16W, 1%
603
CRCW060344K2FKEA
Vishay
4
R1, R2, R3, R4
499K
Resistor, Chip, 1/16W, 1%
603
CRCW0603499KFKEA
Vishay
1
R20
59K
Resistor, Chip, 1/16W,1%
603
CRCW060359K0FKEA
Vishay
2
R9, R17
681
Resistor, Chip, 1/16W, 1%
603
CRCW0603681RFKEA
Vishay
1
R21
80.6K
Resistor, Chip, 1/16W,1%
603
CRCW060380K6FKEA
Vishay
1
R25
90.9
Resistor, Chip, 1/16W,1%
603
CRCW060390R9FKEA
Vishay
1
R11
10
Resistor, Chip, 1/10W, 5%
805
CRCW080510R0JNEA
Vishay
1
R16
20
Resistor, Chip, 1/10W, 5%
805
CRCW080520R0JNEA
Vishay
1
R13
39K
Resistor, Chip, 1/10W, 5%
805
CRCW080539K0JNEA
Vishay
1
R27
0.5
Resistor, Chip, 1/4W, 1%
1206
CSR1206FKR500
Stackpole
1
J3
ED555/2DS
Terminal Block, 2-pin, 6-A, 3.5mm
ED555/2DS
OST
1
U1
TLV431AIDBVR
IC, Precision Adjustable Shunt Regulator
SOT23-5
TLV431AIDBVR
TI
2
TP1, TP3
5000
Test Point, Red, Thru Hole Color Keyed
0.100 x 0.100
inch
5000
Keystone
2
TP2, TP4
5001
Test Point, Black, Thru Hole Color Keyed
0.100 x 0.100
inch
5001
Keystone
1
U2
TPS23753APW
IC, IEEE 802.3af Integrated Primary Side
Controller
TSSOP14
TPS23753APW
TI
1
Q3
CSD17527Q5A
MOSFET, N-Chan, 30V, 65A, 11.8milliohm
SON5x6
CSD17527Q5A
TI
1
Q4
FDC86244
Trans, Nch, 150V, 2.3A, 144 milliohm
SuperSOT-6
FDC86244
Fairchild
2
Q1, Q2
FDS89161
MOSFET, Dual NChan 100V, 2.7A , 105
milliOhm
SO8
FDS89161
Fairchild
1
T1
NA6223-AL
Transformer, Flyback
12.7x17.75
mm
NA6223-AL
Coilcraft
1
--
PWR235
Any
PCB, 3.7 In x 1.6 In x 0.062 In
0.27 x 0.25
inch
TPS23753AEVM-235 Evaluation Module
MFR
Alternative Part
Number
750314433
Alternative MFR
Wurth Electronics
SLVUA27A – January 2014 – Revised March 2014
Submit Documentation Feedback
Copyright © 2014, Texas Instruments Incorporated
Revision History
www.ti.com
Revision History
Changes from Original (January 2014) to A Revision .................................................................................................... Page
•
Changed the Bill of Materials........................................................................................................... 13
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
SLVUA27A – January 2014 – Revised March 2014
Submit Documentation Feedback
Copyright © 2014, Texas Instruments Incorporated
Revision History
15
ADDITIONAL TERMS AND CONDITIONS, WARNINGS, RESTRICTIONS, AND DISCLAIMERS FOR
EVALUATION MODULES
Texas Instruments Incorporated (TI) markets, sells, and loans all evaluation boards, kits, and/or modules (EVMs) pursuant to, and user
expressly acknowledges, represents, and agrees, and takes sole responsibility and risk with respect to, the following:
1.
User agrees and acknowledges that EVMs are intended to be handled and used for feasibility evaluation only in laboratory and/or
development environments. Notwithstanding the foregoing, in certain instances, TI makes certain EVMs available to users that do not
handle and use EVMs solely for feasibility evaluation only in laboratory and/or development environments, but may use EVMs in a
hobbyist environment. All EVMs made available to hobbyist users are FCC certified, as applicable. Hobbyist users acknowledge, agree,
and shall comply with all applicable terms, conditions, warnings, and restrictions in this document and are subject to the disclaimer and
indemnity provisions included in this document.
2. Unless otherwise indicated, EVMs are not finished products and not intended for consumer use. EVMs are intended solely for use by
technically qualified electronics experts who are familiar with the dangers and application risks associated with handling electrical
mechanical components, systems, and subsystems.
3. User agrees that EVMs shall not be used as, or incorporated into, all or any part of a finished product.
4. User agrees and acknowledges that certain EVMs may not be designed or manufactured by TI.
5. User must read the user's guide and all other documentation accompanying EVMs, including without limitation any warning or
restriction notices, prior to handling and/or using EVMs. Such notices contain important safety information related to, for example,
temperatures and voltages. For additional information on TI's environmental and/or safety programs, please visit www.ti.com/esh or
contact TI.
6. User assumes all responsibility, obligation, and any corresponding liability for proper and safe handling and use of EVMs.
7. Should any EVM not meet the specifications indicated in the user’s guide or other documentation accompanying such EVM, the EVM
may be returned to TI within 30 days from the date of delivery for a full refund. THE FOREGOING LIMITED WARRANTY IS THE
EXCLUSIVE WARRANTY MADE BY TI TO USER AND IS IN LIEU OF ALL OTHER WARRANTIES, EXPRESSED, IMPLIED, OR
STATUTORY, INCLUDING ANY WARRANTY OF MERCHANTABILITY OR FITNESS FOR ANY PARTICULAR PURPOSE. TI SHALL
NOT BE LIABLE TO USER FOR ANY INDIRECT, SPECIAL, INCIDENTAL, OR CONSEQUENTIAL DAMAGES RELATED TO THE
HANDLING OR USE OF ANY EVM.
8. No license is granted under any patent right or other intellectual property right of TI covering or relating to any machine, process, or
combination in which EVMs might be or are used. TI currently deals with a variety of customers, and therefore TI’s arrangement with
the user is not exclusive. TI assumes no liability for applications assistance, customer product design, software performance, or
infringement of patents or services with respect to the handling or use of EVMs.
9. User assumes sole responsibility to determine whether EVMs may be subject to any applicable federal, state, or local laws and
regulatory requirements (including but not limited to U.S. Food and Drug Administration regulations, if applicable) related to its handling
and use of EVMs and, if applicable, compliance in all respects with such laws and regulations.
10. User has sole responsibility to ensure the safety of any activities to be conducted by it and its employees, affiliates, contractors or
designees, with respect to handling and using EVMs. Further, user is responsible to ensure that any interfaces (electronic and/or
mechanical) between EVMs and any human body are designed with suitable isolation and means to safely limit accessible leakage
currents to minimize the risk of electrical shock hazard.
11. User shall employ reasonable safeguards to ensure that user’s use of EVMs will not result in any property damage, injury or death,
even if EVMs should fail to perform as described or expected.
12. User shall be solely responsible for proper disposal and recycling of EVMs consistent with all applicable federal, state, and local
requirements.
Certain Instructions. User shall operate EVMs within TI’s recommended specifications and environmental considerations per the user’s
guide, accompanying documentation, and any other applicable requirements. Exceeding the specified ratings (including but not limited to
input and output voltage, current, power, and environmental ranges) for EVMs may cause property damage, personal injury or death. If
there are questions concerning these ratings, user should contact a TI field representative prior to connecting interface electronics including
input power and intended loads. Any loads applied outside of the specified output range may result in unintended and/or inaccurate
operation and/or possible permanent damage to the EVM and/or interface electronics. Please consult the applicable EVM user's guide prior
to connecting any load to the EVM output. If there is uncertainty as to the load specification, please contact a TI field representative. During
normal operation, some circuit components may have case temperatures greater than 60°C as long as the input and output are maintained
at a normal ambient operating temperature. These components include but are not limited to linear regulators, switching transistors, pass
transistors, and current sense resistors which can be identified using EVMs’ schematics located in the applicable EVM user's guide. When
placing measurement probes near EVMs during normal operation, please be aware that EVMs may become very warm. As with all
electronic evaluation tools, only qualified personnel knowledgeable in electronic measurement and diagnostics normally found in
development environments should use EVMs.
Agreement to Defend, Indemnify and Hold Harmless. User agrees to defend, indemnify, and hold TI, its directors, officers, employees,
agents, representatives, affiliates, licensors and their representatives harmless from and against any and all claims, damages, losses,
expenses, costs and liabilities (collectively, "Claims") arising out of, or in connection with, any handling and/or use of EVMs. User’s
indemnity shall apply whether Claims arise under law of tort or contract or any other legal theory, and even if EVMs fail to perform as
described or expected.
Safety-Critical or Life-Critical Applications. If user intends to use EVMs in evaluations of safety critical applications (such as life support),
and a failure of a TI product considered for purchase by user for use in user’s product would reasonably be expected to cause severe
personal injury or death such as devices which are classified as FDA Class III or similar classification, then user must specifically notify TI
of such intent and enter into a separate Assurance and Indemnity Agreement.
RADIO FREQUENCY REGULATORY COMPLIANCE INFORMATION FOR EVALUATION MODULES
Texas Instruments Incorporated (TI) evaluation boards, kits, and/or modules (EVMs) and/or accompanying hardware that is marketed, sold,
or loaned to users may or may not be subject to radio frequency regulations in specific countries.
General Statement for EVMs Not Including a Radio
For EVMs not including a radio and not subject to the U.S. Federal Communications Commission (FCC) or Industry Canada (IC)
regulations, TI intends EVMs to be used only for engineering development, demonstration, or evaluation purposes. EVMs are not finished
products typically fit for general consumer use. EVMs may nonetheless generate, use, or radiate radio frequency energy, but have not been
tested for compliance with the limits of computing devices pursuant to part 15 of FCC or the ICES-003 rules. Operation of such EVMs may
cause interference with radio communications, in which case the user at his own expense will be required to take whatever measures may
be required to correct this interference.
General Statement for EVMs including a radio
User Power/Frequency Use Obligations: For EVMs including a radio, the radio included in such EVMs is intended for development and/or
professional use only in legally allocated frequency and power limits. Any use of radio frequencies and/or power availability in such EVMs
and their development application(s) must comply with local laws governing radio spectrum allocation and power limits for such EVMs. It is
the user’s sole responsibility to only operate this radio in legally acceptable frequency space and within legally mandated power limitations.
Any exceptions to this are strictly prohibited and unauthorized by TI unless user has obtained appropriate experimental and/or development
licenses from local regulatory authorities, which is the sole responsibility of the user, including its acceptable authorization.
U.S. Federal Communications Commission Compliance
For EVMs Annotated as FCC – FEDERAL COMMUNICATIONS COMMISSION Part 15 Compliant
Caution
This device complies with part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not cause
harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation.
Changes or modifications could void the user's authority to operate the equipment.
FCC Interference Statement for Class A EVM devices
This equipment has been tested and found to comply with the limits for a Class A digital device, pursuant to part 15 of the FCC Rules.
These limits are designed to provide reasonable protection against harmful interference when the equipment is operated in a commercial
environment. This equipment generates, uses, and can radiate radio frequency energy and, if not installed and used in accordance with the
instruction manual, may cause harmful interference to radio communications. Operation of this equipment in a residential area is likely to
cause harmful interference in which case the user will be required to correct the interference at its own expense.
FCC Interference Statement for Class B EVM devices
This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to part 15 of the FCC Rules.
These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment
generates, uses and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause
harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If
this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and
on, the user is encouraged to try to correct the interference by one or more of the following measures:
• Reorient or relocate the receiving antenna.
• Increase the separation between the equipment and receiver.
• Connect the equipment into an outlet on a circuit different from that to which the receiver is connected.
• Consult the dealer or an experienced radio/TV technician for help.
Industry Canada Compliance (English)
For EVMs Annotated as IC – INDUSTRY CANADA Compliant:
This Class A or B digital apparatus complies with Canadian ICES-003.
Changes or modifications not expressly approved by the party responsible for compliance could void the user’s authority to operate the
equipment.
Concerning EVMs Including Radio Transmitters
This device complies with Industry Canada licence-exempt RSS standard(s). Operation is subject to the following two conditions: (1) this
device may not cause interference, and (2) this device must accept any interference, including interference that may cause undesired
operation of the device.
Concerning EVMs Including Detachable Antennas
Under Industry Canada regulations, this radio transmitter may only operate using an antenna of a type and maximum (or lesser) gain
approved for the transmitter by Industry Canada. To reduce potential radio interference to other users, the antenna type and its gain should
be so chosen that the equivalent isotropically radiated power (e.i.r.p.) is not more than that necessary for successful communication.
This radio transmitter has been approved by Industry Canada to operate with the antenna types listed in the user guide with the maximum
permissible gain and required antenna impedance for each antenna type indicated. Antenna types not included in this list, having a gain
greater than the maximum gain indicated for that type, are strictly prohibited for use with this device.
Canada Industry Canada Compliance (French)
Cet appareil numérique de la classe A ou B est conforme à la norme NMB-003 du Canada
Les changements ou les modifications pas expressément approuvés par la partie responsable de la conformité ont pu vider l’autorité de
l'utilisateur pour actionner l'équipement.
Concernant les EVMs avec appareils radio
Le présent appareil est conforme aux CNR d'Industrie Canada applicables aux appareils radio exempts de licence. L'exploitation est
autorisée aux deux conditions suivantes : (1) l'appareil ne doit pas produire de brouillage, et (2) l'utilisateur de l'appareil doit accepter tout
brouillage radioélectrique subi, même si le brouillage est susceptible d'en compromettre le fonctionnement.
Concernant les EVMs avec antennes détachables
Conformément à la réglementation d'Industrie Canada, le présent émetteur radio peut fonctionner avec une antenne d'un type et d'un gain
maximal (ou inférieur) approuvé pour l'émetteur par Industrie Canada. Dans le but de réduire les risques de brouillage radioélectrique à
l'intention des autres utilisateurs, il faut choisir le type d'antenne et son gain de sorte que la puissance isotrope rayonnée équivalente
(p.i.r.e.) ne dépasse pas l'intensité nécessaire à l'établissement d'une communication satisfaisante.
Le présent émetteur radio a été approuvé par Industrie Canada pour fonctionner avec les types d'antenne énumérés dans le manuel
d’usage et ayant un gain admissible maximal et l'impédance requise pour chaque type d'antenne. Les types d'antenne non inclus dans
cette liste, ou dont le gain est supérieur au gain maximal indiqué, sont strictement interdits pour l'exploitation de l'émetteur.
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2014, Texas Instruments Incorporated
spacer
Important Notice for Users of EVMs Considered “Radio Frequency Products” in Japan
EVMs entering Japan are NOT certified by TI as conforming to Technical Regulations of Radio Law of Japan.
If user uses EVMs in Japan, user is required by Radio Law of Japan to follow the instructions below with respect to EVMs:
1.
2.
3.
Use EVMs in a shielded room or any other test facility as defined in the notification #173 issued by Ministry of Internal Affairs and
Communications on March 28, 2006, based on Sub-section 1.1 of Article 6 of the Ministry’s Rule for Enforcement of Radio Law of
Japan,
Use EVMs only after user obtains the license of Test Radio Station as provided in Radio Law of Japan with respect to EVMs, or
Use of EVMs only after user obtains the Technical Regulations Conformity Certification as provided in Radio Law of Japan with respect
to EVMs. Also, do not transfer EVMs, unless user gives the same notice above to the transferee. Please note that if user does not
follow the instructions above, user will be subject to penalties of Radio Law of Japan.
http://www.tij.co.jp
【無線電波を送信する製品の開発キットをお使いになる際の注意事項】 本開発キットは技術基準適合証明を受けておりません。 本製品の
ご使用に際しては、電波法遵守のため、以下のいずれかの措置を取っていただく必要がありますのでご注意ください。
1.
2.
3.
電波法施行規則第6条第1項第1号に基づく平成18年3月28日総務省告示第173号で定められた電波暗室等の試験設備でご使用いただく。
実験局の免許を取得後ご使用いただく。
技術基準適合証明を取得後ご使用いただく。。
なお、本製品は、上記の「ご使用にあたっての注意」を譲渡先、移転先に通知しない限り、譲渡、移転できないものとします
上記を遵守頂けない場合は、電波法の罰則が適用される可能性があることをご留意ください。
日本テキサス・インスツルメンツ株式会社
東京都新宿区西新宿６丁目２４番１号
西新宿三井ビル
http://www.tij.co.jp
Texas Instruments Japan Limited
(address) 24-1, Nishi-Shinjuku 6 chome, Shinjuku-ku, Tokyo, Japan
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other
changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest
issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and
complete. All semiconductor products (also referred to herein as “components”) are sold subject to TI’s terms and conditions of sale
supplied at the time of order acknowledgment.
TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI’s terms
and conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessary
to support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarily
performed.
TI assumes no liability for applications assistance or the design of Buyers’ products. Buyers are responsible for their products and
applications using TI components. To minimize the risks associated with Buyers’ products and applications, Buyers should provide
adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or
other intellectual property right relating to any combination, machine, or process in which TI components or services are used. Information
published by TI regarding third-party products or services does not constitute a license to use such products or services or a warranty or
endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the
third party, or a license from TI under the patents or other intellectual property of TI.
Reproduction of significant portions of TI information in TI data books or data sheets is permissible only if reproduction is without alteration
and is accompanied by all associated warranties, conditions, limitations, and notices. TI is not responsible or liable for such altered
documentation. Information of third parties may be subject to additional restrictions.
Resale of TI components or services with statements different from or beyond the parameters stated by TI for that component or service
voids all express and any implied warranties for the associated TI component or service and is an unfair and deceptive business practice.
TI is not responsible or liable for any such statements.
Buyer acknowledges and agrees that it is solely responsible for compliance with all legal, regulatory and safety-related requirements
concerning its products, and any use of TI components in its applications, notwithstanding any applications-related information or support
that may be provided by TI. Buyer represents and agrees that it has all the necessary expertise to create and implement safeguards which
anticipate dangerous consequences of failures, monitor failures and their consequences, lessen the likelihood of failures that might cause
harm and take appropriate remedial actions. Buyer will fully indemnify TI and its representatives against any damages arising out of the use
of any TI components in safety-critical applications.
In some cases, TI components may be promoted specifically to facilitate safety-related applications. With such components, TI’s goal is to
help enable customers to design and create their own end-product solutions that meet applicable functional safety standards and
requirements. Nonetheless, such components are subject to these terms.
No TI components are authorized for use in FDA Class III (or similar life-critical medical equipment) unless authorized officers of the parties
have executed a special agreement specifically governing such use.
Only those TI components which TI has specifically designated as military grade or “enhanced plastic” are designed and intended for use in
military/aerospace applications or environments. Buyer acknowledges and agrees that any military or aerospace use of TI components
which have not been so designated is solely at the Buyer's risk, and that Buyer is solely responsible for compliance with all legal and
regulatory requirements in connection with such use.
TI has specifically designated certain components as meeting ISO/TS16949 requirements, mainly for automotive use. In any case of use of
non-designated products, TI will not be responsible for any failure to meet ISO/TS16949.
Products
Applications
Audio
www.ti.com/audio
Automotive and Transportation
www.ti.com/automotive
Amplifiers
amplifier.ti.com
Communications and Telecom
www.ti.com/communications
Data Converters
dataconverter.ti.com
Computers and Peripherals
www.ti.com/computers
DLP® Products
www.dlp.com
Consumer Electronics
www.ti.com/consumer-apps
DSP
dsp.ti.com
Energy and Lighting
www.ti.com/energy
Clocks and Timers
www.ti.com/clocks
Industrial
www.ti.com/industrial
Interface
interface.ti.com
Medical
www.ti.com/medical
Logic
logic.ti.com
Security
www.ti.com/security
Power Mgmt
power.ti.com
Space, Avionics and Defense
www.ti.com/space-avionics-defense
Microcontrollers
microcontroller.ti.com
Video and Imaging
www.ti.com/video
RFID
www.ti-rfid.com
OMAP Applications Processors
www.ti.com/omap
TI E2E Community
e2e.ti.com
Wireless Connectivity
www.ti.com/wirelessconnectivity
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2014, Texas Instruments Incorporated
工商网监
湘ICP备2023018690号
