TPS53688RSBT

TPS53688 TPS53688 SLUSE79A – APRIL 2020 – REVISED SEPTEMBER 2020 SLUSE79A – APRIL 2020 – REVISED SEPTEMBER 2020 www.ti.com TPS53688 Dual-Channel (N + M ≤ 8 phase) D-CAP+™, Step-Down, Digital Multiphase Controller with VR13.HC SVID 1 Features 3 Description • • • • The TPS53688 is a fully VR13.HC SVID compliant step-down controller with two channels, built-in nonvolatile memory (NVM), and PMBus™ interface, and is fully compatible with TI NexFET™ smart power stages. Advanced control features such as the D-CAP +™ architecture with undershoot reduction (USR) provide fast transient response, low output capacitance, and good dynamic current sharing. The device also provides a novel phase interleaving strategy and dynamic phase shedding, for efficiency improvement across loading conditions. Adjustable control of output voltage slew rate and adaptive voltage positioning are natively supported. In addition, the device supports the PMBus communication interface, for reporting the telemetry of voltage, current, power, temperature, and fault conditions to the host system. All programmable parameters can be configured through the PMBus interface and stored in NVM as new default values, to minimize the external component count. • • • • • • • • • • • • • Input Voltage Range: 4.5 V to 17 V Output Voltage Range: 0.25 V to 5.5 V Intel® VR13.HC SVID Compliant Dual Output Supporting N+M Phase Configurations (N+M ≤ 8, M ≤ 4) Enhanced D-CAP+™ Control to Provide Super Transient Performance with Excellent Dynamic Current Sharing Programmable Loop Compensation Programmable Phase-Firing Order Individual Phase Current Calibrations and Reporting Dynamic Phase Shedding with Programmable Thresholds for Optimizing Efficiency at Light and Heavy Loads Fast Phase-Adding for Undershoot Reduction (USR) Driverless PWM Architecture for Efficient HighFrequency Switching Fully Compatible with TI NextFET™ Power Stage for High-Density Solutions Accurate, Adjustable, Adaptive Voltage Positioning (AVP) Patented AutoBalance™ Phase Current Balancing Cycle-by-cycle Per-Phase Current Limit PMBus™ v1.3.1 System Interface for Telemetry of Voltage, Current, Power, Temperature, and Fault Conditions 5 mm × 5 mm, 40-Pin, QFN Package The TPS53688 device is offered in a thermally enhanced 40-pin QFN packaged and is rated to operate from –40°C to 125°C. Device Information TPS53688 (1) QFN (40) 5 mm × 5 mm TPS536xx PWM1 Data center & enterprise computing rack server Hardware accelerator Network interface card (NIC) ASIC and high-performance client BODY SIZE (NOM) For all available packages, see the orderable addendum at the end of the data sheet. 2 Applications • • • • PACKAGE(1) PART NUMBER CSP1 PMBus PWM2 CSP2 PWM8 CSP8 Power Stage Power Stage Power Stage Simplified Schematic An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications, Submit Document Feedback Copyright © 2020 Texas Instruments Incorporated intellectual property matters and other important disclaimers. PRODUCTION DATA. Product Folder Links: TPS53688 1 TPS53688 www.ti.com SLUSE79A – APRIL 2020 – REVISED SEPTEMBER 2020 Table of Contents 1 Features............................................................................1 2 Applications..................................................................... 1 3 Description.......................................................................1 4 Revision History.............................................................. 2 5 Device and Documentation Support..............................3 5.1 Receiving Notification of Documentation Updates......3 5.2 Support Resources..................................................... 3 5.3 Trademarks................................................................. 3 5.4 Electrostatic Discharge Caution..................................3 5.5 Glossary......................................................................3 6 Mechanical, Packaging, and Orderable Information.... 4 4 Revision History NOTE: Page numbers for previous revisions may differ from page numbers in the current version. Changes from Revision (May 2020) to Revision A (September 2020) Page • Updated the numbering format for tables, figures, and cross-references throughout the document..................1 • Changed document status from Advance Information to Production Data ........................................................1 2 Submit Document Feedback Copyright © 2020 Texas Instruments Incorporated Product Folder Links: TPS53688 TPS53688 www.ti.com SLUSE79A – APRIL 2020 – REVISED SEPTEMBER 2020 5 Device and Documentation Support 5.1 Receiving Notification of Documentation Updates To receive notification of documentation updates, navigate to the device product folder on ti.com. Click on Subscribe to updates to register and receive a weekly digest of any product information that has changed. For change details, review the revision history included in any revised document. 5.2 Support Resources TI E2E™ support forums are an engineer's go-to source for fast, verified answers and design help — straight from the experts. Search existing answers or ask your own question to get the quick design help you need. Linked content is provided "AS IS" by the respective contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of Use. 5.3 Trademarks D-CAP+™, NextFET™, AutoBalance™, NexFET™, the D-CAP+™, and TI E2E™ are trademarks of Texas Instruments. PMBus™ is a trademark of SMIF, Inc.. Intel® is a registered trademark of Intel Corporation. All other trademarks are the property of their respective owners. 5.4 Electrostatic Discharge Caution This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications. 5.5 Glossary TI Glossary This glossary lists and explains terms, acronyms, and definitions. Submit Document Feedback Copyright © 2020 Texas Instruments Incorporated Product Folder Links: TPS53688 3 TPS53688 www.ti.com SLUSE79A – APRIL 2020 – REVISED SEPTEMBER 2020 6 Mechanical, Packaging, and Orderable Information The following pages include mechanical, packaging, and orderable information. This information is the most current data available for the designated devices. This data is subject to change without notice and revision of this document. For browser-based versions of this data sheet, refer to the left-hand navigation. 4 Submit Document Feedback Copyright © 2020 Texas Instruments Incorporated Product Folder Links: TPS53688 PACKAGE OPTION ADDENDUM www.ti.com 28-Sep-2021 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan (2) Lead finish/ Ball material MSL Peak Temp Op Temp (°C) Device Marking (3) (4/5) (6) TPS53688RSBR ACTIVE WQFN RSB 40 3000 RoHS & Green Call TI | NIPDAUAG Level-2-260C-1 YEAR -40 to 125 TPS 53688 TPS53688RSBT ACTIVE WQFN RSB 40 250 RoHS & Green Call TI | NIPDAUAG Level-2-260C-1 YEAR -40 to 125 TPS 53688 (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may reference these types of products as "Pb-Free". RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption. Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of