TPS53685RSBR

TPS53685 SLUSEZ5 – DECEMBER 2022 TPS53685 Dual-Channel (N + M ≤ 8 phase) D-CAP+™, Step-Down, Multiphase Controller with AMD-SVI3 and PMBus Interfaces 1 Features 3 Description • • • The TPS53685 is a fully AMD SVI3 compliant stepdown controller with trans-inductor voltage regulator (TLVR) topology support, dual channels, built-in non-volatile memory (NVM), PMBus™ interface, and full compatible with TI NexFET™ smart power stages. Advanced control features such as D-CAP+™ architecture with undershoot reduction (USR) provide fast transient response and good current sharing, minimizing output capacitance requirements. The device also provides a novel phase interleaving strategy and dynamic phase shedding for efficiency improvements at different loads. Adjustable control of VCORE slew rate and voltage positioning work with the AMD SVI3 features. In addition, the device supports the PMBus communication interface for reporting the telemetry of voltage, current, power, temperature, and fault conditions to the systems. All programmable parameters can be configured by the PMBus interface and can be stored in NVM as the new default values to minimize the external component count. • • • • • • • • • • • • • • • Input voltage range: 4.5 V to 17 V Output voltage range: 0.25 V to 5.5 V Dual output supporting N+M ≤ 8 phases, M ≤ 4 phases Native trans-inductor voltage regulator (TLVR) topology support AMD® SVI3 compliant Enhanced D-CAP+™ control to provide superior transient performance with excellent dynamic current sharing Programmable loop compensations Flexible phase-firing sequencing Individual phase current calibrations and reports Dynamic phase shedding with programmable current threshold for optimizing efficiency at light and heavy loads Fast phase-adding for undershoot reduction Driverless configuration for efficient high-frequency switching Fully compatible with TI NexFET™ power stages for high-density solutions Accurate, adjustable voltage positioning Patented AutoBalance™ phase current balancing Selectable per-phase current limit PMBus™ system interface for telemetry of voltage, current, power, temperature, and fault conditions 5.00 × 5.00 mm, 40-pin, 0.4 mm pitch, QFN package 2 Applications • • • • The TPS53685 device is offered in a thermally enhanced 40-pin QFN packaged and is rated to operate from –40°C to 125°C. Device Information PART NUMBER(1) TPS53685 (1) PACKAGE QFN (40) BODY SIZE (NOM) 5.00 × 5.00 mm For all available packages, see the orderable addendum at the end of the data sheet. Rack server Microserver and tower server High performance computing Baseband unit (BBU) TPS53685 PWM1 CSP1 PMBus PWM2 CSP2 Power Stage Power Stage SVI3 PWM8 CSP8 Power Stage Figure 3-1. Simplified Example Application An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications, intellectual property matters and other important disclaimers. PRODUCTION DATA. TPS53685 www.ti.com SLUSEZ5 – DECEMBER 2022 Table of Contents 1 Features............................................................................1 2 Applications..................................................................... 1 3 Description.......................................................................1 4 Revision History.............................................................. 2 5 Device and Documentation Support..............................3 5.1 Documentation Support.............................................. 3 5.2 Receiving Notification of Documentation Updates......3 5.3 Support Resources..................................................... 3 5.4 Trademarks................................................................. 3 5.5 Electrostatic Discharge Caution..................................3 5.6 Glossary......................................................................3 6 Mechanical, Packaging, and Orderable Information.... 4 6.1 Tape and Reel Information..........................................4 4 Revision History NOTE: Page numbers for previous revisions may differ from page numbers in the current version. 2 DATE REVISION NOTES December 2022 * Initial release Submit Document Feedback Copyright © 2022 Texas Instruments Incorporated Product Folder Links: TPS53685 TPS53685 www.ti.com SLUSEZ5 – DECEMBER 2022 5 Device and Documentation Support 5.1 Documentation Support 5.1.1 Related Documentation For related documentation see the following: • Texas Instruments, Dual channel DCAP+ multiphase controllers: TPS53685, TPS536C5 Technical Reference Manual SLUUCN5 5.2 Receiving Notification of Documentation Updates To receive notification of documentation updates, navigate to the device product folder on ti.com. Click on Subscribe to updates to register and receive a weekly digest of any product information that has changed. For change details, review the revision history included in any revised document. 5.3 Support Resources TI E2E™ support forums are an engineer's go-to source for fast, verified answers and design help — straight from the experts. Search existing answers or ask your own question to get the quick design help you need. Linked content is provided "AS IS" by the respective contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of Use. 5.4 Trademarks D-CAP+™, NexFET™, AutoBalance™, TI E2E™ are trademarks of Texas Instruments. PMBus™ is a trademark of SMIF, Inc.. AMD® is a registered trademark of Advanced Micro Devices, Inc.. All trademarks are the property of their respective owners. 5.5 Electrostatic Discharge Caution This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications. 5.6 Glossary TI Glossary This glossary lists and explains terms, acronyms, and definitions. Submit Document Feedback Copyright © 2022 Texas Instruments Incorporated Product Folder Links: TPS53685 3 TPS53685 www.ti.com SLUSEZ5 – DECEMBER 2022 6 Mechanical, Packaging, and Orderable Information The following pages include mechanical, packaging, and orderable information. This information is the most current data available for the designated devices. This data is subject to change without notice and revision of this document. For browser-based versions of this data sheet, refer to the left-hand navigation. 6.1 Tape and Reel Information REEL DIMENSIONS TAPE DIMENSIONS K0 P1 B0 W Reel Diameter Cavity A0 B0 K0 W P1 A0 Dimension designed to accommodate the component width Dimension designed to accommodate the component length Dimension designed to accommodate the component thickness Overall width of the carrier tape Pitch between successive cavity centers Reel Width (W1) QUADRANT ASSIGNMENTS FOR PIN 1 ORIENTATION IN TAPE Sprocket Holes Q1 Q2 Q1 Q2 Q3 Q4 Q3 Q4 User Direction of Feed Pocket Quadrants 4 Device Package Type Package Drawing Pins SPQ Reel Diameter (mm) TPS53685RSBR WQFN RSB 40 3000 330.0 Reel Width W1 (mm) A0 (mm) B0 (mm) K0 (mm) P1 (mm) W (mm) Pin1 Quadrant 12.4 5.25 5.25 1.1 8.0 12.0 Q2 Submit Document Feedback Copyright © 2022 Texas Instruments Incorporated Product Folder Links: TPS53685 TPS53685 www.ti.com SLUSEZ5 – DECEMBER 2022 TAPE AND REEL BOX DIMENSIONS Width (mm) W L H Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) TPS53685RSBR WQFN RSB 40 3000 338.0 355.0 50.0 Submit Document Feedback Copyright © 2022 Texas Instruments Incorporated Product Folder Links: TPS53685 5 TPS53685 www.ti.com SLUSEZ5 – DECEMBER 2022 6 Submit Document Feedback Copyright © 2022 Texas Instruments Incorporated Product Folder Links: TPS53685 TPS53685 www.ti.com SLUSEZ5 – DECEMBER 2022 Submit Document Feedback Copyright © 2022 Texas Instruments Incorporated Product Folder Links: TPS53685 7 TPS53685 www.ti.com SLUSEZ5 – DECEMBER 2022 8 Submit Document Feedback Copyright © 2022 Texas Instruments Incorporated Product Folder Links: TPS53685 PACKAGE OPTION ADDENDUM www.ti.com 15-Dec-2022 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan (2) Lead finish/ Ball material MSL Peak Temp Op Temp (°C) Device Marking (3) Samples (4/5) (6) TPS53685RSBR ACTIVE WQFN RSB 40 3000 RoHS & Green NIPDAUAG Level-2-260C-1 YEAR -40 to 105 TPS 53685 (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may reference these types of products as "Pb-Free". RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption. Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of