TPS51620RHAR

This device is designed specifically to power IMVP Mobile Processors under a strict disclosure agreement with Intel. The end user must have a current CNDA Agreement in place with Intel. For more information please contact IMVP@list.ti.com. PACKAGE MATERIALS INFORMATION www.ti.com 4-Feb-2015 TAPE AND REEL INFORMATION *All dimensions are nominal Device Package Package Pins Type Drawing SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant TPS51620RHAR VQFN RHA 40 2500 330.0 16.4 6.3 6.3 1.1 12.0 16.0 Q2 TPS51620RHAT VQFN RHA 40 250 180.0 16.4 6.3 6.3 1.1 12.0 16.0 Q2 Pack Materials-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 4-Feb-2015 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) TPS51620RHAR VQFN RHA 40 2500 367.0 367.0 38.0 TPS51620RHAT VQFN RHA 40 250 210.0 185.0 35.0 Pack Materials-Page 2 GENERIC PACKAGE VIEW RHA 40 VQFN - 1 mm max height PLASTIC QUAD FLATPACK - NO LEAD 6 x 6, 0.5 mm pitch This image is a representation of the package family, actual package may vary. Refer to the product data sheet for package details. 4225870/A www.ti.com PACKAGE OUTLINE RHA0040B VQFN - 1 mm max height SCALE 2.200 PLASTIC QUAD FLATPACK - NO LEAD B 6.1 5.9 A PIN 1 INDEX AREA 6.1 5.9 1 MAX C SEATING PLANE 0.05 0.00 0.08 2X 4.5 4.15 0.1 (0.2) TYP 11 36X 0.5 20 10 21 EXPOSED THERMAL PAD 2X 4.5 SYMM 41 30 1 PIN 1 ID (OPTIONAL) 40 SYMM 31 40X 0.5 0.3 40X 0.27 0.17 0.1 0.05 C A B 4219052/A 06/2016 NOTES: 1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing per ASME Y14.5M. 2. This drawing is subject to change without notice. 3. The package thermal pad must be soldered to the printed circuit board for thermal and mechanical performance. www.ti.com EXAMPLE BOARD LAYOUT RHA0040B VQFN - 1 mm max height PLASTIC QUAD FLATPACK - NO LEAD ( 4.15) SYMM 40X (0.6) 40X (0.22) 31 40 1 30 (0.25) TYP SYMM 41 (0.685) TYP 36X (0.5) ( 0.2) TYP VIA (5.8) (1.14) TYP 10 21 (R0.05) TYP 20 11 (0.685) TYP (1.14) TYP (5.8) LAND PATTERN EXAMPLE SCALE:12X 0.07 MIN ALL SIDES 0.07 MAX ALL AROUND SOLDER MASK OPENING METAL SOLDER MASK OPENING METAL UNDER SOLDER MASK NON SOLDER MASK DEFINED (PREFERRED) SOLDER MASK DEFINED SOLDER MASK DETAILS 4219052/A 06/2016 NOTES: (continued) 4. This package is designed to be soldered to a thermal pad on the board. For more information, see Texas Instruments literature number SLUA271 (www.ti.com/lit/slua271). www.ti.com EXAMPLE STENCIL DESIGN RHA0040B VQFN - 1 mm max height PLASTIC QUAD FLATPACK - NO LEAD 9X ( 1.17) 40X (0.6) (1.37) TYP 31 40 40X (0.22) 1 30 41 (1.37) TYP (0.25) TYP SYMM (5.8) 36X (0.5) (R0.05) TYP 10 METAL TYP 21 11 20 SYMM (5.8) SOLDER PASTE EXAMPLE BASED ON 0.125 mm THICK STENCIL EXPOSED PAD 41: 72% PRINTED SOLDER COVERAGE BY AREA UNDER PACKAGE SCALE:12X 4219052/A 06/2016 NOTES: (continued) 5. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate design recommendations. www.ti.com IMPORTANT NOTICE AND DISCLAIMER TI PROVIDES TECHNICAL AND RELIABILITY DATA (INCLUDING DATASHEETS), DESIGN RESOURCES (INCLUDING REFERENCE DESIGNS), APPLICATION OR OTHER DESIGN ADVICE, WEB TOOLS, SAFETY INFORMATION, AND OTHER RESOURCES “AS IS” AND WITH ALL FAULTS, AND DISCLAIMS ALL WARRANTIES, EXPRESS AND IMPLIED, INCLUDING WITHOUT LIMITATION ANY IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE OR NON-INFRINGEMENT OF THIRD PARTY INTELLECTUAL PROPERTY RIGHTS. These resources are intended for skilled developers designing with TI products. You are solely responsible for (1) selecting the appropriate TI products for your application, (2) designing, validating and testing your application, and (3) ensuring your application meets applicable standards, and any other safety, security, or other requirements. These resources are subject to change without notice. TI grants you permission to use these resources only for development of an application that uses the TI products described in the resource. Other reproduction and display of these resources is prohibited. No license is granted to any other TI intellectual property right or to any third party intellectual property right. TI disclaims responsibility for, and you will fully indemnify TI and its representatives against, any claims, damages, costs, losses, and liabilities arising out of your use of these resources. TI’s products are provided subject to TI’s Terms of Sale (https:www.ti.com/legal/termsofsale.html) or other applicable terms available either on ti.com or provided in conjunction with such TI products. TI’s provision of these resources does not expand or otherwise alter TI’s applicable warranties or warranty disclaimers for TI products.IMPORTANT NOTICE Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265 Copyright © 2021, Texas Instruments Incorporated