0
登录后你可以
  • 下载海量资料
  • 学习在线课程
  • 观看技术视频
  • 写文章/发帖/加入社区
创作中心
发布
  • 发文章

  • 发资料

  • 发帖

  • 提问

  • 发视频

创作活动
TPS55010EVM-009

TPS55010EVM-009

  • 厂商:

    BURR-BROWN(德州仪器)

  • 封装:

    -

  • 描述:

    EVAL MODULE FOR TPS55010-009

  • 数据手册
  • 价格&库存
TPS55010EVM-009 数据手册
User's Guide SLVU459B – May 2011 – Revised July 2018 TPS55010EVM-009, Low-Power, Isolated Fly-Buck™ Converter This user's guide contains information for the TPS55010EVM-009 evaluation module (PWR009). Included are the performance specifications, the schematic, and the bill of materials for the TPS55010EVM-009. 1 2 3 4 Contents Introduction ................................................................................................................... 2 Test Setup and Results ..................................................................................................... 3 Board Layout ................................................................................................................. 8 Schematic and Bill of Materials ........................................................................................... 10 List of Figures 1 TPS55010EVM-009 Efficiency ............................................................................................. 4 2 TPS55010EVM-009 Load Regulation ..................................................................................... 4 3 TPS55010EVM-009 Line Regulation, VIN = 5 V 4 TPS55010EVM-009 Loop Response 11 ......................................................................... 5 ..................................................................................... 5 TPS55010EVM-009 Output Voltage Ripple ............................................................................. 6 TPS55010EVM-009 Input Voltage Ripple ................................................................................ 6 TPS55010EVM-009 Start-Up With Rising VIN ........................................................................... 7 TPS55010EVM-009 Top Assembly ....................................................................................... 8 TPS55010EVM-009 Top Copper .......................................................................................... 9 TPS55010EVM-009 Bottom Copper ...................................................................................... 9 TPS55010EVM-009 Schematic .......................................................................................... 10 1 Input Voltage and Output Current Summary ............................................................................. 2 2 TPS55010EVM-009 Electrical and Performance Specification ........................................................ 2 3 EVM Connectors and Test Points ......................................................................................... 3 4 Bill of Materials 5 6 7 8 9 10 List of Tables ............................................................................................................. 11 Trademarks Fly-Buck, PowerPAD are trademarks of Texas Instruments. SLVU459B – May 2011 – Revised July 2018 Submit Documentation Feedback TPS55010EVM-009, Low-Power, Isolated Fly-Buck™ Converter Copyright © 2011–2018, Texas Instruments Incorporated 1 Introduction 1 www.ti.com Introduction This user's guide contains background information for the TPS55010 as well as support documentation for the TPS55010EVM-009 evaluation module (PWR009). Included are the performance specifications, the schematic, and the bill of materials for the TPS55010EVM-009. 1.1 Background The TPS55010 dc/dc converter is designed to provide up to a 200-mA output from an input voltage source of 4.5 V to 5.5 V. Rated input voltage and output current range for the evaluation module are given in Table 1. This evaluation module is designed to demonstrate the small, printed-circuit-board areas that may be achieved when designing with the TPS55010 regulator. The switching frequency is externally set at a nominal 350 kHz. Both high-side and low-side MOSFETs are incorporated inside the TPS55010 package along with the gate drive circuitry. The low drain-to-source on-resistance of the MOSFETs allows the TPS55010 to achieve good efficiency. The compensation components are external to the integrated circuit (IC), and an external divider allows for an adjustable output voltage. Additionally, the TPS55010 provides adjustable slow-start and undervoltage lockout inputs. The absolute maximum input voltage for the TPS55010EVM-009 is 6 V. Table 1. Input Voltage and Output Current Summary 1.2 EVM Input Voltage Range Output Current Range TPS55010EVM-009 VIN = 4.5 V to 6 V 0 A to 200 mA Performance Specification Summary A summary of the TPS55010EVM-009 performance specifications is provided in Table 2. Specifications are given for an input voltage of VIN = 5 V and an output voltage of 5 V, unless otherwise specified. The TPS55010EVM-009 is designed and tested for VIN = 4.5 V to 6 V. The ambient temperature is 25°C for all measurements, unless otherwise noted. Table 2. TPS55010EVM-009 Electrical and Performance Specification Parameter Condition Output voltage 4.5 V ≤ VIN ≤ 5.5 V, ILOAD ≤ 200 mA Output current 4.5 V ≤ VIN ≤ 5.5 V Output ripple voltage, peak-to-peak ILOAD = 200 mA VIN = 5 V Switching frequency ILOAD = 200 mA Efficiency, end-to-end ILOAD = 200 mA Line regulation ILOAD = 200 mA Load regulation ILOAD = 10 mA to 200 mA Control loop crossover frequency ILOAD = 200 mA 5V MIN TYP MAX 4.5 5 6 0.2 V A 20 mV VIN = 5 V 350 kHz VIN = 5 V 85% 4.5 V ≤ VIN ≤ 5.5 V ±0.06 VIN = 5 V ±0.3 Slow start Operating temperature 1.3 UNIT –25 V V 25 kHz 40 ms 85 °C Modifications These evaluation modules are designed to provide access to the features of the TPS55010. Some modifications can be made to this module. 1.3.1 Input Voltage Range TPS55010EVM-009 can operate from an input voltage of 5 V or 3.3 V, nominally. For 3.3-V nominal input voltage, remove R3 (allows the EVM to start up from lower input voltages), and change R9 to 511 kΩ (changes switching frequency to 200 kHz). 2 TPS55010EVM-009, Low-Power, Isolated Fly-Buck™ Converter Copyright © 2011–2018, Texas Instruments Incorporated SLVU459B – May 2011 – Revised July 2018 Submit Documentation Feedback Test Setup and Results www.ti.com 1.3.2 Operating Frequency, Slow-Start, and UVLO The operating frequency, slow-start time, and UVLO voltage can be adjusted. R9 sets the operating frequency, C5 sets the slow-start time, and the resistor divider of R2 and R3 sets the UVLO start and stop voltages. See the TPS55010 data sheet (SLVSAV0) for details on adjusting these parameters. 1.3.3 Zener Diode and Output Snubber Under no-load conditions, VOUT can get as high as 15 V if output voltage limiting is not provided. TPS55010EVM-009 provides a Zener diode (5.6 V nominal) in series with a resistor to limit the output voltage at J2 to 6 V. The Zener diode presents a negligible load to the circuit with external loads above approximately 3 mA at J2. Placeholders for an R-C snubber are provided across the output rectifier. Although the snubber impacts efficiency, it can be used to dampen the ringing across the rectifier. 2 Test Setup and Results This section describes how to properly connect, set up, and use the TPS55010EVM-009 evaluation module. The section also includes test results typical for the evaluation module and covers efficiency, output voltage regulation, load transients, loop response, output ripple, input ripple, and start-up. 2.1 Input/Output Connections The TPS55010EVM-009 is provided with input/output connectors and test points as shown in Table 3. A power supply capable of supplying 0.5 A must be connected to J1 through a pair of 20 AWG wires. The load must be connected to J2 through a pair of 20 AWG wires. Test-point TP2 provides a place to monitor the VIN input voltages with TP5 providing a convenient ground reference. TP10 is used to monitor the output voltage with TP4 as the ground reference. Table 3. EVM Connectors and Test Points Reference Designator Label J1 INPUT J2 OUTPUT Description VIN connector VOUT connector TP2 VIN Input VIN circuit point TP5 GND Input GND circuit point TP10 VOUT Output VOUT circuit point TP4 AGND Output AGND circuit point TP1 FAULT FAULT pin TP3 EN EN pin TP6 SS SLOW START pin TP7 PH PH pin TP8 LOOP TP9 VC TP12 GND SLVU459B – May 2011 – Revised July 2018 Submit Documentation Feedback Injection point for loop measurements Regulated voltage Input GND circuit point TPS55010EVM-009, Low-Power, Isolated Fly-Buck™ Converter Copyright © 2011–2018, Texas Instruments Incorporated 3 Test Setup and Results 2.2 www.ti.com Efficiency Figure 1 shows the efficiency for the TPS55010EVM-009 at an ambient temperature of 25°C. 100 90 80 Efficiency (%) 70 60 50 40 30 20 10 Vin = 5 V 0 0 0.05 0.1 0.15 0.2 0.25 0.3 Load Current (A) C001 Figure 1. TPS55010EVM-009 Efficiency The efficiency may be lower at higher ambient temperatures, due to temperature variation in the drain-tosource resistance of the internal MOSFET. 2.3 Load Regulation Figure 2 shows the load regulation for the TPS55010EVM-009 at an ambient temperature of 25°C. 6.5 Vin = 5 V Output Voltage (V) 6 5.5 5 4.5 4 0 0.05 0.1 0.15 0.2 0.25 0.3 Load Current (A) C002 Figure 2. TPS55010EVM-009 Load Regulation 4 TPS55010EVM-009, Low-Power, Isolated Fly-Buck™ Converter Copyright © 2011–2018, Texas Instruments Incorporated SLVU459B – May 2011 – Revised July 2018 Submit Documentation Feedback Test Setup and Results www.ti.com 2.4 Line Regulation Figure 3 shows the line regulation for the TPS55010EVM-009 at an ambient temperature of 25°C. 6 Output Voltage (V) 5.5 5 4.5 Iout = 10 mA Iout = 50 mA Iout = 200 mA 4 4 4.5 5 5.5 6 Input Voltage (V) C003 Figure 3. TPS55010EVM-009 Line Regulation, VIN = 5 V 2.5 Loop Characteristics 60 180 40 120 20 60 0 0 0-mA Load Gain ±20 ±60 200-mA Load Gain 0-mA Load Phase ±40 Phase (ƒ) Gain (dB) The TPS55010EVM-009 loop-response characteristics are shown in Figure 4. Gain and phase plots are shown for VIN = 5 V and a load current of both 0 mA and 200 mA. At a 0-mA load, the unity gain bandwidth is 32.5 kHz and phase margin is 53 degrees. At a 200-mA load, the unity gain bandwidth is 25.2 kHz and the phase margin is 82 degrees. ±120 200-mA Load Phase ±60 ±180 10 100 1k 10k 100k 1M Frequency (Hz) C004 Figure 4. TPS55010EVM-009 Loop Response SLVU459B – May 2011 – Revised July 2018 Submit Documentation Feedback TPS55010EVM-009, Low-Power, Isolated Fly-Buck™ Converter Copyright © 2011–2018, Texas Instruments Incorporated 5 Test Setup and Results 2.6 www.ti.com Output Voltage Ripple The TPS55010EVM-009 output voltage ripple is shown in Figure 5 . The output current is the rated full load of 200 mA and VIN = 5 V. The ripple voltage is measured directly across the output capacitors. Figure 5. TPS55010EVM-009 Output Voltage Ripple 2.7 Input Voltage Ripple The TPS55010EVM-009 input voltage ripple is shown in Figure 6 . The output current is the rated full load of 200 mA and VIN = 5 V. The ripple voltage is measured directly across the input capacitors. Figure 6. TPS55010EVM-009 Input Voltage Ripple 2.8 Powering Up Figure 7 shows the start-up waveforms with rising VIN and the output loaded with 22 Ω. In Figure 7, the output starts to rise when VIN reaches the rising UVLO of 4.5 V. 6 TPS55010EVM-009, Low-Power, Isolated Fly-Buck™ Converter Copyright © 2011–2018, Texas Instruments Incorporated SLVU459B – May 2011 – Revised July 2018 Submit Documentation Feedback Test Setup and Results www.ti.com VIN VIN = 2 V/div EN VEN = 500 mV/div VO = 2 V/div VOUT t - Time = 5 ms/div Figure 7. TPS55010EVM-009 Start-Up With Rising VIN SLVU459B – May 2011 – Revised July 2018 Submit Documentation Feedback TPS55010EVM-009, Low-Power, Isolated Fly-Buck™ Converter Copyright © 2011–2018, Texas Instruments Incorporated 7 Board Layout 3 www.ti.com Board Layout This section provides a description of the TPS55010EVM-009, board layout, and layer illustrations. 3.1 Layout The board layout for the TPS55010EVM-009 is shown in Figure 8 through Figure 10. The top-side layer of the EVM is laid out in a manner typical of a user application. The top and bottom layers are 2-oz copper. A basic set of layout guidelines include: • Place the input capacitors close to the TPS55010 VIN and GND terminals. • Arrange the transformer, input capacitors, and the regulated voltage capacitor in a manner to minimize loop area. • Connect the GND end of the analog control circuitry (COMP, VSENSE, RT/CLK, and SS pins) together apart from the main power GND. Reference this analog GND trace/shape to the power GND (PowerPAD™ IC package of TPS55010) at a single point. • The PowerPAD™ package of the TPS55010 provides a means to remove heat from the device and must be connected to the GND plane with multiple vias as shown in the TPS55010 data sheet, SLVSAV0. Figure 8. TPS55010EVM-009 Top Assembly 8 TPS55010EVM-009, Low-Power, Isolated Fly-Buck™ Converter Copyright © 2011–2018, Texas Instruments Incorporated SLVU459B – May 2011 – Revised July 2018 Submit Documentation Feedback Board Layout www.ti.com Figure 9. TPS55010EVM-009 Top Copper Figure 10. TPS55010EVM-009 Bottom Copper 3.2 Estimated Circuit Area The estimated printed-circuit board area for the components used in this design is 0.70 in2. This area does not include test points or connectors. SLVU459B – May 2011 – Revised July 2018 Submit Documentation Feedback TPS55010EVM-009, Low-Power, Isolated Fly-Buck™ Converter Copyright © 2011–2018, Texas Instruments Incorporated 9 Schematic and Bill of Materials 4 www.ti.com Schematic and Bill of Materials This section presents the TPS55010EVM-009 schematic and bill of materials. 4.1 Schematic Figure 11 is the schematic for the TPS55010EVM-009. EN TP3 FAULT TP1 VIN TP2 R1 100k AGND TP4 1 R2 71.5k C2 0.1µF R3 26.7k 1 2 3 4 15 13 14 VIN1 VIN2 GND C3 0.1µF BOOT GND TP5 C1 47µF 16 EN 220µF C4 17 FAULT + C12 VIN 2 GND PWRPD VIN 5 +/- 0.5V J1 VIN PH U1 TPS55010RTE PH PH SS GND 12 1000pF SS TP6 D1 BZT52C5V6 PH TP7 T1 750311880 11 2 10 9 7 C5 0.1uF RT/CLK COMP GND VSENSE 6 C6 49.9 TP8 LOOP 8 R7 100k VOUT 5 +/- 0.5V 200mA R4 200 J2 200 1 1 AGND 2 +VOUT 5 GND TP12 R8 10.5k 1000pF D2 TP9 VC R6 7 6 C7 47µF C10 3900pF 8 R5 4 5 2kV B120-13-F TP10 VOUT C8 10µF C9 10µF NOTES C11 100pF R9 280k R10 61.9k 1 Not Installed Figure 11. TPS55010EVM-009 Schematic 10 TPS55010EVM-009, Low-Power, Isolated Fly-Buck™ Converter SLVU459B – May 2011 – Revised July 2018 Submit Documentation Feedback Copyright © 2011–2018, Texas Instruments Incorporated Schematic and Bill of Materials www.ti.com 4.2 Bill of Materials Table 4 presents the bill of materials for the TPS55010EVM-009. Table 4. Bill of Materials Count RefDes Value Description Size Part Number MFR 2 C1, C7 47µF Capacitor, Ceramic, 10V, X5R, 10% 1210 Std Std 3 C2, C3, C5 0.1µF Capacitor, Ceramic, Low Inductance, 16V, X7R, 10% 0603 Std Std 1 C4 1000pF Capacitor, Ceramic, 2kV, X7R, 10% 1210 Std Std 1 C6 1000pF Capacitor, Ceramic, Low Inductance, 16V, X7R, 10% 0603 Std Std 2 C8, C9 10µF Capacitor, Ceramic, 10V, X5R, 10% 1210 Std Std 1 C10 3900pF Capacitor, Ceramic, 50V, X7R, 10% 0603 Std Std 1 C11 100pF Capacitor, Ceramic, 50V, NP0, 5% 0603 Std Std 1 C12 220µF Capacitor, Aluminum, 6.3V, ±20% 0.260 x 0.276 inch EEE-FK0J221P Panasonic 1 D1 BZT52C5V6 Diode, Zener, Planar Power, 500mW, 5.6V SOD-123 BZT52C5V6-7-F Diodes, Inc 1 D2 B120-13-F Diode, Schottky, 1000-mA, 20-V SMA B120-13-F Diodes, Inc 2 J1, J2 ED555/2DS Terminal Block, 2-pin, 6-A, 3.5mm 0.27 x 0.25 inch ED555/2DS OST 2 R1, R7 100k Resistor, Chip, 1/16W, 1% 0603 Std Std 1 R2 71.5k Resistor, Chip, 1/16W, 1% 0603 Std Std 1 R3 26.7k Resistor, Chip, 1/16W, 1% 0603 Std Std 1 R4 200 Resistor, Chip, 1/16W, 1% 0603 Std Std 1 R5 49.9 Resistor, Chip, 1/16W, 1% 0603 Std Std 1 R6 200 Resistor, Chip, 1/16W, 1% 0603 Std Std 0 R8 DNP Resistor, Chip, 1/16W, 1% 0603 Std Std 1 R9 280k Resistor, Chip, 1/16W, 1 0603 Std Std 1 R10 61.9k Resistor, Chip, 1/16W, 1 0603 Std Std 4 TP1, TP3, TP6 5012 Test Point, White, Thru Hole 0.125 x 0.125 inch 5010 Keystone 3 TP2, TP9, TP10 5010 Test Point, Black, Thru Hole 0.125 x 0.125 inch 5010 Keystone 3 TP4, TP5, TP12 5011 Test Point, Black, Thru Hole 0.125 x 0.125 inch 5011 Keystone 2 TP7, TP8 5013 Test Point, Orange, Thru Hole 0.125 x 0.125 inch 5013 Keystone 1 T1 2.5µH Transformer, ±10% 0.410 x 0.510 inch 750311880 Wurth 1 U1 TPS55010RTE IC, DC-DC Converter QFN-16 TPS55010RTE TI 1 -- PCB, 2.5 In x 1.5 In x 0.062 In 2.5" x 2.5" x 0.062" PWR009 Any SLVU459B – May 2011 – Revised July 2018 Submit Documentation Feedback TPS55010EVM-009, Low-Power, Isolated Fly-Buck™ Converter Copyright © 2011–2018, Texas Instruments Incorporated 11 Revision History www.ti.com Revision History NOTE: Page numbers for previous revisions may differ from page numbers in the current version. Changes from A Revision (June 2014) to B Revision .................................................................................................... Page • 12 Changed schematic values of R7 from 16.5k to 100k and R10 from 10.0 k to 61.9k. Revision History ......................................... 10 SLVU459B – May 2011 – Revised July 2018 Submit Documentation Feedback Copyright © 2011–2018, Texas Instruments Incorporated Revision History www.ti.com Changes from Original (May 2011) to A Revision ................................................................................................................ Page • Changed 7 V to 6 V in background section. ........................................................................................... 2 • Changed 3 V to 4.5 V in the input voltage and output current summary table and in the first paragraph of the performance specification summary section. .......................................................................................................... 2 • Changed content of the electrical and performance specification table............................................................ 2 • Changed efficiency graph. ............................................................................................................... 4 • Changed load regulation graph. ......................................................................................................... 4 • Deleted line regulation, VIN = 3.3 V graph. ............................................................................................ 5 • Changed line regulation graph. .......................................................................................................... 5 • Changed PCB layout images. ........................................................................................................... 8 • Changed schematic diagram. .......................................................................................................... 10 • Changed BOM: moved C7, changed content of C10 and C11 rows. ............................................................ 11 SLVU459B – May 2011 – Revised July 2018 Submit Documentation Feedback Revision History Copyright © 2011–2018, Texas Instruments Incorporated 13 IMPORTANT NOTICE FOR TI DESIGN INFORMATION AND RESOURCES Texas Instruments Incorporated (‘TI”) technical, application or other design advice, services or information, including, but not limited to, reference designs and materials relating to evaluation modules, (collectively, “TI Resources”) are intended to assist designers who are developing applications that incorporate TI products; by downloading, accessing or using any particular TI Resource in any way, you (individually or, if you are acting on behalf of a company, your company) agree to use it solely for this purpose and subject to the terms of this Notice. TI’s provision of TI Resources does not expand or otherwise alter TI’s applicable published warranties or warranty disclaimers for TI products, and no additional obligations or liabilities arise from TI providing such TI Resources. TI reserves the right to make corrections, enhancements, improvements and other changes to its TI Resources. You understand and agree that you remain responsible for using your independent analysis, evaluation and judgment in designing your applications and that you have full and exclusive responsibility to assure the safety of your applications and compliance of your applications (and of all TI products used in or for your applications) with all applicable regulations, laws and other applicable requirements. You represent that, with respect to your applications, you have all the necessary expertise to create and implement safeguards that (1) anticipate dangerous consequences of failures, (2) monitor failures and their consequences, and (3) lessen the likelihood of failures that might cause harm and take appropriate actions. You agree that prior to using or distributing any applications that include TI products, you will thoroughly test such applications and the functionality of such TI products as used in such applications. TI has not conducted any testing other than that specifically described in the published documentation for a particular TI Resource. You are authorized to use, copy and modify any individual TI Resource only in connection with the development of applications that include the TI product(s) identified in such TI Resource. NO OTHER LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE TO ANY OTHER TI INTELLECTUAL PROPERTY RIGHT, AND NO LICENSE TO ANY TECHNOLOGY OR INTELLECTUAL PROPERTY RIGHT OF TI OR ANY THIRD PARTY IS GRANTED HEREIN, including but not limited to any patent right, copyright, mask work right, or other intellectual property right relating to any combination, machine, or process in which TI products or services are used. Information regarding or referencing third-party products or services does not constitute a license to use such products or services, or a warranty or endorsement thereof. Use of TI Resources may require a license from a third party under the patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI. TI RESOURCES ARE PROVIDED “AS IS” AND WITH ALL FAULTS. TI DISCLAIMS ALL OTHER WARRANTIES OR REPRESENTATIONS, EXPRESS OR IMPLIED, REGARDING TI RESOURCES OR USE THEREOF, INCLUDING BUT NOT LIMITED TO ACCURACY OR COMPLETENESS, TITLE, ANY EPIDEMIC FAILURE WARRANTY AND ANY IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE, AND NON-INFRINGEMENT OF ANY THIRD PARTY INTELLECTUAL PROPERTY RIGHTS. TI SHALL NOT BE LIABLE FOR AND SHALL NOT DEFEND OR INDEMNIFY YOU AGAINST ANY CLAIM, INCLUDING BUT NOT LIMITED TO ANY INFRINGEMENT CLAIM THAT RELATES TO OR IS BASED ON ANY COMBINATION OF PRODUCTS EVEN IF DESCRIBED IN TI RESOURCES OR OTHERWISE. IN NO EVENT SHALL TI BE LIABLE FOR ANY ACTUAL, DIRECT, SPECIAL, COLLATERAL, INDIRECT, PUNITIVE, INCIDENTAL, CONSEQUENTIAL OR EXEMPLARY DAMAGES IN CONNECTION WITH OR ARISING OUT OF TI RESOURCES OR USE THEREOF, AND REGARDLESS OF WHETHER TI HAS BEEN ADVISED OF THE POSSIBILITY OF SUCH DAMAGES. You agree to fully indemnify TI and its representatives against any damages, costs, losses, and/or liabilities arising out of your noncompliance with the terms and provisions of this Notice. This Notice applies to TI Resources. Additional terms apply to the use and purchase of certain types of materials, TI products and services. These include; without limitation, TI’s standard terms for semiconductor products http://www.ti.com/sc/docs/stdterms.htm), evaluation modules, and samples (http://www.ti.com/sc/docs/sampterms.htm). Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265 Copyright © 2018, Texas Instruments Incorporated
TPS55010EVM-009 价格&库存

很抱歉,暂时无法提供与“TPS55010EVM-009”相匹配的价格&库存,您可以联系我们找货

免费人工找货