TPS3514
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SLVS422C – JUNE 2002 – REVISED DECEMBER 2006
PC POWER-SUPPLY SUPERVISORS
FEATURES
•
•
•
•
•
•
•
•
•
•
•
DESCRIPTION
Over-Voltage Protection and
Lockout: 12V, 5V, and 3.3V Supplies
Over-Current Protection and
Lockout: 12V, 5V, and 3.3V Supplies
Under-Voltage Protection and
Lockout: 12V Supplies
Under-Voltage Detect: 5V and 3.3V Supplies
Fault-Protection Output with Open-Drain
Output Stage
Open-Drain, Power-Good Output Signal:
Monitors Power-Good Signal Input 3.3V and
5V Supplies
300ms Power-Good Delay
75ms Delay: 5V, 3.3V Power-Supply
Short-Circuit Turn-On Protection
2.3ms PSON Control To FPO Turn-Off Delay
38ms PSON Control Debounce
Wide Supply Voltage Range: 4.5V to 15V
The TPS3514 is a PC switching power-supply
system monitor with minimum external components.
It
provides
under-voltage
lockout
(UVLO),
over-voltage (OV), under-voltage (UV), over-current
(OC) protection circuits, power-good indicator, and
on/off control.
UVLO thresholds are 4.45V (on) and 3.65V (off).
Over-current protection (OCP) and over-voltage
protection (OVP) monitor 3.3V, 5V, and 12V
supplies. When an OC or OV condition is detected,
the power-good output (PGO) is asserted low and
the fault protection output (FPO) is latched high.
PSON from low-to-high resets the latch. The OCP
function will be enabled 75ms after PSON goes LOW
with PGI HIGH and a debounce of typically 38ms. A
built-in 2.3ms delay with 38ms debounce from PSON
to FPO output is enabled at turn-off.
An external resistor is connected between the RI pin
and the GND pin. This will program a precise I(REF)
for OCP function. The programmable I(REF) range is
from 12.5µA to 62.5µA. Three OCP comparators and
the I(REF) section are supplied by VS12. The current
draw from the VS12 pin is less than 1mA.
The power-good feature monitors PGI, the 3.3V and
5V supplies, and issues a power-good signal when
the output is ready.
The TPS3514 is characterized for operation from
–40°C to +85°C. The TPS3514 is available in DIP-14
and SO-14 packages.
IO
0.01Ω
12V
12V
0.01Ω
5V
5V
0.01Ω
3.3V
5V VSB
PG
From Transformer
R1Ω
R2Ω
3.3V
5V VSB
470kΩ
PGO
GND
VDD
FPO
System Side
1kΩ
TPS3514
PGI
VS5
PSON
VS33
IS12
VS12
Power Supply
Output Side
560Ω
820Ω
56kΩ
RI
IS33
NC
IS5
1.5kΩ
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
All trademarks are the property of their respective owners.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2002–2006, Texas Instruments Incorporated
TPS3514
www.ti.com
SLVS422C – JUNE 2002 – REVISED DECEMBER 2006
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be
more susceptible to damage because very small parametric changes could cause the device not to meet its published
specifications.
PACKAGE/ORDERING INFORMATION
PRODUCT
PACKAGE-LEAD
TPS3514
(1)
PACKAGE
DESIGNATOR
SO-14
D
DIP-14
N
(1)
SPECIFIED
TEMPERATURE
RANGE
PACKAGE
MARKING
ORDERING
NUMBER
TPS3514D
Rails, 50
40°C to +85°C
TPS3514
TPS3514DR
Tape and Reel, 2500
TPS3514N
Rails, 25
TRANSPORT
MEDIA, QUANTITY
For the most current package and ordering information see the Package Option Addendum at the end of this document, or see the TI
web site at www.ti.com.
ABSOLUTE MAXIMUM RATINGS
over operating free-air temperature range (unless otherwise noted) (1) (2)
UNIT
Supply Voltage, VDD
16V
Voltage on PSON, IS5, IS33, PGI
8V
Voltage on VS33, VS5
16V
Voltage on FPO
16V
Voltage on PGO
8V
All Other Pins
–0.3V to 16V
Continuous Total Power Dissipation
See Dissipation Ratings Table
Operating Free-Air Temperature Range, TA
–40°C to +85°C
Storage Temperature Range, Tstg
–65°C to +150°C
Soldering Temperature
(1)
(2)
2
260°C
Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating
Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
All voltage values are with respect to GND.
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SLVS422C – JUNE 2002 – REVISED DECEMBER 2006
RECOMMENDED OPERATING CONDITIONS
At specified temperature range.
PARAMETER
MIN
MAX
UNIT
4.5
15
V
PSON, VS5, VS33, IS5, IS33
7
V
VS12, IS12
15
V
VDD + 0.3V (max = 7V)
V
FPO
15
V
PGO
7
V
FPO
20
mA
PGO
10
mA
Supply Voltage
VDD
Inputs
VI
PGI
Outputs
VO
Sink Current
IO(SINK)
Supply Voltage Rising Time
OCP Reference Source
Operating Free-Air Temperature Range
(1)
tR (1)
1
I(REF)
12.5
62.5
µA
TA
–40
+85
°C
ms
VDD rising and falling slew rate must be less than 14V/ms.
DISSIPATION RATINGS TABLE
PACKAGE
TA≤ +25°C
POWER RATING
DERATING FACTOR
ABOVE TA = +25°C
TA = +70°C
POWER RATING
TA = +85°C
POWER RATING
D
956mW
7.65mW/°C
612mW
497mW
N
1512mW
12.1mW/°C
968mW
786mW
OVER-CURRENT PROTECTION
MAX OUTPUT CURRENT
(1)
OVER-CURRENT PROTECTION TRIP POINT
12V
6A
9.2A
5V
16A
24.6A
3.3V
9A
13.5A
(1)
Over-current protection trip point can be programmable.
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TPS3514
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SLVS422C – JUNE 2002 – REVISED DECEMBER 2006
ELECTRICAL CHARACTERISTICS
Limits apply over operating free-air temperature range, TA = –40°C to +85°C, unless otherwise noted.
TPS3514
PARAMETER
CONDITIONS
MIN
TYP
MAX
UNIT
VS33
3.7
3.9
4.1
V
VS5
5.7
6.1
6.5
V
VS12
13.2
13.8
14.4
V
7.6
8
8.4
OVER-VOLTAGE AND OVER-CURRENT PROTECTION
Over-Voltage Threshold
Ratio of Current Sense Sink
Current to Current Sense Setting
Pin (RI) Source Current, I(REF)
C
Leakage Current (FPO)
Low-Level Output Voltage (FPO)
µA
Ilkg
V(FPO) = 5V
5
VOL
I(SINK) = 20mA, VDD = 5V
0.7
V
Noise Deglitch Time (OVP)
Current Source Reference
Voltage
Resistor at RI = 30kΩ, 0.1%
Resistor
V(RI)
VDD = 5V
35
73
110
µs
VDD = 5V
1.1
1.15
1.2
V
4.45
V
UNDER-VOLTAGE LOCKOUT
Start Threshold Voltage
Minimum Operating Voltage After Start-Up
3.65
V
PGI AND PGO
Input Threshold
VIT(PGI)
0.9 x typ
1.15
1.01 x typ
V
VS33
2
2.2
2.4
V
VS5
3.3
3.5
3.7
V
VS12
8.5
9
9.5
V
5
mV
Under-Voltage Threshold
Input Offset Voltage for OCP Comparators
Leakage Current (PGO)
Low-Level Output Voltage (PGO)
Short-Circuit Protection Delay
Delay Time
llkg
PGO = 5V
5
µA
VOL
I(SINK) = 10mA, VDD = 4.5V
0.4
V
3.3V, 5V
49
75
114
ms
t(d)(1)
PGI to PGO
VDD = 5V
200
300
450
ms
PGI to FPO
VDD = 5V
3.2
4.8
7.2
ms
PGI to PGO
VDD = 5V
88
150
225
µs
12V UVP to FPO
VDD = 5V
88
150
225
µs
Noise Deglitch Time
PSON CONTROL
Input Pull-Up Current
II
PSON = 0V
µA
–120
High-Level Input Voltage
VIH
Low-Level Input Voltage
VIL
1.2
V
Debounce Time (PSON)
t(b)
VDD = 5V
24
38
50
ms
t(d)(2)
VDD = 5V
tb + 1.1
tb + 2.3
tb + 4
ms
1
mA
Delay Time (PSON to FPO)
2.4
V
TOTAL DEVICE
Supply Current
4
IDD
PSON = 5V
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TPS3514
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SLVS422C – JUNE 2002 – REVISED DECEMBER 2006
PIN CONFIGURATION
Top View
SO, DIP
PIN ASSIGNMENTS
PIN
NAME
FUNCTION
3
FPO
Inverted Fault Ptotection output. Open-drain output stage.
2
GND
Ground
5
IS12
12V Over-Current Protection Input
8
IS5
5V Over-Current Protection Input
9
IS33
3.3V Over-Current Protection Input
7
NC
No Internal Connection
1
PGI
Power-Good Input
14
PGO
Power-Good Output. Open-drain output stage.
4
PSON
On/Off Control Input
6
RI
13
VDD
10
VS12
12V Over-Voltage/Under-Voltage Protection Input
11
VS33
3.3V Over-Voltage/Under-Voltage Protection Input
12
VS5
5V Over-Voltage/Under-Voltage Protection Input
OCP Reference Source
Supply Voltage
FUNCTION TABLE (1)
(1)
(2)
(3)
PGI
PSON
UV CONDITION
3.3V/5V
OV CONDITIONS
UV CONDITION 12V
OC CONDITIONS
FPO (2)
PGO (3)
< 0.9V
L
No
No
No
L
L
< 0.9V
L
No
No
Yes
L
L
< 0.9V
L
No
Yes
No
H
L
< 0.9V
L
No
Yes
Yes
H
L
< 0.9V
L
Yes
No
No
L
L
< 0.9V
L
Yes
No
Yes
L
L
< 0.9V
L
Yes
Yes
No
H
L
< 0.9V
L
Yes
Yes
Yes
H
L
> 1.2V
L
No
No
No
L
H
> 1.2V
L
No
No
Yes
H
L
> 1.2V
L
No
Yes
No
H
L
> 1.2V
L
No
Yes
Yes
H
L
> 1.2V
L
Yes
No
No
H
L
> 1.2V
L
Yes
No
Yes
H
L
> 1.2V
L
Yes
Yes
No
H
L
> 1.2V
L
Yes
Yes
Yes
H
L
x
H
x
x
x
H
L
x = Don’t Care.
For FPO, L = Fault is not latched. H = Fault is latched.
For PGO, L = Fault. H = No Fault.
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TPS3514
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SLVS422C – JUNE 2002 – REVISED DECEMBER 2006
TIMING DIAGRAMS
VDD
(SB5V)
PSON
PFO
PGI
3.3V/5V
300ms
12V
2.3ms 300ms
38ms
38ms
PGO
PSON Off
PSON
On
PGO Off
300ms
OVP
Occurs
Figure 1. AC Turn-On and Over-Voltage Protect
VDD
PSON
FPO
PGI
3.3V/5V
12V
300ms
300ms
PGO
38ms
38ms
300ms
3.3V or 5V Drop
OCP Occurs
300ms
12V UVP
Occurs
Figure 2. Over-Current and Under-Voltage Detect/Protect
6
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TPS3514
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SLVS422C – JUNE 2002 – REVISED DECEMBER 2006
SCHEMATIC
VDD
VS12
12V OV
+
_
UVLO
POR
VS5
R
5V OV
FPO
+
_
S
73µ s
Debounce
VS33
2.3ms
Delay
VDD
38ms
Debounce
3.3V OV
+
_
PSON
3.3V UV
+
_
75ms
Delay
5V UV
VDD
+
_
PGO
PGI1
PGI
150µs
Debounce
+
_
300ms
Delay
12V UV
+
_
Band-Gap
Reference
1.153V
150µ s
Debounce
_
IS12
+
Iref x 8
I(REF) OCP Reference Source
_
IS5
RI
+
Iref x 8
_
IS33
+
Iref x 8
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TPS3514
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SLVS422C – JUNE 2002 – REVISED DECEMBER 2006
TYPICAL CHARACTERISTICS
TA = +25°C, unless otherwise noted.
8
SUPPLY CURRENT
vs
SUPPLY VOLTAGE
INPUT CURRENT (PSON)
vs
INPUT VOLTAGE (PSON)
LOW-LEVEL OUTPUT VOLTAGE (FPO)
vs
LOW-LEVEL OUTPUT CURRENT (FPO)
LOW-LEVEL OUTPUT VOLTAGE (FPO)
vs
LOW-LEVEL OUTPUT CURRENT (FPO)
LOW-LEVEL OUTPUT VOLTAGE (PGO)
vs
LOW-LEVEL OUTPUT CURRENT (PGO)
LOW-LEVEL OUTPUT VOLTAGE (PGO)
vs
LOW-LEVEL OUTPUT CURRENT (PGO)
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TPS3514
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SLVS422C – JUNE 2002 – REVISED DECEMBER 2006
TYPICAL CHARACTERISTICS (continued)
TA = +25°C, unless otherwise noted.
NORMALIZED SENSE THRESHOLD VOLTAGE
vs
FREE-AIR TEMPERATURE AT VDD
CURRENT RATIO
vs
FREE-AIR TEMPERATURE
DETAILED DESCRIPTION
Although there is no requirement to meet specific
timing parameters, the following signal timings are
recommended:
2ms ≤ t2 ≤ 20ms, 100ms < t3 < 2000ms, t4 >
1ms, t5 ≤ 10ms
Power-Good and Power-Good Delay
A PC power supply is commonly designed to provide
a power-good signal, which is defined by the
computer manufacturers. Power-Good Output (PGO)
is a power-good indicator and should be asserted
high by the PC power supply to indicate that the
5VDC and 3.3VDC outputs are above the
under-voltage threshold limit. At this time, the supply
should be able to provide enough power to assure
continuous operation within the specification.
Furthermore, motherboards should be designed to
comply with the above recommended timing. If
timings other than these are implemented or
required, this information should be clearly specified.
The TPS3514 family of power-supply supervisors
provides a PGO for the 3.3V and 5V supply voltage
rails and a separate Power-Good Input (PGI). An
internal timer is used to generate a 300ms
power-good delay.
Conversely, when either the 5VDC or the 3.3VDC
output voltages fall below the under-voltage
threshold, or when main power has been removed
for a sufficiently long time so that power-supply
operation is no longer assured, PGO should be
deasserted to a low state. The power-good, DC
enable (PSON), and the 5V/3.3V supply rails are
shown in Figure 3.
PSON
On
Off
75%
5V/3.3V
Output
10%
PGO
t5
t4
t3
t2
Figure 3. Timing of PSON and PGO
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TPS3514
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SLVS422C – JUNE 2002 – REVISED DECEMBER 2006
If the voltage signals at PGI, VS33, and VS5 rise
above the under-voltage threshold, the open-drain
PGO will go high after a delay of 300ms. When the
PGI voltage or any of the 3.3V/5V rail drops below
the under-voltage threshold, PGO will be disabled
immediately.
Power-Supply Remote On/Off (PSON) And
Fault Protect Output (FPO)
Since the latest personal computer generation
focuses on easy turn-on and power-saving functions,
the PC power supply will require two characteristics.
One is a DC power-supply remote on/off function;
the other is standby voltage to achieve very low
power consumption of the PC system. Thus,
requiring the main power supply to be shut down.
The power-supply remote on/off (PSON) is an
active-low signal that turns on all of the main power
rails including the 3.3V, 5V, –5V, and –12V power
rails. When this signal is held high by the PC
motherboard or left open-circuited, the signal of the
Fault Protect Output (FPO) also goes high. In this
condition, the main power rails should not deliver
current and should be held at 0V.
When the FPO signal is held high due to an
occurring fault condition, the fault status will be
latched and the outputs of the main power rails
should not deliver current and should be held at 0V.
Toggling PSON from low to high will reset the fault
protection latch. During this fault condition, only the
standby power is not affected.
When PSON goes from high to low or low to high,
the 38ms debounce block will prevent a glitch on the
input from disabling/enabling the FPO output. During
the HIGH to LOW transition, the under-voltage
function is disabled to prevent turn-on failure.
Power should be delivered to the rails only if the
PSON signal is held at ground potential, thus, FPO is
active low. The FPO pin can be connected to 5VDC
(or up to 15VDC) through a pull-up resistor.
Under-Voltage Protection (UVP)
The TPS3514 provides Under-Voltage Protection
(UVP) for the 12V rail and Under-Voltage Detect
(UVD) for the 3.3V and 5V rails. When an
under-voltage condition appears at the VS12 input
pin for more than 150µs, the FPO output goes high
and PGO goes low. Also, this fault condition will be
latched until PSON is toggled from low to high or VDD
is removed.
10
Over-Current Protection (OCP)
In bridge, or forward type, off-line switching power
supplies, usually designed for medium to large
power, the overload protection design needs to be
very precise. Most of these types of power supplies
sense the output current for an overload condition.
The trigger-point needs to be set higher than the
maximum load in order to prevent false turn-on.
The TPS3514 provides Over-Current Protection
(OCP) for the 3.3V, 5V, and 12V rails. When an
over-current condition appears at the OCP
comparator input pins for more than 73µs, the FPO
output goes high and PGO goes low. Also, this fault
condition will be latched until PSON is toggled from
low to high or VDD is removed.
The resistor connected between the RI pin and the
GND pin will create a precise I(REF) for the OCP
function. The formula for choosing the RI resistor is
V(RI)/I(REF). The I(REF) range is from 12.5µA to 62.5µA.
Three OCP comparators and the I(REF) section are
supplied through the V12 pin. Current drawn from
the VS12 pin is less than 1mA.
Following is an example on calculating OCP for the
12V rail:
RI = V(RI)/I(REF) = 1.15V/20µA = 56kΩ
I(REF) • C • R(IS12) = R(SENSE)⋅ I(OCP_TRIP)
I(OCP_TRIP) = 20µA • 8 • 560Ω/0.01Ω = 9.2A
C = Current Ratio (typically = 8)
Over-Voltage Protection (OVP)
The Over-Voltage Protection (OVP) of the TPS3514
monitors 3.3V, 5V, and 12V. When an over-voltage
condition appears at one of the 3.3V, 5V, or 12V
input pins for more than 73µs, the FPO output goes
high and PGO goes low. Also, this fault condition will
be latched until PSON is toggled from low-to-high or
VDD is removed.
During fault conditions, most power supplies have
the potential to deliver higher output voltages than
those normally specified or required. In unprotected
equipment, it is possible for output voltages to be
high enough to cause internal or external damage of
the system. To protect the system under these
abnormal conditions, it is common practice to provide
over-voltage protection within the power supply.
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PACKAGE OPTION ADDENDUM
www.ti.com
10-Dec-2020
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
(2)
Lead finish/
Ball material
MSL Peak Temp
Op Temp (°C)
Device Marking
(3)
(4/5)
(6)
TPS3514D
ACTIVE
SOIC
D
14
50
RoHS & Green
NIPDAU
Level-1-260C-UNLIM
-40 to 85
TPS3514D
TPS3514DR
ACTIVE
SOIC
D
14
2500
RoHS & Green
NIPDAU
Level-1-260C-UNLIM
-40 to 85
TPS3514D
TPS3514N
ACTIVE
PDIP
N
14
25
RoHS & Green
NIPDAU
N / A for Pkg Type
-40 to 85
TPS3514N
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of