TPS3839K33EVM-112

Sample & Buy Product Folder Support & Community Tools & Software Technical Documents TPS3831, TPS3839 SBVS193D – JUNE 2012 – REVISED JULY 2015 TPS383x 150-nA, Ultralow Power, Supply Voltage Monitor 1 Features 3 Description • • • • • • • The TPS3831 and TPS3839 devices (both referred to as TPS383x) are ultralow current (150 nA, typical), voltage supervisory circuits that monitor a single voltage. Both devices initiate an active-low reset signal whenever the VDD supply voltage drops below the factory-trimmed reset threshold voltage. The reset output remains low for 200 ms (typical) after the VDD voltage rises above the threshold voltage and hysteresis. These devices are designed to ignore fast transients on the VDD pin. The TPS3831 device includes a manual reset input that forces RESET low when MR is low. 1 Ultralow Supply Current: 150 nA (Typical) Operating Supply Voltage: 0.9 V to 6.5 V Valid Reset for VDD > 0.6 V Push-Pull RESET Output Factory-Trimmed Reset Threshold Voltages Temperature Range: –40°C to 85°C Packages: 1-mm × 1-mm X2SON or 3-Pin SOT23 2 Applications • • • • • • • Portable and Battery-Powered Equipment Metering Industrial Equipment Cell Phones Glucose Monitors Tablets Wearables The ultralow current consumption of 150 nA makes these voltage supervisors ideal for use in low-power and portable applications. The TPS383x devices are specified to have the correct output logic state for supply voltages down to 0.6 V. The TPS383x devices feature precision factorytrimmed threshold voltages and extremely low-power operation. The TPS3831 device is available in a 4pin, 1-mm × 1-mm (DQN) X2SON package. The TPS3839 device is available in a 3-pin SOT23 (DBZ) package or a 4-pin, 1-mm × 1-mm (DQN) X2SON package. Device Information(1) PART NUMBER TPS3831 TPS3839 PACKAGE PACKAGE SIZE (NOM) X2SON (4) 1.00 mm x 1.00 mm SOT-23 (3) 2.92 mm x 2.37 mm X2SON (4) 1.00 mm x 1.00 mm (1) For all available packages, see the orderable addendum at the end of the data sheet. Typical Application Circuit Supply Current vs Temperature 3.3 V 200 190 C1 0.1 mF VDD TPS383xK33 MR TPS3831 Only RESET GND Microprocessor RST Supply Current (nA) 180 170 VDD = 1.2 V VDD = 3.3 V VDD = 5.0 V VDD = 6.5 V 160 150 140 130 120 110 100 −40 −15 10 35 Temperature (°C) 60 85 G001 1 An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications, intellectual property matters and other important disclaimers. PRODUCTION DATA. TPS3831, TPS3839 SBVS193D – JUNE 2012 – REVISED JULY 2015 www.ti.com Table of Contents 1 2 3 4 5 6 7 8 Features .................................................................. Applications ........................................................... Description ............................................................. Revision History..................................................... Device Options....................................................... Pin Configuration and Functions ......................... Specifications......................................................... 1 1 1 2 4 5 6 7.1 7.2 7.3 7.4 7.5 7.6 7.7 6 6 6 6 7 8 9 Absolute Maximum Ratings ...................................... ESD Ratings.............................................................. Recommended Operating Conditions....................... Thermal Information .................................................. Electrical Characteristics........................................... Timing Requirements ................................................ Typical Characteristics .............................................. Detailed Description ............................................ 11 8.1 Overview ................................................................. 11 8.2 Functional Block Diagram ....................................... 11 8.3 Feature Description................................................. 11 8.4 Device Functional Modes........................................ 12 9 Applications and Implementation ...................... 13 9.1 Application Information............................................ 13 9.2 Typical Application .................................................. 13 10 Power Supply Recommendations ..................... 15 11 Layout................................................................... 15 11.1 Layout Guidelines ................................................. 15 11.2 Layout Example .................................................... 15 12 Device and Documentation Support ................. 16 12.1 12.2 12.3 12.4 12.5 12.6 12.7 Device Support...................................................... Documentation Support ........................................ Related Links ........................................................ Community Resources.......................................... Trademarks ........................................................... Electrostatic Discharge Caution ............................ Glossary ................................................................ 16 16 16 16 16 16 17 13 Mechanical, Packaging, and Orderable Information ........................................................... 17 4 Revision History NOTE: Page numbers for previous revisions may differ from page numbers in the current version. Changes from Revision C (February 2015) to Revision D Page • Changed µA to nA in document title....................................................................................................................................... 1 • Added TPS3839G25 to document ......................................................................................................................................... 1 • Changed Applications section: moved Metering bullet to second in list, changed Tablets bullet, added Wearables bullet .. 1 • Changed first paragraph of Description section .................................................................................................................... 1 • Changed Device Information table: changed Package Size column heading and value of SOT-23 row ............................. 1 • Added TPS3839G25 row to Device Options table ................................................................................................................ 4 • Changed Thermal Information table ...................................................................................................................................... 6 • Changed VIT– and Vhys parameters in Electrical Characteristics table: changed test conditions, added TPS3839G25 rows 7 Changes from Revision B (April 2013) to Revision C Page • Added ESD Ratings table, Feature Description section, Device Functional Modes, Application and Implementation section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and Mechanical, Packaging, and Orderable Information section ................................................................................................. 1 • Changed title of data sheet ................................................................................................................................................... 1 • Changed Operating Supply Voltage bullet from 0.6 V to 0.9 V.............................................................................................. 1 • Changed last sentence of Description section ...................................................................................................................... 1 • Changed front page figure ..................................................................................................................................................... 1 • Added MR parameter to Absolute Maximum Ratings ........................................................................................................... 6 • Changed condition statement for Electrical Characteristics .................................................................................................. 7 • Changed V(VO) parameter symbol to VPOR ............................................................................................................................. 7 • Changed Figure 1................................................................................................................................................................... 8 • Changed Functional Block Diagram; added hysteresis symbol to op amp .......................................................................... 11 • Deleted Typical Application Circuit figure ............................................................................................................................. 13 2 Submit Documentation Feedback Copyright © 2012–2015, Texas Instruments Incorporated TPS3831, TPS3839 www.ti.com SBVS193D – JUNE 2012 – REVISED JULY 2015 Changes from Revision A (September 2012) to Revision B • Page Changed VDD test conditions for high-level output voltage parameter ................................................................................... 7 Changes from Original (June 2012) to Revision A • Page Changed data sheet status from product preview to production data.................................................................................... 1 Copyright © 2012–2015, Texas Instruments Incorporated Submit Documentation Feedback 3 TPS3831, TPS3839 SBVS193D – JUNE 2012 – REVISED JULY 2015 www.ti.com 5 Device Options PRODUCT THRESHOLD VOLTAGE (V) PACKAGE-LEAD PACKAGE DESIGNATOR (1) TPS3831A09 0.9 X2SON-4 DQN TPS3831G12 1.1 X2SON-4 DQN TPS3831E16 1.52 X2SON-4 DQN TPS3831G18 1.67 X2SON-4 DQN TPS3831L30 2.63 X2SON-4 DQN TPS3831K33 2.93 X2SON-4 DQN TPS3831G33 3.08 X2SON-4 DQN TPS3831K50 4.38 X2SON-4 DQN TPS3839A09 0.9 TPS3839G12 1.1 TPS3839E16 1.52 TPS3839G18 1.67 TPS3839G25 2.325 TPS3839L30 (1) 4 2.63 TPS3839K33 2.93 TPS3839G33 3.08 TPS3839K50 4.38 SOT23-3 DBZ X2SON-4 DQN SOT23-3 DBZ X2SON-4 DQN SOT23-3 DBZ X2SON-4 DQN SOT23-3 DBZ X2SON-4 DQN SOT23-3 DBZ SOT23-3 DBZ X2SON-4 DQN SOT23-3 DBZ X2SON-4 DQN SOT23-3 DBZ X2SON-4 DQN SOT23-3 DBZ X2SON-4 DQN For the most current package and ordering information see the Package Option Addendum at the end of this document, or visit the device product folder at www.ti.com. Submit Documentation Feedback Copyright © 2012–2015, Texas Instruments Incorporated TPS3831, TPS3839 www.ti.com SBVS193D – JUNE 2012 – REVISED JULY 2015 6 Pin Configuration and Functions TPS3831 DQN Package 1-mm × 1-mm X2SON Top View 4 1 RESET TPS3839 DQN Package 1-mm × 1-mm X2SON Top View VDD RESET 1 Thermal Pad MR 3 2 4 VDD 3 GND Thermal Pad GND NC 2 TPS3839 DBZ Package SOT23-3 Top View GND 1 3 VDD 2 RESET Pin Functions PIN NO. NAME I/O DESCRIPTION TPS3839 (SOT23-3) TPS3839 (X2SON) TPS3831 (X2SON) 1 3 3 — MR N/A N/A 2 I NC N/A 2 N/A — No internal connection. 2 1 1 O Active-low reset output. RESET has a push-pull output drive and is capable of directly driving input pins. RESET is low as long as VDD remains below the factory threshold voltage, and until the delay time (td) elapses after VDD rises above the threshold voltage. N/A Available Available — Connect to ground or to a floating copper plane for mechanical stability. 3 4 4 I GND RESET Thermal pad VDD Copyright © 2012–2015, Texas Instruments Incorporated Ground Manual reset. Pull this pin to a logic low to assert the RESET output. After the MR pin is deasserted, the RESET output deasserts after the reset delay (td) elapses. Supply voltage Submit Documentation Feedback 5 TPS3831, TPS3839 SBVS193D – JUNE 2012 – REVISED JULY 2015 www.ti.com 7 Specifications 7.1 Absolute Maximum Ratings over operating free-air temperature range, unless otherwise noted (1) Voltage Current Temperature (2) (1) (2) MIN MAX UNIT VDD, RESET –0.3 7 V MR –0.3 VDD + 0.3 V RESET pin –10 10 mA Operating ambient, TA –40 85 Storage, Tstg –65 150 °C Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. As a result of the low dissipated power in this device, the junction temperature is assumed to be equal to the ambient temperature. 7.2 ESD Ratings VALUE V(ESD) (1) (2) Electrostatic discharge Human body model (HBM), per ANSI/ESDA/JEDEC JS-001 (1) ±2000 Charged device model (CDM), per JEDEC specification JESD22-C101 (2) ±500 UNIT V JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process. 7.3 Recommended Operating Conditions over operating free-air temperature range (unless otherwise noted) MIN NOM MAX UNIT VDD Input supply voltage 0.9 6.5 V VMR Manual reset pin voltage 0 VDD V VRESET RESET pin voltage 0 6.5 IRESET RESET pin current 0 8 V mA 7.4 Thermal Information THERMAL METRIC (1) TPS3839 TPS3831, TPS3839 DBZ (SOT23-3) DQN (X2SON) 3 PINS 4 PINS UNIT RθJA Junction-to-ambient thermal resistance 346.6 216.1 °C/W RθJC(top) Junction-to-case (top) thermal resistance 124.4 161.7 °C/W RθJB Junction-to-board thermal resistance 78.9 162.1 °C/W ψJT Junction-to-top characterization parameter 11.5 5.1 °C/W ψJB Junction-to-board characterization parameter 77.3 161.7 °C/W RθJC(bot) Junction-to-case (bottom) thermal resistance N/A 123.0 °C/W (1) 6 For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report, SPRA953. Submit Documentation Feedback Copyright © 2012–2015, Texas Instruments Incorporated TPS3831, TPS3839 www.ti.com SBVS193D – JUNE 2012 – REVISED JULY 2015 7.5 Electrical Characteristics At TA = –40°C to 85°C, 0.9 V < VDD < 6.5 V, and C1 = 0.1 µF, unless otherwise noted. Typical values are at 25°C. PARAMETER TEST CONDITIONS VDD Input supply voltage V(POR) Minimum VDD voltage for valid output IOL = 1 µA IDD Supply current (into VDD pin) Output not connected VOL VOH Low-level output voltage (RESET pin) High-level output voltage (RESET pin) VIL Low-level input voltage (MR pin) VIH High-level input voltage (MR pin) RMR MR pin pullup resistance MIN 0.9 Vhys Negative-going threshold voltage Hysteresis voltage Copyright © 2012–2015, Texas Instruments Incorporated MAX 6.5 150 V nA VDD = 1.2 V to 2.8 V, IOL = 0.5 mA 0.4 VDD = 2.8 V to 6.5 V, IOL = 2 mA 0.4 VDD – 0.4 VDD = 1.2 V to 3.3 V, IOH = –0.5 mA VDD – 0.4 VDD = 3.3 V to 6.5 V, IOH = –2 mA VDD – 0.4 V V 0.3VDD 10 V 500 0.4 VDD = 0.9 V to 1.2 V, IOH = –50 µA UNIT 0.6 VDD = 0.9 V to 1.2 V, IOL = 120 µA Negative-going input threshold accuracy TA = 25°C VIT– TYP V 20 0.7VDD V 30 kΩ ±1% TPS383xA09 0.874 0.9 0.914 TPS383xG12 TPS383xE16 1.073 1.1 1.117 1.482 1.52 1.543 TPS383xG18 1.628 1.67 1.695 TPS3839G25 2.267 2.325 2.360 TPS383xL30 2.564 2.63 2.669 TPS383xK33 2.857 2.93 2.974 TPS383xG33 3.003 3.08 3.126 TPS383xK50 4.271 4.38 4.446 TPS383xA09 54 TPS383xG12 11 TPS383xE16 15 TPS383xG18 17 TPS383xL30 26 TPS3839G25 23 TPS383xK33 29 TPS383xG33 31 TPS383xK50 44 Submit Documentation Feedback V mV 7 TPS3831, TPS3839 SBVS193D – JUNE 2012 – REVISED JULY 2015 www.ti.com 7.6 Timing Requirements At TA = –40°C to 85°C, 0.9 V < VDD < 6.5 V, and C1 = 0.1 µF, unless otherwise noted. Typical values are at 25°C. MIN TYP MAX UNIT 120 200 350 ms td RESET delay time (power-up delay) tPD_VDD Propagation delay, VDD falling (power-down delay) 20 µs tPD_MR Propagation delay from MR low to RESET low 46 ns VDD VIT- + VHYS VIT0.6 V MR 0.7VDD 0.3VDD td = Reset Delay td RESET td td = Undefined State Time Figure 1. MR and VDD Reset Timing 8 Submit Documentation Feedback Copyright © 2012–2015, Texas Instruments Incorporated TPS3831, TPS3839 www.ti.com SBVS193D – JUNE 2012 – REVISED JULY 2015 7.7 Typical Characteristics At TA = 25°C and C1 = 0.1 µF, unless otherwise noted. 200 220 VDD = 1.2 V VDD = 3.3 V VDD = 5.0 V VDD = 6.5 V Supply Current (nA) 180 170 TPS3839K33 Reset Delay Time (ms) 190 160 150 140 130 120 210 200 190 110 100 −40 −15 10 35 Temperature (°C) 60 180 −40 85 −15 10 35 Temperature (°C) G001 Figure 2. Supply Current vs Temperature 60 85 G002 Figure 3. Reset Delay vs Temperature 0.2 1.8 VDD = 1.8 V 1.6 −0.2 VOH (V) Change in VIT– (%) 0 −0.4 1.4 1.2 −0.6 TA = −40°C TA = 0°C TA = +25°C TA = +85°C 1 −0.8 TPS3839A09 TPS3839K50 −1 −40 −15 10 35 Temperature (°C) 60 0.8 85 0 0.5 1 1.5 2 IOH (mA) G003 Figure 4. Threshold Voltage vs Temperature 2.5 3 3.5 G004 Figure 5. VOH vs IOH and Temperature for VDD = 1.8 V 3.5 4 VDD = 3.3 V VDD =4.0 V 3.5 VOH (V) VOH (V) 2.5 3 1.5 TA = −40°C TA = 0°C TA = +25°C TA = +85°C 0.5 0 2 TA = −40°C TA = 0°C TA = +25°C TA = +85°C 2.5 4 6 IOH (mA) 8 10 G005 Figure 6. VOH vs IOH and Temperature for VDD = 3.3 V Copyright © 2012–2015, Texas Instruments Incorporated 2 0 2 4 6 IOH (mA) 8 10 12 G006 Figure 7. VOH vs IOH and Temperature for VDD = 4.0 V Submit Documentation Feedback 9 TPS3831, TPS3839 SBVS193D – JUNE 2012 – REVISED JULY 2015 www.ti.com Typical Characteristics (continued) At TA = 25°C and C1 = 0.1 µF, unless otherwise noted. 1.6 1.6 TA = −40°C TA = 0°C TA = +25°C TA = +25°C 1.4 1.2 1.2 1 VOL (V) 1 VOL (V) TA = −40°C TA = 0°C TA = +25°C TA = +85°C 1.4 0.8 0.8 0.6 0.6 0.4 0.4 0.2 0.2 VDD = 1.8 V 0 0 1 2 3 4 VDD = 3.3 V 0 5 IOL (mA) VOL (V) 0.8 0.6 0.4 0.2 VDD = 4.0 V 0 0 2 4 6 IOL (mA) 8 10 G009 Figure 10. VOL vs IOL and Temperature for VDD = 4.0 V 10 Submit Documentation Feedback 4 6 8 10 G008 Figure 9. VOL vs IOL and Temperature for VDD = 3.3 V Minimum Pulse Duration Trigger Reset (µs) TA = −40°C TA = 0°C TA = +25°C TA = +85°C 1 2 IOL (mA) Figure 8. VOL vs IOL and Temperature for VDD = 1.8 V 1.4 1.2 0 G007 50 Reset Occurs Above Line 45 40 35 30 25 20 15 10 0 5 10 15 20 25 VDD voltage drop below VIT− (%) 30 35 G010 Figure 11. Maximum Pulse Duration vs Percent of Threshold Overdrive Copyright © 2012–2015, Texas Instruments Incorporated TPS3831, TPS3839 www.ti.com SBVS193D – JUNE 2012 – REVISED JULY 2015 8 Detailed Description 8.1 Overview The TPS3831 and TPS3839 are ultralow current voltage supervisory circuits that monitor the input supply voltage of these devices. Both devices assert an active-low reset whenever the VDD supply voltage drops below the negative-going threshold voltage (VIT–). The output, RESET, remains asserted for approximately 200 ms after the VDD voltage rises above the positive-going threshold voltage (VIT– + Vhys). These devices are designed to ignore fast transients on the VDD pin. The TPS3831 device includes a manual reset input (MR) that can be used to force the RESET signal low, even if the supply voltage is above VIT–. 8.2 Functional Block Diagram VDD Delay RESET VREF GND VDD MR (TPS3831 Only) 8.3 Feature Description 8.3.1 VDD Transient Rejection The TPS383x (TPS3831 and TPS3839) devices have built-in rejection of fast transients on the VDD pin. Transient rejection depends on both the duration and amplitude of the transient. Transient amplitude is measured from the bottom of the transient to the negative threshold voltage (VIT–) of the device, as shown in Figure 12. VDD VITTransient Amplitude Transient Duration (tW) Figure 12. Voltage Transient Measurement Copyright © 2012–2015, Texas Instruments Incorporated Submit Documentation Feedback 11 TPS3831, TPS3839 SBVS193D – JUNE 2012 – REVISED JULY 2015 www.ti.com Feature Description (continued) Minimum Pulse Duration Trigger Reset (µs) Figure 13 shows the relationship between the transient amplitude and duration required to trigger a reset. Any combination of duration and amplitude greater than that shown in Figure 13 generates a reset signal. 50 Reset Occurs Above Line 45 40 35 30 25 20 15 10 0 5 10 15 20 25 VDD voltage drop below VIT− (%) 30 35 G010 Figure 13. TPS3839 Transient Rejection 8.3.2 Manual Reset (MR) Input (TPS3831 Only) The manual reset (MR) input allows a processor, or other logic devices, to initiate a reset (TPS3831 device only). A logic low (0.3 VDD) on MR causes RESET to assert. After MR returns to a logic high and VDD is greater than the threshold voltage, RESET is deasserted after the reset delay time, td, elapses. MR is internally tied to VDD with a 20-kΩ resistor; therefore, this pin can be left unconnected if MR is not used. If a logic signal driving MR does not go fully to VDD, some additional current draws into VDD as a result of the internal pullup resistor on MR. To minimize current draw, a logic-level FET can be used, as shown in Figure 14. VDD 20 kW MR TPS3831 GND Figure 14. Using a Logic-Level FET to Minimize Current Draw 8.4 Device Functional Modes 8.4.1 Normal Operation (VDD > VDD(min)) When the voltage on VDD is greater than VDD(min), the RESET output corresponds to the voltage on the VDD pin relative to VIT–. 8.4.2 Below VDD(min) (V(POR) < VDD < VDD(min) When the voltage on VDD is less than VDD(min) but greater than the power-on reset voltage (V(POR)), the RESET output is asserted. 8.4.3 Below Power-On Reset (VDD < V(POR) When the voltage on VDD is lower than the power-on reset voltage (V(POR)), the RESET output is undefined. Do not rely on the RESET output for proper device function under this condition. 12 Submit Documentation Feedback Copyright © 2012–2015, Texas Instruments Incorporated TPS3831, TPS3839 www.ti.com SBVS193D – JUNE 2012 – REVISED JULY 2015 9 Applications and Implementation NOTE Information in the following applications sections is not part of the TI component specification, and TI does not warrant its accuracy or completeness. TI’s customers are responsible for determining suitability of components for their purposes. Customers should validate and test their design implementation to confirm system functionality. 9.1 Application Information Low operating voltage and threshold options make the TPS383x devices well-suited for monitoring single-cell, alkaline-battery applications. 9.2 Typical Application Figure 15 shows the TPS3839A09 used to disable a boost converter when the cell voltage reaches 0.9 V, which is the end of the discharge voltage for a single alkaline battery cell. When the cell voltage reaches 0.9 V, the TPS61261 enable pin is driven low. This setting disables the TPS61261 and places it in a low-current shutdown state. The combination of the TPS3839 and TPS61261 devices consumes only 250 nA (typical) from the discharged battery. VIN VOUT 3.3 V at 40 mA 4.7 PH FB L One-Cell Alkaline 10 PF 10 PF VDD TPS61261 TPS3839A09 EN RESET GND RI 5 k: GND Figure 15. Disabled Boost Converter 9.2.1 Design Requirements Table 1 lists the design requirements for Figure 15. Table 1. Design Requirements and Results DESIGN REQUIREMENTS Input voltage range of 0.9 V to 1.7 V DESIGN RESULT TPS3839A09 TPS61261 COMBINED 0.9 V to 6.5 V 0.8 V to 4 V 0.9 V to 4 V 0.5 μA (maximum) 1.5 μA (maximum) 2.0 μA (maximum) Output voltage of 3.3 V N/A 3.3 V 3.3 V Output current of 50 mA N/A 100 mA 100 mA Switching frequency ≥ 1 MHz N/A 2.5 MHz 2.5 MHz Shutdown current < 3 µA Copyright © 2012–2015, Texas Instruments Incorporated Submit Documentation Feedback 13 TPS3831, TPS3839 SBVS193D – JUNE 2012 – REVISED JULY 2015 www.ti.com 9.2.2 Detailed Design Procedure 9.2.2.1 Input Capacitor The TPS383x devices use a unique sampling scheme to maintain an extremely low average quiescent current of 150 nA. The TPS383x devices typically consume only approximately 100 nA of dc current. However, this current rises to approximately 15 µA for about 200 µs when the TPS383x devices sample the input voltage. If the source impedance back to the supply voltage is high, then the additional current during sampling may trigger a false reset as a result of the apparent voltage drop at VDD. For applications with high-impedance input supplies (including trace impedance), TI recommends adding a small 0.1-µF bypass capacitor near the TPS3839 VDD pin. This bypass capacitor effectively keeps the average current at 150 nA and reduces the effects of a highimpedance voltage source. 9.2.2.2 Bidirectional Reset Pins Some devices have bidirectional reset pins that act both as an input and an output. For applications where the TPS383x devices drive a bidirectional reset pin, place a series resistor between the TPS383x output and the reset pin to protect against excessive current flow when both the TPS383x devices and the reset pin attempt to drive the reset line. Figure 16 shows the connection of the TPS3839K33 to a bidirectional reset pin of a microcontroller using a series resistor. 3.3 V VCC Microprocessor VDD TPS3839K33 47 k: RESET RST GND Figure 16. Connection to a Bidirectional Reset Pin 9.2.3 Application Curve 200 190 Supply Current (nA) 180 170 VDD = 1.2 V VDD = 3.3 V VDD = 5.0 V VDD = 6.5 V 160 150 140 130 120 110 100 −40 −15 10 35 Temperature (°C) 60 85 G001 Figure 17. Supply Current vs Temperature 14 Submit Documentation Feedback Copyright © 2012–2015, Texas Instruments Incorporated TPS3831, TPS3839 www.ti.com SBVS193D – JUNE 2012 – REVISED JULY 2015 10 Power Supply Recommendations These devices are designed to operate from an input supply with a voltage range between 0.9 V and 6.5 V. Use a low-impedance power supply to eliminate inaccuracies caused by the extra current during the input-voltage sampling discussed in the Input Capacitor section. 11 Layout 11.1 Layout Guidelines Make sure the connection to the VDD pin is low impedance and able to carry 15 µA without a significant voltage drop. Place a 0.1-µF bypass capacitor near the VDD pin if the 15-µA sampling current causes too much voltage droop. 11.2 Layout Example 1 CVDD 3 RESET Flag 2 Input Supply Figure 18. Recommended Layout Copyright © 2012–2015, Texas Instruments Incorporated Submit Documentation Feedback 15 TPS3831, TPS3839 SBVS193D – JUNE 2012 – REVISED JULY 2015 www.ti.com 12 Device and Documentation Support 12.1 Device Support 12.1.1 Development Support 12.1.1.1 Evaluation Modules Two evaluation modules (EVMs) are available to assist in the initial circuit performance evaluation using the TPS3831 and TPS3839. The TPS3831G33EVM-187 and TPS3839K33EVM-112 evaluation modules (and related user's guides) can be requested at the TI website through the product folders or purchased directly from the TI eStore. 12.1.1.2 Spice Models Computer simulation of circuit performance using SPICE is often useful when analyzing the performance of analog circuits and systems. SPICE models for the TPS3831 and TPS3839 devices are available through each of the product folders under Tools & Software. 12.2 Documentation Support 12.2.1 Related Documentation • TPS3831G33EVM-187 User's Guide, SLVU774 • TPS3839K33EVM-112 User's Guide, SLVU758. • TPS61261 Data Sheet, SLVSA99 12.3 Related Links Table 2 lists quick access links. Categories include technical documents, support and community resources, tools and software, and quick access to sample or buy. Table 2. Related Links PARTS PRODUCT FOLDER SAMPLE & BUY TECHNICAL DOCUMENTS TOOLS & SOFTWARE SUPPORT & COMMUNITY TPS3831 Click here Click here Click here Click here Click here TPS3839 Click here Click here Click here Click here Click here 12.4 Community Resources The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of Use. TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help solve problems with fellow engineers. Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and contact information for technical support. 12.5 Trademarks E2E is a trademark of Texas Instruments. All other trademarks are the property of their respective owners. 12.6 Electrostatic Discharge Caution These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates. 16 Submit Documentation Feedback Copyright © 2012–2015, Texas Instruments Incorporated TPS3831, TPS3839 www.ti.com SBVS193D – JUNE 2012 – REVISED JULY 2015 12.7 Glossary SLYZ022 — TI Glossary. This glossary lists and explains terms, acronyms, and definitions. 13 Mechanical, Packaging, and Orderable Information The following pages include mechanical, packaging, and orderable information. This information is the most current data available for the designated devices. This data is subject to change without notice and revision of this document. For browser-based versions of this data sheet, refer to the left-hand navigation. Copyright © 2012–2015, Texas Instruments Incorporated Submit Documentation Feedback 17 PACKAGE OPTION ADDENDUM www.ti.com 10-Dec-2020 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan (2) Lead finish/ Ball material MSL Peak Temp Op Temp (°C) Device Marking (3) (4/5) (6) TPS3831A09DQNR ACTIVE X2SON DQN 4 3000 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 85 A3 TPS3831A09DQNT ACTIVE X2SON DQN 4 250 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 85 A3 TPS3831E16DQNR ACTIVE X2SON DQN 4 3000 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 85 A5 TPS3831E16DQNT ACTIVE X2SON DQN 4 250 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 85 A5 TPS3831G12DQNR ACTIVE X2SON DQN 4 3000 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 85 A4 TPS3831G12DQNT ACTIVE X2SON DQN 4 250 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 85 A4 TPS3831G18DQNR ACTIVE X2SON DQN 4 3000 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 85 A6 TPS3831G18DQNT ACTIVE X2SON DQN 4 250 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 85 A6 TPS3831G33DQNR ACTIVE X2SON DQN 4 3000 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 85 A7 TPS3831G33DQNT ACTIVE X2SON DQN 4 250 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 85 A7 TPS3831K33DQNR ACTIVE X2SON DQN 4 3000 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 85 A8 TPS3831K33DQNT ACTIVE X2SON DQN 4 250 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 85 A8 TPS3831K50DQNR ACTIVE X2SON DQN 4 3000 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 85 A9 TPS3831K50DQNT ACTIVE X2SON DQN 4 250 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 85 A9 TPS3831L30DQNR ACTIVE X2SON DQN 4 3000 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 85 BA TPS3831L30DQNT ACTIVE X2SON DQN 4 250 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 85 BA TPS3839A09DBZR ACTIVE SOT-23 DBZ 3 3000 RoHS & Green NIPDAUAG Level-1-260C-UNLIM -40 to 85 PZDI TPS3839A09DBZT ACTIVE SOT-23 DBZ 3 250 RoHS & Green NIPDAUAG Level-1-260C-UNLIM -40 to 85 PZDI TPS3839A09DQNR ACTIVE X2SON DQN 4 3000 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 85 ZJ TPS3839A09DQNT ACTIVE X2SON DQN 4 250 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 85 ZJ Addendum-Page 1 Samples PACKAGE OPTION ADDENDUM www.ti.com Orderable Device 10-Dec-2020 Status (1) Package Type Package Pins Package Drawing Qty Eco Plan (2) Lead finish/ Ball material MSL Peak Temp Op Temp (°C) Device Marking (3) (4/5) (6) TPS3839E16DBZR ACTIVE SOT-23 DBZ 3 3000 RoHS & Green NIPDAUAG Level-1-260C-UNLIM -40 to 85 PZCI TPS3839E16DBZT ACTIVE SOT-23 DBZ 3 250 RoHS & Green NIPDAUAG Level-1-260C-UNLIM -40 to 85 PZCI TPS3839E16DQNR ACTIVE X2SON DQN 4 3000 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 85 ZK TPS3839E16DQNT ACTIVE X2SON DQN 4 250 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 85 ZK TPS3839G12DBZR ACTIVE SOT-23 DBZ 3 3000 RoHS & Green NIPDAUAG Level-1-260C-UNLIM -40 to 85 PZBI TPS3839G12DBZT ACTIVE SOT-23 DBZ 3 250 RoHS & Green NIPDAUAG Level-1-260C-UNLIM -40 to 85 PZBI TPS3839G12DQNR ACTIVE X2SON DQN 4 3000 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 85 ZE TPS3839G12DQNT ACTIVE X2SON DQN 4 250 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 85 ZE TPS3839G18DBZR ACTIVE SOT-23 DBZ 3 3000 RoHS & Green NIPDAUAG Level-1-260C-UNLIM -40 to 85 PZAI TPS3839G18DBZT ACTIVE SOT-23 DBZ 3 250 RoHS & Green NIPDAUAG Level-1-260C-UNLIM -40 to 85 PZAI TPS3839G18DQNR ACTIVE X2SON DQN 4 3000 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 85 ZL TPS3839G18DQNT ACTIVE X2SON DQN 4 250 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 85 ZL TPS3839G25DBZR ACTIVE SOT-23 DBZ 3 3000 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 85 PZNI TPS3839G25DBZT ACTIVE SOT-23 DBZ 3 250 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 85 PZNI TPS3839G33DBZR ACTIVE SOT-23 DBZ 3 3000 RoHS & Green NIPDAUAG Level-1-260C-UNLIM -40 to 85 PYZI TPS3839G33DBZT ACTIVE SOT-23 DBZ 3 250 RoHS & Green NIPDAUAG Level-1-260C-UNLIM -40 to 85 PYZI TPS3839G33DQNR ACTIVE X2SON DQN 4 3000 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 85 ZG TPS3839G33DQNT ACTIVE X2SON DQN 4 250 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 85 ZG TPS3839K33DBZR ACTIVE SOT-23 DBZ 3 3000 RoHS & Green NIPDAUAG Level-1-260C-UNLIM -40 to 85 PYYI TPS3839K33DBZT ACTIVE SOT-23 DBZ 3 250 RoHS & Green NIPDAUAG Level-1-260C-UNLIM -40 to 85 PYYI TPS3839K33DQNR ACTIVE X2SON DQN 4 3000 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 85 ZF Addendum-Page 2 Samples PACKAGE OPTION ADDENDUM www.ti.com Orderable Device 10-Dec-2020 Status (1) Package Type Package Pins Package Drawing Qty Eco Plan (2) Lead finish/ Ball material MSL Peak Temp Op Temp (°C) Device Marking (3) (4/5) (6) TPS3839K33DQNT ACTIVE X2SON DQN 4 250 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 85 ZF TPS3839K50DBZR ACTIVE SOT-23 DBZ 3 3000 RoHS & Green NIPDAUAG Level-1-260C-UNLIM -40 to 85 PYXI TPS3839K50DBZT ACTIVE SOT-23 DBZ 3 250 RoHS & Green NIPDAUAG Level-1-260C-UNLIM -40 to 85 PYXI TPS3839K50DQNR ACTIVE X2SON DQN 4 3000 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 85 ZH TPS3839K50DQNT ACTIVE X2SON DQN 4 250 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 85 ZH TPS3839L30DBZR ACTIVE SOT-23 DBZ 3 3000 RoHS & Green NIPDAUAG Level-1-260C-UNLIM -40 to 85 PYWI TPS3839L30DBZT ACTIVE SOT-23 DBZ 3 250 RoHS & Green NIPDAUAG Level-1-260C-UNLIM -40 to 85 PYWI TPS3839L30DQNR ACTIVE X2SON DQN 4 3000 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 85 ZI TPS3839L30DQNT ACTIVE X2SON DQN 4 250 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 85 ZI (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may reference these types of products as "Pb-Free". RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption. Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of