TPS51623RSMR

TPS51623 SLUSEW6 – JUNE 2022 TPS51623 2-Phase, D-CAP+™ Step-Down Controller for VR12.1 VCPU 1 Features 3 Description • • • • • • The TPS51623 device is a driverless, fully SVID compliant, VR12.1 step-down controller. Advanced control features such as D-CAP+ architecture with overlapping pulse support undershoot reduction (USR) and overshoot reduction (OSR) provide fast transient response, lowest output capacitance and high efficiency. The TPS51623 device also supports single-phase operation in CCM or DCM for lightload efficiency. The TPS51623 device integrates the full complement of VR12.1 I/O features including VR_READY (PGOOD), ALERT and VR_HOT. The SVID interface address allows programming from 0 to 7. When the device is operating in PS4 mode, the quiescent power consumption of the controller is typically 0.25 mW. Adjustable control of VOUT slew rate and voltage positioning round out the VR12.1 features. • • • • • • • • VR12.1 serial VID (SVID) compliant 1- or 2-phase operation Supports only zero load line applications 8-Bit DAC output range: 0.25 V to 1.52 V Optimized efficiency at light and heavy loads 8 independent levels of overshoot reduction (OSR) and undershoot reduction (USR) Driverless configuration for efficient high-frequency switching Supports discrete, Power Block, Power Stage or DrMOS MOSFET implementations Accurate, adjustable voltage positioning 300-kHz to 1-MHz frequency selections Patented AutoBalance Phase Balancing Selectable 8-level current limit 4.5-V to 28-V conversion voltage range Small, 4 mm × 4 mm, 32-Pin, VQFN PowerPAD™ integrated circuit package 2 Applications • • • • Adapter Battery NVDC 5-V or 12-V Rails Paired with the TPS51604 FET gate driver, the solution delivers exceptionally high speed and low switching loss. The TPS51623 device works with selected TI power stage products for optimum efficiency as well as DrMOS products. The TPS51623 device operates with a default boot voltage of 1 V. Applications can override the default boot voltage by including an external resistor divider in the design. The TPS51623 device package is a space saving, thermally enhanced 32-pin VQFN package that operates from –40°C to 105°C. Table 3-1. Device Information(1) PART NUMBER PACKAGE BODY SIZE (NOM) TPS51623 VQFN (32) 4.00 mm × 4.00 mm (1) For all available packages, see the orderable addendum at the end of the document. TPS51623 TPS51604 Drive Power Block TPS51604 Drive Power Block PWM1 SVID BUS PWM2 SKIP Figure 3-1. Simplified Schematic An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications, intellectual property matters and other important disclaimers. PRODUCTION DATA. TPS51623 www.ti.com SLUSEW6 – JUNE 2022 Table of Contents 1 Features............................................................................1 2 Applications..................................................................... 1 3 Description.......................................................................1 4 Revision History.............................................................. 2 5 Device and Documentation Support..............................3 5.1 Receiving Notification of Documentation Updates......3 5.2 Support Resources..................................................... 3 5.3 Trademarks................................................................. 3 5.4 Electrostatic Discharge Caution..................................3 5.5 Glossary......................................................................3 6 Mechanical, Packaging, and Orderable Information.... 4 4 Revision History 2 DATE REVISION NOTES June 2022 * Initial Release Submit Document Feedback Copyright © 2022 Texas Instruments Incorporated Product Folder Links: TPS51623 TPS51623 www.ti.com SLUSEW6 – JUNE 2022 5 Device and Documentation Support 5.1 Receiving Notification of Documentation Updates To receive notification of documentation updates, navigate to the device product folder on ti.com. Click on Subscribe to updates to register and receive a weekly digest of any product information that has changed. For change details, review the revision history included in any revised document. 5.2 Support Resources TI E2E™ support forums are an engineer's go-to source for fast, verified answers and design help — straight from the experts. Search existing answers or ask your own question to get the quick design help you need. Linked content is provided "AS IS" by the respective contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of Use. 5.3 Trademarks D-CAP+™ and PowerPAD™ are trademarks of TI. TI E2E™ is a trademark of Texas Instruments. All trademarks are the property of their respective owners. 5.4 Electrostatic Discharge Caution This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications. 5.5 Glossary TI Glossary This glossary lists and explains terms, acronyms, and definitions. Submit Document Feedback Copyright © 2022 Texas Instruments Incorporated Product Folder Links: TPS51623 3 TPS51623 www.ti.com SLUSEW6 – JUNE 2022 6 Mechanical, Packaging, and Orderable Information The following pages include mechanical packaging and orderable information. This information is the most current data available for the designated devices. This data is subject to change without notice and revision of this document. For browser-based versions of this data sheet, refer to the left-hand navigation. 4 Submit Document Feedback Copyright © 2022 Texas Instruments Incorporated Product Folder Links: TPS51623 PACKAGE OPTION ADDENDUM www.ti.com 13-Apr-2022 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan (2) Lead finish/ Ball material MSL Peak Temp Op Temp (°C) Device Marking (3) (4/5) (6) TPS51623RSMR ACTIVE VQFN RSM 32 3000 RoHS & Green NIPDAU Level-2-260C-1 YEAR -40 to 105 TPS 51623 TPS51623RSMT ACTIVE VQFN RSM 32 250 RoHS & Green NIPDAU Level-2-260C-1 YEAR -40 to 105 TPS 51623 (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may reference these types of products as "Pb-Free". RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption. Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of