TPS63031DSKR

Product Folder Order Now Support & Community Tools & Software Technical Documents TPS63030, TPS63031 SLVS696D – OCTOBER 2008 – REVISED APRIL 2020 TPS6303x High Efficiency Single Inductor Buck-Boost Converter With 1-A Switches 1 Features 3 Description • • The TPS6303x devices provide a power supply solution for products powered by either a two-cell or three-cell alkaline, NiCd or NiMH battery, or a onecell Li-ion or Li-polymer battery. Output currents can go as high as 600 mA while using a single-cell Li-ion or Li-polymer battery, and discharge it down to 2.5 V or lower. The buck-boost converter is based on a fixed-frequency, pulse width modulation (PWM) controller using synchronous rectification to obtain maximum efficiency. At low-load currents, the converter enters power-save mode to maintain high efficiency over a wide load current range. The powersave mode can be disabled, forcing the converter to operate at a fixed switching frequency. The maximum average current in the switches is limited to a typical value of 1000 mA. The output voltage is programmable using an external resistor divider, or is fixed internally on the chip. The converter can be disabled to minimize battery drain. During shutdown, the load is disconnected from the battery. 1 • • • • • • • • • • Input voltage range: 1.8 V to 5.5 V Fixed and adjustable output voltage options from 1.2 V to 5.5 V Up to 96% efficiency 800-mA Output current at 3.3 V in step-down mode (VIN = 3.6 V to 5.5 V) Up to 500-mA output current at 3.3 V in boost mode (VIN > 2.4 V) Automatic transition between step-down and boost mode Device quiescent current less than 50 μA Power-save mode for improved efficiency at lowoutput power Forced fixed frequency operation and synchronization possible Load disconnect during shutdown Overtemperature protection Available in a small 2.5-mm × 2.5-mm 10-pin VSON package (QFN) 2 Applications • All two-cell and three-cell alkaline, NiCd or NiMH, or single-cell Li battery powered products – Smartphone – Portable media player – IP network camera – Blood glucose monitor – Portable data terminal The TPS6303x devices operate over a free air temperature range of –40°C to 85°C. The devices are packaged in a 10-pin VSON package measuring 2.5mm × 2.5-mm (DSK). Device Information(1) PART NUMBER TPS63030 TPS63031 PACKAGE VSON (10) BODY SIZE (NOM) 2.50 mm x 2.50 mm (1) For all available packages, see the orderable addendum at the end of the data sheet. Typical Application Schematic Efficiency versus Output Current L1 100 1.5 µH VI = 3.6 V, VO = 3.3 V 90 L2 L1 VIN C1 10 µF VOUT VINA C3 0.1µF EN FB PS/SYNC GND PGND TPS63031 C2 2X10 µF VOUT 3.3 V up to 800 mA 80 70 Efficiency - % VIN 1.8 V to 5.5 V VI = 2.4 V, VO = 3.3 V 60 50 40 30 20 10 0 0.1 TPS63031 Power Save Enabled 100 1 10 IO - Output Current - mA 1000 1 An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications, intellectual property matters and other important disclaimers. PRODUCTION DATA. TPS63030, TPS63031 SLVS696D – OCTOBER 2008 – REVISED APRIL 2020 www.ti.com Table of Contents 1 2 3 4 5 6 7 8 Features .................................................................. Applications ........................................................... Description ............................................................. Revision History..................................................... Output Voltage Options ........................................ Pin Configuration and Functions ......................... Specifications......................................................... 1 1 1 2 3 3 4 7.1 7.2 7.3 7.4 7.5 7.6 4 4 4 4 5 6 Absolute Maximum Ratings ...................................... ESD Ratings.............................................................. Recommended Operating Conditions....................... Thermal Information .................................................. Electrical Characteristics........................................... Typical Characteristics .............................................. Detailed Description .............................................. 7 8.1 8.2 8.3 8.4 Overview ................................................................... Functional Block Diagrams ....................................... Feature Description................................................... Device Functional Modes.......................................... 7 7 8 9 9 Application and Implementation ........................ 10 9.1 Application Information............................................ 10 9.2 Typical Application .................................................. 10 10 Power Supply Recommendations ..................... 17 11 Layout................................................................... 17 11.1 Layout Guidelines ................................................. 17 11.2 Layout Example .................................................... 17 11.3 Thermal Considerations ........................................ 17 12 Device and Documentation Support ................. 18 12.1 12.2 12.3 12.4 12.5 12.6 12.7 Device Support...................................................... Documentation Support ........................................ Related Links ........................................................ Support Resources ............................................... Trademarks ........................................................... Electrostatic Discharge Caution ............................ Glossary ................................................................ 18 18 18 18 18 18 18 13 Mechanical, Packaging, and Orderable Information ........................................................... 18 4 Revision History NOTE: Page numbers for previous revisions may differ from page numbers in the current version. Changes from Revision C (August 2014) to Revision D Page • Changed the max average switch current limit to 1300 mA .................................................................................................. 5 • Updated the Soft Start and Short Circuit Protection section .................................................................................................. 9 • Corrected typos .................................................................................................................................................................... 10 • Added Table 4 ..................................................................................................................................................................... 13 • Corrected to TPS63030 ....................................................................................................................................................... 14 • Corrected to TPS63030 ....................................................................................................................................................... 14 Changes from Revision B (March 2012) to Revision C • 2 Page Added ESD Ratings table, Feature Description section, Device Functional Modes, Application and Implementation section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and Mechanical, Packaging, and Orderable Information section .................................................................................................. 1 Submit Documentation Feedback Copyright © 2008–2020, Texas Instruments Incorporated Product Folder Links: TPS63030 TPS63031 TPS63030, TPS63031 www.ti.com SLVS696D – OCTOBER 2008 – REVISED APRIL 2020 5 Output Voltage Options (1) Table 1. Output Voltage Options OUTPUT VOLTAGE DC/DC PACKAGE MARKING Adjustable CEF 3.3 V CEF (1) (1) PACKAGE 10-pin VSON PART NUMBER (1) TPS63030DSK TPS63031DSK Contact the factory to check availability of other fixed output voltage versions. The DSK package is available taped and reeled. Add R suffix to device type (for example, TPS63030DSKR) to order quantities of 3000 devices per reel. Add T suffix to device type (for example, TPS63030DSKT) to order quantities of 250 devices per reel. 6 Pin Configuration and Functions DSK Package 10-Pin VSON Top View VOUT L2 PGND L1 VIN (1) Exposed Thermal (1) Pad FB GND VINA PS/SYNC EN The exposed thermal pad is connected to PGND. Pin Functions PIN NAME NO. I/O DESCRIPTION EN 6 IN Enable input (1 enabled, 0 disabled) FB 10 IN Voltage feedback of adjustable versions, must be connected to VOUT on fixed output voltage versions GND 9 — Control / logic ground L1 4 IN Connection for inductor L2 2 IN Connection for inductor PGND 3 — Power ground PS/SYNC 7 IN Enable / disable power save mode (1 disabled, 0 enabled, clock signal for synchronization) VIN 5 IN Supply voltage for power stage VINA 8 IN Supply voltage for control stage VOUT 1 OUT Exposed Thermal Pad — — Buck-boost converter output The exposed thermal pad is connected to PGND. Copyright © 2008–2020, Texas Instruments Incorporated Product Folder Links: TPS63030 TPS63031 Submit Documentation Feedback 3 TPS63030, TPS63031 SLVS696D – OCTOBER 2008 – REVISED APRIL 2020 www.ti.com 7 Specifications 7.1 Absolute Maximum Ratings Over operating free-air temperature range (unless otherwise noted) (1) MIN MAX UNIT Input voltage on VIN, VINA, L1, L2, VOUT, ILIM, EN, FB, SS –0.3 7 V Operating virtual junction temperature, TJ –40 150 °C Storage temperature, Tstg –65 150 °C (1) Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods my affect device reliability. 7.2 ESD Ratings VALUE Electrostatic discharge V(ESD) (1) (2) Human body model (HBM), per ANSI/ESDA/JEDEC JS-001, all pins (1) 2000 Charged device model (CDM), per JEDEC specification JESD22-C101, all pins (2) 1000 UNIT V JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process. 7.3 Recommended Operating Conditions MIN MAX Supply voltage at VIN, VINA 1.8 5.5 UNIT V Operating free air temperature, TA –40 85 °C Operating virtual junction temperature, TJ –40 125 °C 7.4 Thermal Information TPS6303x THERMAL METRIC (1) DSK (VSON) UNIT 10 PINS RθJA Junction-to-ambient thermal resistance 60.7 °C/W RθJC(top) Junction-to-case (top) thermal resistance — °C/W RθJB Junction-to-board thermal resistance 26 °C/W ψJT Junction-to-top characterization parameter — °C/W ψJB Junction-to-board characterization parameter — °C/W RθJC(bot) Junction-to-case (bottom) thermal resistance 6.3 °C/W (1) 4 For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report, SPRA953. Submit Documentation Feedback Copyright © 2008–2020, Texas Instruments Incorporated Product Folder Links: TPS63030 TPS63031 TPS63030, TPS63031 www.ti.com SLVS696D – OCTOBER 2008 – REVISED APRIL 2020 7.5 Electrical Characteristics over recommended free-air temperature range and over recommended input voltage range (typical at an ambient temperature range of 25°C) (unless otherwise noted) PARAMETER TEST CONDITIONS MIN TYP MAX UNIT DC/DC STAGE VIN Input voltage range VIN Minimum input voltage for start-up VIN VOUT 1.8 5.5 V 1.6 1.8 1.9 V Minimum input voltage for start-up 1.6 1.8 2.0 V TPS63030 output voltage range 1.2 5.5 V 0°C ≤ TA ≤ 85°C Minimum duty cycle in step-down conversion VFB VFB f TPS63030 feedback voltage 30% PS/SYNC = VIN TPS63031 output voltage Iq IS 505 3.267 3.3 3.333 PS/SYNC = GND Referenced to 500 mV -3% TPS63031 output voltage PS/SYNC = GND Referenced to 3.3 V -3% Frequency range for synchronization ISW 500 TPS63030 feedback voltage Oscillator frequency 40% 495 mV V +6% +6% 2200 2400 2600 kHz 2200 2400 2600 kHz 900 1000 1300 Average switch current limit VIN = VINA = 3.6 V, TA = 25°C High-side switch ON-resistance VIN = VINA = 3.6 V 200 mΩ Low-side switch ON-resistance VIN = VINA = 3.6 V 200 mΩ Maximum line regulation 0.5% Maximum load regulation 0.5% Quiescent current VIN and VINA IOUT = 0 mA, VEN = VIN = VINA = 3.6 V, VOUT = 3.3 V VOUT TPS63031 FB input impedance VEN = HIGH Shutdown current VEN = 0 V, VIN = VINA = 3.6 V 25 35 4 6 1 mA μA μA MΩ 0.1 0.9 μA 1.5 1.6 V 0.4 V CONTROL STAGE VUVLO Under voltage lockout threshold VIL EN, PS/SYNC input low voltage VIH EN, PS/SYNC input high voltage VINA voltage decreasing 1.4 1.2 EN, PS/SYNC input current Clamped on GND or VINA V 0.01 0.1 μA Overtemperature protection 140 °C Overtemperature hysteresis 20 °C Copyright © 2008–2020, Texas Instruments Incorporated Product Folder Links: TPS63030 TPS63031 Submit Documentation Feedback 5 TPS63030, TPS63031 SLVS696D – OCTOBER 2008 – REVISED APRIL 2020 www.ti.com 7.6 Typical Characteristics 1200 1100 TPS63030 TPS63031 VO = 2.5 V 1000 1000 Maximum Output Current - mA Maximum Output Current - mA 900 800 700 VO = 4.5 V 600 500 400 300 200 VO = 3.3 V 800 600 400 200 100 0 1.8 2.2 2.6 3 3.4 3.8 4.2 4.6 VI - Input Voltage - V 5 5.4 Figure 1. Maximum Output Current versus Input Voltage, TPS63030 6 Submit Documentation Feedback 0 1.8 2.2 2.6 3 3.4 3.8 4.2 4.6 VI - Input Voltage - V 5 5.4 Figure 2. Maximum Output Current versus Input Voltage, TPS63031 Copyright © 2008–2020, Texas Instruments Incorporated Product Folder Links: TPS63030 TPS63031 TPS63030, TPS63031 www.ti.com SLVS696D – OCTOBER 2008 – REVISED APRIL 2020 8 Detailed Description 8.1 Overview The controlling circuit of the device is based on an average current mode topology. The average inductor current is regulated by a fast current regulator loop which is controlled by a voltage control loop. The controller also uses input and output voltage feed forward. Changes of input and output voltage are monitored and can immediately change the duty cycle in the modulator to achieve a fast response to those errors. The voltage error amplifier gets its feedback input from the FB pin. At adjustable output voltages, a resistive voltage divider must be connected to that pin. At fixed output voltages, FB must be connected to the output voltage to directly sense the voltage. Fixed output voltage versions use a trimmed internal resistive divider. The feedback voltage is compared with the internal reference voltage to generate a stable and accurate output voltage. The controller circuit also senses the average input current as well as the peak input current. With this, maximum input power can be controlled as well as the maximum peak current to achieve a safe and stable operation under all possible conditions. To finally protect the device from overheating, an internal temperature sensor is implemented. The device uses four internal N-channel MOSFETs to maintain synchronous power conversion at all possible operating conditions. This enables the device to keep high efficiency over a wide input voltage and output power range. To avoid ground shift problems due to the high currents in the switches, two separate ground pins, GND and PGND, are used. The reference for all control functions is the GND pin. The power switches are connected to PGND. Both grounds must be connected on the PCB at only one point ideally close to the GND pin. Due to the 4-switch topology, the load is always disconnected from the input during shutdown of the converter. 8.2 Functional Block Diagrams L1 L2 VIN VOUT Current Sensor VINA VBAT VOUT PGND PGND Gate Control _ VINA Modulator + + _ FB VREF Oscillator PS/SYNC + - Device Control EN Temperature Control PGND PGND GND Figure 3. Functional Block Diagram (TPS63030) Copyright © 2008–2020, Texas Instruments Incorporated Product Folder Links: TPS63030 TPS63031 Submit Documentation Feedback 7 TPS63030, TPS63031 SLVS696D – OCTOBER 2008 – REVISED APRIL 2020 www.ti.com Functional Block Diagrams (continued) L1 L2 VIN VOUT Current Sensor VINA VBAT VOUT VINA PGND PGND Gate Control FB _ Modulator + _ + Oscillator PS/SYNC + - VREF Device Control EN Temperature Control PGND PGND GND Figure 4. Functional Block Diagram (TPS63031) 8.3 Feature Description 8.3.1 Device Enable The device is put into operation when EN is set high. It is put into a shutdown mode when EN is set to GND. In shutdown mode, the regulator stops switching, all internal control circuitry is switched off, and the load is disconnected from the input. This also means that the output voltage can drop below the input voltage during shutdown. During the start-up of the converter, the duty cycle and the peak current are limited to avoid high peak currents flowing from the input. 8.3.2 Undervoltage Lockout An undervoltage lockout function prevents device start-up if the supply voltage at VINA is lower than approximately its threshold (see the Electrical Characteristics). When in operation, the device automatically enters the shutdown mode if the voltage at VINA drops below the undervoltage lockout threshold. The device automatically restarts if the input voltage recovers to the minimum operating input voltage. 8.3.3 Overtemperature Protection The device has a built-in temperature sensor which monitors the internal IC temperature. If the temperature exceeds the programmed threshold (see the Electrical Characteristics), the device stops operating. As soon as the IC temperature has decreased below the programmed threshold, it starts operating again. There is a built-in hysteresis to avoid unstable operation at IC temperatures at the overtemperature threshold. 8 Submit Documentation Feedback Copyright © 2008–2020, Texas Instruments Incorporated Product Folder Links: TPS63030 TPS63031 TPS63030, TPS63031 www.ti.com SLVS696D – OCTOBER 2008 – REVISED APRIL 2020 8.4 Device Functional Modes 8.4.1 Soft Start and Short Circuit Protection After being enabled, the device starts operating. The average current limit ramps up from zero to the nominal current limit value. Thus, the output voltage overshoot at start-up, as well as the inrush current, is kept at a minimum. The device ramps up the output voltage in a controlled manner, even if a very large capacitor is connected at the output. At an overload or short circuit condition at the output, the average current limit protects the device itself and the application. Higher change rates of output current or input voltage can trigger an additional built-in short circuit protection mode, which reduces the current limit to less than 50% of the nominal current limit. In this mode, the switching frequency can be reduced as well. 8.4.2 Buck-Boost Operation To regulate the output voltage properly at all possible input voltage conditions, the device automatically switches from step-down operation to boost operation and back as required by the configuration. It always uses one active switch, one rectifying switch, one switch permanently on, and one switch permanently off. Therefore, it operates as a step-down converter (buck) when the input voltage is higher than the output voltage, and as a boost converter when the input voltage is lower than the output voltage. There is no mode of operation where all four switches are permanently switching. Controlling the switches this way allows the converter to maintain high efficiency at the most important point of operation, when input voltage is close to the output voltage. The RMS current through the switches and the inductor is kept at a minimum to minimize switching and conduction losses. Switching losses are also kept low by using only one active and one passive switch. For the remaining two switches, one is kept permanently on and the other is kept permanently off, thus causing no switching losses. 8.4.3 Power-Save Mode and Synchronization The PS/SYNC pin can be used to select different operation modes. To enable power-save, PS/SYNC must be set low. Power-save mode is used to improve efficiency at light load. If power-save mode is enabled, the converter stops operating if the average inductor current gets lower than about 100 mA and the output voltage is at or above its nominal value. If the output voltage decreases below its nominal value, the device ramps up the output voltage again by starting operation using a programmed average inductor current higher than required by the current load condition. Operation can last for one or several pulses. The converter again stops operating once the conditions for stopping operation are met again. The power save mode can be disabled by programming high at the PS/SYNC. Connecting a clock signal at PS/SYNC forces the device to synchronize to the connected clock frequency. Synchronization is done by a phase-locked loop (PLL), so synchronizing to lower and higher frequencies compared to the internal clock works without any issues. The PLL can also tolerate missing clock pulses without the converter malfunctioning. The PS/SYNC input supports standard logic thresholds. Copyright © 2008–2020, Texas Instruments Incorporated Product Folder Links: TPS63030 TPS63031 Submit Documentation Feedback 9 TPS63030, TPS63031 SLVS696D – OCTOBER 2008 – REVISED APRIL 2020 www.ti.com 9 Application and Implementation NOTE Information in the following applications sections is not part of the TI component specification, and TI does not warrant its accuracy or completeness. TI’s customers are responsible for determining suitability of components for their purposes. Customers should validate and test their design implementation to confirm system functionality. 9.1 Application Information The TPS63030 and TPS63031 are buck-boost converters suitable for applications that need a regulated output voltage from an input supply that is higher or lower than the desired output voltage. 9.2 Typical Application L1 1.5 µH L1 VIN 1.8 V to 5.5 V L2 VIN C1 10 µF VOUT 3.3 V up to 800 mA VOUT VINA R1 C3 0.1 µF EN C2 2X10 µF FB PS/SYNC R2 PGND GND TPS63030 Figure 5. Typical Application Circuit for Adjustable Output Voltage L1 1.5 µH VIN 1.8 V to 5.5 V L1 L2 VIN C1 10 µF VOUT VINA C3 0.1µF EN C2 2X10 µF FB VOUT 3.3 V up to 800 mA PS/SYNC GND PGND TPS63031 Figure 6. Typical Application Circuit for 3.3-V Fixed Output Voltage Option 9.2.1 Design Requirements The design guideline provides a component selection to operate the device within the Recommended Operating Conditions. Table 2 shows ths list of components for the application curves. 10 Submit Documentation Feedback Copyright © 2008–2020, Texas Instruments Incorporated Product Folder Links: TPS63030 TPS63031 TPS63030, TPS63031 www.ti.com SLVS696D – OCTOBER 2008 – REVISED APRIL 2020 Typical Application (continued) Table 2. List of Components REFERENCE DESCRIPTION MANUFACTURER TPS6303 0 / 1 Texas Instruments L1 1.5 μH, 3 mm x 3 mm x 1.5 mm LPS3015-1R5, Coilcraft C1 10 μF 6.3V, 0603, X7R ceramic GRM188R60J106KME84D, Murata C2 2 × 10 μF 6.3V, 0603, X7R ceramic GRM188R60J106KME84D, Murata C3 0.1 μF, X7R ceramic R1, R2 Depending on the output voltage at TPS63030, not used at TPS63031 9.2.2 Detailed Design Procedure 9.2.2.1 Programming the Output Voltage Within the TPS6303x family, there are fixed and adjustable output voltage versions available. To properly configure the fixed output voltage devices, the FB pin is used to sense the output voltage. This means that it must be connected directly to VOUT. At the adjustable output voltage versions, an external resistor divider is used to adjust the output voltage. The resistor divider must be connected between VOUT, FB, and GND. When the output voltage is regulated properly, the typical value of the voltage at the FB pin is 500 mV. The maximum recommended value for the output voltage is 5.5 V. The current through the resistive divider must be about 100 times greater than the current into the FB pin. The typical current into the FB pin is 0.01 μA, and the voltage across the resistor between FB and GND, R2, is typically 500 mV. Based on those two values, the recommended value for R2 must be lower than 500 kΩ, in order to set the divider current at 1 μA or higher. TI recommends to keep the value for this resistor in the range of 200 kΩ. From that, the value of the resistor connected between VOUT and FB, R1, depending on the needed output voltage (VOUT), can be calculated using Equation 1. R 1 + R2 ǒ VOUT V FB Ǔ *1 (1) 9.2.2.2 Inductor Selection The inductor selection is affected by several parameter like inductor ripple current, output voltage ripple, transition point into power-save mode, and efficiency. See Table 3 for typical inductors. Table 3. List of Recommended Inductors VENDOR INDUCTOR SERIES LPS3015 Coilcraft EPL3010 Murata LQH3NP Tajo Yuden NR3015 For high efficiencies, the inductor must have a low DC resistance to minimize conduction losses. Especially at high-switching frequencies, the core material has a high impact on efficiency. When using small chip inductors, the efficiency is reduced mainly due to higher inductor core losses. This needs to be considered when selecting the appropriate inductor. The inductor value determines the inductor ripple current. The larger the inductor value, the smaller the inductor ripple current and the lower the conduction losses of the converter. Conversely, larger inductor values cause a slower load transient response. To avoid saturation of the inductor, the peak current for the inductor in steady state operation is calculated using Equation 3. Only the equation which defines the switch current in boost mode is shown, because this provides the highest value of current and represents the critical current value for selecting the right inductor. Duty Cycle Boost IPEAK = D= V -V IN OUT V OUT (2) Iout Vin ´ D + η ´ (1 - D) 2 ´ f ´ L Copyright © 2008–2020, Texas Instruments Incorporated Product Folder Links: TPS63030 TPS63031 Submit Documentation Feedback 11 TPS63030, TPS63031 SLVS696D – OCTOBER 2008 – REVISED APRIL 2020 www.ti.com where • • • • D = duty cycle in boost mode f = converter switching frequency (typical 2.5 MHz) L = inductor value η = estimated converter efficiency (use the number from the efficiency curves or 0.90 as an assumption) (3) NOTE The calculation must be done for the minimum input voltage which is possible to have in boost mode. Calculating the maximum inductor current using the actual operating conditions gives the minimum saturation current of the inductor needed. TI recommends to choose an inductor with a saturation current 20% higher than the value calculated using Equation 3. Possible inductors are listed in Table 3. 9.2.2.3 Capacitor Selection 9.2.2.3.1 Input Capacitor At least a 4.7-μF input capacitor is recommended to improve transient behavior of the regulator and EMI behavior of the total power supply circuit. A ceramic capacitor placed as close as possible to the VIN and PGND pins of the IC is recommended. 9.2.2.3.2 Bypass Capacitor To make sure that the internal control circuits are supplied with a stable low noise supply voltage, a capacitor can be connected between VINA and GND. Using a ceramic capacitor with a value of 0.1 μF is recommended. The value of this capacitor should not be higher than 0.22 μF. 9.2.2.3.3 Output Capacitor For the output capacitor, use of a small ceramic capacitors placed as close as possible to the VOUT and PGND pins of the IC is recommended. The recommended nominal output capacitance value is 10 µF. There is also no upper limit for the output capacitance value. Larger capacitors causes lower output voltage ripple as well as lower output voltage drop during load transients. 12 Submit Documentation Feedback Copyright © 2008–2020, Texas Instruments Incorporated Product Folder Links: TPS63030 TPS63031 TPS63030, TPS63031 www.ti.com SLVS696D – OCTOBER 2008 – REVISED APRIL 2020 9.2.3 Application Curves Table 4. Application Curves PARAMETER CONDITION FIGURE Efficiency versus Output Current, TPS63030, Power-Save Enabled Figure 7 Efficiency versus Output Current, TPS63030, Power-Save Disabled Figure 8 Efficiency versus Output Current, TPS63031, Power-Save Enabled Figure 9 Efficiency versus Output Current, TPS63031, Power-Save Disabled Figure 10 Efficiency versus Input Voltage, TPS63030, Power-Save Enabled VOUT = 2.5 V Figure 11 Efficiency versus Input Voltage, TPS63030, Power-Save Enabled VOUT = 4.5 V Figure 13 Efficiency versus Input Voltage, TPS63030, Power-Save Disabled VOUT = 2.5 V Figure 13 Efficiency versus Input Voltage, TPS63030, Power-Save Disabled VOUT = 3.3 V Figure 14 Efficiency versus Input Voltage, TPS63031, Power-Save Enabled VOUT = 3.3 V Figure 15 Efficiency versus Input Voltage, TPS63031, Power-Save Disabled VOUT = 3.3 V Figure 16 Output Voltage versus Output Current, TPS63031, Power-Save Disabled VIN = 3.6 V / VOUT = 2.5 V Figure 17 Output Voltage versus Output Current, TPS63031, Power Save Disabled VIN = 3.6 V / VOUT = 3.3 V Figure 19 Load Transient Response, TPS63031 VIN = 2.4 V / VOUT = 3.3 V Figure 20 Load Transient Response, TPS63031 VIN = 4.2 V / VOUT = 3.3 V Figure 21 Line Transient Response, TPS63031 VIN = 3.0 V / VOUT = 3.3 V Figure 22 Start-up After Enable, TPS63031 VIN = 2.4 V / VOUT = 3.3 V Figure 23 Start-up After Enable, TPS63031 VIN = 4.2 V / VOUT = 3.3 V Figure 24 Copyright © 2008–2020, Texas Instruments Incorporated Product Folder Links: TPS63030 TPS63031 Submit Documentation Feedback 13 TPS63030, TPS63031 SLVS696D – OCTOBER 2008 – REVISED APRIL 2020 www.ti.com 100 100 VI = 3.6 V, VO = 2.5 V 90 80 80 VI = 3.6 V, VO = 4.5 V 70 VI = 2.4 V, VO = 4.5 V Efficiency - % Efficiency - % 70 VI = 3.6 V, VO = 4.5 V 60 50 VI = 2.4 V, VO = 2.5 V 40 60 40 30 20 20 TPS63030 Power Save Enabled 10 0 0.1 1 10 100 IO - Output Current - mA 100 0 0.1 1000 80 80 70 VI = 3.6 V, VO = 3.3 V 70 Efficiency - % VI = 2.4 V, VO = 3.3 V 60 50 40 60 VI = 2.4 V, VO = 3.3 V 50 40 30 30 20 20 TPS63031 Power Save Enabled 10 0 0.1 100 1 10 IO - Output Current - mA 0 0.1 1000 1 10 100 IO - Output Current - mA 1000 Figure 10. Efficiency versus Output Current, TPS63031, Power-Save Disabled 100 IO = 100 mA VO = 2.5 V TPS63031 Power Save Disabled 10 Figure 9. Efficiency versus Output Current, TPS63031, Power-Save Enabled VO = 4.5 V 90 IO = 100 mA 90 80 80 IO = 10 mA 70 Efficiency - % IO = 500 mA 60 IO = 10 mA 70 50 40 IO = 500 mA 60 50 40 30 30 20 20 TPS63030 Power Save Enabled 10 2.2 2.6 3 3.4 3.8 4.2 4.6 VI - Input Voltage - V 5 5.4 TPS63030 Power Save Enabled 10 0 1.8 2.2 VOUT = 2.5 V Submit Documentation Feedback 2.6 3 3.4 3.8 4.2 4.6 VI - Input Voltage - V 5 5.4 VOUT = 4.5 V Figure 11. Efficiency versus Input Voltage, TPS63030, Power-Save Enabled 14 1000 10 100 IO - Output Current - mA 100 VI = 3.6 V, VO = 3.3 V 90 0 1.8 1 Figure 8. Efficiency versus Output Current, TPS63030, Power-Save Disabled 90 100 TPS63030 Power Save Disabled 10 Figure 7. Efficiency versus Output Current, TPS63030, Power-Save Enabled Efficiency - % VI = 2.4 V, VO = 4.5 V 50 30 Efficiency - % VI = 3.6 V, VO = 2.5 V VI = 2.4 V, VO = 2.5 V 90 Figure 12. Efficiency versus Input Voltage, TPS63030, Power-Save Enabled Copyright © 2008–2020, Texas Instruments Incorporated Product Folder Links: TPS63030 TPS63031 TPS63030, TPS63031 www.ti.com SLVS696D – OCTOBER 2008 – REVISED APRIL 2020 100 VO = 2.5 V 100 IO = 100 mA 90 80 Efficiency - % 70 60 50 IO = 10 mA 40 30 60 IO = 500 mA 50 IO = 10 mA 40 30 20 20 TPS63030 Power Save Disabled 10 0 1.8 2.2 2.6 3 3.4 3.8 4.2 4.6 VI - Input Voltage - V 5 TPS63030 Power Save Disabled 10 0 1.8 5.4 2.2 2.6 VOUT = 2.5 V 100 100 90 5.4 VO = 3.3 V IO = 100 mA 90 80 80 IO = 500 mA IO = 10 mA 60 50 40 60 IO = 10 mA 50 40 30 30 20 20 TPS63031 Power Save Enabled 10 0 1.8 2.2 2.6 3 3.4 3.8 4.2 4.6 VI - Input Voltage - V IO = 500 mA 70 Efficiency - % 70 Efficiency - % 5 Figure 14. Efficiency versus Input Voltage, TPS63030, Power-Save Disabled IO = 100 mA VO = 3.3 V 3 3.4 3.8 4.2 4.6 VI - Input Voltage - V VOUT = 4.5 V Figure 13. Efficiency versus Input Voltage, TPS63030, Power-Save Disabled 5 TPS63031 Power Save Disabled 10 0 1.8 5.4 2.2 2.6 VOUT = 3.3 V 2.575 3 3.4 3.8 4.2 4.6 VI - Input Voltage - V 5 5.4 VOUT = 3.3 V Figure 15. Efficiency versus Input Voltage, TPS63031, Power-Save Enabled Figure 16. Efficiency versus Input Voltage, TPS63031, Power-Save Disabled 4.635 VO = 2.5 V VO = 4.5 V 2.55 4.59 VO - Output Voltage - V VO - Output Voltage - V IO = 100 mA 80 IO = 500 mA 70 Efficiency - % VO = 4.5 V 90 2.525 VI = 3.6 V 2.5 2.475 2.45 TPS63031 Power Save Disabled VI = 3.6 V 4.5 4.455 4.41 TPS63031 Power Save Disabled 2.425 1 4.545 10 100 IO - Output Current - mA 1000 4.365 1 VIN = 3.6 V / VOUT = 2.5 V Figure 17. Output Voltage versus Output Current, TPS63030, Power-Save Disabled 10 100 IO - Output Current - mA 1000 VIN = 3.6 V / VOUT = 4.5 V Figure 18. Output Voltage versus Output Current, TPS63030, Power Save Disabled Copyright © 2008–2020, Texas Instruments Incorporated Product Folder Links: TPS63030 TPS63031 Submit Documentation Feedback 15 TPS63030, TPS63031 SLVS696D – OCTOBER 2008 – REVISED APRIL 2020 www.ti.com 3.399 VI = 2.4 V, IL = 175 mA to 265 mA VO = 3.3 V Output Voltage 50 mV/div, AC VO - Output Voltage - V 3.366 VI = 3.6 V 3.333 3.3 3.267 Output Current 50 mA/div 3.234 TPS63031 Power Save Disabled 3.201 1 TPS63031, VO = 3.3 V 10 100 IO - Output Current - mA 1000 VIN = 3.6 V / VOUT = 3.3 V Time - 1 ms/div Figure 20. Load Transient Response, TPS63031 Figure 19. Output Voltage versus Output Current, TPS63031, Power Save Disabled VI = 4.2 V, IL = 340 mA to 500 mA VI = 3 V to 3.6 V, IL = 300 mA Output Voltage 50 mV/div, AC Input Voltage 500 mV/div, AC Output Current 100 mA/div Output Voltage 20 mV/div, AC TPS63031, VO = 3.3 V TPS63031, VO = 3.3 V Time 1 ms/div Time 2 ms/Div VIN = 4.2 V / VOUT = 3.3 V Figure 21. Load Transient Response, TPS63031 Enable 5 V/div, DC VIN = 3.0 V / VOUT = 3.3 V Figure 22. Line Transient Response, TPS63031 Enable 5 V/div, DC Output Voltage 1 V/div, DC Output Voltage 1 V/div, DC Inductor Current 200 mA/div, DC Inductor Current Voltage at L1 200 mA/div, DC 5 V/div, DC Voltage at L2 5 V/div, DC TPS63031, VO = 3.3 V VI = 2.4 V, RL = 11 W TPS63031, VO = 3.3 V VIN = 4.2 V / VOUT = 3.3 V VIN = 2.4 V / VOUT = 3.3 V Figure 23. Start-up After Enable, TPS63031 16 Submit Documentation Feedback VI = 4.2 V, RL = 11 W Time 100 ms/div Time 200ms/div Figure 24. Start-up After Enable, TPS63031 Copyright © 2008–2020, Texas Instruments Incorporated Product Folder Links: TPS63030 TPS63031 TPS63030, TPS63031 www.ti.com SLVS696D – OCTOBER 2008 – REVISED APRIL 2020 10 Power Supply Recommendations The TPS6303x devices have no special requirements for its input power supply. The output current of the input power supply needs to be rated according to the supply voltage, output voltage, and output current of the TPS6303x. 11 Layout 11.1 Layout Guidelines As for all switching power supplies, the layout is an important step in the design, especially at high peak currents and high switching frequencies. If the layout is not carefully done, the regulator can show stability problems as well as EMI problems. Therefore, use wide and short traces for the main current path and for the power ground tracks. The input capacitor, output capacitor, and the inductor must be placed as close as possible to the IC. Use a common ground node for power ground and a different one for control ground to minimize the effects of ground noise. Connect these ground nodes at any place close to one of the ground pins of the IC. The feedback divider must be placed as close as possible to the control ground pin of the IC. To lay out the control ground, TI recommends to use short traces as well, separated from the power ground traces. This avoids ground shift problems, which can occur due to superimposition of power ground current and control ground current. 11.2 Layout Example L1 C2 L2 VOUT VOUT L1 PGND VIN C1 VIN GND FB GND VINA EN PS/SYNC GND C3 R2 R1 Figure 25. Layout Recommendation 11.3 Thermal Considerations Implementation of integrated circuits in low-profile and fine-pitch surface-mount packages typically requires special attention to power dissipation. Many system-dependent issues such as thermal coupling, airflow, added heat sinks and convection surfaces, and the presence of other heat-generating components affect the powerdissipation limits of a given component. The follow are three basic approaches for enhancing thermal performance: • Improving the power dissipation capability of the PCB design • Improving the thermal coupling of the component to the PCB by soldering the exposed thermal pad • Introducing airflow in the system For more details on how to use the thermal parameters in the dissipation ratings table, check the Thermal Characteristics Application Note and the Semiconductor and IC Package Thermal Metrics Application Note. Copyright © 2008–2020, Texas Instruments Incorporated Product Folder Links: TPS63030 TPS63031 Submit Documentation Feedback 17 TPS63030, TPS63031 SLVS696D – OCTOBER 2008 – REVISED APRIL 2020 www.ti.com 12 Device and Documentation Support 12.1 Device Support 12.1.1 Third-Party Products Disclaimer TI'S PUBLICATION OF INFORMATION REGARDING THIRD-PARTY PRODUCTS OR SERVICES DOES NOT CONSTITUTE AN ENDORSEMENT REGARDING THE SUITABILITY OF SUCH PRODUCTS OR SERVICES OR A WARRANTY, REPRESENTATION OR ENDORSEMENT OF SUCH PRODUCTS OR SERVICES, EITHER ALONE OR IN COMBINATION WITH ANY TI PRODUCT OR SERVICE. 12.2 Documentation Support 12.2.1 Related Documentation For related documentation see the following: Texas Instruments, Thermal Characteristics Application Note 12.3 Related Links The table below lists quick access links. Categories include technical documents, support and community resources, tools and software, and quick access to sample or buy. Table 5. Related Links PARTS PRODUCT FOLDER SAMPLE & BUY TECHNICAL DOCUMENTS TOOLS & SOFTWARE SUPPORT & COMMUNITY TPS63030 Click here Click here Click here Click here Click here TPS63031 Click here Click here Click here Click here Click here 12.4 Support Resources TI E2E™ support forums are an engineer's go-to source for fast, verified answers and design help — straight from the experts. Search existing answers or ask your own question to get the quick design help you need. Linked content is provided "AS IS" by the respective contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of Use. 12.5 Trademarks E2E is a trademark of Texas Instruments. All other trademarks are the property of their respective owners. 12.6 Electrostatic Discharge Caution These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates. 12.7 Glossary SLYZ022 — TI Glossary. This glossary lists and explains terms, acronyms, and definitions. 13 Mechanical, Packaging, and Orderable Information The following pages include mechanical, packaging, and orderable information. This information is the most current data available for the designated devices. This data is subject to change without notice and revision of this document. For browser-based versions of this data sheet, refer to the left-hand navigation. 18 Submit Documentation Feedback Copyright © 2008–2020, Texas Instruments Incorporated Product Folder Links: TPS63030 TPS63031 PACKAGE OPTION ADDENDUM www.ti.com 30-Mar-2020 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan Lead/Ball Finish MSL Peak Temp (2) (6) (3) Op Temp (°C) Device Marking (4/5) TPS63030DSKR ACTIVE SON DSK 10 3000 Green (RoHS & no Sb/Br) NIPDAU Level-1-260C-UNLIM -40 to 85 CEE TPS63030DSKT ACTIVE SON DSK 10 250 Green (RoHS & no Sb/Br) NIPDAU Level-1-260C-UNLIM -40 to 85 CEE TPS63031DSKR ACTIVE SON DSK 10 3000 Green (RoHS & no Sb/Br) NIPDAU Level-1-260C-UNLIM -40 to 85 CEF TPS63031DSKT ACTIVE SON DSK 10 250 Green (RoHS & no Sb/Br) NIPDAU Level-1-260C-UNLIM -40 to 85 CEF TPS63031DSKTG4 ACTIVE SON DSK 10 250 Green (RoHS & no Sb/Br) NIPDAU Level-1-260C-UNLIM -40 to 85 CEF (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may reference these types of products as "Pb-Free". RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption. Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of