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TPS23841PAPRG4

TPS23841PAPRG4

  • 厂商:

    BURR-BROWN(德州仪器)

  • 封装:

    TQFP64_EP

  • 描述:

    Power Over Ethernet Controller 4 Channel 802.3af (PoE) 64-HTQFP (10x10)

  • 数据手册
  • 价格&库存
TPS23841PAPRG4 数据手册
TPS23841 www.ti.com SLUS745A – NOVEMBER 2006 – REVISED MAY 2007 HIGH-POWER, WIDE VOLTAGE RANGE, QUAD-PORT ETHERNET POWER SOURCING EQUIPMENT MANAGER FEATURES APPLICATIONS • • • • • • • • • • • • • • • • • • • Quad-Port Power Management With Integrated Switches and Sense Resistors High Power PoE up to 25 W at PD Input Operating from a 53-V Minimum Input Power Rail Wide Range Single Supply: 21.5 V up to 57 V ICUT = 615 mA, ILIM = 650 mA Nominal IEEE 802.3af Compatible Individual Port 15-bit A/D Converters Auto, Semi-Auto and Power Management Modes Controlled Current Ramp Power-Up/Down for EMI Reduction Over-Temperature Protection DC Disconnect Detection, Supports AC Disconnect High-Speed 400-kHz I2C Interface Supports Legacy PD Detection PowerPAD™ Package Comprehensive Power Management Software Available for MPS430 Microcontroller Medical/Industrial Applications at 24 V High Power Ethernet Enterprise Switches SOHO Hubs, Ethernet Hubs Ethernet High Power Mid-Spans High Power PSE Injectors DESCRIPTION The TPS23841 is a high-power, wide voltage range, quad-port sourcing equipment manager. The TPS23841 can provide up to 570 mA per port over a wide temperature range (-40°C to +125°C). Each port may operate from 21.5 V up to 57 V. The integrated output eliminates two external components per port (MOSFET and sense resistor) and survives 100-V transients. Four individual 15-bit A/D converters are used to measure signature resistance, voltage, current and die temperature, resulting in a simple and robust PSE solution. The TPS23841 comes with a comprehensive software solution to meet the most demanding applications which can serve as a core for all PoE system designs. TYPICAL APPLICATION PSE D1 PD FB1 Z +55V F1 TX Up to 100m of CAT 5A RJ45 RJ45 3 3 6 6 TX VDD TPS2376-H Px C1 TPS23841 High-current PoE Xfmr High-current PoE Xfmr 1 1 DET CLASS RTN RX Nx VPOE RTN RETx SCL SDA_I SDA_O Z FB2 Optional MSP430 Micro 2 2 4 4 5 5 7 7 8 8 RX DC/DC Converter VSS Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. PowerPAD is a trademark of Texas Instruments. PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright © 2006–2007, Texas Instruments Incorporated TPS23841 www.ti.com SLUS745A – NOVEMBER 2006 – REVISED MAY 2007 DESCRIPTION (CONTINUED) The TPS23841 has three internal supply buses (10 V, 6.3 V and 3.3 V) generated from the 48-V input supply. These supplies are used to bias all internal digital and analog circuitry. Each supply has been brought out separately for proper bypassing to insure high performance. The digital supply (3.3 V) is available for powering external loads up to 2 mA. For more demanding loads it is highly recommended to use external buffers to prevent system degradation. When the TPS23841 is initially powered up an internal Power-on-Reset (POR) circuit resets all registers and sets all ports to the off state to ensure that the device is powered up in a known safe operating state. The TPS23841 has three modes of operation; auto mode (AM), semi-auto mode (SAM) and power management mode (PMM). • In auto mode the TPS23841 performs discovery, classification and delivery of power autonomously to a compliant PD without the need of a micro-controller. • In semi-auto mode the TPS23841 operates in auto mode but users can access the contents of all read status registers and A/D registers through the I2C serial interface. All write control registers are active except for D0 through D3 of port control register 1 (Address 0010) for limited port control. The semi-auto mode allows the TPS23841 to detect valid PD's without micro-controller intervention but adds a flexibility to perform power management activities. • Power management mode (with a micro-controller) allows users additional capabilities of discovering non-compliant (legacy) PDs, performing AC Disconnect and advanced power management system control that are based on real time port voltages and currents. All functions in this mode are programmed and controlled through read/write registers over the I2C interface. This allows users complete freedom in detecting and powering devices. A comprehensive software package is available that mates the power of the TPS23841 with the MSP430 micro-controller. TPS23841 integrated output stage provides port power and low-side control. The internal low-side circuitry is designed with internal current sensing so there are no external resistors required. The output design ensures the power switches operate in the fully enhanced mode for low power dissipation. The I2C interface allows easy application of opto-coupler circuitry to maintain Ethernet port isolation when a ground based micro-controller is required. The TPS23841 five address pins (A1–A5) allow the device to be addressed at one of 31 possible I2C addresses. Per-port write registers separately control each port state (discovery, classification, legacy, power up, etc) while the read registers contain status information of the entire process along with parametric values of discovery, classification, and real-time port operating current, voltage and die temperature. The proprietary 15-bit integrating A/D converter is designed to meet the harsh environment where the PSEPM resides. The converter is set for maximum rejection of power line noise allowing it to make accurate measurements of line currents during discovery, classification and power delivery for reliable power management decisions. The TPS23841 is available in either 64-pin PowerPAD™ down (PAP) or 64-pin PowerPAD up (PJD) packages. ORDERING INFORMATION (1) (2) 2 PACKAGED DEVICES (1) TEMPERATURE RANGE TA = TJ TQFP – 64 (PAP) (2) TQFP – 64 (PJD) (2) –40°C to 125°C TPS23841PAP TPS23841PJD The PAP and PJD packages are available taped and reeled. Add R suffix to device type (e.g.TPS23841PAPR) to order quantities of 1,000 devices per reel. PAP = PowerPad down, PJD = PowerPad up. Submit Documentation Feedback TPS23841 www.ti.com SLUS745A – NOVEMBER 2006 – REVISED MAY 2007 ABSOLUTE MAXIMUM RATINGS over operating free-air temperature range (unless otherwise noted) (1) (2) PARAMETER VALUE UNIT V10 current sourced 100 µA V3.3 current sourced 5 mA Applied voltage on CINT#, CT, RBIAS –0.5 to 10 Applied voltage on SCL, SDA_I, SDA_O, INTB, A1, A2, A3, A4, A5, MS, PORB, WD_DIS, ALT_A/B, AC_LO, AC_HI –0.5 to 6 V Applied voltage on V48, P#, N# –0.5 to 80 TJ Junction operating temperature –40 to 125 Tstg Storage temperature --55 to 150 –55 to 150 Tsol Lead temperature (soldering, 10 sec.) (1) (2) °C 260 Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. All voltages are with respect to GND. Currents are positive into, negative out of the specified terminal. Consult Packaging Section of the Data book for thermal limitations and considerations of packages. DISSIPATION RATINGS (1) (1) PACKAGE THERMAL RESISTANCE JUNCTION TO CASE θJC THERMAL RESISTANCE JUNCTION TO AMBIENT θJA PAP 0.38°C/W 21.47°C/W PJD 0.38°C/W 21.47°C/W Thermal Resistance measured using 2-oz copper trace and copper pad solder following layout recommendation in TI Publication PowerPAD Thermally Enhanced Package Technical Brief SLMA002. RECOMMENDED OPERATING CONDITIONS over operating free-air temperature range (unless otherwise noted) MIN NOM MAX VIN PARAMETER Input voltage, V48 pin 21.5 48 57 UNIT V TJ Junction temperature -40 125 °C ELECTRO STATIC DISCHARGE (ESD) PROTECTION MAX Human body model UNIT 1.5 CDM 1 Machine model kV 0.2 Submit Documentation Feedback 3 TPS23841 www.ti.com SLUS745A – NOVEMBER 2006 – REVISED MAY 2007 ELECTRICAL CHARACTERISTICS V48 = 48 V, RT = 124 kΩ, CT = 220 pF, CINT = 0.027 µF (low leakage), –40°C to 125°C and TA = TJ (unless otherwise noted) PARAMETER TEST CONDITIONS MIN TYP MAX 4 9 12 10 14 UNIT Power Supply V48 quiescent current Off mode (all ports) V48 quiescent current Powered mode (all ports) V10, internal analog supply ILOAD = 0 9.75 10.5 11.5 V3.3, internal digital supply ILOAD = 0 to 3 mA 3 3.3 3.7 V3.3 short circuit current V=0 3 V6.3, internal supply ILOAD = 0 5 6.3 7 V2.5, internal reference supply ILOAD = 0 2.46 2.5 2.54 VUVLO_R, V48 UVLO Input voltage rising 16.0 21.5 VUVLO_F, V48 UVLO Input voltage falling 14 21 VHYSUV, UVLO hysteresis 0.2 Internal POR time out(I2C) After all supplies are good I2C activity is valid Internal POR time out (Port) After all supplies are good Port active to I2C commands 12 1.0 mA V mA V 2.0 8 Clock Pulses 66000 Port Discovery Port off #P to #N input resistance 400 Discovery open circuit voltage 600 22 Discovery 1 voltage loop control 70 µA < IPORT < 3 mA Discovery 2 voltage loop control 70 µA < IPORT < 3 mA Discovery current limit P = N = 48 V Auto-mode discovery resistance acceptance Band 2.8 4.4 8.8 3 kΩ 30 4 V 10 5 19 26.5 Auto-mode discovery resistance low end rejection 0 15 Auto-mode discovery resistance high end rejection 33 Discovery1,2 A/D conversion scale factor 100 µA < IPORT < 3 mA Discovery1,2 A/D conversion time IPORT= 120 µA 5.30 6.10 mA kΩ 6.75 count/µA ms Port Classification Classification voltage loop control 100 µA < IPORT < 50 mA 15 17.5 20 Classification current limit P = N = 48 V 50 60 100 Class 0 to 1 detection threshold 5.5 6.5 7.5 Class 1 to 2 detection threshold 13 14.5 16 Class 2 to 3 detection threshold 21 23 25 Class 3 to 4 detection threshold 31 33 35 Class 4 to 0 detection threshold Classification A/D conversion scale factor Classification A/D conversion time 4 IPORT = 50 mA Submit Documentation Feedback 45 48 375 424 18 V mA 51 475 Count/m A 22 ms TPS23841 www.ti.com SLUS745A – NOVEMBER 2006 – REVISED MAY 2007 ELECTRICAL CHARACTERISTICS (continued) V48 = 48 V, RT = 124 kΩ, CT = 220 pF, CINT = 0.027 µF (low leakage), –40°C to 125°C and TA = TJ (unless otherwise noted) PARAMETER TEST CONDITIONS MIN TYP MAX UNIT Port Legacy Detection Legacy current limit P = N = 48 V Legacy voltage A/D conversion scale factor 100 mV < VPORT < 17.5 V Legacy A/D conversion time 0 V < VPORT < 15 V 2.6 3.5 4.3 1365 1400 1445 mA 18 22 ms Ω Count/V Port Powered Mode Port on resistance 20 mA < IPORT < 300 mA ICUT Over current threshold RBIAS = 124 kΩ, CT = 220 pF, ILIM Output current limit ILIM ICUT Threshold delta Disconnect timer current threshold TMPDO Disconnect detection time 1.3 1.8 570 615 665 600 650 700 2 RBIAS = 124 kΩ, CT = 220 pF ILOAD < current threshold, RBIAS = 124 kΩ, CT = 220 pF 70 7.5 300 10 400 Port output UV 42.0 42.7 44.0 Port output OV 54 55 56 TOVLD Over current time out RBIAS = 124 kΩ, CT = 220 pF 50 TLIM Short circuit time out RBIAS = 124 k., CT = 220 pF 50 Turn--off delay from UV/OV faults RBIAS = 124 k., CT = 220 pF, After port enabled and ramped up Port current A/D conversion scale factor 20 mA < IPORT < 56 V Port current A/D conversion time IPORT < 300 mA Port voltage A/D conversion scale factor mA ms V 75 75 ms 3 31 36.41 40 Count/m A 18 22 ms 335 353 370 Count/V 18 22 ms 45 V < VPORT < 56 V Port voltage A/D conversion time Port temperature A/D conversion (17500 - counts)/16 °C Port Disable Mode Port N voltage P = 48 V 47 V AC LO and AC HI Specification AC_LO, AC_HI – low output voltage 0 0.5 AC_LO – high output voltage 3.0 5.0 AC_HI – high output voltage 5.0 7.0 Submit Documentation Feedback V 5 TPS23841 www.ti.com SLUS745A – NOVEMBER 2006 – REVISED MAY 2007 ELECTRICAL CHARACTERISTICS (continued) V48 = 48 V, RT = 124 kΩ, CT = 220 pF, CINT = 0.027 µF (low leakage), –40°C to 125°C and TA = TJ (unless otherwise noted) PARAMETER Digital I2C TEST CONDITIONS MIN TYP MAX UNIT DC Specifications SCL, SDA_I, A1–A5 ,WD_DIS, ALTA/B, MS, PORB logic input threshold 1.5 SCL, SDA_I input hysteresis 250 MS, PORB input hysteresis 150 WD_DIS, ALTA/B, MS, PORB input pulldown resistance Input voltage 0.5 to 3 V V mV 50 kΩ 10 µA SDA_O logic high leakage Drain = 5 V 100 nA SDA_O logic low ISINK = 10 mA 200 mV INTB logic high leakage Drain = 6 V INTB logic low ISINK = 10 mA A1–A5 pull-down current 10 µA 200 mV Digital I2C Timing SCL clock frequency Pulse duration 0 SCL high 0.6 SCL low 1.3 Rise time, SCL to SDA kHz 0.300 Fall time, SCL to SDA 6 400 0.300 Setup time, SDA to SCL 0.250 Hold time, SCL to SDA 0.300 Bus free time between start and stop 1.3 Setup time, SCL to start condition 0.6 Hold time, start condition to SCL 0.6 Setup time, SCL to stop condition 0.6 Submit Documentation Feedback 0.900 µs TPS23841 www.ti.com SLUS745A – NOVEMBER 2006 – REVISED MAY 2007 TPS23841 SINGLE PORT BLOCK DIAGRAM Diff Amp (Fix Gain) UV/OV Comparators 600 kW Two 8 Bits Status Register Loop Cntri Amp Detect/Class Modes Two 8 Bits Status Register Auto Seq Logic Analog Control Circurty LCA Power Mode Thermal Detector A2D Registers Resistor Voltage Current & Die Temp Max I Thld OVI OVI Thld Submit Documentation Feedback 7 TPS23841 www.ti.com SLUS745A – NOVEMBER 2006 – REVISED MAY 2007 TERMINAL FUNCTIONS TERMINAL NAME NO. PAP I/O DESCRIPTION PJD POWER AND GROUND V48 60 5 I 48-V input to the device. This supply can have a range of 22 V to 57 V. This pin should be decoupled with a 0.1-µF capacitor from V48 to AG1 placed as close to the device as possible. V10 58 7 O 10-V analog supply. The 10-V reference is generated internally and connects to the main internal analog power bus. A 0.1-µF de-coupling capacitor should terminate as close to this node and the AG1 pin as possible. Do not use for an external supply. V6.3 59 6 O 6.3-V analog supply. A 0.1-µF de-coupling capacitor should terminate as close to this pin and the AG1 pin as possible. Do not use for an external supply. V3.3 24 41 O 3.3-V logic supply. The 3.3-V supply is generated internally and connects to the internal logic power bus. A 0.1-µìF de-coupling capacitor should terminate as close to this node and the DG pin as possible. This output can be used as a low current supply to external logic. V2.5 54 11 O 2.5-V reference supply. The V2.5 is generated internally and connects to the internal reference power bus. This pin should not be tied to any external supplies. A 0.1-µF de-coupling capacitor should terminate as close to this node and the RG pin as possible. Do not use for an external supply. AG1 57 8 Analog ground 1. This is the analog ground of the V6.3, V10 and V48 power systems. It should be GND externally tied to the common copper 48-V return plane. This pin should carry the low side of three de-coupling capacitors tied to V48, V10 and V6.3. AG2 61 4 Analog ground 2. This is the analog ground which ties to the substrate and ESD structures of the GND device. It should be externally tied to the common copper 48-V return plane. AG1 and AG2 must be tied together directly for the best noise immunity. DG 23 42 GND Digital ground. This pin connects to the internal logic ground bus. It should be externally tied to the common copper 48-V return plane. RG 56 9 GND Reference ground. This is a precision sense of the external ground plane. The integration capacitor (CINT) and the biasing resistor (RBIAS pin) should be tied to this ground. This ground should also be used to form a printed wiring board ground guard ring around the active node of the integration capacitor (CINT). It should tie to common copper 48-V return plane. PORT ANALOG SIGNAL 8 P1 7 58 I P2 10 55 I P3 39 26 I P4 42 23 I N1 6 59 I N2 11 54 I N3 38 27 I N4 43 22 I RET1 5 60 I RET2 12 53 I RET3 37 28 I RET4 44 21 I CINT1 4 61 I CINT2 13 52 I CINT3 36 29 I CINT4 45 20 I Port Positive. 48-V load sense pin. Terminal voltage is monitored and controlled differentially with respect to each Port N pin Optionally, if the application warrants, this high side path can be protected with the use of a self resetting poly fuse. Port negative. 48-V load return pin. The low side of the load is switched and protected by internal circuitry that will limit the current. 48 V return pin Integration capacitor. This capacitor is used for the ramp A/D converter signal integration. Connect A 0.027- µF capacitor from this pin to RG. To minimize errors use a polycarbonate, poly-polypropylene, polystyrene or teflon capacitor type to prevent leakage. Other types of capacitors can be used with increased conversion error. Submit Documentation Feedback TPS23841 www.ti.com SLUS745A – NOVEMBER 2006 – REVISED MAY 2007 TERMINAL FUNCTIONS (continued) TERMINAL NAME NO. PAP I/O DESCRIPTION PJD ANALOG SIGNALS This is a dual-purpose pin. When tied to an external capacitor this pin sets the internal clock. When the CT pin is grounded the SYN pin turns from a output to an input (see SYN pin description) CT 53 12 I The timing capacitor and the resistor on the RBIAS pin sets the internal clock frequency of the device. This internal clock is used for the internal state machine, integrating A/D counters, POR time out, faults and delay timers of each port. Using a 220-pF capacitor for CT and a 124-kΩ resistor for RBIAS sets the internal clock to 245 kHz and ensure IEEE 802.3af compliance along with maximizing the rejection of 60-Hz line frequency noise from A/D measurements. RBIAS 55 10 I Bias set resistor. This resistor sets all precision bias currents within the chip. This pin will regulate to 1.25V (V2.5/2) when a resistor is connected between RBIAS and RG. This voltage and RBIAS generate a current which is replicated and used throughout the chip. This resistor also works in conjunction with the capacitors on CT and CINT to set internal timing values. The RBIAS resistor should be connected RG. RBIAS is a high impedance input and care needs to be taken to avoid signal injection from the SYN pin or I2C signals. SYN 52 13 I/O This is a dual purpose pin. When the CT pin is connected to a timing capacitor this output pin is a 0v to 3.3V pulse of the internal clock which can be used to drive other TPS23841 SYN pins for elimination of a timing capacitor. When the CT pin is grounded this pin becomes an input pin that can be driven from a master TPS23841 or any other clock generator signal. AC_LO 51 14 O Totem-pole output pin for AC Disconnect excitation. AC_HI 50 15 O Totem-pole output pin for AC Disconnect excitation. DIGITAL SIGNALS SCL 25 40 I Serial clock input pin for the I2C interface. SDA_I 26 39 I Serial data input pin for the I2C interface. When tied to the SDA_O pin, this connection becomes the standard bi-directional serial data line (SDA) SDA_O 27 38 O Serial data open drain output for the I2C interface. When tied to the SDA_I pin, this connection becomes the standard bi-directional serial data line (SDA). This is a open drain output that can directly drive opto-coupler. WD_DIS 22 43 I The WD_DIS pin disables the watchdog timer function when connected to 3.3 V. The pin has internal 50-k. resistor to digital ground. The watchdog timer monitors the I2C clock pin (SCL) and the internal oscillator activity in power management mode and only the internal oscillator activity in auto mode. INTB 20 45 O This is an open-drain output that goes low if a fault condition occurs on any of the 4 ports. ALTA/B 21 44 I When this input is set to logic low there is no back-off time after a discovery failure. When this pin set to a logic high there is a back-off time (approximately 2 seconds) before initiating another discovery cycle. This pin has an internal 50-kΩ resistor pull-down to digital ground. A1 28 37 I A2 29 36 I A3 30 35 I A4 31 34 I A5 32 33 I MS PORB 63 62 2 3 Address 1 through 5 These are the I2C address select inputs. Select the appropriate binary address on these pins by connecting to the chip ground for a logic low or tying to the V3.3 pin for a logic high. Each address line has an internal current source pull-down to digital ground. I The MS pin selects either the auto mode (MS low) or the power management mode, PMM, (MS high). This pin can be held low for controller-less standalone applications. When MS is low and the POR timing cycle is complete the chip will sequentially Discover, Classify and Power on each port. When MS is set high the ports are controlled by register setting via the I2C bus. The MS pin has an internal 50-kΩ resistor pull-down to analog ground. I This pin can be used to override the internal POR. When held low, the I2C interface, all the state machines, and registers are held in reset. When all internal and external supplies are within specification, and this pin is set to a logic high level, the POR delay will begin. The I2C interface and registers will become active within 70µs of this event and communications to read or preset registers can begin. The reset delay for the remainder of the chip then extinguishes in 1 second. This pin has an internal 50-kΩ resistor pull-down to analog ground. Submit Documentation Feedback 9 TPS23841 www.ti.com SLUS745A – NOVEMBER 2006 – REVISED MAY 2007 CONNECTION DIAGRAM TPS23841 64 Pin Power Pad TQFP_PAP 10 (1) NIC = No internal connection. Pins are floating. (2) NIC pins can be tied to the ground plane for improved thermal characteristics and to prevent noise injection from unused pins. (3) NIC pins next to CINT pins should be tied to ground to prevent noise injection into A/D converter. Submit Documentation Feedback TPS23841 www.ti.com SLUS745A – NOVEMBER 2006 – REVISED MAY 2007 POWERPAD OUTLINE LASER MARKER PIN 1 IDENTIFIER TOP VIEW TPS23841 64 PIN POWER PAD UP TQFP - PJD (1) NIC = No internal connection. Pins are floating. (2) NIC pins can be tied to the ground plane for improved thermal characteristics and to prevent noise injection from unused pins. (3) NIC pins next to CINT pins should be tied to ground to prevent noise injection into A/D converter. Submit Documentation Feedback 11 TPS23841 www.ti.com SLUS745A – NOVEMBER 2006 – REVISED MAY 2007 AUTO MODE FUNCTIONAL DESCRIPTION Auto Mode Auto mode (AM, MS = 0) operation is the basic approach for applying power to IEEE compliant PD’s. When AM has been selected the TPS23841 automatically performs the following functions: • Discovery of IEEE 802.3af compliant powered devices (PD's) • Classification • Power delivery • Port over/under voltage detection, (if enabled, see Over/Under Voltage Fault section) • Port over current detection (570 mA < IPORT < 665 mA • Port maximum current limit (600 mA < IPORT < 700 mA) • DC Disconnect (5 mA < IPORT < 10 mA) • Thermal shutdown protection (TSD), (TJ > 150°C) • Internal oscillator watchdog In AM the contents of all read registers are available via the I2C interface. In addition all control registers except for the function bits can be written. This supports a semi-auto mode where the TPS23841 auto detects compliant PD's while a host can access the A/D registers and class information and then implement power management (including turning a port off, responding to faults, etc). The write registers that are still active in AM are: • All ports disable – Common Control register 0001b • Over/Under Voltage Faults – Common Control register 0001b • Software reset – Common Control register 0001b • Disconnect disable – Port Control 1 register 0010b • Discovery fault disable – Port Control 1 register 0010b • Port enable – Port Control 2 register 0011b For alternative B, semi-auto mode implementations which will manipulate the all ports disable or Port Enable bits, please contact the factory for additional application information. 12 Submit Documentation Feedback TPS23841 www.ti.com SLUS745A – NOVEMBER 2006 – REVISED MAY 2007 AUTO MODE FUNCTIONAL DESCRIPTION (continued) Auto Mode Functional Description Update Class Register PortPwr Update Reg OVI = Over Current Fault U/O V = Under or Over Voltage Fault TSD = Thermal Shutdown Fault TMPDO = PD Maintain Power Dropout Time Limit TED = Error Delay Timing A2D V/I Measurements 300 ms
TPS23841PAPRG4 价格&库存

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