TPS62736RGYR

Product Folder Sample & Buy Support & Community Tools & Software Technical Documents TPS62736, TPS62737 SLVSBO4C – OCTOBER 2012 – REVISED DECEMBER 2014 TPS6273x Programmable Output Voltage Ultra-Low Power Buck Converter With Up to 50 mA / 200 mA Output Current 1 Features 3 • The TPS6273x family provides a highly integrated ultra low power buck converter solution that is well suited for meeting the special needs of ultra-low power applications such as energy harvesting. The TPS6273x provides the system with an externally programmable regulated supply to preserve the overall efficiency of the power-management stage compared to a linear step-down converter. This regulator is intended to step-down the voltage from an energy storage element such as a battery or super capacitor to supply the rail to low-voltage electronics. The regulated output has been optimized to provide high efficiency across low-output currents ( 4.6 V -> 4.6 V from bench power supply R(OUT) = 9 Ω Figure 57. Line Transient Response V(IN) = 4.0 V bench supply + additional C(IN) = 100 uF VOUT resistors modified to provide 2.5 V I(OUT) = 200 mA every 1 us Figure 58. IR Pulse Transient Response Copyright © 2012–2014, Texas Instruments Incorporated Product Folder Links: TPS62736 TPS62737 Submit Documentation Feedback 23 TPS62736, TPS62737 www.ti.com EN1 2 V/div 2 V/div SLVSBO4C – OCTOBER 2012 – REVISED DECEMBER 2014 VOUT VIN-OK 1 V/div VIN-OK 2 V/div 1 V/div 1 V/div 1 V/div VIN VOUT VSW 10 s/div 20 ms/div V(IN) = power amplifier ramped from 0 V to 5 V to 0 V EN1 = low; EN2 = high V(IN) = 3.6 V bench power supply EN2 = high; EN1 transitioned from high to low R(OUT) = 1 kΩ Figure 60. Ship-Mode Startup Behavior EN2 VIN-OK VOUT VSW 2 V/div 1 V/div 2 V/div 2 V/div Figure 59. Startup Behavior with Slow Ramping VIN 200 μs/div V(IN) = 3.6 V bench power supply EN1 = low; EN2 transitioned from low to high R(OUT) = 1 kΩ Figure 61. Standby-Mode Startup Behavior 24 Submit Documentation Feedback Copyright © 2012–2014, Texas Instruments Incorporated Product Folder Links: TPS62736 TPS62737 TPS62736, TPS62737 www.ti.com SLVSBO4C – OCTOBER 2012 – REVISED DECEMBER 2014 10.2.2 TPS62736 4-Resistor Typical Application Circuit TPS62736 IN VIN CIN1 CIN2 4.7PF 0.1PF SW L 10 PH System Load OUT 22PF Buck Controller GPIO1 VIN_OK GPIO2 EN1 GPIO2 EN2 COUT VSS Host VRDIV R3 VOUT_SET R2 R4 VIN_OK_SET Nano-Power Management R1 Figure 62. TPS62736 4-Resistor Typical Application Circuit 10.2.2.1 Design Requirements A 2.5-V, up to 50-mA regulated power rail is needed. The VIN_OK comparator should indicate when the input voltage drops below 2.9 V. No large load transients are expected. 10.2.2.2 Detailed Design Procedure The recommended 10-µH inductor (TOKO DFE252012C) and 4.7-µF input capacitor are used. Since no large load transients are expected, the minimum 22-µF output capacitor is used. Had a large load transient been expected, we would have sized the capacitor using ITRAN = COUT x ΔVOUT / ΔTIME where ΔVOUT is amount of VOUT droop allowed for the time of the transient. First set RSUM = R1 + R2 = R3 + R4 = 13 MΩ then solve Equation 4 for R1 = VBIAS x RSUM / VIN_OK = 1.21 V x 13 MΩ / 2.9 V = 5.42 MΩ → 5.36 MΩ as the closest 1 % resistor. Then R2 = RSUM - R1 = 13 MΩ - 5.42 MΩ = 7.58 MΩ → 7.5 MΩ as the closest 1% resistor. Solve Equation 3 for R4 = VBIAS x RSUM / VOUT = 1.21 V x 13 MΩ / 2.5 V = 6.29 MΩ → 6.34 MΩ as the closest 1% resistor. Finally R3 = RSUM - R3 = 13 MΩ - 6.29 MΩ = 6.71 MΩ → 6.81 MΩ as the closest 1% resistor. These values yield VOUT = 2.51 V and VIN_OK threshold = 2.90 V. If using 3 resistors, see Resistor Selection for guidance on sizing the resistors. 10.2.2.3 Application Curves See efficiency, load regulation and line regulation graphs at Figure 1, Figure 7 and Figure 8 respectively. Copyright © 2012–2014, Texas Instruments Incorporated Product Folder Links: TPS62736 TPS62737 Submit Documentation Feedback 25 TPS62736, TPS62737 SLVSBO4C – OCTOBER 2012 – REVISED DECEMBER 2014 www.ti.com 2 V/div 10 mV/div 100 mA/div VOUT-AC SW 10 Ps/div Figure 64. Steady State Operation 1 V/div IL 1 V/div 1 V/div VOUT-AC SW 4 Ps/div V(IN) = 3.0 V bench power supply VOUT resistors changed to provide 1.8 V; L = 4.7 uH R(OUT) = 100 kΩ 50 mA/div VOUT-AC 40 ms/div V(IN) = 3.0 V -> 5.0 V from bench power supply R(OUT) = 50 Ω Figure 67. Line Transient Response VOUT VRDIV Figure 66. Sampling Waveform 20 mV/div 2 V/div VIN VIN 2 ms/div V(IN) = 3.0 V bench power supply Figure 65. Steady State Operation 10 mV/div SW IL IOUT 50 mA/div 2 V/div 10 mV/div 100 mA/div Figure 63. Steady State Operation Submit Documentation Feedback VOUT-AC 2 Ps/div V(IN) = 3.0 V bench power supply R(OUT) = 100 kΩ V(IN) = 3.0 V bench power supply R(OUT) = 50 Ω 26 IL VOUT-AC SW 5 V/div 2 V/div 10 mV/div 50 mA/div IL 10 Ps/div V(IN) = 4.0 V from bench power supply + additional CIN = 100 uF R(OUT) = open - > 50 Ω Figure 68. Load Transient Response Copyright © 2012–2014, Texas Instruments Incorporated Product Folder Links: TPS62736 TPS62737 TPS62736, TPS62737 SLVSBO4C – OCTOBER 2012 – REVISED DECEMBER 2014 2 V/div 2 V/div 2 V/div 5 V/div 2 V/div 100 mA/div www.ti.com IOUT VOUT 2 V/div SW 4 Ps/div V(IN) = 4.0 V from bench power supply + additional CIN = 100 uF I(OUT) = 200 mA every 1us VIN_OK VOUT SW 20 ms/div V(IN) = 4.0 V from bench power supply VOUT resistors modified to provide 1.8 V EN2 = high, EN1 transitioned high to low Figure 69. IR Pulse Transient Response 2 V/div 2 V/div 2 V/div 5 V/div EN1 Figure 70. Ship-Mode Startup Behavior EN2 VIN_OK VOUT SW 400 Ps/div V(IN) = 4.0 V from bench power supply VOUT resistors modified to provide 1.8 V EN1 = low, EN2 transitioned low to high Figure 71. Standby-Mode Startup Behavior Copyright © 2012–2014, Texas Instruments Incorporated Product Folder Links: TPS62736 TPS62737 Submit Documentation Feedback 27 TPS62736, TPS62737 SLVSBO4C – OCTOBER 2012 – REVISED DECEMBER 2014 www.ti.com 11 Power Supply Recommendations The TPS62736 / 7 ICs require a low impedance power source (e.g. battery, wall adapter) capable of providng between 2.0 V and 5.5 V and up to 100 mA / 370 mA respectively. When the voltage at IN is less than or equal to VOUT, the IC stops switching, turns on the high side FET and provides VOUT = VIN - ILOAD x RDS(on)HighSideFET. 12 Layout 12.1 Layout Guidelines To minimize switching noise generation, the step-down converter (buck) power stage external components must be carefully placed. The most critical external component for a buck power stage is its input capacitor. The bulk input capacitor (CIN1) and high frequency decoupling capacitor (CIN2) must be placed as close as possible between the power stage input (IN pin 1) and ground (VSS pin 12). Next, the inductor (L1) must be placed as close as possible beween the switching node (SW pin 13) and the output voltage (OUT pin 11). Finally, the output capacitor (COUT) should be placed as close as possible between the output voltage (OUT pin 11) and GND (VSS pin 12). In the diagram below, the input and output capacitor grounds are connected to VSS pin 12 through vias to the bottom-layer ground plane of the PCB. To minimize noise pickup by the high impedance voltage setting nodes (VIN_OK_SET pin 8 and VOUT_SET pin 9), the external resistors (R1, R2 and R3) should be placed so that the traces connecting the midpoints of the string are as short as possible. In the diagram below, the connection to VOUT_SET is by a bottom layer trace. The remaining pins are either NC pins, that should be connected to the PowerPAD™ as shown below, or digital signals with minimal layout restrictions. In order to maximize efficiency at light load, the use of voltage level setting resistors > 1 MΩ is recommended. However, during board assembly, contaminants such as solder flux and even some board cleaning agents can leave residue that may form parasitic resistors across the physical resistors and/or from one end of a resistor to ground, especially in humid, fast airflow environments. This can result in the voltage regulation and threshold levels changing significantly from those expected per the installed resistor values. Therefore, it is highly recommended that no ground planes be poured near the voltage setting resistors. In addition, the boards must be carefully cleaned, possibly rotated at least once during cleaning, and then rinsed with de-ionized water until the ionic contamination of that water is well above 50 MΩ. If this is not feasible, then it is recommended that the sum of the voltage setting resistors be reduced to at least 5 times below the measured ionic contamination. 12.2 Layout Example VIAS to GND PLANE CIN1 VIAS to GND PLANE CIN1 VIAS to GND PLANE CIN2 CIN2 VIN VIN 1 1 COUT L1 VOUT R3 R2 R1 VIA to GND PLANE Figure 72. Recommended Layout, TPS62736 28 Submit Documentation Feedback COUT L1 VOUT R3 R2 R1 VIA to GND PLANE Figure 73. Recommended Layout, TPS62737 Copyright © 2012–2014, Texas Instruments Incorporated Product Folder Links: TPS62736 TPS62737 TPS62736, TPS62737 www.ti.com SLVSBO4C – OCTOBER 2012 – REVISED DECEMBER 2014 13 Device and Documentation Support 13.1 Device Support 13.1.1 Third-Party Products Disclaimer TI'S PUBLICATION OF INFORMATION REGARDING THIRD-PARTY PRODUCTS OR SERVICES DOES NOT CONSTITUTE AN ENDORSEMENT REGARDING THE SUITABILITY OF SUCH PRODUCTS OR SERVICES OR A WARRANTY, REPRESENTATION OR ENDORSEMENT OF SUCH PRODUCTS OR SERVICES, EITHER ALONE OR IN COMBINATION WITH ANY TI PRODUCT OR SERVICE. 13.2 Related Links The table below lists quick access links. Categories include technical documents, support and community resources, tools and software, and quick access to sample or buy. Table 5. Related Links PARTS PRODUCT FOLDER SAMPLE & BUY TECHNICAL DOCUMENTS TOOLS & SOFTWARE SUPPORT & COMMUNITY TPS62736 Click here Click here Click here Click here Click here TPS62737 Click here Click here Click here Click here Click here 13.3 Trademarks PowerPAD is a trademark of Texas Instruments. All other trademarks are the property of their respective owners. 13.4 Electrostatic Discharge Caution These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates. 13.5 Glossary SLYZ022 — TI Glossary. This glossary lists and explains terms, acronyms, and definitions. 14 Mechanical, Packaging, and Orderable Information The following pages include mechanical, packaging, and orderable information. This information is the most current data available for the designated devices. This data is subject to change without notice and revision of this document. For browser-based versions of this data sheet, refer to the left-hand navigation. Copyright © 2012–2014, Texas Instruments Incorporated Product Folder Links: TPS62736 TPS62737 Submit Documentation Feedback 29 PACKAGE OPTION ADDENDUM www.ti.com 10-Dec-2020 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan (2) Lead finish/ Ball material MSL Peak Temp Op Temp (°C) Device Marking (3) (4/5) (6) TPS62736RGYR ACTIVE VQFN RGY 14 3000 RoHS & Green NIPDAU Level-2-260C-1 YEAR -40 to 85 62736 TPS62736RGYT ACTIVE VQFN RGY 14 250 RoHS & Green NIPDAU Level-2-260C-1 YEAR -40 to 85 62736 TPS62737RGYR ACTIVE VQFN RGY 14 3000 RoHS & Green NIPDAU Level-2-260C-1 YEAR -40 to 105 62737 TPS62737RGYT ACTIVE VQFN RGY 14 250 RoHS & Green NIPDAU Level-2-260C-1 YEAR -40 to 105 62737 (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may reference these types of products as "Pb-Free". RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption. Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of