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TPS63010, TPS63011, TPS63012
SLVS653C – JUNE 2008 – REVISED FEBRUARY 2016
TPS6301x Highly Efficient, Single Inductor Buck-Boost Converter With 2-A Switches
1 Features
3 Description
•
•
The TPS6301x devices provide a power supply
solution for products powered by either a two-cell or
three-cell alkaline, NiCd or NiMH battery, or a onecell Li-Ion or Li-polymer battery. Output currents can
go as high as 1200 mA while using a single-cell LiIon or Li-Polymer Battery, and discharge it down to
2.5 V or lower. The buck-boost converter is based on
a fixed-frequency, pulse-width-modulation (PWM)
controller using synchronous rectification to obtain
maximum efficiency. At low load currents, the
converter enters power save mode to maintain high
efficiency over a wide load current range. The power
save mode can be disabled, forcing the converter to
operate at a fixed switching frequency. The maximum
average current in the switches is limited to a typical
value of 2200 mA. The output voltage is
programmable using an external resistor divider, or is
fixed internally on the chip. The converter can be
disabled to minimize battery drain. During shutdown,
the load is disconnected from the battery. The device
is packaged in a 20-pin DSBGA package measuring
2.126 mm × 1.922 mm (YFF).
1
•
•
•
•
•
•
•
•
•
•
•
Up to 96% Efficiency
1200-mA Output Current at 3.3 V in Step-Down
Mode (VIN = 3.6 V to 5.5 V)
Up to 800-mA Output Current at 3.3 V in Boost
Mode (VIN > 2.4 V)
Automatic Transition Between Step-Down and
Boost Mode
Device Quiescent Current less than 50 μA
Input Voltage Range: 2 V to 5.5 V
Fixed and Adjustable Output Voltage Options from
1.2 V to 5.5 V
Power Save Mode for Improved Efficiency at LowOutput Power
Forced Fixed Frequency Operation and
Synchronization Possible
Load Disconnect During Shutdown
Output Overvoltage Protection
Overtemperature Protection
Available in Small 20-Pin, 2.126 mm × 1.922 mm,
DSBGA Package
Device Information(1)
PART NUMBER
PACKAGE
BODY SIZE (NOM)
2 Applications
TPS6301x
•
(1) For all available packages, see the orderable addendum at
the end of the data sheet.
•
•
•
•
•
All Two-Cell and Three-Cell Alkaline, NiCd or
NiMH, or Single-Cell Li
Battery-Powered Products
Portable Audio Players
PDAs
Cellular Phones
Personal Medical Products
White LEDs
DSBGA (20)
2.126 mm × 1.922 mm
Typical Application Circuit
L1
1.5 µH
L1
VIN
1.8 V to
5.5 V
L2
VIN
C1
10 µF
VOUT
VINA
EN
FB
C2
10 µF
VOUT
3.3 V
Up to
1200 mA
PS
VSEL
SYNC
GND
PGND
TPS63011
1
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.
TPS63010, TPS63011, TPS63012
SLVS653C – JUNE 2008 – REVISED FEBRUARY 2016
www.ti.com
Table of Contents
1
2
3
4
5
6
7
8
Features ..................................................................
Applications ...........................................................
Description .............................................................
Revision History.....................................................
Device Comparison Table.....................................
Pin Configuration and Functions .........................
Specifications.........................................................
1
1
1
2
3
3
4
7.1
7.2
7.3
7.4
7.5
7.6
7.7
4
4
4
4
5
6
7
Absolute Maximum Ratings ......................................
ESD Ratings..............................................................
Recommended Operating Conditions.......................
Thermal Information ..................................................
Electrical Characteristics...........................................
Dissipation Ratings ...................................................
Typical Characteristics ..............................................
Detailed Description ............................................ 11
8.1 Overview ................................................................. 11
8.2 Functional Block Diagrams ..................................... 11
8.3 Feature Description................................................. 12
8.4 Device Functional Modes........................................ 13
9
Application and Implementation ........................ 15
9.1 Application Information............................................ 15
9.2 Typical Application ................................................. 15
10 Power Supply Recommendations ..................... 19
11 Layout................................................................... 19
11.1 Layout Guidelines ................................................. 19
11.2 Layout Example .................................................... 19
11.3 Thermal Consideration.......................................... 20
12 Device and Documentation Support ................. 21
12.1
12.2
12.3
12.4
12.5
Related Links ........................................................
Community Resources..........................................
Trademarks ...........................................................
Electrostatic Discharge Caution ............................
Glossary ................................................................
21
21
21
21
21
13 Mechanical, Packaging, and Orderable
Information ........................................................... 21
13.1 Package Dimensions ............................................ 21
4 Revision History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
Changes from Revision B (May 2012) to Revision C
•
Page
Added ESD Ratings table, Feature Description section, Device Functional Modes, Application and Implementation
section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and
Mechanical, Packaging, and Orderable Information section. ................................................................................................. 1
Changes from Revision A (August 2009) to Revision B
•
Page
Changed the YFF Package Dimensions table ..................................................................................................................... 21
Changes from Original (June 2008) to Revision A
Page
•
Changed Title From: High Efficient... To: Highly Efficient... ................................................................................................... 1
•
Added Feature - Output Overvoltage Protection .................................................................................................................... 1
•
Added Output overvoltage protection to the CONTROL STAGE ELECTRICAL CHARACTERISTICS................................. 5
•
Added Overvoltage Protection section ................................................................................................................................. 13
•
Changed Sentence in the PROGRAMMING THE OUTPUT VOLTAGE section - From: As an example, if an output
voltage of 3.3 V is needed, a 1-MΩ resistor should be chosen for R1. To: As an example, if an output voltage of 3.3
V is needed, a 1-MΩ resistor should be chosen for R1 if R2 is 180-kΩ .............................................................................. 16
•
Added Figure - PCB Layout Suggestion .............................................................................................................................. 19
2
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Copyright © 2008–2016, Texas Instruments Incorporated
Product Folder Links: TPS63010 TPS63011 TPS63012
TPS63010, TPS63011, TPS63012
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SLVS653C – JUNE 2008 – REVISED FEBRUARY 2016
5 Device Comparison Table
Table 1. Available Output Voltage Options (1)
OUTPUT
OUTPUT
VOLTAGE
VOLTAGE
DC/DC at VSEL DC/DC at VSEL
=1
=0
TA
–40°C to 85°C
(1)
(2)
PACKAGE
MARKING
Adjustable
Adjustable
TPS63010
3.3 V
2.8 V
TPS63011
3.4 V
2.9 V
TPS63012
PACKAGE
PART NUMBER (2)
TPS63010YFF
20-Pin WCSP
TPS63011YFF
TPS63012YFF
Contact the factory to check availability of other fixed output voltage versions.
The YFF package is available taped and reeled. Add R suffix to device type (for example, TPS63010YFFR) to order quantities of 3000
devices per reel. Add T suffix to device type (for example, TPS63010YFFT) to order quantities of 250 devices per reel.
6 Pin Configuration and Functions
YFF Package
20-Pin DSBGA
Top View
A4
B4
C4
D4
E4
A3
B3
C3
D3
E3
A2
B2
C2
D2
E2
A1
B1
C1
D1
E1
Pin Functions
PIN
I/O
DESCRIPTION
NAME
NO.
EN
A4
I
Enable input. (1 enabled, 0 disabled)
FB
E3
I
Voltage feedback of adjustable versions, must be connected to VOUT at fixed output voltage
versions
GND
C3, D3, E4
—
Control and logic ground
L1
B1,B2
I
Connection for Inductor
L2
D1,D2
I
Connection for Inductor
PGND
C1,C2
—
PS
C4
I
Enable and disable power save mode (1 disabled, 0 enabled)
SYNC
B4
I
Clock signal for synchronization, should be connected to GND if not used
VIN
Power ground
A1, A2
I
Supply voltage for power stage
VINA
A3
I
Supply voltage for control stage
VINA1
B3
O
Output of the 100 Ω for designing the VINA filter
VOUT
E1,E2
O
Buck-boost converter output
VSEL
D4
I
Output voltage select for fixed output voltage options (1 programs higher output voltage
option, 0 programs lower output voltage option), must be connected to a defined logic signal
at adjustable output voltage option.
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SLVS653C – JUNE 2008 – REVISED FEBRUARY 2016
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7 Specifications
7.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted) (1)
MIN
MAX
UNIT
VI
Input voltage on VIN, VINA, VINA1, L1, L2, VOUT, PS, SYNC, VSEL,
EN, FB
–0.3
7
V
TJ
Operating junction temperature
–40
150
°C
Tstg
Storage temperature
–65
150
°C
(1)
Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating
Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
7.2 ESD Ratings
VALUE
Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001 (1) (2)
V(ESD)
Electrostatic discharge
Charged-device model (CDM), per JEDEC specification JESD22-C101 (3) (2)
Machine model (MM)
(1)
(2)
(3)
UNIT
±2500
±150
(2)
V
±1000
JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
ESD testing is performed according to the respective JESD22 JEDEC standard.
JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
7.3 Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted)
Supply voltage at VIN, VINA
MIN
MAX
UNIT
2
5.5
V
Operating free air temperature, TA
–40
85
°C
Operating junction temperature, TJ
–40
125
°C
7.4 Thermal Information
TPS6301x
THERMAL METRIC (1)
YFF (DSBGA)
UNIT
20 PINS
RθJA
Junction-to-ambient thermal resistance
71.1
°C/W
RθJC(top)
Junction-to-case (top) thermal resistance
0.5
°C/W
RθJB
Junction-to-board thermal resistance
11.4
°C/W
ψJT
Junction-to-top characterization parameter
2
°C/W
ψJB
Junction-to-board characterization parameter
11.3
°C/W
RθJC(bot)
Junction-to-case (bottom) thermal resistance
N/A
°C/W
(1)
4
For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report, SPRA953.
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SLVS653C – JUNE 2008 – REVISED FEBRUARY 2016
7.5 Electrical Characteristics
over recommended free-air temperature range and over recommended input voltage range (typical at an ambient temperature
range of 25°C) (unless otherwise noted)
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
DC-DC STAGE
VI
Input voltage range
2
5.5
V
VI
Input voltage range for start-up
2.1
5.5
V
VO
TPS63010 output voltage range
1.2
5.5
VFB
TPS63010 feedback voltage
VFB
TPS63010 feedback voltage
f
ISW
0°C ≤ TA ≤ 60°C
492.5
500
489
TPS63011 output voltage
VSEL = LOW, 0°C ≤ TA ≤ 60°C
2.758
TPS63011 output voltage
VSEL = LOW
TPS63011 output voltage
TPS63011 output voltage
mV
500
507
mV
2.8
2.842
V
2.75
2.8
2.85
V
VSEL = HIGH, 0°C ≤ TA ≤ 60°C
3.251
3.3
3.35
V
VSEL = HIGH
3.241
3.3
3.359
V
TPS63012 output voltage
VSEL = LOW, 0°C ≤ TA ≤ 60°C
2.857
2.9
2.944
V
TPS63012 output voltage
VSEL = LOW
2.848
2.9
2.952
V
TPS63012 output voltage
VSEL = HIGH, 0°C ≤ TA ≤ 60°C
3.349
3.4
3.451
V
TPS63012 output voltage
VSEL = HIGH
3.339
3.4
3.461
V
Oscillator frequency
2200
2400
2600
kHz
Frequency range for
synchronization
2200
3000
kHz
2400
mA
Switch current limit
VIN = VINA = 3.6 V, TA = 25°C
2000
High side switch on resistance
VIN = VINA = 3.6 V
100
mΩ
Low side switch on resistance
VIN = VINA = 3.6 V
100
mΩ
Maximum line regulation
PS = HIGH
0.5%
Maximum load regulation
PS = HIGH
0.5%
VIN
VINA
Iq
Quiescent current VOUT
(adjustable
output voltage
version)
Shutdown current
VIN
1
2
μA
40
50
μA
4
6
μA
1
VEN = 0 V, VIN = VINA = 3.6 V
PS, SYNC, VSEL clamped on GND or VINA
VINA
2200
IO = 0 mA, VEN = VIN = VINA = 3.6 V,
VOUT = 3.3 V
FB input impedance (fixed output
voltage versions)
IS
V
503.5
MΩ
0.1
1
μA
0.1
1.5
μA
1.7
1.8
V
0.4
V
CONTROL STAGE
UVLO
Undervoltage lockout threshold
VIL
EN, PS, SYNC, VSEL input low
voltage
VIH
EN, PS, SYNC, VSEL input high
voltage
EN, PS, SYNC, VSEL input
current
VINA voltage decreasing
1.5
1.2
Clamped on GND or VINA
V
0.01
0.1
μA
Output overvoltage protection
6.5
V
Overtemperature protection
140
°C
Overtemperature hysteresis
20
°C
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SLVS653C – JUNE 2008 – REVISED FEBRUARY 2016
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7.6 Dissipation Ratings
(1)
6
PACKAGE (1)
THERMAL RESISTANCE
RθJA
POWER RATING
TA ≤ 25°C
DERATING FACTOR ABOVE
TA = 25°C
YFF
84 °C/W
1190 mW
12 mW/°C
For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI
website at www.ti.com.
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SLVS653C – JUNE 2008 – REVISED FEBRUARY 2016
7.7 Typical Characteristics
2500
2250
VO = 2.5 V
IO − Maximum Output Current − mA
IO − Maximum Output Current − mA
2250
2500
2000
1750
1500
1250
VO = 4.5 V
1000
750
500
250
0
2.0
2.5
3.0
3.5
4.0
4.5
5.0
1000
750
500
3.0
3.5
4.0
4.5
5.0
VI − Input Voltage − V
5.5
G002
Figure 2. Maximum Output Current vs Input Voltage
(TPS63011)
90
VO = 2.9 V
80
1750
70
η − Efficiency − %
2000
1500
VO = 3.4 V
1250
1000
VI = 2.4 V, VO = 2.5 V
50
500
20
250
10
3.0
3.5
4.0
4.5
5.0
VI − Input Voltage − V
0
0.1
5.5
VI = 3.6 V, VO = 4.5 V
40
30
2.5
VI = 3.6 V, VO = 2.5 V
60
750
VI = 2.4 V, VO = 4.5 V
Power-Save Mode Enabled
1
10
100
1k
IO − Output Current − mA
G003
Figure 3. Maximum Output Current vs Input Voltage
(TPS63012)
10k
G004
Figure 4. Efficiency vs Output Current (TPS63010)
100
100
VI = 2.4 V, VO = 2.5 V
90
80
70
70
η − Efficiency − %
80
60
50
VI = 3.6 V,
VO = 4.5 V
40
VI = 2.4 V,
VO = 4.5 V
30
VI = 3.6 V, VO = 2.8 V
60
VI = 2.4 V, VO = 2.8 V
50
40
VI = 2.4 V, VO = 3.3 V
VI = 3.6 V, VO = 3.3 V
30
VI = 3.6 V, VO = 2.5 V
20
10
0
0.1
2.5
100
2250
90
VO = 3.3 V
1250
G001
2500
IO − Maximum Output Current − mA
1500
0
2.0
5.5
Figure 1. Maximum Output Current vs Input Voltage
(TPS63010)
η − Efficiency − %
1750
250
VI − Input Voltage − V
0
2.0
VO = 2.8 V
2000
20
10
Power-Save Mode Disabled
1
10
100
1k
IO − Output Current − mA
10k
G005
Figure 5. Efficiency vs Output Current (TPS63010)
0
0.1
Power-Save Mode Enabled
1
10
100
IO − Output Current − mA
1k
10k
G006
Figure 6. Efficiency vs Output Current (TPS63011)
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Typical Characteristics (continued)
100
90
100
90
VI = 2.4 V, VO = 2.8 V
80
80
70
VI = 3.6 V, VO = 3.3 V
η − Efficiency − %
η − Efficiency − %
70
60
50
VI = 3.6 V, VO = 2.8 V
40
30
10
1
10
100
1k
10
100
1k
10k
G008
Figure 8. Efficiency vs Output Current (TPS63012)
100
90
VI = 2.4 V, VO = 2.9 V
80
70
70
VI = 2.4 V, VO = 3.4 V
η − Efficiency − %
η − Efficiency − %
1
IO − Output Current − mA
80
60
50
VI = 3.6 V, VO = 2.9 V
40
30
IO = 1000 mA
IO = 100 mA
60
50
IO = 500 mA
IO = 10 mA
40
30
VI = 3.6 V, VO = 3.4 V
20
20
10
10
Power-Save Mode Disabled
0
0.1
1
10
100
1k
0
2.0
10k
IO − Output Current − mA
3.0
90
90
80
80
η − Efficiency − %
IO = 500 mA
50
40
30
4.0
IO = 500 mA
70
IO = 1000 mA
IO = 100 mA
3.5
4.5
5.0
5.5
G010
Figure 10. Efficiency vs Input Voltage (TPS63010)
100
IO = 10 mA
2.5
VI − Input Voltage − V
100
70
VO = 2.5 V
Power-Save Mode Enabled
G009
Figure 9. Efficiency vs Output Current (TPS63012)
IO = 100 mA
IO = 1000 mA
60
50
40
IO = 10 mA
30
20
0
2.0
Power-Save Mode Enabled
G007
100
10
VI = 3.6 V, VO = 3.4 V
0
0.1
Figure 7. Efficiency vs Output Current (TPS63011)
η − Efficiency − %
40
VI = 2.4 V, VO = 3.4 V
10
10k
IO − Output Current − mA
60
VI = 2.4 V, VO = 2.9 V
50
20
Power-Save Mode Disabled
0
0.1
20
VO = 4.5 V
Power-Save Mode Enabled
2.5
3.0
3.5
4.0
10
4.5
VI − Input Voltage − V
5.0
5.5
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0
2.0
VO = 2.5 V
Power-Save Mode Disabled
2.5
3.0
3.5
4.0
4.5
VI − Input Voltage − V
G011
Figure 11. Efficiency vs Input Voltage (TPS63010)
8
60
30
VI = 2.4 V, VO = 3.3 V
20
90
VI = 3.6 V, VO = 2.9 V
5.0
5.5
G012
Figure 12. Efficiency vs Input Voltage (TPS63010)
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SLVS653C – JUNE 2008 – REVISED FEBRUARY 2016
Typical Characteristics (continued)
100
100
90
90
80
IO = 500 mA
70
IO = 1000 mA
η − Efficiency − %
η − Efficiency − %
70
80
IO = 100 mA
60
50
40
IO = 10 mA
30
0
2.0
2.5
3.0
3.5
4.0
4.5
5.0
0
2.0
5.5
90
80
80
70
η − Efficiency − %
IO = 1000 mA
60
IO = 500 mA
40
30
0
2.0
5.0
5.5
G014
IO = 100 mA
IO = 500 mA
IO = 1000 mA
50
40
2.5
3.0
3.5
4.0
4.5
5.0
0
2.0
5.5
IO = 10 mA
VO = 3.3 V
Power-Save Mode Disabled
2.5
3.0
3.5
4.0
4.5
5.0
VI − Input Voltage − V
G015
5.5
G016
Figure 16. Efficiency vs Input Voltage (TPS63011)
100
100
90
90
80
80
IO = 100 mA
70
η − Efficiency − %
IO = 500 mA
70
IO = 1000 mA
60
50
IO = 10 mA
30
IO = 1000 mA
IO = 100 mA
60
IO = 10 mA
IO = 500 mA
50
40
30
20
0
2.0
4.5
60
10
Figure 15. Efficiency vs Input Voltage (TPS63011)
10
4.0
20
VO = 2.8 V
Power-Save Mode Enabled
VI − Input Voltage − V
40
3.5
30
20
10
3.0
Figure 14. Efficiency vs Input Voltage (TPS63011)
90
IO = 10 mA
2.5
VI − Input Voltage − V
100
IO = 100 mA
VO = 3.3 V
Power-Save Mode Enabled
G013
100
70
η − Efficiency − %
40
10
Figure 13. Efficiency vs Input Voltage (TPS63010)
50
IO = 500 mA
20
VO = 4.5 V
Power-Save Mode Disabled
VI − Input Voltage − V
η − Efficiency − %
IO = 10 mA
50
30
20
10
IO = 1000 mA
IO = 100 mA
60
20
VO = 2.8 V
Power-Save Mode Disabled
2.5
3.0
3.5
4.0
10
4.5
VI − Input Voltage − V
5.0
5.5
0
2.0
VO = 3.4 V
Power-Save Mode Enabled
2.5
3.0
Figure 17. Efficiency vs Input Voltage (TPS63011)
3.5
4.0
4.5
VI − Input Voltage − V
G017
5.0
5.5
G018
Figure 18. Efficiency vs Input Voltage (TPS63012)
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Typical Characteristics (continued)
100
100
90
90
80
80
60
IO = 100 mA
IO = 10 mA
IO = 500 mA
50
40
50
IO = 10 mA
40
30
20
0
2.0
IO = 100 mA
IO = 1000 mA
60
30
10
IO = 500 mA
70
IO = 1000 mA
η − Efficiency − %
η − Efficiency − %
70
20
VO = 2.9 V
Power-Save Mode Enabled
2.5
3.0
3.5
4.0
10
4.5
5.0
VI − Input Voltage − V
0
2.0
5.5
VO = 3.4 V
Power-Save Mode Disabled
2.5
3.0
3.5
4.0
4.5
VI − Input Voltage − V
G019
Figure 19. Efficiency vs Input Voltage (TPS63012)
5.0
5.5
G020
Figure 20. Efficiency vs Input Voltage (TPS63012)
100
90
80
η − Efficiency − %
IO = 100 mA
IO = 500 mA
70
IO = 1000 mA
60
50
IO = 10 mA
40
30
20
10
0
2.0
VO = 2.9 V
Power-Save Mode Disabled
2.5
3.0
3.5
4.0
4.5
VI − Input Voltage − V
5.0
5.5
G021
Figure 21. Efficiency vs Input Voltage (TPS63012)
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8 Detailed Description
8.1 Overview
The TPS6301x uses 4 internal N-channel MOSFETs to maintain synchronous power conversion at all possible
operating conditions. This enables the device to keep high efficiency over the complete input voltage and output
power range. To regulate the output voltage at all possible input voltage conditions, the device automatically
switches from buck operation to boost operation and back as required by the configuration. It always uses one
active switch, one rectifying switch, one switch is held on, and one switch held off. Therefore, it operates as a
buck converter when the input voltage is higher than the output voltage, and as a boost converter when the input
voltage is lower than the output voltage. There is no mode of operation in which all 4 switches are switching at
the same time. Keeping one switch on and one switch off eliminates their switching losses. The RMS current
through the switches and the inductor is kept at a minimum, to minimize switching and conduction losses.
Controlling the switches this way allows the converter to always keep higher efficiency. The device provides a
seamless transition from buck-to-boost or from boost-to-buck operation
The device provides a seamless transition from buck-to-boost or from boost-to-buck operation.
8.2 Functional Block Diagrams
L1
L2
VIN
VOUT
Current
Sensor
VINA1
VIN
VOUT
PGND PGND
Gate
Control
_
VINA
Modulator
PS
Oscillator
+
+
_
FB
VREF
SYNC
VSEL
+
−
Device
Control
EN
Temperature
Control
PGND
PGND
GND
Figure 22. Functional Block Diagram (TPS63010)
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Functional Block Diagrams (continued)
L1
L2
VIN
VOUT
Current
Sensor
VINA1
VIN
VOUT
PGND PGND
Gate
Control
FB
VSEL
_
VINA
Modulator
PS
Oscillator
SYNC
VSEL
+
+
−
VREF
Device
Control
EN
+
_
Temperature
Control
PGND
PGND
GND
Figure 23. Functional Block Diagram (TPS63011, TPS63012)
8.3 Feature Description
8.3.1 Output Voltage Selection
To program the output voltage at an adjustable device option, like the TPS63010, an external resistive feedback
divider connected to FB must be used. For the fixed output voltage versions, FB is used as an output voltage
sense and must be connected to the output voltage VOUT. All fixed output voltage versions have two different
output voltages programmed internally. They are selected by programming high or low at VSEL. The higher
output voltage is selected by programming VSEL high and the lower output voltage is selected by programming
VSEL low. VSEL also supports standard logic thresholds.
8.3.2 Soft-Start and Short-Circuit Protection
After being enabled, the device starts operating. The average current limit ramps up from an initial 400 mA
following the output voltage increasing. At an output voltage of about 1.2 V, the current limit is at its nominal
value. If the output voltage does not increase, the current limit will not increase. There is no timer implemented.
Thus, the output voltage overshoot at start-up, as well as the inrush current, is kept at a minimum. The device
ramps up the output voltage in a controlled manner even if a very large capacitor is connected at the output.
When the output voltage does not increase above 1.2 V, the device assumes a short-circuit at the output, and
keeps the current limit low to protect itself and the application. At a short at the output during operation, the
current limit is also decreased accordingly. At 0 V at the output, for example, the output current does not exceed
about 400 mA.
8.3.3 Undervoltage Lockout
If the supply voltage on VINA is lower than its approximate threshold (see Electrical Characteristics), an
undervoltage lockout function prevents device start-up. When in operation, the device automatically enters the
shutdown mode if the voltage on VINA drops below the undervoltage lockout threshold. The device automatically
restarts if the input voltage recovers to the minimum operating input voltage.
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Feature Description (continued)
8.3.4 Overvoltage Protection
If, for any reason, the output voltage is not fed back properly to the input of the voltage amplifier, control of the
output voltage will not work anymore. Therefore overvoltage protection is implemented to avoid the output
voltage exceeding critical values for the device and possibly for the system it is supplying. The implemented
overvoltage protection circuit monitors the output voltage internally as well. In case it reaches the overvoltage
threshold the voltage amplifier regulates the output voltage to this value.
8.3.5 Overtemperature Protection
The device has a built-in temperature sensor which monitors the internal IC temperature. If the temperature
exceeds the programmed threshold (see Electrical Characteristics), the device stops operating. As soon as the
IC temperature has decreased below the programmed threshold, it again starts operating. There is a built-in
hysteresis to avoid unstable operation at IC temperatures at the overtemperature threshold.
8.4 Device Functional Modes
8.4.1 Controller Circuit
The controlling circuit of the device is based on an average current mode topology. The average inductor current
is regulated by a fast-current regulator loop which is controlled by a voltage control loop. The controller also uses
input and output voltage feedforward. Changes of input and output voltage are monitored and immediately can
change the duty cycle in the modulator to achieve a fast response to those errors. The voltage error amplifier
gets its feedback input from the FB pin. At adjustable output voltages a resistive voltage divider must be
connected to that pin. At fixed output voltages FB must be connected to the output voltage to directly sense the
voltage. Fixed output voltage versions use a trimmed internal resistive divider. The feedback voltage will be
compared with the internal reference voltage to generate a stable and accurate output voltage.
The controller circuit also senses the average input current as well as the peak input current. With this, maximum
input power can be controlled as well as the maximum peak current to achieve a safe and stable operation under
all possible conditions. To protect the device from overheating, an internal temperature sensor is implemented.
8.4.2 Synchronous Operation
The device uses 4 internal N-channel MOSFETs to maintain synchronous power conversion at all possible
operating conditions. This enables the device to keep high efficiency over a wide input voltage and output power
range.
To avoid ground shift problems due to the high currents in the switches, two separate ground pins GND and
PGND are used. The reference for all control functions is the GND pin. The power switches are connected to
PGND. Both grounds must be connected on the PCB at only one point ideally close to the GND pin. Due to the
4-switch topology, the load is always disconnected from the input during shutdown of the converter.
8.4.3 Buck-Boost Operation
To be able to regulate the output voltage properly at all possible input voltage conditions, the device
automatically switches from step-down operation to boost operation and back as required by the configuration. It
always uses one active switch, one rectifying switch, one switch permanently on, and one switch permanently off.
Therefore, it operates as a step-down converter (buck) when the input voltage is higher than the output voltage,
and as a boost converter when the input voltage is lower than the output voltage. There is no mode of operation
in which all 4 switches are permanently switching. Controlling the switches this way allows the converter to
maintain high efficiency at the most important point of operation; when input voltage is close to the output
voltage. The RMS current through the switches and the inductor is kept at a minimum, to minimize switching and
conduction losses. Switching losses are also kept low by using only one active and one passive switch.
Regarding the remaining 2 switches, one is kept permanently on and the other is kept permanently off, thus
causing no switching losses.
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Device Functional Modes (continued)
8.4.4 Power Save Mode
The PS pin can be used to select different operation modes. To enable power save, PS must be set low. Power
save mode is used to improve efficiency at light load. If power save mode is enabled, the converter stops
operating if the average inductor current gets lower than about 300 mA and the output voltage is at or above its
nominal value. If the output voltage decreases below its nominal value, the device ramps up the output voltage
again by starting operation using a programmed average inductor current higher than required by the current
load condition. Operation can last for one or several pulses. The converter again stops operating once the
conditions for stopping operation are met again.
The power save mode can be disabled by programming high at PS. The PS input supports standard logic
threshold voltages. If the device is synchronized to an external clock connected to SYNC, power save mode is
disabled.
8.4.5 Synchronization
Connecting a clock signal at SYNC forces the device to synchronize to the connected clock frequency.
Synchronization is done by a PLL, so synchronizing to lower and higher frequencies compared to the internal
clock works without any issues. The PLL can also tolerate missing clock pulses without the converter
malfunctioning. The SYNC input supports standard logic thresholds. If synchronization is not used SYNC must
be tied low or connected to GND. Applying a clock signal to SYNC automatically disables the power save mode.
8.4.6 Device Enable
The device is put into operation when EN is set high. It is put into a shutdown mode when EN is set to GND. In
shutdown mode, the regulator stops switching, all internal control circuitry is switched off, and the load is
disconnected from the input. This also means that the output voltage can drop below the input voltage during
shutdown. During start-up of the converter, the duty cycle and the peak current are limited in order to avoid high
peak currents flowing from the input.
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9 Application and Implementation
NOTE
Information in the following applications sections is not part of the TI component
specification, and TI does not warrant its accuracy or completeness. TI’s customers are
responsible for determining suitability of components for their purposes. Customers should
validate and test their design implementation to confirm system functionality.
9.1 Application Information
The TPS6301x are high-efficiency, low-quiescent current buck-boost converters suitable for application where the
input voltage is higher, lower or equal to the output. Output currents can go as high as 1 A in boost mode and as
high as 2 A in buck mode. The maximum average current in the switches is limited to a typical value of 2 A.
9.2 Typical Application
L1
L2
L1
VOUT
VIN
VIN
VOUT
R1
VINA1
C1
C3
VINA
C2
FB
R2
EN
PS
VSEL
SYNC
GND
PGND
TPS6301X
Figure 24. Adjustable Version
9.2.1 Design Requirements
The design guideline provides a component selection to operate the device within the recommended operating
conditions. Table 2 lists the components for the Application Curves section.
Table 2. Components for Application Characteristic Curves
REFERENCE
DESCRIPTION
MANUFACTURER
TPS6301 0 / 1 / 2
Texas Instruments
L1
LPS3015-222
Coilcraft
C1
GRM188R60J106M (10 μF 6.3 V, 0603)
Murata
C2
2 × GRM188R60J106M (10 μF 6.3 V, 0603)
Murata
C3
0.1 μF, X7R ceramic
R1, R2
Depending on the output voltage at TPS63010, not
used at TPS6301 1 / 2 (R1 shorted)
9.2.2 Detailed Design Procedure
The TPS6301x DC-DC converters are intended for systems powered by one-cell Li-Ion or Li-Polymer battery with
a typical voltage from 2.3 V to 4.5 V. They can also be used in systems powered by a double-cell or triple-cell
Alkaline, NiCd, or NiMH battery with a typical terminal voltage from 2 V to 5.5 V. Additionally, any other voltage
source with a typical output voltage from 2 V to 5.5 V can power systems where the TPS6301x is used.
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9.2.2.1 Programming the Output Voltage
Within the TPS6301x family, there are fixed and adjustable output voltage versions available. To properly
configure the fixed output voltage devices, the FB pin is used to sense the output voltage. This means that it
must be connected directly to VOUT . At the adjustable output voltage versions, an external resistor divider is used
to adjust the output voltage. The resistor divider must be connected between VOUT, FB, and GND. When the
output voltage is regulated properly, the typical value of the voltage at the FB pin is 500 mV. The maximum
recommended value for the output voltage is 5.5 V. The current through the resistive divider should be about 100
times greater than the current into the FB pin. The typical current into the FB pin is 0.01 μA, and the voltage
across the resistor between FB and GND, R2, is typically 500 mV. Based on those two values, the
recommended value for R2 should be lower than 500 kΩ, in order to set the divider current at 1 μA or higher.
The recommended value for this resistor is in the range of 200 kΩ. From that, the value of the resistor connected
between VOUT and FB. R1, depending on the needed output voltage (VOUT ), is calculated using Equation 1:
æV
ö
R1 = R2 × ç OUT - 1÷
è VFB
ø
(1)
As an example, if an output voltage of 3.3 V is needed, a 1-MΩ resistor should be chosen for R1 if R2 is 180-kΩ.
L1
L2
L1
VOUT
VIN
VIN
VOUT
R1
VINA1
C1
C3
VINA
C2
FB
R2
EN
PS
VSEL
SYNC
GND
PGND
TPS6301X
Figure 25. Typical Application Circuit for Adjustable Output Voltage Option
9.2.2.2 Inductor Selection
To properly configure the TPS6301x devices, an inductor must be connected between pin L1 and pin L2. To
estimate the inductance value Equation 2 and Equation 3 can be used.
μs
L1 = (VIN1 - VOUT ) × 0.5 ×
A
(2)
μs
L2 = VOUT × 0.5 ×
A
(3)
In Equation 2, the minimum inductance value L1 for step down mode operation is calculated. VIN1 is the
maximum input voltage. In Equation 3 the minimum inductance, L2 , for boost mode operation is calculated. The
recommended minimum inductor value is either L1 or L2 whichever is higher. As an example, a suitable inductor
for generating 3.3 V from a Li-Ion battery with a battery voltage range from 2.5 V up to 4.2 V is 2.2 μH. The
recommended inductor value range is between 1 μH and 4.7 μH. In general, this means that at high voltage
conversion rates, higher inductor values offer better performance.
With the chosen inductance value, the peak current for the inductor in steady-state operation can be calculated.
Equation 4 shows how to calculate the peak current I1 in step-down mode operation and Equation 5 shows how
to calculate the peak current I2 in boost mode operation. VIN2 is the minimum input voltage.
V
(V - V )
I
I1 = OUT + OUT IN1 OUT
0.8
2 × VIN1× f× L
(4)
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I2 =
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VOUT ×IOUT VIN2 × (VOUT - VIN2 )
+
0.8 × VIN2
2 × VOUT × f× L
(5)
The critical current value for selecting the right inductor is the higher value of I1 and I2. Consider that load
transients and error conditions may cause higher inductor currents, especially when selecting an appropriate
inductor. The following inductor series from different suppliers have been used with TPS6301x converters:
Table 3. List of Recommended Inductors
VENDOR
Coilcraft
FDK
Murata
Toko
INDUCTOR SERIES
LPS3015
LPS4012
MIPSA2520
LQH3NP
LQM2HP
FDSE0312
9.2.2.3 Capacitor Selection
9.2.2.3.1
Input Capacitor
At least a 4.7-μF input capacitor is recommended to improve transient behavior of the regulator and EMI
behavior of the total power supply circuit. A ceramic capacitor placed as close as possible to the VIN and PGND
pins of the IC is recommended.
9.2.2.3.2
Output Capacitor
For the output capacitor, TI recommends using small ceramic capacitors placed as close as possible to the
VOUT and PGND pins of the IC. If, for any reason, the application requires the use of large capacitors which can
not be placed close to the IC, using a smaller ceramic capacitor in parallel to the large one is recommended.
This small capacitor should be placed as close as possible to the VOUT and PGND pins of the IC.
To get an estimate of the recommended minimum output capacitance, Equation 6 can be used.
mF
COUT = 5 × L×
mF
(6)
A capacitor with a value in the range of the calculated minimum should be used. This is required to maintain
control loop stability. There are no additional requirements regarding minimum ESR. There is also no upper limit
for the output capacitance value. Larger capacitors will cause lower output voltage ripple as well as lower output
voltage drop during load transients.
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9.2.3 Application Curves
VI = 2.4 V, IO = 80 mA to 750 mA
VI = 4.2 V, IO = 150 mA to 1300 mA
Output Voltage
Output Voltage
200 mV/div, AC
200 mV/div, AC
Output Current
Output Current
500 mA/div
500 mA/div
TPS63011, VO = 3.3 V
TPS63011, VO = 3.3 V
Timebase 1 ms/div
Timebase 1 ms/div
G029
G028
Figure 26. Load Transient Response (TPS63011)
VI = 2.4 V, IO = 80 mA to 630 mA
Figure 27. Load Transient Response (TPS63011)
VI = 4.2 V, IO = 140 mA to 1100 mA
Output Voltage
Output Voltage
200 mV/div, AC
200 mV/div, AC
Output Current
Output Current
500 mA/div
500 mA/div
TPS63012, VO = 3.4 V
TPS63012, VO = 3.4 V
Timebase 1 ms/div
Timebase 1 ms/div
G030
Figure 28. Load Transient Response (TPS63012)
VI = 3 V to 3.6 V, IO = 300 mA
G031
Figure 29. Load Transient Response (TPS63012)
VI = 3 V to 3.6V, IO = 300 mA
Input Voltage
Input Voltage
500 mV/div, AC
500 mV/div, AC
Output Voltage
Output Voltage
20 mV/div, AC
10 mV/div, AC
TPS63011, VO = 3.3 V
TPS63012, VO = 3.4 V
Timebase 2 ms/div
Timebase 2 ms/div
G032
Figure 30. Line Transient Response (TPS63011)
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G033
Figure 31. Line Transient Response (TPS63012)
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Enable
5 V/div, DC
Output Voltage
1 V/div, DC
Enable
5 V/div, DC
Output Voltage
1 V/div, DC
Inductor Current
500 mA/div, DC
Inductor Current
500 mA/div, DC
Voltage at L1
2 V/div, DC
Voltage at L1
2 V/div, DC
VI = 4.2 V, RL = 11 W
TPS63011, VO = 3.3 V
TPS63012, VO = 3.4 V
VI = 4.2 V, RL = 11 W
Timebase 100 ms/div
Timebase 100 ms/div
G035
G034
Figure 32. Start-Up After Enable (TPS63011)
Figure 33. Start-Up After Enable (TPS63012)
10 Power Supply Recommendations
The TPS6301x device family has no special requirements for its input power supply. The output current of the
input power supply must be rated according to the supply voltage, output voltage, and output current of the
TPS6301x.
11 Layout
11.1 Layout Guidelines
As for all switching power supplies, the layout is an important step in the design, especially at high peak currents
and high switching frequencies. If the layout is not carefully done, the regulator could show stability problems as
well as EMI problems. Therefore, use wide and short traces for the main current path and for the power ground
tracks. The input capacitor, output capacitor, and the inductor must be placed as close as possible to the IC. Use
a common ground node for power ground and a different one for control ground to minimize the effects of ground
noise. Connect these ground nodes at any place close to one of the ground pins of the IC.
The feedback divider must be placed as close as possible to the control ground pin of the IC. To lay out the
control ground, TI recommends using short traces separated from the power ground traces. This avoids ground
shift problems, which can occur due to superimposition of power ground current and control ground current.
11.2 Layout Example
Figure 34. PCB Layout Suggestion
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11.3 Thermal Consideration
Implementation of integrated circuits in low-profile and fine-pitch surface-mount packages typically requires
special attention to power dissipation. Many system-dependent issues such as thermal coupling, airflow, added
heat sinks and convection surfaces, and the presence of other heat-generating components affect the powerdissipation limits of a given component.
Three basic approaches for enhancing thermal performance are listed:
1. Improving the power dissipation capability of the PCB design
2. Improving the thermal coupling of the component to the PCB by soldering all pins to traces as wide as
possible.
3. Introducing airflow in the system
The maximum recommended junction temperature (TJ ) of the TPS6301x devices is 125°C. The thermal
resistance of this 20-pin chipscale package (YFF) is RθJA = 84°C/W, if all pins are soldered. Specified regulator
operation is assured to a maximum ambient temperature TA of 85°C. Therefore, the maximum power dissipation
is about 476 mW, as calculated in Equation 7. More power can be dissipated if the maximum ambient
temperature of the application is lower.
TJ(MAX) - TA 125°C- 85°C
PD(MAX) =
=
= 476 mW
Rq JA
84°C/ W
(7)
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12 Device and Documentation Support
12.1 Related Links
The table below lists quick access links. Categories include technical documents, support and community
resources, tools and software, and quick access to sample or buy.
Table 4. Related Links
PARTS
PRODUCT FOLDER
SAMPLE & BUY
TECHNICAL
DOCUMENTS
TOOLS &
SOFTWARE
SUPPORT &
COMMUNITY
TPS63010
Click here
Click here
Click here
Click here
Click here
TPS63011
Click here
Click here
Click here
Click here
Click here
TPS63012
Click here
Click here
Click here
Click here
Click here
12.2 Community Resources
The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective
contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of
Use.
TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration
among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help
solve problems with fellow engineers.
Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and
contact information for technical support.
12.3 Trademarks
E2E is a trademark of Texas Instruments.
All other trademarks are the property of their respective owners.
12.4 Electrostatic Discharge Caution
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
12.5 Glossary
SLYZ022 — TI Glossary.
This glossary lists and explains terms, acronyms, and definitions.
13 Mechanical, Packaging, and Orderable Information
The following pages include mechanical, packaging, and orderable information. This information is the most
current data available for the designated devices. This data is subject to change without notice and revision of
this document. For browser-based versions of this data sheet, refer to the left-hand navigation.
13.1 Package Dimensions
The package dimensions for this YFF package are shown in the table below. See the package drawing at the
end of this data sheet for more details.
Table 5. YFF Package Dimensions
Packaged Devices
D
E
TPS63010YFF
2.126 ± 0.05 mm
1.922 ± 0.05 mm
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PACKAGE OPTION ADDENDUM
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10-Dec-2020
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
(2)
Lead finish/
Ball material
MSL Peak Temp
Op Temp (°C)
Device Marking
(3)
(4/5)
(6)
TPS63010YFFR
ACTIVE
DSBGA
YFF
20
3000
RoHS & Green
SNAGCU
Level-1-260C-UNLIM
-40 to 125
TPS63010
TPS63010YFFT
ACTIVE
DSBGA
YFF
20
250
RoHS & Green
SNAGCU
Level-1-260C-UNLIM
-40 to 125
TPS63010
TPS63011YFFR
ACTIVE
DSBGA
YFF
20
3000
RoHS & Green
SNAGCU
Level-1-260C-UNLIM
-40 to 125
TPS63011
TPS63011YFFT
ACTIVE
DSBGA
YFF
20
250
RoHS & Green
SNAGCU
Level-1-260C-UNLIM
-40 to 125
TPS63011
TPS63012YFFR
ACTIVE
DSBGA
YFF
20
3000
RoHS & Green
SNAGCU
Level-1-260C-UNLIM
-40 to 125
TPS63012
TPS63012YFFT
ACTIVE
DSBGA
YFF
20
250
RoHS & Green
SNAGCU
Level-1-260C-UNLIM
-40 to 125
TPS63012
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of
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