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TPS62000, TPS62001, TPS62002, TPS62003
TPS62004, TPS62005, TPS62006, TPS62007, TPS62008
SLVS294F – SEPTEMBER 2000 – REVISED AUGUST 2015
TPS6200x High-Efficiency Step-Down Low Power DC-DC Converter
1 Features
2 Applications
•
•
•
•
•
•
•
High-Efficiency Synchronous Step-Down
Converter with More than 95% Efficiency
2-V to 5.5-V Operating Input Voltage Range
Adjustable Output Voltage Range From 0.8 V to
VIN
Fixed Output Voltage Options Available in 0.9 V,
1 V, 1.2 V, 1.5 V, 1.8 V, 1.9 V, 2.5 V, and 3.3 V
Synchronizable to External Clock Signal up to
1 MHz
Up to 600 mA Output Current
Pin-Programmable Current Limit
High Efficiency Over a Wide Load Current Range
in Power Save Mode
100% Maximum Duty Cycle for Lowest Dropout
Low-Noise Operation Antiringing Switch and
PFM/PWM Operation Mode
Internal Softstart
50-μA Quiescent Current (TYP)
Available in the 10-Pin Microsmall Outline
Package (VSSOP)
Evaluation Module Available
1
•
•
•
•
•
•
•
•
•
•
•
•
•
Low-Power CPUs and DSPs
Cellular Phones
Organizers, PDAs, and Handheld PCs
MP-3 Portable Audio Players
Digital Cameras
USB-Based DSL Modems and Other Network
Interface Cards
3 Description
The TPS6200x devices are a family of low-noise
synchronous step-down DC/DC converters that are
ideally suited for systems powered from a 1-cell Li-ion
battery or from a 2- to 3-cell NiCd, NiMH, or alkaline
battery. The TPS6200x operates typically down to an
input voltage of 1.8 V, with a specified minimum input
voltage of 2 V.
The TPS62000 operates over a free-air temperature
range of –40°C to 85°C.The device is available in the
10-pin (DGS) microsmall outline package (VSSOP).
Device Information(1)
PART NUMBER
TPS6200x
PACKAGE
VSSOP (10)
BODY SIZE (NOM)
3.00 mm × 3.00 mm
(1) For all available packages, see the orderable addendum at
the end of the datasheet.
Efficiency vs Load Current
Typical Application Schematic
100
90
80
10 mF
1
8
VIN
L
EN
FB
9
10 mH
VO = 0.8 V
to VI
5
10 mF
TPS6200x
6
7
ILIM
SYNC
GND
3
PGND
PG
FC
†
70
Efficiency − %
VI = 2 V
to 5.5 V
SYNC = Low
60
SYNC = High
50
40
30
10
20
4
2
VI = 3.6 V,
VO = 2.5 V
10
PG
0
0.1
1
10
100
IO − Load Current − mA
1000
0.1 mF
†
With VO ≥1.8 V; Co = 10 mF, VO 50 mΩ
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SLVS294F – SEPTEMBER 2000 – REVISED AUGUST 2015
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See Table 3 for recommended capacitors.
If an output capacitor is selected with an ESR value ≤ 120 mΩ, its RMS ripple current rating always meets the
application requirements. Just for completeness, the RMS ripple current is calculated as:
V
1 - O
VI
1
IRMS(CO ) = VO ´
´
L ´ f
2´ 3
(5)
The overall output ripple voltage is the sum of the voltage spike caused by the output capacitor ESR plus the
voltage ripple caused by charging and discharging the output capacitor:
VO
VI
L ´ f
1 DVO = VO ´
æ
ö
1
´ ç
+ ESR ÷
è 8 ´ CO ´ f
ø
(6)
Where the highest output voltage ripple occurs at the highest input voltage VI.
Table 3. Tested Capacitors
CAPACITOR VALUE
ESR/mΩ
COMPONENT SUPPLIER
COMMENTS
10 μF
50
Taiyo Yuden JMK316BJ106KL
Ceramic
47 μF
100
Sanyo 6TPA47M
POSCAP
68 μF
100
Spraque 594D686X0010C2T
Tantalum
9.2.2.3 Input Capacitor Selection
Because of the nature of the buck converter having a pulsating input current, a low ESR input capacitor is
required for best input voltage filtering and minimizing the interference with other circuits caused by high input
voltage spikes.
The input capacitor should have a minimum value of 10 μF and can be increased without any limit for better input
voltage filtering.
The input capacitor should be rated for the maximum input ripple current calculated as:
IRMS = IO(max) ´
VO
VI
æ V ö
´ ç 1- O ÷
VI ø
è
(7)
The worst case RMS ripple current occurs at D = 0.5 and is calculated as:
IRMS
I
= O
2
Ceramic capacitor show a good performance because of their low ESR value, and they are less sensitive against
voltage transients compared to tantalum capacitors.
Place the input capacitor as close as possible to the input pin of the IC for best performance.
14
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TPS62004, TPS62005, TPS62006, TPS62007, TPS62008
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SLVS294F – SEPTEMBER 2000 – REVISED AUGUST 2015
9.2.3 Application Curves
100
VO = 2.5 V
Efficiency − %
90
VI = 3.6 V
80
70
VI = 5 V
60
50
40
0.1
1
10
100
IO − Load Current − mA
1000
Figure 6. Efficiency vs Load Current
Figure 7. Efficiency vs Load Current
Figure 8. Efficiency vs Load Current
Figure 9. Load Transient Response
200 ms/div
400 ms/div
Figure 10. Line Transient Response
Copyright © 2000–2015, Texas Instruments Incorporated
10 ms/div
Figure 11. Power Save Mode Operation
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15
TPS62000, TPS62001, TPS62002, TPS62003
TPS62004, TPS62005, TPS62006, TPS62007, TPS62008
SLVS294F – SEPTEMBER 2000 – REVISED AUGUST 2015
www.ti.com
2.55
2.54
EN
2 V/div
VO − Output Voltage − V
2.53
VO
1 V/div
Power Good
1 V/div
2.52
2.51
2.50
2.49
2.48
2.47
II
200 mA/div
2.46
2.45
250 ms/div
Figure 12. Start-Up vs Time
16
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0
100
200
300
400
500
600
IO − Load Current − mA
Figure 13. Output Voltage vs Load Current
Copyright © 2000–2015, Texas Instruments Incorporated
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TPS62008
TPS62000, TPS62001, TPS62002, TPS62003
TPS62004, TPS62005, TPS62006, TPS62007, TPS62008
www.ti.com
SLVS294F – SEPTEMBER 2000 – REVISED AUGUST 2015
9.3 System Examples
9.3.1 Standard 5-V to 3.3-V/600-mA Conversion; High Efficiency
1
VI = 5 V
C1
10 mF
8
VIN
L
EN
FB
9
L1
22 mH
VO = 3.3 V/600 mA
5
TPS62007DGS
6
7
ILIM
680 kΩ
10
PGND
SYNC
GND
3
4
PG
FC
2
C2
10 mF
Power
Good
L1:
Sumdia CDRH5D28-220
C1, C2: 10 mF Ceramic Taiyo Yuden
JMK316BJ106KL
C3:
0.1 mF Ceramic
C3
0.1 mF
Figure 14. Standard 5-V to 3.3-V/600-mA Conversion; High Efficiency
9.3.2 Single Li-ion to 2.5-V/600-mA Using Ceramic Capacitors Only
VI = 2.7 V to 4.2 V
C1
10 mF
1
8
VIN
L
EN
FB
9
7
ILIM
SYNC
GND
3
VO = 2.5 V/600 mA
5
TPS62006DGS
6
L1
10 mH
470 kΩ
PGND
PG
FC
C2
10 mF
10
4
2
C3
0.1 mF
Power Good
L1:
C1,C2:
C3:
Sumdia CDRH5D28-100
10 mF Ceramic Taiyo Yuden
JMK316BJ106KL
0.1 mF Ceramic
Figure 15. Single Li-ion to 2.5-V/600-mA Using Ceramic Capacitors Only
Copyright © 2000–2015, Texas Instruments Incorporated
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17
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TPS62004, TPS62005, TPS62006, TPS62007, TPS62008
SLVS294F – SEPTEMBER 2000 – REVISED AUGUST 2015
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System Examples (continued)
9.3.3 Single Li-ion to 1.8 V/300 mA; Smallest Solution Size
1
VI = 2.5 V to 4.2 V
C1
10 mF
8
VIN
L
EN
FB
9
L1
10 mH
VO = 1.8 V/300 mA
5
C2
10 mF
TPS62005DGS
6
7
ILIM
10
PGND
SYNC
GND
4
PG
FC
3
2
L1:
C1,C2:
C3
0.1 mF
C3:
Murata LQH4C100K04
10 mF Ceramic Taiyo Yuden
JMK316BJ106KL
0.1 mF Ceramic
NOTE: For low noise operation connect SYNC to VIN
Figure 16. Single Li-ion to 1.8 V/300 mA; Smallest Solution Size
9.3.4 Dual Cell NiMH or NiCd to 1.2 V/200 mA; Smallest Solution Size
VI = 2 V to 3.8 V
C1
10 mF
1
8
VIN
L
EN
FB
9
7
ILIM
SYNC
GND
3
PGND
PG
FC
2
VO = 1.2 V/200 mA
5
C2
47 mF
TPS62003
6
L1
10 mH
+
10
4
C3
0.1 mF
L1:
C1:
C2:
C3:
Murata LQH4C100K04
10 mF Ceramic Taiyo Yuden
JMK316BJ106KL
Sanyo 6TPA47M
0.1 mF Ceramic
Figure 17. Dual Cell NiMH or NiCd to 1.2 V/200 mA; Smallest Solution Size
18
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TPS62004, TPS62005, TPS62006, TPS62007, TPS62008
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SLVS294F – SEPTEMBER 2000 – REVISED AUGUST 2015
System Examples (continued)
9.3.5 Dynamic Output Voltage Programming As Used in Low Power DSP Applications
10 mH
820 kW
(2)
470 kW
10 mF
47 mF
326 kW
524 kW
0.1 mF
Sumida CDRH5D28-100
10 mF Ceramic Taiyo Yuden
JMK316BJ106KL
Sanyo 6TPA47M
0.1 mF Ceramic
(1)
Use a small R-C filter to filter wrong reset signals during output voltage transitions.
(2)
A large value is used for C(ff) to compensate for the parasitic capacitance introduced into the regulation loop by Q1.
Figure 18. Dynamic Output Voltage Programming As Used in Low Power DSP Applications
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TPS62004, TPS62005, TPS62006, TPS62007, TPS62008
SLVS294F – SEPTEMBER 2000 – REVISED AUGUST 2015
www.ti.com
10 Power Supply Recommendations
The TPS6200x device family has no special requirements for its input power supply. The input power supply's
output current needs to be rated according to the supply voltage, output voltage and output current of the
TPS6200x.
11 Layout
11.1 Layout Guidelines
As for all switching power supplies, the layout is an important step in the design especially at high peak currents
and switching frequencies. If the layout is not carefully done, the regulator might show stability problems as well
as EMI problems.
Therefore, use wide and short traces for the main current paths as indicted in bold in Figure 19. The input
capacitor should be placed as close as possible to the IC pins as well as the inductor and output capacitor. Place
the bypass capacitor, C3, as close as possible to the FC pin. The analog ground, GND, and the power ground,
PGND, need to be separated. Use a common ground node as shown in Figure 19 to minimize the effects of
ground noise.
11.2 Layout Example
1
VI
VIN
L
EN
FB
L1
9
VO
+
8
Ci
R3
5
R1
TPS62000
6
C(ff)
4
ILIM
PG
+
PG
Co
7
SYNC
GND
3
10
PGND
FC
R2
C3
2
Figure 19. Layout Diagram
20
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TPS62004, TPS62005, TPS62006, TPS62007, TPS62008
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SLVS294F – SEPTEMBER 2000 – REVISED AUGUST 2015
12 Device and Documentation Support
12.1 Device Support
12.1.1 Third-Party Products Disclaimer
TI'S PUBLICATION OF INFORMATION REGARDING THIRD-PARTY PRODUCTS OR SERVICES DOES NOT
CONSTITUTE AN ENDORSEMENT REGARDING THE SUITABILITY OF SUCH PRODUCTS OR SERVICES
OR A WARRANTY, REPRESENTATION OR ENDORSEMENT OF SUCH PRODUCTS OR SERVICES, EITHER
ALONE OR IN COMBINATION WITH ANY TI PRODUCT OR SERVICE.
12.2 Community Resources
The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective
contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of
Use.
TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration
among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help
solve problems with fellow engineers.
Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and
contact information for technical support.
12.3 Related Links
The table below lists quick access links. Categories include technical documents, support and community
resources, tools and software, and quick access to sample or buy.
Table 4. Related Links
PARTS
PRODUCT FOLDER
SAMPLE & BUY
TECHNICAL
DOCUMENTS
TOOLS &
SOFTWARE
SUPPORT &
COMMUNITY
TPS62000
Click here
Click here
Click here
Click here
Click here
TPS62001
Click here
Click here
Click here
Click here
Click here
TPS62002
Click here
Click here
Click here
Click here
Click here
TPS62003
Click here
Click here
Click here
Click here
Click here
TPS62004
Click here
Click here
Click here
Click here
Click here
TPS62005
Click here
Click here
Click here
Click here
Click here
TPS62006
Click here
Click here
Click here
Click here
Click here
TPS62007
Click here
Click here
Click here
Click here
Click here
TPS62008
Click here
Click here
Click here
Click here
Click here
12.4 Trademarks
E2E is a trademark of Texas Instruments.
All other trademarks are the property of their respective owners.
12.5 Electrostatic Discharge Caution
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
12.6 Glossary
SLYZ022 — TI Glossary.
This glossary lists and explains terms, acronyms, and definitions.
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TPS62004, TPS62005, TPS62006, TPS62007, TPS62008
SLVS294F – SEPTEMBER 2000 – REVISED AUGUST 2015
www.ti.com
13 Mechanical, Packaging, and Orderable Information
The following pages include mechanical, packaging, and orderable information. This information is the most
current data available for the designated devices. This data is subject to change without notice and revision of
this document. For browser-based versions of this data sheet, refer to the left-hand navigation.
22
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TPS62008
PACKAGE OPTION ADDENDUM
www.ti.com
14-Oct-2022
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
(2)
Lead finish/
Ball material
MSL Peak Temp
Op Temp (°C)
Device Marking
(3)
Samples
(4/5)
(6)
TPS62000DGS
ACTIVE
VSSOP
DGS
10
80
RoHS & Green
NIPDAUAG
Level-1-260C-UNLIM
-40 to 85
AIH
Samples
TPS62000DGSG4
ACTIVE
VSSOP
DGS
10
80
RoHS & Green
NIPDAUAG
Level-1-260C-UNLIM
-40 to 85
AIH
Samples
TPS62000DGSR
ACTIVE
VSSOP
DGS
10
2500
RoHS & Green NIPDAU | NIPDAUAG
Level-1-260C-UNLIM
-40 to 85
AIH
Samples
TPS62000DGSRG4
ACTIVE
VSSOP
DGS
10
2500
RoHS & Green
NIPDAU
Level-1-260C-UNLIM
-40 to 85
AIH
Samples
TPS62002DGS
ACTIVE
VSSOP
DGS
10
80
RoHS & Green
NIPDAUAG
Level-1-260C-UNLIM
-40 to 85
AIJ
Samples
TPS62002DGSR
ACTIVE
VSSOP
DGS
10
2500
RoHS & Green
NIPDAUAG
Level-1-260C-UNLIM
-40 to 85
AIJ
Samples
TPS62003DGS
ACTIVE
VSSOP
DGS
10
80
RoHS & Green
NIPDAUAG
Level-1-260C-UNLIM
-40 to 85
AIK
Samples
TPS62003DGSR
ACTIVE
VSSOP
DGS
10
2500
RoHS & Green
NIPDAUAG
Level-1-260C-UNLIM
-40 to 85
AIK
Samples
TPS62003DGSRG4
ACTIVE
VSSOP
DGS
10
2500
RoHS & Green
NIPDAUAG
Level-1-260C-UNLIM
-40 to 85
AIK
Samples
TPS62004DGS
ACTIVE
VSSOP
DGS
10
80
RoHS & Green
NIPDAUAG
Level-1-260C-UNLIM
-40 to 85
AIL
Samples
TPS62004DGSR
ACTIVE
VSSOP
DGS
10
2500
RoHS & Green
NIPDAUAG
Level-1-260C-UNLIM
-40 to 85
AIL
Samples
TPS62005DGS
ACTIVE
VSSOP
DGS
10
80
RoHS & Green
NIPDAUAG
Level-1-260C-UNLIM
-40 to 85
AIM
Samples
TPS62005DGSR
ACTIVE
VSSOP
DGS
10
2500
RoHS & Green
NIPDAUAG
Level-1-260C-UNLIM
-40 to 85
AIM
Samples
TPS62006DGS
ACTIVE
VSSOP
DGS
10
80
RoHS & Green
NIPDAUAG
Level-1-260C-UNLIM
-40 to 85
AIN
Samples
TPS62006DGSR
ACTIVE
VSSOP
DGS
10
2500
RoHS & Green
NIPDAUAG
Level-1-260C-UNLIM
-40 to 85
AIN
Samples
TPS62007DGS
ACTIVE
VSSOP
DGS
10
80
RoHS & Green NIPDAU | NIPDAUAG
Level-1-260C-UNLIM
-40 to 85
AIO
Samples
TPS62007DGSR
ACTIVE
VSSOP
DGS
10
2500
RoHS & Green NIPDAU | NIPDAUAG
Level-1-260C-UNLIM
-40 to 85
AIO
Samples
TPS62007DGSRG4
ACTIVE
VSSOP
DGS
10
2500
RoHS & Green
NIPDAU
Level-1-260C-UNLIM
-40 to 85
AIO
Samples
TPS62008DGS
ACTIVE
VSSOP
DGS
10
80
RoHS & Green
NIPDAUAG
Level-1-260C-UNLIM
-40 to 85
AJI
Samples
TPS62008DGSR
ACTIVE
VSSOP
DGS
10
2500
RoHS & Green
NIPDAUAG
Level-1-260C-UNLIM
-40 to 85
AJI
Samples
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
14-Oct-2022
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of