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TPS61060, TPS61061, TPS61062
SLVS538B – NOVEMBER 2004 – REVISED DECEMBER 2014
TPS6106x Constant Current LED Driver With Digital and PWM Brightness Control
1 Features
3 Description
•
The TPS6106x is a high-frequency, synchronous
boost converter with constant current output to drive
up to five white LEDs. For maximum safety, the
device features integrated overvoltage and an
advanced short-circuit protection when the output is
shorted to ground. The device operates with 1-MHz
fixed switching frequency to allow for the use of small
external components and to simplify possible EMI
problems. The device comes with three different
overvoltage protection thresholds (14 V, 18 V, and 23
V) to allow inexpensive and small-output capacitors
with lower voltage ratings. The LED current is initially
set with the external sense resistor Rs, and the
feedback voltage is regulated to 500 mV or 250 mV,
depending on the configuration of the ILED pin.
Digital brightness control is implemented by applying
a simple digital signal to the ILED pin. Alternatively, a
PWM signal up to 1 kHz can be applied to the enable
pin to control the brightness of the LED. During
shutdown, the output is disconnected from the input
to avoid leakage current through the LEDs.
1
•
•
•
•
•
•
•
•
•
•
•
•
•
•
LED Driver With Integrated Overvoltage and
Short-Circuit Protection
2.7-V to 6-V Input Voltage Range
500-mV or 250-mV Feedback Voltage
TPS61060 Powers up to 3 LEDs
TPS61061 Powers up to 4 LEDs
TPS61062 Powers up to 5 LEDs
PWM Brightness Control on Enable
Digital Brightness Control on ILED
1-MHz Fixed Switching Frequency
400-mA Internal Power MOSFET Switch
LEDs Disconnected During Shutdown
Operates With Small-Output Capacitors
Down to 220 nF
Up to 80% Efficiency
8-Pin NanoFree™ Package (Chipscale, CSP)
3-mm × 3-mm QFN Package
Device Information(1)
2 Applications
•
•
•
•
•
PART NUMBER
White LED Drivers
Cellular Phones
PDAs, Pocket PCs, and Smart Phones
Digital Still Cameras
Handheld Devices
TPS61060,
TPS61061,
TPS61062
PACKAGE
BODY SIZE (NOM)
VSON (8)
3.00 mm × 3.00 mm
DSBGA (8)
1.446 mm × 1.446 mm
(1) For all available packages, see the orderable addendum at
the end of the datasheet.
Typical Application
C2
220 nF
VIN
2.7 V to 6 V
L1
22 mH
C1
1 mF
VIN
SW
EN
OUT
ILED
FB
GND PGND
RS
12 W
1
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.
TPS61060, TPS61061, TPS61062
SLVS538B – NOVEMBER 2004 – REVISED DECEMBER 2014
www.ti.com
Table of Contents
1
2
3
4
5
6
7
8
Features ..................................................................
Applications ...........................................................
Description .............................................................
Revision History.....................................................
Device Comparison Table.....................................
Pin Configuration and Functions .........................
Specifications.........................................................
1
1
1
2
3
3
4
7.1
7.2
7.3
7.4
7.5
7.6
4
4
4
5
5
7
Absolute Maximum Ratings .....................................
ESD Ratings..............................................................
Recommended Operating Conditions.......................
Thermal Information ..................................................
Electrical Characteristics...........................................
Typical Characteristics ..............................................
Detailed Description .............................................. 9
8.1
8.2
8.3
8.4
Overview ................................................................... 9
Functional Block Diagram ......................................... 9
Feature Description................................................... 9
Device Functional Modes........................................ 10
9
Application and Implementation ........................ 12
9.1 Application Information............................................ 12
9.2 Typical Application .................................................. 12
9.3 System Examples ................................................... 15
10 Power Supply Recommendations ..................... 17
11 Layout................................................................... 17
11.1 Layout Guidelines ................................................. 17
11.2 Layout Example .................................................... 18
11.3 Thermal Considerations ........................................ 18
12 Device and Documentation Support ................. 19
12.1
12.2
12.3
12.4
12.5
Device Support......................................................
Related Links ........................................................
Trademarks ...........................................................
Electrostatic Discharge Caution ............................
Glossary ................................................................
19
19
19
19
19
13 Mechanical, Packaging, and Orderable
Information ........................................................... 19
13.1 Chipscale Package Dimensions ........................... 19
4 Revision History
Changes from Revision A (April 2005) to Revision B
•
2
Page
Added Pin Configuration and Functions section, ESD Rating table, Feature Description section, Device Functional
Modes, Application and Implementation section, Power Supply Recommendations section, Layout section, Device
and Documentation Support section, and Mechanical, Packaging, and Orderable Information section .............................. 1
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Copyright © 2004–2014, Texas Instruments Incorporated
Product Folder Links: TPS61060 TPS61061 TPS61062
TPS61060, TPS61061, TPS61062
www.ti.com
SLVS538B – NOVEMBER 2004 – REVISED DECEMBER 2014
5 Device Comparison Table
TA
OVERVOLTAGE
PROTECTION
(OVP)
NanoFree (1)
QFN (2)
NanoFree
QFN
14 V (min)
TPS61060YZF
TPS61060DRB
AKX
AQP
18 V (min)
TPS61061YZF
TPS61061DRB
AKY
AQQ
22.2 V (min)
TPS61062YZF
TPS61062DRB
AKZ
AQR
–40 to 85°C
(1)
PACKAGE
PACKAGE MARKING
The YZF package is available in tape and reel. Add R suffix (TPS61060YZFR) to order quantities of 3000 parts per reel or add T suffix
(TPS61060YZFT) to order 250 parts per reel.
The DRB package is available in tape and reel. Add R suffix (TPS61060DRBR) to order quantities of 3000 parts per reel.
(2)
6 Pin Configuration and Functions
8-BALL
NanoFree PACKAGE
(TOP VIEW OF PCB)
Pin A1
1
Index
2
8-BALL
WAFER CHIP SCALE
YZF PACKAGE
TPS6106x DIMENSIONS
(TOP VIEW OF PCB)
3
A
1,50 mm
1,424 mm
B
C
GND
EN
ILED
A1
A2
A3
VIN
FB
B1
B3
OUT
SW
PGND
C1
C2
C3
1,50 mm
1,424 mm
8-Pin 3x3-mm QFN Package
Top View
8 Vin
GND 1
Exposed
Thermal
DiePad
EN 2
ILED 3
FB 4
7 OUT
6 SW
5 PGND
Pin Functions
PIN
NAME
NO.
I/O
DESCRIPTION
CSP
QFN
VIN
B1
8
I
Input supply pin of the device
EN
A2
2
I
Enable pin. This pin needs to be pulled high to enable the device. To allow brightness control of
the LEDs, a PWM signal up to 1 kHz can be applied. This pin has an internal pulldown resistor.
GND
A1
1
Analog ground
PGND
C3
5
Power ground
FB
B3
4
I
This is the feedback pin of the device. The feedback pin regulates the LED current through the
sense resistor by regulating the voltage across Rs. The feedback voltage is set by the ILED pin.
ILED=GND sets the feedback voltage to 500 mV. ILED=high sets the feedback voltage to 250
mV. Refer to digital brightness control section for more information.
OUT
C1
7
O
Output of the device
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SLVS538B – NOVEMBER 2004 – REVISED DECEMBER 2014
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Pin Functions (continued)
PIN
NO.
NAME
SW
ILED
I/O
CSP
QFN
C2
6
A3
3
–
–
PowerPAD™
DESCRIPTION
I
Switch pin of the device
I
Digital brightness control input. When this pin is grounded, the digital brightness control is
disabled. When this pin is connected to high, then the feedback voltage is reduced to typically
250 mV and the digital brightness control is enabled. Refer to digital brightness control section for
more information.
The PowerPAD™ (exposed thermal diepad) is only available on the QFN package. The
PowerPAD™ needs to be connected and soldered to analog ground (GND).
7 Specifications
7.1 Absolute Maximum Ratings (1)
over operating free-air temperature range (unless otherwise noted)
VIN
(2)
MIN
MAX
UNIT
Supply voltages on pin
–0.3
7
V
EN, ILED,
FB (2)
Voltages on pins
–0.3
7
V
OUT (2)
Voltage on pin
33
V
SW
(2)
Voltage on pin
Operating junction temperature
–40
Lead temperature (soldering, 10 s)
Tstg
(1)
(2)
Storage temperature
–55
33
V
150
°C
260
°C
150
°C
Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating
Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
All voltage values are with respect to network ground terminal.
7.2 ESD Ratings
VALUE
Human body model (HBM), per ANSI/ESDA/JEDEC JS-001
V(ESD)
(1)
(2)
Electrostatic discharge
(1)
UNIT
±4000
Charged-device model (CDM), per JEDEC specification JESD22C101 (2)
V
±750
JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
7.3 Recommended Operating Conditions
MIN
TYP
L
Inductor (1)
CI
Input capacitor (1)
CO
Output capacitor (1)
TA
Operating ambient temperature
-40
85
°C
TJ
Operating junction temperature
-40
125
°C
4
0.22
6.0
UNIT
Input voltage range
(1)
2.7
MAX
VI
V
22
µH
1
µF
1
µF
Refer to application section for further information.
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Copyright © 2004–2014, Texas Instruments Incorporated
Product Folder Links: TPS61060 TPS61061 TPS61062
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SLVS538B – NOVEMBER 2004 – REVISED DECEMBER 2014
7.4 Thermal Information
TPS6106x
THERMAL METRIC (1)
DRB
YZF
UNIT
8 PINS
RθJA
Junction-to-ambient thermal resistance
47.6
RθJC(top)
Junction-to-case (top) thermal resistance
54.1
0.7
RθJB
Junction-to-board thermal resistance
23.2
59.4
ψJT
Junction-to-top characterization parameter
1.0
2.2
ψJB
Junction-to-board characterization parameter
23.4
59.4
RθJC(bot)
Junction-to-case (bottom) thermal resistance
7.1
n/a
(1)
120.8
°C/W
For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
7.5 Electrical Characteristics
Vin = 3.6 V, EN = VIN, TA= –40°C to 85°C, typical values are at TA = 25°C (unless otherwise noted)
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
SUPPLY CURRENT
VIN
Input voltage range
2.7
IQ
Operating quiescent current into Vin
Device not switching
ISD
Shutdown current
EN = GND
VUVLO
Undervoltage lockout threshold
VIN falling
VHYS
Undervoltage lockout hysteresis
6
V
1
mA
1
10
µA
1.65
1.8
V
50
mV
ENABLE AND ILED
VEN
Enable high-level voltage
VIN = 2.7 V to 6 V
VEN
Enable low-level voltage
VIN = 2.7 V to 6 V
REN
Enable pulldown resistor
tshtdn
Enable-to-shutdown delay
(1)
tPWML
PWM low-level signal time
(1)
VILED
ILED high-level voltage
VIN = 2.7 V to 6 V
VILED
ILED low-level voltage
VIN = 2.7 V to 6 V
IILED
ILED input leakage current
ILED = GND or VIN
1.2
V
0.4
V
EN = high to low
50
ms
PWM signal applied to EN
25
ms
200
300
kΩ
1.2
V
0.1
0.4
V
3
µA
DAC resolution
5 Bit
tup
Increase feedback voltage one step
ILED = high to low
1
15.6
75
mV
µs
tdown
Decrease feedback voltage one step
ILED = high to low
180
300
µs
tdelay
Delay time between up/down steps
ILED = low to high
1.5
µs
toff
Digital programming off, VFB = 500 mV
ILED = high to low
720
µs
FEEDBACK FB
IFB
Feedback input bias current
VFB = 500 mV
VFB
Feedback regulation voltage
ILED = GND, after start-up
VFB
Feedback regulation voltage
ILED = High, after start-up
1
1.5
µA
485
500
515
mV
240
250
260
mV
POWER SWITCH SYNCHRONOUS RECTIFIER AND CURRENT LIMIT (SW)
P-channel MOSFET on-resistance
VO = 10 V, Isw = 10 mA
2.5
3.7
Ω
N-channel MOSFET on-resistance
VIN = VGS = 3.6 V, Isw = 100 mA
0.6
0.9
Ω
N-channel MOSFET on-resistance
VIN = VGS = 2.7 V, Isw = 100 mA
0.7
1.0
Ω
Iswleak
Switch leakage current (2)
VIN = VSW= 6 V, VOUT = GND,
EN = GND
0.1
2
µA
ISW
N-Channel MOSFET current limit
VO = 10 V
400
475
mA
rDS(ON)
RDS(ON)
(1)
(2)
325
A PWM low signal applied to EN for a time (≥25 ms) could cause a device shutdown. After a period of ≥50 ms the device definitely
enters shutdown mode.
The switch leakage current includes the leakage current of both internal switches, which is the leakage current from SW to ground, and
from SW to VOUT, with VIN = VSW.
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Electrical Characteristics (continued)
Vin = 3.6 V, EN = VIN, TA= –40°C to 85°C, typical values are at TA = 25°C (unless otherwise noted)
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
0.8
1.0
1.2
MHz
OSCILLATOR
fs
Switching frequency
OUTPUT
Vovp
Output overvoltage protection
VO rising; TPS61060
14
14.5
16
V
Vovp
Output overvoltage protection
VO rising; TPS61061
18
18.5
19.8
V
Vovp
Output overvoltage protection
VO rising; TPS61062
22.2
23.5
25
V
Vovp
Output overvoltage protection hysteresis
TPS61060/61/62, VO falling
Vo
Output voltage threshold for short-circuit
detection
Vo
Output voltage threshold for short-circuit
detection
0.7
V
VO falling
VIN–0.7
V
VO rising
VIN–0.3
V
Start-up, EN = low to high,
OUT = GND
Ipre
Precharge current and short-circuit current
VIN = 6 V
180
VIN = 3.6 V
VIN = 2.7 V
D
6
65
Maximum duty cycle
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mA
95
95%
Copyright © 2004–2014, Texas Instruments Incorporated
Product Folder Links: TPS61060 TPS61061 TPS61062
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SLVS538B – NOVEMBER 2004 – REVISED DECEMBER 2014
7.6 Typical Characteristics
Table 1. Table of Graphs
FIGURE
Efficiency (η)
vs LED current; 2 LEDs, ILED = high
Figure 1
vs LED current; 3 LEDs, ILED = low
Figure 2
vs LED current; 3 LEDs, ILED = high
Figure 3
vs LED current; 4 LEDs, ILED = low
Figure 4
vs LED current; 4 LEDs, ILED = high
Figure 5
vs LED current; 5 LEDs, ILED = high
Figure 6
Digital brightness control
Feedback voltage vs ILED programming step
Figure 7
LED current
vs PWM duty cycle
Figure 8
90
90
80
3 LEDS,
ILED = Low,
VOUT = 10.9 V
80
VIN = 4.2 V
VIN = 4.2 V
VIN = 3.6 V
VIN = 3 V
60
50
40
VIN = 3 V
60
50
40
2 LEDS,
ILED = High,
VOUT= 7.33 V
30
20
VIN = 3.6 V
70
Efficiency − %
Efficiency − %
70
0
10
20
30
40
50
30
20 0
60
10
3 LEDS,
ILED = High,
VOUT = 10.8 V
80
4 LEDS,
ILED = Low,
VOUT = 14.3 V
80
VIN = 3.6 V
Efficiency − %
Efficiency − %
60
50
VIN = 3 V
60
50
40
40
30
30
20
10
20
LED Current − mA
30
Figure 3. Efficiency vs LED Current
40
VIN = 4.2 V
VIN = 3.6 V
70
VIN = 3 V
0
40
90
VIN = 4.2 V
70
20
30
Figure 2. Efficiency vs LED Current
Figure 1. Efficiency vs LED Current
90
20
LED Current − mA
LED Current − mA
0
5
10
15
20
25
30
LED Current − mA
Figure 4. Efficiency vs LED Current
Copyright © 2004–2014, Texas Instruments Incorporated
Product Folder Links: TPS61060 TPS61061 TPS61062
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90
90
4 LEDS,
ILED = High,
VOUT = 14.3 V
80
VIN = 4.2 V
VIN = 3.6 V
70
Efficiency − %
Efficiency − %
60
50
30
30
10
15
20
LED Current − mA
25
20
30
0
Figure 5. Efficiency vs LED Current
20
25
Stepsize typ = 15.6 mV
20
450
18
400
16
LED Current − mA
VFB − Voltage Feedback − mV
10
15
LED Current − mA
22
500
350
300
250
200
150
100
50
0
5
Figure 6. Efficiency vs LED Current
600
550
VIN = 3 V
50
40
5
VIN = 3.6 V
60
40
0
VIN = 4.2 V
70
VIN = 3 V
20
5 LEDS,
ILED = High,
VOUT = 17.8 V
80
14
f = 1 kHz
12
10
8
f = 500 Hz
6
0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17
4
f = 100 Hz
ILED − Programming Step
2
0
Figure 7. Digital Brightness Control Feedback Voltage vs
ILED Programming Step
8
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0
10
20
30 40 50 60 70
PWM − Duty Cycle − %
80
90
100
Figure 8. LED Current vs PWM Duty Cycle
Copyright © 2004–2014, Texas Instruments Incorporated
Product Folder Links: TPS61060 TPS61061 TPS61062
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SLVS538B – NOVEMBER 2004 – REVISED DECEMBER 2014
8 Detailed Description
8.1 Overview
The TPS61060/61/62 family is a constant-frequency, PWM current-mode converter with an integrated N-channel
MOSFET switch and synchronous P-channel MOSFET rectifier. The device operates in pulse width modulation
(PWM) with a fixed switching frequency of 1 MHz. For an understanding of the device operation, refer the block
diagram. The duty cycle of the converter is set by the error amplifier and the sawtooth ramp applied to the
comparator. Because the control architecture is based on a current-mode control, a compensation ramp is added
to allow stable operation for duty cycles larger than 50%. The converter is a fully integrated synchronous boost
converter operating always in continuous conduction mode. This allows low noise operation and avoids ringing
on the switch pin as it would be seen on a converter when entering discontinuous conduction mode.
8.2 Functional Block Diagram
SW
Q2
Precharge Current/PWM
Short-Circuit Detection
VIN
50-mS
Turnoff
Delay
Bias Vref = 1.22 V
Thermal Shutdown
UVLO
OUT
OVP
Oscillator
1 MHz
EN
Error
Amplifier
EN
Vref
Control Logic
Gate Drive Circuit
FB
Q1
EN
Comparator
EN
Σ
EN
Current Limit
Current Sense
300 kW
Ramp
Compensation
GND
PGND
Vref = 1.22 V
ILED = High VFB = 250 mV
ILED = Low VFB = 500 mV
ILED Programmed VFB = 15.6 mV to 500 mV
5-Bit
DAC
15.6 mV/Step
Digital
Interface
ILED
8.3 Feature Description
8.3.1 Start-Up
To avoid high inrush current during start-up, special care is taken to control the inrush current. When the device
is first enabled, the output capacitor is charged with a constant precharge current of typically 100 mA until the
output voltage is typically 0.3 V below VIN. The device starts with a reduced analog controlled current limit for
typically 40 µs. After this time, the device enters its normal regulation with full current limit. The fixed precharge
current during start-up allows the device to start up without problems when driving LEDs because the LED only
starts to conduct current when the forward voltage is reached. If, for any reason a resistive load is driven, the
maximum start-up load current must be smaller, or equal to, the precharge current.
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Feature Description (continued)
8.3.2 Short-Circuit Protection
The TPS6106x family has an advanced short-circuit protection in case the output of the device is shorted to
ground. Because the device is configured as a current source even when the LEDs are shorted, the maximum
current is controlled by the sense resistor Rs. As an additional safety feature, the TPS6106x series also protects
the device and inductor when the output is shorted to ground. When the output is shorted to ground, the device
enters precharge mode and limits the maximum current to typically 100 mA.
8.3.3 Overvoltage Protection (OVP)
As with any current source, the output voltage rises when the output gets high impedance or disconnected. To
prevent the output voltage exceeding the maximum switch voltage rating (33 V) of the main switch, an
overvoltage protection circuit is integrated. As soon as the output voltage exceeds the OVP threshold, the
converter stops switching and the output voltage falls down. When the output voltage falls below the OVP
threshold, the converter continues operation until the output voltage exceeds the OVP threshold again. To allow
the use of inexpensive low-voltage output capacitors, the TPS6106x series has different OVP levels that must be
selected according to the number of external LEDs and their maximum forward voltage.
8.3.4 Efficiency and Feedback Voltage
The feedback voltage has a direct effect on the converter efficiency. Because the voltage drop across the
feedback resistor does not contribute to the output power (LED brightness), the lower the feedback voltage, the
higher the efficiency. Especially when powering only three or less LEDs, the feedback voltage impacts the
efficiency around 2% depending on the sum of the forward voltage of the LEDs. To take advantage of this, the
ILED pin can be connected to VIN, setting the feedback voltage to 250 mV.
8.3.5 Undervoltage Lockout
An undervoltage lockout prevents mis-operation of the device at input voltages below typical 1.65 V. When the
input voltage is below the undervoltage threshold, the device remains off and both internal MOSFETs are turned
off providing isolation between input and output.
8.3.6 Thermal Shutdown
An internal thermal shutdown is implemented and turns off the internal MOSFETs when the typical junction
temperature of 160°C is exceeded. The thermal shutdown has a hysteresis of typically 15°C.
8.4 Device Functional Modes
8.4.1 Enable PWM Dimming
The EN pin allows disabling and enabling of the device as well as brightness control of the LEDs by applying a
PWM signal up to typically 1 kHz. When a PWM signal is applied, the LED current is turned on when the EN is
high and off when EN is pulled low. Changing the PWM duty cycle therefore changes the LED brightness. To
allow higher PWM frequencies on the enable pin, the device continues operation when a PWM signal is applied.
As shown in the block diagram, the EN pin needs to be pulled low for at least 50 ms to fully turn the device off.
The enable input pin has an internal 300-kΩ pulldown resistor to disable the device when this pin is floating.
8.4.2 Digital Brightness Control (ILED)
The ILED pin features a simple digital interface to allow digital brightness control. This can save processor power
and battery life. Using the digital interface to control the LED brightness does not required a PWM signal all the
time, and the processor can enter sleep mode if available. To save signal lines, the ILED pin can be connected
to the enable pin to allow digital programming and enable/disable function at the same time with the same signal.
Such a circuit is shown in Figure 9.
10
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SLVS538B – NOVEMBER 2004 – REVISED DECEMBER 2014
Device Functional Modes (continued)
The ILED pin basically sets the feedback regulation voltage (VFB); thus, it sets the LED current. When the ILED
pin is connected to GND, the digital brightness control is disabled and the feedback is regulated to VFB =
500 mV. When the ILED pin is pulled high, the digital brightness control is enabled starting at its midpoint where
the feedback is regulated to VFB = 250 mV. The digital brightness control is implemented by adjusting the
feedback voltage in digital steps with a typical maximum voltage of VFB = 500 mV. For this purpose, a 5-bit DAC
is used giving 32 steps equal to a 15.6-mV change in feedback voltage per step. To increase or decrease the
internal reference voltage, the ILED pin needs to be pulled low over time as outlined in Table 2 and specified in
the electrical table. When the internal DAC is programmed to its highest or lowest value, it stays at this value
until it gets programmed in the opposite direction again.
Table 2. Increase/Decrease Internal Reference Voltage
FEEDBACK VOLTAGE
TIME
ILED LOGIC LEVEL
Increase
1 µs to 75 µs
Low
Decrease
180 µs to 300 µs
Low
Brightness control disabled
≥550 µs
Low
Delay between steps
1.5 µs
High
Between each cycle the ILED pin needs to be pulled high for 1.5 µs.
td
High
ILED
Low
td
tup
tdown
td
toff
Brightness
Control Disabled
Brightness Brightness
Control
Control
Disabled
Enabled
Figure 9. ILED Timing Diagram
Using the digital interface on the ILED pin allows simple implementation of a two-step brightness control by
pulling the ILED either high or low. For full LED current with VFB = 500 mV, the ILED must be pulled low; to
program half the LED current with VFB = 250 mV, the ILED pin must be pulled high.
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9 Application and Implementation
NOTE
Information in the following applications sections is not part of the TI component
specification, and TI does not warrant its accuracy or completeness. TI’s customers are
responsible for determining suitability of components for their purposes. Customers should
validate and test their design implementation to confirm system functionality.
9.1 Application Information
The TPS6106x is designed to driver up to five LEDs in series with constant current output. The device, which
operates in peak current mode PWM control, has a switch peak current limit of 325-mA minimum and internal
loop compensation. The switching frequency is fixed at 1 MHz, and the input voltage range is 2.7 to 6.0 V. The
following section provides a step-by-step design approach for configuring the TPS61060 to power two white
LEDs in series.
9.2 Typical Application
C2
220 nF
VIN
3 V to 6 V
L1
22 mH
C1
1 mF
VIN
SW
EN
OUT
ILED
FB
GND PGND
RS
12 W
Figure 10. TPS61062 Powering Five White LEDs
9.2.1 Design Requirements
PARAMETER
VALUE
Input Voltage
3 V to 6 V
Output Current
20 mA
9.2.2 Detailed Design Procedure
9.2.2.1 Inductor Selection
The device requires typically a 22-µH or 10-µH inductance. When selecting the inductor, the inductor saturation
current should be rated as high as the peak inductor current at maximum load, and respectively, maximum LED
current. Because of the special control loop design, the inductor saturation current does not need to be rated for
the maximum switch current of the converter. The maximum converter switch current usually is not reached even
when the LED current is pulsed by applying a PWM signal to the enable pin. The maximum inductor peak
current, as well as LED current, is calculated as:
Vin
Duty cycle : D = 1 Vout
(1)
Vin ´ D
Maxim um LED current : I LED = (lsw ) ´ (1 - D) ´ h
2 ´ fs ´ L
(2)
Vin ´ D
ILED
Inductor peak current : iLpeak =
+
2 ´ fs ´ L (1 - D) ´ h
(3)
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with:
fs = Switching frequency (1 MHz typical)
L = Inductor value
η = Estimated converter efficiency (0.75)
Isw = Minimum N-channel MOSFET current limit (325 mA)
(4)
Using the expected converter efficiency is a simple approach to calculate maximum possible LED current as well
as peak inductor current. The efficiency can be estimated by taking the efficiency numbers out of the provided
efficiency curves or to use a worst-case assumption for the expected efficiency, for example, 75%.
9.2.2.2 Efficiency
The overall efficiency of the application depends on the specific application conditions and mainly on the
selection of the inductor. A physically smaller inductor usually shows lower efficiency due to higher switching
losses of the inductor (core losses, proximity losses, skin effect losses). A trade-off between physical inductor
size and overall efficiency has to be made. The efficiency can typically vary around ±5% depending on the
selected inductor. Figure 2 to Figure 7 can be used as a guideline for the application efficiency. These curves
show the typical efficiency with a 22-µH inductor (Murata Electronics LQH32CN220K23). Figure 11 shows a
basic setup where the efficiency is taken/measured as:
VLED ´ ILED
h=
(5)
Vin ´ Iin
Table 3. Inductor Selection
INDUCTOR VALUE
COMPONENT SUPPLIER
DIMENSIONS
10 µH
TDK VLF3012AT-100MR49
2.6 mm × 2.8 mm × 1.2 mm
10 µH
Murata LQH32CN100K53
3.2 mm × 2.5 mm × 1.55 mm
10 µH
Murata LQH32CN100K23
3.2 mm × 2.5 mm × 2.0 mm
22 µH
TDK VLF3012AT-220MR33
2.6 mm × 2.8 mm × 1.2 mm
22 µH
Murata LQH32CN220K53
3.2 mm × 2.5 mm × 1.55 mm
22 µH
Murata LQH32CN220K23
3.2 mm × 2.5 mm × 2.0 mm
ILED
C2
220 nF
VIN
2.7 V to 6 V
L1
22 mH
VLED
Iin
C1
1 mF
Vin
VIN
SW
EN
OUT
ILED
FB
GND PGND
RS
12 W
Figure 11. Efficiency Measurement Setup
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9.2.2.3 Output Capacitor Selection
The device is designed to operate with a fairly wide selection of ceramic output capacitors. The selection of the
output capacitor value is a trade-off between output voltage ripple and capacitor cost and form factor. In general,
capacitor values of 220 nF up to 4.7 µF can be used. When using a 220-nF output capacitor, it is recommended
to use X5R or X7R dielectric material to avoid the output capacitor value falling far below 220 nF over
temperature and applied voltage. For systems with wireless or RF sections, EMI is always a concern. To
minimize the voltage ripple in the LED string and board traces, the output capacitor needs to be connected
directly from the OUT pin of the device to ground rather than across the LEDs. A larger output capacitor value
reduces the output voltage ripple. Table 4 shows possible input and/or output capacitors.
9.2.2.4 Input Capacitor Selection
For good input voltage filtering, low ESR ceramic capacitors are recommended. A 1-µF ceramic input capacitor is
sufficient for most of the applications. For better input voltage filtering and EMI reduction, this value can be
increased. The input capacitor should be placed as close as possible to the input pin of the converter. Table 4
shows possible input and/or output capacitors.
Table 4. Capacitor Selection
VOLTAGE RATING
FORM FACTOR
COMPONENT SUPPLIER (1)
10 V
0603
Tayo Yuden LMK107BJ105
220 nF
16 V
0603
Tayo Yuden EMK107BJ224
TPS61060
220 nF
50 V
0805
Tayo Yuden UMK212BJ224
TPS61060/61/62
470 nF
35 V
0805
Tayo Yuden GMK212BJ474
TPS61060/61/62
1 µF
16 V
0805
Tayo Yuden EMK212BJ105
TPS61060
1 µF
35 V
1206
Tayo Yuden GMK316BJ105
TPS61060/61/62
1 µF
25 V
1206
TDK C3216X7R1E105
TPS61060/61/62
CAPACITOR
COMMENTS
INPUT CAPACITOR
1 µF
OUTPUT CAPACITOR
(1)
Similar capacitors are also available from TDK and other suppliers.
9.2.3 Application Curves
C1 Frequency
199.9991 Hz
Low Signal
Amplitude
EN
2 V/div
EN
2 V/div
LED Current
20 mA/div
Inductor Current
100 mA/div
LED Current
20 mA/div
Inductor Current
100 mA/div
1 ms/div
space
100 ms/div
Figure 12. PWM Dimming
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Figure 13. Soft-Start Operation
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TPS61062
SW
20 V/div
SW
20 V/div
Output Voltage
20 V/div
Inductor Current
200 mA/div
Output Voltage
2 V/div
17 V DC Offset
20 ms/div
500 ms/div
Figure 14. Short-Circuit Protection
Figure 15. Overvoltage Protection
SW
10 V/div
Input Voltage
20 mV/div
500 ns/div
Figure 16. Input Voltage Ripple
9.3 System Examples
C2
220 nF
VIN
2.7 V to 6 V
L1
22 mH
C1
1 mF
VIN
SW
EN
OUT
ILED
FB
GND PGND
RS
12 W
Figure 17. TPS61060 Powering Two White LEDs
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System Examples (continued)
C2
220 nF
VIN
2.7 V to 6 V
L1
22 mH
C1
1 mF
VIN
SW
EN
OUT
ILED
FB
RS
12 W
GND PGND
Figure 18. TPS61060 Powering Three White LEDs
C2
220 nF
VIN
2.7 V to 6 V
L1
22 mH
C1
1 mF
VIN
SW
EN
OUT
ILED
FB
GND PGND
RS
12 W
Figure 19. TPS61061 Powering Four White LEDs
C2
220 nF
VIN
3 V to 6 V
L1
22 mH
C1
1 mF
VIN
SW
EN
OUT
ILED
FB
GND PGND
RS
25 W
R1
25 W
Figure 20. TPS61060 Powering Six White LEDs
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System Examples (continued)
C2
220 nF
VIN
2.7 V to 6 V
L1
22 H
C1
1 F
Digital
Brightness
Control
VIN
SW
EN
OUT
ILED
FB
GND PGND
RS
12
This circuit combines the enable with the digital brightness control pin, allowing the digital signal applied to ILED to
also enable and disable the device.
Figure 21. TPS61061 Digital Brightness Control
10 Power Supply Recommendations
The TPS6106x is designed to operate from an input voltage supply range from 2.7-V to 6.0-V. The power supply
to the TPS6106x must have a current rating according to the supply voltage, output voltage, and output current
of the TPS6106x device.
11 Layout
11.1 Layout Guidelines
As for all switching power supplies, the layout is an important step in the design, especially at high peak currents
and switching frequencies. If the layout is not carefully done, the regulator might show noise problems and duty
cycle jitter. The input capacitor should be placed as close as possible to the input pin for good input voltage
filtering. The inductor should be placed as close as possible to the switch pin to minimize the noise coupling into
other circuits. The output capacitor needs to be placed directly from the OUT pin to GND rather than across the
LEDs. This reduces the ripple current in the trace to the LEDs. The GND pin must be connected directly to the
PGND pin. When doing the PCB layout, the bold traces (Figure 22) should be routed first, as well as placement
of the inductor, and input and output capacitors.
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11.2 Layout Example
GND
1
EN
2
ILED
3
FB
4
TPS6106x
GND
VIN
8
VIN
7
OUT
6
SW
5
PGND
LED+
LEDFigure 22. TPS6106x Layout Example
11.3 Thermal Considerations
The TPS6106x comes in a thermally enhanced QFN package. The package includes a thermal pad that
improves the thermal capabilities of the package. Also see QFN/SON PCB Attachment application report
(SLUA271). The thermal resistance junction-to-ambient RθJA of the QFN package greatly depends on the PCB
layout. Using thermal vias and wide PCB traces improves the thermal resistance RθJA. The thermal pad must be
soldered to the analog ground on the PCB.
For the NanoFree package, similar guidelines apply for the QFN package. The thermal resistance RθJA depends
mainly on the PCB layout.
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12 Device and Documentation Support
12.1 Device Support
12.1.1 Third-Party Products Disclaimer
TI'S PUBLICATION OF INFORMATION REGARDING THIRD-PARTY PRODUCTS OR SERVICES DOES NOT
CONSTITUTE AN ENDORSEMENT REGARDING THE SUITABILITY OF SUCH PRODUCTS OR SERVICES
OR A WARRANTY, REPRESENTATION OR ENDORSEMENT OF SUCH PRODUCTS OR SERVICES, EITHER
ALONE OR IN COMBINATION WITH ANY TI PRODUCT OR SERVICE.
12.2 Related Links
The table below lists quick access links. Categories include technical documents, support and community
resources, tools and software, and quick access to sample or buy.
Table 5. Related Links
PARTS
PRODUCT FOLDER
SAMPLE & BUY
TECHNICAL
DOCUMENTS
TOOLS &
SOFTWARE
SUPPORT &
COMMUNITY
TPS61060
Click here
Click here
Click here
Click here
Click here
TPS61061
Click here
Click here
Click here
Click here
Click here
TPS61062
Click here
Click here
Click here
Click here
Click here
12.3 Trademarks
NanoFree, PowerPAD are trademarks of Texas Instruments.
All other trademarks are the property of their respective owners.
12.4 Electrostatic Discharge Caution
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
12.5 Glossary
SLYZ022 — TI Glossary.
This glossary lists and explains terms, acronyms, and definitions.
13 Mechanical, Packaging, and Orderable Information
The following pages include mechanical, packaging, and orderable information. This information is the most
current data available for the designated devices. This data is subject to change without notice and revision of
this document. For browser-based versions of this data sheet, refer to the left-hand navigation.
13.1 Chipscale Package Dimensions
The TPS6106x is available in a Chipscale package and has the following mechanical dimensions: E=D=1,446
mm (typical), E=D=1,424 mm (minimum), E=D=1,5 mm (maximum). See the mechanical drawing of the package
(YZF).
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PACKAGE OPTION ADDENDUM
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14-Oct-2022
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
(2)
Lead finish/
Ball material
MSL Peak Temp
Op Temp (°C)
Device Marking
(3)
Samples
(4/5)
(6)
TPS61060DRBR
ACTIVE
SON
DRB
8
3000
RoHS & Green
NIPDAU
Level-2-260C-1 YEAR
-40 to 85
AQP
Samples
TPS61060YZFR
ACTIVE
DSBGA
YZF
8
3000
RoHS & Green
SNAGCU
Level-1-260C-UNLIM
-40 to 85
AKX
Samples
TPS61060YZFT
ACTIVE
DSBGA
YZF
8
250
RoHS & Green
SNAGCU
Level-1-260C-UNLIM
-40 to 85
AKX
Samples
TPS61061DRBR
ACTIVE
SON
DRB
8
3000
RoHS & Green
NIPDAU
Level-2-260C-1 YEAR
-40 to 85
AQQ
Samples
TPS61061YZFT
ACTIVE
DSBGA
YZF
8
250
RoHS & Green
SNAGCU
Level-1-260C-UNLIM
-40 to 85
AKY
Samples
TPS61062DRBR
ACTIVE
SON
DRB
8
3000
RoHS & Green
NIPDAU
Level-2-260C-1 YEAR
-40 to 85
AQR
Samples
TPS61062YZFR
ACTIVE
DSBGA
YZF
8
3000
RoHS & Green
SNAGCU
Level-1-260C-UNLIM
-40 to 85
AKZ
Samples
TPS61062YZFT
ACTIVE
DSBGA
YZF
8
250
RoHS & Green
SNAGCU
Level-1-260C-UNLIM
-40 to 85
AKZ
Samples
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of
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