TPS3705-30, TPS3705-33, TPS3705-50, TPS3707-30, TPS3707-50
TPS3705-30, TPS3705-33,
TPS3705-50,
TPS3707-30,
TPS3707-50
SLVS184F
– NOVEMBER 1998
– REVISED OCTOBER
2020
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SLVS184F – NOVEMBER 1998 – REVISED OCTOBER 2020
TPS370x-xx Processor Supervisory Circuits With Power-Fail
1 Features
3 Description
•
The TPS370x-xx family of microprocessor supplyvoltage supervisors provide circuit initialization and
timing supervision, primarily for DSP and processorbased systems.
•
•
•
•
•
•
•
Power-on reset generator with fixed delay time of
200 ms (no external capacitor needed)
Precision supply voltage monitor: 2.5 V, 3 V,
3.3 V, and 5 V
Pin-for-pin compatible with the MAX705 through
MAX708 Series
Integrated watchdog time (TPS3705-xx Only)
Voltage monitor for power-fail or low-battery
warning
Maximum supply current of 50 µA
8-Pin MSOP and 8-Pin SOIC packages
Temperature range: –40°C to 85°C
(–40°C to 125°C for TPS3705-33)
During power-on, RESET is asserted when the supply
voltage V DD becomes higher than 1.1 V. Thereafter,
the supply voltage supervisor monitors VDD and keeps
RESET active as long as V DD remains below the
threshold voltage VIT+. When the supply voltage drops
below the threshold voltage V IT–, the output becomes
active (low) again. No external components are
required. All the devices of this family have a fixedsense threshold voltage VIT– set by an internal voltage
divider.
2 Applications
•
•
•
•
•
•
•
•
The product spectrum is designed for supply voltages
of 2.5 V, 3 V, 3.3 V, and 5 V. The circuits are available
in either 8-pin MSOP or standard SOIC packages.
The TPS370x-xx devices are characterized for
operation over a temperature range of −40°C to 85°C.
Designs using DSPs, microcontrollers, or
microprocessors
Industrial equipment
Programmable controls
Automotive systems
Portable or battery powered equipment
Intelligent instruments
Wireless communication systems
Notebook or desktop computers
Device Information (1)
PART NUMBER
TPS3705-xx,
TPS3707-xx
(1)
PACKAGE
BODY SIZE (NOM)
MSOPPowerPAD™ (8)
3.00 mm × 3.00 mm
SOIC (8)
3.90 mm × 4.90 mm
For all available packages, see the orderable addendum at
the end of the data sheet.
12 V
5V
VDD
VDD
PFO
TPS3705−50
MR
RESET
MSP430P112
100 nF
RESET/NMI
910 kΩ
WDO
I/O
WDI
I/O
PFI
120 kΩ
GND
GND
Copyright © 2016, Texas Instruments Incorporated
Typical MSP430 Application
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
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© 2020 Texas
Instruments
Incorporated
intellectual
property
matters
and other important disclaimers. PRODUCTION DATA.
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SLVS184F – NOVEMBER 1998 – REVISED OCTOBER 2020
Table of Contents
1 Features............................................................................1
2 Applications..................................................................... 1
3 Description.......................................................................1
4 Revision History.............................................................. 2
5 Device Comparison Table...............................................3
6 Pin Configuration and Functions...................................4
6.1 Pin Functions.............................................................. 4
7 Specifications.................................................................. 5
7.1 Absolute Maximum Ratings........................................ 5
7.2 ESD Ratings............................................................... 5
7.3 Recommended Operating Conditions.........................5
7.4 Thermal Information....................................................6
7.5 Electrical Characteristics.............................................7
7.6 Electrical Characteristics for TPS3705-33 Only..........8
7.7 Timing Requirements.................................................. 8
7.8 Switching Characteristics............................................9
7.9 Dissipation Ratings..................................................... 9
7.10 Timing Diagram.......................................................10
7.11 Typical Characteristics.............................................11
8 Detailed Description......................................................16
8.1 Overview................................................................... 16
8.2 Functional Block Diagram......................................... 16
8.3 Feature Description...................................................16
8.4 Device Functional Modes..........................................17
9 Application and Implementation.................................. 18
9.1 Application Information............................................. 18
9.2 Typical Application.................................................... 18
10 Power Supply Recommendations..............................19
11 Layout........................................................................... 20
11.1 Layout Guidelines................................................... 20
11.2 Layout Example...................................................... 20
12 Device and Documentation Support..........................21
12.1 Receiving Notification of Documentation Updates..21
12.2 Support Resources................................................. 21
12.3 Trademarks............................................................. 21
12.4 Electrostatic Discharge Caution..............................21
12.5 Glossary..................................................................21
13 Mechanical, Packaging, and Orderable
Information.................................................................... 21
4 Revision History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
Changes from Revision E (July 2017) to Revision F (October 2020)
Page
• Updated the numbering format for tables, figures, and cross-references throughout the document..................1
• Updated Device Comparison Table by adding -40°C to 125°C for TPS3705-33D............................................. 3
• Updated Absolute Maximum Ratings table to include Operating Temperature of -40°C to 125°C for
TPS3705-33D..................................................................................................................................................... 5
• Added TPS3705-33 Electrical Table................................................................................................................... 8
• Added histograms............................................................................................................................................. 11
Changes from Revision D (May 2016) to Revision E (July 2017)
Page
• Updated package body sizes in the Device Information table............................................................................ 1
Changes from Revision C (December 2005) to Revision D (May 2016)
Page
• Added ESD Ratings table, Feature Description section, Device Functional Modes, Application and
Implementation section, Power Supply Recommendations section, Layout section, Device and
Documentation Support section, and Mechanical, Packaging, and Orderable Information section................... 1
2
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SLVS184F – NOVEMBER 1998 – REVISED OCTOBER 2020
5 Device Comparison Table
PACKAGED DEVICES
TA
–40°C to 85°C
–40°C to 125°C
THRESHOLD
VOLTAGE
SMALL OUTLINE (D)
POWER-PAD
µ-SMALL OUTLINE
(DGN)
2.63 V
TPS3705−30D
TPS3705−30DGN
TIAAT
TPS3705-30Y
4.55 V
TPS3705−50D
TPS3705−50DGN
TIAAV
TPS3705−50Y
2.25 V
TPS3707−25D
TPS3707−25DGN
TIAAW
TPS3707−25Y
2.63 V
TPS3707−30D
TPS3707−30DGN
TIAAX
TPS3707−30Y
2.93 V
TPS3707−33D
TPS3707−33DGN
TIAAY
TPS3707−33Y
4.55 V
TPS3707−50D
TPS3707−50DGN
TIAAZ
TPS3707−50Y
2.93 V
TPS3705−33D
TPS3705−33DGN
TIAAU
TPS3705−33Y
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MARKING DGN
PACKAGE
CHIP FORM (Y)
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SLVS184F – NOVEMBER 1998 – REVISED OCTOBER 2020
6 Pin Configuration and Functions
MR
1
8
WDO
MR
1
8
RESET
VDD
2
7
RESET
VDD
2
7
RESET
GND
3
6
WDI
GND
3
6
NC
PFI
4
5
PFO
PFI
4
5
PFO
Figure 6-1. TPS3705-xx D Package 8-Pin SOIC Top
View
Figure 6-2. TPS3707-xx D Package 8-Pin SOIC Top
View
RESET
1
8
WDI
RESET
1
8
NC
WDO
2
7
PFO
RESET
2
7
PFO
MR
3
6
PFI
MR
3
6
PFI
VDD
4
5
GND
VDD
4
5
GND
Figure 6-3. TPS3705-xx DGN Package 8-Pin MSOP- Figure 6-4. TPS3707-xx DGN Package 8-Pin MSOPPowerPAD Top View
PowerPAD Top View
6.1 Pin Functions
PIN
NAME
4
TPS3705-xx
SOIC
TPS3707-xx
MSOP-PowerPAD
I/O
SOIC
MSOP-PowerPAD
GND
3
5
3
5
—
MR
1
3
1
3
I
DESCRIPTION
Ground
Manual reset
NC
—
—
6
8
—
PFI
4
6
4
6
I
Power-fail comparator input
PFO
5
7
5
7
O
Power-fail comparator output
RESET
7
1
7
1
O
Active-low reset output
RESET
—
—
8
2
O
Active-high reset output
VDD
2
4
2
4
—
Supply voltage
WDI
6
8
—
—
I
Watchdog timer input
WDO
8
2
—
—
O
Watchdog timer output
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SLVS184F – NOVEMBER 1998 – REVISED OCTOBER 2020
7 Specifications
7.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted)(1)
MIN
Supply voltage, VDD (2)
MAX
UNIT
7
V
PFI voltage range, VPFI
–0.3
VDD + 0.3
V
All other pins(2)
–0.3
7
V
Maximum low output current, IOL
5
mA
Maximum high output current, IOH
–5
mA
Input clamp current, IIK (VI < 0 or VI > VDD)
±20
mA
Output clamp current, IOK (VO < 0 or VO > VDD)
±20
mA
Continuous total power dissipation
See Section 7.9
Soldering temperature
260
°C
Operating temperature, TA
–40
85
°C
Operating temperature, TA for TPS3705-33 only
–40
125
°C
Storage temperature, Tstg
–65
150
°C
(1)
(2)
Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under
Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device
reliability.
All voltage values are with respect to GND. For reliable operation the device must not be operated at 7 V for more than t = 1000h
continuously.
7.2 ESD Ratings
VALUE
V(ESD)
(1)
(2)
Electrostatic discharge
Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1)
±2000
Charged-device model (CDM), per JEDEC specification JESD22-C101(2)
±500
UNIT
V
JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
7.3 Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted)
MIN
VDD
Supply voltage
VI
Input voltage
VIH
High-level input voltage
VIL
Low-level input voltage
Δt/ΔV
Input transition rise and fall rate at MR or WDI
TA
Operating free-air temperature
TA
Operating free-air temperature for TPS3705-33 only
Copyright © 2020 Texas Instruments Incorporated
NOM
MAX
UNIT
2
6
V
0
VDD + 0.3
V
0.7 × VDD
V
0.3 × VDD
V
100
ns/V
–40
85
°C
–40
125
°C
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SLVS184F – NOVEMBER 1998 – REVISED OCTOBER 2020
7.4 Thermal Information
THERMAL
TPS3705-xx
TPS3707-xx
D (SOIC)
DGN (MSOP-PowerPAD)
8 PINS
8 PINS
UNIT
RθJA
Junction-to-ambient thermal resistance
118.2
66.1
°C/W
RθJC(top)
Junction-to-case (top) thermal resistance
64.4
62.6
°C/W
RθJB
Junction-to-board thermal resistance
58.5
45.1
°C/W
ψJT
Junction-to-top characterization parameter
15.8
7.6
°C/W
ψJB
Junction-to-board characterization parameter
57.9
44.8
°C/W
RθJC(bot)
Junction-to-case (bottom) thermal resistance
—
18.5
°C/W
(1)
6
METRIC(1)
For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report.
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SLVS184F – NOVEMBER 1998 – REVISED OCTOBER 2020
7.5 Electrical Characteristics
over operating free-air temperature range (unless otherwise noted)
PARAMETER
TEST CONDITIONS
TPS370x-xx, VDD = 1.1 V, IOH = –4 μA
VOH
VOL
High-level output voltage
Low-level output voltage
Power-up reset
VIT–
voltage(1)
Negative-going input
threshold voltage(2)
Negative-going input
threshold voltage, PFI(2)
Vhys
Hysteresis, VDD
Hysteresis, PFI
MIN
TYP
MAX
0.8
TPS3707-25, TPS370x-30, TPS370x-33,
VDD = VIT+ + 0.2 V, IOH = –500 μA
0.7 × VDD
TPS370x-50, VDD = VIT+ + 0.2 V, IOH = –800 μA
VDD – 1.5
TPS370x-xx, VDD = 6 V, IOH = –800 μA
VDD – 1.5
V
TPS3707-25, TPS370x-30, TPS370x-33,
VDD = VIT+ + 0.2 V, IOL = 1 mA
0.3
TPS370x-50, VDD = VIT+ + 0.2 V, IOL = 2.5 mA
0.4
TPS370x-xx, VDD = 6 V, IOL = 3 mA
0.4
VDD ≥ 1.1 V, IOL = 50 μA
0.3
TPS3707-25, TA = 0°C to 85°C
2.2
TPS370x-30, TA = 0°C to 85°C
2.57
2.63
2.68
TPS370x-33, TA = 0°C to 85°C
2.87
2.93
2.98
TPS370x-50, TA = 0°C to 85°C
2.25
4.45
4.55
4.63
2.2
2.25
2.32
TPS370x-30, TA = –40°C to 85°C
2.57
2.63
2.7
TPS370x-33, TA = –40°C to 85°C
2.87
2.93
3
TPS370x-50, TA = –40°C to 85°C
4.45
4.55
4.65
1.2
1.25
1.3
TPS3707-25
40
TPS370x-30
50
TPS370x-33
50
TPS370x-50
70
TPS370x-xx
10
V
V
2.3
TPS3707-25, TA = –40°C to 85°C
TPS370x-xx, VDD ≥ 2 V, TA = –40°C to 85°C
UNIT
V
mV
IIH(AV) Average high-level input current, WDI
WDI = VDD = 6 V, time average (dc = 88%)
100
150
µA
IIL(AV)
WDI = 0 V, VDD = 6 V, time average (dc = 12%)
–15
–20
µA
IIH
IIL
II
IDD
Ci
(1)
(2)
Average low-level input current, WDI
High-level input current, WDI
WDI = VDD = 6 V
120
170
High-level input current, MR
MR = 0.7 × VDD, VDD = 6 V
–130
–180
Low-level input current, WDI
WDI = 0 V, VDD = 6 V
–120
–170
Low-level input current, MR
MR = 0 V, VDD = 6 V
–430
–600
Input current, PFI
VDD = 6 V, 0 V ≤ VI ≤ VDD
0
1
TPS3705-xx, VDD = 2 V to 6 V, MR = VDD,
MR, WDI and outputs unconnected
30
50
TPS3707-xx, VDD = 2 V to 6 V, MR = VDD,
MR, WDI and outputs unconnected
20
50
Supply current
Input capacitance
–1
µA
µA
µA
µA
VI = 0 V to VDD
5
pF
The lowest supply voltage at which RESET becomes active, tr,VDD ≥ 15 µs/V
To ensure best stability of the threshold voltage, a bypass capacitor (ceramic, 0.1 µF) should be placed near to the supply terminals
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7.6 Electrical Characteristics for TPS3705-33 Only
over operating free-air temperature range -40 to 125C (unless otherwise noted)
PARAMETER
TEST CONDITIONS
VDD = 1.1 V, IOH = –4 μA
VOH
VOL
VIT–
Vhys
High-level output voltage
MIN
TYP
MAX
0.8
VDD = VIT+ + 0.2 V, IOH = –500 μA
0.7 × VDD
VDD = 6 V, IOH = –800 μA
VDD – 1.5
V
VDD = VIT+ + 0.2 V, IOL = 1 mA
0.3
VDD = 6 V, IOL = 3 mA
0.4
Power-up reset voltage(1)
VDD ≥ 1.1 V, IOL = 50 μA
0.3
Negative-going input
threshold voltag
TA = 0°C to 125°C
2.87
2.93
3
TA = –40°C to 125°C
2.87
2.93
3.02
Negative-going input
threshold voltage, PFI(2)
VDD ≥ 2 V
1.2
1.25
1.3
Low-level output voltage
UNIT
Hysteresis, VDD
50
Hysteresis, PFI
10
V
V
V
mV
IIH(AV) Average high-level input current, WDI
WDI = VDD = 6 V, time average (dc = 88%)
100
150
µA
IIL(AV)
Average low-level input current, WDI
WDI = 0 V, VDD = 6 V, time average (dc = 12%)
–15
–20
µA
High-level input current, WDI
WDI = VDD = 6 V
120
170
High-level input current, MR
MR = 0.7 × VDD, VDD = 6 V
–130
–180
Low-level input current, WDI
WDI = 0 V, VDD = 6 V
–120
–170
Low-level input current, MR
MR = 0 V, VDD = 6 V
–430
–600
II
Input current, PFI
VDD = 6 V, 0 V ≤ VI ≤ VDD
0
1
µA
IDD
Supply current
VDD = 2 V to 6 V, MR = VDD,
MR, WDI and outputs unconnected
30
50
µA
Ci
Input capacitance
VI = 0 V to VDD
IIH
IIL
–1
5
µA
µA
pF
7.7 Timing Requirements
at RL = 1 MΩ, CL = 50 pF, TA = 25°C (unless otherwise noted)
PARAMETER
tw
8
Pulse width
TEST CONDITIONS
MIN
At VDD, VDD = VIT+ + 0.2 V, VDD = VIT– – 0.2 V
6
µs
100
ns
At MR and WDI, VDD ≥ VIT+ + 0.2 V, VIL = 0.3 × VDD, VIH = 0.7 × VDD
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MAX
UNIT
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SLVS184F – NOVEMBER 1998 – REVISED OCTOBER 2020
7.8 Switching Characteristics
at RL = 1 MΩ, CL = 50 pF, TA = 25°C (unless otherwise noted)
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
tt(out)
Watchdog time out
VDD ≥ VIT+ + 0.2 V, see Figure 7-1
1.1
1.6
2.3
s
td
Delay time
VDD ≥ VIT+ + 0.2 V, see Figure 7-1
140
200
280
ms
tPHL
Propagation (delay) time,
high-to-low-level output
MR to RESET delay, VDD ≥ VIT+ + 0.2 V,
VIL = 0.3 × VDD, VIH = 0.7 × VDD
50
250
ns
tPLH
Propagation (delay) time,
low-to-high-level output
MR to RESET delay (TPS3707-xx only)
VDD ≥ VIT+ + 0.2 V, VIL = 0.3 × VDD, VIH = 0.7 × VDD
50
250
ns
tPHL
Propagation (delay) time,
high-to-low-level output
VDD to RESET delay
3
5
µs
tPLH
Propagation (delay) time,
low-to-high-level output
VDD to RESET delay (TPS3707-xx only)
3
5
µs
tPHL
Propagation (delay) time,
high-to-low-level output
PFI to PFO delay, VDD = 2 V to 6 V
0.5
1
µs
tPLH
Propagation (delay) time,
low-to-high-level output
PFI to PFO delay, VDD = 2 V to 6 V
0.5
1
µs
7.9 Dissipation Ratings
TA < 25°C
POWER RATING
DERATING FACTOR
ABOVE TA = 25°C
DGN
2.14 W
17.1 mW/°C
1.37 W
1.11 W
D
725 mW
5.8 mW/°C
464 mW
377 mW
PACKAGE
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TA = 70°C
POWER RATING
TA = 85°C
POWER RATING
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7.10 Timing Diagram
VDD
5V
4.5 V
1.1 V
0V
t
MR
5V
4.5 V
1.1 V
0V
RESET
t
td
td
td
5V
4.5 V
1.1 V
0V
t
Undefined Behavior
Don’t Care
1.1 V
Don’t Care
5V
4.5 V
Don’t Care
WDI
0V
WDO
t
t t(out)
5V
4.5 V
1.1 V
0V
t
Figure 7-1. Timing Diagrams
10
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SLVS184F – NOVEMBER 1998 – REVISED OCTOBER 2020
50
1.002
VDD = 6 V
PFI = 1.05 V
MR = Open
1.001
1
TPS3707−50
10
−10
−30
0.999
−40
−15
10
35
60
TA − Free-Air Temperature − °C
−50
−0.5
85
2.5
4.5
3.5
5.5
6.5
Figure 7-3. Supply Current vs Supply Voltage
100
10
tw − Minimum Pulse Duration at VDD − µ s
VDD = 6 V
PFI = 1.05 V
0
−100
−200
−300
−40°C
−400
85°C
−500
PFI = 1.05 V
MR = Open
8
6
4
2
0
−1
0
1
2
3
4
5
6
0
VI − Input Voltage at MR − V
200
400
800
600
1000
VDD − Threshold Overdrive − mV
Figure 7-4. Input Current vs Input Voltage at MR
Figure 7-5. Minimum Pulse Duration at VDD vs VDD Threshold
Overdrive
6.5
3.5
VDD = 3.2 V
PFI = 1.05 V
MR = Open
3
2.5
2
1.5
−40°C
1
85°C
0.5
VDD = 6 V
PFI = 1.05 V
MR = Open
6
VOH − High-Level Output Voltage − V
VOH − High-Level Output Voltage − V
1.5
0.5
VDD − Supply Voltage − V
Figure 7-2. Normalized Input Threshold Voltage vs Free-Air
Temperature at VDD
I I − Input Current − µ A
PFI = 1.05 V
MR = Open
TA = 25°C
30
I DD − Supply Current − µ A
Normalized Input Threshold Voltage VIT(TA), VIT (25 °C )
7.11 Typical Characteristics
5.5
5
4.5
4
3.5
−40°C
3
85°C
2.5
2
1.5
1
0.5
0
0
0
−1
−2
−3
−4
−5
−6
−7
−8
−9 −10
IOH − High-Level Output Current − mA
Figure 7-6. High-Level Output Voltage vs High-Level Output
Current
Copyright © 2020 Texas Instruments Incorporated
0
−5
−10
−15
−20
−25
−30
IOH − High-Level Output Current − mA
Figure 7-7. High-Level Output Voltage vs High-Level Output
Current
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SLVS184F – NOVEMBER 1998 – REVISED OCTOBER 2020
7.11 Typical Characteristics (continued)
VOL − Low-Level Output Voltage − V
3
VDD = 2.67 V
PFI = 1.05 V
MR = Open
2.5
2
1.5
85°C
−40°C
1
0.5
0
0
1
2
3
4
5
6
7
8
9
10 11 12 13
IOL − Low-Level Output Current − mA
12
Figure 7-8. Low-Level Output Voltage vs Low-Level Output
Current
Figure 7-9. Watchdog Timeout Histogram for TSP3705-33
Devices at -40°C (Unit Count = 20)
Figure 7-10. Watchdog Timeout Histogram for TSP3705-33
Devices at 25°C (Unit Count = 20)
Figure 7-11. Watchdog Timeout Histogram for TSP3705-33
Devices at 125°C (Unit Count = 20)
Figure 7-12. Reset Delay Histogram for TPS3705-33 Devices at
-40°C (Unit Count = 20)
Figure 7-13. Reset Delay Histogram for TPS3705-33 Devices at
25°C (Unit Count = 20)
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SLVS184F – NOVEMBER 1998 – REVISED OCTOBER 2020
7.11 Typical Characteristics (continued)
Figure 7-14. Reset Delay Histogram for TPS3705-33 Devices at
125°C (Unit Count = 20)
Figure 7-15. MR to RESET (tPHL) Delay Histogram for
TPS3705-33 Devices at -40°C (Unit Count = 20)
Figure 7-16. MR to RESET (tPHL) Delay Histogram for
TPS3705-33 Devices at 25°C (Unit Count = 20)
Figure 7-17. MR to RESET (tPHL) Delay Histogram for
TPS3705-33 Devices at 125°C (Unit Count = 20)
Figure 7-18. VDD to RESET (tPHL) Delay Histogram for
TPS3705-33 Devices at -40°C (Unit Count = 20)
Figure 7-19. VDD to RESET (tPHL) Delay Histogram for
TPS3705-33 Devices at 25°C (Unit Count = 20)
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SLVS184F – NOVEMBER 1998 – REVISED OCTOBER 2020
7.11 Typical Characteristics (continued)
14
Figure 7-20. VDD to RESET (tPHL) Delay Histogram for
TPS3705-33 Devices at 125°C (Unit Count = 20)
Figure 7-21. PFI to PFO (tPHL) Delay Histogram for TPS3705-33
Devices at -40°C (Unit Count = 20)
Figure 7-22. PFI to PFO (tPHL) Delay Histogram for TPS3705-33
Devices at 25°C (Unit Count = 20)
Figure 7-23. PFI to PFO (tPHL) Delay Histogram for TPS3705-33
Devices at 125°C (Unit Count = 20)
Figure 7-24. PFI to PFO (tPLH) Delay Histogram for TPS3705-33
Devices at -40°C (Unit Count = 20)
Figure 7-25. PFI to PFO (tPLH) Delay Histogram for TPS3705-33
Devices at 25°C (Unit Count = 20)
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SLVS184F – NOVEMBER 1998 – REVISED OCTOBER 2020
7.11 Typical Characteristics (continued)
Figure 7-26. PFI to PFO (tPLH) Delay Histogram for TPS3705-33 Devices at 125°C (Unit Count = 20)
Copyright © 2020 Texas Instruments Incorporated
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8 Detailed Description
8.1 Overview
The TPS370x-xx family of supervisors feature an integrated reference and comparator for V DD supervision, an
additional power-fail supervisor, and a manual reset input. The TPS3705-xx devices feature a watchdog timer,
where the TPS3707-xx devices feature a complimentary RESET output.
8.2 Functional Block Diagram
TPS3705
TPS3707
VDD
14 kΩ
MR
Reset
Logic + Timer
R1
+
_
RESET
RESET
Only
TPS3707
R2
GND
Oscillator
Reference
Voltage
of 1.25 V
_
WDI
Only
TPS3705
PFO
+
PFI
Transition
Detection
40 kΩ
Watchdog
Logic + Timer
WDO
Only
TPS3705
Copyright © 2016, Texas Instruments Incorporated
8.3 Feature Description
8.3.1 Manual Reset Input
The TPS370x-xx devices incorporate a manual reset input, MR. A low level at MR causes RESET to become
active.
8.3.2 Power-Fail Comparator
The TPS370x-xx family integrates a power-fail comparator which can be used for low-battery detection, powerfail warning, or for monitoring a power supply other than the main supply.
8.3.3 Watchdog Timer
The TPS3705-xx devices have a watchdog timer that is periodically triggered by a positive or negative transition
at WDI. When the supervising system fails to retrigger the watchdog circuit within the timeout interval,
t t(out) = 1.6 s, WDO becomes active. This event also reinitializes the watchdog timer. Leaving WDI unconnected
disables the watchdog.
The TPS3707-xx devices do not have the watchdog function, but include a high-level output RESET.
16
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SLVS184F – NOVEMBER 1998 – REVISED OCTOBER 2020
8.4 Device Functional Modes
8.4.1 VDD < 1.1 V
When VDD is less than 1.1 V, the status of the outputs cannot be determined.
8.4.2 1.1 V < VDD ≤ 2 V
When V DD is greater than 1.1 V but less than 2 V, the output states are valid. However, the specifications in
Section 7.5 do not apply.
8.4.3 2 V < VDD < 6 V
When VDD is greater than 2 V but less than 6 V, the device is within the recommended operating conditions (see
Section 7.3). See Table 8-1, Table 8-2, and Table 8-3 for corresponding truth tables.
Table 8-1. TPS3705 Truth Table
MR
VDD > VIT
RESET
TYPICAL DELAY
H→L
1
H→L
30 ns
L→H
1
L→H
200 ms
H
1→0
H→L
3 µs
H
0→1
L→H
200 ms
Table 8-2. TPS3707 Truth Table
MR
VDD > VIT
RESET
RESET
TYPICAL DELAY
H→L
1
H→L
L→H
30 ns
L→H
1
L→H
H→L
200 ms
H
1→0
H→L
L→H
3 µs
H
0→1
L→H
H→L
200 ms
Table 8-3. TPS370x Truth Table
PFI > VIT
PFO
TYPICAL DELAY
0→1
L→H
0.5 µs
1→0
H→L
0.5 µs
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9 Application and Implementation
Note
Information in the following applications sections is not part of the TI component specification, and TI
does not warrant its accuracy or completeness. TI’s customers are responsible for determining
suitability of components for their purposes. Customers should validate and test their design
implementation to confirm system functionality.
9.1 Application Information
The TPS370x-xx family of devices offers several options for power monitoring. The TPS3705-xx offers a
watchdog supervisor, V DD rail monitoring, and a power-fail interrupt monitor. The TPS3707-xx offers V DD rail
monitoring with complimentary outputs and a power-fail interrupt monitor.
9.2 Typical Application
12 V
5V
VDD
VDD
PFO
TPS3705−50
MR
MSP430P112
100 nF
RESET
RESET/NMI
910 kΩ
WDO
I/O
WDI
I/O
PFI
120 kΩ
GND
GND
Copyright © 2016, Texas Instruments Incorporated
Figure 9-1. Typical MSP430 Application
9.2.1 Design Requirements
Table 9-1 lists the required design parameters for Figure 9-1.
Table 9-1. Application Parameters
DESIGN PARAMETER
VALUE
Monitored voltage 1
5V
Monitored voltage 2
12 V
9.2.2 Detailed Design Procedure
To create two voltage monitoring rails, the PFI input can be used along with the MR pin to create a single output.
The 5-V monitor is created by selecting a 5-V device option, giving threshold of 4.55 V. The PFI input is
configured to any adjustable rail with a voltage divider. Use Equation 1 to select resistors.
VTH
18
R1 R2
u VIT
R2
910 k 120 k
u 1.25 10.73 V
120 k
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SLVS184F – NOVEMBER 1998 – REVISED OCTOBER 2020
50
1.002
VDD = 6 V
PFI = 1.05 V
MR = Open
30
I DD − Supply Current − µ A
Normalized Input Threshold Voltage VIT(TA), VIT (25 °C )
9.2.3 Application Curves
1.001
1
PFI = 1.05 V
MR = Open
TA = 25°C
TPS3707−50
10
−10
−30
0.999
−40
−15
10
35
60
TA − Free-Air Temperature − °C
85
Figure 9-2. Normalized Input Threshold Voltage vs
Free-Air Temperature at VDD
−50
−0.5
0.5
1.5
2.5
3.5
4.5
5.5
6.5
VDD − Supply Voltage − V
Figure 9-3. Supply Current vs Supply Voltage
10 Power Supply Recommendations
These devices are designed to operate from an input supply with a voltage range from 2 V to 6 V.
Copyright © 2020 Texas Instruments Incorporated
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11 Layout
11.1 Layout Guidelines
Place a 0.1-µF decoupling capacitor as close to the device as possible.
If a resistor divider is used, place the resistors as close to the device as possible to minimize noise coupling.
11.2 Layout Example
MR
VDD
1
8
WDO
2
7
RESET
3
6
WDI
4
5
PFO
Decoupling Cap
PFI
R1
R2
Monitored
Voltage
TPS3705 D Package
Figure 11-1. TPS3705 Layout
20
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SLVS184F – NOVEMBER 1998 – REVISED OCTOBER 2020
12 Device and Documentation Support
12.1 Receiving Notification of Documentation Updates
To receive notification of documentation updates, navigate to the device product folder on ti.com. Click on
Subscribe to updates to register and receive a weekly digest of any product information that has changed. For
change details, review the revision history included in any revised document.
12.2 Support Resources
TI E2E™ support forums are an engineer's go-to source for fast, verified answers and design help — straight
from the experts. Search existing answers or ask your own question to get the quick design help you need.
Linked content is provided "AS IS" by the respective contributors. They do not constitute TI specifications and do
not necessarily reflect TI's views; see TI's Terms of Use.
12.3 Trademarks
PowerPAD™ and TI E2E™ are trademarks of Texas Instruments.
All other trademarks are the property of their respective owners.
12.4 Electrostatic Discharge Caution
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled
with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may
be more susceptible to damage because very small parametric changes could cause the device not to meet its published
specifications.
12.5 Glossary
TI Glossary
This glossary lists and explains terms, acronyms, and definitions.
13 Mechanical, Packaging, and Orderable Information
The following pages include mechanical, packaging, and orderable information. This information is the most
current data available for the designated devices. This data is subject to change without notice and revision of
this document. For browser-based versions of this data sheet, refer to the left-hand navigation.
Copyright © 2020 Texas Instruments Incorporated
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PACKAGE OPTION ADDENDUM
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PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
(2)
Lead finish/
Ball material
MSL Peak Temp
Op Temp (°C)
Device Marking
(3)
Samples
(4/5)
(6)
TPS3705-30D
ACTIVE
SOIC
D
8
75
RoHS & Green
NIPDAU
Level-1-260C-UNLIM
-40 to 85
70530
Samples
TPS3705-30DGN
ACTIVE
HVSSOP
DGN
8
80
RoHS & Green
NIPDAU
Level-1-260C-UNLIM
-40 to 85
AAT
Samples
TPS3705-30DR
ACTIVE
SOIC
D
8
2500
RoHS & Green
NIPDAU
Level-1-260C-UNLIM
-40 to 85
70530
Samples
TPS3705-33D
ACTIVE
SOIC
D
8
75
RoHS & Green
NIPDAU
Level-1-260C-UNLIM
-40 to 125
70533
Samples
TPS3705-33DG4
ACTIVE
SOIC
D
8
75
RoHS & Green
NIPDAU
Level-1-260C-UNLIM
-40 to 125
70533
Samples
TPS3705-33DGN
ACTIVE
HVSSOP
DGN
8
80
RoHS & Green
NIPDAU
Level-1-260C-UNLIM
-40 to 85
AAU
Samples
TPS3705-33DGNR
ACTIVE
HVSSOP
DGN
8
2500
RoHS & Green
NIPDAU
Level-1-260C-UNLIM
-40 to 85
AAU
Samples
TPS3705-33DR
ACTIVE
SOIC
D
8
2500
RoHS & Green
NIPDAU
Level-1-260C-UNLIM
-40 to 125
70533
Samples
TPS3705-50D
ACTIVE
SOIC
D
8
75
RoHS & Green
NIPDAU
Level-1-260C-UNLIM
-40 to 85
70550
Samples
TPS3705-50DG4
ACTIVE
SOIC
D
8
75
RoHS & Green
NIPDAU
Level-1-260C-UNLIM
-40 to 85
70550
Samples
TPS3705-50DGN
ACTIVE
HVSSOP
DGN
8
80
RoHS & Green
NIPDAU
Level-1-260C-UNLIM
-40 to 85
AAV
Samples
TPS3705-50DGNG4
ACTIVE
HVSSOP
DGN
8
80
RoHS & Green
NIPDAU
Level-1-260C-UNLIM
-40 to 85
AAV
Samples
TPS3705-50DGNR
ACTIVE
HVSSOP
DGN
8
2500
RoHS & Green
NIPDAU
Level-1-260C-UNLIM
-40 to 85
AAV
Samples
TPS3705-50DR
ACTIVE
SOIC
D
8
2500
RoHS & Green
NIPDAU
Level-1-260C-UNLIM
-40 to 85
70550
Samples
TPS3705-50DRG4
ACTIVE
SOIC
D
8
2500
RoHS & Green
NIPDAU
Level-1-260C-UNLIM
-40 to 85
70550
Samples
TPS3707-25D
ACTIVE
SOIC
D
8
75
RoHS & Green
NIPDAU
Level-1-260C-UNLIM
-40 to 85
70725
Samples
TPS3707-25DGN
ACTIVE
HVSSOP
DGN
8
80
RoHS & Green
NIPDAU
Level-1-260C-UNLIM
-40 to 85
AAW
Samples
TPS3707-25DGNR
ACTIVE
HVSSOP
DGN
8
2500
RoHS & Green
NIPDAU
Level-1-260C-UNLIM
-40 to 85
AAW
Samples
TPS3707-25DR
ACTIVE
SOIC
D
8
2500
RoHS & Green
NIPDAU
Level-1-260C-UNLIM
-40 to 85
70725
Samples
TPS3707-30D
ACTIVE
SOIC
D
8
75
RoHS & Green
NIPDAU
Level-1-260C-UNLIM
-40 to 85
70730
Samples
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PACKAGE OPTION ADDENDUM
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Orderable Device
14-Oct-2022
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
(2)
Lead finish/
Ball material
MSL Peak Temp
Op Temp (°C)
Device Marking
(3)
Samples
(4/5)
(6)
TPS3707-30DG4
ACTIVE
SOIC
D
8
75
RoHS & Green
NIPDAU
Level-1-260C-UNLIM
-40 to 85
70730
Samples
TPS3707-30DGN
ACTIVE
HVSSOP
DGN
8
80
RoHS & Green
NIPDAU
Level-1-260C-UNLIM
-40 to 85
AAX
Samples
TPS3707-30DGNR
ACTIVE
HVSSOP
DGN
8
2500
RoHS & Green
NIPDAU
Level-1-260C-UNLIM
-40 to 85
AAX
Samples
TPS3707-30DR
ACTIVE
SOIC
D
8
2500
RoHS & Green
NIPDAU
Level-1-260C-UNLIM
-40 to 85
70730
Samples
TPS3707-33D
ACTIVE
SOIC
D
8
75
RoHS & Green
NIPDAU
Level-1-260C-UNLIM
-40 to 85
70733
Samples
TPS3707-33DG4
ACTIVE
SOIC
D
8
75
RoHS & Green
NIPDAU
Level-1-260C-UNLIM
-40 to 85
70733
Samples
TPS3707-33DGN
ACTIVE
HVSSOP
DGN
8
80
RoHS & Green
NIPDAU
Level-1-260C-UNLIM
-40 to 85
AAY
Samples
TPS3707-33DGNG4
ACTIVE
HVSSOP
DGN
8
80
RoHS & Green
NIPDAU
Level-1-260C-UNLIM
-40 to 85
AAY
Samples
TPS3707-33DGNR
ACTIVE
HVSSOP
DGN
8
2500
RoHS & Green
NIPDAU
Level-1-260C-UNLIM
-40 to 85
AAY
Samples
TPS3707-33DGNRG4
ACTIVE
HVSSOP
DGN
8
2500
RoHS & Green
NIPDAU
Level-1-260C-UNLIM
-40 to 85
AAY
Samples
TPS3707-33DR
ACTIVE
SOIC
D
8
2500
RoHS & Green
NIPDAU
Level-1-260C-UNLIM
-40 to 85
70733
Samples
TPS3707-50D
ACTIVE
SOIC
D
8
75
RoHS & Green
NIPDAU
Level-1-260C-UNLIM
-40 to 85
70750
Samples
TPS3707-50DGN
ACTIVE
HVSSOP
DGN
8
80
RoHS & Green
NIPDAU
Level-1-260C-UNLIM
-40 to 85
AAZ
Samples
TPS3707-50DGNR
ACTIVE
HVSSOP
DGN
8
2500
RoHS & Green
NIPDAU
Level-1-260C-UNLIM
-40 to 85
AAZ
Samples
TPS3707-50DR
ACTIVE
SOIC
D
8
2500
RoHS & Green
NIPDAU
Level-1-260C-UNLIM
-40 to 85
70750
Samples
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Addendum-Page 2
PACKAGE OPTION ADDENDUM
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14-Oct-2022
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of