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TPS61199
SLVSAN3B – DECEMBER 2010 – REVISED NOVEMBER 2016
TPS61199 White-LED Driver for LCD Monitor Backlighting
1 Features
3 Description
•
•
•
•
•
•
•
•
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The TPS61199 provides highly integrated solutions
for large size LCD backlighting. This device integrates
a current-mode boost controller and eight current
sinks for driving up to eight LED strings with multiple
LEDs in series. Each string has an independent
current regulator with current matching between
strings reaching 3% regulation accuracy. The device
automatically adjusts the output voltage of the boost
converter to provide only the voltage required by the
LED string with the largest forward voltage drop plus
the minimum required voltage at the IFBx pin of that
string, thereby optimizing efficiency of the driver.
1
8-V to 30-V Input Voltage
Integrated High-Power Boost Controller
Adaptive Boost Output for LED Voltages
Drive up to Eight LED Strings in Parallel
Maximum 70 mA for Each LED String
3% Current Matching Between Strings
5000:1 PWM Dimming Ratio at 200 Hz
MOSFET Overcurrent Protection
Programmable LED Short Protection
Adjustable LED Open Protection
Thermal Shutdown Protection
20-Pin SO Package and TSSOP Package
With PowerPAD™
The TPS61199 provides PWM brightness dimming
with an external PWM signal. The signal of the PWM
maximum frequency can be as high as 22 kHz.
Dimming ratios up to 5000:1 can be achieved with a
200-Hz PWM signal. The TPS61199 integrates
overcurrent protection for the switch FET, soft startup, LED short protection, LED open protection, and
overtemperature shutdown protection. The TPS61199
device is available in 20-pin SO and HTSSOP
packages.
2 Applications
•
•
•
Monitor LCD Backlight
LCD TV Backlight
General LED Lighting
Device Information(1)
PART NUMBER
TPS61199
PACKAGE
BODY SIZE (NOM)
SO (20)
12.60 mm × 5.30 mm
HTSSOP (20)
6.50 mm × 4.40 mm
(1) For all available packages, see the orderable addendum at
the end of the data sheet.
Typical Application
L1
22µH
12V IN
D1
SS5P10
OUT 60V
+
C1
10µF
R8
3Ω
Q1
Si4480DY
C2
3 X 33µF
R9
200Ω
C3
2.2µF
OUT
VIN
GDRV
VDD
ISNS
C6
0.47nF
R1
0.03Ω
R2
190kΩ
GND
IFB1
IFB2
IFB3
IFB4
OVP
TPS61199
10kΩ
R3
10kΩ
EN
10kΩ
IFB5
PWM
IFB6
IFB7
COMP
IFB8
R4
50kΩ
FBP
ISET
R6
40.2kΩ
R5
200kΩ
FSW
R7
160kΩ
C5
0.47nF
C4
47nF
Copyright © 2016, Texas Instruments Incorporated
1
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.
TPS61199
SLVSAN3B – DECEMBER 2010 – REVISED NOVEMBER 2016
www.ti.com
Table of Contents
1
2
3
4
5
6
7
Features ..................................................................
Applications ...........................................................
Description .............................................................
Revision History.....................................................
Pin Configuration and Functions .........................
Specifications.........................................................
1
1
1
2
3
4
6.1 Absolute Maximum Ratings .....................................
6.2 ESD Ratings..............................................................
6.3 Recommended Operating Conditions......................
6.4 Thermal Information ..................................................
6.5 Electrical Characteristics..........................................
6.6 Typical Characteristics ..............................................
4
4
4
4
5
6
Detailed Description .............................................. 8
7.1
7.2
7.3
7.4
Overview ................................................................... 8
Functional Block Diagram ......................................... 8
Feature Description................................................... 9
Device Functional Modes........................................ 10
8
Application and Implementation ........................ 12
8.1 Application Information............................................ 12
8.2 Typical Application ................................................. 12
9 Power Supply Recommendations...................... 17
10 Layout................................................................... 17
10.1 Layout Consideration ............................................ 17
10.2 Layout Example .................................................... 17
11 Device and Documentation Support ................. 18
11.1
11.2
11.3
11.4
11.5
11.6
11.7
Device Support ....................................................
Related Documentation .......................................
Receiving Notification of Documentation Updates
Community Resources..........................................
Trademarks ...........................................................
Electrostatic Discharge Caution ............................
Glossary ................................................................
18
18
18
18
18
18
18
12 Mechanical, Packaging, and Orderable
Information ........................................................... 18
4 Revision History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
Changes from Revision A (May 2011) to Revision B
•
Page
Added Device Information and Pin Configuration and Functions sections, ESD Ratings table, Feature Description,
Device Functional Modes, Application and Implementation, Power Supply Recommendations, Layout, Device and
Documentation Support, and Mechanical, Packaging, and Orderable Information sections; delete Device
Comparison table - info in POA.............................................................................................................................................. 1
Changes from Original (December 2010) to Revision A
Page
•
Changed to Rev A, May 2011 ................................................................................................................................................ 1
•
Changed from 65 mA to 70 mA in fifth list Item of Features .................................................................................................. 1
•
Changed ABS MAX table MAX column, row 1 to 33 and the 4th row to 3.6 ......................................................................... 4
•
Changed Electrical Characteristics table, Current Regulation, IIFB_max spec MIN value from 65 to 70 mA............................ 5
•
Changed values in ELEC CHAR TABLE, OSCILLATOR section, first 2 rows 0.66, 0.8, 0.94 and 0.44, 0.5, 0.56 ............... 5
•
Changed values in ELEC CHAR TABLE, PROTECTION section, first row to min 2.77, max 3.13....................................... 5
•
Added a paragraph: Fs (in kHz) = 80,000 / R7 (in kΩ) .......................................................................................................... 9
•
Changed 65 mA to 70 mA in paragraph in Program LED Full-Scale Current...................................................................... 10
•
Changed 65 mA to 70 mA in paragraph in Drive High Current LED.................................................................................... 10
•
Added ListItem number 4 to OrderedList under Protection section ..................................................................................... 10
•
Changed or added the paragraph Current Sense and Current Sense Filtering................................................................... 14
2
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SLVSAN3B – DECEMBER 2010 – REVISED NOVEMBER 2016
5 Pin Configuration and Functions
NS Package
20-Pin SO
Top View
PWP Package
20-Pin HTSSOP
Top View
1
20
OVP
COMP
2
19
VDD
FSW
3
18
VIN
ISET
4
17
GDRV
EN
5
16
ISNS
PWM
6
15
GND
IFB8
7
14
IFB1
IFB7
8
13
IFB2
IFB6
9
12
IFB3
IFB5
10
11
IFB4
FBP
COMP
FSW
ISET
EN
PWM
IFB8
IFB7
IFB6
IFB5
1
2
3
4
5
6
7
8
9
10
PowerPAD
FBP
20
19
18
17
16
15
14
13
12
11
OVP
VDD
VIN
GDRV
ISNS
GND
IFB1
IFB2
IFB3
IFB4
Pin Functions
PIN
TYPE
DESCRIPTION
NAME
NO.
COMP
2
Output
EN
5
Input
FBP
1
Output
LED short-across protection threshold program pin (see Protection)
FSW
3
Output
Boost switching frequency selection pin. Connect a resistor to set the frequency
between 300 kHz to 800 kHz.
GDRV
17
Output
External Switch MOSFET gate driver output pin
GND
15
Ground
Ground pin
7, 8, 9, 10, 11
12, 13, 14
Input
ISET
4
Output
ISNS
16
Input
External MOSFET current sense positive input pin
OVP
20
Input
Overvoltage protection pin (see Protection)
PWM
6
Input
PWM dimming signal input pin. The frequency must be in the range of 100 Hz to
22 kHz.
VDD
19
Output
VIN
18
Input
Supply input pin. This pin can be tied to a voltage different from the power stage
input.
—
The PowerPAD pad must be soldered to the ground. If possible, use thermal vias
to connect to top and internal ground plane layers for ideal power dissipation.
IFB1 to IFB8
PowerPAD – HTTSOP package
Loop compensation pin. Connect an RC network to make loop stable (see Loop
Consideration ).
Enable/disable pin — high = device is enabled; low = device is disabled.
Regulated current sink input pins.
Full-scale LED current selection pin; connect a resistor to program LED current
for each string
Internal regulator output pin. Connect a 2.2-μF capacitor between this pin to
GND.
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TPS61199
SLVSAN3B – DECEMBER 2010 – REVISED NOVEMBER 2016
www.ti.com
6 Specifications
6.1
Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted) (1)
Voltage
MIN
MAX
Pin VIN (2)
–0.3
33
Pin IFB1 to IFB8 (2)
–0.3
30
Pin EN and PWM (2)
–0.3
20
Pin ISET, ISNS and OVP (2)
–0.3
3.6
All other pins (2)
–0.3
7
Continuous power dissipation
UNIT
V
SeeThermal Information
Operating junction temperature
–40
150
°C
Storage temperature, Tstg
–65
50
°C
(1)
(2)
Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended
Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
All voltage values are with respect to network ground terminal
6.2 ESD Ratings
V(ESD)
(1)
Electrostatic discharge
Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001 (1)
VALUE
UNIT
±2000
V
JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control procedures.
6.3
Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted) (1)
MIN
NOM
MAX
Inductor, L1
10
22
47
Input capacitor, C1
10
UNIT
µH
µF
Output capacitor, C2
10
100
µF
PWM dimming frequency, ƒPWM
0.1
33
22
KHz
1
µsec
Boost regulator switching frequency, fBOOST
300
800
kHz
Operating ambient temperature, TA
–40
85
°C
Rising/falling edge of PWM signal, tPWM
(1)
Customers must verify the component values in their application if the values are different from the recommended values.
6.4 Thermal Information
THERMAL METRIC (1)
TPS61199
TPS61199
NS (SO)
PWP (HTSSOP)
UNITS
20 PINS
20 PINS
RθJA
Junction-to-ambient thermal resistance
69.4
46.9
°C/W
RθJC(top)
Junction-to-case (top) thermal resistance
36.4
48.2
°C/W
RθJB
Junction-to-board thermal resistance
37.3
22.1
°C/W
ψJT
Junction-to-top characterization parameter
11.0
3.4
°C/W
ψJB
Junction-to-board characterization parameter
36.8
13.3
°C/W
RθJC(bot)
Junction-to-case (bottom) thermal resistance
n/a
2.3
°C/W
(1)
4
For more information about traditional and new thermal metrics, see Semiconductor and IC Package Thermal Metrics.
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6.5
SLVSAN3B – DECEMBER 2010 – REVISED NOVEMBER 2016
Electrical Characteristics
VIN = 12 V; TA = –40°C to +85°C, typical values are at TA = 25°C (unless otherwise noted)
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
SUPPLY CURRENT
VIN
Input voltage range
VUVLO_VIN
Undervoltage lockout threshold
VIN falling
8
6.5
VVIN_SYS
VIN hysteresis
VIN rising
300
IQ_VIN
Operating quiescent current into
VIN
EN = high; PWM = low;
no switching, VIN = 30 V
ISD
Shutdown current
VDD
Internal regulation voltage
Output current of VDD = 15 mA
VH
Logic high threshold on EN, PWM
VIN = 8 V to 30 V
VL
Logic low threshold on EN, PWM
VIN = 8 V to 30 V
RPD
Pulldown resistor on EN, PWM
5.7
30
6
7
V
V
mV
1.5
mA
10
µA
6.3
V
EN and PWM
2
V
0.8
V
400
800
1600
kΩ
1.204
1.229
1.253
V
CURRENT REGULATION
VISET
ISET pin voltage
KISET
Current multiple IIFB(AVG) / ISET
IISET = 30 µA; IFB = 450 mV
IFB
Current accuracy to IIFB(AVG)
IISET = 30 µA; IFB = 450 mV
IFB(BR) (1)
Current matching
IISET= 30 µA; IFB = 450 mV
IFBleak
IFB pin leakage current
IFB voltage = 30 V; PWM = low
10
IIFB_max
Current sink max output current
IFB = 450 mV
70
1990
–2%
2%
3%
25
45
µA
mA
OSCILLATOR
ƒOSC
Switching frequency
VFSW
FSW pin reference voltage
Dutymax
Maximum duty cycle
tskip
Minimum pulse width for skip cycle
mode
R = 100 kΩ
0.66
0.8
0.94
R = 160 kΩ
0.44
0.5
0.56
FSW = 500 kHz
90%
1.229
MHz
V
94%
200
ns
GATE DRIVER and OVERCURRENT LIMIT
RGDRV(SRC)
Gate driver impedance when
sourcing
VGDRV = 6 V, IGDRV = 20 mA
2
Ω
RGDRV(SNK)
Gate driver impedance when
sinking
VGDRV = 6 V, IGDRV = 20 mA
1.5
Ω
VISNS
Switch current limit detection
threshold
VIN = 8 V to 30 V
120
160
180
mV
2.77
2.95
3.13
V
0.23
0.25
0.27
PROTECTION
VCLAMP
Output overvoltage threshold at
OVP pin
IFBP
LED short across protection bias
current multiple IFBP/IISET
VOVP_IFB
IFB overvoltage threshold
VFBP = 1 V
26.5
29.5
V
THERMAL SHUTDOWN
Tshutdown
(1)
Thermal shutdown threshold
150
°C
Current matching = (IMAX – IMIN) / IAVG
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TPS61199
SLVSAN3B – DECEMBER 2010 – REVISED NOVEMBER 2016
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6.6 Typical Characteristics
Typical Application as test circuit, and L = CDRH127/HPNP- 220M, R6 = 41kΩ, unless otherwise noted
DESCRIPTION
FIGURES
Dimming linearity
17 LEDs in series; VIN = 12 V
Figure 1
Dimming with short on time
17 LEDs in series; VIN = 12 V
Figure 2
Current matching
17 LEDs in series; VIN = 12 V
Figure 3
Dimming waveform
17 LEDs in series; VIN = 12 V; 200 Hz with 1% duty cycle
Figure 4
Dimming waveform
17 LEDs in series; VIN = 12 V; 22 kHz with 5% duty cycle
Figure 5
Startup waveform
17 LEDs in series; VIN = 12 V; 200 Hz with 50% duty cycle
Figure 6
Shutdown waveform
17LEDs in series; VIN = 12 V; 200 Hz with 50% duty cycle
Figure 7
Dimming efficiency
17 LEDs in series; 200 Hz dimming frequency
Figure 9
Dimming efficiency
13 LEDs in series; 200 Hz dimming frequency
Figure 10
0.48
0.44
100
Total LED Average Current - mA
Total LED Average Current - A
0.40
0.36
0.32
0.28
0.24
0.20
0.16
0.12
10
1
0.08
0.04
0.1
0
0
20
40
60
PWM Duty Cycle - %
80
100
1
2
3
4
5
6
7
PWM On Time - ms
8
9
10
Figure 2. Dimming With Short On Time
Figure 1. Dimming Linearity
60
IFB1
10 V/div
DC
LED String Current - mA
59.8
59.6
VOUT
200 mV/div
AC
59.4
59.2
Total LED
500 mA/div
DC
59
58.8
58.6
IFB1 IFB2
IFB3 IFB4 IFB5
IFB6 IFB7 IFB8
Figure 3. Current Matching
6
t - Time - 10 ms/div
Figure 4. Dimming Waveforms
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SLVSAN3B – DECEMBER 2010 – REVISED NOVEMBER 2016
EN
5 V/div
DC
IFB1
10 V/div
DC
IFB1
10 V/div
DC
VOUT
500 mV/div
AC
VOUT
20 V/div
AC
Total LED
500 mA/div
DC
Total LED
500 mA/div
DC
t - Time - 10 ms/div
t - Time - 20 ms/div
Figure 6. Start-Up Waveform
Figure 5. Dimming Waveforms
EN
5 V/div
DC
IFB1
10 V/div
DC
VOUT
20 V/div
AC
Total LED
500 mA/div
DC
t - Time - 40 ms/div
Figure 7. Shutdown Waveform
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TPS61199
SLVSAN3B – DECEMBER 2010 – REVISED NOVEMBER 2016
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7 Detailed Description
7.1 Overview
The TPS61199 provides a highly integrated solution for large-size LCD TV backlight with high precision pulse
width modulation (PWM) dimming resolution up to 5000:1. This device is a current-mode boost controller driving
up to eight LED strings in parallel. The input voltage range for the device is from 8 V to 30 V. See Functional
Block Diagram and Typical Application.
7.2 Functional Block Diagram
VIN
VDD
VDD
LDO
VDD
PWM
Logic
FSW
GDRV
Driver
ISNS
Oscillator
and
Slope
Compensation
COMP
OC
Protection
160mV
OVP
Protection
EA
Ref
OVP
8
IFBs
Selection
IFB1
EN
Shutdown
PWM
EN
Current Sink
GND
IFB2
Dimming
Control
ISET
Current
Mirror & REF
IFB
Protection
FBP
Current Sinks
IFB8
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7.3 Feature Description
7.3.1 Supply Voltage
The TPS61199 has a built-in linear regulator to supply the device analog and logic circuitry. The VDD pin, output
of the regulator, must be connected to a 2.2-µF bypass capacitor. VDD only has a current sourcing capability of
15 mA. VDD voltage is ready after the EN pin is pulled high.
7.3.2 Boost Controller
A boost controller is shown at the top of the Functional Block Diagram. The TPS61199 regulates the output
voltage with current mode pulse width modulation (PWM) control. The control circuitry turns on an external switch
FET at the beginning of each switching cycle. The input voltage is applied across the inductor and stores the
energy as the inductor current ramps up. During this portion of the switching cycle, the load current is provided
by the output capacitor. When the inductor current rises to the threshold set by the Error Amplifier (EA) output,
the switch FET is turned off and the external Schottky diode is forward biased. The inductor transfers stored
energy to replenish the output capacitor and supply the load current. This operation repeats each switching
cycle. The switching frequency is programmed by the external resistor.
A ramp signal from the oscillator is added to the current ramp to provide slope compensation, shown in the
Oscillator and Slope Compensation block. The duty cycle of the converter is then determined by the PWM Logic
block which compares the EA output and the slope compensated current ramp. The feedback loop regulates the
OVP pin to a reference voltage generated by the minimum voltage across the IFB pins. The output of the EA is
connected to the COMP pin. An external RC compensation network must be connected to the COMP pin to
optimize the feedback loop for stability and transient response.
The device consistently adjusts the boost output voltage to account for any changes in LED forward voltages. In
the event that the boost controller is not able to regulate the output voltage due to the minimum pulse width (tskip
in Electrical Characteristics), the device enters pulse skip mode. In this mode, the device keeps the power switch
off for several switching cycles to prevent the output voltage from rising above the regulated voltage. This
operation typically occurs in light load condition or when the input voltage is higher than the output voltage.
7.3.3 Switching Frequency
The TPS61199 switching frequency can be programmed between 300 kHz to 800 kHz by a external resistor (R7
in Typical Application). Table 1 shows the recommended values for the resistance.
Fs (in kHz) = 80,000 / R7 (in kΩ)
(1)
Table 1. Recommended Value For Resistance
R7
FSW
100 kΩ
800 kHz
160 kΩ
500 kHz
7.3.4 Enable and Undervoltage Lockout
The TPS61199 is enabled with the soft-start when the EN pin voltage is higher than 2 V; a voltage of less than
0.8 V disables the device.
An undervoltage lockout protection feature is provided. When the voltage at VIN pin is less than 7 V, the device
is switched off. The device resumes the operation once the voltage at VIN pin recovers adjusted for hysteresis
(see VVIN_SYS in Electrical Characteristics).
7.3.5 Start-Up
The TPS61199 has integrated soft-start circuitry to avoid any inrush current during start-up. During the start-up
period, the output voltage rises step-by-step from the minimum voltage of LED string in 100-mV increments,
shown in Figure 6. The soft-start time depends on the load and the output capacitor.
7.3.6 Unused LED String
If the application requires fewer than eight LED strings, the TPS61199 simply requires shorting the unused IFB
pin to ground. The device detects the voltage less than 0.3 V and immediately disables the string during start-up.
Refer to Figure 11.
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7.3.7 Program LED Full-Scale Current
The eight current sink regulators embedded in the TPS61199 can be configured to provide up to a maximum of
70 mA per string. The current must be programmed to the expected full-scale LED current by the ISET pin
resistor (R6 in Typical Application) using Equation 2.
V
ILED = ISET ´KISET
R6
where
•
•
KISET = Current multiple (1990 typical, in Electrical Characteristics)
VISET = ISET pin voltage (1.229 V typical, in Electrical Characteristics)
(2)
7.3.8 PWM Dimming
LED brightness dimming is set by applying an external PWM signal of 100 Hz to 22 kHz to the PWM pin. Varying
the PWM duty cycle from 0% to 100% adjusts the LED from minimum to maximum brightness respectively. The
minimum on time of the LED string is 1 µsec; thus the TPS61199 has a dimming ratio of 5000:1 at 200 Hz. Refer
to Figure 2 for dimming ratio in other dimming frequency.
When the PWM voltage is pulled low, the device will turn off the LED strings and keep the boost converter output
at the same level as when PWM is high. Thus, the TPS61199 limit the output ripple due to the load transient that
occurs during PWM dimming.
7.3.9 Drive High Current LED
For applications requiring LEDs rated for more than 70 m A, it is acceptable to tie two or more IFB pins together
as shown in Figure 12.
7.4 Device Functional Modes
7.4.1 Protection
1. Switch current limit protection using the ISNS pin
The TPS61199 monitors the inductor current through the voltage across a sense resistor (R1 in Typical
Application) in order to provide current limit protection. During the switch FET on period, when the voltage at
ISNS pin rises above 160 mV (VISNS in Electrical Characteristics), the device turns off the FET immediately
and does not turn it back on until the next switch cycle. The switch current limit is equal to 160 mV / R1.
2. LED open protection
When one of the LED strings is open, the boost output rises to the clamp threshold voltage (see 5. Output
overvoltage protection using the OVP pin ). The device detects the open string by sensing no current on the
corresponding IFB pin. As a result, the device deactivates the open IFB pin and removes it from the voltage
feedback loop. Afterwards, the output voltage returns to the voltage required for the connected WLED
strings. The IFB pin currents of the connected strings remain in regulation during this process.
If all the LED strings are open, the device repeatedly attempts to restart until the fault is cleared.
3. LED short-across protection using the FBP pin
If one or several LEDs short in one string, the corresponding IFB pin voltage rises but continues to sink the
LED current, causing increased device power dissipation. To protect the device, the TPS61199 provides a
programmable LED short-across protection feature with threshold voltage that can be programmed by
properly sizing the resistor on the FBP pin (see R5 in Typical Application) using Equation 3.
R5
VLED_short =
´1.229V
R6
(3)
If any IFB pin voltage exceeds the threshold (VLED_short), the device turns off the corresponding current sink
and removes this IFB pin from the output voltage regulation loop. Current regulation of the remaining IFB
pins is not affected.
If the voltage on all the IFB pins exceed the threshold, the device repeatedly attempts to restart until the fault
is cleared.
4. IFB overvoltage protection
10
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Device Functional Modes (continued)
When any of IFB pin reaches the threshold (VOVP_IFB), the device stops switching immediately to protect from
damage. The device re-starts when IFB pin voltage falls below the threshold. The time delay depends on
how quickly IFB voltage can fall. It is usually determined by the amount of output capacitance and load.
5. Output overvoltage protection using the OVP pin:
Use a resistor divider to program the clamp threshold voltage as follows:
(a) Compute the maximum output voltage by multiplying the maximum forward voltage (VFWD(MAX)) and
number (n) of series LEDs. Add 1V to account for regulation and resistor tolerances and load transients.
VOUTMAX = VFLED_MAX ´ Number +1V
(4)
(b) The recommended bottom feedback resistor (R3 in Typical Application ) at 10 k. Calculate the top
resistor (R2 in Typical Application) using Equation 5:
+1V ö
æV
- 1÷ ´ R3
R2 = ç OUTMAX
2.95V
è
ø
(5)
When the device detects that the OVP pin exceeds 2.95 V, indicating that the output voltage has exceeded
the clamp threshold voltage, the device clamps the output voltage to the set threshold.
When the OVP pin voltage is higher than 3 V, indicating that the output is higher than the clamp threshold
voltage due to transients or high voltage noise spike coupling from external circuits, the device shuts down
the boost controller until the output drops below the clamp threshold voltage.
6. Output short-to-ground protection
When the inductor peak current reaches twice the switch current limit in each switch cycle, the device
immediately disables the boost controller until the fault is cleared. This protects the device and external
components from damage if the output is shorted to ground.
7. Thermal Protection
When the device junction temperature is over 150°C, the thermal protection circuit is triggered and shuts
down the device immediately. The device automatically restarts when the junction temperature falls back to
less than 150°C, with approximate 15°C hysteresis.
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8 Application and Implementation
NOTE
Information in the following applications sections is not part of the TI component
specification, and TI does not warrant its accuracy or completeness. TI’s customers are
responsible for determining suitability of components for their purposes. Customers should
validate and test their design implementation to confirm system functionality.
8.1 Application Information
The TPS61199 is designed for LCD TV backlighting. It is a current-mode boost controller driving up to eight LED
strings in parallel. The input voltage range for the device is from 8 V to 30 V. Its switching frequency is
programmed by an external resistor from 300 kHz to 800 kHz.
The TPS61199 has a built-in linear regulator, which steps down the input voltage to the VDD voltage for
powering the internal circuitry. An internal soft start circuit is implemented to work with an external capacitor to
adjust the soft start-up time to minimize the in-rush current during boost converter start-up.
8.2 Typical Application
The TPS61199 is configured as a simple boost converter to drive the single string with the LEDs when the boost
ratio of the output voltage to the input voltage is less than 6.
L1
22µH
12V IN
D1
SS5P10
OUT 60V
+
C1
10µF
R8
3Ω
Q1
Si4480DY
C2
3 X 33µF
R9
200Ω
C3
2.2µF
OUT
VIN
GDRV
VDD
ISNS
C6
0.47nF
R1
0.03Ω
R2
190kΩ
GND
IFB1
IFB2
IFB3
IFB4
OVP
TPS61199
10kΩ
R3
10kΩ
EN
10kΩ
IFB5
PWM
IFB6
IFB7
COMP
IFB8
R4
50kΩ
FBP
ISET
R6
40.2kΩ
R5
200kΩ
FSW
R7
160kΩ
C5
0.47nF
C4
47nF
Copyright © 2016, Texas Instruments Incorporated
Figure 8. TPS61199 Typical Application
8.2.1 Design Requirements
For typical LED-driver applications, use the parameters listed in Table 2.
Table 2. Design Parameters
12
DESIGN PARAMETER
EXAMPLE VALUE
Input voltage
8 V to 30 V
Output voltage
60 V
Output current
60 mA
Programmable switching frequency
300 kHz to 800 kHz
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8.2.2 Detailed Design Procedure
8.2.2.1 Inductor Selection
The TPS61199 is designed to work with inductor values between 10 µH to 47 µH. Running the controller at
higher switching frequencies allows the use of smaller and/or lower profile inductors in the 10-µH range. Running
the controller at slower switching frequencies requires the use of larger inductors, near 47 µH, to maintain the
same inductor current ripple but may improve overall inefficiency due to smaller switching losses. Inductor values
can have ±20% tolerance with no current bias. When the inductor current approaches saturation level, its
inductance can decrease 20% to 35% from the 0A value depending on how the inductor vendor defines
saturation. In a boost regulator, the inductor peak current can be calculated with Equation 6 and Equation 7.
IL
Peak
V
× IOUT IPP
= OUT
+
VIN × η
2
DIL =
(6)
1
æ
1
1 ö
L ´ ç
+
÷ ´ FSW
è VOUT - VIN VIN ø
where
•
•
•
•
•
•
VOUT = output voltage
IOUT = total LED current
VIN = input voltage
η = power conversion efficiency, use 85% for TPS61199 applications
L = inductor value
FSW = switching frequency
(7)
Select an inductor with a saturation current over the calculated peak current. To calculate the worst case inductor
peak current, use the minimum input voltage, maximum output voltage, and maximum total LED current. Select
an inductor with a saturation current at least 30% higher the calculated peak current to account for load
transients when dimming. Table 3 lists the recommended inductors
Table 3. Recommended Value For Inductors
DEVICE
L (µH)
DCR (mΩ)
ISAT (A)
SIZE (L × W × H mm)
MANUFACTURER
CDRH127/HPNP-220M
22
48.8
5.6
12.5 × 12.5 × 8.0
Sumida
SLF12575T- 220M
22
26.3
4
12.5 × 12.5 × 7.5
TDK
#B953AS-220M
22
46
3.6
12.8 × 12.8 × 6.8
TOKO
8.2.2.2 Schottky Diode
The TPS61199 demands a high-speed rectification for optimum efficiency. Ensure that the average and peak
current ratings of the diode exceed the output LED current and inductor peak current. In addition, the reverse
breakdown voltage of the diode must exceed the application output voltage. Therefore, TI recommends the
VISHAY SS5P9.
8.2.2.3 Switch MOSFET and Gate Driver Resistor
The TPS61199 demands a power N-MOSFET (see Q1 in Typical Application) as a switch. The voltage and
current rating of the MOSFET must be higher than the application output voltage and the inductor peak current.
The applications benefits from the addition of a resistor (see R8 in Typical Application) connected between the
GDRV pin and the gate of the switching MOSFET. With this resistor, the load regulation between LED dimming
on and off period and EMI are improved. TI recommends a 3-Ω resistor value. The TPS61199 exhibits lower
efficiency when the resistor value is above 3 Ω.
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8.2.2.4 Current Sense and Current Sense Filtering
R1 determines the correct overcurrent limit protection. To choose the right value of R1, start with the total system
power needed POUT. Input current Iin = POUT / (VIN × efficiency). Efficinecy can be estimated from Figure 10. The
second step is to calculate the inductor ripple current based on the inductor value L.
dIL = VIN × D / (fs × L)
where
•
D = 1 – VIN / VOUT
(8)
Thus, the peak current Ipk = Iin + dIL/2. The maximum R1 can now be calculated as
R1 = VISNS / Ipk
(9)
TI recommends adding 20% or more margin to account for component variations.
A small filter placed on the ISNS pin improves performance of the converter (see R9 and C6 in Typical
Application). The time constant of this filter should be approximately 100 ns. The range of R9 must be from about
100 Ω to 1 kΩ for best results. Locate C6 as close as possible to the ISNS pin to provide noise immunity.
8.2.2.5 Output Capacitor
The output capacitor is mainly selected to meet the requirements for output ripple and loop stability of the whole
system. This ripple voltage is related to the capacitance of the capacitor and its equivalent series resistance
(ESR). Assuming a capacitor with zero ESR, the minimum capacitance needed for a given ripple can be
calculated by:
Vripple =
C
DMAX × IOUT
FSW × COUT
where
•
•
•
Vripplec is the peak to peak output ripple
DMAX is the duty cycle of the boost converter.
DMAX is equal to approximately (VOUT_MAX – VIN_MIN) / VOUT_MAX in applications.
(10)
Care must be taken when evaluating the derating of a capacitor under DC bias. The DC bias can also
significantly reduce capacitance. Ceramic device capacitors can loss as much as 50% of its capacitance at its
rated voltage. Therefore, leave the margin on the voltage rating to ensure adequate capacitance in the
recommendation table.
The ESR impact on the output ripple must be considered as well if tantalum or electrolytic capacitors are used.
Assuming there is enough capacitance such that the ripple due to the capacitance can be ignored, the ESR
needed to limit the Vripple is:
Vripple
ESR
= IL
Peak
× ESR
(11)
Ripple current flowing through the ESR of a capacitor causes power dissipation in the capacitor. This power
dissipation causes a temperature increase internal to the capacitor. Excessive temperature can seriously shorten
the expected life of a capacitor. Capacitors have ripple current ratings that are dependent on ambient
temperature and must not be exceeded. Therefore, three electrolytic capacitors (UPW2A330MPD6, Nichicon) in
parallel reduces the total ESR, shown as in Typical Application.
In a typical application, the output requires a capacitor in the range of 10 µF to 100 µF. The output capacitor
affects the small signal control loop stability of the boost converter. If the output capacitor is below the range, the
boost regulator may potentially become unstable.
8.2.2.6 Loop Consideration
The COMP pin on the TPS61199 is used for external compensation, allowing the loop response to be optimized
for each application. The COMP pin is the output of the internal transconductance amplifier. The external resistor
R4, along with ceramic capacitors C4 and C5, are connected to the COMP pin to provide poles and zero. The
poles and zero, along with the inherent pole and zero in a peak current mode control boost converter, determine
the closed loop frequency response. This is important to converter stability and transient response. For most of
the applications, the recommended values of 10 kΩ for R4, 100 nF for C4 and 470 pF for C5 are sufficient. For
applications with different components or requirements, see Description Compensating the Current Mode Boost
Control Loop for guidance on selecting different compensation components.
14
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8.2.3 Application Curves
100
100
95
95
90
90
85
VI = 24 V
VI = 12 V
80
Efficiency - %
Efficiency - %
85
75
70
80
75
70
65
65
60
60
55
55
50
0
20
40
60
PWM - Duty Cycle - %
80
50
0
100
VI = 12 V
VI = 24 V
Figure 9. Dimming Efficiency
20
40
60
PWM - Duty Cycle - %
80
100
Figure 10. Dimming Efficiency
8.2.4 Additional Application Circuits
L1
22µH
12V IN
D1
SS5P10
OUT 60V
+
C1
10µF
R8
3Ω
C2
3 x 33µF
Q1
Si4480DY
R9
200Ω
C3
2.2µF
OUT
VIN
GDRV
VDD
ISNS
C6
0.47nF
R1
0.03Ω
R2
190kΩ
GND
IFB1
IFB2
IFB3
IFB4
OVP
TPS61199
10kΩ
R3
10kΩ
EN
10kΩ
IFB5
PWM
IFB6
IFB7
COMP
IFB8
R4
50kΩ
FBP
ISET
R6
40.2kΩ
R5
200kΩ
FSW
R7
160kΩ
C5
0.47nF
C4
47nF
Copyright © 2016, Texas Instruments Incorporated
Figure 11. Six LED Strings Application
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L1
22µH
12V IN
D1
SS5P10
OUT 60V
+
C1
10µF
R8
3Ω
Q1
Si4480DY
C2
3 x 33µF
R9
200Ω
C3
2.2µF
OUT
VIN
GDRV
VDD
ISNS
C6
0.47nF
R1
0.03Ω
R2
190kΩ
GND
IFB1
IFB2
IFB3
OVP
TPS61199
10kΩ
IFB4
R3
10kΩ
EN
10kΩ
IFB5
PWM
IFB6
IFB7
COMP
IFB8
R4
50kΩ
FBP
ISET
R5
200kΩ
FSW
R6
40.2kΩ
R7
160kΩ
C5
0.47nF
C4
47nF
Copyright © 2016, Texas Instruments Incorporated
Figure 12. Four LED Strings With 130-mA Current Application
L1
22µH
12V IN
C1
10µF
D1
SS5P10
OUT 45V
C2
R8
3Ω
Q1
Si4480DY
2 X 10µF
R9
200Ω
C3
2.2µF
OUT
VIN
GDRV
VDD
ISNS
C6
0.47nF
R1
0.03Ω
R2
150kΩ
GND
IFB1
IFB2
OVP
TPS61199
IFB3
IFB4
10kΩ
R3
10kΩ
EN
10kΩ
IFB5
PWM
IFB6
IFB7
COMP
IFB8
R4
100kΩ
FBP
ISET
C2 = GRM55DR61H106K
R6
40.2kΩ
R5
200kΩ
FSW
R7
100kΩ
C5
0.47nF
C4
100nF
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Figure 13. 112-LED Driver Application With Ceramic Output Capacitor
16
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9 Power Supply Recommendations
The TPS61199 requires a single-supply input voltage. This voltage can range from 8 V to 30 V and be able to
supply enough current for a given application.
10 Layout
10.1 Layout Consideration
As for all switching power supplies, especially those providing high current and using high switching frequencies,
layout is an important design step. If layout is not carefully done, the regulator could show instability as well as
EMI problems. Therefore, use wide and short traces for high current paths. The VDD capacitor, C3 (see Typical
Application) is the filter and noise decoupling capacitor for the internal linear regulator powering the internal
digital circuits. Place C3 as close as possible between the VDD and GND pins to prevent any noise insertion to
digital circuits. The switch node at the drain of Q1 carries high current with fast rising and falling edges.
Therefore, the connection between this node to the inductor and the Schottky diode must be kept as short and
wide as possible. It is also beneficial to have the ground of the output capacitor C2 close to the GND pin since
there is large ground return current flowing between them. When laying out signal grounds, TI recommends
using short traces separate from power ground traces, connecting them together at a single point, for example on
the thermal pad in the PWP package. Resistors R5, R6, and R7 in Typical Application are LED short-protection
threshold current setting and switching frequency programming resistors. To avoid unexpected noise coupling
into the pins and affecting the accuracy, these resistors must be close to the pins with short and wide traces to
GND. In the PWP package, the thermal pad must be soldered onto the PCB and connected to the GND pin of
the device. Additional thermal via can significantly improve power dissipation of the device.
10.2 Layout Example
Figure 14. Recommended TPS61199 PCB Layout
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11 Device and Documentation Support
11.1 Device Support
11.1.1 Third-Party Products Disclaimer
TI'S PUBLICATION OF INFORMATION REGARDING THIRD-PARTY PRODUCTS OR SERVICES DOES NOT
CONSTITUTE AN ENDORSEMENT REGARDING THE SUITABILITY OF SUCH PRODUCTS OR SERVICES
OR A WARRANTY, REPRESENTATION OR ENDORSEMENT OF SUCH PRODUCTS OR SERVICES, EITHER
ALONE OR IN COMBINATION WITH ANY TI PRODUCT OR SERVICE.
11.2 Related Documentation
For additional information, see the following:
Description Compensating the Current Mode Boost Control Loop
11.3 Receiving Notification of Documentation Updates
To receive notification of documentation updates, navigate to the device product folder on ti.com. In the upper
right corner, click on Alert me to register and receive a weekly digest of any product information that has
changed. For change details, review the revision history included in any revised document.
11.4 Community Resources
The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective
contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of
Use.
TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration
among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help
solve problems with fellow engineers.
Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and
contact information for technical support.
11.5 Trademarks
E2E is a trademark of Texas Instruments.
All other trademarks are the property of their respective owners.
11.6 Electrostatic Discharge Caution
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
11.7 Glossary
SLYZ022 — TI Glossary.
This glossary lists and explains terms, acronyms, and definitions.
12 Mechanical, Packaging, and Orderable Information
The following pages include mechanical, packaging, and orderable information. This information is the most
current data available for the designated devices. This data is subject to change without notice and revision of
this document. For browser-based versions of this data sheet, refer to the left-hand navigation.
18
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PACKAGE OPTION ADDENDUM
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10-Dec-2020
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
(2)
Lead finish/
Ball material
MSL Peak Temp
Op Temp (°C)
Device Marking
(3)
(4/5)
(6)
TPS61199NSR
ACTIVE
SO
NS
20
2000
RoHS & Green
NIPDAU
Level-1-260C-UNLIM
-40 to 85
TPS61199
TPS61199PWP
ACTIVE
HTSSOP
PWP
20
70
RoHS & Green
NIPDAU
Level-2-260C-1 YEAR
-40 to 85
TPS61199
TPS61199PWPR
ACTIVE
HTSSOP
PWP
20
2000
RoHS & Green
NIPDAU
Level-2-260C-1 YEAR
-40 to 85
TPS61199
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of
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