TPS62675YFDT

Order Now Product Folder Technical Documents Support & Community Tools & Software TPS62671, TPS62672, TPS62674 TPS62675, TPS626751, TPS626765, TPS62679 SLVS952G – APRIL 2010 – REVISED JANUARY 2017 TPS6267x 500-mA/650-mA, 6-MHz High-Efficiency Step-Down Converter in Low Profile Chip Scale Packaging (Height < 0.4mm) 1 Features 3 Description • • • • • • • • • • • The TPS6267x devices are high-frequency synchronous step-down dc-dc converters optimized for small battery-powered applications. Intended for low-power applications, the TPS6267x supports up to 650-mA load current and allows the use of low cost chip inductor and capacitors. 1 • • • • 92% Efficiency at 6MHz Operation 17μA Quiescent Current Wide VIN Range From 2.3V to 4.8V 6MHz Regulated Frequency Operation Spread Spectrum, PWM Frequency Dithering Best in Class Load and Line Transient ±2% Total DC Voltage Accuracy Low Ripple Light-Load PFM Mode ≥35dB VIN PSRR (1kHz to 10kHz) Simple Logic Enable Inputs Supports External Clock Presence Detect Enable Input Three Surface-Mount External Components Required (One 0603 MLCC Inductor, Two 0402 Ceramic Capacitors) Complete Sub 0.33-mm Component Profile Solution Total Solution Size RBW: The receiver is able to properly measure each individual side-band harmonic separately, so the measurements match with the theoretical calculations. 10.3.5 Short-Circuit Protection The TPS6267x integrates a P-channel MOSFET current limit to protect the device against heavy load or short circuits. When the current in the P-channel MOSFET reaches its current limit, the P-channel MOSFET is turned off and the N-channel MOSFET is turned on. The regulator continues to limit the current on a cycle-by-cycle basis. As soon as the output voltage falls below ca. 0.4V, the converter current limit is reduced to half of the nominal value. Because the short-circuit protection is enabled during start-up, the device does not deliver more than half of its nominal current limit until the output voltage exceeds approximately 0.5V. This needs to be considered when a load acting as a current sink is connected to the output of the converter. 10.3.6 Thermal Shutdown As soon as the junction temperature, TJ, exceeds typically 140°C, the device goes into thermal shutdown. In this mode, the P- and N-channel MOSFETs are turned off. The device continues its operation when the junction temperature again falls below typically 130°C. 10.4 Device Functional Modes 10.4.1 Soft Start The TPS6267x has an internal soft-start circuit that limits the inrush current during start-up. This limits input voltage drops when a battery or a high-impedance power source is connected to the input of the converter. The soft-start system progressively increases the on-time from a minimum pulse-width of 35ns as a function of the output voltage. This mode of operation continues for c.a. 100μs after enable. Should the output voltage not have reached its target value by this time, such as in the case of heavy load, the soft-start transitions to a second mode of operation. The converter then operates in a current limit mode, specifically the P-MOS current limit is set to half the nominal limit, and the N-channel MOSFET remains on until the inductor current has reset. After a further 100 μs, the device ramps up to the full current limit operation if the output voltage has risen above 0.5V (approximately). Therefore, the start-up time mainly depends on the output capacitor and load current. 10.4.2 Enable The TPS6267x device starts operation when EN is set high and starts up with the soft start as previously described. For proper operation, the EN pin must be terminated and must not be left floating. Pulling the EN pin Low, forces the device into shutdown with a shutdown quiescent current of typically 0.1μA. In this mode, the P and N-channel MOSFETs are turned off, the internal resistor feedback divider is disconnected, and the entire internal-control circuitry is switched off. When an external clock signal (EXTCLK), 4MHz to 27MHz, is applied to the TPS62674 or TPS62679, the DC/DC converter powers-up automatically within approx. 120μs (TPS62674) or 450μs (TPS62679). When the external clock signal is stopped, the DC/DC converter is powered down and the output capacitor is discharged actively. 10.4.3 Active Output Discharge The TPS62674, TPS626751, TPS626765 and TPS62679 actively discharge the output capacitor when turned off. The integrated discharge resistor has a typical resistance of 70 Ω. The required time to discharge the output capacitor at the output node depends on load current and the output capacitance value. Copyright © 2010–2017, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: TPS62671 TPS62672 TPS62674 TPS62675 TPS626751 TPS626765 TPS62679 17 TPS62671, TPS62672, TPS62674 TPS62675, TPS626751, TPS626765, TPS62679 SLVS952G – APRIL 2010 – REVISED JANUARY 2017 www.ti.com Device Functional Modes (continued) 10.4.4 Undervoltage Lockout The undervoltage lockout circuit prevents the device from misoperation at low input voltages. It prevents the converter from turning on the switch or rectifier MOSFET under undefined conditions. The TPS6267x device have a UVLO threshold set to 2.05V (typical). Fully functional operation is permitted down to 2.1V input voltage. 18 Submit Documentation Feedback Copyright © 2010–2017, Texas Instruments Incorporated Product Folder Links: TPS62671 TPS62672 TPS62674 TPS62675 TPS626751 TPS626765 TPS62679 TPS62671, TPS62672, TPS62674 TPS62675, TPS626751, TPS626765, TPS62679 www.ti.com SLVS952G – APRIL 2010 – REVISED JANUARY 2017 11 Application and Implementation 11.1 Application Information TPS6267x are high frequency step-down converters. They can convert from a 2.3V to 4.8V input source to various fixed output voltages, providing up to 500mA. Needing a minimum amount of external components, the design procedure is easy to do and usually done by choosing input and output capacitor as well as an appropriate inductor which is described in the sections below. 11.2 Typical Applications 11.2.1 TPS6267x Point-Of-Load Supply VBAT 2.3 V .. 4.8 V CI TPS62671 L VIN SW EN FB 2.2 mF VOUT 1.8 V @ 500mA 0.47 mH CO 4.7 mF GND MODE Figure 28. 1.8V/0.5A Power Supply Using TPS62671 11.2.1.1 Design Requirements The TPS6267x devices are optimized to work with the external components as shown in Figure 28, providing stable operation for the input voltage and load current range up to 500mA. Connecting the MODE pin to GND provides PWM/PFM operation. 11.2.1.2 Detailed Design Procedure 11.2.1.2.1 Inductor Selection The TPS6267x series of step-down converters have been optimized to operate with an effective inductance value in the range of 0.3μH to 1.8μH and with output capacitors in the range of 2.2μF to 4.7μF. The internal compensation is optimized to operate with an output filter of L = 0.47μH and CO = 2.2μF. Larger or smaller inductor values can be used to optimize the performance of the device for specific operation conditions. For more details, see the CHECKING LOOP STABILITY section. The inductor value affects its peak-to-peak ripple current, the PWM-to-PFM transition point, the output voltage ripple and the efficiency. The selected inductor has to be rated for its dc resistance and saturation current. The inductor ripple current (ΔIL) decreases with higher inductance and increases with higher VI or VO. V V *V DI I O DI + O DI +I ) L L L(MAX) O(MAX) 2 V L ƒ sw I (4) With: fSW = switching frequency (6 MHz typical) L = inductor value ΔIL = peak-to-peak inductor ripple current IL(MAX) = maximum inductor current In high-frequency converter applications, the efficiency is essentially affected by the inductor AC resistance (i.e. quality factor) and to a smaller extent by the inductor DCR value. To achieve high efficiency operation, care should be taken in selecting inductors featuring a quality factor above 25 at the switching frequency. Increasing the inductor value produces lower RMS currents, but degrades transient response. For a given physical inductor size, increased inductance usually results in an inductor with lower saturation current. The total losses of the coil consist of both the losses in the DC resistance, R(DC), and the following frequencydependent components: Copyright © 2010–2017, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: TPS62671 TPS62672 TPS62674 TPS62675 TPS626751 TPS626765 TPS62679 19 TPS62671, TPS62672, TPS62674 TPS62675, TPS626751, TPS626765, TPS62679 SLVS952G – APRIL 2010 – REVISED JANUARY 2017 www.ti.com Typical Applications (continued) • • • • The losses in the core material (magnetic hysteresis loss, especially at high switching frequencies) Additional losses in the conductor from the skin effect (current displacement at high frequencies) Magnetic field losses of the neighboring windings (proximity effect) Radiation losses The following inductor series from different suppliers have been used with the TPS6267x converters. Table 1. List of Inductors (1) MANUFACTURER MURATA PANASONIC SEMCO DIMENSIONS (in mm) 2.0 x 1.2 x 1.0 max. height LQM21PNR47MC0 2.0 x 1.2 x 0.55 max. height LQM21PN1R0MC0 2.0 x 1.2 x 0.55 max. height LQM18PN1R5-B35 1.6 x 0.8 x 0.4 max. height LQM18PN1R5-A62 1.6 x 0.8 x 0.33 max. height ELGTEAR82NA 2.0 x 1.2 x 1.0 max. height CIG21L1R0MNE 2.0 x 1.2 x 1.0 max. height BRC1608T1R0M6, BRC1608TR50M6 1.6 x 0.8 x 1.0 max. height CKP1608L1R5M 1.6 x 0.8 x 0.55 max. height TAIYO YUDEN (1) SERIES LQM21PN1R0NGR CKP1608U1R5M 1.6 x 0.8 x 0.4 max. height CKP1608S1R0M, CKP1608S1R5M 1.6 x 0.8 x 0.33 max. height NM2012NR82, NM2012N1R0 2.0 x 1.2 x 1.0 max. height TDK MLP2012SR82T 2.0 x 1.2 x 0.6 max. height TOKO MDT2012-CR1R0A 2.0 x 1.2 x 1.0 max. height See Third-Party Products Disclaimer 11.2.1.2.2 Output Capacitor Selection The advanced fast-response voltage mode control scheme of the TPS6267x allows the use of tiny ceramic capacitors. Ceramic capacitors with low ESR values have the lowest output voltage ripple and are recommended. For best performance, the device should be operated with a minimum effective output capacitance of 0.8μF. The output capacitor requires either an X7R or X5R dielectric. Y5V and Z5U dielectric capacitors, aside from their wide variation in capacitance over temperature, become resistive at high frequencies. At nominal load current, the device operates in PWM mode and the overall output voltage ripple is the sum of the voltage step caused by the output capacitor ESL and the ripple current flowing through the output capacitor impedance. At light loads, the output capacitor limits the output ripple voltage and provides holdup during large load transitions. A 2.2μF or 4.7μF ceramic capacitor typically provides sufficient bulk capacitance to stabilize the output during large load transitions. The typical output voltage ripple is 1% of the nominal output voltage VO. For best operation (i.e. optimum efficiency over the entire load current range, proper PFM/PWM auto transition), the TPS6267x requires a minimum output ripple voltage in PFM mode. The typical output voltage ripple is ca. 1% of the nominal output voltage VO. The PFM pulses are time controlled resulting in a PFM output voltage ripple and PFM frequency that depends (first order) on the capacitance seen at the converter's output. 11.2.1.2.3 Input Capacitor Selection Because of the nature of the buck converter having a pulsating input current, a low ESR input capacitor is required to prevent large voltage transients that can cause misbehavior of the device or interferences with other circuits in the system. For most applications, a 1 or 2.2-μF capacitor is sufficient. If the application exhibits a noisy or erratic switching frequency, the remedy will probably be found by experimenting with the value of the input capacitor. 20 Submit Documentation Feedback Copyright © 2010–2017, Texas Instruments Incorporated Product Folder Links: TPS62671 TPS62672 TPS62674 TPS62675 TPS626751 TPS626765 TPS62679 TPS62671, TPS62672, TPS62674 TPS62675, TPS626751, TPS626765, TPS62679 www.ti.com SLVS952G – APRIL 2010 – REVISED JANUARY 2017 Take care when using only ceramic input capacitors. When a ceramic capacitor is used at the input and the power is being supplied through long wires, such as from a wall adapter, a load step at the output can induce ringing at the VIN pin. This ringing can couple to the output and be mistaken as loop instability or could even damage the part. Additional "bulk" capacitance (electrolytic or tantalum) should in this circumstance be placed between CI and the power source lead to reduce ringing than can occur between the inductance of the power source leads and CI. 11.2.1.2.4 Checking Loop Stability The first step of circuit and stability evaluation is to look from a steady-state perspective at the following signals: • Switching node, SW • Inductor current, IL • Output ripple voltage, VO(AC) These are the basic signals that need to be measured when evaluating a switching converter. When the switching waveform shows large duty cycle jitter or the output voltage or inductor current shows oscillations, the regulation loop may be unstable. This is often a result of board layout and/or L-C combination. As a next step in the evaluation of the regulation loop, the load transient response is tested. The time between the application of the load transient and the turn on of the P-channel MOSFET, the output capacitor must supply all of the current required by the load. VO immediately shifts by an amount equal to ΔI(LOAD) x ESR, where ESR is the effective series resistance of CO. ΔI(LOAD) begins to charge or discharge CO generating a feedback error signal used by the regulator to return VO to its steady-state value. The results are most easily interpreted when the device operates in PWM mode. During this recovery time, VO can be monitored for settling time, overshoot or ringing that helps judge the converter’s stability. Without any ringing, the loop has usually more than 45° of phase margin. Because the damping factor of the circuitry is directly related to several resistive parameters (e.g., MOSFET rDS(on)) that are temperature dependant, the loop stability analysis has to be done over the input voltage range, load current range, and temperature range. Copyright © 2010–2017, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: TPS62671 TPS62672 TPS62674 TPS62675 TPS626751 TPS626765 TPS62679 21 TPS62671, TPS62672, TPS62674 TPS62675, TPS626751, TPS626765, TPS62679 SLVS952G – APRIL 2010 – REVISED JANUARY 2017 www.ti.com 11.2.1.3 Application Curves VI = 3.6 V, VO = 1.8 V VI = 3.6 V, VO = 1.8 V 30 to 300 mA Load Step 30 to 300 mA Load Step 2.7V to 3.3V Line Step 3.3V to 3.9V Line Step MODE = Low Figure 29. Combined Line/Load Transient Response VI = 3.6 V, VO = 1.2 V MODE = Low Figure 30. Combined Line/Load Transient Response VI = 3.6 V, VO = 1.2 V 50 to 350 mA Load Step 5 to 150 mA Load Step MODE = Low Figure 31. Load Transient Response in PFM/PWM Operation VI = 2.7 V, VO = 1.2 V 50 to 350 mA Load Step MODE = Low Figure 33. Load Transient Response in PFM/PWM Operation 22 Submit Documentation Feedback MODE = Low Figure 32. Load Transient Response in PFM/PWM Operation VI = 4.8 V, VO = 1.2 V 50 to 350 mA Load Step MODE = Low Figure 34. Load Transient Response in PFM/PWM Operation Copyright © 2010–2017, Texas Instruments Incorporated Product Folder Links: TPS62671 TPS62672 TPS62674 TPS62675 TPS626751 TPS626765 TPS62679 TPS62671, TPS62672, TPS62674 TPS62675, TPS626751, TPS626765, TPS62679 www.ti.com VI = 3.6 V, VO = 1.2 V SLVS952G – APRIL 2010 – REVISED JANUARY 2017 150 to 500 mA Load Step VI = 2.7 V, VO = 1.2 V 150 to 500 mA Load Step MODE = Low MODE = Low Figure 35. Load Transient Response in PWM/PWM Operation VI = 4.8 V, VO = 1.2 V 150 to 500 mA Load Step Figure 36. Load Transient Response in PWM/PWM Operation VI = 3.6 V, VO = 1.8 V 5 to 150 mA Load Step MODE = Low Figure 37. Load Transient Response in PWM/PWM Operation VI = 3.6 V, VO = 1.8 V 50 to 350 mA Load Step MODE = Low Figure 39. Load Transient Response in PFM/PWM Operation Copyright © 2010–2017, Texas Instruments Incorporated MODE = Low Figure 38. Load Transient Response in PFM/PWM Operation VI = 3.6 V, VO = 1.8 V 150 to 500 mA Load MODE = Low Figure 40. Load Transient Response in PWM/PWM Operation Submit Documentation Feedback Product Folder Links: TPS62671 TPS62672 TPS62674 TPS62675 TPS626751 TPS626765 TPS62679 23 TPS62671, TPS62672, TPS62674 TPS62675, TPS626751, TPS626765, TPS62679 SLVS952G – APRIL 2010 – REVISED JANUARY 2017 www.ti.com VI = 3.6 V, VO = 1.2 V VI = 3.6 V, VO = 1.8 V 5 to 300 mA Load Sweep 5 to 300 mA Load Sweep MODE = Low MODE = Low Figure 41. AC Load Transient Response Figure 42. AC Load Transient Response VI = 3.6 V, VO = 1.2 V, IO = 200 mA VI = 3.6 V, VO = 1.2 V, IO = 150 mA MODE = Low Figure 43. Typical PWM Mode Operation MODE = Low Figure 44. PWM Mode Operation - SSFM Modulation VI = 3.6 V, VO = 1.2V, IO = 40 mA VI = 3.6 V, VO = 1.8 V, IO = 0 mA MODE = Low Figure 45. Typical Power Save Mode Operation 24 Submit Documentation Feedback MODE = Low Figure 46. Start-Up Copyright © 2010–2017, Texas Instruments Incorporated Product Folder Links: TPS62671 TPS62672 TPS62674 TPS62675 TPS626751 TPS626765 TPS62679 TPS62671, TPS62672, TPS62674 TPS62675, TPS626751, TPS626765, TPS62679 www.ti.com SLVS952G – APRIL 2010 – REVISED JANUARY 2017 VI = 3.6 V, VO = 1.2 V, IO = 0 mA VI = 3.6 V, VO = 1.2 V, IO = 0 mA MODE = Low MODE = High Figure 47. Start-Up Figure 48. Start-Up (RF Clock) VI = 3.6 V, VO = 1.2 V, IO = 0 mA, CO = 4.7uF 6.3V X5R (0402) MODE = High Figure 49. Shut-Down (RF Clock) Copyright © 2010–2017, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: TPS62671 TPS62672 TPS62674 TPS62675 TPS626751 TPS626765 TPS62679 25 TPS62671, TPS62672, TPS62674 TPS62675, TPS626751, TPS626765, TPS62679 SLVS952G – APRIL 2010 – REVISED JANUARY 2017 www.ti.com 11.2.2 1.26V CMOS Sensor Embedded Power Solution — Featuring Sub 0.4mm Profile VBAT 2.3 V .. 4.8 V TPS62674 CI 1 mF VIN SW MODE FB EN EXTCLK L GND VOUT 1.26 V @ 500 mA 1.5 mH CO 2.2 mF L = muRata LQM18PN1R5-B35 CI = muRata GRM153R60J105M CO = muRata GRM153R60G225M Figure 50. 1.26V CMOS Sensor Embedded Power Solution — Featuring Sub 0.4mm Profile 11.2.2.1 Design Requirements A CMOS sensor power supply providing a voltage of 1.26V is needed. The profile height mustn't exceed 0.4mm and the device is enabled/switched off by external clock signal. 11.2.2.2 Detailed Design Procedure See previous Detailed Design Procedure. To provide 1.26V, the TPS62674 or TPS62679 can be used. The inductor can be chosen from Table 1, selecting low profile device. Startup and shut down sequence with external clock are shown below. 11.2.2.3 Application Curves VI = 3.6 V, VO = 1.26 V, IO = 0 mA TPS62679 VI = 3.6 V, VO = 1.26 V, IO = 0 mA L = TY CKP1608S1R0, CO = TY AMK105BJ225MP L = TY CKP1608S1R0, CO = TY AMK105BJ225MP MODE = Low Figure 51. Start-Up (RF Clock) MODE = Low Figure 52. Shut-Down (RF Clock) 12 Power Supply Recommendations The power supply of TPS6267X devices needs to have appropriate current rating to support input and output voltage range for the maximum load current. 26 Submit Documentation Feedback Copyright © 2010–2017, Texas Instruments Incorporated Product Folder Links: TPS62671 TPS62672 TPS62674 TPS62675 TPS626751 TPS626765 TPS62679 TPS62671, TPS62672, TPS62674 TPS62675, TPS626751, TPS626765, TPS62679 www.ti.com SLVS952G – APRIL 2010 – REVISED JANUARY 2017 13 Layout 13.1 Layout Guidelines As for all switching power supplies, the layout is an important step in the design. High-speed operation of the TPS6267x devices demand careful attention to PCB layout. Care must be taken in board layout to get the specified performance. If the layout is not carefully done, the regulator could show poor line and/or load regulation, stability and switching frequency issues as well as EMI problems. It is critical to provide a low inductance, impedance ground path. Therefore, use wide and short traces for the main current paths. The ground pins of the dc/dc converter must be strongly connected to the PCB ground (i.e. reference potential across the system). These ground pins serve as the return path for both the control circuitry and the synchronous rectifier. Furthermore, due to its high frequency switching circuitry, it is imperative for the input capacitor to be as close to the SMPS device as possible, and that there is an unbroken ground plane under the TPS6267x and its external passives. Additionally, minimizing the area between the SW pin trace and inductor will limit high frequency radiated energy. The feed-back line should be routed away from noisy components and traces (e.g. SW line). The output capacitor carries the inductor ripple current. While not as critical as the input capacitor, an unbroken ground connection from this capacitor’s ground return to the inductor, input capacitor and SMPS device will reduce the output voltage ripple and it’s associated ESL step. This is a critical aspect to achieve best loop and frequency stability. High frequency currents tend to find their way on the ground plane along a mirror path directly beneath the incident path on the top of the board. If there are slits or cuts in the ground plane due to other traces on that layer, the current will be forced to go around the slits. If high frequency currents are not allowed to flow back through their natural least-area path, excessive voltage will build up and radiated emissions will occur. There should be a group of vias in the surrounding of the dc/dc converter leading directly down to an internal ground plane. To minimize parasitic inductance, the ground plane should be as close as possible to the top plane of the PCB (i.e. onto which the components are located). 13.2 Layout Example MODE CI L VIN ENABLE CO GND VOUT Figure 53. Suggested Layout (Top) Copyright © 2010–2017, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: TPS62671 TPS62672 TPS62674 TPS62675 TPS626751 TPS626765 TPS62679 27 TPS62671, TPS62672, TPS62674 TPS62675, TPS626751, TPS626765, TPS62679 SLVS952G – APRIL 2010 – REVISED JANUARY 2017 www.ti.com 14 Device and Documentation Support 14.1 Device Support 14.1.1 Third-Party Products Disclaimer TI'S PUBLICATION OF INFORMATION REGARDING THIRD-PARTY PRODUCTS OR SERVICES DOES NOT CONSTITUTE AN ENDORSEMENT REGARDING THE SUITABILITY OF SUCH PRODUCTS OR SERVICES OR A WARRANTY, REPRESENTATION OR ENDORSEMENT OF SUCH PRODUCTS OR SERVICES, EITHER ALONE OR IN COMBINATION WITH ANY TI PRODUCT OR SERVICE. 14.2 Documentation Support 14.2.1 Related Documentation 14.2.1.1 References "EMI Reduction in Switched Power Converters Using Frequency Modulation Techniques", in IEEE TRANSACTIONS ON ELECTROMAGNETIC COMPATIBILITY, VOL. 4, NO. 3, AUGUST 2005, pp 569-576 by Josep Balcells, Alfonso Santolaria, Antonio Orlandi, David González, Javier Gago. 14.3 Related Links The table below lists quick access links. Categories include technical documents, support and community resources, tools and software, and quick access to sample or buy. Table 2. Related Links PARTS PRODUCT FOLDER ORDER NOW TECHNICAL DOCUMENTS TOOLS & SOFTWARE SUPPORT & COMMUNITY TPS62671 Click here Click here Click here Click here Click here TPS62672 Click here Click here Click here Click here Click here TPS62674 Click here Click here Click here Click here Click here TPS62675 Click here Click here Click here Click here Click here TPS626751 Click here Click here Click here Click here Click here TPS626765 Click here Click here Click here Click here Click here TPS62679 Click here Click here Click here Click here Click here 14.4 Trademarks NanoFree is a trademark of Texas Instruments. Bluetooth is a trademark of Bluetooth SIG, Inc. 14.5 Electrostatic Discharge Caution These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates. 14.6 Glossary SLYZ022 — TI Glossary. This glossary lists and explains terms, acronyms, and definitions. 28 Submit Documentation Feedback Copyright © 2010–2017, Texas Instruments Incorporated Product Folder Links: TPS62671 TPS62672 TPS62674 TPS62675 TPS626751 TPS626765 TPS62679 TPS62671, TPS62672, TPS62674 TPS62675, TPS626751, TPS626765, TPS62679 www.ti.com SLVS952G – APRIL 2010 – REVISED JANUARY 2017 15 Mechanical, Packaging, and Orderable Information The following pages include mechanical, packaging, and orderable information. This information is the most current data available for the designated devices. This data is subject to change without notice and revision of this document. For browser-based versions of this data sheet, refer to the left-hand navigation. Copyright © 2010–2017, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: TPS62671 TPS62672 TPS62674 TPS62675 TPS626751 TPS626765 TPS62679 29 PACKAGE OPTION ADDENDUM www.ti.com 11-Jan-2022 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan (2) Lead finish/ Ball material MSL Peak Temp Op Temp (°C) Device Marking (3) (4/5) (6) TPS62671YFDR ACTIVE DSBGA YFD 6 3000 RoHS & Green SNAGCU Level-1-260C-UNLIM -40 to 85 NZ TPS62671YFDT ACTIVE DSBGA YFD 6 250 RoHS & Green SNAGCU Level-1-260C-UNLIM -40 to 85 NZ TPS62672YFDR ACTIVE DSBGA YFD 6 3000 RoHS & Green SNAGCU Level-1-260C-UNLIM -40 to 85 1BCS TPS62672YFDT ACTIVE DSBGA YFD 6 250 RoHS & Green SNAGCU Level-1-260C-UNLIM -40 to 85 1BCS TPS62674YFDR ACTIVE DSBGA YFD 6 3000 RoHS & Green SNAGCU Level-1-260C-UNLIM -40 to 85 PN TPS62674YFDT ACTIVE DSBGA YFD 6 250 RoHS & Green SNAGCU Level-1-260C-UNLIM -40 to 85 PN TPS626751YFDR ACTIVE DSBGA YFD 6 3000 RoHS & Green SNAGCU Level-1-260C-UNLIM -40 to 85 E3 TPS626751YFDT ACTIVE DSBGA YFD 6 250 RoHS & Green SNAGCU Level-1-260C-UNLIM -40 to 85 E3 TPS62675YFDR ACTIVE DSBGA YFD 6 3000 RoHS & Green SNAGCU Level-1-260C-UNLIM -40 to 85 OB TPS62675YFDT ACTIVE DSBGA YFD 6 250 RoHS & Green SNAGCU Level-1-260C-UNLIM -40 to 85 OB TPS626765YFDR ACTIVE DSBGA YFD 6 3000 RoHS & Green SNAGCU Level-1-260C-UNLIM -40 to 85 EH TPS626765YFDT ACTIVE DSBGA YFD 6 250 RoHS & Green SNAGCU Level-1-260C-UNLIM -40 to 85 EH TPS62679ZYFMR ACTIVE DSLGA YFM 6 3000 RoHS & Green CUNIPD Level-1-260C-UNLIM -40 to 85 TPS62679ZYFMT ACTIVE DSLGA YFM 6 250 RoHS & Green CUNIPD Level-1-260C-UNLIM -40 to 85 (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may reference these types of products as "Pb-Free". Addendum-Page 1 Samples PACKAGE OPTION ADDENDUM www.ti.com 11-Jan-2022 RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption. Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of