TPS61099
SLVSD88L – JULY 2016 – REVISED AUGUST 2021
TPS61099x Synchronous Boost Converter with Ultra-Low Quiescent Current
1 Features
•
•
•
•
•
•
•
•
•
•
•
•
600-nA ultra-low IQ into VOUT pin
400-nA ultra-low IQ into VIN pin
Operating input voltage from 0.7 V to 5.5 V
Adjustable output voltage from 1.8 V to 5.5 V
Fixed output voltage versions available
Minimum 0.8-A switch peak current limit
Regulated output voltage in down mode
True disconnection during shutdown
Up to 75% efficiency at 10-µA load with fixed
output voltage versions
Up to 93% efficiency from 10-mA to 300-mA load
6-ball 1.23-mm × 0.88-mm WCSP package and
2-mm × 2-mm WSON package
Create a custom design using the TPS61099x with
the WEBENCH® Power Designer
The TPS61099x also offers both Down mode and
Pass-Through operations for different applications. In
Down mode, the output voltage can still be regulated
at target value even when input voltage is higher
than the output voltage. In Pass-Through mode, the
output voltage follows input voltage. The TPS61099x
exits Down mode and enters into Pass-Through mode
when VIN > VOUT + 0.5 V.
The TPS61099x supports true shutdown function
when it is disabled, which disconnects the load from
the input supply to reduce the current consumption.
2 Applications
•
•
•
•
•
•
The TPS61099x boost converter uses a hysteretic
control topology to obtain maximal efficiency at
minimal quiescent current. It only consumes 1-µA
quiescent current under light-load condition and can
achieve up to 75% efficiency at 10-µA load with fixed
output voltage version. It can also support up to 300mA output current from 3.3-V to 5-V conversion, and
achieve up to 93% at 200-mA load.
Memory LCD bias
Optical heart rate monitor LED bias
Wearable applications
Low-power wireless applications
Portable products
Battery powered systems
The TPS61099x offers both adjustable output voltage
version and fixed output voltage versions. It is
available in a 6-ball 1.23-mm × 0.88-mm WCSP
Package and a 6-pin 2-mm × 2-mm WSON package.
Device Information
3 Description
PART NUMBER
The TPS61099x device is a synchronous boost
converter with 1-µA ultra-low quiescent current. The
device is designed for products powered by an
alkaline battery, NiMH rechargeable battery, Li-Mn
battery, or rechargeable Li-Ion battery where high
efficiency under light-load condition is critical to
achieve long battery life operation.
PACKAGE(1)
BODY SIZE (NOM)
WCSP (6)
1.23 mm × 0.88 mm
WSON(6)
2 mm × 2 mm
TPS61099
TPS61099x
TPS61099
TPS61099x
(1)
For all available packages, see the orderable addendum at
the end of this document.
1.8 V to 5.5 V
VOUT
L1
2.2 µH
VIN
0.7 V to 5.5 V
VOUT
SW
R1
VIN
TPS61099
FB
C1
10 µF
C2
C3
10 µF
10 µF
R2
EN
GND
Copyright © 2016, Texas Instruments Incorporated
Typical Application Circuit
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.
TPS61099
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SLVSD88L – JULY 2016 – REVISED AUGUST 2021
Table of Contents
1 Features............................................................................1
2 Applications..................................................................... 1
3 Description.......................................................................1
4 Revision History.............................................................. 2
5 Device Comparison Table...............................................3
6 Pin Configuration and Functions...................................3
7 Specifications.................................................................. 4
7.1 Absolute Maximum Ratings........................................ 4
7.2 ESD Ratings............................................................... 4
7.3 Recommended Operating Conditions.........................4
7.4 Thermal Information....................................................4
7.5 Electrical Characteristics.............................................5
7.6 Typical Characteristics................................................ 7
8 Detailed Description......................................................10
8.1 Overview................................................................... 10
8.2 Functional Block Diagram......................................... 10
8.3 Feature Description...................................................10
8.4 Device Functional Modes..........................................13
9 Application and Implementation.................................. 14
9.1 Application Information............................................. 14
9.2 Typical Application - 5 V Output Boost Converter.....14
10 Power Supply Recommendations..............................18
11 Layout........................................................................... 19
11.1 Layout Guidelines................................................... 19
11.2 Layout Example...................................................... 19
12 Device and Documentation Support..........................21
12.1 Device Support....................................................... 21
12.2 Documentation Support.......................................... 21
12.3 Receiving Notification of Documentation Updates..21
12.4 Support Resources................................................. 21
12.5 Trademarks............................................................. 22
12.6 Electrostatic Discharge Caution..............................22
12.7 Glossary..................................................................22
13 Mechanical, Packaging, and Orderable
Information.................................................................... 22
4 Revision History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
Changes from Revision K (May 2018) to Revision L (August 2021)
Page
• Updated the numbering format for tables, figures and cross-references throughout the document. .................1
Changes from Revision J (October 2017) to Revision K (May 2018)
Page
• Added Load Efficiency graph for TPS610995 device ........................................................................................ 7
2
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5 Device Comparison Table
(1)
PART NUMBER
OUTPUT VOLTAGE
TPS61099
Adjustable
TPS610997
5.0 V
TPS610996
4.5 V
TPS610995
3.6 V
TPS610994
3.3 V
TPS610993
3.0 V
TPS610992
2.5 V
TPS610991(1)
1.8 V
Product Preview. Contact TI factory for more information.
6 Pin Configuration and Functions
VIN
A1
A2
GND
1
B1
B2
EN
C1
C2
VOUT
2
3
FB
Figure 6-1. YFF Package 6-Pin YFF Top View
PowerPad
SW
6
5
4
Figure 6-2. DRV Package 6-Pin DRV Top View
Table 6-1. Pin Functions
PIN
TYPE
DESCRIPTION
NAME
YFF
DRV
VIN
A1
6
SW
B1
5
EN
C1
4
GND
A2
1
PWR Ground
VOUT
B2
2
PWR Boost converter output
FB
C2
3
PowerPad
I
IC power supply input
PWR Switch pin of the converter. It is connected to the inductor
I
I
7
Enable logic input. Logic high voltage enables the device; logic low voltage disables the device.
Do not leave it floating.
Voltage feedback of adjustable output voltage. Connect to the center tap of a resistor divider to
program the output voltage. Connect to GND pin for fixed output voltage versions.
Connect to GND
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7 Specifications
7.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted)(1)
MIN
MAX
UNIT
-0.3
6.0
V
Operating junction temperature, TJ
–40
150
°C
Storage temperature range, Tstg
–65
150
°C
Voltage range at terminals(2)
(1)
(2)
VIN, SW, VOUT, FB, EN
Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating
Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
All voltage values are with respect to network ground terminal.
7.2 ESD Ratings
V(ESD)
(1)
(2)
Electrostatic discharge
VALUE
UNIT
Human Body Model (HBM), per ANSI/ESDA/JEDEC JS-001, all pins(1)
±2000
V
Charged Device Model (CDM), per JEDEC specification JESD22C101, all pins(2)
±500
JEDEC document JEP155 states that 500V HBM rating allows safe manufacturing with a standard ESD control process.
JEDEC document JEP157 states that 250V CDM rating allows safe manufacturing with a standard ESD control process.
7.3 Recommended Operating Conditions
MIN
NOM
VIN
Input voltage range
0.7
VOUT
Output voltage range
1.8
L
Inductor
0.7
2.2
CIN
Input capacitor
1.0
10
COUT
Output capacitor
10
20
TJ
Operating virtual junction temperature
MAX
UNIT
5.5
–40
V
5.5
V
2.86
µH
µF
100
µF
125
°C
7.4 Thermal Information
TPS61099
THERMAL METRIC(1)
DRV(6 PINS,
WSON)
UNIT
RθJA
Junction-to-ambient thermal resistance
134.4
71.7
°C/W
RθJCtop
Junction-to-case (top) thermal resistance
0.9
83.0
°C/W
RθJB
Junction-to-board thermal resistance
36.1
33.9
°C/W
ψJT
Junction-to-top characterization parameter
0.1
2.7
°C/W
ψJB
Junction-to-board characterization parameter
36.2
33.4
°C/W
RθJCbot
Junction-to-case (bottom) thermal resistance
N/A
14.4
°C/W
(1)
4
YFF (6 BALLS,
WCSP)
For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
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7.5 Electrical Characteristics
TJ = -40°C to 125°C and VIN = 0.7 V to 5.5 V. Typical values are at VIN = 3.7 V, TJ = 25°C, unless otherwise noted.
PARAMETER
Version
TEST CONDITIONS
MIN
TYP
MAX
UNIT
POWER SUPPLY
VIN
Input voltage range
TPS61099x
VUVLO
Input under voltage lockout threshold
TPS61099x
UVLO hysteresis
TPS61099x
0.6
5.5
V
0.7
V
200
mV
Quiescent current into VIN pin
TPS61099x
IC enabled, no Load, no Switching
TJ = -40 °C to 85 °C
Quiescent current into VOUT pin
TPS61099x
IC enabled, no Load, no Switching,
Boost or Down Mode
TJ = -40 °C to 85 °C
0.6
1.5
µA
Shutdown current into VIN pin
TPS61099x
IC disabled, VIN = 3.7 V, VOUT = 0 V
TJ = -40 °C to 85 °C
0.5
1.6
µA
Output voltage range
TPS61099
5.5
V
5.00
5.10
V
3.37
V
IQ
ISD
0.7
VIN rising
0.4
1.1
µA
OUTPUT
VOUT
TPS610997
TPS610994
TPS610993
Output accuracy
TPS610996
TPS610992
TPS610995
VREF
Feedback reference voltage
VOVP
Output overvoltage protection threshold TPS61099x
IFB_LKG
1.8
VIN < VOUT, PWM mode
VIN < VOUT, PFM mode
VIN < VOUT, PWM mode
VIN < VOUT, PWM mode
VIN < VOUT, PWM mode
VIN < VOUT, PWM mode
VOUT rising
3.0
3.06
3.1
4.4
4.5
4.6
4.63
2.45
2.5
2.55
2.58
3.53
VIN < VOUT, PFM mode
VIN < VOUT, PFM mode
TPS61099x
2.94
VIN < VOUT, PFM mode
VIN < VOUT, PWM mode
3.30
3.4
VIN < VOUT, PFM mode
TPS61099
Leakage current into FB pin
3.23
VIN < VOUT, PFM mode
VIN < VOUT, PWM mode
TPS61099x
5.15
VIN < VOUT, PFM mode
TPS61099
OVP hysteresis
4.90
3.6
3.67
3.71
0.98
1.00
1.02
1.03
5.6
VFB = 1.0 V
V
V
V
V
V
V
5.8
6.0
V
100
200
mV
10
50
nA
POWER SWITCH
RDS(on)_LS
RDS(on)_HS
ILH
Low side switch on resistance
Rectifier on resistance
Inductor current ripple
TPS61099x
TPS61099x
TPS61099x
ILIM
Current limit threshold
TPS61099x
ISW_LKG
Leakage current into SW pin (from SW
pin to GND)
TPS61099x
VOUT = 5.0 V
250
mΩ
VOUT = 3.3 V
300
mΩ
VOUT = 1.8 V
400
VOUT = 5.0 V
300
350
mΩ
VOUT = 3.3 V
350
450
mΩ
VOUT = 1.8 V
500
750
mΩ
VOUT = 5.0 V
350
mA
VOUT = 3.3 V
300
mA
VOUT = 1.8 V
250
VOUT ≥ 2.5 V, boost operation
0.8
1
VOUT < 2.5 V, boost operation
0.5
0.75
VSW = 5.0 V, no switch, TJ = -40 °C to 85 °C
mΩ
mA
1.25
A
A
200
nA
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7.5 Electrical Characteristics (continued)
TJ = -40°C to 125°C and VIN = 0.7 V to 5.5 V. Typical values are at VIN = 3.7 V, TJ = 25°C, unless otherwise noted.
PARAMETER
Version
TEST CONDITIONS
MIN
TYP
MAX
UNIT
CONTROL LOGIC
6
0.2 x
VIN
VIL
EN input low voltage threshold
TPS61099x
VIN ≤ 1.5 V
VIH
EN input high voltage threshold
TPS61099x
VIN ≤ 1.5 V
VIL
EN input low voltage threshold
TPS61099x
VIN > 1.5 V
VIH
EN input high voltage threshold
TPS61099x
VIN > 1.5 V
1.2
V
IEN_LKG
Leakage current into EN pin
TPS61099x
VEN = 5.0 V
50
nA
Overtemperature protection
TPS61099x
150
°C
Overtemperature hysteresis
TPS61099x
25
°C
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V
0.8 x
VIN
0.4
V
V
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100
100
95
95
Load Efficiency with Different Input
Load Efficiency with Different Input
7.6 Typical Characteristics
90
85
80
75
70
65
VIN = 0.7 V
VIN = 1.5 V
VIN = 3.0 V
VIN = 3.6 V
VIN = 4.2 V
60
55
50
45
0.005
0.1
1
10
IOUT (mA)
100
90
85
80
75
70
60
55
0.005
1000
0.1
Figure 7-1. TPS61099 Load Efficiency with Different Inputs
95
90
90
85
85
Efficiency (%)
100
75
70
65
75
70
55
50
0.01
0.1
1
10
Output Current (mA)
100
VIN = 0.7V
VIN = 1.5V
VIN = 2.5V
VIN = 3.0V
VIN = 3.3V
60
VIN = 3.3 V
VIN = 4.2 V
55
1000
50
0.01
0.1 0.2 0.5 1
D016
TPS610996, VIN= 0.7 V, 1.5 V, 2.7, 3.3 V, 4.2 V
Figure 7-3. TPS610996 Load Efficiency with Different Inputs
D002
80
65
VIN = 0.7 V
VIN = 1.5 V
VIN = 2.7 V
1000
Figure 7-2. TPS610997 Load Efficiency with Different Inputs
95
80
100
TPS610997, VIN= 0.7 V, 1.5 V, 3.0 V, 3.6 V, 4.2 V
100
60
1
10
IOUT (mA)
D001
TPS61099, VIN = 0.7 V, 1.5 V, 3.0 V, 3.6 V, 4.2 V, VOUT = 5.0 V
Efficiency (%)
VIN = 0.7 V
VIN = 1.5 V
VIN = 3.0 V
VIN = 3.6 V
VIN = 4.2 V
65
2 3 5 710 20
Iout (mA)
50 100
1000
TPS6
TPS610995, VIN= 0.7 V, 1.5 V, 2.0, 3.0 V, 3.3 V
Figure 7-4. TPS610995 Load Efficiency with Different Inputs
Load Efficiency with Different Input
100
95
90
85
80
75
70
VIN = 0.7 V
VIN = 1.5 V
VIN = 2.5 V
VIN = 3.0 V
65
60
0.005
0.1
1
10
IOUT (mA)
100
1000
0.1
D003
10
IOUT (mA)
100
1000
TPS610993, VIN= 0.7 V, 1.5 V, 2.2 V, 2.5 V
TPS610994, VIN= 0.7 V, 1.5 V, 2.5 V, 3.0 V
Figure 7-5. TPS610994 Load Efficiency with Different Inputs
1
Figure 7-6. TPS610993 Load Efficiency with Different Inputs
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7.6 Typical Characteristics (continued)
100
95
Load Efficiency with Different Output
95
90
Efficiency (%)
85
80
75
70
65
VIN = 0.7 V
VIN = 1.2 V
VIN = 1.5 V
VIN = 2.2 V
60
55
50
0.01
0.1
1
10
Output Current (mA)
100
90
85
80
75
70
65
VOUT = 3.0 V
VOUT = 3.6 V
VOUT = 4.5 V
VOUT = 5.0 V
60
55
50
0.005
1000
0.1
1
10
IOUT (mA)
D014
TPS610992, VIN= 0.7 V, 1.2 V, 1.5 V, 2.2 V
100
D004
TPS61099, VIN = 2.4 V, VOUT = 3.0 V, 3.6 V, 4.5 V, 5.0 V
Figure 7-7. TPS610992 Load Efficiency with Different Inputs
Figure 7-8. Load Efficiency with Different Outputs
1.2
5.4
VIN = 3.7 V
Vin = 0.7 V
Vin = 1.5 V
5.3
1
5.2
Quiescent Current (µA)
Vin = 3.0 V
Output Voltage (V)
1000
Vin = 3.6 V
Vin = 4.2 V
5.1
5
4.9
0.8
0.6
0.4
0.2
4.8
4.7
10 µ
100 µ
1m
10 m
Output Current (A)
100 m
0
-40
600 m
D003a
TPS61099, VIN = 0.7 V, 1.5 V, 3.0 V, 3.6 V, 4.2 V, VOUT = 5.0 V
Figure 7-9. Load Regulation
-20
0
VIN = 3.7 V
20
40
Temperature (°C)
60
80
100
D004
No Switching
Figure 7-10. Quiescent Current into VOUT vs Temperature
0.7
1.2
VIN = 3.7 V
1
Shutdown Current (µA)
Quiescent Current (µA)
0.6
0.5
0.4
0.3
0.2
0.8
0.6
0.4
0.2
VIN = 3.7 V
0.1
-40
-20
0
VIN = 3.7 V
20
40
Temperature (°C)
60
80
100
D005
No Switching
-20
0
20
40
Temperature (°C)
60
80
100
D006
VIN = 3.7 V, Into VIN and SW
Figure 7-11. Quiescent Current into VIN vs Temperature
8
0
-40
Figure 7-12. Shutdown Current vs Temperature
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7.6 Typical Characteristics (continued)
5.02
1.009
VIN = 3.7 V
5.018
1.007
Output Voltage (V)
Reference Voltage (V)
5.016
1.005
1.003
1.001
0.999
5.014
5.012
5.01
5.008
5.006
5.004
0.997
5.002
0.995
-40
-20
0
20
40
60
80
Temperature (°C)
TPS61099, VIN = 3.7 V
100
120
5
-40
140
TJ = –40°C to 125°C
-20
0
20
40
60
80
Temperature (qC)
100
120
140
D010
TPS610997, VIN= 3.7 V, TJ = –40°C to 125°C
Figure 7-13. Reference Voltage vs Temperature
Figure 7-14. Output Voltage vs Temperature
3.324
1.1
VIN = 3.7 V
3.322
3.32
Current Limit (A)
Output Voltage (V)
1.05
3.318
3.316
3.314
3.312
3.31
1
0.95
3.308
3.306
3.304
-40
0.9
-20
0
20
40
60
80
Temperature (qC)
100
120
140
–40
10
TPS610994, VIN= 2.5 V, TJ = –40°C to 125°C
VIN = 3.7 V
Figure 7-15. TPS610994 Output Voltage vs Temperature
60
Temperature (°C)
D012
125
D001
TJ = –40°C to 125°C
Figure 7-16. Current Limit vs Temperature
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8 Detailed Description
8.1 Overview
The TPS61099x synchronous step-up converter is designed for alkaline battery, coin-cell battery, Li-ion or
Li-polymer battery powered systems, which requires long battery running time and tiny solution size. The
TPS61099x can operate with a wide input voltage from 0.7 V to 5.5 V. It only consumes 1 µA quiescent current
and can achieve high efficiency under light load condition.
The TPS61099x operates in a hysteretic control scheme with typical 1-A peak switch current limit. The
TPS61099x provides the true shutdown function and the load is completely disconnected from the input so
as to minimize the leakage current. It also adopts Down Mode and Pass-Through operation when input voltage
is close to or higher than the regulated output voltage. The TPS61099x family is available in both adjustable
and fixed output voltage versions. Adjustable version offers programmable output voltage for flexible applications
while fixed versions offer minimal solution size and achieve up to 75% high efficiency under 10-µA load.
8.2 Functional Block Diagram
B2 VOUT
SW B1
(1)
Startup
Boost
Gate Driver
UVLO
Pulse
Modulator
Current
Sense
Protection
(OCP, OVP)
REF
TPS61099 x
OCP
TPS61099
C2 FB
VDOWN
OVP
Down Mode
Logic
Control
VIN A1
Pass-Through
Thermal
Shutdown
VPSTH
A2 GND
EN C1
A.
Internal FB resistor divider is implemented in fixed output voltage versions.
Figure 8-1. Functional Block Diagram
8.3 Feature Description
8.3.1 Boost Controller Operation
The TPS61099x boost converter is controlled by a hysteretic current mode controller. This controller regulates
the output voltage by keeping the inductor ripple current constant in the range of 300 mA and adjusting the
offset of this inductor current depending on the output load. Since the input voltage, output voltage and inductor
value all affect the rising and falling slopes of inductor ripple current, the switching frequency is not fixed and is
determined by the operation condition. If the required average input current is lower than the average inductor
current defined by this constant ripple, the inductor current goes discontinuously to keep the efficiency high
under light load condition. Figure 8-2 illustrates the hysteretic current operation. If the load current is reduced
further, the boost converter enters into Burst mode. In Burst mode, the boost converter ramps up the output
voltage with several switching cycles. Once the output voltage exceeds a setting threshold, the device stops
switching and goes into a sleep status. In sleep status, the device consumes less quiescent current. It resumes
10
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switching when the output voltage is below the setting threshold. It exits the Burst mode when the output current
can no longer be supported in this mode. Refer to Figure 8-3 for Burst mode operation details.
To achieve high efficiency, the power stage is realized as a synchronous boost topology. The output voltage
VOUT is monitored via an external or internal feedback network which is connected to the voltage error amplifier.
To regulate the output voltage, the voltage error amplifier compares this feedback voltage to the internal voltage
reference and adjusts the required offset of the inductor current accordingly.
IL
Continuous Current Operation
Discontinuous Current Operation
300 mA
(typ.)
300 mA
(typ.)
t
Figure 8-2. Hysteretic Current Operation
Output Voltage of
Boost Converter
Burst Mode Operation at
Light Load
VOUT_BST
Continuous Current Operation at
Heavy Load
VOUT_NOM
t
Figure 8-3. Burst Mode Operation
8.3.2 Under-Voltage Lockout
An under-voltage lockout (UVLO) circuit stops the operation of the converter when the input voltage drops below
the typical UVLO threshold of 0.4 V. A hysteresis of 200 mV is added so that the device cannot be enabled again
until the input voltage goes up to 0.6 V. This function is implemented in order to prevent malfunctioning of the
device when the input voltage is between 0.4 V and 0.6 V.
8.3.3 Enable and Disable
When the input voltage is above UVLO rising threshold and the EN pin is pulled to high voltage, the TPS61099x
is enabled. When the EN pin is pulled to low voltage, the TPS61099x goes into shutdown mode. In shutdown
mode, the device stops switching and the rectifying PMOS fully turns off, providing the completed disconnection
between input and output. Less than 0.5-µA input current is consumed in shutdown mode.
8.3.4 Soft Start
After the EN pin is tied to high voltage, the TPS61099x begins to startup. At the beginning, the device operates
at the boundary of Discontinuous Conduction Mode (DCM) and Continuous Conduction Mode (CCM), and the
inductor peak current is limited to around 200 mA during this stage. When the output voltage is charged above
approximately 1.6 V, the device starts the hysteretic current mode operation. The current limit threshold is
gradually increasing to 0.7× ILIM within 500 µs. In this way, the soft start function reduces the inrush current
during startup. After VOUT reaches the target value, soft start stage ends and the peak current is now determined
by the output of an internal error amplifier which compares the feedback of the output voltage and the internal
reference voltage.
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The TPS61099x is able to start up with 0.7-V input voltage with larger than 3-kΩ load. However, if the load
during startup is so heavy that the TPS61099x fails to charge the output voltage above 1.6 V, the TPS61099x
can't start up successfully until the input voltage is increased or the load current is reduced. The startup time
depends on input voltage and load current.
8.3.5 Current Limit Operation
The TPS61099x employs cycle-by-cycle over-current protection (OCP) function. If the inductor peak current
reaches the current limit threshold ILIM, the main switch turns off so as to stop further increase of the input
current. In this case the output voltage will decrease until the power balance between input and output is
achieved. If the output drops below the input voltage, the TPS61099x enters into Down Mode. The peak current
is still limited by ILIM cycle-by-cycle in Down Mode. If the output drops below 1.6 V, the TPS61099 enters into
startup process again. In Pass-Through operation, current limit function is not enabled.
8.3.6 Output Short-to-Ground Protection
The TPS61099x starts to limit the switch current to 200 mA when the output voltage is below 1.6 V. If short-toground condition occurs, switch current is limited at 200 mA. Once the short circuit is released, the TPS61099x
goes back to soft start again and regulates the output voltage.
8.3.7 Over Voltage Protection
TPS61099x has an output over-voltage protection (OVP) to protect the device in case that the external feedback
resistor divider is wrongly populated. When the output voltage of the TPS61099 exceeds the OVP threshold of
5.8 V, the device stops switching. Once the output voltage falls 0.1 V below the OVP threshold, the device starts
operating again.
8.3.8 Down Mode Regulation and Pass-Through Operation
The TPS61099x features Down Mode and Pass-Through operation when input voltage is close to or higher than
output voltage.
In the Down Mode, output voltage is regulated at target value even when VIN > VOUT. The control circuit changes
the behavior of the rectifying PMOS by pulling its gate to input voltage instead of to ground. In this way, the
voltage drop across the PMOS is increasing as high as to regulate the output voltage. The power loss also
increases in this mode, which needs to be taken into account for thermal consideration.
In the Pass-Through operation, the boost converter stops switching. The rectifying PMOS constantly turns on
and low side switch constantly turns off. The output voltage is the input voltage minus the voltage drop across
the dc resistance (DCR) of the inductor and the on-resistance of the rectifying PMOS.
With VIN ramping up, the TPS61099x goes into Down Mode first when VIN > VOUT – 50mV. It stays in Down
Mode until VIN > VOUT + 0.5 V and then goes automatically into Pass-Through operation. In the Pass-Through
operation, output voltage follows input voltage. The TPS61099x exits Pass-Through Mode and goes back to
Down Mode when VIN ramps down to 103% of the target output voltage. It stays in Down Mode until input
voltage falls 100mV below the output voltage, returning to Boost operation.
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Voltage
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3
1
2
1
3
1:Down Mode
2:Pass-through Mode
3:Boost Mode
500mV
VIN
3%*VOUT
VOUT
50mV
100mV
t
Figure 8-4. Down Mode and Pass-Through Operation
8.3.9 Thermal Shutdown
The TPS61099x has a built-in temperature sensor which monitors the internal junction temperature in boost
mode operation. If the junction temperature exceeds the threshold 150°C, the device stops operating. As soon
as the junction temperature drops below the shutdown temperature minus the hysteresis, typically 125°C, it
starts operating again.
8.4 Device Functional Modes
8.4.1 Burst Mode Operation under Light Load Condition
The boost converter of TPS61099x enters into Burst Mode operation under light load condition. Refer to Boost
Controller Operation for details.
8.4.2 Down Mode Regulation and Pass-Through Mode Operation
The boost converter of TPS61099x automatically enters into Down Mode or pass-through mode operation when
input voltage is higher than the target output voltage. Refer to Down Mode Regulation and Pass-Through
Operation for details.
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9 Application and Implementation
Note
Information in the following applications sections is not part of the TI component specification,
and TI does not warrant its accuracy or completeness. TI’s customers are responsible for
determining suitability of components for their purposes, as well as validating and testing their design
implementation to confirm system functionality.
9.1 Application Information
The TPS61099x is a synchronous boost converter designed to operate at a wide input voltage from 0.7 V to 5.5
V with 1-A peak switch current limit. The device adopts a hysteretic control scheme so the operating frequency is
not a constant value, which varies with different input/output voltages and inductor values. It only consumes 1-µA
quiescent current under light load condition. It also supports true shutdown to disconnect the load from the input
in order to minimize the leakage current. Therefore, it is very suitable for alkaline battery, coin-cell battery, Li-ion
or Li-polymer battery powered systems to extend the battery running time.
9.2 Typical Application - 5 V Output Boost Converter
L1
2.2 µH
VIN
2.7 V to 4.2 V
VOUT
SW
R1
VIN
TPS61099
FB
C1
10 µF
C2
C3
10 µF
10 µF
VOUT
5V
R2
EN
GND
Copyright © 2016, Texas Instruments Incorporated
9.2.1 Design Requirements
A typical application example is the memory LCD, which normally requires 5-V output as its bias voltage
and only consumes less than 1 mA current. The following design procedure can be used to select external
component values for the TPS61099x.
Table 9-1. Design Requirements
PARAMETERS
VALUES
Input Voltage
2.7 V ~ 4.2 V
Output Voltage
5V
Output Current
1 mA
Output Voltage Ripple
± 50 mV
9.2.1.1 Detailed Design Procedure
9.2.1.1.1 Custom Design With WEBENCH® Tools
Click here to create a custom design using the TPS61099 device with the WEBENCH® Power Designer.
1. Start by entering the input voltage (VIN), output voltage (VOUT), and output current (IOUT) requirements.
2. Optimize the design for key parameters such as efficiency, footprint, and cost using the optimizer dial.
3. Compare the generated design with other possible solutions from Texas Instruments.
The WEBENCH Power Designer provides a customized schematic along with a list of materials with real-time
pricing and component availability.
In most cases, these actions are available:
• Run electrical simulations to see important waveforms and circuit performance
• Run thermal simulations to understand board thermal performance
14
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•
•
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Export customized schematic and layout into popular CAD formats
Print PDF reports for the design, and share the design with colleagues
Get more information about WEBENCH tools at www.ti.com/WEBENCH.
9.2.1.1.2 Programming the Output Voltage
There are two ways to set the output voltage of the TPS61099x. For adjustable output voltage version, select the
external resistor divider R1 and R2, as shown in Equation 1, the output voltage is programmed to the desired
value. When the output voltage is regulated, the typical voltage at the FB pin is VREF of 1.0 V.
VOUT
VREF ˜
R1 R2
R2
(1)
For fixed output voltage versions, the FB pin should be connected to the GND. The TPS61099x offers diverse
fixed voltage versions, refer to Device Comparison Table for version details.
In this example, 5-V output is required to bias the memory LCD. For the best accuracy, the current following
through R2 should be 100 times larger than FB pin leakage current. Changing R2 towards a lower value
increases the robustness against noise injection. Changing R2 towards higher values reduces the FB divider
current for achieving the highest efficiency at low load currents. 1-MΩ and 249-kΩ resistors are selected for R1
and R2 in this example. High accuracy resistors are recommended for better output voltage accuracy.
9.2.1.1.3 Maximum Output Current
The maximum output capability of the TPS61099x is determined by the input to output ratio and the current limit
of the boost converter. It can be estimated by Equation 2.
VIN ˜ (ILIM
IOUT(max)
ILH
)˜K
2
VOUT
(2)
where
•
•
•
η is the conversion efficiency, use 85% for estimation
ILH is the current ripple value
ILIM is the switch current limit
Minimum input voltage, maximum boost output voltage and minimum current limit ILIM should be used as the
worst case condition for the estimation.
9.2.1.1.4 Inductor Selection
Because the selection of the inductor affects steady state operation, transient behavior, and loop stability,
the inductor is the most important component in power regulator design. There are three important inductor
specifications, inductor value, saturation current, and dc resistance (DCR).
The TPS61099x is optimized to work with inductor values between 1 µH and 2.2 µH. For best stability
consideration, a 2.2-µH inductor is recommended under Vout > 3.0V condition while choosing a 1-µH inductor
for applications under Vout ≤ 3.0V condition. Follow Equation 3 and Equation 4 to calculate the inductor's peak
current for the application. Depending on different load conditions, the TPS61099x works in continuous current
mode or discontinuous mode. In different modes, the peak currents of the inductor are also different. Equation 3
provides an easy way to estimate whether the device works in CCM or DCM. As long as the Equation 3 is true,
continuous current mode is typically established. Otherwise, discontinuous current mode is typically established.
VOUT ˜ IOUT ILH
!
VIN u K
2
(3)
The inductor current ripple ILH is fixed by design. Therefore, the peak inductor current is calculated with Equation
4.
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IL,peak
VOUT ˜ IOUT
VIN u K
IL,peak
ILH;
ILH
; continuous current mode operation
2
discontinuous current mode operation
(4)
where
•
IL,peak is the peak inductor current.
The inductor's saturation current must be higher than the calculated peak inductor current. Table 9-2 lists the
recommended inductors for TPS61099x device.
After choosing the inductor, the estimated switching frequency ƒ in continuous current mode can be calculated
by Equation 5. The switching frequency is not a constant value, which is determined by L, VIN and VOUT.
VIN ˜ ( VOUT VIN ˜ K)
L ˜ ILH ˜ VOUT
f
(5)
Table 9-2. List of Inductors
VOUT
[V](1)
> 3.0
≤ 3.0
(1)
INDUCTANCE
[µH]
SATURATION
CURRENT [A]
DC RESISTANCE
[mΩ]
SIZE (LxWxH)
2.2
1.95
80
2.2
1.7
92
2.2
1.45
1.0
2.6
1.0
1.0
PART NUMBER
MANUFACTURER
2.5 x 2.0 x 1.2
74404024022
Würth Elektronik
2.5 x 2.0 x 1.1
LQH2HPN2R2MJR
muRata
163
2.0 x 1.6 x 1.0
VLS201610CX-2R2M
TDK
37
2.5 x 2.0 x 1.2
74404024010
Würth Elektronik
2.3
48
2.5 x 2.0 x 1.0 MLP2520W1R0MT0S1
1.5
80
2.0 x 1.2 x 1.0
LQM21PN1R0MGH
TDK
muRata
See Third-Party Products disclaimer
9.2.1.1.5 Capacitor Selection
For best output and input voltage filtering, low ESR X5R or X7R ceramic capacitors are recommended.
The input capacitor minimizes input voltage ripple, suppresses input voltage spikes and provides a stable system
rail for the device. An input capacitor value of 10 μF is normally recommended to improve transient behavior of
the regulator and EMI behavior of the total power supply circuit. A ceramic capacitor placed as close as possible
to the VIN and GND pins of the IC is recommended.
For the output capacitor of VOUT pin, small ceramic capacitors are recommended, placed as close as possible
to the VOUT and GND pins of the IC. If, for any reason, the application requires the use of large capacitors
which cannot be placed close to the IC, the use of a small ceramic capacitor with a capacitance value of 1 μF
in parallel to the large one is recommended. This small capacitor should be placed as close as possible to the
VOUT and GND pins of the IC.
From the power stage point of view, the output capacitor sets the corner frequency of the converter while the
inductor creates a Right-Half-Plane-Zero. Consequently, with a larger inductor, a larger output capacitor must
be used. The TPS61099x is optimized to work with the inductor from 1 µH to 2.2 µH, so the minimal output
capacitor value is 20 μF (nominal value). Increasing the output capacitor makes the output ripple smaller in
PWM mode.
When selecting capacitors, ceramic capacitor’s derating effect under bias should be considered.
Choose the right nominal capacitance by checking capacitor's DC bias characteristics. In this example,
GRM188R60J106ME84D, which is a 10-µF ceramic capacitor with high effective capacitance value at DC biased
condition, is selected for VOUT rail. The performance of TPS61099x is shown in Application Curves section.
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9.2.1.2 Application Curves
VIN = 3.7 V
VIN = 3.7 V
VOUT = 5 V
IOUT = 200 mA
VOUT = 5 V
IOUT = 10 mA
Figure 9-2. Switching Waveform at Light Load
Figure 9-1. Switching Waveform at Heavy Load
VIN = 3.7 V
VOUT = 5 V
IOUT = 50 mA
VIN = 3.7 V
VOUT = 5 V
IOUT = 100 mA
Figure 9-4. Startup by EN
Figure 9-3. Startup by VIN
VIN = 2.4 V to 3.7 V
VOUT = 5 V
IOUT = 200 mA
VIN = 3.7 V
Figure 9-5. Line Transient
VOUT = 5 V
IOUT = 50 mA to 200 mA
Figure 9-6. Load Transient
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VIN = 3.7 V
VOUT = 5 V IOUT = 0 mA to 250 mA
VIN = 2.4 to 5.5 V
Figure 9-7. Load Regulation
VOUT = 5 V
IOUT = 200 mA
Figure 9-8. Line Regulation
10 Power Supply Recommendations
The TPS61099x family is designed to operate from an input voltage supply range between 0.7 V to 5.5 V. The
power supply can be alkaline battery, NiMH rechargeable battery, Li-Mn battery or rechargeable Li-Ion battery.
The input supply should be well regulated with the rating of TPS61099x.
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11 Layout
11.1 Layout Guidelines
As for all switching power supplies, the layout is an important step in the design, especially at high peak currents
and high switching frequencies. If the layout is not carefully done, the regulator could show stability problems as
well as EMI problems. Therefore, use wide and short traces for the main current path and for the power ground
paths. The input and output capacitor, as well as the inductor should be placed as close as possible to the IC.
11.2 Layout Example
The bottom layer is a large GND plane connected by vias.
GROUND
INPUT
Top Layer
VIA
VIN
GND
SW
VOUT
EN
FB
OUTPUT
GROUND
EN
Figure 11-1. Layout -YFF
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VIN
GND
GND
VIN
VOUT
SW
FB
EN
VOUT
EN
Figure 11-2. Layout - DRV
20
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12 Device and Documentation Support
12.1 Device Support
12.1.1 Development Support
12.1.1.1 Custom Design With WEBENCH® Tools
Click here to create a custom design using the TPS61099x device with the WEBENCH® Power Designer.
1. Start by entering the input voltage (VIN), output voltage (VOUT), and output current (IOUT) requirements.
2. Optimize the design for key parameters such as efficiency, footprint, and cost using the optimizer dial.
3. Compare the generated design with other possible solutions from Texas Instruments.
The WEBENCH Power Designer provides a customized schematic along with a list of materials with real-time
pricing and component availability.
In most cases, these actions are available:
• Run electrical simulations to see important waveforms and circuit performance
• Run thermal simulations to understand board thermal performance
• Export customized schematic and layout into popular CAD formats
• Print PDF reports for the design, and share the design with colleagues
Get more information about WEBENCH tools at www.ti.com/WEBENCH.
12.1.2 Third-Party Products Disclaimer
TI'S PUBLICATION OF INFORMATION REGARDING THIRD-PARTY PRODUCTS OR SERVICES DOES NOT
CONSTITUTE AN ENDORSEMENT REGARDING THE SUITABILITY OF SUCH PRODUCTS OR SERVICES
OR A WARRANTY, REPRESENTATION OR ENDORSEMENT OF SUCH PRODUCTS OR SERVICES, EITHER
ALONE OR IN COMBINATION WITH ANY TI PRODUCT OR SERVICE.
12.2 Documentation Support
12.2.1 Related Documentation
For related documentation see the following:
• Performing Accurate PFM Mode Efficiency Measurements, SLVA236
• Accurately measuring efficiency of ultralow-IQ devices, SLYT558
• IQ: What it is, what it isn’t, and how to use it, SLYT412
12.3 Receiving Notification of Documentation Updates
To receive notification of documentation updates, navigate to the device product folder on ti.com. Click on
Subscribe to updates to register and receive a weekly digest of any product information that has changed. For
change details, review the revision history included in any revised document.
12.4 Support Resources
TI E2E™ support forums are an engineer's go-to source for fast, verified answers and design help — straight
from the experts. Search existing answers or ask your own question to get the quick design help you need.
Linked content is provided "AS IS" by the respective contributors. They do not constitute TI specifications and do
not necessarily reflect TI's views; see TI's Terms of Use.
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12.5 Trademarks
TI E2E™ is a trademark of Texas Instruments.
WEBENCH® is a registered trademark of Texas Instruments.
is a registered trademark of Texas Instruments.
All trademarks are the property of their respective owners.
12.6 Electrostatic Discharge Caution
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled
with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may
be more susceptible to damage because very small parametric changes could cause the device not to meet its published
specifications.
12.7 Glossary
TI Glossary
This glossary lists and explains terms, acronyms, and definitions.
13 Mechanical, Packaging, and Orderable Information
The following pages include mechanical packaging and orderable information. This information is the most
current data available for the designated devices. This data is subject to change without notice and revision of
this document. For browser-based versions of this data sheet, refer to the left-hand navigation.
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PACKAGE OPTION ADDENDUM
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28-Sep-2021
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
(2)
Lead finish/
Ball material
MSL Peak Temp
Op Temp (°C)
Device Marking
(3)
(4/5)
(6)
TPS610992YFFR
ACTIVE
DSBGA
YFF
6
3000
RoHS & Green
SNAGCU
Level-1-260C-UNLIM
-40 to 85
19J
TPS610992YFFT
ACTIVE
DSBGA
YFF
6
250
RoHS & Green
SNAGCU
Level-1-260C-UNLIM
-40 to 85
19J
TPS610993YFFR
ACTIVE
DSBGA
YFF
6
3000
RoHS & Green
SNAGCU
Level-1-260C-UNLIM
-40 to 85
17X
TPS610993YFFT
ACTIVE
DSBGA
YFF
6
250
RoHS & Green
SNAGCU
Level-1-260C-UNLIM
-40 to 85
17X
TPS610994YFFR
ACTIVE
DSBGA
YFF
6
3000
RoHS & Green
SNAGCU
Level-1-260C-UNLIM
-40 to 85
17N
TPS610994YFFT
ACTIVE
DSBGA
YFF
6
250
RoHS & Green
SNAGCU
Level-1-260C-UNLIM
-40 to 85
17N
TPS610995DRVR
ACTIVE
WSON
DRV
6
3000
RoHS & Green
NIPDAU
Level-1-260C-UNLIM
-40 to 125
1NDU
TPS610995DRVT
ACTIVE
WSON
DRV
6
250
RoHS & Green
NIPDAU
Level-1-260C-UNLIM
-40 to 125
1NDU
TPS610995YFFR
ACTIVE
DSBGA
YFF
6
3000
RoHS & Green
SNAGCU
Level-1-260C-UNLIM
-40 to 85
19K
TPS610995YFFT
ACTIVE
DSBGA
YFF
6
250
RoHS & Green
SNAGCU
Level-1-260C-UNLIM
-40 to 85
19K
TPS610996YFFR
ACTIVE
DSBGA
YFF
6
3000
RoHS & Green
SNAGCU
Level-1-260C-UNLIM
-40 to 85
19I
TPS610996YFFT
ACTIVE
DSBGA
YFF
6
250
RoHS & Green
SNAGCU
Level-1-260C-UNLIM
-40 to 85
19I
TPS610997YFFR
ACTIVE
DSBGA
YFF
6
3000
RoHS & Green
SNAGCU
Level-1-260C-UNLIM
-40 to 85
14K
TPS610997YFFT
ACTIVE
DSBGA
YFF
6
250
RoHS & Green
SNAGCU
Level-1-260C-UNLIM
-40 to 85
14K
TPS61099DRVR
ACTIVE
WSON
DRV
6
3000
RoHS & Green
NIPDAU
Level-2-260C-1 YEAR
-40 to 150
1I8U
TPS61099YFFR
ACTIVE
DSBGA
YFF
6
3000
RoHS & Green
SNAGCU
Level-1-260C-UNLIM
-40 to 85
12G
TPS61099YFFT
ACTIVE
DSBGA
YFF
6
250
RoHS & Green
SNAGCU
Level-1-260C-UNLIM
-40 to 85
12G
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
Addendum-Page 1
Samples
PACKAGE OPTION ADDENDUM
www.ti.com
28-Sep-2021
OBSOLETE: TI has discontinued the production of the device.
(2)
RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of
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