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TPS61046
SLVSCQ7 – APRIL 2015
TPS61046 28-V Output Voltage Boost Converter in WCSP Package
1 Features
3 Description
•
The TPS61046 is a highly integrated boost converter
designed for applications requiring high voltage and
tiny solution size such as PMOLED panel and sensor
module. The TPS61046 integrates a 30-V power
switch, input/output isolation switch, and power diode.
It can output up to 28 V from input of a Li+ battery or
two cell alkaline batteries in series.
1
•
•
•
•
•
•
•
•
•
•
•
•
•
Input Voltage Range: 1.8 V to 5.5 V, 1.6 V after
Startup
Output Voltage Up to 28 V
Integrated Power Diode and Isolation Switch
900-mA (typical) Switch Current
Up to 85% Efficiency at 3.6-V Input and 12-V
Output
500-nA Ultra-low Shutdown Current
±2% Output Voltage Accuracy
Power Save Operation Mode at Light Load
Internal 10-ms Soft Start Time
True Disconnection between Input and Output
during Shutdown
Output Short Circuit Protection
Output Over-Voltage Protection
Thermal Shutdown Protection
0.80-mm × 1.20-mm WCSP package
The TPS61046 operates with a switching frequency
at 1.0 MHz. This allows the use of small external
components. The TPS61046 has an internal default
12-V output voltage setting by connecting the FB pin
to the VIN pin. Thus it only needs three external
components to get 12-V output voltage. Together with
WCSP package, the TPS61046 gives a very small
overall solution size. The TPS61046 has typical 900mA switch current limit. It has 10-ms built-in soft start
time to minimize the inrush current. When the
TPS61046 is in shutdown mode, the isolation switch
disconnects the output from input to minimize the
leakage current. The TPS61064 also implements
output short circuit protection, output over-voltage
protection and thermal shutdown.
2 Applications
•
•
•
•
The TPS61046 is available in a 6-pin 0.80-mm x
1.20-mm WCSP package.
PMOLED Power Supply
Wearable Devices
Portable Medical Equipment
Sensor Power Supply
Device Information(1)
PART NUMBER
TPS61046
PACKAGE
WCSP (6)
BODY SIZE (NOM)
0.80 mm x 1.20 mm
(1) For all available packages, see the orderable addendum at
the end of the datasheet.
4 Simplified Schematic
L1
1.8 V ~ 5.5 V
C1
10PH
1.0PF
VIN
SW
4.5 V ~ 28 V
GND
VOUT
C2
TPS61046
ON
OFF
EN
R1
2.2PF
FB
R2
1
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.
TPS61046
SLVSCQ7 – APRIL 2015
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Table of Contents
1
2
3
4
5
6
7
8
Features ..................................................................
Applications ...........................................................
Description .............................................................
Simplified Schematic.............................................
Revision History.....................................................
Pin Configuration and Functions .........................
Specifications.........................................................
1
1
1
1
2
3
4
7.1
7.2
7.3
7.4
7.5
7.6
4
4
4
4
5
6
Absolute Maximum Ratings ......................................
ESD Ratings ............................................................
Recommended Operating Conditions.......................
Thermal Information ..................................................
Electrical Characteristics...........................................
Typical Characteristics ..............................................
8.3 Feature Description................................................... 9
9
Application and Implementation ........................ 11
9.1 Application Information............................................ 11
9.2 Typical Application - 12-V Output Boost Converter 11
9.3 System Examples ................................................... 15
10 Power Supply Recommendations ..................... 16
11 Layout................................................................... 17
11.1 Layout Guidelines ................................................. 17
11.2 Layout Example .................................................... 17
12 Device and Documentation Support ................. 18
12.1
12.2
12.3
12.4
12.5
Detailed Description .............................................. 8
8.1 Overview ................................................................... 8
8.2 Functional Block Diagram ......................................... 8
Device Support ....................................................
Community Resources..........................................
Trademarks ...........................................................
Electrostatic Discharge Caution ............................
Glossary ................................................................
18
18
18
18
18
13 Mechanical, Packaging, and Orderable
Information ........................................................... 19
5 Revision History
2
DATE
REVISION
NOTES
April 2015
*
Initial release.
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6 Pin Configuration and Functions
YFF Package
6-Ball WCSP
(Top View)
VIN
GND
FB
SW
EN
VOUT
Pin Functions
PIN
NAME
NUMBER
I/O
DESCRIPTION
EN
C1
I
Enable logic input. Logic high voltage enables the device. Logic low voltage disables the device and turns
it into shutdown mode.
FB
B1
I
Voltage feedback of adjustable output voltage. Connect to the center tap of a resistor divider to program
the output voltage. When it is connected to the VIN pin, the output voltage is set to 12 V by an internal
feedback.
GND
A2
PWR
Ground
SW
B2
PWR
The switch pin of the converter. It is connected to the drain of the internal power MOSFET.
VIN
A1
I
VOUT
C2
PWR
IC power supply input
Output of the boost converter
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7 Specifications
7.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted)
Voltage range at terminals
(2)
(1)
MIN
MAX
UNIT
VIN, EN, FB
– 0.3
6
V
SW, VOUT
–0.3
32
V
Operating junction temperature range, TJ
–40
150
°C
Storage temperature range, Tstg
–65
150
°C
(1)
(2)
Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended
Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
All voltage values are with respect to network ground terminal.
7.2 ESD Ratings
Human body model (HBM), per ANSI/ESDA/JEDEC JS-001, all pins
V(ESD)
(1)
(2)
(3)
(1)
Electrostatic discharge
(2)
Charged device model (CDM), per JEDEC specification JESD22-C101,
all pins (3)
VALUE
UNIT
±2000
V
±500
V
Electrostatic discharge (ESD) to measure device sensitivity and immunity to damage caused by assembly line electrostatic discharges in
to the device.
JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
7.3 Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted)
MIN
TYP
MAX
UNIT
VIN
Input voltage range
1.8
5.5
V
VOUT
Output voltage range
4.5
28
V
L
Effective inductance range
1.0×0.7
10
CIN
Effective input capacitance range
0.22
1.0
COUT
Effective output capacitance range
0.22
1.0
TJ
Operating junction temperature
–40
22×1.3
µH
µF
10
µF
125
°C
7.4 Thermal Information
TPS61046
THERMAL METRIC
(1)
YFF (WCSP)
UNIT
6 BALLS
RθJA
Junction-to-ambient thermal resistance
RθJC(top)
Junction-to-case (top) thermal resistance
1.6
RθJB
Junction-to-board thermal resistance
22.3
ψJT
Junction-to-top characterization parameter
5.6
ψJB
Junction-to-board characterization parameter
22.3
RθJC(bot)
Junction-to-case (bottom) thermal resistance
n/a
(1)
4
135.4
°C/W
For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
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7.5 Electrical Characteristics
TJ = –40°C to 125°C, VIN = 3.6 V and VOUT = 12 V. Typical values are at TJ = 25°C, unless otherwise noted.
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
POWER SUPPLY
VIN
Input voltage range
VIN_UVLO
Under voltage lockout threshold
VIN_HYS
VIN UVLO hysteresis
IQ_VIN
Quiescent current into VIN pin
ISD
Shutdown current into VIN pin
1.8
5.5
VIN rising
1.75
1.8
VIN falling
1.55
1.6
200
V
V
mV
IC enabled, no load, no switching, VIN = 1.8 V to 5.5 V,
VOUT = 12 V
110
200
µA
IC disabled, VIN = 1.8 V to 5.5 V, TJ up to 85°C
0.1
0.8
µA
0.5
µA
28
V
IC disabled, VIN = 1.8 V to 5.5 V, TJ up to 60°C
OUTPUT
VOUT
Output voltage range
VOUT_12V
12-V output voltage accuracy
VREF
Feedback voltage
VOVP
Output overvoltage protection threshold
VOVP_HYS
Over voltage protection hysteresis
IFB_LKG
Leakage current into FB pin
ISW_LKG
Leakage current into SW pin
4.5
FB pin connected to VIN pin, TJ=0°C to 125°C
PWM mode, TJ=0°C to 125°C
11.7
12
12.3
V
0.779
0.795
0.811
V
PFM mode, TJ=0°C to 125°C
0.803
28
29.2
V
30.4
V
200
nA
500
nA
0.8
IC disabled, TJ up to 85°C
V
POWER SWITCH
Isolation MOSFET on resistance
VOUT = 12 V
850
Low-side MOSFET on resistance
VOUT = 12 V
450
fSW
Switching frequency
VIN = 3.6 V, VOUT = 12 V, PWM mode
tON_min
Minimal switch on time
ILIM_SW
Peak switch current limit
VIN = 3.6 V, VOUT = 12 V
ILIM_CHG
Pre-charge current
VIN = 3.6 V, VOUT = 0 V
tSTARTUP
Startup time
VOUT from VIN to 12 V, COUT_effective = 2.2 µF, IOUT = 0 A
RDS(on)
850
600
2
mΩ
1050
1250
150
250
ns
900
1200
mA
30
50
mA
5
kHz
ms
LOGIC INTERFACE
VEN_H
EN Logic high threshold
VEN_L
EN Logic Low threshold
1
0.4
V
V
PROTECTION
TSD
Thermal shutdown threshold
TJ rising
TSD_HYS
Thermal shutdown hysteresis
TJ falling below TSD
150
°C
20
°C
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7.6 Typical Characteristics
100
100
90
90
80
80
70
70
Efficiency (%)
Efficiency (%)
VIN = 3.6 V, VOUT = 12 V, TJ = –40°C to 125°C, unless otherwise noted.
60
50
40
30
60
50
40
30
VIN = 1.8 V
VIN = 3.0 V
VIN = 3.6 V
VIN = 4.2 V
20
10
0
0.0001
0.001
0.01
Output Current (A)
0.1
20
VOUT = 5 V
VOUT = 12 V
VOUT = 24 V
10
0
0.0001
1
0.001
D001
VIN = 1.8 V, 3.0 V, 3.6 V, 4.2 V, VOUT = 12 V
12.3
805
12.2
12.1
12
11.9
800
795
790
-20
0
20
40
60
Temperature (°C)
80
100
780
-40
120
-20
0
20
40
60
Temperature (°C)
D001
80
100
120
D001
VIN = 3.6 V, VOUT = 12 V
Figure 3. 12-V Fixed Output Voltage vs Temperature
Figure 4. Reference Voltage vs Temperature
150
150
140
140
130
130
Quiescent Current (PA)
Quiescent Current (PA)
D001
785
11.8
VIN = 3.6 V, VOUT = 12 V, FB pin connected to VIN pin
120
110
100
90
80
120
110
100
90
80
-20
0
20
40
60
Temperature(°C)
80
100
120
70
1.8
2.4
D001
VIN = 3.6 V, VOUT = 12 V, No switching
3
3.6
4.2
Input Voltage (V)
4.8
5.4
6
D001
VIN = 1.8 V ~ 6 V, VOUT = 12 V, No switching
Figure 5. Quiescent Current vs Temperature
6
1
Figure 2. Efficiency vs Output Current
810
Reference Voltage (mV)
12-V Fixed Output Voltage (V)
Figure 1. Efficiency vs Output Current
70
-40
0.1
VIN = 3.6 V, VOUT = 5 V, 12 V, 24 V
12.4
11.7
-40
0.01
Output Current (A)
Figure 6. Quiescent Current vs Input Voltage
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Typical Characteristics (continued)
VIN = 3.6 V, VOUT = 12 V, TJ = –40°C to 125°C, unless otherwise noted.
0.4
1100
1000
0.3
Current Limit (mA)
Shutdown Current (PA)
0.35
0.25
0.2
0.15
900
800
700
0.1
600
0.05
0
-40
-20
0
20
40
Temperature (°C)
60
500
-40
80
-20
0
20
40
60
Temperature (°C)
D001
VIN = 3.6 V
80
100
120
D001
VIN = 3.6 V, VOUT = 12 V
Figure 7. Shutdown Current vs Temperature
Figure 8. Current Limit vs Temperature
1100
Current Limit (mA)
1000
900
800
700
600
500
1.8
2.4
3
3.6
4.2
Input Voltage (V)
4.8
5.4
6
D001
VIN = 1.8 V ~ 6 V, VOUT = 12 V
Figure 9. Current Limit vs Temperature
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8 Detailed Description
8.1 Overview
The TPS61046 is a highly integrated boost converter designed for applications requiring high voltage and tiny
solution size such as PMOLED panel power supply and sensor module. The TPS61046 integrates a 30-V power
switch, input/output isolation switch, and power diode. It can output up to 28 V from input of a Li+ battery or two
cell alkaline batteries in series.
One common issue with conventional boost regulators is the conduction path from input to output even when the
power switch is turned off. It creates three problems, which are inrush current during start-up, output leakage
current during shutdown and excessive over load current. In the TPS61046, the isolation switch is turned off
under shutdown mode and over load conditions, thereby opening the current path. Thus the TPS61046 can
truely disconnect the load from the input voltage and minimize the leakage current during shutdown mode.
The TPS61046 operates with a switching frequency at 1.0 MHz. This allows the use of small external
components. The TPS61046 has an internal default 12-V output voltage setting by connecting the FB pin to the
VIN pin. Thus it only needs three external components to get 12-V output voltage. Together with WCSP package,
the TPS61046 gives a very small overall solution size. The TPS61046 has typical 900-mA switch current limit. It
has 10-ms built-in soft start time to minimize the inrush current. The TPS61064 also implements output short
circuit protection, output over-voltage protection and thermal shutdown.
8.2 Functional Block Diagram
VIN
SW
A1
B2
VIN
VOUT
UVLO
C2 VOUT
Thermal
Shutdown
Gate Driver
Gate Driver
EN C1
Logic
Pre-charge &
Short Circuit
Protection &
On/Off Control
EN
PWM / PFM
Control
1.2V
FB
GND A2
OVP REF
VOUT
Soft Start &
Current Limit Control
B1 FB
EA
REF
8
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8.3 Feature Description
8.3.1 Under-Voltage Lockout
An under-voltage lockout (UVLO) circuit stops the operation of the converter when the input voltage drops below
the typical UVLO threshold of 1.55 V. A hysteresis of 200 mV is added so that the device cannot be enabled
again until the input voltage goes up to 1.75 V. This function is implemented in order to prevent malfunctioning of
the device when the input voltage is between 1.55 V and 1.75 V.
8.3.2 Enable and Disable
When the input voltage is above maximal UVLO rising threshold of 1.8 V and the EN pin is pulled high, the
TPS61046 is enabled. When the EN pin is pulled low, the TPS61046 goes into shutdown mode. The device
stops switching and the isolation switch is turned off providing the isolation between input and output. In
shutdown mode, less than 1-µA input current is consumed.
8.3.3 Soft Start
The TPS61046 begins soft start when the EN pin is pulled high. at the beginning of the soft start period, the
isolation FET is turned on slowly to charge the output capacitor with 30-mA current for about 5 ms. This is called
the pre-charge phase. After the pre-charge phase, the TPS61046 starts switching. This is called switching soft
start phase. An internal soft start circuit limits the peak inductor current according to the output voltage. When the
output voltage is below 3 V, the peak inductor current is limited to 140 mA. Along with the output voltage going
up from 3 V to 5 V, the peak current limit is gradually increased to the normal value of 900 mA. The switching
soft start phase is about 5 ms typically. The soft start funciton reduces the inrush current during startup.
8.3.4 Over-voltage Protection
The TPS61046 has internal output over-voltage protection (OVP) function. When the output voltage exceeds the
OVP threshold of 29.2 V, the device stops switching. Once the output voltage falls 0.8 V below the OVP
threshold, the device resumes operation again.
8.3.5 Output Short Circuit Protection
The TPS61046 starts to limit the output current whenever the output voltage drops below 4 V. The lower output
voltage, the smaller output current limit. When the VOUT pin is shorted to ground, the output current is limited to
less than 200 mA. This function protects the device from being damaged when the output is shorted to ground.
8.3.6 Thermal Shutdown
The TPS61046 goes into thermal shutdown once the junction temperature exceeds 150°C. When the junction
temperature drops below the thermal shutdown temperature threshold less the hysteresis, typically 130°C, the
device starts operating again.
8.3.7 Device Functional Modes
The TPS61046 has two operation modes, PWM mode and power save mode.
8.3.7.1 PWM Mode
The TPS61046 uses a quasi-constant 1.0-MHz frequency pulse width modulation (PWM) at moderate to heavy
load current. Based on the input voltage to output votlage ratio, a circuit predicts the required off-time. At the
beginning of the switching cycle, the NMOS switching FET, shown in the functional block diagram, is turned on.
The input voltage is applied across the inductor and the inductor current ramps up. In this phase, the output
capacitor is discharged by the load current. When the inductor current hits the current threshold that is set by the
output of the error amplifier, the PWM switch is turned off, and the power diode is forward-biased. The inductor
transfers its stored energy to replenish the output capacitor and supply the load. When the off-time is expired, the
next switching cycle starts again. The error amplifier compares the FB pin voltage with an internal reference
votlage, and its output determines the inductor peak current.
The TPS61046 has a built-in compensation circuit that can accommodate a wide range of input voltage, output
voltage, inductor value and output capacitor value for stable operation.
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Feature Description (continued)
8.3.8 Power Save Mode
The TPS61046 integrates a power save mode with pulse frequency modulation (PFM) to improve efficiency at
light load. When the load current decreases, the inductor peak current set by the output of the error amplifier
declines to regulate the output voltage. When the inductor peak current hits the low limit of 140 mA, the output
voltage will exceed the setting voltage as the load current decreases further. When the FB voltage hits the PFM
reference voltage, the TPS61046 goes into the power save mode. In the power save mode, when the FB voltage
rises and hits the PFM reference voltage, the device continuous switching for several cycles because of the
delay time of the internal comparator. Then it stops switching. The load is supplied by the output capacitor and
the output voltage declines. When the FB voltage falls below the PFM reference voltage, after the delay time of
the comparator, the device starts switching again to ramp up the output voltage.
Output
Voltage
PFM mode at light load
1.01 x VOUT_NOM
VOUT_NOM
PWM mode at heavy load
Figure 10. Output Voltage in PWM Mode and PFM Mode
10
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9 Application and Implementation
9.1 Application Information
The TPS61046 is a boost DC-DC converter with a PWM switch, a power diode and an input/output isolation
switch integrated. The device supports up to 28-V output with the input range from 1.8 V to 5.5 V. The TPS61046
adopts the current-mode control with adaptive constant off-time. The switching frequency is quasi-constant at 1.0
MHz. The isolation switch disconnects the output from the input during shutdown to minimize leakage current.
The following design procedure can be used to select component values for the TPS61046.
9.2 Typical Application - 12-V Output Boost Converter
spacing
L1
2.7 V ~ 4.2 V
C1
10PH
1.0PF
VIN
SW
12 V
GND
VOUT
C2
TPS61046
ON
OFF
EN
FB
4.7PF
R1
1.0M
R2
71.5k
Figure 11. 12-V Boost Converter
9.2.1 Design Requirements
Table 1. Design Requirements
PARAMETERS
VALUES
Input Voltage
2.7 V ~ 4.2 V
Output Voltage
12 V
Output Current
50 mA
Output Voltage Ripple
±50mV
9.2.2 Detailed Design Procedure
9.2.2.1 Programming the Output Voltage
There are two ways to set the output voltage of the TPS61046. When the FB pin is connected to the input
voltage, the output voltage is fixed to 12 V. This function makes the TPS61046 only need three external
components to minimize the solution size. The second way is to use an external resistor divider to set the
desired output voltage.
By selecting the external resistor divider R1 and R2, as shown in Equation 1, the output voltage is programmed
to the desired value. When the output voltage is regulated, the typical voltage at the FB pin is VREF of 795 mV.
§V
·
R1 ¨ OUT 1¸ u R2
© VREF
¹
(1)
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Where:
VOUT is the desired output voltage
VREF is the internal reference voltage at the FB pin
For best accuracy, R2 should be kept smaller than 80 kΩ to ensure the current flowing through R2 is at least 100
times larger than the FB pin leakage current. Changing R2 towards a lower value increases the immunity against
noise injection. Changing the R2 towards a higher value reduces the quiescent current for achieving highest
efficiency at low load currents.
9.2.2.2 Inductor Selection
Because the selection of the inductor affects steady state operation, transient behavior, and loop stability, the
inductor is the most important component in power regulator design. There are three important inductor
specifications, inductor value, saturation current, and dc resistance (DCR).
The TPS61046 is designed to work with inductor values between 1.0 µH and 22 µH. Follow Equation 2 to
Equation 4 to calculate the inductor’s peak current for the application. To calculate the current in the worst case,
use the minimum input voltage, maximum output voltage, and maximum load current of the application. To have
enough design margin, choose the inductor value with -30% tolerance, and a low power-conversion efficiency for
the calculation.
In a boost regulator, the inductor dc current can be calculated with Equation 2.
VOUT u IOUT
IL(DC)
VIN u K
(2)
Where:
VOUT = output voltage
IOUT = output current
VIN = input voltage
η = power conversion efficiency, use 80% for most applications
The inductor ripple current is calculated with the Equation 3 for an asynchronous boost converter in continuous
conduction mode (CCM).
VIN u VOUT 0.8V VIN
'IL(P P)
L u fSW u VOUT 0.8V
(3)
Where:
ΔIL(P-P) = inductor ripple current
L = inductor value
f SW = switching frequency
VOUT = output voltage
VIN = input voltage
Therefore, the inductor peak current is calculated with Equation 4.
'IL P P
IL P IL DC
2
(4)
Normally, it is advisable to work with an inductor peak-to-peak current of less than 40% of the average inductor
current for maximum output current. A smaller ripple from a larger valued inductor reduces the magnetic
hysteresis losses in the inductor and EMI. Bit in the same way, load transient response time is increased.
Because the TPS61046 is for relatively small output current application, the inductor peak-to-peak current could
be as high as 200% of the average current with a small inductor value, which means the TPS61046 always
works in DCM mode.Table 2 lists the recommended inductor for the TPS61046.
Table 2. Recommended Inductors for the TPS61046
12
PART NUMBER
L(µH)
DCR MAX (mΩ)
SATURATION CURRENT (A)
SIZE (LxWxH)
VENDOR
FDSD0420-H-100M
10
200
2.5
4.2x4.2x2.0
Toko
CDRH3D23/HP
10
198
1.02
4.0x4.0x2.5
Sumida
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Table 2. Recommended Inductors for the TPS61046 (continued)
PART NUMBER
L(µH)
DCR MAX (mΩ)
SATURATION CURRENT (A)
SIZE (LxWxH)
VENDOR
1239AS-H-100M
10
460
1.0
2.5x2.0x1.2
Toko
VLS4012-4R7M
4.7
132
1.1
4.0x4.0x1.2
TDK
0420CDMCBDS
22
379
1.6
4.5x4.1x2.0
Sumida
9.2.2.3 Input and Output Capacitor Selection
The output capacitor is mainly selected to meet the requirements for output ripple and loop stability. This ripple
voltage is related to the capacitor’s capacitance and its equivalent series resistance (ESR). Assuming a ceramic
capacitor with zero ESR, the minimum capacitance needed for a given ripple can be calculated by:
IOUT u DMAX
COUT
fSW u VRIPPLE
(5)
Where:
DMAX = maximum switching duty cycle
VRIPPLE = peak to peak output voltage ripple
The ESR impact on the output ripple must be considered if tantalum or aluminum electrolytic capacitors are
used.
Care must be taken when evaluating a ceramic capacitor’s derating under dc bias, aging, and ac signal. For
example, the dc bias can significantly reduce capacitance. A ceramic capacitor can lose more than 50% of its
capacitance at its rated voltage. Therefore, always leave margin on the voltage rating to ensure adequate
capacitance at the required output voltage.
It is recommended to use the output capacitor with effective capacitance in the range of 0.47 μF to 10 μF. The
output capacitor affects the small signal control loop stability of the boost regulator. If the output capacitor is
below the range, the boost regulator can potentially become unstable. Increasing the output capacitor makes the
output voltage ripple smaller in PWM mode.
For input capacitor, a ceramic capacitor with more than 1.0 µF is enough for most applications.
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9.2.3 Application Performance Curves
SW 10 V/div
SW 10 V/div
VOUT (AC) 20 mV/div
VOUT (AC) 50 mV/div
Inductor Current 100 mA/div
Inductor Current 100 mA/div
VIN = 3.6 V, VOUT = 12 V, IOUT = 50 mA
VIN = 3.6 V, VOUT = 12 V, IOUT = 20 mA
Figure 12. Switching Waveforms in PWM CCM Mode
SW 10 V/div
Figure 13. Switching Waveforms in PWM DCM Mode
EN 1 V/div
VOUT (AC) 50 mV/div
VOUT 3 V/div
Inductor Current 100 mA/div
Inductor Current 100 mA/div
VIN = 3.6 V, VOUT = 12 V, IOUT = 50 mA
VIN = 3.6 V, VOUT = 12 V, IOUT = 3 mA
Figure 15. Soft Startup
Figure 14. Switching Waveforms in Power Save Mode
EN 1 V/div
VOUT (AC) 200 mV/div
VOUT 3 V/div
Output Current 20 mA/div
Inductor Current 100 mA/div
VIN = 3.6 V, VOUT = 12 V, IOUT = 50 mA
VIN = 3.6 V, VOUT = 12 V
Figure 16. Shutdown Waveforms
14
Figure 17. 10-mA to 50-mA Load Transient Response
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Output Voltage (AC) 50 mV/div
VIN (3.3 V offset) 200 mV/div
VOUT = 12V, IOUT = 50 mA
Figure 18. Input Voltage from 3.3-V to 3.6-V Line Transient Response
9.3 System Examples
9.3.1 Fixed 12-V Output Voltage with Three External Components
The TPS61046 can output fixed 12-V voltage by connecting the FB pin to the VIN pin to save the external
resistor divider. The Figure 19 shows the application circuit.
L1
1.8 V ~ 5.5 V
C1
10PH
1.0PF
VIN
SW
12 V
FB
VOUT
C2
2.2PF
TPS61046
ON
OFF
EN
GND
Figure 19. Fixed 12-V Output Voltage by Connecting the FB Pin to VIN Pin
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10 Power Supply Recommendations
The device is designed to operate from an input voltage supply range between 1.8 V to 5.5 V. This input supply
must be well regulated. If the input supply is located more than a few inches from the converter, additional bulk
capacitance may be required in addition to the ceramic bypass capacitors. A typical choice is an electrolytic or
tantalum capacitor with a value of 47 µF. The input power supply’s output current needs to be rated according to
the supply voltage, output voltage and output current of the TPS61046.
16
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11 Layout
11.1 Layout Guidelines
As for all switching power supplies, especially those running at high switching frequency and high currents,
layout is an important design step. If the layout is not carefully done, the regulator could suffer from instability
and noise problems. To maximize efficiency, switch rise and fall time are very fast. To prevent radiation of high
frequency noise (for example, EMI), proper layout of the high-frequency switching path is essential. Minimize the
length and area of all traces connected to the SW pin, and always use a ground plane under the switching
regulator to minimize interplane coupling. The input capacitor needs not only to be close to the VIN pin, but also
to the GND pin in order to reduce input supply ripple.
The most critical current path for all boost converters is from the switching FET, through the rectifier diode, then
the output capacitors, and back to ground of the switching FET. This high current path contains nanosecond rise
and fall time and should be kept as short as possible. Therefore, the output capacitor needs not only to be close
to the VOUT pin, but also to the GND pin to reduce the overshoot at the SW pin and VOUT pin.
11.2 Layout Example
A large ground plane on the bottom layer connects the ground pins of the components on the top layer through
vias.
GND
GND
VIN
GND
SW
VOUT
VIN
FB
EN
VOUT
GND
Figure 20. PCB Layout Example
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12 Device and Documentation Support
12.1 Device Support
12.1.1 Third-Party Products Disclaimer
TI'S PUBLICATION OF INFORMATION REGARDING THIRD-PARTY PRODUCTS OR SERVICES DOES NOT
CONSTITUTE AN ENDORSEMENT REGARDING THE SUITABILITY OF SUCH PRODUCTS OR SERVICES
OR A WARRANTY, REPRESENTATION OR ENDORSEMENT OF SUCH PRODUCTS OR SERVICES, EITHER
ALONE OR IN COMBINATION WITH ANY TI PRODUCT OR SERVICE.
12.2 Community Resources
The following links connect to TI community resources. Linked contents are provided AS IS by the respective
contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of
Use.
TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration
among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help
solve problems with fellow engineers.
Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and
contact information for technical support.
12.3 Trademarks
E2E, NanoFree are trademarks of Texas Instruments.
All other trademarks are the property of their respective owners.
12.4 Electrostatic Discharge Caution
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
12.5 Glossary
SLYZ022 — TI Glossary.
This glossary lists and explains terms, acronyms, and definitions.
18
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13 Mechanical, Packaging, and Orderable Information
The following pages include mechanical, packaging, and orderable information. This information is the most
current data available for the designated devices. This data is subject to change without notice and revision of
this document. For browser-based versions of this data sheet, refer to the left-hand navigation.
Package summary
Chip scale package dimensions
The TPS61046 is available in a 6-bump chip scale package (YFF, NanoFree™). The package dimensions are
given as:
D=ca. 1192 ± 30µm
E=ca. 792 ± 30µm
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PACKAGE OPTION ADDENDUM
www.ti.com
24-Apr-2015
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
Lead/Ball Finish
MSL Peak Temp
(2)
(6)
(3)
Op Temp (°C)
Device Marking
(4/5)
TPS61046YFFR
ACTIVE
DSBGA
YFF
6
3000
Green (RoHS
& no Sb/Br)
SNAGCU
Level-1-260C-UNLIM
-40 to 85
SJS
TPS61046YFFT
ACTIVE
DSBGA
YFF
6
250
Green (RoHS
& no Sb/Br)
SNAGCU
Level-1-260C-UNLIM
-40 to 85
SJS
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3)
MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4)
There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5)
Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish
value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
Addendum-Page 1
Samples
PACKAGE OPTION ADDENDUM
www.ti.com
24-Apr-2015
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
17-Jun-2015
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
Diameter Width (mm)
(mm) W1 (mm)
TPS61046YFFR
DSBGA
YFF
6
3000
180.0
8.4
TPS61046YFFT
DSBGA
YFF
6
250
180.0
8.4
Pack Materials-Page 1
B0
(mm)
K0
(mm)
P1
(mm)
W
Pin1
(mm) Quadrant
0.89
1.69
0.69
4.0
8.0
Q1
0.89
1.69
0.69
4.0
8.0
Q1
PACKAGE MATERIALS INFORMATION
www.ti.com
17-Jun-2015
*All dimensions are nominal
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
TPS61046YFFR
DSBGA
YFF
6
3000
182.0
182.0
20.0
TPS61046YFFT
DSBGA
YFF
6
250
182.0
182.0
20.0
Pack Materials-Page 2
PACKAGE OUTLINE
YFF0006
DSBGA - 0.625 mm max height
SCALE 10.500
DIE SIZE BALL GRID ARRAY
B
A
E
BALL A1
CORNER
D
0.625 MAX
C
SEATING PLANE
0.30
0.12
BALL TYP
0.05 C
0.4 TYP
C
0.8
TYP
SYMM
B
D: Max = 1.222 mm, Min =1.162 mm
E: Max = 0.822 mm, Min =0.762 mm
0.4 TYP
A
6X
0.015
0.3
0.2
C A B
2
1
SYMM
4223785/A 06/2017
NOTES:
1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
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EXAMPLE BOARD LAYOUT
YFF0006
DSBGA - 0.625 mm max height
DIE SIZE BALL GRID ARRAY
(0.4) TYP
6X ( 0.23)
1
2
A
(0.4) TYP
SYMM
B
C
SYMM
LAND PATTERN EXAMPLE
EXPOSED METAL SHOWN
SCALE:30X
0.05 MAX
( 0.23)
METAL
EXPOSED
METAL
SOLDER MASK
OPENING
0.05 MIN
METAL UNDER
SOLDER MASK
EXPOSED
METAL
( 0.23)
SOLDER MASK
OPENING
NON-SOLDER MASK
DEFINED
(PREFERRED)
SOLDER MASK
DEFINED
SOLDER MASK DETAILS
NOT TO SCALE
4223785/A 06/2017
NOTES: (continued)
3. Final dimensions may vary due to manufacturing tolerance considerations and also routing constraints. For more information,
see Texas Instruments literature number SNVA009 (www.ti.com/lit/snva009).
www.ti.com
EXAMPLE STENCIL DESIGN
YFF0006
DSBGA - 0.625 mm max height
DIE SIZE BALL GRID ARRAY
(0.4) TYP
6X ( 0.25)
2
1
(R0.05) TYP
A
(0.4) TYP
SYMM
B
METAL
TYP
C
SYMM
SOLDER PASTE EXAMPLE
BASED ON 0.1 mm THICK STENCIL
SCALE:35X
4223785/A 06/2017
NOTES: (continued)
4. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release.
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