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TPS56628DDAR

TPS56628DDAR

  • 厂商:

    BURR-BROWN(德州仪器)

  • 封装:

    SOIC8_150MIL_EP

  • 描述:

    是降压型-40℃~+85℃@(TA)1降压可调0.76V~5.5V 6A 4.5V~18V 650kHz SOIC-8-EP DC-DC转换器ROHS

  • 数据手册
  • 价格&库存
TPS56628DDAR 数据手册
TPS56628 www.ti.com SLVSC94A – OCTOBER 2013 – REVISED DECEMBER 2013 4.5V to 18V Input, 6-A Synchronous Step-Down Converter with Eco-mode™ Check for Samples: TPS56628 FEATURES DESCRIPTION • The TPS56628 is an adaptive on-time D-CAP2™ mode synchronous buck converter. The TPS56628 enables system designers to complete the suite of various end-equipment power bus regulators with a cost effective, low component count, low standby current solution. The main control loop for the TPS56628 uses the D-CAP2™ mode control that provides a fast transient response with no external compensation components. The adaptive on-time control supports seamless transition between PWM mode at higher load conditions and Eco-mode™ operation at light loads. Eco-mode™ allows the TPS56628 to maintain high efficiency during lighter load conditions. The TPS56628 also has a proprietary circuit that enables the device to adopt to both low equivalent series resistance (ESR) output capacitors, such as POSCAP or SP-CAP, and ultra-low ESR ceramic capacitors. The device operates from 4.5-V to 18-V VIN input. The output voltage can be programmed between 0.76 V and 5.5 V. The TPS56628 is available in the 8-pin DDA package, and designed to operate from –40°C to 85°C. 1 23 • • • • • • • • • • • • D-CAP2™ Mode Enables Fast Transient Response Low Output Ripple and Allows Ceramic Output Capacitor Wide VIN Input Voltage Range: 4.5 V to 18 V Output Voltage Range: 0.76 V to 5.5 V Highly Efficient Integrated FETs Optimized for Lower Duty Cycle Applications – 36 mΩ (High Side) and 28 mΩ (Low Side) High Efficiency, less than 10 μA at shutdown High Initial Bandgap Reference Accuracy Pre-Biased Soft Start 650-kHz Switching Frequency (fSW) Cycle By Cycle Over Current Limit Auto-Skip Eco-mode™ for High Efficiency at Light Load Power Good Output Fixed Soft Start: 1.0 ms APPLICATIONS • Wide Range of Applications for Low Voltage System – Digital TV Power Supply – High Definition Blu-ray Disc™ Players – Networking Home Terminal – Digital Set Top Box (STB) VIN Vout (50mV/div) TPS56628DDA EN 1 VIN EN VOUT 2 VBST VFB 3 SW VREG5 4 GND PG 8 7 6 5 VOUT Iout (2A/div) PwPd 9 100 μs /div 1 2 3 Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. D-CAP2, Eco-mode are trademarks of Texas Instruments. Blu-ray Disc is a trademark of Blu-ray Disc Association. PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright © 2013, Texas Instruments Incorporated TPS56628 SLVSC94A – OCTOBER 2013 – REVISED DECEMBER 2013 www.ti.com These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates. ORDERING INFORMATION (1) (2) (3) (1) (2) (3) TA PACKAGE –40°C to 85°C DDA ORDERABLE PART NUMBER TRANSPORT MEDIA PIN TPS56628DDA Tube 8 TPS56628DDAR Tape and Reel For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI web site at www.ti.com. Package drawings, thermal data, and symbolization are available at www.ti.com/packaging. All package options have Cu NIPDAU lead/ball finish. ABSOLUTE MAXIMUM RATINGS over operating free-air temperature range (unless otherwise noted) (1) VALUE Input voltage range Output voltage range MAX VIN, EN –0.3 20 VBST –0.3 26 VBST (10 ns transient) –0.3 28 VBST (vs SW) –0.3 6.5 VFB, PG –0.3 6.5 SW –2 20 SW (10 ns transient) –3 22 –0.3 6.5 –0.2 0.2 V 2 kV 500 V VREG5 Voltage from GND to thermal pad, Vdiff Electrostatic discharge Human Body Model (HBM) Charged Device Model (CDM) Operating junction temperature, TJ –40 150 Storage temperature, Tstg –55 150 (1) UNIT MIN V V °C Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. THERMAL INFORMATION THERMAL METRIC TPS56628 DDA (8 PINS) θJA Junction-to-ambient thermal resistance 43.5 θJCtop Junction-to-case (top) thermal resistance 49.4 θJB Junction-to-board thermal resistance 25.6 ψJT Junction-to-top characterization parameter 7.4 ψJB Junction-to-board characterization parameter 25.5 θJCbot Junction-to-case (bottom) thermal resistance 5.2 2 UNITS °C/W Copyright © 2013, Texas Instruments Incorporated Product Folder Links :TPS56628 TPS56628 www.ti.com SLVSC94A – OCTOBER 2013 – REVISED DECEMBER 2013 RECOMMENDED OPERATING CONDITIONS over operating free-air temperature range, (unless otherwise noted) VIN Supply input voltage range VI Input voltage range MIN MAX 4.5 18 VBST –0.1 24 VBST (10 ns transient) –0.1 27 VBST(vs SW) –0.1 6.0 PG –0.1 5.7 EN –0.1 18 VFB –0.1 5.5 SW –1.8 18 SW (10 ns transient) VO Output voltage range VREG5 IO Output Current range IVREG5 TA Operating free-air temperature –3 22 –0.1 5.7 UNIT V V V 0 5 mA –40 85 °C TYP MAX UNIT ELECTRICAL CHARACTERISTICS over operating free-air temperature range, VIN = 12 V (unless otherwise noted) PARAMETER TEST CONDITIONS MIN SUPPLY CURRENT IVIN Operating - non-switching supply current VIN current, TA = 25°C, EN = 5 V, VFB = 0.8 V 950 1400 μA IVINSDN Shutdown supply current VIN current, TA = 25°C, EN = 0 V 3 10 μA LOGIC THRESHOLD VEN REN EN high-level input voltage EN EN low-level input voltage EN EN pin resistance to GND VEN = 12 V 1.6 200 V 400 0.6 V 800 kΩ VFB VOLTAGE TA = 25°C, VO = 1.05 V, IO = 10 mA, Ecomode™ operation VFBTH IVFB VFB threshold voltage 772 TA = 25°C, VO = 1.05 V, continuous mode operation 757 TA = -40 to 85°C, VO = 1.05 V, continuous mode operation (1) 751 VFB input current VFB = 0.8 V, TA = 25°C VVREG5 VREG5 output voltage TA = 25°C, 6 V < VIN < 18 V, 0 < IVREG5 < 5 mA 5.2 IVREG5 Output current VIN = 6 V, VREG5 = 4.0 V, TA = 25°C 20 765 mV 773 mV 779 mV 0 ±0.15 μA 5.5 5.7 V VREG5 OUTPUT mA VFB VOLTAGE AND DISCHARGE RESISTANCE RDISCHG 500 800 Ω VOUT discharge resistance EN = 0 V, SW = 0.5 V, TA = 25°C High side switch resistance 25°C, VBST - SW = 5.5 V 36 mΩ Low side switch resistance 25°C 28 mΩ Current limit L out = 1.5 μH (1) MOSFET RDS(on) CURRENT LIMIT IOCL (1) 6.6 7.3 8.9 A Not production tested. 3 Copyright © 2013, Texas Instruments Incorporated Product Folder Links :TPS56628 TPS56628 SLVSC94A – OCTOBER 2013 – REVISED DECEMBER 2013 www.ti.com ELECTRICAL CHARACTERISTICS (continued) over operating free-air temperature range, VIN = 12 V (unless otherwise noted) PARAMETER TEST CONDITIONS MIN TYP MAX UNIT THERMAL SHUTDOWN TSDN Thermal shutdown threshold Shutdown temperature Hysteresis (2) 165 (2) °C 35 ON-TIME TIMER CONTROL tON On time VIN = 12 V, VO = 1.05 V 150 tOFF(MIN) Minimum off time TA = 25°C, VFB = 0.7 V 260 310 ns ns Soft-start time Internal soft-start time 0.7 1.0 1.3 ms 85% 90% 95% SOFT START TSS POWER GOOD VTHPG PG threshold IPG PG sink current VFB rising (Good) VFB falling (Fault) PG = 5 V 85% 2 4 mA HICCUP AND OVER-VOLTAGE PROTECTION VOVP Output OVP threshold OVP Detect (L > H) 125% VHICCUP Output Hiccup threshold Hiccup detect (H > L) THICCUPDELAY Output Hiccup delay To hiccup state 250 THICCUPENDELAY Output Hiccup Enable delay Relative to soft-start time x1.7 65% µs UVLO UVLO (2) UVLO threshold Wake up VREG5 voltage 3.45 3.75 4.05 Hysteresis VREG5 voltage 0.13 0.32 0.48 V Not production tested. 4 Copyright © 2013, Texas Instruments Incorporated Product Folder Links :TPS56628 TPS56628 www.ti.com SLVSC94A – OCTOBER 2013 – REVISED DECEMBER 2013 DEVICE INFORMATION DDA PACKAGE (TOP VIEW) 1 EN VIN 8 EXPOSED THERMAL PAD 2 VFB VBST 7 SW 6 GND 5 TPS56628 DDA 3 VREG5 4 PG HSOP8 PIN FUNCTIONS PIN NAME NO. DESCRIPTION EN 1 Enable input control. EN is active high and must be pulled up to enable the device. VFB 2 Converter feedback input. Connect to output voltage with feedback resistor divider. VREG5 3 5.5 V power supply output. A capacitor (typical 1 µF) should be connected to GND. VREG5 is not active when EN is low. PG 4 Open drain power good output GND 5 Ground pin. Power ground return for switching circuit. Connect sensitive VFB returns to GND at a single point. SW 6 Switch node connection between high-side NFET and low-side NFET. VBST 7 Supply input for the high-side FET gate drive circuit. Connect 0.1 µF capacitor between VBST and SW pins. An internal diode is connected between VREG5 and VBST. VIN 8 Input voltage supply pin. Exposed Thermal Pad Back side Thermal pad of the package. Must be soldered to achieve appropriate dissipation. Must be connected to GND. 5 Copyright © 2013, Texas Instruments Incorporated Product Folder Links :TPS56628 TPS56628 SLVSC94A – OCTOBER 2013 – REVISED DECEMBER 2013 www.ti.com FUNCTIONAL BLOCK DIAGRAM EN EN 1 EN Logic VIN VIN OV 8 +25% 7 VBST Ref SS SW VO 6 2 VFB Ceramic Capacitor UVP_Hiccup -35% SGND 5 SW VREG5 GND ZC 3 GND SW Softstart Hiccup PGND GND SS VIN OV EN Ref PG VREG5 4 UVLO UVLO -10% TSD Protection Logic Hiccup REF Ref 6 Copyright © 2013, Texas Instruments Incorporated Product Folder Links :TPS56628 TPS56628 www.ti.com SLVSC94A – OCTOBER 2013 – REVISED DECEMBER 2013 OVERVIEW The TPS56628 is a 6-A synchronous step-down (buck) converter with two integrated N-channel MOSFETs with Auto-Skip mode to improve light load efficiency. It operates using D-CAP2™ mode control. The fast transient response of D-CAP2™ control reduces the output capacitance required to meet a specific level of performance. Proprietary internal circuitry allows the use of low ESR output capacitors including ceramic and special polymer types. The PG output can be used for sequence operation. DETAILED DESCRIPTION PWM Operation The main control loop of the TPS56628 is an adaptive on-time pulse width modulation (PWM) controller that supports a proprietary D-CAP2™ mode control. D-CAP2™ mode control combines adaptive on-time control with an internal compensation circuit for pseudo-fixed frequency and low external component count configuration with both low ESR and ceramic output capacitors. It is stable even with virtually no ripple at the output. At the beginning of each cycle, the high-side MOSFET is turned on. This MOSFET is turned off after internal one shot timer expires. This one shot is set by the converter input voltage, VIN, and the output voltage, VO, to maintain a pseudo-fixed frequency over the input voltage range, hence it is called adaptive on-time control. The one-shot timer is reset and the high-side MOSFET is turned on again when the feedback voltage falls below the reference voltage. An internal ramp is added to reference voltage to simulate output ripple, eliminating the need for ESR induced output ripple from D-CAP2™ mode control. PWM Frequency and Adaptive On-Time Control TPS56628 uses an adaptive on-time control scheme and does not have a dedicated on board oscillator. The TPS56628 runs with a pseudo-constant frequency of 650 kHz by using the input voltage and output voltage to set the on-time one-shot timer. The on-time is inversely proportional to the input voltage and proportional to the output voltage; therefore, when the duty ratio is VOUT/VIN, the frequency is constant. Auto-Skip Eco-mode™ Control The TPS56628 is designed with Auto-Skip Eco-mode™ to increase light load efficiency. As the output current decreases from heavy load condition, the inductor current is also reduced and eventually comes to a point where its rippled valley touches zero level, which is the boundary between continuous conduction and discontinuous conduction modes. The rectifying MOSFET is turned off when its zero inductor current is detected. As the load current further decreases the converters runs in discontinuous conduction mode. The on-time is kept almost the same as it was in the continuous conduction mode so that it takes longer time to discharge the output capacitor with smaller load current to the level of the reference voltage. The transition point to the light load operation IOUT(LL) current can be calculated in Equation 1 (VIN - VOUT )×VOUT 1 × I OUT ( LL ) = 2 × L × fsw VIN (1) Soft Start and Pre-Biased Soft Start The TPS56628 has an internal 1.0 ms soft-start. When the EN pin becomes high, internal soft-start function begins ramping up the reference voltage to the PWM comparator. The TPS56628 contains a unique circuit to prevent current from being pulled from the output during startup if the output is pre-biased. When the soft-start commands a voltage higher than the pre-bias level (internal soft start becomes greater than feedback voltage VFB), the controller slowly activates synchronous rectification by starting the first low side FET gate driver pulses with a narrow on-time. It then increments that on-time on a cycle-bycycle basis until it coincides with the time dictated by (1-D), where D is the duty cycle of the converter. This scheme prevents the initial sinking of the pre-bias output, and ensure that the out voltage (VO) starts and ramps up smoothly into regulation and the control loop is given time to transition from pre-biased start-up to normal mode operation. 7 Copyright © 2013, Texas Instruments Incorporated Product Folder Links :TPS56628 TPS56628 SLVSC94A – OCTOBER 2013 – REVISED DECEMBER 2013 www.ti.com Power Good The power-good function is activated after soft start has finished. The power good function becomes active after 1.7 times soft-start time. When the output voltage becomes within -10% of the target value, internal comparators detect power good state and the power good signal becomes high. The power good output, PG is an open drain output. If the feedback voltage goes under 15% of the target value, the power good signal becomes low. Rpg resistor value, which is connected between PG and VREG5, is required from 25kΩ to 150kΩ. Current Protection The output overcurrent protection (OCP) is implemented using a cycle-by-cycle valley detect control circuit. The switch current is monitored by measuring the low-side FET switch voltage between the SW pin and GND. This voltage is proportional to the switch current. To improve accuracy, the voltage sensing is temperature compensated. During the on time of the high-side FET switch, the switch current increases at a linear rate determined by VIN, VOUT, the on-time and the output inductor value. During the on time of the low-side FET switch, this current decreases linearly. The average value of the switch current is the load current IOUT. The TPS56628 constantly monitors the low-side FET switch voltage, which is proportional to the switch current, during the low-side on-time. If the measured voltage is above the voltage proportional to the current limit, an internal counter is incremented per each SW cycle and the converter maintains the low-side switch on until the measured voltage is below the voltage corresponding to the current limit at which time the switching cycle is terminated and a new switching cycle begins. In subsequent switching cycles, the on-time is set to a fixed value and the current is monitored in the same manner. If the over current condition exists for 7 consecutive switching cycles, the internal OCL threshold is set to a lower level, reducing the available output current. When a switching cycle occurs where the switch current is not above the lower OCL threshold, the counter is reset and the OCL limit is returned to the higher value. There are some important considerations for this type of over-current protection. The load current one half of the peak-to-peak inductor current is higher than the over-current threshold also when the current is being limited, the output voltage tends to fall as the demanded load current may be higher than the current available from the converter. This may cause the output voltage to fall. When the VFB voltage becomes lower than 65% of the target voltage, the UVP comparator detects it. After 250 µs detecting the UVP voltage, device will shut down and re-start after approximately 12ms hiccup time When the over-current condition is removed, the output voltage returns to the regulated value. Overvoltage Protection TPS56628 detects overvoltage conditions by monitoring the feedback voltage (VFB). This function is enabled after approximately 1.7 x times the soft start time. When the feedback voltage becomes higher than 125% of the target voltage, the OVP comparator output goes high and both the high-side MOSFET driver and the low-side MOSFET driver turn off. This function is non-latch operation. UVLO Protection Undervoltage lock out protection (UVLO) monitors the voltage of the VREG5 pin. When the VREG5 voltage is lower than UVLO threshold voltage, the TPS56628 is shut off. This protection is non-latching. Thermal Shutdown TPS56628 monitors the temperature of itself. If the temperature exceeds the threshold value (typically 165°C), the device is shut off. This is non-latch protection. 8 Copyright © 2013, Texas Instruments Incorporated Product Folder Links :TPS56628 TPS56628 www.ti.com SLVSC94A – OCTOBER 2013 – REVISED DECEMBER 2013 TYPICAL CHARACTERISTICS VIN = 12 V, VO = 1.05V, TA = 25°C (unless otherwise noted). 10 Ivccsdn - Shutdown Current (µA) 1,400 ICC - Supply Current (µA) 1,200 1,000 800 600 400 200 0 9 8 7 6 5 4 3 2 1 0 ±50 0 50 100 ±50 150 TJ Junction Temperature (ƒC) 0 50 100 150 TJ Junction Temperature (ƒC) C001 Figure 1. SUPPLY CURRENT vs JUNCTION TEMPERATURE C002 Figure 2. VIN SHUTDOWN CURRENT vs JUNCTION TEMPERATURE 1.100 50 VIN = 18 V VOUT - Output Voltage (V) EN Input Current (µA) 40 30 20 10 1.075 1.050 1.025 VVin=5V IN = 5 V VVin=12V IN = 12 V 0 VVin=18V IN = 18 V 1.000 0 5 10 15 20 EN Input Voltage (V) 0.0 2.0 3.0 4.0 5.0 IOUT - Output Current (A) C003 Figure 3. EN CURRENT vs EN VOLTAGE 1.0 6.0 C004 Figure 4. 1.05-V OUTPUT VOLTAGE vs OUTPUT CURRENT VOUT - Output Voltage (V) 1.080 1.070 Vout( 50mV/div ) 1.060 1.050 1.040 1.030 Iout( 2A/div ) IOUT = 10 mA Io=10mA Io=1A IOUT = 1 A 1.020 0 5 10 VIN - Input Voltage (V) 15 20 100 μs /div ) C005 Figure 5. 1.05-V OUTPUT VOLTAGE vs INPUT VOLTAGE Figure 6. 1.05-V, LOAD TRANSIENT RESPONSE 9 Copyright © 2013, Texas Instruments Incorporated Product Folder Links :TPS56628 TPS56628 SLVSC94A – OCTOBER 2013 – REVISED DECEMBER 2013 www.ti.com TYPICAL CHARACTERISTICS (continued) VIN = 12 V, VO = 1.05V, TA = 25°C (unless otherwise noted). 100 VIN = 12 V EN (10V/div) Efficiency (%) 90 VREG5 (5V/div) Vout (0.5V/div) 80 70 60 Vo=1.8V 50 Vo=3.3V PG (5V/div) Vo=5V 40 0.0 1.0 2.0 3.0 4.0 5.0 IOUT - Output Current (A) 6.0 C008 400 μs/div Figure 7. START-UP WAVE FORM Figure 8. EFFICIENCY vs OUTPUT CURRENT 100 900 fsw - Switching Frequency (kHz) VIN = 12 V 90 80 Efficiency (%) 70 60 50 40 30 Vo=1.8V 20 Vo=3.3V 10 Vo=5V 0 0.001 800 750 700 650 Vo=1.05V V O = 1.05 V Vo=1.2V V O = 1.2 V V Vo=1.5V O = 1.5 V V Vo=1.8V O = 1.8 V V Vo=2.5V O = 2.5 V V Vo=3.3V O = 3.3 V V Vo=5V O= 5 V 600 550 500 450 400 0.01 0.1 IOUT - Output Current (A) 0 5 10 15 VIN - Input Voltage (V) C009 Figure 9. LIGHT LOAD EFFICIENCY vs OUTPUT CURRENT 20 C010 Figure 10. SWITCHING FREQUENCY vs INPUT VOLTAGE 0.780 900 800 0.775 700 VFB Voltage (V) fsw - Switching Frequency (kHz) IOUT = 1 A 850 600 500 400 300 200 VVo=1.05V O = 1.05 V 100 VVo=1.8V O = 1.8 V 0.0 0.1 1.0 IO - Output Current (A) 0.765 0.760 0.755 VVo=3.3V O = 3.3 V 0 0.770 IO = 10 mA Io=10mA Io=1A IO = 1 A 0.750 10.0 ±50 Figure 11. SWITCHING FREQUENCY vs OUTPUT CURRENT 0 50 100 TJ Junction Temperature (ƒC) C011 150 C012 Figure 12. VFB VOLTAGE vs JUNCTION TEMPERATURE 10 Copyright © 2013, Texas Instruments Incorporated Product Folder Links :TPS56628 TPS56628 www.ti.com SLVSC94A – OCTOBER 2013 – REVISED DECEMBER 2013 TYPICAL CHARACTERISTICS (continued) VIN = 12 V, VO = 1.05V, TA = 25°C (unless otherwise noted). Vo=1.05V Vo(10mV/div) VO = 50 mV / div SW = 5 V / div SW( 5V/div) 400ns/div Time = 1 µsec / div Figure 13. VOLTAGE RIPPLE AT OUTPUT (IO = 6 A) Figure 14. DCM VOLTAGE RIPPLE AT OUTPUT (IO = 30 mA) 7.00 VIN(50mV/div) 6.00 Output Current (A) Vo=1.05V SW( 5V/div) 5.00 4.00 3.00 VO = 1.05V 2.00 VO = 1.8V 1.00 VO = 3.3V 400ns/div VO = 5.0V 0.00 Figure 15. VOLTAGE RIPPLE AT INPUT (IO = 6 A) 0 20 40 60 80 100 TA - Ambient Temperature (ºC) Figure 16. OUTPUT CURRENT vs AMBIENT TEMPERATURE 11 Copyright © 2013, Texas Instruments Incorporated Product Folder Links :TPS56628 TPS56628 SLVSC94A – OCTOBER 2013 – REVISED DECEMBER 2013 www.ti.com DESIGN GUIDE Step-By-Step Design Procedure To • • • • • begin the design process, the user must know a few application parameters: Input voltage range Output voltage Output current Output voltage ripple Input voltage ripple VIN 4.5 to 18V VIN C1 10 uF C2 C3 10 uF 0.1uF 1 2 U1 TPS56628 DDA R3 10. 0k 1 EN 2 VOUT R1 8.25k 3 R2 22 .1k C4 1 C5 1 uF R4 100 k 4 VIN 8 VBST 7 EN C7 0.1uF VFB VOUT 1.05V 6A L1 SW VREG5 6 VOUT 1 .5uH GND PG 5 C8 C9 22uF 22uF PwPd 9 1 Not Installed Figure 17. Shows the Schematic Diagram for This Design Example. Output Voltage Resistors Selection The output voltage is set with a resistor divider from the output node to the VFB pin. It is recommended to use 1% tolerance or better divider resistors. Start by using Equation 2 to calculate VOUT. To improve efficiency at light loads consider using larger value resistors, high resistance is more susceptible to noise, and the voltage errors from the VFB input current are more noticeable. V = 0.765 x OUT æ ö çç1 + R1÷÷ ÷ çè R2 ø (2) Output Filter Selection The output filter used with the TPS56628 is an LC circuit. This LC filter has double pole at: F = P 2p L 1 OUT x COUT (3) 12 Copyright © 2013, Texas Instruments Incorporated Product Folder Links :TPS56628 TPS56628 www.ti.com SLVSC94A – OCTOBER 2013 – REVISED DECEMBER 2013 At low frequencies, the overall loop gain is set by the output set-point resistor divider network and the internal gain of the TPS56628. The low frequency phase is 180 degrees. At the output filter pole frequency, the gain rolls off at a –40 dB per decade rate and the phase drops rapidly. D-CAP2™ introduces a high frequency zero that reduces the gain roll off to –20 dB per decade and increases the phase to 90 degrees one decade above the zero frequency. The inductor and capacitor for the output filter must be selected so that the double pole of Equation 3 is located below the high frequency zero but close enough that the phase boost provided be the high frequency zero provides adequate phase margin for a stable circuit. To meet this requirement use the values recommended in Table 1 Table 1. Recommended Component Values C4 (pF) (1) Output Voltage (V) R1 (kΩ) R2 (kΩ) (1) L1 (µH) C8 + C9 (µF) MIN TYP MAX MIN TYP MAX MIN MAX 1 6.81 22.1 5 150 220 1.0 1.5 4.7 22 68 1.05 8.25 22.1 5 150 220 1.0 1.5 4.7 22 68 1.2 12.7 22.1 5 100 1.0 1.5 4.7 22 68 1.5 21.5 22.1 5 68 1.0 1.5 4.7 22 68 1.8 30.1 22.1 5 22 1.2 1.5 4.7 22 68 2.5 49.9 22.1 5 22 1.5 2.2 4.7 22 68 3.3 73.2 22.1 2 22 1.8 2.2 4.7 22 68 5 124 22.1 2 22 2.2 3.3 4.7 22 68 Optional For higher output voltages, additional phase boost can be achieved by adding a feed forward capacitor (C4) in parallel with R1 The inductor peak-to-peak ripple current, peak current and RMS current are calculated using Equation 4, Equation 5 and Equation 6. The inductor saturation current rating must be greater than the calculated peak current and the RMS or heating current rating must be greater than the calculated RMS current. Use 650 kHz for fSW. Make sure the chosen inductor is rated for the peak current of Equation 5 and the RMS current of Equation 6. - VOUT V V OUT x IN(max) I = IPP V L x f IN(max) O SW I =I + Ipeak O (4) I lpp 2 (5) 1 2 2 = I I + I Lo(RMS) O 12 IPP (6) For this design example, the calculated peak current is 6.51 A and the calculated RMS current is 6.01 A. The inductor used is a TDK SPM6530-1R5M100 with a peak current rating of 11.5 A and an RMS current rating of 11 A. The capacitor value and ESR determines the amount of output voltage ripple. The TPS56628 is intended for use with ceramic or other low ESR capacitors. Recommended values range from 22µF to 68µF. Use Equation 7 to determine the required RMS current rating for the output capacitor. I Co(RMS) = VOUT x (VIN - VOUT ) 12 x VIN x LO x fSW (7) For this design two TDK C3216X5R0J226M 22µF output capacitors are used. The typical ESR is 2 mΩ each. The calculated RMS current is 0.286 A and each output capacitor is rated for 4A. 13 Copyright © 2013, Texas Instruments Incorporated Product Folder Links :TPS56628 TPS56628 SLVSC94A – OCTOBER 2013 – REVISED DECEMBER 2013 www.ti.com Input Capacitor Selection The TPS56628 requires an input decoupling capacitor and a bulk capacitor is needed depending on the application. A ceramic capacitor over 10 μF is recommended for the decoupling capacitor. An additional 0.1 µF capacitor (C3) from pin 8 to ground is optional to provide additional high frequency filtering. The capacitor voltage rating needs to be greater than the maximum input voltage. Bootstrap Capacitor Selection A 0.1 µF. ceramic capacitor must be connected between the VBST to SW pin for proper operation. It is recommended to use a ceramic capacitor. VREG5 Capacitor Selection A 1-µF ceramic capacitor must be connected between the VREG5 to GND pin for proper operation. It is recommended to use a ceramic capacitor. THERMAL INFORMATION This 8-pin DDA package incorporates an exposed thermal pad that is designed to be directly attached to an external heatsink. The thermal pad must be soldered to the printed circuit board (PCB). After soldering, the PCB can be used as a heartsick. In addition, through the use of thermal vias, the thermal pad can be attached directly to the appropriate copper plane shown in the electrical schematic for the device, or alternatively, can be attached to a special heartsick structure designed into the PCB. This design optimizes the heat transfer from the integrated circuit (IC). For additional information on the exposed thermal pad and how to use the advantage of its heat dissipating abilities, see the Technical Brief, PowerPAD™ Thermally Enhanced Package, Texas Instruments Literature No. SLMA002 and Application Brief, PowerPAD™ Made Easy, Texas Instruments Literature No. SLMA004. The exposed thermal pad dimensions for this package are shown in the following illustration. Figure 18. Thermal Pad Dimensions 14 Copyright © 2013, Texas Instruments Incorporated Product Folder Links :TPS56628 TPS56628 www.ti.com SLVSC94A – OCTOBER 2013 – REVISED DECEMBER 2013 LAYOUT CONSIDERATIONS 1. The TPS56628 can supply large load currents up to 6 A, so heat dissipation may be a concern. The top side area of PCB adjacent to the TPS56628 should be filled with ground as much as possible to dissipate heat. 2. The bottom side area directly below the IC should a dedicated ground area. It should be directly connected to the thermal pad of the device using vias as shown. The ground area should be as large as practical. Additional internal layers can be dedicated as ground planes and connected to the vias as well. 3. Keep the input switching current loop as small as possible. 4. Keep the SW node as physically small and short as possible to minimize parasitic capacitance and inductance and to minimize radiated emissions. Kelvin connections should be brought from the output to the feedback pin of the device. 5. Keep analog and non-switching components away from switching components. 6. Make a single point connection from the signal ground to power ground. 7. Do not allow switching current to flow under the device. 8. Keep the pattern lines for VIN, SW, and PGND (POWERGROUND) broad. 9. Exposed pad of device must be connected to PGND with solder. 10. VREG5 capacitor should be placed near the device, and connected PGND. 11. Output capacitor should be connected to a broad pattern of the PGND. 12. Voltage feedback loop should be as short as possible, and preferably with ground shield. 13. Lower resistor of the voltage divider which is connected to the VFB pin should be tied to ANALOG GROUND. 14. Providing sufficient via is preferable for VIN, SW and PGND connection. 15. VFB node should be as short as possible. 16. VIN Capacitor should be placed as near as possible to the device. Additional Thermal Vias TO ENABLE CONTROL FEEDBACK RESISTORS Connection to POWER GROUND on internal or bottom layer BIAS CAP VIN INPUT BYPASS CAPACITOR VIN INPUT BYPASS CAPACITOR VIN EN VIN VFB VBST VREG5 SW PG EXPOSED POWERPAD AREA GND Additional Thermal Vias ANALOG GROUND TRACE BOOST CAPACITOR VOUT OUTPUT INDUCTOR OUTPUT FILTER CAPACITOR POWER GROUND Figure 19. PCB Layout 15 Copyright © 2013, Texas Instruments Incorporated Product Folder Links :TPS56628 TPS56628 SLVSC94A – OCTOBER 2013 – REVISED DECEMBER 2013 www.ti.com REVISION HISTORY NOTE: Page numbers of current version may vary from previous versions. Changes from Original (October 2013) to Revision A Page • Deleted "The device also features an adjustable soft start time." from the Description. ...................................................... 1 • Deleted "GND" spec from Output Voltage Range in the Absolute Maximum Ratings table. ............................................... 2 • Deleted "GND" spec from Input Voltage Range in the Recommended Operating Conditions table.. .................................. 3 • Deleted "TJ" spec from the Recommended Operating Conditions table. ............................................................................. 3 • Changed VTHPG spec for VFB falling (Fault) condition from "65%" to "85%" in Electrical Characteristics table ................... 4 • Changed GND pin description from "SS and VFB" to "VFB" in the Pin Functions table. ..................................................... 5 • Changed input names from "PGND" to "GND" at the ZC and OCP comparators in the Functional Block Diagram graphic .................................................................................................................................................................................. 6 • Changed text string from "constant on-time" to "adaptive on-time" in the 1st paragraph of PWM Operation. ..................... 7 • Changed text string from "detects over and under voltage" to "detects overvoltage" in the Overvoltage Protection section. .................................................................................................................................................................................. 8 • Added VO = 1.05V to Conditions statement for the Typical Characteristics graphs. ............................................................ 9 • Changed time scale callout from "100 µs/div" to "400 µs/div" on Figure 7 ........................................................................ 10 • Added VO = 1.05V to Conditions statement for the Typical Characteristics graphs. .......................................................... 10 • Added VO = 1.05V to Conditions statement for the Typical Characteristics graphs. .......................................................... 11 • Deleted "-950 mv dc offset" text string from signal trace label; and changed SW label from "10 V/div" to "5 V/div" on Figure 14 ............................................................................................................................................................................. 11 • Changed some itemized notes in the Layout Considerations section for clarification. ...................................................... 15 16 Copyright © 2013, Texas Instruments Incorporated Product Folder Links :TPS56628 PACKAGE OPTION ADDENDUM www.ti.com 10-Dec-2020 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan (2) Lead finish/ Ball material MSL Peak Temp Op Temp (°C) Device Marking (3) (4/5) (6) TPS56628DDA ACTIVE SO PowerPAD DDA 8 75 RoHS & Green NIPDAU | NIPDAUAG Level-2-260C-1 YEAR -40 to 85 56628 TPS56628DDAR ACTIVE SO PowerPAD DDA 8 2500 RoHS & Green NIPDAU | NIPDAUAG Level-2-260C-1 YEAR -40 to 85 56628 (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may reference these types of products as "Pb-Free". RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption. Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of
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TPS56628DDAR
    •  国内价格
    • 1+1.42945
    • 100+1.39216
    • 500+1.35487
    • 2000+1.33001

    库存:73058