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TPS61376EVM-NSYNC

TPS61376EVM-NSYNC

  • 厂商:

    BURR-BROWN(德州仪器)

  • 封装:

  • 描述:

    TPS61376 - DC/DC,步升 1,非隔离 输出评估板

  • 数据手册
  • 价格&库存
TPS61376EVM-NSYNC 数据手册
www.ti.com Table of Contents User’s Guide TPS61376 Evaluation Module ABSTRACT This user's guide describes the setup, schematic, and layout of the evaluation module (EVM) for the TPS61376. The EVM helps to evaluate the behavior and performance of the device at different input voltage, output voltage, and load conditions. This EVM is optimized for 5-V input voltage and 12-V output voltage applications. The feedback divider and compensation network can be modified for other application conditions, according to the data sheet. Table of Contents 1 Introduction.............................................................................................................................................................................2 1.1 Performance Specification................................................................................................................................................. 2 1.2 Modification........................................................................................................................................................................ 2 1.3 Input Capacitor C8............................................................................................................................................................. 2 2 Test Setup................................................................................................................................................................................2 2.1 Input/Output Connector Descriptions................................................................................................................................. 2 3 Schematic and Bill of Materials.............................................................................................................................................3 3.1 Schematic.......................................................................................................................................................................... 3 3.2 Bill of Materials...................................................................................................................................................................4 4 Board Layout...........................................................................................................................................................................6 5 Revision History......................................................................................................................................................................8 Trademarks All trademarks are the property of their respective owners. SLVUCD9B – JANUARY 2022 – REVISED MARCH 2023 Submit Document Feedback Copyright © 2023 Texas Instruments Incorporated TPS61376 Evaluation Module 1 Introduction www.ti.com 1 Introduction The TPS61376 is a high voltage non-synchronous boost converter with load-disconnect and input current limit functions. The device has output overvoltage protection and hiccup mode for overcurrent protection to prevent the device from over heat. This EVM is optimized for 5-V input voltage and 12-V output voltage applications. The operating conditions of the EVM can be easily changed by modifying the external components. 1.1 Performance Specification Table 1-1 provides the summary of the TPS61376EVM performance specifications. All the specifications are given for an ambient temperature of 25°C. Table 1-1. Performance Specification Parameter Test Condition Value Unit Input voltage 3-8 V Output voltage 12 V ISEL = H 3 A ISEL = L 0.75 A 1200 kHz Maximum input current Default switching frequency 1.2 Modification The external components of the TPS61376 device can be modified to adjust the output voltage, input current limit, and response speed of real applications. 1.3 Input Capacitor C8 The 47-μF, 35-V aluminum capacitor C8 is added as the input capacitor in the EVM. The capacitor is not necessary and can be removed in a real application. 2 Test Setup This section describes how to properly connect, set up, and use the TPS61376 EVM. 2.1 Input/Output Connector Descriptions 2 Jumper Description J1 Input voltage positive connection J2 Output voltage positive connection J3 Input voltage return connection J4 Output voltage return connection JP1 EN pin input jumper. Place a jumper across EN and H to turn on the IC. Place a jumper across EN and L to turn off the IC. JP2 ISEL pin input jumper. Place a jumper across ISEL and H to set the device input current limit in high range. Put the jumper across ISEL and L to set the device input current limit in low range. TP1 Input voltage positive sensing node for measuring efficiency TP2 Output voltage positive sensing node for measuring efficiency TP3 Input voltage negative sensing node for measuring efficiency TP4 Output voltage negative sensing node for measuring efficiency TP5 Test point to measure bode plot TP6 Test point to measure SW pin waveform TPS61376 Evaluation Module SLVUCD9B – JANUARY 2022 – REVISED MARCH 2023 Submit Document Feedback Copyright © 2023 Texas Instruments Incorporated www.ti.com Schematic and Bill of Materials 3 Schematic and Bill of Materials This section provides the TPS61376 EVM schematic and bill of materials (BOM). 3.1 Schematic Figure 3-1 shows the TPS61376 EVM schematic. TP6 C1 R1 2.2nF PMEG6030EVPX 60V TP2 VOUT 2.20 J2 D1 GND C2 1uF U1 C7 1 TP1 4.7uH J1 VIN VP L1 2.9-23V C8 C9 C10 10uF 10uF 47uF TP3 5 VCC C11 1uF C15 4.7µF 11 EN 2 ISEL J3 AGND 3 COMP ILIM GND 9 10 VI N BOOT VP SW VCC VOUT FB 13 BOOT 6 SW VOUT 470nF 4 8 R2 49.9 C5 C6 10uF 10uF 47uF 1000uF TP4 J4 C12 0.01uF FB C4 TP5 R3 0 EN C3 GND C13 15pF IS EL AGND COMP AGND PGND ILI M R4 1.00M R10 10.0k 12 7 TPS61376RYHR R7 80.6k C16 3300pF AGND R5 90.9k C14 15pF R6 14.3k GND AGND AGND AGND VIN R8 100k R9 100k JP1 High EN Low VCC 1 2 3 AGND EN C17 0.1uF JP2 1 2 3 ISEL AGND AGND Figure 3-1. Schematic SLVUCD9B – JANUARY 2022 – REVISED MARCH 2023 Submit Document Feedback TPS61376 Evaluation Module Copyright © 2023 Texas Instruments Incorporated 3 Schematic and Bill of Materials www.ti.com 3.2 Bill of Materials Table 3-1 lists the BOM of the TPS61376 EVM. Table 3-1. TPS61376EVM Bill of Materials Designator 4 Qty Value Description PackageReference PartNumber Manufacturer C2, C11 2 1 μF CAP, CERM, 1 μF, 35 V, ±10%, X5R, 0402 0402 GRM155R6YA105KE11D MuRata C3, C4, C9, C10 4 10 μF CAP, CERM, 10 μF, 50 V, ±10%, X5R, AEC-Q200 Grade 1, 1206 1206 GRT31CR61H106KE01L MuRata C5, C8 2 47 μF CAP, AL, 47 μF, 35 V, ±20%, 0.06 Ω, SMD SMT Radial D EEHZC1V470P Panasonic C7 1 0.47uF CAP, CERM, 0.47 uF, 25 V, +/- 10%, X7R, 0603 0603 GRM188R71E474KA12D MuRata C12 1 0.01uF CAP, CERM, 0.01 uF, 50 V, +/- 10%, X7R, 0402 0402 GRM155R71H103KA88D MuRata C15 1 4.7 μF CAP, CERM, 4.7 µF, 16 V, ±10%, X5R, AEC-Q200 Grade 3, 0603 0603 GRT188R61C475KE13D MuRata C16 1 3300 pF CAP, CERM, 3300 pF, 50 V, ±10%, X7R, AEC-Q200 0402 Grade 1, 0402 CGA2B2X7R1H332K050BA TDK C17 1 0.1 μF CAP, CERM, 0.1 μF, 50 V, ±10%, X7R, AEC-Q200 Grade 1, 0402 0402 CGA2B3X7R1H104K050BB TDK D1 1 60 V Diode, Schottky, 60 V, 3 A, SOD-128 SOD-128 PMEG6030EVPX Nexperia J1, J2, J3, J4 4 Terminal, Turret, TH, Double Keystone1502-2 1502-2 Keystone JP1, JP2 2 Header, 100 mil, 3 × 1, Tin, TH Header, 3 PIN, 100 mil, PEC03SAAN Tin Sullins Connector Solutions L1 1 4.7 μH Shielded Power Inductor, 4.7 μH, 19.6 mΩ, 7.4 A SMT2_5MM28_5MM48 XEL5050-472MEC Coilcraft R2 1 49.9 R3 1 0 R4 1 R5 RES, 49.9, 1%, 0.063 W, AEC-Q200 Grade 0, 0402 0402 CRCW040249R9FKED Vishay-Dale RES, 0, 0%, 0.2 W, AEC-Q200 Grade 0, 0402 0402 CRCW04020000Z0EDHP Vishay-Dale 1.00 Meg RES, 1.00 M, 1%, 0.063 W, AEC-Q200 Grade 0, 0402 0402 CRCW04021M00FKED Vishay-Dale 1 90.9 k RES, 90.9 k, 1%, 0.063 W, AEC-Q200 Grade 0, 0402 0402 CRCW040290K9FKED Vishay-Dale R6 1 14.3 k RES, 14.3 k, 1%, 0.063 W, AEC-Q200 Grade 0, 0402 0402 CRCW040214K3FKED Vishay-Dale R7 1 80.6 k RES, 80.6 k, 1%, 0.063 W, AEC-Q200 Grade 0, 0402 0402 CRCW040280K6FKED Vishay-Dale R8, R9 2 100 k RES, 100 k, 1%, 0.063 W, AEC-Q200 Grade 0, 0402 0402 CRCW0402100KFKED Vishay-Dale SH-JP1, SH-JP2 2 Shunt, 100 mil, Gold plated, Black Shunt 2 pos. 100 mil 881545-2 TE Connectivity TP1, TP2, TP3, TP4, TP5, TP6 6 Test Point, Miniature, Orange, TH Orange Miniature Testpoint 5003 Keystone U1 1 23-VIN, 25-VOUT, 4.5-A, Boost Converter with Input VQFN-HR-13 Average Current Limit and Load Disconnect TPS61376RYHR Texas Instruments C1 0 CAP, CERM, 2200 pF, 250 V, ±10%, X7R, 0805 GRM21AR72E222KW01D MuRata 2200 pF 0805 TPS61376 Evaluation Module SLVUCD9B – JANUARY 2022 – REVISED MARCH 2023 Submit Document Feedback Copyright © 2023 Texas Instruments Incorporated www.ti.com Schematic and Bill of Materials Table 3-1. TPS61376EVM Bill of Materials (continued) Designator Qty Value C6 0 1000 μF C13, C14 0 15 pF FID1, FID2, FID3 0 R1 0 2.2 R10 0 10k Description PackageReference PartNumber Manufacturer CAP, AL, 1000 μF, 35 V, ±20%, 0.018 Ω, TH D12.5xL20mm EEU-FR1V102B Panasonic CAP, CERM, 15 pF, 50 V, ±5%, C0G/NP0, 0402 0402 GRM1555C1H150JA01D MuRata Fiducial mark. There is nothing to buy or mount. N/A N/A N/A RES, 2.20, 1%, 0.25 W, AEC-Q200 Grade 0, 1206 1206 ERJ-8RQF2R2V Panasonic RES, 10.0 k, 1%, 0.063 W, AEC-Q200 Grade 0, 0402 0402 CRCW040210K0FKED Vishay-Dale SLVUCD9B – JANUARY 2022 – REVISED MARCH 2023 Submit Document Feedback TPS61376 Evaluation Module Copyright © 2023 Texas Instruments Incorporated 5 Board Layout www.ti.com 4 Board Layout The TPS61376 EVM board is a 4-layer, 1-oz copper thick PCB. All the components are placed on the top layer. Figure 4-1 and Figure 4-2 show the top view and bottom view, respectively. Figure 4-3 and Figure 4-4 show the inner layer 1 and inner layer 2, respectively. Figure 4-1. Top-Side Layout Figure 4-2. Bottom-Side Layout 6 TPS61376 Evaluation Module SLVUCD9B – JANUARY 2022 – REVISED MARCH 2023 Submit Document Feedback Copyright © 2023 Texas Instruments Incorporated www.ti.com Board Layout Figure 4-3. Inner Layer 1 Layout Figure 4-4. Inner Layer 2 Layout SLVUCD9B – JANUARY 2022 – REVISED MARCH 2023 Submit Document Feedback Copyright © 2023 Texas Instruments Incorporated TPS61376 Evaluation Module 7 Revision History www.ti.com 5 Revision History NOTE: Page numbers for previous revisions may differ from page numbers in the current version. Changes from Revision A (August 2022) to Revision B (March 2023) Page • Changed device MODE pin name to ISEL......................................................................................................... 2 • Changed device MODE pin name to ISEL......................................................................................................... 2 Changes from Revision * (January 2022) to Revision A (August 2022) Page • Updated schematic and bill of materials............................................................................................................. 3 • Updated board layout images.............................................................................................................................6 8 TPS61376 Evaluation Module SLVUCD9B – JANUARY 2022 – REVISED MARCH 2023 Submit Document Feedback Copyright © 2023 Texas Instruments Incorporated IMPORTANT NOTICE AND DISCLAIMER TI PROVIDES TECHNICAL AND RELIABILITY DATA (INCLUDING DATA SHEETS), DESIGN RESOURCES (INCLUDING REFERENCE DESIGNS), APPLICATION OR OTHER DESIGN ADVICE, WEB TOOLS, SAFETY INFORMATION, AND OTHER RESOURCES “AS IS” AND WITH ALL FAULTS, AND DISCLAIMS ALL WARRANTIES, EXPRESS AND IMPLIED, INCLUDING WITHOUT LIMITATION ANY IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE OR NON-INFRINGEMENT OF THIRD PARTY INTELLECTUAL PROPERTY RIGHTS. These resources are intended for skilled developers designing with TI products. You are solely responsible for (1) selecting the appropriate TI products for your application, (2) designing, validating and testing your application, and (3) ensuring your application meets applicable standards, and any other safety, security, regulatory or other requirements. These resources are subject to change without notice. TI grants you permission to use these resources only for development of an application that uses the TI products described in the resource. Other reproduction and display of these resources is prohibited. No license is granted to any other TI intellectual property right or to any third party intellectual property right. TI disclaims responsibility for, and you will fully indemnify TI and its representatives against, any claims, damages, costs, losses, and liabilities arising out of your use of these resources. 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