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TPS650830
SLVSCF4A – DECEMBER 2014 – REVISED JULY 2016
TPS650830 Simple and Flexible Wide Input Voltage PMU for Mobile Computers
1 Device Overview
1.1
Features
1
• 5 Reconfigurable Voltage Regulators:
– High Efficiency over a Wide Input Voltage and
Wide Output Current Range
– Voltage, Current, and Sequence can be
Changed to Optimize the System
– 4 Variable Output Voltage Step-Down
Controllers using External Power MOSFETs:
• VR1 = 1 V; VR3 = 3.3 V , VR4 = 1.2 V/1.35
V/1.1 V for DDRx VDDQ , VR5 = 5 V
• VIN Range from 5.4 V to 24 V
– 1 Variable Output Voltage Step-Down Converter
with Internal Power MOSFETs:
• VR2 = 1.8 V
• VIN Range from 3 V to 3.6 V
• Up to 2 A of Continuous Output Current
– Output Voltage DC Accuracy ±1%; with
Differential Output Voltage Sensing
– Ultra Low Quiescent Current Mode, Typical 30µA Quiescent Current per Controller or
Converter
• 3 Fixed LDO Voltage Regulators:
– LDO1: Fixed Output Voltage LDO for DDRx VTT
(Vout = VDDQ/2)
• Up to 1 A of Continuous Output Current,
1.2
•
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•
•
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•
•
•
Applications
NVDC or Non-NVDC
2, 3, or 4 Series-Cell Li Battery Powered Products
1.3
•
DC+AC Accuracy ±5%, 2 A Peak
– LDO3: 3.3-V Fixed Output Voltage LDO, DC
Accuracy ±1%, < 40 mA
• High Precision Reference Supply for
External ADC
• 3.3-V Load Switch for EC_VCC Rail
– LDO5: 5-V Fixed Output Voltage LDO, DC
Accuracy ±1%, < 100 mA
• Automatic Switch to 5-V Regulator for Higher
Efficiency
7 Powergood Comparators and Sequence Logic
for External Voltage Regulators, Load Switches, or
LDOs
Power-Button Logic Supported with Programmable
Response Time
3 General Purpose Level Shifters
Backup Battery / 3.1-V LDO Selector Output for
RTC
Power Source Detection and Monitoring: Adapter,
Battery1, Battery2
Board Temperature Monitoring
1-Hz EC-Wake Clock Output
Advanced System Reset Control
I2C Interface: Standard-Mode (100 kHz), FastMode (400 kHz), Fast-Mode Plus (1000 kHz)
•
•
Tablet, Ultrabook, 2in1, and Notebook Computers
Mobile PC's, All-in-Ones, Mobile Internet Devices
Description
The TPS650830 is a single-chip solution Power Management IC designed specifically for the latest Intel
Processors targeted for Tablets, Ultrabooks, and Notebooks with NVDC or non-NVDC power
architectures, using 2S, 3S, or 4S Lithium-Ion battery packs.
The TPS650830 is used for Volume systems with the low voltage rails merged for the smallest footprint
and lowest cost system power solution.
The TPS650830 can provide the complete power solution based on the Intel Reference Designs. Five
highly efficient step-down voltage regulators (VRs) and a sink/source LDO, are used along with power-up
sequence logic managing external load switches to provide the proper power rails, sequencing, and
protection - including DDR3 and DDR4 memory power. The regulators support dynamic voltage scaling
(DVS) for maximum efficiency including Connected Standby. The high frequency voltage regulators use
small inductors and capacitors to achieve a small solution size. Output power is adjustable on four VR
controllers. An I2C interface allows simple control by the embedded controller (EC). Each version is
available in a 7x7 NFBGA package and a 9x9 NFBGA package. The 7x7 NFBGA package can be used in
Type 4 PCB boards for the smallest area implementation. The 9x9 NFBGA package can be used in Type
3 and Type 4 PCB boards allowing to minimize cost and area.
1
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.
TPS650830
SLVSCF4A – DECEMBER 2014 – REVISED JULY 2016
www.ti.com
For the Skylake and Kabylake Power Map implementation, the five PMIC voltage regulators and LDO1 are
assigned with the low-voltage rails merged or split according to the configuration. For the Volume (merged
low voltage rails) configuration six external load switches are controlled and monitored by using six
powergood comparator logic blocs.
Device Information
PART NUMBER
PACKAGE
TPS650830
(1)
1.4
(1)
BODY SIZE (NOM)
NFBGA (168)
7.00 mm x 7.00 mm
NFBGA (159)
9.00 mm x 9.00 mm
For more information, see Section 11, Mechanical Packaging and Orderable Information.
Simplified System Diagram
TPS650830 PMIC
Non-NVDC
ADAPTOR
FET FET
VBATA
FET
CHARGER
NVDC
VR5, 5V
FET
FET
VR3, 3.3V
FET
FET
FET
FET
+
LOAD
SWITCH
BAT1
-
LOAD
SWITCH
FET
FET
LOAD
SWITCH
+
VR2, 1.8V
BAT2
LOAD
SWITCH
-
SKYLAKE/
KABYLAKE
PLATFORM
LOAD
SWITCH
VR1, 1V
FET
FET
LOAD
SWITCH
VR4, 1.2V
FET
FET
LDO1, 0.6V
RTC, 3.1V
+
I/O
-
I2C
Copyright © 2016, Texas Instruments Incorporated
Figure 1-1. Simplified System Diagram
2
Device Overview
Copyright © 2014–2016, Texas Instruments Incorporated
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Product Folder Links: TPS650830
TPS650830
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SLVSCF4A – DECEMBER 2014 – REVISED JULY 2016
Table of Contents
1
Device Overview ......................................... 1
Register Map ........................................ 75
Features .............................................. 1
1.2
Applications ........................................... 1
7.1
Application Information
1.3
Description ............................................ 1
7.2
Typical Application ................................. 127
1.4
Simplified System Diagram ........................... 2
..................................
...................................
Power Supply Recommendations .................
Layout ...................................................
9.1
Layout Guidelines ..................................
9.2
Layout Example ....................................
9.3
Thermal Considerations ...........................
Device and Documentation Support ..............
10.1 Device Support.....................................
10.2 Documentation Support ............................
10.3 Receiving Notification of Documentation Updates.
10.4 Community Resources.............................
10.5 Trademarks ........................................
10.6 Electrostatic Discharge Caution ...................
10.7 Glossary............................................
2
3
4
Revision History ......................................... 3
Device Options ........................................... 6
Pin Configuration and Functions ..................... 7
5
Specifications ........................................... 14
4.1
5.1
7
8
9
Pin Functions ......................................... 9
Absolute Maximum Ratings ......................... 14
........................................
5.3
Recommended Operating Conditions ...............
5.4
Thermal Information .................................
5.5
Electrical Characteristics ............................
5.6
Timing Requirements ...............................
5.7
Typical Characteristics ..............................
Detailed Description ...................................
6.1
Overview ............................................
6.2
Functional Block Diagram ...........................
6.3
Feature Description .................................
6.4
Device Functional Modes ...........................
6.5
Programming .......................................
5.2
6
6.6
1.1
ESD Ratings
16
16
18
18
43
46
50
50
51
52
70
10
Application and Implementation ................... 127
7.3
System Example
7.4
Do's and Don'ts
............................
127
142
142
143
144
144
146
148
149
149
149
149
149
149
149
149
11 Mechanical, Packaging, and Orderable
Information ............................................. 150
11.1
Packaging Information ............................. 150
72
2 Revision History
Changes from Original (December 2014) to Revision A
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•
Page
Changed from data sheet format to data manual format ........................................................................ 1
Changed Applications ............................................................................................................... 1
Changed Skylake to Skylake and Kabylake throughout data manual ......................................................... 2
Added Device Options section ...................................................................................................... 6
Changed pinout diagrams ........................................................................................................... 7
Added TYPE column to pin functions tables ...................................................................................... 9
Added Switch pins - controllers (transient 1.05V in bit 6:3 description in Table 6-48 ................................................................ 111
Changed ? 1V to >1.05V in bit 6:3 description in Table 6-49 ................................................................ 112
Changed ? 1V to >1.05V in bit 6:3 description in Table 6-50 ................................................................ 113
Changed ? 1V to >1.05V in bit 6:3 description in Table 6-51 ................................................................ 114
Revision History
Copyright © 2014–2016, Texas Instruments Incorporated
Submit Documentation Feedback
Product Folder Links: TPS650830
TPS650830
www.ti.com
•
•
•
•
•
•
SLVSCF4A – DECEMBER 2014 – REVISED JULY 2016
Changed ? 1V to >1.05V in bit 6:3 description in Table 6-52 ................................................................
Changed ? 1V to >1.05V in bit 6:3 description in Table 6-53 ................................................................
Changed O to Ω in bit 7 description in Table 6-54 ...........................................................................
Changed ? 1V to >1.05V in bit 6:3 description in Table 6-54 ................................................................
Changed O to Ω in bit 0 description in Table 6-59 ...........................................................................
Deleted last two paragraphs and equation from Section 7.2.2.1.2 .........................................................
Revision History
Copyright © 2014–2016, Texas Instruments Incorporated
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Product Folder Links: TPS650830
115
116
117
117
122
130
5
TPS650830
SLVSCF4A – DECEMBER 2014 – REVISED JULY 2016
www.ti.com
3 Device Options
Table 3-1. Voltage Regulator and Powergood Comparator Logic Assignment for Skylake and Kabylake
Platforms
SWITCHING
FREQUENCY,
Fsw
NVDCZ = 1 / 0
LPM
VOLTAGE,
Vout
Default
POWER
GOOD
OUTPUT
SETTING,
(PGVRx or
PGx is PP or
OD)
TPS650830
Skylake and Kabylake PLATFORM POWER
SYSTEM VOLTAGE RAIL
VOLUME (Merged Low Voltage Rails)
OUTPUT
VOLTAGE, Vout
DEFAULT, or
COMPARATOR
INPUT
VR1
V1.00A / V 0.85A
1.00 V
500 kHz / 800
kHz
LPM = 1.00 V
PP
VR2
V1.8A
1.8 V
2 MHz / 2 MHz
LPM = 1.8 V
PP
LPM = 3.3 V
PP
VR3
V3.3A_DSW
3.3 V
800 kHz / 800
kHz
VR4
V1.2U
1.2 V,1.35 V,1.1
V
500 kHz / 800
kHz
LPM = 1.2
V,1.35 V,1.1
V
OD
VR5
V5A_DS3
5V
800 kHz / 800
kHz
LPM = 5.0 V
PP
LDO1
V0.6Dx
0.6 V, 0.675 V,
0.55 V
-
LPM =
DDR_VTT_
CTRL = Off
NA
External
VR_a
none
-
-
-
--
External
VR_b
none
-
-
-
--
Powergood
Comparator
Logic a
V3.3A_PCH Enable/Sense External Load Switch
3.3 V,
Comparator
Analog Input
–
–
PP
Powergood
Comparator
Logic b
V1.8U_2.5U Enable/Sense External Load Switch
1.8 V,
Comparator
Analog Input
–
–
PP
Powergood
Comparator
Logic c
Generic Comparator
- Comparator
Disabled
–
–
-
Powergood
Comparator
Logic d
VCCIO Enable/Sense External Load Switch
1.00 V,
Comparator
Analog Input
–
–
PP
Powergood
Comparator
Logic e
V3.3S Sense External Load Switch
3.3 V,
Comparator
Analog Input
–
–
PP
Powergood
Comparator
Logic f
V1.8S Sense External Load Switch
1.8 V,
Comparator
Analog Input
–
–
PP
Powergood
Comparator
Logic g
V1.0S Sense External Load Switch
1.00 V,
Comparator
Analog Input
–
–
OD
6
Device Options
Copyright © 2014–2016, Texas Instruments Incorporated
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Product Folder Links: TPS650830
TPS650830
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SLVSCF4A – DECEMBER 2014 – REVISED JULY 2016
4 Pin Configuration and Functions
D
E
F
G
H
J
K
L
M
N
13
A13
NC
B13
VBATTBK
UP
C13
V3P3A_RT
C
D13
AGND4
E13
VREGVR2
F13
VINVR2
G13
PGNDVR2
H13
SWVR2
J13
END
K13
DS3_VREN
L13
AGND3
M13
VDDIO
N13
NC
12
A12
DRVHVR3
B12
ENA
C12
ENC
D12
PMIC_INT
#
E12
PGVR2
F12
VINVR2
G12
PGNDVR2
H12
SWVR2
J12
ENF
K12
DPWROK
L12
LVA
M12
ENVR1
N12
DRVHVR1
11
A11
SWVR3
B11
VBSTVR3
C11
ENB
D11
ACOK
E11
PCH_PWR
OK
F11
ENVR2
G11
ALL_SYS_P
WRGD
H11
SYS_PWR
OK
J11
RSMRST#_
PWRGD
K11
1HZ
L11
ENH
M11
VBSTVR1
N11
SWVR1
10
A10
PGNDVR3
B10
ENG
C10
FBVR3
D10
ILIMVR3H
S
E10
FBVR2N
F10
ENE
G10
FBVR2P
H10
TRIP#
J10
VSG
K10
FBVR1P
L10
LVB
M10
VREGVR1
N10
PGNDVR1
9
A9
DRVLVR3
B9
PGVR1
C9
ILIMVR3LS
D9
STANDBY#
E9
ENVR3
F9
VINLDO1S
G9
VINVR3
H9
NVDC#
J9
FBVR1N
K9
VSB
L9
ILIMVR1
M9
PGVR1
N9
DRVLVR1
8
A8
VOUTLDO
1
B8
VOUTLDO
1
C8
RESET#
D8
FBLDO1
E8
VSF
F8
AGND
G8
AGND
H8
AGND
J8
AGND
K8
VSC
L8
VDDLV
M8
VINLDO3
N8
LDO3V
7
A7
PGNDLDO
1
B7
PGNDLDO
1
C7
SHUTDWO
N#
D7
FBVR3N
E7
VSA
F7
AGND
G7
AGND
H7
AGND
J7
AGND
K7
AGND
L7
VINVR5
M7
VOUT3V3
SW
N7
LDO5V
6
A6
VINLDO1
B6
VINLDO1
C6
PGC
D6
PGA
E6
VSD
F6
AGND
G6
AGND
H6
AGND
J6
AGND
K6
AGND
L6
ENLVA
M6
PGH
N6
VIN
5
A5
DRVLVR4
B5
PGVR4
C5
PGB
D5
FBVR4N
E5
VINPP
F5
VSH
G5
AGND
H5
AGND
J5
AGND
K5
ILIMVR5H
S
L5
ILIMVR5LS
M5
EN5VSW
N5
VIN5VSW
4
A4
PGNDVR4
B4
VREGVR4
C4
PGE
D4
DDRID
E4
VCCST_P
WRGD
F4
VSE
G4
FBVR5P
H4
PGF
J4
VCOMP
K4
EN_ONOF
F#
L4
FBVR5N
M4
PGVR5
N4
DRVLVR5
3
A3
SWVR4
B3
VBSTVR4
C3
FBVR4P
D3
VPROGOT
P
E3
DDR_VTT_
CTRL
F3
PGG
G3
VDCSNS
H3
PGD
J3
EC_RST#
K3
EN3V3SW
L3
SLAVEADD
R
M3
VBSTVR5
N3
PGNDVR5
2
A2
DRVHVR4
C2
ENVR4
D2
ILIMVR4
E2
ACIN
F2
BAT1SWO
N#
G2
BAT2SWO
N#
H2
PWRBTNI
N
J2
ACSWON#
K2
PCH_PWR
BTN#
L2
TEMP_ALE
RT#
M2
ENVR5
N2
SWVR5
1
A1
NC
C1
AGND1
D1
VDDPG
E1
VDDIO
F1
BAT1
G1
BAT2
H1
SDA
J1
SCLK
K1
AGND2
L1
ECVCC
M1
DRVHVR5
N1
NC
VR4
LDO1
VR3
C
B1
VREF1V25
VR5
B
VR1
A
Legend
Color
Type
Power
Critical
Analog /
Sensitve
Digital
AGND
No
Connect
Figure 4-1. 168-Pin 7x7 ZAJ NFBGA (Top View)
Pin Configuration and Functions
Copyright © 2014–2016, Texas Instruments Incorporated
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7
TPS650830
SLVSCF4A – DECEMBER 2014 – REVISED JULY 2016
www.ti.com
VR2
C
D
E
F
G
H
J
K
L
M
N
P
R
T
16
A16
NC
B16
NC
C16
VBATTBK
UP
D16
V3P3A_RT
C
E16
AGND4
F16
RSMRST#_
PWRGD
G16
VREGVR2
H16
VINVR2
J16
PGNDVR2
K16
SWVR2
L16
END
M16
DS3_VREN
N16
AGND3
P16
VDDIO
R16
NC
T16
NC
15
A15
NC
B15
ENA
H15
VINVR2
J15
PGNDVR2
K15
SWVR2
R15
ENVR1
T15
NC
14
A14
DRVHVR3
R14
VBSTVR1
T14
DRVHVR1
13
A13
SWVR3
12
A12
PGNDVR3
11
A11
DRVLVR3
10
A10
PGB
9
A9
VOUTLDO
1
B9
VOUTLDO
1
8
A8
PGNDLDO
1
B8
PGNDLDO
1
7
A7
VINLDO1
B7
VINLDO1
6
A6
DRVLVR4
5
A5
PGNDVR4
4
A4
SWVR4
3
A3
DRVHVR4
2
A2
NC
B2
ENVR4
C2
DDRID
1
A1
NC
B1
NC
C1
VCCST_P
WRGD
F15
ALL_SYS_P
WRGD
D15
ENC
E14
PMIC_INT
#
C14
ENG
B13
VBSTVR3
D13
ENB
B11
PGVR3
F13
ACOK
D11
ENVR3
C10
STANDBY#
G12
FBVR2N
E10
ILIMVR3LS
C8
SHUTDOW
N#
D7
PGC
C6
PGVR4
E6
FBVR4N
E4
DDR_VTT_
CTRL
C4
VBSTVR4
D3
VPROGOT
P
E1
AGND1
F1
VDDIO
G1
VDCSNS
K3
BAT2SWO
N#
J1
BAT2
L1
EN3V3SW
R4
VBSTVR5
N2
PCH_PWR
BTN#
M1
SCLK
N1
AGND2
P1
ECVCC
T6
DRVLVR5
T5
PGNDVR5
P3
TEMP_ALE
RT#
M3
ACSWON#
L2
PWRBTNI
N
K1
SDA
P5
ENLVA
N4
SLAVEADD
R
T8
VIN
T7
VIN5VSW
R6
PGVR5
N6
ILIMVR5LS
L4
EC_RST#
J2
BAT1SWO
N#
H1
BAT1
P7
EN5VSW
M5
EN_ONOF
F#
J4
PGD
G2
VDDPG
D1
VREF1V25
L6
VCOMP
T10
LDO3V
T9
LDO5V
R8
PGH
N8
VINVR5
K5
PGF
H3
ACIN
P9
VOUT3V3
SW
M7
ILIMVR5H
S
J6
FBVR5P
G4
PGG
F3
ILIMVR4
L8
VSC
T12
PGNDVR1
T11
DRVLVR1
R10
VINLDO3
N10
VDDLV
K7
VSG
H5
FBVR5N
P11
PGVR1
M9
VSB
J8
VSF
G6
VSE
F5
FBVR4P
L10
VSD
T13
SWVR1
R12
VREGVR1
N12
LVB
M11
ILIMVR1
K9
NVDC#
H7
VINPP
P13
ENH
VR5
D5
PGE
K11
FBVR1N
H9
VINLDO1S
F7
VSA
L12
TRIP#
J10
FBVR1P
G8
VSH
N14
LVA
M13
1HZ
J12
ENE
G10
FBVR2P
E8
FBVR3N
L14
ENF
K13
SYS_PWR
OK
H11
VINVR3
F9
FBLDO1
M15
DPWROK
J14
ENVR2
H13
PGVR2
F11
FBVR3P
D9
RESET#
B5
VREGVR4
G14
PCH_PWR
OK
E12
ILIMVR3H
S
C12
PGA
VR4
LDO1
VR3
B
VR1
A
T4
SWVR5
T3
DRVHVR5
R2
ENVR5
T2
NC
R1
NC
T1
NC
Legend
Color
Type
Power
Critical
Analog /
Sensitve
Digital
AGND
No
Connect
Figure 4-2. 159-Pin 9x9 ZCG NFBGA (Top View)
8
Pin Configuration and Functions
Copyright © 2014–2016, Texas Instruments Incorporated
Submit Documentation Feedback
Product Folder Links: TPS650830
TPS650830
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4.1
SLVSCF4A – DECEMBER 2014 – REVISED JULY 2016
Pin Functions
Table 4-1. Pin Functions
PIN
NAME
ZAJ
PACKAGE
NUMBER
ZCG
PACKAGE
NUMBER
I/O
TYPE (1)
ACIN
E2
H3
I
AS
DESCRIPTION
AC Adaptor voltage sense
ACOK
D11
F13
I
D
ACOK input
ACSWONZ
J2
M3
O
D
AC adaptor switch ON power-path (Open-drain output) (active low)
AGND
F8, G8, H8,
J8, F7, G7,
H7, J7, K7,
F6, G6, H6,
J6, K6, G5,
H5, J5
-
-
A
Analog GND - tie directly to the ground plane
AGND1
C1
E1
-
A
Analog GND1 - tie directly to the ground plane
AGND2
K1
N1
-
A
Analog GND2 - tie directly to the ground plane
AGND3
L13
N16
-
A
Analog GND3 - tie directly to the ground plane
AGND4
D13
E16
-
A
Analog GND4 - tie directly to the ground plane
ALL_SYS_PWRGD
G11
F15
O
D
Non-core rails powergood, All PMIC and specified monitored VRs
power good (Open-drain output)
BAT1
F1
H1
I
AS
Battery 1 voltage sense input
BAT2
G1
J1
I
AS
Battery 2 voltage sense input
BAT1SWONZ
F2
J2
O
D
Battery 1 switch ON power-path (Open-drain output) (active low)
BAT2SWONZ
G2
K3
O
D
Battery 2 switch ON power-path (Open-drain output) (active low)
DDRID
D4
C2
I
D
VR4 Output voltage selection. Low = 1.2 V, High = 1.35 V, Float = 1.1
V.
DDR_VTT_CTRL
E3
E4
I
D
LDO1 Enable, and DVS control of VR4
Delayed version of V3.3A_DSW_PG (Open-drain output)
(1)
DPWROK
K12
M15
O
D
DRVHVR1
N12
T14
O
VR
VR1 High side gate drive output (external power FET)
DRVHVR3
A12
A14
O
VR
VR3 High side gate drive output (external power FET)
DRVHVR4
A2
A3
O
VR
VR4 High side gate drive output (external power FET)
DRVHVR5
M1
T3
O
VR
VR5 High side gate drive output (external power FET)
DRVLVR1
N9
T11
O
VR
VR1 Low side gate drive output (external power FET)
DRVLVR3
A9
A11
O
VR
VR3 Low side gate drive output (external power FET)
DRVLVR4
A5
A6
O
VR
VR4 Low side gate drive output (external power FET)
DRVLVR5
N4
T6
O
VR
VR5 Low side gate drive output (external power FET)
DS3_VREN
K13
M16
O
D
DS3 VR enable (enables external power switches) (Push-pull output)
ECVCC
L1
P1
I
AS
EC_ONOFFZ
K4
M5
O
D
EC VCC supply
Debounced version of PWRBTNIN (Open-drain output) (active low)
EC_RSTZ
J3
L4
O
D
EC reset (Open-drain output) (active low)
ENA
B12
B15
I
D
Enable for VSA powergood comparator
ENB
C11
D13
I
D
Enable for VSB powergood comparator
ENC
C12
D15
I
D
Enable for VSC powergood comparator
END
J13
L16
I
D
Enable for VSD powergood comparator
ENE
F10
J12
I
D
Enable for VSE powergood comparator
ENG
B10
C14
I
D
Enable for VSG powergood comparator
ENF
J12
L14
I
D
Enable for VSF powergood comparator
ENH
L11
P13
I
D
Input to Level Shifter B general purpose level shifter.
ENLVA
L6
P5
I
D
Enable level shifter A. Pin not used for TPS650830. Connect to
ground if unused. (Level Shifter A input is ACOK pin)
VR – VR Critical, AS – Analog Sensitive, D – Digital, A - AGND
Pin Configuration and Functions
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Table 4-1. Pin Functions (continued)
PIN
10
NAME
ZAJ
PACKAGE
NUMBER
ZCG
PACKAGE
NUMBER
I/O
TYPE (1)
ENVR1
M12
R15
I
D
VR1 Enable
ENVR2
F11
J14
I
D
VR2 Enable
ENVR3
E9
D11
I
D
VR3 Enable
ENVR4
C2
B2
I
D
VR4 Enable
ENVR5
M2
R2
I
D
VR5 Enable
DESCRIPTION
EN3V3SW
K3
L1
I
D
Enable for load switch from LDO3V pin to VOUT3V3SW output pin
EN5VSW
M5
P7
I
D
Enable Internal load switch from 5-V switching regulator to LDO5V
output through VIN5VSW. Connect to powergood of 5-V switching
regulator.
FBLDO1
D8
F9
I
AS
LDO1 Feedback voltage kelvin sense, (Connect to vout of LDO1 at
output load capacitor)
FBVR1N
J9
K11
I
AS
VR1 Negative feedback remote sense (Connect to GND of VR1 at
output load capacitor)
FBVR1P
K10
J10
I
AS
VR1 Positive feedback remote sense (Connect to vout of VR1 at
output load capacitor)
FBVR2N
E10
G12
I
AS
VR2 Negative feedback remote sense (Connect to GND of VR2 at
output load capacitor)
FBVR2P
G10
G10
I
AS
VR2 Positive feedback remote sense (Connect to vout of VR2 at
output load capacitor)
FBVR3N
D7
E8
I
AS
VR3 Negative feedback remote sense (Connect to GND of VR3 at
output load capacitor)
FBVR3P
C10
F11
I
AS
VR3 Positive feedback remote sense (Connect to vout of VR3 at
output load capacitor)
FBVR4N
D5
E6
I
AS
VR4 Negative feedback remote sense (Connect to GND of VR4 at
output load capacitor)
FBVR4P
C3
F5
I
AS
VR4 Positive feedback remote sense (Connect to vout of VR4 at
output load capacitor)
FBVR5N
L4
H5
I
AS
VR5 Negative feedback remote sense (Connect to GND of VR5 at
output load capacitor)
FBVR5P
G4
J6
I
AS
VR5 Positive feedback remote sense (Connect to vout of VR5 at
output load capacitor)
ILIMVR1
L9
M11
I
AS
VR1 Current limit setting, low-side FET valley current limit
ILIMVR3HS
D10
E12
I
AS
VR3 Current limit setting, high-side FET peak current limit
ILIMVR3LS
C9
E10
I
AS
VR3 Current limit setting, low-side FET valley current limit
ILIMVR4
D2
F3
I
AS
VR4 Current limit setting, low-side FET valley current limit
ILIMVR5HS
K5
M7
I
AS
VR5 Current limit setting, high-side FET peak current limit
ILIMVR5LS
L5
N6
I
AS
VR5 Current limit setting, low-side FET valley current limit
LDO3V
N8
T10
O
AS
3.3-V LDO used as a reference voltage, and as a pull-up supply.
LDO5V
N7
T9
O
AS
5-V internal supply used primarily for the gate drives
LVA
L12
N14
O
D
Level shifter A open-drain output, used for BC_ACOK output level
shifted to EC_VCC. Input is from ACOK pin
LVB
L10
N12
O
D
Level shifter B push-pull output, level shifted to VDDLV. Input is from
ENH pin
NVDC#
H9
K9
I
D
NVDC select [two-level: Low = NVDC, High = non-NVDC]. Connect
NVDC# to GND for NVDC, Connect NVDC# to LDO3V for non-NVDC
PCH_PWRBTNZ
K2
N2
O
D
Power button signal to PCH (Open-drain output) (active low)
PCH_PWROK
E11
G14
O
D
Core and Non Core powergood, Delayed version of
ALL_SYS_PWRGD, (Open-drain output)
PGA
D6
C12
O
D
Powergood comparator output, push-pull to VDDPG
PGB
C5
A10
O
D
Powergood comparator output, push-pull to VDDPG
Pin Configuration and Functions
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SLVSCF4A – DECEMBER 2014 – REVISED JULY 2016
Table 4-1. Pin Functions (continued)
PIN
NAME
ZAJ
PACKAGE
NUMBER
ZCG
PACKAGE
NUMBER
I/O
TYPE (1)
PGC
C6
D7
O
D
Powergood comparator output, push-pull to VDDPG
PGD
H3
J4
O
D
Powergood comparator output, push-pull to VDDPG
PGE
C4
D5
O
D
Powergood comparator output, push-pull to VDDPG
PGF
H4
K5
O
D
Powergood comparator output, push-pull to VDDPG
PGG
F3
G4
O
D
Powergood comparator output, open-drain output
Powergood comparator output, open-drain output
DESCRIPTION
PGH
M6
R8
O
D
PGNDLDO1
A7, B7
A8, B8
-
VR
LDO1 Power GND
PGNDVR1
N10
T12
-
VR
VR1 Power GND
PGNDVR2
G12, G13
J15, J16
-
VR
VR2 Power GND
PGNDVR3
A10
A12
-
VR
VR3 Power GND
PGNDVR4
A4
A5
-
VR
VR4 Power GND
VR5 Power GND
PGNDVR5
N3
T5
-
VR
PGVR1
M9
P11
O
D
VR1 powergood comparator output (Push-pull output)
PGVR2
E12
H13
O
D
VR2 powergood comparator output (Push-pull output)
PGVR3
B9
B11
O
D
VR3 powergood comparator output (Push-pull output)
PGVR4
B5
C6
O
D
VR4 powergood comparator output (Open-drain output)
PGVR5
M4
R6
O
D
VR5 powergood comparator output (Push-pull output)
PMIC_INTZ
D12
E14
O
D
PMIC to EC interrupt (Open-drain output) (active low)
PWRBTNIN
H2
L2
I
AS
RESETZ
C8
D9
O
D
Global disable output for external converters/power tree (active low)
RSMRSTZ_PWRGD
J11
F16
O
D
Resume Reset powergood (Open-drain output) (active low)
SCLK
J1
M1
I
D
I2C Clock
SDA
H1
K1
I/O
D
I2C Data
SHUTDOWNZ
C7
C8
I
D
Set shutdown mode (all supplies off) (active low)
SLAVEADDR
L3
N4
I
D
I2C Slave Address select (low = 0x30, high = 0x32, open = float =
0x34). Keep same connection during operation.
STANDBYZ
D9
C10
I
D
Set rails in standby when low (low power mode)
SWVR1
N11
T13
I
VR
VR1 Switch node connection
SWVR2
H12, H13
K15, K16
I
VR
VR2 Switch node connection
SWVR3
A11
A13
I
VR
VR3 Switch node connection
SWVR4
A3
A4
I
VR
VR4 Switch node connection
SWVR5
N2
T4
I
VR
VR5 Switch node connection
Power button input (internal pull-up to LDO3V) (active low)
SYS_PWROK
H11
K13
O
D
Delayed version of ALL_SYS_PWRGD (Open-drain output)
TEMP_ALERTZ
L2
P3
O
D
Open-drain output of silicon temperature sensor. Input to Power
Monitor Unit (connect to PROCHOT# of system). Active low,
recommended pull-up to V1.00S with 50 Ω.
VCOMP comparator push-pull output (active low)
TRIPZ
H10
L12
O
D
VBATTBKUP
B13
C16
I
AS
RTC backup battery supply connection
VBSTVR1
M11
R14
I
VR
VR1 Bootstrap pin
VBSTVR3
B11
B13
I
VR
VR3 Bootstrap pin
VBSTVR4
B3
C4
I
VR
VR4 Bootstrap pin
VBSTVR5
M3
R4
I
VR
VR5 Bootstrap pin
VCCST_PWRGD
E4
C1
O
D
VCOMP
J4
L6
I
AS
VCOMP comparator input
VDCSNS
G3
G1
I
AS
VDC voltage monitor
VCCST powergood (Open-drain output)
Pin Configuration and Functions
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Table 4-1. Pin Functions (continued)
PIN
NAME
ZAJ
PACKAGE
NUMBER
ZCG
PACKAGE
NUMBER
I/O
TYPE (1)
VDDIO
E1, M13
F1, P16
I
VR
Voltage supply input for I/O buffers. VDDIO should be tied to LDO3V
(3.3 V)
DESCRIPTION
VDDLV
L8
N10
I
VR
LVx buffer supply, sets output level for Level Shifter pins
VDDPG
D1
G2
I
VR
PGx supply, sets output level for PG pins for A-H, if PG pin is pushpull
VDD5 VPROGOTP
D3
D3
I
AS
Always connect to LDO5V. supply voltage for OTP programming
(must be connected to LDO5V in normal operation)
12
VIN
N6
T8
I
VR
IC input voltage
VINLDO1
A6, B6
A7, B7
I
VR
LDO1 Input supply
VINLDO3
M8
R10
I
VR
LDO3V input supply
VINLDO1S
F9
H9
I
AS
LDO1 Input voltage reference sense (Connect to vout of VR4 at
output load capacitor)
VINPP
E5
H7
I
AS
VIN for Power Path Domain. Connect to external diode OR from: AC,
BAT1, BAT2.
VINVR2
F12, F13
H15, H16
I
VR
VR2 Power Input voltage. Connect to a 3.3-V voltage regulator, such
as V3.3A_DSW .
VINVR3
G9
H11
I
AS
VR3 Input voltage sense and high-side current-sense (Kelvin connect
to drain of high-side FET)
VINVR5
L7
N8
I
AS
VR5 Input voltage sense and high-side current-sense (Kelvin connect
to drain of high-side FET)
VIN5VSW
N5
T7
I
VR
Internal load switch from 5-V switching regulator to LDO5Voutput.
Connect VIN5VSW to 5-V switching regulator output.
VOUTLDO1
A8, B8
A9, B9
O
VR
LDO1 Output voltage, VOUTLDO1 = (1/2 * VINLDO1SNS)
VOUT3V3SW
M7
P9
O
VR
EC domain load switch output and discharge path from LDO3V
VREF1V25
B1
D1
O
AS
Decoupling cap connection for internal voltage reference
VREGVR1
M10
R12
I
VR
5-V drive supply input (shorted on board with LDO5V), supply for VR1
and VR5
VREGVR2
E13
G16
I
VR
VR2 5-V drive supply input (shorted on board with LDO5V)
VREGVR4
B4
B5
I
VR
VR4 5-V drive supply input (shorted on board with LDO5V), shared
with VR3
VSA
E7
F7
I
AS
Powergood comparator input and discharge path for external rail
VSB
K9
M9
I
AS
Powergood comparator input and discharge path for external rail
VSC
K8
L8
I
AS
Powergood comparator input and discharge path for external rail
VSD
E6
L10
I
AS
Powergood comparator input and discharge path for external rail
VSE
F4
G6
I
AS
Powergood comparator input and discharge path for external rail
VSF
E8
J8
I
AS
Powergood comparator input and discharge path for external rail
VSG
J10
K7
I
AS
Powergood comparator input and discharge path for external rail
VSH
F5
G8
I
AS
Powergood comparator input and discharge path for external rail
V3P3A_RTC
C13
D16
O
AS
PCH RTC power supply
1HZ
K11
M13
O
D
1-Hz clock output for waking up embedded controller, EC.
Pin Configuration and Functions
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SLVSCF4A – DECEMBER 2014 – REVISED JULY 2016
Table 4-1. Pin Functions (continued)
PIN
ZAJ
PACKAGE
NUMBER
ZCG
PACKAGE
NUMBER
DEPOPULATED
BALL - FOR VIAS
No
Depopulate
d Balls for
Vias in 7x7.
Type 4 PC
put microvias under
each ball
pad
B3, B4, B6, DEP
B10, B12, OPU
B14, C3,
LAT
C5, C7, C9, ED
C11, C13,
BAL
C15, D2,
L
D4, D6, D8,
D10, D12,
D14, E2,
E3, E5, E7,
E9, E11,
E13, E15,
F2, F4, F6,
F8, F10,
F12, F14,
G3, G5, G7,
G9, G11,
G13, G15,
H2, H4, H6,
H8, H10,
H12, H14,
J3, J5, J7,
J9, J11,
J13, K2, K4,
K6, K8,
K10, K12,
K14, L3, L5,
L7, L9, L11,
L13, L15,
M2, M4,
M6, M8,
M10, M12,
M14, N3,
N5, N7, N9,
N11, N13,
N15, P2,
P4, P6, P8,
P10, P12,
P14, P15,
R3, R5, R7,
R9, R11,
R13,
-
VIA PLACEMENT FOR INTERNAL BALL ROUTES - For Type3
PCBs, put a plated through-hole (PTH) via at each depopulated ball,
to connect to the internal row balls.
DEPOPULATED
BALL - PICK-NPLACE INDICATOR
B2
C3 (also
DEP
used for via OPU
- see below) LAT
ED
BAL
L
-
PICK-N-PLACE INDICATOR
NC POPULATED
BALL - CORNERS
A1, A13,
N1, N13
A1, A2, B1,
A15, A16,
B16, R16,
T16, T15,
R1, T1, T2
-
CORNERS - solder to PCB for mechanical strength
NAME
I/O
POP
ULA
TED
BAL
L
TYPE (1)
DESCRIPTION
Pin Configuration and Functions
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5 Specifications
5.1
Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted) (1)
MIN
MAX
UNIT
CHIP
Power input pins
VIN, VINLDO3
-0.3
28
V
Analog ground pins
AGND1, AGND2, AGND3, AGND4, AGND (16 center pins)
-0.3
0.3
V
Input pins - controllers
VINVR3, VINVR5
-0.3
28
V
Switch pins - controllers
SWVR1 , SWVR3 , SWVR4 , SWVR5
-1
28
V
Switch pins - controllers (transient UVLO, 3.3-V and 5-V LDOs up,
Measured at the V3P3A_RTC pin with
respect to AGND. Place a 1-µF capacitor
at V3P3A_RTC. (Do not exceed 2 µF
actual capacitance).
I3v1LDO
Maximum 3V1 LDO output current
Maximum output current out of 3V3RTC.
IQ_bkup_no_Vsys
VBATTBKUP quiescent current,
when no adapter and no main
battery connected to system,
automatically VBATTBKUP
internally selected, internal 3.1-V
LDO automatically off
VVDC < UVLO, VBBC = 2.0 V to 3.0 V,
VVDC = 0 V
IQ_bkup_with_Vsys
VBATTBKUP quiescent current,
when adapter or main battery
connected to system, automatically VVDC > UVLO, VBBC = 2.0 V to 3.0 V,
VBATTBKUP internally not
VVDC = 7.4 V
selected, internal 3.1-V LDO
automatically on and selected.
(1)
42
3.0
3.1
3.2
V
1
mA
0.03
0.45
μA
0.15
0.85
μA
All values referred to VIH min and VIH max levels.
Specifications
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SLVSCF4A – DECEMBER 2014 – REVISED JULY 2016
Electrical Characteristics (continued)
Over recommended free-air temperature range and over recommended input voltage range (typical at an ambient
temperature range of 25°C) (unless otherwise noted)
PARAMETER
TEST CONDITIONS
External resistor in series with
backup battery
Rext_bkup
MIN
TYP
Place between backup battery and
VBATTBKUP pin, for limiting current out
of backup battery
MAX
UNIT
1
kΩ
I2C INTERFACE
VIL
SDA, SCL input low voltage
VIH
SDA, SCL input high voltage
Cb
0.4
V
SDA, SCL input current
Clamped on 3.3 V
0.01
0.3
SDA output low voltage
ISDA = 5 mA (using a 354 Ω or larger
external pull-up resistor)
0.04
0.4
Capacitive load for SDA and SCL
5.6
V
1.2
μA
V
400
pF
MAX
UNIT
Timing Requirements
PARAMETER
TEST CONDITIONS
MIN
TYP
I2C INTERFACE
tI2C_Rdy
Minimum time for I2C to be ready
after VIN > UVLO5V rising
Time after VIN rising above > VUVLO_5V_Main +
VHys_5V_Mainuntil OTP is loaded and I2C is
ready to communicate
1
Standard-mode
f(SCL)
SCL clock frequency
100
Fast-mode
400
Fast-mode Plus
Bus free time between a STOP and
START condition
tBUF
STA
tSU; STA
4.7
Fast-mode
1.3
Fast-mode Plus
0.5
tSU; DAT
tHD;
DAT
Data setup time
Data hold time
4
μs
ns
Fast-mode Plus
260
ns
Standard-mode
4.7
μs
Fast-mode
600
ns
Fast-mode Plus
260
ns
Standard-mode
250
Fast-mode
100
Rise time of SCL signal
50
Standard-mode
0
3.45
Fast-mode
0
0.9
Fast-mode Plus
0
Fast-mode
Fast-mode (using an 885 Ω or smaller external
pull-up resistor)
Fast-mode Plus (using a 354 Ω or smaller
external pull-up resistor)
300
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ns
1000
20
300
ns
120
Specifications
Copyright © 2014–2016, Texas Instruments Incorporated
μs
ns
120
Standard-mode (using a 2.95 kΩ or smaller
external pull-up resistor)
Rise time of SDA signal
μs
1000
20
Fast-mode Plus
trDA
ns
Fast-mode Plus
Standard-mode
trCL
μs
600
Hold time (repeated) START condition Fast-mode
Setup time for a repeated START
condition
kHz
1000
Standard-mode
Standard-mode
tHD;
ms
43
TPS650830
SLVSCF4A – DECEMBER 2014 – REVISED JULY 2016
www.ti.com
Timing Requirements (continued)
PARAMETER
TEST CONDITIONS
MIN
Standard-mode
tfDA
Fall time of SDA signal
44
Setup time for STOP condition
MAX
UNIT
300
Fast-mode
20 x (VDD /
5.5 V)
300
Fast-mode Plus
20 x (VDD /
5.5 V)
120
Standard-mode
tSU; STO
TYP
ns
4
µs
Fast-mode
600
ns
Fast-mode Plus
260
ns
Specifications
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SLVSCF4A – DECEMBER 2014 – REVISED JULY 2016
VOLUME Application Block Diagram:
VR1 = V1.00A (V11), & V085A (V12), VR2 = V1.8A (V8), VR3 = V33ADSW (V6),
VR4 = V1.2U (V10), VR5 = V5ADS3 (V5)
COMPA = V3.3A_PCH (V7), COMPB = V1.8U_2.5U (V9), COMPC = Generic Comparator,
COMPD = VCCIO (V4), COMPE = V3.3S, COMPF = V1.8S, COMPG = V1.00S
TPS650830 ± VOLUME
S5/S4
G3 ÆS5/S4
G3
VOL#1
S5/S4 Æ S0
VDC
(BAT/ADP
Insertion )
VREF1V25
UVLO3#
[UVLO2#_LDO3EN]
LDO3
LDO3_PG
UVLO5#
[UVLO1#_LDO5EN]
(Power On Dig Reset )
LDO5
LDO5_PGD
xxxx
xxxx
xxxx
1ms from UVLO5/Dig Reset to OTP Loaded
OTP_LOAD
I2C Ready
PMIC I2C
V3P3A_RTC 3.2V
[V3P3A_RTC] 2.0V
3.1V LDO
Vcoin_cell_battery
V3.3A_DSW_EN (V6)
[ENVR3] (Tie to LDO 3)
V33ADSW (V6)
[FBVR3P]
PG
V3.3A_DSW_PG (V6)
[PGVR3]
16ms
>10ms delay from PG
V3.3A_DSW to DPWROK
DPWROK
[DPWROK]
ext
V1.8A_EN (V8)
[ENVR2]
Assumes V1.8A enabled by DPWROK.
Could also be enabled by SLP _SUS# later.
V1.8A (V8)
[FBVR2P]
PG
V1.8A_PG
[PGVR2]
DPWROK to SLP_SUS# takes 95ms from PCH
95ms
SLP_SUS#
[ENE]
ext
V5ADS3_EN
[ENVR5]
V5ADS3_EN is copy of SLP _SUS#
DS3_VREN
[DS3_VREN]
xxx
xxx
xxx
xxx
xxx
xxx
xxx
xxx
xxx
xxx
xxx
DS3VREN is gated by
V5ADS3_EN ~ 1us delay
V5ADS3 (V5)
[FBVR5P]
PG
V5ADS3_PG
[PGVR5]
V5A_DS3_PG to V 1.00A_PG
10mSec
RSMRST#_PWRGD
[RSMRST#_PWRGD]
external
SLP_S4#
[ENB]
V1.8U_2.5U_EN
[PGB]
SLP_S4# to V1.8U_2.5U ramp =
0.5ms ” tdelay +tramp-up ” 2ms
[Load Sw turn-on time]
V1.8U_2.5U (V9)
[VSB]
ext
PG
V1.8U_2.5U_PG
[PMIC internal ]
V1.2U_EN
[ENVR4]
SLP_S4# to V1.2U ramp
>2.5ms
[4ms]
V1.2U (V10)
[FBVR4P]
PG
V1.2U_PG
[PGVR4]
SLP_S3#
[ENF] for powergood tree only
ext
V100S_EN
[ENG] ± to Load Switch
V1.00S
[VSG]
ext
PG
V1.00S_PG
[PGG]
V3.3S_EN
[ENG] ± to Load Switch
V3.3S
[VSE]
PG
V3.3S_PG
[PMIC internal ]
V1.8S_EN
[ENG] ± to Load Switch
ext
V1.8S
[VSF]
ext
PG
V1.8S_PG
[PGF]
ext
VCCIO_EN
[PGD] ± to Load Switch
SLP_S3# & V1.2U_PG & V1.00S_PG
[V1.2U_PG & V1.00S_PG open-drain
outputs drive same ENVR3 pin, with single
pull-up resistor]
No direct SLP_S3# connection
VCCIO (V4)
[VSD]
PG
VCCIO_PG
[PMIC internal ]
2ms (from the last PG )
ALL_SYS_PWRGD
[ALL_SYS_PWRGD]
1.00V
VCCST_PWRGD
[VCCST_PWRGD]
PCH_PWROK
[PCH_PWROK]
Prog
SYS_PWROK
[SYS_PWROK]
Prog
Figure 5-1. TPS650830 Volume Timing Diagram
Specifications
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5.7
www.ti.com
Typical Characteristics
1.05
1.89
Vin=5.40V
Vin=8.10V
Vin=8.70V
Vin=13.50V
1.04
1.03
1.85
1.84
VR2 Vout (V)
VR1 Vout (V)
1.02
1.01
1.00
0.99
1.82
1.80
1.78
0.98
1.76
0.97
1.75
0.96
1.73
0.95
1.71
0 0.5 1 1.5 2 2.5 3 3.5 4 4.5 5 5.5 6 6.5 7
Iout (A)
D001
0
1.5
2
2.5
D001
1.272
Vin=5.40
Vin=8.10
Vin=8.70
Vin=13.50
3.432
3.399
Vin=5.40V
Vin=8.10V
Vin=8.70V
Vin=13.50V
1.260
1.248
1.236
3.366
1.224
VR4 Vout (V)
VR3 Vout (V)
1
Figure 5-3. VR2 Output Voltage Load Regulation, NVDC
3.465
3.333
3.300
3.267
1.212
1.200
1.188
3.234
1.176
3.201
1.164
3.168
1.152
3.135
1.140
0
1
2
3
4
5
6
Iout (A)
7
0
1
2
3
D001
Figure 5-4. VR3 Output Voltage Load Regulation, NVDC
4
Iout (A)
5
6
7
8
D001
Figure 5-5. VR4 Output Voltage Load Regulation, NVDC
5.25
100
Vin=5.40V
Vin=8.10V
Vin=8.70V
Vin=13.50V
5.20
5.15
90
80
VR1 Efficiency (%)
5.10
VR5 Vout (V)
0.5
Iout (A)
Figure 5-2. VR1 Output Voltage Load Regulation, NVDC
5.05
5.00
4.95
4.90
70
60
50
40
30
4.85
20
4.80
10
4.75
Vin=5.40V
Vin=8.10V
Vin=8.70V
Vin=13.50V
0
0
0.5
1
1.5
2
Iout (A)
2.5
3
3.5
4
0
1
D001
Figure 5-6. VR5 Output Voltage Load Regulation, NVDC
46
Vin=2.97
Vin=3.30
Vin=3.63
1.87
2
3
4
Iout (A)
5
6
7
D001
Figure 5-7. VR1 Efficiency vs Load, NVDC
Specifications
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100
100
90
90
80
80
VR3 Efficiency (%)
VR2 Efficiency (%)
Typical Characteristics (continued)
70
60
50
40
30
10
0.0
0.5
1.0
1.5
2.0
50
40
30
Vin=5.40V
Vin=8.10V
Vin=8.70V
Vin=13.50V
10
0
0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0 6.5
Iout (A)
D001
2.5
Iout (A)
60
20
Vin=2.97V
Vin=3.30V
Vin=3.63V
20
70
D001
Figure 5-9. VR3 Efficiency vs Load, NVDC
100
100
90
90
80
80
70
70
VR5 Efficiency (%)
VR4 Efficiency (%)
Figure 5-8. VR2 Efficiency vs Load, NVDC
60
50
40
30
Vin=5.40V
Vin=8.10V
Vin=8.70V
Vin=13.50V
20
10
1
2
3
4
Iout (A)
5
6
50
40
30
Vin=5.40V
Vin=8.10V
Vin=8.70V
Vin=13.50V
20
10
0
0
60
0
0.00
7
Figure 5-10. VR4 Efficiency vs Load, NVDC
1.00
1.50
2.00
Iout (A)
2.50
3.00
3.50
D001
Figure 5-11. VR5 Efficiency vs Load, NVDC
900000
800000
800000
700000
700000
600000
600000
VR3 fsw (Hz)
VR1 fsw (Hz)
0.50
D001
500000
400000
300000
100000
400000
300000
200000
Vin=5.40V
Vin=8.10V
Vin=8.70V
Vin=13.50V
200000
500000
Vin=5.40V
Vin=8.10V
Vin=8.70V
Vin=13.50V
100000
0
0
0
1
2
3
4
Iout (A)
5
6
7
0
0.5
D001
Figure 5-12. VR1 Switching Frequency vs Load, NVDC
1
1.5
2
2.5
3 3.5
Iout (A)
4
4.5
5
5.5
6
6.5
D001
Figure 5-13. VR3 Switching Frequency vs Load, NVDC
Specifications
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Typical Characteristics (continued)
800000
800000
700000
700000
600000
600000
VR5 fsw (Hz)
500000
400000
300000
Vin=5.40V
Vin=8.10V
Vin=8.70V
Vin=13.50V
200000
100000
500000
400000
300000
200000
100000
0
0
1
2
3
4
Iout (A)
5
6
0
7
0
2.00
0.75
3
0.50
2
0.25
1
0.00
Vout VR2 (V)
4
Iout (VR1) Actual (A)
Vout VR1 (V)
1.00
2
3
4
5
6
Iout (VR1) Programmed (A)
7
2.5
3
3.5
D001
3.5
8
3.0
2.0
2.5
1.6
2.0
1.2
1.5
0.8
1.0
0.4
0.5
0.0
0.0
0
1
2
Iout (A)
Vout (Vin=2.97V)
Vout (Vin=3.30V)
Vout (Vin=3.63V)
Iout (Vin=2.97V)
Iout (Vin=3.30V)
Iout (Vin=3.63V)
2.4
6
5
1.5
2.8
7
1.25
0
1
Figure 5-15. VR5 Switching Frequency vs Load, NVDC
8
Vout (Vin=5.4V)
Vout (Vin=8.7V)
Vout (Vin=15V)
Vout (Vin=24V)
Iout (Vin=5.4V)
Iout (Vin=8.7V)
Iout (Vin=15V)
Iout (Vin=24V)
1.50
0.5
D001
Figure 5-14. VR4 Switching Frequency vs Load, NVDC
1.75
Vin=5.40V
Vin=8.10V
Vin=8.70V
Vin=13.50V
0.5
1.0
1.5
2.0
2.5
Iout(VR2) Programmed (A)
D001
Iout(VR2) Actual (A)
VR4 fsw (Hz)
900000
0.0
3.5
3.0
D001
Figure 5-16. VR1 Current Limit: Vout and Iout vs Load, Non-NVDC Figure 5-17. VR2 Current Limit: Vout and Iout vs Load, Non-NVDC
9
Vout (Vin=5.40V)
Vout (Vin=8.70V)
Vout (Vin=15.00V)
Vout (Vin=24.00V)
Iout (Vin=5.40V)
Iout (Vin=8.70V)
Iout (Vin=15.00V)
Iout (Vin=24.00V)
7
2.1
3.6
6
1.8
6
3
5
1.5
5
2.4
4
1.2
4
1.8
3
0.9
3
1.2
2
0.6
2
0.6
1
0.3
1
0
0
0
0
1
2
3
4
5
6
Iout (VR4) Programmed (A)
7
8
9
Vout VR4 (V)
2.4
4.2
Vout VR4 (V)
9
Vout (Vin=5.40V)
Vout (Vin=8.70V)
Vout (Vin=13.50V)
Vout (Vin=24.00V)
Iout (Vin=5.40V)
Iout (Vin=8.70V)
Iout (Vin=13.50V)
Iout (Vin=24.00V)
8
Iout (VR4) Actual (A)
4.8
2.7
8
7
Iout (VR4) Actual (A)
5.4
0
0
1
D001
2
3
4
5
6
Iout (VR4) Programmed (A)
7
8
9
D001
Figure 5-18. VR3 Current Limit: Vout and Iout vs Load, Non-NVDC Figure 5-19. VR4 Current Limit: Vout and Iout vs Load, Non-NVDC
48
Specifications
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Typical Characteristics (continued)
10
Vout VR5 (V)
7
0.675
3.5
3.0
5
2.5
4
2.0
3
1.5
2
1.0
1
0
0.0
0.700
4.0
6
0.5
0.5
1.0
1.5 2.0 2.5 3.0 3.5
Iout (VR5) Programmed (A)
4.0
4.5
Vin=1.05V
Vin=1.20V
Vin=1.35V
0.725
4.5
0.0
5.0
LDO1 Vout (V)
8
0.750
Iout (VR5) Actual (A)
9
5.0
Vout (Vin=5.40V)
Vout (Vin=8.70V)
Vout (Vin=13.50V)
Vout (Vin=24.00V)
Iout (Vin=5.40V)
Iout (Vin=8.70V)
Iout (Vin=13.50V)
Iout (Vin=24.00V)
0.650
0.625
0.600
0.575
0.550
0.525
0.500
0.475
-1.25
-1
-0.75 -0.5 -0.25 0 0.25
Iout (A)
0.5
0.75
1
1.25
D001
Positive current = sinking from load.
Negative current = sourcing to load.
Inherent droop reduces transient ripple response
D001
Figure 5-20. VR5 Current Limit: Vout and Iout vs Load, Non-NVDC
Figure 5-21. LDO1 Load Regulation: Vout vs Iout
Specifications
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6 Detailed Description
6.1
Overview
The TPS650830 is a single-chip solution Power Management IC designed specifically for the latest Intel
Processors targeted for Tablets, Ultrabooks, and Notebooks with NVDC or non-NVDC power
architectures, using 2S, 3S, or 4S Lithium-Ion battery packs.
The TPS650830 is used for Volume systems with the low voltage rails merged for the smallest footprint
and lowest cost system power solution.
The TPS650830 can provide the complete power solution based on the Intel Reference Designs. Five
highly efficient step-down voltage regulators (VRs) and a sink/source LDO, are used along with power-up
sequence logic managing external load switches to provide the proper power rails, sequencing, and
protection - including DDR3 and DDR4 memory power. The regulators support dynamic voltage scaling
(DVS) for maximum efficiency including Connected Standby. The high frequency voltage regulators use
small inductors and capacitors to achieve a small solution size. Output power is adjustable on four VR
controllers. An I2C interface allows simple control by the embedded controller (EC). Each version is
available in a 7x7 NFBGA package and a 9x9 NFBGA package. The 7x7 NFBGA package can be used in
Type 4 PCB boards for the smallest area implementation. The 9x9 NFBGA package can be used in Type
3 and Type 4 PCB boards allowing to minimize cost and area.
The Powergood Comparator Logic allows controlling and monitoring up to eight external load switches
within the sequence. All the VR and Load Switch Powergood signals are used in the Powergood Tree of
which the outputs are shown with open-drain outputs. Enable inputs allow connecting externally to set the
sequence, and it also allows using various Sleep Mode State signals. The STANDBYZ allows entering a
Deep Sleep Mode, in which the out put voltages of the voltage regulators can be reduced to save power
by DVS.
The Power Monitoring comparators are used to detect and monitor up to three input power sources
(adapter, battery1, battery2, or any other combination). Over temperature of the PMIC self-protects, and
outputs a Status output, TEMPALERTZ; plus there is a dedicated comparator that can monitor system
over temperature with multiple stacked PTC thermistors, or an NTC thermistor. The PMIC automatically
switches between an internal 3.1-V LDO when a power source is connected; or to a Backup Battery (Coin
Cell) when all power sources are removed. This output RTC rail is used to maintain the always-on RTC
rails for critical register data.
50
Detailed Description
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VDDIO
OD
TTL
PP
VDCSNS
PGVR4
VDDIO
EC_VCC
BAT2SWONZ
BAT1SWONZ
POWER MONITOR
HV
OD
ACIN
ACSWONZ
BAT2
BAT1
VINPP
EC_RSTZ
EC_ONOFFZ
PCH_PWRBTNZ
DPWROK
RSMRSTZ_PWRGD
PMIC_INTZ
TTL
VDDIO
HIV
VREF
RAM
VDDIO
TTL
TTL
PCH_PWROK
ALL_SYS_PWRGD
VDDIO
PWRBTNIN
ACOK
ECVCC
SHUTDOWNZ
STANDBYZ
1HZ
VCCST_PWRGD
SYS_PWROK
Functional Block Diagram
DS3_VREN
6.2
SLVSCF4A – DECEMBER 2014 – REVISED JULY 2016
OD/PP
VREGVR4
ILIMVR4
VDDIO
FBVR4N
PP
PPATH
LOGIC
VDDIO
RESETZ
PP
VSA
VSB
VSC
VSD
VSE
VSF
VSG
VSH
ENA
ENB
ENC
END
ENE
ENF
ENG
ENH
PGA
PGB
PGC
PGD
PGE
PGF
PGG
PGH
VDDPG
REF
PG
EN
VSET
EN/
PGOOD
LOGIC
VDDIO
DCH
VBSTVR4
DRVHVR4
SWVR4
DRVLVR4
PGNDVR4
VDDIO
TTL
ENVR4
TTL
SEQ
+
INTEL
AND
OEM
LOGIC
VDDIO
TTL
DDR_VTT_CTRL
VINDLO1S
VINLDO1[2X]
EN
EN
LOGIC
VDDPG
LDO1
SINK/SRC LDO VOUTLDO1[2X]
V0.6DX/0.675DX
FBLDO1
/0.525DX
Vout= (VR1)/2
1A max
PGNDLDO1[2X]
OD/PP
VINVR2 [2X]
ENLVA
SWVR2 [2X]
VR2
Converter
Out range:
0.85v-3.3v
Vout INTEL
PG
EN
VSET
TTL
VDDLVS
FBVR2P
VREGVR2
FBVR2N
OD/PP
LVB
PGNDVR2 [2X]
EN/
PGOOD
LOGIC
VDDLV
DIGCORE
VREGVR1
VDDIO
VDDIO
FBVR1P
DRVHVR1
SWVR1
ENVR2
TTL
VR1
Controller
Vout range
0.85v-5v
Vout INTEL
VBSTVR1
EN
VSET
V33ARTC
RTC
DIG
EN/
PGOOD
LOGIC
PG
DRVLVR1
VBATTBKUP
BACKUP
BATTERY
SELECTOR
OEM
VCOMP
PGNDVR1
V3P3A_RTC
TRIPZ
OD/PP
VCOMP
VDDIO
ENVR1
TTL
VDDIO
OD/PP
VINVR5
EN
VSET
FBVR3N
FBVR3P
VBSTVR3
DRVHVR3
VR5
Controller
Out range:
0.85v-5v
Vout INTEL
SWVR3
SWVR5
DRVLVR3
VDDIO
PGNDVR3
TTL
DRVLVR5
VREGVR1
PGNDVR5
ENVR3
VDDIO
OTP
PGA
PGB
PGC
PGD
3L
TTL
OD
REFSYS
VOUT3V3SW
AGND [4]
VINLDO3
DFT AND
AMUX
VPROGOTP
VDDIO [2X]
DIETEMP
SDA
OD
TTL
ENVR5
VIN
UVLO
SLAVEADDR
TTL
SCLK
VDDIO
VDDIO
ILIMVR5LS
TEMP_ALERTZ
VR3
Controller
Out range:
0.85v-5v
Vout INTEL
I2C AND
REGFILE
EN3V3SW
DRVHVR5
ILIMVR3LS
PG
EN
VSET
DTMODE
FBVR5P
VBSTVR5
VREGVR4
VINVR3
ILIMVR3HS
EN/
PGOOD
LOGIC
EN/
PGOOD
LOGIC
ILIMVR5HS
FBVR5N
NVDCZ
TTL
VDDIO
PGVR3
OD/PP
VDDIO
VDDIO
OD/PP
PGVR5
PGVR2
OD/PP
ILIMVR1
FBVR1N
PGVR1
DDRID
3L
VDDIO
VDDIO
LVA
FBVR4P
VR4
Controller
V12U/135U/
1.05U
Vout=1.05V1.2V
10A max
LDO5V
VREF1V25
LDO3V
VIN5VSW
SW EN5VSW
TTL
SW
TTL
EN3V3SW
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Detailed Description
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6.3
www.ti.com
Feature Description
6.3.1
Voltage Regulator Assignment and Powergood Comparator Logic Assignment
(External Voltage Regulator or Load Switch) for Skylake and Kabylake Platform
For the Skylake and Kabylake Power Map implementation, the five PMIC voltage regulators and LDO1 are
assigned with the low -voltage rails merged or split according to the configuration. For the Volume
(merged low voltage rails) configuration six external load switches are controlled and monitored by using
six powergood comparator logic blocs.
Table 6-1. Voltage Regulator and Powergood Comparator Logic Assignment for Skylake and Kabylake
Platforms
SWITCHING
FREQUENCY,
Fsw
NVDC# = 1 / 0
LPM
VOLTAGE,
Vout
DEFAULT
POWER
GOOD
OUTPUT
SETTING,
(PGVRx or
PGx is PP or
OD)
TPS650830
Skylake and Kabylake PLATFORM POWER
SYSTEM VOLTAGE RAIL
VOLUME (Merged Low Voltage Rails)
OUTPUT
VOLTAGE, Vout
DEFAULT, or
COMPARATOR
INPUT
VR1
V1.00A / V0.85A
1.00 V
500 kHz / 800
kHz
LPM = 1.00 V
PP
VR2
V1.8A
1.8 V
2 MHz / 2 MHz
LPM = 1.8 V
PP
LPM = 3.3 V
PP
VR3
V3.3A_DSW
3.3 V
800 kHz / 800
kHz
VR4
V1.2U
1.2 V,1.35 V,1.1
V
500 kHz / 800
kHz
LPM = 1.2
V,1.35 V,1.1
V
OD
VR5
V5A_DS3
5V
800 kHz / 800
kHz
LPM = 5.0 V
PP
LDO1
V0.6Dx
0.6 V, 0.675 V,
0.55 V
-
LPM =
DDR_VTT_C
TRL = Off
NA
External
VR_a
none
-
-
-
NA
External
VR_b
none
-
-
-
NA
Powergood
Comparator
Logic a
V3.3A_PCH Enable/Sense External Load Switch
3.3 V,
Comparator
Analog Input
–
–
PP
Powergood
Comparator
Logic b
V1.8U_2.5U Enable/Sense External Load Switch
1.8 V,
Comparator
Analog Input
–
–
PP
Powergood
Comparator
Logic c
Generic Comparator
-
–
–
--
Powergood
Comparator
Logic d
VCCIO Enable/Sense External Load Switch
1.00 V,
Comparator
Analog Input
–
–
PP
Powergood
Comparator
Logic e
V3.3S Sense External Load Switch
3.3 V,
Comparator
Analog Input
–
–
PP
Powergood
Comparator
Logic f
V1.8S Sense External Load Switch
1.8 V,
Comparator
Analog Input
–
–
PP
Powergood
Comparator
Logic g
V1.0S Sense External Load Switch
1.00 V,
Comparator
Analog Input
–
–
OD
52
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6.3.2
SLVSCF4A – DECEMBER 2014 – REVISED JULY 2016
Generic Powergood Window Comparator with Open-Drain Output
The generic powergood comparator monitors the output voltage to ensure it is within ±10% of the nominal
target voltage there is a 30-µs deglitch on both rising and falling edges of all comparators (converter,
controller, comparators). The open-drain output requires an external pull-up resistor - typically in the 100kΩ range. Open-Drain outputs can be combined to create an "AND" logic function.
GENERIC POWERGOOD COMPARATOR LOGIC
DIGITAL
FOR EXTERNAL VR or LOAD SW
ENABLE
QUALIFIED_
ENABLE
OD/ PP
ANALOG
COMP_PG_ENB
Logic A
0
Comp
1
Comp_ Mode
INPUT
En
Ref
ANA_ PGOOD
ANA_ PGOODL
From Digital
Type
0
1
0
DIG_ PGOOD
1
PGOOD
Deglitch
1
0
Logic B
OD / PP
COMP_PG_ Mode
Copyright © 2016, Texas Instruments Incorporated
Figure 6-1. Generic Powergood Window Comparator with Open-Drain Output
Detailed Description
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6.3.3
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Powergood Window Comparator
All the powergood comparators (converter, controller, comparators) can be configured for either OpenDrain outputs or Push-Pull outputs.
All the powergood comparators (converter, controller, comparators) in analog configuration monitors the
output voltage to ensure it is within ±10% of the nominal target voltage. A 30-µs deglitch exists on the
output of all the powergood comparators (converter, controller, comparators). The open-drain output
requires an external pull-up resistor - typically in the 100-kΩ range. Open-Drain outputs can be combined
to create an "AND" logic function. The push-pull output internally pulls up to VDDIO pin rail, or other noted
input rail. Care should be taken to minimize series impedance on the PCB and providing adequate bulk
and decoupling capacitance for the load switch rails. The Intel Skylake and Kabylake specification is ±5%
at each rail, including those provided by load switches, therefore the load switch rails are still protected for
±10% powergood, as required by Intel Skylake and Kabylake specification.
ENABLE
1.10*VREF
+
-
ENA
+
-
VSENSE
0.90*VREF
PWRGD
30us
deglitch
ENA
+
-
+
-
N
U
T
1.10*VREF
1.08*VREF
1.05*VREF
VO
VOUT
Copyright © 2016, Texas Instruments Incorporated
VREF
0.95*VREF
0.92*VREF
0.90*VREF
30us
PWRGD
30us
30us
Good
30us
Good
time
Figure 6-2. Powergood Window Comparator with Open-Drain Output
54
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VDDIO
ENABLE
1.10*VREF
+
-
ENA
VSENSE
0.90*VREF
P
+
-
PWRGD
30us
deglitch
ENA
+
-
+
-
N
U
T
1.10*VREF
1.08*VREF
1.05*VREF
VO
VOUT
Copyright © 2016, Texas Instruments Incorporated
VREF
0.95*VREF
0.92*VREF
0.90*VREF
30us
PWRGD
30us
30us
Good
30us
Good
time
Figure 6-3. Powergood Window Comparator with Push-Pull Output
6.3.4
3.3-V LDO and 3V3SW Load Switch
The LDO3V powers up when Vin_LDO3V pin goes above the UVLO3V threshold. The LDO3V powers the
internal digital blocks and analog blocks of the PMIC. It is also used as the positive rail of the powergood
comparator and level-shifter outputs. The 3V3 load switch is optional to connect or disconnect the
VOUT3V3SW output to a load. The load switch is enabled by the EN3V3SW pin.
Detailed Description
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LDO3V
VIN
VDC
VLDO3
LDO3V
AGND
AGND
EN3V3SW
EC
N
VOUT3V3SW
VOUT3V3SW
AGND
Copyright © 2016, Texas Instruments Incorporated
Figure 6-4. LDO3V and 3V3SW Load Switch
6.3.5
5-V LDO and 5VSW Load Switch
The LDO5V powers up when Vin pin goes above the UVLO5V threshold. The LDO5V powers the gate
drives for all the five VRs of the PMIC. The 5-V load switch is used to switch the gate drive source from
the internal LDO5V LDO to the 3.3-V PWM VR output as soon as the 3.3-V VR powergood signal
indicates it is good. This significantly improves the efficiency of the VRs whose effect is more significant at
lower VR load current, and VR input voltage. The load switch is enabled by the EN5VSW pin. Connect the
V5A_PG signal to the EN5VSW pin. When the EN5VSW pin is high, the LDO5V internal reference drops
to 4.5 V to ensure the 5-V VR drives all the gate drive current, but also ensures the gate drive never falls
below 4.5 V. When EN5VSW is low, the LDO resumes to 5-V internal reference and the load switch is
turned off to disconnect the 5-V VR.
VDC
PG_V5ADS3
V5ADS3
EN5VSW
VIN5VSW
VREGVR1
VREGVR2
VDC
LDO5V
VIN
VLDO5
LDO5V
VREGVR4
Copyright © 2016, Texas Instruments Incorporated
Figure 6-5. 5-V LDO and 5VSW Load Switch
56
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6.3.6
SLVSCF4A – DECEMBER 2014 – REVISED JULY 2016
RTC Selector and 3.1-V LDO
The RTC selector is used to select between the coincell backup battery or the internal 3.3-V LDO to power
the 3P3A_RTC output rail for the RTC domain rail. If the Vin is below the UVLo5V threshold, the coincell
battery is selected. If the Vin is greater than the UVLO5V, then the internal 3.1-V LDO is selected. The
backup battery selector logic has a very low current draw when battery is selected to extend the charge
life of the backup battery. This rail allows keeping the RTC registers' data even when the adapter and
main battery is removed from the system. If the coincell voltage falls below the minimum threshold, the
RTC registers will be reset to the default values. The 3.1-V LDO is at 3.1 V to ensure the PCH voltage is
always below 3.2 V maximum to protect the PCH.
1kW
VBATTBKUP
VBATTBKUP
Coincell
Battery
UVLO
3.1V LDO
VDC
V3P3A_RTC
VIN
LDO5V
LDO3P1V
V3P3A_RTC
RTC
DIG
Copyright © 2016, Texas Instruments Incorporated
Figure 6-6. RTC Selector and 3.1-V LDO
6.3.7
Power Path Comparators
The Power Path comparators are high voltage comparators rated at 28 V both input and output that are
independent of the rest of the PMIC. These can be used even when the PMIC is powered down, as long
as the VINPP pin is above the UVLO5V threshold. Connect a resistor divider from the source to set the
1.25-V trigger threshold. These comparators can be used to detect adapter, and up to two batteries. An
open-drain pin can detect the status, and a status register detects the status, that can issue an interrupt to
the EC. The high voltage rated outputs can be used to turn on external P-channel power MOSFETs to
control the power source path. A diode "OR" connection from all the power sources used is recommended
to ensure the VINPP is up when a source is available. If these comparators are not used tie the VINPP pin
to VIN and VIN_LDO3. Do not ground the VINPP pin when the VIN pin is powered up. These comparators
can also be used a general purpose comparators.
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ADAPTOR
ACIN
BATTERY1
VINPP
VINPP
ADAPTOR
BATTERY2
FET
FET
POWER
PATH
REFSYS
BAT1
+
-
VCCPP
ADAPTOR
VBATA
NVDC
CHARGER
FET FET
FET
FET
+ BAT2
ACSWONZ
ACIN
VCCPP
ACIN
1.25V
+
-
ACSWONZ
-
+
N
LOWBATTDET[3]
Address 0x6A
PWRSRCINT[4]
Address 0x04
BATTERY1
BAT1SWONZ
BAT1
VCCPP
BAT1
1.25V
+
-
BAT1SWONZ
+
N
LOWBATTDET[4]
Address 0x6A
PWRSRCINT[5]
Address 0x04
BATTERY2
BAT2SWONZ
BAT2
VCCPP
BAT2
1.25V
+
-
BAT2SWONZ
+
N
LOWBATTDET[5]
Address 0x6A
PWRSRCINT[6]
Address 0x04
Copyright © 2016, Texas Instruments Incorporated
Figure 6-7. Power Path Comparators
6.3.8
UVLO Comparators
The UVLO comparators are high voltage comparators rated at 28-V input are powered by the VIN pin for
LDO5V and 1.25-V LDO, and the VIN_LDO3V pin for th LDO3V. The VDCSNS input is also a high voltage
input pin to detect if VBATA is above a programmable voltage. The Vin and VIN_LDO3 pin are tied
directly to VBATA, while the VDCSNS pin requires a resistor divider to set the proper detection gain.
58
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VIN
VBATA
VINLDO3
PMIC
REFSYS
1.25V
LDO3
LDO3
VINLDO3
VBATA
UVLO
3.75V
Internal
+
-
+
-
UVLO_3V
LDO3
VIN
VBATA
LDO5
UVLO
5.3V
Internal
+
-
+
-
UVLO_5V_Main
VBATA
4R
VDCSNS
R
LDO3
VDCSNS
VDLMTCRT[3:0]
Address 0x51
1.08V,
1.10V,
1.12V (default),
1.14V,
1.16V
1.18V
1.20V
+
-
+
-
Internal
PMUINT[2]
Address 0x05
Copyright © 2016, Texas Instruments Incorporated
Figure 6-8. UVLO Comparators
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6.3.9
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Temperature Comparator
The temperature comparator is used to detect either several PTC thermisters stacked in series string, or a
single NTC thermister. The PTC thermisters allow an inexpensive overtemperature detection of any fault
throughout several points on the motherboard with each PTC thermister selected to have its own
temperature threshold trigger point. An internal current source can be enabled to drive the PTC
thermisters to minimize noise sensitivity. The current source can be disabled to drive with a voltage source
such as the LDO3V to allow a tighter accuracy. Only a single NTC thermister can be detected at a time,
but the NTC allows tracking several temperature profiles. This comparator can also be used as a general
purpose comparator.
LDO3V
10uA
TRIPZ
TRIPZ
LDO3
VCOMP
VCOMP
R
1.25V
+
-
+
-
N
PTC1
PTC2
PTCn
LDO3V
OFF
LDO3V
R1
TRIPZ
LDO3
VCOMP
VCOMP
R2
+
-
1.25V
TRIPZ
+
N
PTC1
PTC2
PTCn
LDO3V
OFF
LDO3V
R1
TRIPZ
LDO3
VCOMP
VCOMP
NTC
R2
1.25V
+
-
TRIPZ
+
N
Copyright © 2016, Texas Instruments Incorporated
Figure 6-9. Temperature Comparator
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6.3.10 Low Power Mode (LPM) / Connected Standby / Instant Go of VRs
All the Voltage regulators from the PMIC can be programmed by register to change the voltage in active
mode, or to change to a lower voltage or decay in the low power mode. This can be used to save system
power and extend battery life. And such capability is useful to meet the Connected Standby and Instant
Go specifications. The STANDBYZ pin triggers low power mode (LPM) when low. The STANDBYZ
triggers active mode (not in LPM) when high. Connect the SLP_S0# signal from the PCH to the
STANDBYZ pin to trigger the low power mode, LPM. The default settings can be changed by the user with
the I2C register at any time.
When SLP_S0# is Lo, the device is in Connected Standby Mode,
which is now called Instant GO mode.
SLP_S0#
SLP_S0#
(STANDBYZ)
Vout
Normal Mode
STANDBYZ
All VRs
* Select Vout
* Control PWM
Low
Power
Mode
Optimized
Ramp-down
FLT
OFF:
VIN > UVLO
Startup:
LDO3V, LDO5V and
VREF1V25 ramp up,
OTP loads from
default
(backup battery
saves RTC register
values)
VIN > UVLO
VIN < UVLO
Backup Battery
or G3:
All rails off, RTC =
backup battery,
RTC registers saved
(VIN < UVLO) &&
(no backup
battery)
(VIN < UVLO) &&
(backup battery
present)
LDO3V and LDO5V
power goods = HIGH
Exit Emergency Shutdown:
Emergency
Shutdown:
ACOK transitions from LOW to HIGH
or PWRBTNIN falling edge detected
DPWROK transitions LOW,
All rails turn off with
discharge resister ramp
down
Ready:
Reference LDOs are on,
I2C is active,
Waiting for EN signals
Emergency
Shutdown Initiated
Emergency
Shutdown Initiated
ENVR3 = LOW
ENVR3 = HIGH
DSx:
VR3 (V3.3A_DSW) and
VR2 (V1.8A) turn on.
DPWROK asserted
HIGH
STANDBY:
SLP_SUS# = LOW or
EC_SLP_DS4 or EC_DS4 = 1
SLP_SUS# = HIGH,
At ENE and ENVR5
DVS and Decay on
programmed rails
STANDBY# = HIGH
(SLP_S0#)
S5/S4:
STANDBY# = LOW
(SLP_S0#)
VR5 (V5A_DS3), LS-PGE
(V3.3A_PCH), VR1 (V0.85A &
V1.00A) turn on.
DS3_VREN, RSMRST#_PWRGD
and EC_RST# asserted HIGH
STANDBY# = HIGH
(SLP_S0#)
STANDBY# = LOW
(SLP_S0#)
LDO1 ON:
LDO1 (VTT)
turns on
DDR_VTT_CTRL = LOW
SLP_S4# = HIGH,
At ENB and ENVR4
S0:
SLP_S4# = LOW
S3:
VR4 (VDDQ) and
LS-PGB (V1.8U)
turn on.
SLP_S3# = LOW
LS-PGD (VCCIO) turns on.
ALL_SYS_PWRGD,
VCCST_PWRGD,
PCH_PWROK_SYS_PWROK
asserted HIGH
DDR_VTT_CTRL = HIGH
(SLP_S3# = HIGH, at ENF and ENG)
&& (valid 3.3V, 1.8V, and 1.0V
detected on VSE, VSF, and VSG)
Figure 6-16. Sequence of Function Modes - Assuming the TPS650830 Application Configuration
Connections
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6.4.1
SLVSCF4A – DECEMBER 2014 – REVISED JULY 2016
OFF State - No VIN and No Backup Battery
If the VIN and the VBATTBKUP battery are both lower than their respective UVLOs then, the device will
be in the OFF state. In this state the device will not be able to turn on or enable any VRs or discrete load
switches / regulators. The clock and I2C are not active in this state.
In the OFF state, the power path switch comparators, ACIN, BAT1, and BAT2 are the only block available
for use. In order to use these comparators the VINPP must be supplied with the highest of the 3 input
voltages from AC, BAT1, and BAT2. In all other states the VINPP must be supplied from the same source
as VIN.
6.4.2
Startup
The device enters STARTUP once the VIN > UVLO. During STARTUP LDO3V, LDO5V, and VREF1V25
ramp up. Once both LDO3V and LDO5V reach their nominal voltage and their powergoods assert HIGH,
the OTP loads into the I2C registers. After the LDO5V_PG asserts HIGH, the RTC LDO is turned on and
the V3.3A_RTC is regulated to 3.1 V powered from the LDO5V. Once the OTP is loaded and the RTC is
regulated to 3.1 V the device enters READY state.
6.4.3
Ready State
The device is considered to be in the READY state once, all of the internal supplies and RTC are
regulated and the OTP is loaded into the registers. In this state the device is ready for enable commands.
The comparators, level shifters and all other blocks are available for use.
6.4.4
S5/S4 State
The S5/S4 states are entered when the V3.3A_DSW, V1.8A, V5A_DS3, V3.3A_PCH, V0.85A, and V1.00A
are all enabled and regulating with valid powergoods. In this state the RSMRST#_PWRGD will be
asserted HIGH.
6.4.5
S3 State
To enter S3 state the SLP_S4# signal must be asserted HIGH. Upon SLP_S4# assertion the VDDQ
(VR4), and V1.8U rails are turned on.
6.4.6
S0 State
To enter S0 state the SLP_S3# signal must be asserted HIGH in addition to valid 3.3-V, 1.8-V, and 1.0-V
signals on VSE, VSF, and VSG pins. Upon PGG = 1 and PGVR4 = 1 the VCCIO and rail is turned on and
the device transitions to S0 state. ALL_SYS_PWRGD asserts HIGH in this state.
6.4.7
Standby
Standby is entered when the STANDBYZ pin transitions from HIGH to LOW provided that
ALL_SYS_PWRGD is HIGH. During the STANDBY state the device will DVS and/or decay the VRs that
are programmed to DVS or decay from the I2C register definitions, (registers x30 - x38).
6.4.8
DSx State
The DSx state is entered from STARTUP by the enabling of V3.3A_DSW. From the S5/S4 states it can be
entered by either pulling the SLP_SUS# signal LOW or writing to VREN, EC_SLP_S4 = EC_DS4 = 1. In
this state, the V5A_DS3 and V1.8A may be turned off.
6.4.9
Emergency Shutdown
Emergency Shutdown is a protection feature for the system loads. It reduces the risk of reverse bias in the
processor or other devices from once rail to another. Once Emergency Shutdown is initiated the
DPWROK pin is pulled LOW, discharge resistors are enabled for all rails, and all rails are disabled at the
same time. The PMIC remains in Emergency Shutdown until any of the follow occurs:
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•
•
•
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PWRBTNIN falling edge detected
ACOK transitions from LOW to HIGH
VIN < UVLO
Emergency Shutdown is initiated when:
• VR Fault detected - Read RESETIRQ1 to determine if VR fault caused shutdown.
• Hardware force shutdown
• Software force shutdown
• Die Thermal Fault - Read RESETIRQ2 to determine if thermal fault caused shutdown.
• PWRBTN held longer than defined time by FLT[5:0] - Read RESETIRQ1 to determine if push button
caused shutdown.
• VIN < UVLO - Read IRQLVL1 bit 2 to determine if VIN < UVLO caused shutdown.
6.4.10 Backup Battery / G3 - No VIN
G3 is an Intel defined state where the VIN < UVLO to the device but, a valid backup battery is present on
VBATTBKUP pin. In this state, the backup battery is passed to the RTC output and the RTC domain I2C
register values are saved. Once the VIN > UVLO these register retain their value and can be read once
I2C is ready.
In this state, all VRs and internal LDOs are off and I2C access is not available.
6.5
Programming
I2C - Interface
6.5.1
I2C is a 2-wire serial interface developed by NXP (formerly Philips Semiconductor) (see I2C-Bus
Specification and user manual, Rev 4, 13 February 2012). The bus consists of a data line (SDA) and a
clock line (SCL) with pull-up structures. When the bus is idle, both SDA and SCL lines are pulled high. All
the I2C compatible devices connect to the I2C bus through open drain I/O pins, SDA and SCL. A master
device, usually a microcontroller or a digital signal processor, controls the bus. The master is responsible
for generating the SCL signal and device addresses. The master also generates specific conditions that
indicate the START and STOP of data transfer. A slave device receives and/or transmits data on the bus
under control of the master device.
The TPS650830 works as a slave and supports the following data transfer modes, as defined in the I2CBus Specification: standard mode (100 kbps), fast mode (400 kbps). The interface adds flexibility to the
power supply solution, enabling most functions to be programmed to new values depending on the
instantaneous application requirements. Register contents are loaded when voltage is applied to
TPS650830 higher than the undervoltage lockout threshold. The I2C interface is running from an internal
oscillator that is automatically enabled when there is an access to the interface.
The data transfer protocol for standard and fast modes is exactly the same, therefore, they are referred to
as F/S-mode in this document.
The TPS650830 supports 7-bit addressing; 10-bit addressing and general call address are not supported.
The default device address is defined by the status of the SLAVEADDR pin. 3 different slave addresses
are possible, 0x30 (SLAVEADDR 0 V), 0x32 (SLAVEADDR 3.3 V) and 0x34 (SLAVEADDR floating).
All registers are set to their default value when the supply voltage is below the UVLO threshold.
6.5.1.1
F/S-Mode Protocol
The master initiates data transfer by generating a start condition. The start condition is when a high-to-low
transition occurs on the SDA line while SCL is high, see Figure 6-17. All I2C-compatible devices should
recognize a start condition.
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The master then generates the SCL pulses, and transmits the 7-bit address and the read/write direction bit
R/W on the SDA line. During all transmissions, the master ensures that data is valid. A valid data
condition requires the SDA line to be stable during the entire high period of the clock pulse, see Figure 618. All devices recognize the address sent by the master and compare it to their internal fixed addresses.
Only the slave device with a matching address generates an acknowledge, see Figure 6-19, by pulling the
SDA line low during the entire high period of the ninth SCL cycle. Upon detecting this acknowledge, the
master knows that the communication link with a slave has been established.
The master generates further SCL cycles to either transmit data to the slave (R/W bit = 0) or receive data
from the slave (R/W bit = 1). In either case, the receiver needs to acknowledge the data sent by the
transmitter. An acknowledge signal can either be generated by the master or by the slave, depending on
which one is the receiver. 9-bit valid data sequences consisting of 8-bit data and 1-bit acknowledge can
continue as long as necessary.
To signal the end of the data transfer, the master
low to high while the SCL line is high, see
communication link with the addressed slave.
condition. Upon the receipt of a stop condition, all
a start condition followed by a matching address
generates a stop condition by pulling the SDA line from
Figure 6-17. This releases the bus and stops the
All I2C compatible devices must recognize the stop
devices know that the bus is released, and they wait for
Attempting to read data from register addresses not listed in this section results in FFh being read out. FS
I2C operation does not support repeated start
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6.5.1.2
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Diagrams of I2C Protocol
SDA
SCL
S
P
Start
Condition
Stop
Condition
Figure 6-17. START and STOP Conditions
SDA
SCL
data line
stable;
data valid
change of data allowed
Figure 6-18. Bit Transfer on the I2C-bus
Data Output
by Transmitter
Not Acknowledge
Data Output
by Receiver
Acknowledge
SCL From
Master
1
2
8
9
S
Clock Pulse for
Acknowledgement
START
Condition
Figure 6-19. Acknowledge on the I2C-Bus
recognize START or
REPEATED START
condition
recognize STOP or
REPEATED START
condition
generate ACKNOWLEDGE
signal
P
SDA
MSB
acknowledgement
signal from slave
Sr
Address
R/W
SCL
S
or
Sr
1
2
7
8
9
ACK
byte complete,
interrupt within slave
1
2
3−8
9
ACK
clock line held low while
interrupts are serviced
START or
repeated START
condition
Sr
or
P
STOP or
repeated START
condition
Figure 6-20. Bus Protocol
74
Detailed Description
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SCL
...
SDA
A6
A5 A4 ...
...
A0 R/W ACK
0
R7
R6
...
R5
R0 ACK
0
D7
D5 ...
D6
0
Slave Address
Start
...
D0 ACK
0
Register Address
Data
Stop
NOTE: SLAVE=This Device
Figure 6-21. I2C Interface WRITE to Device in F/S Mode
SCL
...
SDA
A6 ..
...
A0
R/W ACK
0
R7
..
...
R0
A6 ..
ACK
0
...
A0
R/W ACK
1
0
Start
Slave Address
Register
Address
Slave Address
D7
D0
ACK
0
Slave
Drives
the Data
Repeated
Start
NOTE: SLAVE=This Device
..
Stop
Master
Drives
ACK and Stop
Figure 6-22. I2C Interface READ from Device in F/S Mode
6.6
Register Map
Table 6-3. Register Summary
Register Address
Register Name
Domain
Short Description
x00
VENDORID
UVLO
Code that indicated a Texas Instruments' PMIC
device.
x01
REVID
UVLO
Code to identify device revision and
programming revision.
x02
IRQLVL1
RTC
Top level interrupts
x04
PWRSRCINT
RTC
Input power interrupts
x05
PMUINT
RTC
PMU interrupts
x08
RESETIRQ1
RTC
Emergency Shutdown interrupts
x09
RESETIRQ2
RTC
Emergency Shutdown interrupts
x0B
MPMUINT
RTC
Mask PMU interrupts
x0C
MPWRSRCNT
RTC
Mask input power interrupts
x11
RESETIRQ1MASK
RTC
Mask Emergency Shutdown interrupts
x12
RESETIRQ2MASK
RTC
Mask Emergency Shutdown interrupts
x13
IRQLVL1MSK
RTC
Mask top level interrupt
x14
PBCONFIG
RTC
Power Button configuration
x15
PBSTATUS
RTC
Power Button Status
x16
PWRSTAT1
RTC
VR Fault Reporting
x17
PWRSTAT2
RTC
VR Fault Reporting
x18
PGMASK1
RTC
Mask VR PGs from System Power Good Tree
x19
PGMASK2
RTC
Mask VR PGs from System Power Good Tree
x30
VCCIOCNT
UVLO
VCCIO (PGD ) Control
Detailed Description
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Table 6-3. Register Summary (continued)
76
Register Address
Register Name
Domain
Short Description
x31
V5ADS3CNT
UVLO
V5A_DS3 (VR5 ) Control
x32
V33ADSWCNT
UVLO
V3.3A_DSW (VR3 ) Control
x33
V33APCHCNT
UVLO
V3.3A_PCH (PGE) Control
x34
V18ACNT
UVLO
V1.8A (VR2 ) Control
x35
V18U25UCNT
UVLO
V1.8U_2.5U (PGB) Control
x36
V1P2UCNT
UVLO
V1.2U / VDDQ (VR4) Control
x37
V100ACNT
UVLO
V1.00A (VR1) Control
x38
V08ACNT
UVLO
V0.85A (VR1 ) Control
x3B
VRMODECTRL
UVLO
Force Low Power Mode
x3C
DISCHCNT1
UVLO
Discharge Resistors Settings
x3D
DISCHCNT2
UVLO
Discharge Resistors Settings
x3E
DISCHCNT3
UVLO
Discharge Resistors Settings
x3F
DISCHCNT4
UVLO
Discharge Resistors Settings
x40
PWRGDCNT1
UVLO
System Level Power Goods
x41
VREN
UVLO
Deep Sleep Enable
x42
REGLOCK
UVLO
Lock for Control Registers, x30 - x38
x43
VRENPINMASK
UVLO
Mask hardware enable pins
x48
RSTCTRL
RTC
Reset Control
x49
SDWNCTRL
UVLO
Software Force Shutdown
x51
VDLMTCRT
UVLO
VDCSNS Settings
x69
ACOKDBDM
UVLO
ACOK Settings
x6A
LOWBATTDET
UVLO
Battery Detection Settings
x6F
SPWRSRCINT
UVLO
Input power Statuses
xD0
CLKCTRL1
RTC
Clock Control
xDD
COMPA_REF
UVLO
Comparator A Settings
xDE
COMPB_REF
UVLO
Comparator B Settings
xDF
COMPC_REF
UVLO
Comparator C Settings
xE0
COMPD_REF
UVLO
Comparator D Settings
xE1
COMPE_REF
UVLO
Comparator E Settings
xE2
COMPF_REF
UVLO
Comparator F Settings
xE3
COMPG_REF
UVLO
Comparator G Settings
xE4
COMPH_REF
UVLO
Comparator H Settings
xE5
PWRFAULT_MASK1
UVLO
Mask VR Faults from Emergency Shutdown
xE6
PWRFAULT_MASK2
UVLO
Mask VR Faults from Emergency Shutdown
xE7
PGOOD_STAT1
UVLO
VR PGs Statuses
xE8
PGOOD_STAT2
UVLO
VR PGs Statuses
xE9
MISC_BITS
UVLO
Misc. Bits
xEA
STDY_CTRL
RTC
VCOMP and Standby Control
xEB
TEMPCRIT
RTC
VR Critical Temperature
xEC
TEMPHOT
RTC
VR Hot Temperature
xED
OVERCURRENT
RTC
VR Overcurrent
xEE
VREN_PIN_OVR
UVLO
VR Enable Override with Software
Detailed Description
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6.6.1
6.6.1.1
SLVSCF4A – DECEMBER 2014 – REVISED JULY 2016
Registers
VENDORID Register (address = 0x00) [reset = 00100010]
Figure 6-23. VENDORID Register Format
B7
VENDORID[7]
0
RW
B6
VENDORID[6]
0
RW
B5
VENDORID[5]
1
RW
B4
VENDORID[4]
0
RW
B3
VENDORID[3]
0
RW
B2
VENDORID[2]
0
RW
B1
VENDORID[1]
1
RW
B0
VENDORID[0]
0
RW
LEGEND: R/W = Read/Write; R = Read only; -n = value after reset
Table 6-4. VENDORID Register Field Descriptions
Bit
Field
Type
Reset
Description
7:0
VENDORID[7:0]
RW
00100010
Vendor ID
6.6.1.2
REVID Register (address = 0x01) [reset = 00000000]
Figure 6-24. REVID Register Format
B7
DNUM[3]
0
RW
B6
DNUM[2]
0
RW
B5
DNUM[1]
0
RW
B4
DNUM[0]
1
RW
B3
OTPREV[3]
0
RW
B2
OTPREV[2]
0
RW
B1
REVID[1]
0
RW
B0
REVID[0]
0
RW
LEGEND: R/W = Read/Write; R = Read only; -n = value after reset
Table 6-5. REVID Register Field Descriptions
Bit
Field
Type
Reset
Description
7:4
DNUM[3:0]
RW
0000
Major revision ID
1010: A
1011: B
1100: C
1101: D
1110: E
1111: F
3:2
OTPREV[1:0]
RW
00
Minor revision ID
0000: 0
0001: 1
0010: 2
0011: 3
0100: 4
0101: 5
0110: 6
0111: 7
1:0
REVID[1:0]
RW
00
Minor revision ID
0000: 0
0001: 1
0010: 2
0011: 3
0100: 4
0101: 5
0110: 6
0111: 7
Detailed Description
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6.6.1.3
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IRQLVL1 Register (address = 0x02) [reset = 00000000]
Figure 6-25. IRQLVL1 Register Format
B7
RESET
B6
RESERVED2
B5
PMU
0
RW
0
R
0
RW
B4
B3
RESERVED1[1 RESERVED1[0
]
]
0
0
R
R
B2
PWRSRC
B1
RESERVED
B0
PWRBTN
0
RW
0
R
0
RW
LEGEND: R/W = Read/Write; R = Read only; -n = value after reset
Table 6-6. IRQLVL1 Register Field Descriptions
Bit
Field
Type
Reset
Description
7
RESET
R
0
RESET interrupt
0: Not asserted
1: Asserted
6
RESERVED2
R
0
5
PMU
R
0
4:3
78
RESERVED1[1:0]
R
00
2
PWRSRC
R
0
1
RESERVED
R
0
0
PWRBTN
RW
0
Power monitor interrupt
0: Not asserted
1: Asserted
Power source interrupt
0: Not asserted
1: Asserted
Power button interrupt
0: Not asserted
1: Asserted, write '1' to clear
Detailed Description
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6.6.1.4
SLVSCF4A – DECEMBER 2014 – REVISED JULY 2016
PWRSRCINT Register (address = 0x04) [reset = 00000000]
Figure 6-26. PWRSRCINT Register Format
B7
RESERVED1_
PWRSRCINT
0
R
B6
LOWBATT2
B5
LOWBATT1
B4
ACOK
B3
PMICHOT
B2
RESERVED[2]
B1
RESERVED[1]
B0
RESERVED[0]
0
RW
0
RW
0
RW
0
RW
0
R
0
R
0
R
LEGEND: R/W = Read/Write; R = Read only; -n = value after reset
Table 6-7. PWRSRCINT Register Field Descriptions
Bit
Field
Type
Reset
7
RESERVED1_PWRSRCINT
R
0
6
LOWBATT2
RW
0
Low battery2 interrupt [rising-edge detect threshold = 1.25 V;
falling-edge hysteresis = 125 mV]
0: No battery2 detected
1: Battery2 detected
5
LOWBATT1
RW
0
Low battery1 interrupt [rising-edge detect threshold =1.25 V;
falling-edge hysteresis = 125 mV]
0: No battery1 detected
1: Battery1 detected
4
ACOK
RW
0
AC/DC adapter detection interrupt. [rising-edge detect threshold
=1.25 V; falling-edge hysteresis = 125 mV]
0: No adapter detected
1: Adapter detected
3
PMICHOT
RW
0
PMIC internal temperature interrupt
0: PMIC temperature normal
1: PMIC temperature hot
RESERVED[2:0]
R
000
2:0
6.6.1.5
Description
PMUINT Register (address = 0x05) [reset = 00000000]
Figure 6-27. PMUINT Register Format
B7
B6
B5
RESERVED2[2 RESERVED2[1 RESERVED2[0
]
]
]
0
0
0
R
R
R
B4
PMUACOK
0
RW
B3
RESERVED1_
PMUINT
0
R
B2
PMUVDC
0
RW
B1
RESERVED_P
MUINT[1]
0
R
B0
RESERVED_P
MUINT[0]
0
R
LEGEND: R/W = Read/Write; R = Read only; -n = value after reset
Table 6-8. PMUINT Register Field Descriptions
Bit
Field
Type
Reset
7:5
RESERVED2[2:0]
R
000
4
PMUACOK
RW
0
3
RESERVED1_PMUINT
R
0
2
PMUVDC
RW
0
RESERVED_PMUINT[1:0]
R
00
1:0
Description
Adapter detection interrupt
0: No Interrupt Pending
1: AC Adapter removed (SACOK H -> L)
Power monitor critical supply voltage interrupt
0: Critical supply voltage over threshold limit
1: Critical supply voltage below threshold limit
Detailed Description
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RESETIRQ1 Register (address = 0x08) [reset = 00000000]
Figure 6-28. RESETIRQ1 Register Format
B7
RESERVED1_
RESETIRQ1[1]
0
R
B6
RESERVED1_
RESETIRQ1[0]
0
R
B5
FCO
B4
VRFAULT
B3
RESERVED[3]
B2
RESERVED[2]
B1
RESERVED[1]
B0
RESERVED[0]
0
RW
0
RW
0
R
0
R
0
R
0
R
LEGEND: R/W = Read/Write; R = Read only; -n = value after reset
Table 6-9. RESETIRQ1 Register Field Descriptions
Bit
Field
Type
Reset
7:6
Description
RESERVED1_RESETIRQ1[1:0]
R
00
5
FCO
RW
0
Power button triggered reset interrupt
0: Power button counter has not forced an emergency reset
1: Power button counter has forced an emergency reset
4
VRFAULT
RW
0
Voltage regulator triggered reset interrupt
0: Voltage regulator fault has not triggered an emergency reset
1: Voltage regulator fault has triggered an emergency reset
RESERVED[3:0]
R
0000
3:0
6.6.1.7
RESETIRQ2 Register (address = 0x09) [reset = 00000000]
Figure 6-29. RESETIRQ2 Register Format
B7
B6
B5
B4
B3
B2
RESERVED1[5 RESERVED1[4 RESERVED1[3 RESERVED1[2 RESERVED1[1 RESERVED1[0
]
]
]
]
]
]
0
0
0
0
0
0
R
R
R
R
R
R
B1
CRITTEMP
0
RW
B0
RESERVED_R
ESETIRQ2
0
R
LEGEND: R/W = Read/Write; R = Read only; -n = value after reset
Table 6-10. RESETIRQ2 Register Field Descriptions
80
Bit
Field
Type
Reset
7:2
RESERVED1[5:0]
R
000000
1
CRITTEMP
RW
0
0
RESERVED_RESETIRQ2
R
0
Description
Temperature triggered reset interrupt
0: Critical temperature not reached
1: Critical temperature reached, forcing emergency shutdown
Detailed Description
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6.6.1.8
SLVSCF4A – DECEMBER 2014 – REVISED JULY 2016
MPMUINT Register (address = 0x0B) [reset = 00010100]
Figure 6-30. MPMUINT Register Format
B7
RESERVED2_
MPMUINT[2]
0
R
B6
RESERVED2_
MPMUINT[1]
0
R
B5
RESERVED2_
MPMUINT[0]
0
R
B4
MPMUACOK
1
RW
B3
RESERVED1_
MPMUINT
0
R
B2
MPMUVDC
1
RW
B1
B0
RESERVED_M RESERVED_M
PMUINT[1]
PMUINT[0]
0
0
R
R
LEGEND: R/W = Read/Write; R = Read only; -n = value after reset
Table 6-11. MPMUINT Register Field Descriptions
Bit
Field
Type
Reset
7:5
RESERVED2_MPMUINT[2:0]
R
000
4
MPMUACOK
RW
1
3
RESERVED1_MPMUINT
R
0
2
MPMUVDC
RW
1
RESERVED_MPMUINT[1:0]
R
00
1:0
6.6.1.9
Description
Power monitor critical supply voltage (adapter) mask interrupt
0: Not masked
1: Masked
Power monitor critical supply voltage mask interrupt
0: Not masked
1: Masked
MPWRSRCINT Register (address = 0x0C) [reset = 01111000]
Figure 6-31. MPWRSRCINT Register Format
B7
RESERVED1_
MPWRSRCINT
B6
MLOWBAT2
B5
MLOWBAT1
B4
MACOK
B3
MPMICHOT
0
R
1
RW
1
RW
1
RW
1
RW
B2
B1
B0
RESERVED_M RESERVED_M RESERVED_M
PWRSRCINT[2 PWRSRCINT[1 PWRSRCINT[0
]
]
]
0
0
0
R
R
R
LEGEND: R/W = Read/Write; R = Read only; -n = value after reset
Table 6-12. MPWRSRCINT Register Field Descriptions
Bit
Field
Type
Reset
7
RESERVED1_MPWRSRCINT
R
0
6
MLOWBAT2
RW
1
Low battery voltage mask interrupt
0: Not masked
1: Masked
5
MLOWBAT1
RW
1
Low battery voltage mask interrupt
0: Not masked
1: Masked
4
MACOK
RW
1
AC/DC adapter detection mask interrupt
0: Not masked
1: Masked
3
MPMICHOT
RW
1
PMIC internal temperature mask interrupt
0: Not masked
1: Masked
RESERVED_MPWRSRCINT[2:0]
R
000
2:0
Description
6.6.1.10 RESETIRQ1MASK Register (address = 0x11) [reset = 00110000]
Detailed Description
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Figure 6-32. RESETIRQ1MASK Register Format
B7
RESERVED1_
RESETIRQ1M
ASK[1]
0
R
B6
RESERVED1_
RESETIRQ1M
ASK[0]
0
R
B5
MFCO
B4
MVRFAULT
1
RW
1
RW
B3
B2
B1
B0
RESERVED_R RESERVED_R RESERVED_R RESERVED_R
ESETIRQ1MAS ESETIRQ1MAS ESETIRQ1MAS ESETIRQ1MAS
K[3]
K[2]
K[1]
K[0]
0
0
0
0
R
R
R
R
LEGEND: R/W = Read/Write; R = Read only; -n = value after reset
Table 6-13. RESETIRQ1MASK Register Field Descriptions
Bit
Field
7:6
RESERVED1_RESETIRQ1MASK[1: R
0]
00
5
MFCO
RW
1
Power button triggered reset mask interrupt
0: Not masked
1: Masked
4
MVRFAULT
RW
1
Voltage regulator triggered reset mask interrupt
0: Not masked
1: Masked
3:0
Type
RESERVED_RESETIRQ1MASK[3:0 R
]
Reset
Description
0000
6.6.1.11 RESETIRQ2MASK Register (address = 0x12) [reset = 00000010]
Figure 6-33. RESETIRQ2MASK Register Format
B7
RESERVED1_
RESETIRQ2M
ASK[5]
0
R
B6
RESERVED1_
RESETIRQ2M
ASK[4]
0
R
B5
RESERVED1_
RESETIRQ2M
ASK[3]
0
R
B4
RESERVED1_
RESETIRQ2M
ASK[2]
0
R
B3
RESERVED1_
RESETIRQ2M
ASK[1]
0
R
B2
RESERVED1_
RESETIRQ2M
ASK[0]
0
R
B1
MCRITTEMP
1
RW
B0
RESERVED_R
ESETIRQ2MAS
K
0
R
LEGEND: R/W = Read/Write; R = Read only; -n = value after reset
Table 6-14. RESETIRQ2MASK Register Field Descriptions
82
Bit
Field
Type
Reset
7:2
RESERVED1_RESETIRQ2MASK[5: R
0]
000000
1
MCRITTEMP
RW
1
0
RESERVED_RESETIRQ2 MASK
R
0
Description
Temperature triggered reset mask interrupt
0: Not masked
1: Masked
Detailed Description
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SLVSCF4A – DECEMBER 2014 – REVISED JULY 2016
6.6.1.12 IRQLVL1msK Register (address = 0x13) [reset = 10100101]
Figure 6-34. IRQLVL1msK Register Format
B7
MRESET
1
RW
B6
RESERVED2_I
RQLVL1msK
0
R
B5
MPMU
B4
B3
RESERVED1_I RESERVED1_I
RQLVL1msK[1] RQLVL1msK[0]
0
0
R
R
1
RW
B2
MPWRSRC
1
RW
B1
RESERVED_IR
QLVL1msK
0
R
B0
MPWRBTN
1
RW
LEGEND: R/W = Read/Write; R = Read only; -n = value after reset
Table 6-15. IRQLVL1msK Register Field Descriptions
Bit
Field
Type
Reset
Description
7
MRESET
RW
1
RESET mask interrupt
0: Not masked
1: Masked
6
RESERVED2_IRQLVL1msK
R
0
5
MPMU
RW
1
4:3
RESERVED1_IRQLVL1msK[1:0]
R
00
2
MPWRSRC
RW
1
1
RESERVED_IRQLVL1msK
R
0
0
MPWRBTN
RW
1
Power monitor mask interrupt
0: Not masked
1: Masked
Power source mask interrupt
0: Not masked
1: Masked
Power button mask interrupt
0: Not masked
1: Masked
Detailed Description
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6.6.1.13 PBCONFIG Register (address = 0x14) [reset = 00011111]
Figure 6-35. PBCONFIG Register Format
B7
PWRBTNDBN
0
RW
B6
CLRHT
0
RW
B5
FLT[5]
0
RW
B4
FLT[4]
1
RW
B3
FLT[3]
1
RW
B2
FLT[2]
1
RW
B1
FLT[1]
1
RW
B0
FLT[0]
1
RW
LEGEND: R/W = Read/Write; R = Read only; -n = value after reset
Table 6-16. PBCONFIG Register Field Descriptions
Bit
84
Field
Type
Reset
Description
7
PWRBTNDBN
RW
0
Power button debounce
0: 30 ms
1: 0 ms (no debounce)
6
CLRHT
RW
0
Reset of power button timer logic
0: No action
1: Reset of HT, bit is self clearing
5:0
FLT[5:0]
RW
011111
Time that the button must be held to force an emergency reset
000000: 0 s
000001: 1 s
000010: 2 s
000011: 3 s
000100: 4 s
000101: 5 s
000110: 6 s
000111: 7 s
001000: 8 s
001001: 9 s
001010: 10 s
..
011111: 31 s
...
111100: 60 s
111101: 61 s
111110: 62 s
111111: 63 s
Detailed Description
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SLVSCF4A – DECEMBER 2014 – REVISED JULY 2016
6.6.1.14 PBSTATUS Register (address = 0x15) [reset = 00000000]
Figure 6-36. PBSTATUS Register Format
B7
RESERVED_P
BSTATUS
0
R
B6
LVL
B5
HT[5]
B4
HT[4]
B3
HT[3]
B2
HT[2]
B1
HT[1]
B0
HT[0]
0
R
0
R
0
R
0
R
0
R
0
R
0
R
LEGEND: R/W = Read/Write; R = Read only; -n = value after reset
Table 6-17. PBSTATUS Register Field Descriptions
Bit
Field
Type
Reset
7
RESERVED_PBSTATUS
R
0
6
LVL
R
0
Power button present level
0: Power button held
1: Power button released
HT[5:0]
R
000000
Time that the button has been held
00000: Disabled
00001: Disabled
000010: 2 s
000011: 3 s
000100: 4 s
000101: 5 s
000110: 6 s
000111: 7 s
001000: 8 s
001001: 9 s
001010: 10 s
..
...
111100: 60 s
111101: 61 s
111110: 62 s
111111: 63 s
5:0
Description
Detailed Description
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6.6.1.15 PWRSTAT1 Register (address = 0x16) [reset = 00000000]
Figure 6-37. PWRSTAT1 Register Format
B7
B6
VCCIO_FAULT V5A_DS3_FAU
LT
0
0
RW
RW
B5
V33A_DSW_F
AULT
0
RW
B4
V33A_PCH_FA
ULT
0
RW
B3
V18A_FAULT
0
RW
B2
V18U_25U_FA
ULT
0
RW
B1
V12U_FAULT
B0
V06DX_FAULT
0
RW
0
RW
LEGEND: R/W = Read/Write; R = Read only; -n = value after reset
Table 6-18. PWRSTAT1 Register Field Descriptions
Bit
86
Field
Type
Reset
Description
7
VCCIO_FAULT
RW
0
These bits indicate that the VR has lost regulation
0: Clears register
1: Indicates power fault
6
V5A_DS3_FAULT
RW
0
These bits indicate that the VR has lost regulation
0: Clears register
1: Indicates power fault
5
V33A_DSW_FAULT
RW
0
These bits indicate that the VR has lost regulation
0: Clears register
1: Indicates power fault
4
V33A_PCH_FAULT
RW
0
These bits indicate that the VR has lost regulation
0: Clears register
1: Indicates power fault
3
V18A_FAULT
RW
0
These bits indicate that the VR has lost regulation
0: Clears register
1: Indicates power fault
2
V18U_25U_FAULT
RW
0
These bits indicate that the VR has lost regulation
0: Clears register
1: Indicates power fault
1
V12U_FAULT
RW
0
These bits indicate that the VR has lost regulation
0: Clears register
1: Indicates power fault
0
V06DX_FAULT
RW
0
These bits indicate that the VR has lost regulation
0: Clears register
1: Indicates power fault
Detailed Description
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6.6.1.16 PWRSTAT2 Register (address = 0x17) [reset = 00000000]
Figure 6-38. PWRSTAT2 Register Format
B7
RESERVED[5]
0
R
B6
RESERVED[4]
0
R
B5
RESERVED[3]
0
R
B4
RESERVED[2]
0
R
B3
RESERVED[1]
0
R
B2
RESERVED[0]
0
R
B1
V100A_FAULT
0
RW
B0
V085A_FAULT
0
RW
LEGEND: R/W = Read/Write; R = Read only; -n = value after reset
Table 6-19. PWRSTAT2 Register Field Descriptions
Bit
Field
Type
Reset
7:2
RESERVED[5:0]
R
000000
Description
1
V100A_FAULT
RW
0
These bits indicate that the VR has lost regulation
0: Clears register
1: Indicates power fault
0
V085A_FAULT
RW
0
These bits indicate that the VR has lost regulation
0: Clears register
1: Indicates power fault
Detailed Description
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6.6.1.17 PGMASK1 Register (address = 0x18) [reset = 00000000]
Figure 6-39. PGMASK1 Register Format
B7
MVCCIOPG
0
RW
B6
MV085APG
0
RW
B5
MV100APG
0
RW
B4
MV18APG
0
RW
B3
MV33APCHPG
0
RW
B2
MV5ADS3PG
0
RW
B1
MV33ADSWPG
0
RW
B0
MV100SPG
0
RW
LEGEND: R/W = Read/Write; R = Read only; -n = value after reset
Table 6-20. PGMASK1 Register Field Descriptions
Bit
88
Field
Type
Reset
Description
7
MVCCIOPG
RW
0
VCCIO PG is part of the power good tree
0: Power Good function is enabled
1: Power Good function is masked and set to 1 (not part of the
Power Good tree)
6
MV085APG
RW
0
V0.85A PG is part of the power good tree
0: Power Good function is enabled
1: Power Good function is masked and set to 1 (not part of the
Power Good tree)
5
MV100APG
RW
0
V100A PG is part of the power good tree
0: Power Good function is enabled
1: Power Good function is masked and set to 1 (not part of the
Power Good tree)
4
MV18APG
RW
0
V1.8A PG is part of the power good tree
0: Power Good function is enabled
1: Power Good function is masked and set to 1 (not part of the
Power Good tree)
3
MV33APCHPG
RW
0
V3.3A PCH PG is part of the power good tree
0: Power Good function is enabled
1: Power Good function is masked and set to 1 (not part of the
Power Good tree)
2
MV5ADS3PG
RW
0
V5A DS3 PG is part of the power good tree
0: Power Good function is enabled
1: Power Good function is masked and set to 1 (not part of the
Power Good tree)
1
MV33ADSWPG
RW
0
V3.3A DSW PG is part of the power good tree
0: Power Good function is enabled
1: Power Good function is masked and set to 1 (not part of the
Power Good tree)
0
MV100SPG
RW
0
V100S PG is part of the power good tree
0: Power Good function is enabled
1: Power Good function is masked and set to 1 (not part of the
Power Good tree)
Detailed Description
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6.6.1.18 PGMASK2 Register (address = 0x19) [reset = 00000000]
Figure 6-40. PGMASK2 Register Format
B7
RESERVED_P
GMASK2[3]
0
R
B6
RESERVED_P
GMASK2[2]
0
R
B5
RESERVED_P
GMASK2[1]
0
R
B4
RESERVED_P
GMASK2[0]
0
R
B3
V18U25UPG
B2
MV12UPG
B1
MV33SPG
B0
MV18SPG
0
RW
0
RW
0
RW
0
RW
LEGEND: R/W = Read/Write; R = Read only; -n = value after reset
Table 6-21. PGMASK2 Register Field Descriptions
Bit
Field
Type
Reset
7:4
Description
RESERVED_PGMASK2[3:0]
R
0000
3
V18U25UPG
RW
0
V1.8_2.5U PG is part of the power good tree
0: Power Good function is enabled
1: Power Good function is masked and set to 1 (not part of the
Power Good tree)
2
MV12UPG
RW
0
V1.2U PG is part of the power good tree
0: Power Good function is enabled
1: Power Good function is masked and set to 1 (not part of the
Power Good tree)
1
MV33SPG
RW
0
V3.3S PG is part of the power good tree
0: Power Good function is enabled
1: Power Good function is masked and set to 1 (not part of the
Power Good tree)
0
MV18SPG
RW
0
V1.8S PG is part of the power good tree
0: Power Good function is enabled
1: Power Good function is masked and set to 1 (not part of the
Power Good tree)
Detailed Description
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6.6.1.19 VCCIOCNT Register (address = 0x30) [reset = 00001010]
Figure 6-41. VCCIOCNT Register Format
B7
RESERVED_V
CCIOCNT
0
R
B6
CSDECAYEN
B5
VCCIOVSEL[1]
0
RW
0
RW
B4
B3
B2
B1
VCCIOVSEL[0] AOACCNTVCC AOACCNTVCC CTLVVCCIO[1]
IO[1]
IO[0]
0
1
0
1
RW
RW
RW
RW
B0
CTLVVCCIO[0]
0
RW
LEGEND: R/W = Read/Write; R = Read only; -n = value after reset
Table 6-22. VCCIOCNT Register Field Descriptions
Bit
90
Field
Type
Reset
Description
7
RESERVED_VCCIOCNT
R
0
6
CSDECAYEN
RW
0
Enables VCCIO decay when SLP_S0# is asserted. [wait 2us
after removing FPWM, before entering DECAY mode. Direct
FPWM to DECAY by SLP0Z may cause ringing. Decay exit time
within 100us not guaranteed for Vout > 1V.]
0: VCCIO stays at voltage set by VCCIOVSEL independent of
state of SLP_S0#
1: VCCIO decays to 0V, PGOOD is maintained when SLP_S0#
is asserted (low)
5:4
VCCIOVSEL[1:0]
RW
00
Output voltage select
00: 0.975V
01: 0.950V
10: 0.875V
11: 0.850V
3:2
AOACCNTVCCIO[1:0]
RW
10
Mode control for exit standby (rising edge of SLP_S0#) changes bits D[1:0] on exit
00: No change in bits D[1:0] - fast change mode disabled
01: Bits D[1:0] set to 01, Auto Mode, (automatic transition from
PFM to PWM)
10: Bits D[1:0] set to 10, Auto Mode, (automatic transition from
PFM to PWM)
11: Bits D[1:0] set to 11, forced PWM operation
1:0
CTLVVCCIO[1:0]
RW
10
Mode control (V4)
00: Converter disabled
01: Auto Mode, (automatic transition from PFM to PWM)
10: Auto Mode, (automatic transition from PFM to PWM)
11: Forced PWM operation
Detailed Description
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SLVSCF4A – DECEMBER 2014 – REVISED JULY 2016
6.6.1.20 V5ADS3CNT Register (address = 0x31) [reset = 00101010]
Figure 6-42. V5ADS3CNT Register Format
B7
B6
V5ADS3LVSEL V5ADS3LVSEL
[1]
[0]
0
0
RW
RW
B5
V5ADS3VSEL[
1]
1
RW
B4
V5ADS3VSEL[
0]
0
RW
B3
AOACCNTV5A
DS3[1]
1
RW
B2
AOACCNTV5A
DS3[0]
0
RW
B1
CTLV5ADS3[1]
B0
CTLV5ADS3[0]
1
RW
0
RW
LEGEND: R/W = Read/Write; R = Read only; -n = value after reset
Table 6-23. V5ADS3CNT Register Field Descriptions
Bit
Field
Type
Reset
Description
7:6
V5ADS3LVSEL[1:0]
RW
00
V5ADS3 low power mode output voltage set point - set at
assertion of SLP_S0#
00: Disabled, voltage stays at value set by V5ADS3VSEL[1:0]
01: Vnom - 4%
10: Vnom - 3%
11: Vnom - 2%
5:4
V5ADS3VSEL[1:0]
RW
10
Output voltage select
00: Vnom + 3%
01: Vnom + 2%
10: Vnom
11: Vnom - 2%
3:2
AOACCNTV5ADS3[1:0]
RW
10
Mode control for exit standby (rising edge of SLP_S0#) changes bits D[1:0] on exit
00: No change in bits D[1:0] - fast change mode disabled
01: Bits D[1:0] set to 01, Auto Mode, (automatic transition from
PFM to PWM)
10: Bits D[1:0] set to 10, Auto Mode, (automatic transition from
PFM to PWM)
11: Bits D[1:0] set to 11, forced PWM operation
1:0
CTLV5ADS3[1:0]
RW
10
Mode control (V5)
00: Converter disabled
01: Auto Mode, (automatic transition from PFM to PWM)
10: Auto Mode, (automatic transition from PFM to PWM)
11: Forced PWM operation
Detailed Description
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6.6.1.21 V33ADSWCNT Register (address = 0x32) [reset = 00101010]
Figure 6-43. V33ADSWCNT Register Format
B7
V33ADSWLVS
EL[1]
0
RW
B6
V33ADSWLVS
EL[0]
0
RW
B5
V33ADSWVSE
L[1]
1
RW
B4
V33ADSWVSE
L[0]
0
RW
B3
AOACCNTV33
ADSW[1]
1
RW
B2
AOACCNTV33
ADSW[0]
0
RW
B1
B0
CTLV33ADSW[ CTLV33ADSW[
1]
0]
1
0
RW
RW
LEGEND: R/W = Read/Write; R = Read only; -n = value after reset
Table 6-24. V33ADSWCNT Register Field Descriptions
92
Bit
Field
Type
Reset
Description
7:6
V33ADSWLVSEL[1:0]
RW
00
V33A_DSW low power mode output voltage set point - set at
assertion of SLP_S0#
00: Disabled, voltage stays at value set by V33ADSWVSEL[1:0]
01: Vnom - 4%
10: Vnom - 3%
11: Vnom - 2%
5:4
V33ADSWVSEL[1:0]
RW
10
Output voltage select
00: Vnom + 3%
01: Vnom + 2%
10: Vnom
11: Vnom - 2%
3:2
AOACCNTV33ADSW[1:0]
RW
10
Mode control for exit standby (rising edge of SLP_S0#) changes bits D[1:0] on exit
00: No change in bits D[1:0] - fast change mode disabled
01: Bits D[1:0] set to 01, Auto Mode, (automatic transition from
PFM to PWM)
10: Bits D[1:0] set to 10, Auto Mode, (automatic transition from
PFM to PWM)
11: Bits D[1:0] set to 11, forced PWM operation
1:0
CTLV33ADSW[1:0]
RW
10
Mode control (V6)
00: Converter disabled
01: Auto Mode, (automatic transition from PFM to PWM)
10: Auto Mode, (automatic transition from PFM to PWM)
11: Forced PWM operation
Detailed Description
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SLVSCF4A – DECEMBER 2014 – REVISED JULY 2016
6.6.1.22 V33APCHCNT Register (address = 0x33) [reset = 00001010]
Figure 6-44. V33APCHCNT Register Format
B7
B6
B5
B4
RESERVED_V RESERVED_V RESERVED_V RESERVED_V
33APCHCNT[3] 33APCHCNT[2] 33APCHCNT[1] 33APCHCNT[0]
0
0
0
0
RW
RW
RW
RW
B3
AOACCNTV33
APCH[1]
1
RW
B2
AOACCNTV33
APCH[0]
0
RW
B1
CTLV33APCH[
1]
1
RW
B0
CTLV33APCH[
0]
0
RW
LEGEND: R/W = Read/Write; R = Read only; -n = value after reset
Table 6-25. V33APCHCNT Register Field Descriptions
Bit
Field
Type
Reset
Description
7:4
RESERVED_V33APCHCNT[3:0]
RW
0000
3:2
AOACCNTV33APCH[1:0]
RW
10
Mode control for exit standby (rising edge of SLP_S0#) changes bits D[1:0] on exit
00: No change in bits D[1:0] - fast change mode disabled
01: Bits D[1:0] set to 01
10: Bits D[1:0] set to 10
11: Bits D[1:0] set to 11
1:0
CTLV33APCH[1:0]
RW
10
Mode control (V7)
00: Disabled
01: Enabled
10: Enabled
11: Enabled
Detailed Description
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6.6.1.23 V18ACNT Register (address = 0x34) [reset = 00101010]
Figure 6-45. V18ACNT Register Format
B7
V18ALVSEL[1]
B6
V18ALVSEL[0]
B5
V18AVSEL[1]
B4
V18AVSEL[0]
0
RW
0
RW
1
RW
0
RW
B3
AOACCNTV18
A[1]
1
RW
B2
AOACCNTV18
A[0]
0
RW
B1
CTLV18A[1]
B0
CTLV18A[0]
1
RW
0
RW
LEGEND: R/W = Read/Write; R = Read only; -n = value after reset
Table 6-26. V18ACNT Register Field Descriptions
94
Bit
Field
Type
Reset
Description
7:6
V18ALVSEL[1:0]
RW
00
V18A low power mode output voltage set point - set at assertion
of SLP_S0#
00: Disabled, voltage stays at value set by V18AVSEL[1:0]
01: Vnom - 4%
10: Vnom - 3%
11: Vnom - 2%
5:4
V18AVSEL[1:0]
RW
10
Output voltage select
00: Vnom + 3%
01: Vnom + 2%
10: Vnom
11: Vnom - 2%
3:2
AOACCNTV18A[1:0]
RW
10
Mode control for exit standby (rising edge of SLP_S0#) changes bits D[1:0] on exit
00: No change in bits D[1:0] - fast change mode disabled
01: Bits D[1:0] set to 01, Auto Mode, (automatic transition from
PFM to PWM)
10: Bits D[1:0] set to 10, Auto Mode, (automatic transition from
PFM to PWM)
11: Bits D[1:0] set to 11, forced PWM operation
1:0
CTLV18A[1:0]
RW
10
Mode control (V8)
00: Converter disabled
01: Auto Mode, (automatic transition from PFM to PWM)
10: Auto Mode, (automatic transition from PFM to PWM)
11: Forced PWM operation
Detailed Description
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SLVSCF4A – DECEMBER 2014 – REVISED JULY 2016
6.6.1.24 V18U25UCNT Register (address = 0x35) [reset = 00001010]
Figure 6-46. V18U25UCNT Register Format
B7
RESERVED_V
18U25UCNT[3]
0
R
B6
RESERVED_V
18U25UCNT[2]
0
R
B5
RESERVED_V
18U25UCNT[1]
0
R
B4
RESERVED_V
18U25UCNT[0]
0
R
B3
AOACCNTV18
U25U[1]
1
RW
B2
AOACCNTV18
U25U[0]
0
RW
B1
B0
CTLV18U25U[1 CTLV18U25U[0
]
]
1
0
RW
RW
LEGEND: R/W = Read/Write; R = Read only; -n = value after reset
Table 6-27. V18U25UCNT Register Field Descriptions
Bit
Field
Type
Reset
Description
7:4
RESERVED_V18U25UCNT[3:0]
R
0000
3:2
AOACCNTV18U25U[1:0]
RW
10
Mode control for exit standby (rising edge of SLP_S0#) changes bits D[1:0] on exit
00: No change in bits D[1:0] - fast change mode disabled
01: Bits D[1:0] set to 01
10: Bits D[1:0] set to 10
11: Bits D[1:0] set to 11
1:0
CTLV18U25U[1:0]
RW
10
Mode control (V9)
00: Disabled
01: Enabled
10: Enabled
11: Enabled
Detailed Description
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6.6.1.25 V1P2UCNT Register (address = 0x36) [reset = 00111010]
Figure 6-47. V1P2UCNT Register Format
B7
V1P2ULVSEL
B6
V1P2UVSEL[2]
B5
V1P2UVSEL[1]
B4
V1P2UVSEL[0]
0
RW
0
RW
1
RW
1
RW
B3
AOACCNTV1P
2U[1]
1
RW
B2
AOACCNTV1P
2U[0]
0
RW
B1
CTLV1P2U[1]
B0
CTLV1P2U[0]
1
RW
0
RW
LEGEND: R/W = Read/Write; R = Read only; -n = value after reset
Table 6-28. V1P2UCNT Register Field Descriptions
Bit
Field
Type
Reset
Description
V1P2ULVSEL
RW
0
V1.2U low power mode output voltage set point - set at
assertion of SLP_S0#
0: Disabled, voltage stays at value set by V1P2UVSEL
1: Vnom - 3%
6:4
V1P2UVSEL[2:0]
RW
011
Output voltage select
000: Vnom + 3%
001: Vnom + 2%
010: Vnom + 1%
011: Vnom + 0%
100: Vnom - 1%
101: Vnom - 2%
110: Vnom - 3%
111: Vnom -4%
3:2
AOACCNTV1P2U[1:0]
RW
10
Mode control for exit standby (rising edge of SLP_S0#) changes bits D[1:0] on exit
00: no change in bits D[1:0] - fast change mode disabled
01: Bits D[1:0] set to 01, Auto Mode, (automatic transition from
PFM to PWM)
10: Bits D[1:0] set to 10, Auto Mode, (automatic transition from
PFM to PWM)
11: Bits D[1:0] set to 11, forced PWM operation
1:0
CTLV1P2U[1:0]
RW
10
Mode control (V10)
00: Converter disabled
01: Auto Mode, (automatic transition from PFM to PWM)
10: Auto Mode, (automatic transition from PFM to PWM)
11: Forced PWM operation
7
96
Detailed Description
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SLVSCF4A – DECEMBER 2014 – REVISED JULY 2016
6.6.1.26 V100ACNT Register (address = 0x37) [reset = 00011010]
Figure 6-48. V100ACNT Register Format
B7
B6
V100ALVSEL[1 V100ALVSEL[0
]
]
0
0
RW
RW
B5
V100AVSEL[1]
B4
V100AVSEL[0]
0
RW
1
RW
B3
AOACCNTV10
0A[1]
1
RW
B2
AOACCNTV10
0A[0]
0
RW
B1
CTLV100A[1]
B0
CTLV100A[0]
1
RW
0
RW
LEGEND: R/W = Read/Write; R = Read only; -n = value after reset
Table 6-29. V100ACNT Register Field Descriptions
Bit
Field
Type
Reset
Description
7:6
V100ALVSEL[1:0]
RW
00
V100A low power mode output voltage set point - set at
assertion of SLP_S0#
00: Disabled, voltage stays at value set by V100AVSEL[1:0]
01: Vnom - 4%
10: Vnom - 3%
11: Vnom - 2%
5:4
V100AVSEL[1:0]
RW
01
Output voltage select
00: Vnom + 5% (1.05 V)
01: Vnom (1 V)
10: Vnom - 2.5% (0.975 V)
11: Vnom - 5% (0.95V)
3:2
AOACCNTV100A[1:0]
RW
10
Mode control for exit standby (rising edge of SLP_S0#) changes bits D[1:0] on exit
00: No change in bits D[1:0] - fast change mode disabled
01: Bits D[1:0] set to 01, Auto Mode, (automatic transition from
PFM to PWM)
10: Bits D[1:0] set to 10, Auto Mode, (automatic transition from
PFM to PWM)
11: Bits D[1:0] set to 11, forced PWM operation
1:0
CTLV100A[1:0]
RW
10
Mode control (V11)
00: Converter disabled
01: Auto Mode, (automatic transition from PFM to PWM)
10: Auto Mode, (automatic transition from PFM to PWM)
11: Forced PWM operation
Detailed Description
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6.6.1.27 V085ACNT Register (address = 0x38) [reset = 00101010]
Figure 6-49. V085ACNT Register Format
B7
B6
V085ALVSEL[1 V085ALVSEL[0
]
]
0
0
RW
RW
B5
V085AVSEL[1]
B4
V085AVSEL[0]
1
RW
0
RW
B3
AOACCNTV08
5A[1]
1
RW
B2
AOACCNTV08
5A[0]
0
RW
B1
CTLV085A[1]
B0
CTLV085A[0]
1
RW
0
RW
LEGEND: R/W = Read/Write; R = Read only; -n = value after reset
Table 6-30. V085ACNT Register Field Descriptions
98
Bit
Field
Type
Reset
Description
7:6
V085ALVSEL[1:0]
RW
00
V085A low power mode output voltage set point - set at
assertion of SLP_S0#
00: Disabled, voltage stays at value set by V085AVSEL[1:0]
01: 0.70 V
10: 0.75 V
11: 0.80 V
5:4
V085AVSEL[1:0]
RW
00
Output voltage select
00: 0.95 V
01: 0.90 V
10: 0.85 V
11: 0.80 V
3:2
AOACCNTV085A[1:0]
RW
10
Mode control for exit standby (rising edge of SLP_S0#) changes bits D[1:0] on exit
00: No change in bits D[1:0] - fast change mode disabled
01: Bits D[1:0] set to 01, Auto Mode, (automatic transition from
PFM to PWM)
10: Bits D[1:0] set to 10, Auto Mode, (automatic transition from
PFM to PWM)
11: Bits D[1:0] set to 11, forced PWM operation
1:0
CTLV085A[1:0]
RW
10
Mode control (V12)
00: Converter disabled
01: Auto Mode, (automatic transition from PFM to PWM)
10: Auto Mode, (automatic transition from PFM to PWM)
11: Forced PWM operation
Detailed Description
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6.6.1.28 VRMODECTRL Register (address = 0x3B) [reset = 00111111]
Figure 6-50. VRMODECTRL Register Format
B7
RESERVED_V
RMODECTRL[
1]
0
R
B6
RESERVED_V
RMODECTRL[
0]
0
R
B5
V33ADSW_LP
M
B4
VCCIO_LPM
B3
V085A_LPM
B2
V12U_LPM
B1
V100A_LPM
B0
V5ADS3_LPM
1
RW
1
RW
1
RW
1
RW
1
RW
1
RW
LEGEND: R/W = Read/Write; R = Read only; -n = value after reset
Table 6-31. VRMODECTRL Register Field Descriptions
Bit
Field
Type
Reset
7:6
RESERVED_VRMODECTRL[1:0]
R
00
Description
5
V33ADSW_LPM
RW
1
Force low power mode (Auto mode). This is only used if forcing
PWM in CTLV33ADSW [1:0] bits of V33ADSWCNT register.
0: Force Auto mode when STANDBY# (SLP_S0#) is asserted
(low) {Over-rides setting of register V33ADSWCNT, bits
CTLV33ADSW [1:0] when STANDBY# is low}
1: Mode set by CTLV33ADSW [1:0] bits when STANDBY#
(SLP_S0#) {Does what is setting of register bits CTLV33ADSW
[1:0] when STANDBY# is low}
4
VCCIO_LPM
RW
1
Force low power mode (Auto mode). This is only used if forcing
PWM in CTLVCCIO [1:0] bits of VCCIOCNT register.
0: Force Auto mode when STANDBY# (SLP_S0#) is asserted
(low) {Over-rides setting of register VCCIOCNT, bits CTLVCCIO
[1:0] when STANDBY# is low}
1: Mode set by CTLVCCIO [1:0] bits when STANDBY#
(SLP_S0#) {Does what is setting of register bits CTLVCCIO [1:0]
when STANDBY# is low}
3
V085A_LPM
RW
1
Force low power mode (Auto mode). This is only used if forcing
PWM in CTLV085A [1:0] register.
0: Force Auto mode when STANDBY# (SLP_S0#) is asserted
(low) {Over-rides setting of register V085ACNT, bits CTLV085A
[1:0] when STANDBY# is low}
1: Mode set by CTLV085A [1:0] bits when STANDBY#
(SLP_S0#) {Does what is setting of register bits CTLV085A [1:0]
when STANDBY# is low}
2
V12U_LPM
RW
1
Force low power mode (Auto mode). This is only used if forcing
PWM in CTLV12U [1:0] bits in V12UCNT register.
0: Force Auto mode when STANDBY# (SLP_S0#) is asserted
(low) {Over-rides setting of register V12UCNT, bits CTLV12U
[1:0] when STANDBY# is low}
1: Mode set by CTLV12U [1:0] bits when STANDBY#
(SLP_S0#) {Does what is setting of register bits CTLV12U [1:0]
when STANDBY# is low}
1
V100A_LPM
RW
1
Force low power mode (Auto mode). This is only used if forcing
PWM in CTLV100A [1:0] bits in V100ACNTregister.
0: Force Auto mode when STANDBY# (SLP_S0#) is asserted
(low) {Over-rides setting of register V100ACNT, bits CTLV100A
[1:0] when STANDBY# is low}
1: Mode set by CTLV100A [1:0] bits when STANDBY#
(SLP_S0#) {Does what is setting of register bits CTLV100A[1:0]
when STANDBY# is low}
0
V5ADS3_LPM
RW
1
Force low power mode (Auto mode). This is only used if forcing
PWM in CTLV5ADS3 [1:0] bits in V5ADS3CNT register.
0: Force Auto mode when STANDBY# (SLP_S0#) is asserted
(low) {Over-rides setting of register V5ADS3,CNT bits
CTLVV33ADSW [1:0] when STANDBY# is low}
1: Mode set by CTLV5ADS3 [1:0] bits when STANDBY#
(SLP_S0#) {Does what is setting of register bits CTLV5ADS3
[1:0] when STANDBY# is low}
Detailed Description
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6.6.1.29 DISCHCNT1 Register (address = 0x3C) [reset = 00000000]
Figure 6-51. DISCHCNT1 Register Format
B7
B6
B5
B4
B3
B2
B1
B0
RESERVED_DI RESERVED_DI RESERVED_DI RESERVED_DI RESERVED_DI RESERVED_DI VCCIODISCHG VCCIODISCHG
SCHCNT1[5]
SCHCNT1[4]
SCHCNT1[3]
SCHCNT1[2]
SCHCNT1[1]
SCHCNT1[0]
[1]
[0]
0
0
0
0
0
0
0
0
R
R
R
R
R
R
RW
RW
LEGEND: R/W = Read/Write; R = Read only; -n = value after reset
Table 6-32. DISCHCNT1 Register Field Descriptions
Bit
Field
Type
Reset
7:2
RESERVED_DISCHCNT1[5:0]
R
000000
1:0
VCCIODISCHG[1:0]
RW
00
Description
VCCIO discharge resistance at VSD, (TPS650831 at FBVR3P)
00: >1000 kΩ
01: 125 Ω
10: 225 Ω
11: 550 Ω
6.6.1.30 DISCHCNT2 Register (address = 0x3D) [reset = 00000000]
Figure 6-52. DISCHCNT2 Register Format
B7
B6
V5ADS3DISCH V5ADS3DISCH
G[1]
G[0]
0
0
RW
RW
B5
V33ADSWDIS
CHG[1]
0
RW
B4
V33ADSWDIS
CHG[0]
0
RW
B3
B2
V33PCHDISCH V33PCHDISCH
G[1]
G[0]
0
0
RW
RW
B1
V18ADISCH[1]
B0
V18ADISCH[0]
0
RW
0
RW
LEGEND: R/W = Read/Write; R = Read only; -n = value after reset
Table 6-33. DISCHCNT2 Register Field Descriptions
100
Bit
Field
Type
Reset
Description
7:6
V5ADS3DISCHG[1:0]
RW
00
V5ADS3 discharge resistance at FBVR5P, (TPS650831 at VSC)
00: No discharge
01: 100 Ω
10: 200 Ω
11: 500 Ω
5:4
V33ADSWDISCHG[1:0]
RW
00
V33A_DSW discharge resistance at FBVR3P, (TPS650831 at
VSD)
00: No discharge
01: 100 Ω
10: 200 Ω
11: 500 Ω
3:2
V33PCHDISCHG[1:0]
RW
00
V33A_PCH discharge resistance at VSA
00: No discharge
01: 100 Ω
10: 200 Ω
11: 500 Ω
1:0
V18ADISCH[1:0]
RW
00
V18A discharge resistance at FBVR2P, (TPS650831 at
FBVR5P)
00: 860 Ω
01: 100 Ω
10: 200 Ω
11: 500 Ω
Detailed Description
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6.6.1.31 DISCHCNT3 Register (address = 0x3E) [reset = 00000000]
Figure 6-53. DISCHCNT3 Register Format
B7
V18U25UDISC
HG[1]
0
RW
B6
V18U25UDISC
HG[0]
0
RW
B5
V12UDISCHG[
1]
0
RW
B4
V12UDISCHG[
0]
0
RW
B3
B2
B1
B0
V100ADISCHG V100ADISCHG V085ADISCH[1 V085ADISCH[0
[1]
[0]
]
]
0
0
0
0
RW
RW
RW
RW
LEGEND: R/W = Read/Write; R = Read only; -n = value after reset
Table 6-34. DISCHCNT3 Register Field Descriptions
Bit
Field
Type
Reset
Description
7:6
V18U25UDISCHG[1:0]
RW
00
V1.8U_2.5U discharge resistance at VSB
00: No discharge
01: 100 Ω
10: 200 Ω
11: 500 Ω
5:4
V12UDISCHG[1:0]
RW
00
V1.2U discharge resistance at FBVR4P
00: >1000 kΩ
01: 125 Ω
10: 225 Ω
11: 550 Ω
3:2
V100ADISCHG[1:0]
RW
00
V100A discharge resistance at FBVR1P
00: >1000 kΩ
01: 125 Ω
10: 225 Ω
11: 550 Ω
1:0
V085ADISCH[1:0]
RW
00
V085A discharge resistance, (TPS650831 at FBVR2P)
00: >1000 kΩ
01: 150 Ω
10: 250 Ω
11: 575 Ω
Detailed Description
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6.6.1.32 DISCHCNT4 Register (address = 0x3F) [reset = 00000000]
Figure 6-54. DISCHCNT4 Register Format
B7
B6
RESERVED_DI RESERVED_DI
SCHCNT4[1]
SCHCNT4[0]
0
0
R
R
B5
V33SDISCHG[
1]
0
RW
B4
V33SDISCHG[
0]
0
RW
B3
V18SDISCHG[
1]
0
RW
B2
V18SDISCHG[
0]
0
RW
B1
B0
V100SDISCH[1 V100SDISCH[0
]
]
0
0
RW
RW
LEGEND: R/W = Read/Write; R = Read only; -n = value after reset
Table 6-35. DISCHCNT4 Register Field Descriptions
102
Bit
Field
Type
Reset
Description
7:6
RESERVED_DISCHCNT4[1:0]
R
00
5:4
V33SDISCHG[1:0]
RW
00
V3.3S discharge resistance at VSE
00: No discharge
01: 100 Ω
10: 200 Ω
11: 500 Ω
3:2
V18SDISCHG[1:0]
RW
00
V18S discharge resistance at VSF
00: No discharge
01: 100 Ω
10: 200 Ω
11: 500 Ω
1:0
V100SDISCH[1:0]
RW
00
V100S discharge resistance at VSG
00: No discharge
01: 100 Ω
10: 200 Ω
11: 500 Ω
Detailed Description
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SLVSCF4A – DECEMBER 2014 – REVISED JULY 2016
6.6.1.33 PWRGDCNT1 Register (address = 0x40) [reset = 01011111 ]
Figure 6-55. PWRGDCNT1 Register Format
B7
B6
B5
B4
RESERVED_P RSMRSTN_PW RSMRSTN_PW PCH_PWROK[
WRGDCNT1
RGD[1]
RGD[0]
1]
0
1
0
1
R
RW
RW
RW
B3
PCH_PWROK[
0]
1
RW
B2
DEL_ALL_SYS
_PWRGD[2]
1
RW
B1
DEL_ALL_SYS
_PWRGD[1]
1
RW
B0
DEL_ALL_SYS
_PWRGD[0]
1
RW
LEGEND: R/W = Read/Write; R = Read only; -n = value after reset
Table 6-36. PWRGDCNT1 Register Field Descriptions
Bit
7
Field
Type
Reset
Description
RESERVED_PWRGDCNT1
R
0
6:5
RSMRSTN_PWRGD[1:0]
RW
10
Delay of RSMRSTN_PWRGD, [RTC = 30.5 µs ±10%]
00: No Delay
01: 164x RTC (5.5 ms)
10: 360x RTC (11 ms)
11: 721x RTC (22 ms)
4:3
PCH_PWROK[1:0]
RW
11
Delay of PCH_PWROK compared to ALL_SYS_PWRGD, [RTC
= 30.5 µs ±10%]
00: 82x RTC (2.5 ms)
01: 164x RTC (5 ms)
10: 328x RTC (10 ms)
11: 656x RTC (20 ms)
2:0
DEL_ALL_SYS_PWRGD[2:0]
RW
111
Delay of SYS_PWR_OK compared to ALL_SYS_PWRGD, [RTC
= 30.5 µs ±10%]
000: 82x RTC (2.5 ms)
001: 164x RTC (5 ms)
010: 328x RTC (10 ms)
011: 492x RTC (15 ms)
100: 656x RTC (20 ms)
101: 1640x RTC (50 ms)
110: 2460x RTC (75 ms)
111: 3280x RTC (100 ms)
Detailed Description
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6.6.1.34 VREN Register (address = 0x41) [reset = 00000000]
Figure 6-56. VREN Register Format
B7
RESERVED_V
REN[5]
0
RW
B6
RESERVED_V
REN[4]
0
RW
B5
RESERVED_V
REN[3]
0
RW
B4
RESERVED_V
REN[2]
0
RW
B3
RESERVED_V
REN[1]
0
RW
B2
RESERVED_V
REN[0]
0
RW
B1
EC_SLP_S4
B0
EC_DS4
0
RW
0
RW
B1
RESERVED[0]
0
R
B0
CNTLOCK
0
RW
LEGEND: R/W = Read/Write; R = Read only; -n = value after reset
Table 6-37. VREN Register Field Descriptions
Bit
Field
Type
Reset
7:2
Description
RESERVED_VREN[5:0]
RW
000000
1
EC_SLP_S4
RW
0
0: Disable
1: Enable
0
EC_DS4
RW
0
0: Disable
1: Enable
6.6.1.35 REGLOCK Register (address = 0x42) [reset = 00000000]
Figure 6-57. REGLOCK Register Format
B7
RESERVED[6]
0
R
B6
RESERVED[5]
0
R
B5
RESERVED[4]
0
R
B4
RESERVED[3]
0
R
B3
RESERVED[2]
0
R
B2
RESERVED[1]
0
R
LEGEND: R/W = Read/Write; R = Read only; -n = value after reset
Table 6-38. REGLOCK Register Field Descriptions
Bit
Field
Type
Reset
7:1
RESERVED[6:0]
R
0000000
CNTLOCK
RW
0
0
104
Description
Locks all V*CNT registers
0: All V*CNT registers are unlocked and can be overwritten
1: All V*CNT registers are locked and cannot be overwritten
Detailed Description
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6.6.1.36 VRENPINMASK Register (address = 0x43) [reset = 00000000]
Figure 6-58. VRENPINMASK Register Format
B7
MV12EN
0
RW
B6
MV11EN
0
RW
B5
MV10EN
0
RW
B4
MV9EN
0
RW
B3
MV8EN
0
RW
B2
MV7EN
0
RW
B1
MV5EN
0
RW
B0
MV4EN
0
RW
LEGEND: R/W = Read/Write; R = Read only; -n = value after reset
Table 6-39. VRENPINMASK Register Field Descriptions
Bit
Field
Type
Reset
Description
7
MV12EN
RW
0
V12 Enable Pin Mask
0: VR Enable Pin controls VR enable
1: VR Enable Pin masked V*CTLV controls VR enable
6
MV11EN
RW
0
V11 Enable Pin Mask
0: VR Enable Pin controls VR enable
1: VR Enable Pin masked V*CTLV controls VR enable
5
MV10EN
RW
0
V10 Enable Pin Mask
0: VR Enable Pin controls VR enable
1: VR Enable Pin masked V*CTLV controls VR enable
4
MV9EN
RW
0
V9 Enable Pin Mask
0: VR Enable Pin controls VR enable
1: VR Enable Pin masked V*CTLV controls VR enable
3
MV8EN
RW
0
V8 Enable Pin Mask
0: VR Enable Pin controls VR enable
1: VR Enable Pin masked V*CTLV controls VR enable
2
MV7EN
RW
0
V7 Enable Pin Mask
0: VR Enable Pin controls VR enable
1: VR Enable Pin masked V*CTLV controls VR enable
1
MV5EN
RW
0
V5 Enable Pin Mask
0: VR Enable Pin controls VR enable
1: VR Enable Pin masked V*CTLV controls VR enable
0
MV4EN
RW
0
V4 Enable Pin Mask
0: VR Enable Pin controls VR enable
1: VR Enable Pin masked V*CTLV controls VR enable
Detailed Description
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6.6.1.37 RSTCTRL Register (address = 0x48) [reset = 00011100]
Figure 6-59. RSTCTRL Register Format
B7
RESERVED_R
STCTRL[2]
0
R
B6
RESERVED_R
STCTRL[1]
0
R
B5
RESERVED_R
STCTRL[0]
0
R
B4
TRST[1]
B3
TRST[0]
B2
VTHRST[2]
B1
VTHRST[1]
B0
VTHRST[0]
1
RW
1
RW
1
RW
0
RW
0
RW
B1
RESERVED_S
DWNCTRL[0]
0
R
B0
SDWN
LEGEND: R/W = Read/Write; R = Read only; -n = value after reset
Table 6-40. RSTCTRL Register Field Descriptions
Bit
Field
Type
Reset
Description
7:5
RESERVED_RSTCTRL[2:0]
R
000
4:3
TRST[1:0]
RW
11
Reset time duration
00: 20 ms
01: 40 ms
10: 80 ms
11: 200 ms
2:0
VTHRST[2:0]
RW
100
Reset voltage threshold
000: 1.4 V
001: 1.5 V
010: 1.6 V
011: 1.7 V
100: 2.4 V
101: 2.6 V
110: 2.8 V
111: 3.0 V
6.6.1.38 SDWNCTRL Register (address = 0x49) [reset = 00000000]
Figure 6-60. SDWNCTRL Register Format
B7
RESERVED_S
DWNCTRL[6]
0
R
B6
RESERVED_S
DWNCTRL[5]
0
R
B5
RESERVED_S
DWNCTRL[4]
0
R
B4
RESERVED_S
DWNCTRL[3]
0
R
B3
RESERVED_S
DWNCTRL[2]
0
R
B2
RESERVED_S
DWNCTRL[1]
0
R
0
RW
LEGEND: R/W = Read/Write; R = Read only; -n = value after reset
Table 6-41. SDWNCTRL Register Field Descriptions
Bit
Field
Type
Reset
7:1
RESERVED_SDWNCTRL[6:0]
R
0000000
SDWN
RW
0
0
106
Description
Forced emergency reset, bit is self clearing
0: No action
1: Force emergency reset
Detailed Description
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SLVSCF4A – DECEMBER 2014 – REVISED JULY 2016
6.6.1.39 VDLMTCRT Register (address = 0x51) [reset = 00000101]
Figure 6-61. VDLMTCRT Register Format
B7
RESERVED_V
DLMTCRT
0
RW
B6
VDLMTCOMP
0
RW
B5
TDBNCVDLMT
CRT[1]
0
RW
B4
B3
B2
B1
B0
TDBNCVDLMT VDLMTCRTH[3 VDLMTCRTH[2 VDLMTCRTH[1 VDLMTCRTH[0
CRT[0]
]
]
]
]
0
0
1
0
1
RW
RW
RW
RW
RW
LEGEND: R/W = Read/Write; R = Read only; -n = value after reset
Table 6-42. VDLMTCRT Register Field Descriptions
Bit
Field
Type
Reset
Description
7
RESERVED_VDLMTCRT
RW
0
6
VDLMTCOMP
RW
0
Critical supply voltage comparator for VDCSNS pin input voltage
sense. Connect voltage divider resistors from VIN to detect
when input voltage is low
0: disable
1: enable
5:4
TDBNCVDLMTCRT[1:0]
RW
00
Supply voltage monitor debounce of VDCSNS input voltage
sense pin
00: No Deglitch
01: 10 µs
10: 1x RTC (30us)
11: 2x RTC (60us)
3:0
VDLMTCRTH[3:0]
RW
0101
Critical supply voltage falling threshold on VDCSNS pin.
Connect voltage divider resistors from VIN to detect when input
voltage is low. For 2S should be 4X top resistor, X bottom
resistor. [rising hysteresis = 20 mV]
0000: no limit
0001: 1.2 V
0010: 1.18 V
0011: 1.16 V
0100: 1.14 V
0101: 1.12 V
0110: 1.10 V
0111: 1.08 V
1xxx: NA
Detailed Description
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6.6.1.40 ACOKDBDM Register (address = 0x69) [reset = 00001111]
Figure 6-62. ACOKDBDM Register Format
B7
RESERVED_A
COKDBDM[3]
0
RW
B6
RESERVED_A
COKDBDM[2]
0
RW
B5
RESERVED_A
COKDBDM[1]
0
RW
B4
RESERVED_A
COKDBDM[0]
0
RW
B3
ACOKDB[1]
B2
ACOKDB[0]
B1
ACOKDM[1]
B0
ACOKDM[0]
1
RW
1
RW
1
RW
1
RW
LEGEND: R/W = Read/Write; R = Read only; -n = value after reset
Table 6-43. ACOKDBDM Register Field Descriptions
Bit
Field
Type
Reset
Description
7:4
RESERVED_ACOKDBDM[3:0]
RW
0000
3:2
ACOKDB[1:0]
RW
11
Adapter detection debounce time
00: 81 µs
01: 10 ms
10: 20 ms
11: 30 ms
1:0
ACOKDM[1:0]
RW
11
Adapter detection mode
00: reserved
01: low-to-high
10: high-to-low
11: both, low-to-high and high-to-low
6.6.1.41 LOWBATTDET Register (address = 0x6A) [reset = 11111000]
Figure 6-63. LOWBATTDET Register Format
B7
B6
LOWBATTDB[1 LOWBATTDB[0
]
]
1
RW
1
RW
B5
LOWBATT2_E
N
B4
LOWBATT1_E
N
B3
ACIN_EN
1
RW
1
RW
1
RW
B2
B1
B0
RESERVED_L RESERVED_L RESERVED_L
OWBATTDET[2 OWBATTDET[1 OWBATTDET[0
]
]
]
0
0
0
RW
RW
RW
LEGEND: R/W = Read/Write; R = Read only; -n = value after reset
Table 6-44. LOWBATTDET Register Field Descriptions
Bit
Field
Type
Reset
Description
7:6
LOWBATTDB[1:0]
RW
11
Low battery detection debounce time
00: 4 RTC periods (120 µs)
01: 32 RTC periods (960 µs)
10: 64 RTC periods (1920 µs)
11: 128 RTC periods (3840 µs)
5
LOWBATT2_EN
RW
1
Low battery Two detection Enable
0: Disable
1: Enable
4
LOWBATT1_EN
RW
1
Low battery One detection Enable
0: Disable
1: Enable
3
ACIN_EN
RW
1
AC IN Comparator
0: Disable
1: Enable
RESERVED_LOWBATTDET[2:0]
RW
000
2:0
108
Detailed Description
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6.6.1.42 SPWRSRCINT Register (address = 0x6F) [reset = 00000000]
Figure 6-64. SPWRSRCINT Register Format
B7
RESERVED1_
SPWRSRCINT
B6
SLOWBATT2
B5
SLOWBATT1
B4
SACOK
0
R
0
R
0
R
0
R
B3
B2
B1
B0
RESERVED_S RESERVED_S RESERVED_S RESERVED_S
PWRSRCINT[3 PWRSRCINT[2 PWRSRCINT[1 PWRSRCINT[0
]
]
]
]
0
0
0
0
R
R
R
R
LEGEND: R/W = Read/Write; R = Read only; -n = value after reset
Table 6-45. SPWRSRCINT Register Field Descriptions
Bit
Field
Type
Reset
7
RESERVED1_SPWRSRCINT
R
0
6
SLOWBATT2
R
0
LOWBATT2 detection status
0: BATT2 above threshold
1: BATT2 below threshold
5
SLOWBATT1
R
0
LOWBATT1 detection status
0: BATT1 above threshold
1: BATT1 below threshold
4
SACOK
R
0
AC adapter (ACOK) detection status
0: Adapter removed
1: Adapter inserted
RESERVED_SPWRSRCINT[3:0]
R
0000
3:0
Description
6.6.1.43 CLKCTRL1 Register (address = 0xD0) [reset = 00000000]
Figure 6-65. CLKCTRL1 Register Format
B7
RESERVED_C
LKCTRL1[6]
0
RW
B6
RESERVED_C
LKCTRL1[5]
0
RW
B5
RESERVED_C
LKCTRL1[4]
0
RW
B4
RESERVED_C
LKCTRL1[3]
0
RW
B3
RESERVED_C
LKCTRL1[2]
0
RW
B2
RESERVED_C
LKCTRL1[1]
0
RW
B1
RESERVED_C
LKCTRL1[0]
0
RW
B0
ECWAKEEN
0
RW
LEGEND: R/W = Read/Write; R = Read only; -n = value after reset
Table 6-46. CLKCTRL1 Register Field Descriptions
Bit
Field
Type
Reset
7:1
RESERVED_CLKCTRL1[6:0]
RW
0000000
ECWAKEEN
RW
0
0
Description
1 Hz clock
0: clock OFF
1: Clock ON
Detailed Description
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6.6.1.44 COMPA_REF Register (address = 0xDD) [reset = 00000000]
Figure 6-66. COMPA_REF Register Format
B7
COMPA_MOD
E
X
RW
B6
B5
B4
B3
B2
B1
B0
COMPA_DVS[3 COMPA_DVS[2 COMPA_DVS[1 COMPA_DVS[0 COMPA_VSEL[ COMPA_VSEL[ COMPA_VSEL[
]
]
]
]
2]
1]
0]
X
X
X
X
X
X
X
RW
RW
RW
RW
RW
RW
RW
LEGEND: R/W = Read/Write; R = Read only; -n = value after reset
Table 6-47. COMPA_REF Register Field Descriptions
Bit
Field
Type
Reset
Description
COMPA_Mode
RW
0
Comparator Mode:
0: PGOOD Mode
1: Comparator Mode
6:3
COMPA_DVS[3:0]
RW
0000
Comparator Window Voltage Shifting:
% deviation from VSEL if VSEL >1.05V
or second voltage option if VSEL = 1 V
0000 = + 3% or 1.05 V
0001 = + 2% or 1 V
0010 = + 1% or 0.975 V
0011 = + 0% or 0.95 V
0100 = - 1% or 0.9 V
0101 = - 2% or 0.875 V
0110 = - 3% or 0.85 V
0111 = - 4% or 0.8 V
1000 = 0.75 V
1001 = 0.7 V
2:0
COMPA_VSEL[2:0]
RW
000
Comparator Window Voltage Select:
000 = 1 V
001 = 1.2 V
010 = 1.5 V
011 = 1.8 V
100 = 1.1 V
101 = 1.35 V
110 = 3.3 V
111 = 2.5 V / 5 V
7
110
Detailed Description
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6.6.1.45 COMPB_REF Register (address = 0xDE) [reset = 00000000]
Figure 6-67. COMPB_REF Register Format
B7
COMPB_MOD
E
X
RW
B6
B5
B4
B3
B2
B1
B0
COMPB_DVS[3 COMPB_DVS[2 COMPB_DVS[1 COMPB_DVS[0 COMPB_VSEL[ COMPB_VSEL[ COMPB_VSEL[
]
]
]
]
2]
1]
0]
X
X
X
X
X
X
X
RW
RW
RW
RW
RW
RW
RW
LEGEND: R/W = Read/Write; R = Read only; -n = value after reset
Table 6-48. COMPB_REF Register Field Descriptions
Bit
Field
Type
Reset
Description
COMPB_Mode
RW
0
Comparator Mode:
0: PGOOD Mode
1: Comparator Mode
6:3
COMPB_DVS[3:0]
RW
0000
Comparator Window Voltage Shifting:
% deviation from VSEL if VSEL >1.05V
or second voltage option if VSEL = 1 V
0000 = + 3% or 1.05 V
0001 = + 2% or 1 V
0010 = + 1% or 0.975 V
0011 = + 0% or 0.95 V
0100 = - 1% or 0.9 V
0101 = - 2% or 0.875 V
0110 = - 3% or 0.85 V
0111 = - 4% or 0.8 V
1000 = 0.75 V
1001 = 0.7 V
2:0
COMPB_VSEL[2:0]
RW
000
Comparator Window Voltage Select:
000 = 1 V
001 = 1.2 V
010 = 1.5 V
011 = 1.8 V
100 = 1.1 V
101 = 1.35 V
110 = 3.3 V
111 = 2.5 V / 5 V
7
Detailed Description
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6.6.1.46 COMPC_REF Register (address = 0xDF) [reset = 00000000]
Figure 6-68. COMPC_REF Register Format
B7
COMPC_MOD
E
1
RW
B6
COMPC_DVS[
3]
0
RW
B5
COMPC_DVS[
2]
0
RW
B4
COMPC_DVS[
1]
0
RW
B3
COMPC_DVS[
0]
1
RW
B2
B1
B0
COMPC_VSEL[ COMPC_VSEL[ COMPC_VSEL[
2]
1]
0]
0
0
0
RW
RW
RW
LEGEND: R/W = Read/Write; R = Read only; -n = value after reset
Table 6-49. COMPC_REF Register Field Descriptions
Bit
Field
Type
Reset
Description
COMPC_Mode
RW
0
Comparator Mode:
0: PGOOD Mode
1: Comparator Mode
6:3
COMPC_DVS[3:0]
RW
0000
Comparator Window Voltage Shifting:
% deviation from VSEL if VSEL >1.05V
or second voltage option if VSEL = 1 V
0000 = + 3% or 1.05 V
0001 = + 2% or 1 V
0010 = + 1% or 0.975 V
0011 = + 0% or 0.95 V
0100 = - 1% or 0.9 V
0101 = - 2% or 0.875 V
0110 = - 3% or 0.85 V
0111 = - 4% or 0.8 V
1000 = 0.75 V
1001 = 0.7 V
2:0
COMPC_VSEL[2:0]
RW
000
Comparator Window Voltage Select:
000 = 1 V
001 = 1.2 V
010 = 1.5 V
011 = 1.8 V
100 = 1.1 V
101 = 1.35 V
110 = 3.3 V
111 = 2.5 V / 5 V
7
112
Detailed Description
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6.6.1.47 COMPD_REF Register (address = 0xE0) [reset = 00000000]
Figure 6-69. COMPD_REF Register Format
B7
COMPD_MOD
E
X
RW
B6
COMPD_DVS[
3]
X
RW
B5
COMPD_DVS[
2]
X
RW
B4
COMPD_DVS[
1]
X
RW
B3
COMPD_DVS[
0]
X
RW
B2
B1
B0
COMPD_VSEL[ COMPD_VSEL[ COMPD_VSEL[
2]
1]
0]
X
X
X
RW
RW
RW
LEGEND: R/W = Read/Write; R = Read only; -n = value after reset
Table 6-50. COMPD_REF Register Field Descriptions
Bit
Field
Type
Reset
Description
COMPD_Mode
RW
0
Comparator Mode:
0: PGOOD Mode
1: Comparator Mode
6:3
COMPD_DVS[3:0]
RW
0000
Comparator Window Voltage Shifting:
% deviation from VSEL if VSEL >1.05V
or second voltage option if VSEL = 1 V
0000 = + 3% or 1.05 V
0001 = + 2% or 1 V
0010 = + 1% or 0.975 V
0011 = + 0% or 0.95 V
0100 = - 1% or 0.9 V
0101 = - 2% or 0.875 V
0110 = - 3% or 0.85 V
0111 = - 4% or 0.8 V
1000 = 0.75 V
1001 = 0.7 V
2:0
COMPD_VSEL[2:0]
RW
000
Comparator Window Voltage Select:
000 = 1 V
001 = 1.2 V
010 = 1.5 V
011 = 1.8 V
100 = 1.1 V
101 = 1.35 V
110 = 3.3 V
111 = 2.5 V / 5 V
7
Detailed Description
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6.6.1.48 COMPE_REF Register (address = 0xE1) [reset = 00000000]
Figure 6-70. COMPE_REF Register Format
B7
COMPE_MOD
E
X
RW
B6
B5
B4
B3
B2
B1
B0
COMPE_DVS[3 COMPE_DVS[2 COMPE_DVS[1 COMPE_DVS[0 COMPE_VSEL[ COMPE_VSEL[ COMPE_VSEL[
]
]
]
]
2]
1]
0]
X
X
X
X
X
X
X
RW
RW
RW
RW
RW
RW
RW
LEGEND: R/W = Read/Write; R = Read only; -n = value after reset
Table 6-51. COMPE_REF Register Field Descriptions
Bit
Field
Type
Reset
Description
COMPE_Mode
RW
0
Comparator Mode:
0: PGOOD Mode
1: Comparator Mode
6:3
COMPE_DVS[3:0]
RW
0000
Comparator Window Voltage Shifting:
% deviation from VSEL if VSEL >1.05V
or second voltage option if VSEL = 1 V
0000 = + 3% or 1.05 V
0001 = + 2% or 1 V
0010 = + 1% or 0.975 V
0011 = + 0% or 0.95 V
0100 = - 1% or 0.9 V
0101 = - 2% or 0.875 V
0110 = - 3% or 0.85 V
0111 = - 4% or 0.8 V
1000 = 0.75 V
1001 = 0.7 V
2:0
COMPE_VSEL[2:0]
RW
000
Comparator Window Voltage Select:
000 = 1 V
001 = 1.2 V
010 = 1.5 V
011 = 1.8 V
100 = 1.1 V
101 = 1.35 V
110 = 3.3 V
111 = 2.5 V / 5 V
7
114
Detailed Description
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6.6.1.49 COMPF_REF Register (address = 0xE2) [reset = 00000000]
Figure 6-71. COMPF_REF Register Format
B7
COMPF_MOD
E
X
RW
B6
B5
B4
B3
B2
B1
B0
COMPF_DVS[3 COMPF_DVS[2 COMPF_DVS[1 COMPF_DVS[0 COMPF_VSEL[ COMPF_VSEL[ COMPF_VSEL[
]
]
]
]
2]
1]
0]
X
X
X
X
X
X
X
RW
RW
RW
RW
RW
RW
RW
LEGEND: R/W = Read/Write; R = Read only; -n = value after reset
Table 6-52. COMPF_REF Register Field Descriptions
Bit
Field
Type
Reset
Description
COMPF_Mode
RW
0
Comparator Mode:
0: PGOOD Mode
1: Comparator Mode
6:3
COMPF_DVS[3:0]
RW
0000
Comparator Window Voltage Shifting:
% deviation from VSEL if VSEL >1.05V
or second voltage option if VSEL = 1 V
0000 = + 3% or 1.05 V
0001 = + 2% or 1 V
0010 = + 1% or 0.975 V
0011 = + 0% or 0.95 V
0100 = - 1% or 0.9 V
0101 = - 2% or 0.875 V
0110 = - 3% or 0.85 V
0111 = - 4% or 0.8 V
1000 = 0.75 V
1001 = 0.7 V
2:0
COMPF_VSEL[2:0]
RW
000
Comparator Window Voltage Select:
000 = 1 V
001 = 1.2 V
010 = 1.5 V
011 = 1.8 V
100 = 1.1 V
101 = 1.35 V
110 = 3.3 V
111 = 2.5 V / 5 V
7
Detailed Description
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6.6.1.50 COMPG_REF Register (address = 0xE3) [reset = 00000000]
Figure 6-72. COMPG_REF Register Format
B7
COMPG_MOD
E
X
RW
B6
COMPG_DVS[
3]
X
RW
B5
COMPG_DVS[
2]
X
RW
B4
COMPG_DVS[
1]
X
RW
B3
COMPG_DVS[
0]
X
RW
B2
B1
B0
COMPG_VSEL COMPG_VSEL COMPG_VSEL
[2]
[1]
[0]
X
X
X
RW
RW
RW
LEGEND: R/W = Read/Write; R = Read only; -n = value after reset
Table 6-53. COMPG_REF Register Field Descriptions
Bit
Field
Type
Reset
Description
COMPG_Mode
RW
0
Comparator Mode:
0: PGOOD Mode
1: Comparator Mode
6:3
COMPG_DVS[3:0]
RW
0000
Comparator Window Voltage Shifting:
% deviation from VSEL if VSEL >1.05V
or second voltage option if VSEL = 1 V
0000 = + 3% or 1.05 V
0001 = + 2% or 1 V
0010 = + 1% or 0.975 V
0011 = + 0% or 0.95 V
0100 = - 1% or 0.9 V
0101 = - 2% or 0.875 V
0110 = - 3% or 0.85 V
0111 = - 4% or 0.8 V
1000 = 0.75 V
1001 = 0.7 V
2:0
COMPG_VSEL[2:0]
RW
000
Comparator Window Voltage Select:
000 = 1 V
001 = 1.2 V
010 = 1.5 V
011 = 1.8 V
100 = 1.1 V
101 = 1.35 V
110 = 3.3 V
111 = 2.5 V / 5 V
7
116
Detailed Description
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6.6.1.51 COMPH_REF Register (address = 0xE4) [reset = 00000000]
Figure 6-73. COMPH_REF Register Format
B7
COMPH_DISC
HG
0
RW
B6
COMPH_DVS[
3]
X
RW
B5
COMPH_DVS[
2]
X
RW
B4
COMPH_DVS[
1]
X
RW
B3
COMPH_DVS[
0]
X
RW
B2
B1
B0
COMPH_VSEL[ COMPH_VSEL[ COMPH_VSEL
2]
1]
0]
X
X
X
RW
RW
RW
LEGEND: R/W = Read/Write; R = Read only; -n = value after reset
Table 6-54. COMPH_REF Register Field Descriptions
Bit
Field
Type
Reset
Description
7
COMPH_DISCHG
RW
0
Comparator H Discharge value
0: No discharge
1: 100 Ω
6:3
COMPH_DVS[3:0]
RW
0000
Comparator Window Voltage Shifting:
% deviation from VSEL if VSEL >1.05V
or second voltage option if VSEL = 1 V
0000 = + 3% or 1.05 V
0001 = + 2% or 1 V
0010 = + 1% or 0.975 V
0011 = + 0% or 0.95 V
0100 = - 1% or 0.9 V
0101 = - 2% or 0.875 V
0110 = - 3% or 0.85 V
0111 = - 4% or 0.8 V
1000 = 0.75 V
1001 = 0.7 V
2:0
COMPH_VSEL[2:0]
RW
000
Comparator Window Voltage Select:
000 = 1 V
001 = 1.2 V
010 = 1.5 V
011 = 1.8 V
100 = 1.1 V
101 = 1.35 V
110 = 3.3 V
111 = 2.5 V / 5 V
Detailed Description
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6.6.1.52 PWFAULT_MASK1 Register (address = 0xE5) [reset = 00000000]
Figure 6-74. PWFAULT_MASK1 Register Format
B7
V4_FLTmsK
0
RW
B6
V5_FLTmsK
0
RW
B5
V6_FLTmsK
0
RW
B4
V7_FLTmsK
0
RW
B3
V8_FLTmsK
0
RW
B2
V9_FLTmsK
0
RW
B1
V10_FLTmsK
0
RW
B0
V13_FLTmsK
1
RW
LEGEND: R/W = Read/Write; R = Read only; -n = value after reset
Table 6-55. PWFAULT_MASK1 Register Field Descriptions
Bit
118
Field
Type
Reset
Description
7
V4_FLTmsK
RW
0
V4 Power Fault Masked
0: Not Masked
1: Masked
6
V5_FLTmsK
RW
0
V5 Power Fault Masked
0: Not Masked
1: Masked
5
V6_FLTmsK
RW
0
V6 Power Fault Masked
0: Not Masked
1: Masked
4
V7_FLTmsK
RW
0
V7 Power Fault Masked
0: Not Masked
1: Masked
3
V8_FLTmsK
RW
0
V8 Power Fault Masked
0: Not Masked
1: Masked
2
V9_FLTmsK
RW
0
V9 Power Fault Masked
0: Not Masked
1: Masked
1
V10_FLTmsK
RW
0
V10 Power Fault Masked
0: Not Masked
1: Masked
0
V13_FLTmsK
RW
0
V13 Power Fault Masked
0: Not Masked
1: Masked
Detailed Description
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6.6.1.53 PWFAULT_MASK2 Register (address = 0xE6) [reset = 00000000]
Figure 6-75. PWFAULT_MASK2 Register Format
B7
RESERVED_P
WFAULT_MAS
K2[5]
0
RW
B6
RESERVED_P
WFAULT_MAS
K2[4]
0
RW
B5
RESERVED_P
WFAULT_MAS
K2[3]
0
RW
B4
RESERVED_P
WFAULT_MAS
K2[2]
0
RW
B3
RESERVED_P
WFAULT_MAS
K2[1]
0
RW
B2
RESERVED_P
WFAULT_MAS
K2[0]
0
RW
B1
V11_FLTmsK
B0
V12_FLTmsK
0
RW
0
RW
LEGEND: R/W = Read/Write; R = Read only; -n = value after reset
Table 6-56. PWFAULT_MASK2 Register Field Descriptions
Bit
Field
Reset
Description
7:2
RESERVED_PWFAULT_MASK2[5:
0]
Type
000000
Read Always Returns '1'
1
V11_FLTmsK
0
V11 Power Fault Masked
0: Not Masked
1: Masked
0
V12_FLTmsK
0
V12 Power Fault Masked
0: Not Masked
1: Masked
Detailed Description
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6.6.1.54 PGOOD_STAT1 Register (address = 0xE7) [reset = 00000000]
Figure 6-76. PGOOD_STAT1 Register Format
B7
V13_PGOOD
0
R
B6
V10_PGOOD
0
R
B5
V9_PGOOD
0
R
B4
V8_PGOOD
0
R
B3
V7_PGOOD
0
R
B2
V6_PGOOD
0
R
B1
V5_PGOOD
0
R
B0
V4_PGOOD
0
R
LEGEND: R/W = Read/Write; R = Read only; -n = value after reset
Table 6-57. PGOOD_STAT1 Register Field Descriptions
Bit
120
Field
Type
Reset
Description
7
V13_PGOOD
R
0
V13 PGOOD STATUS
0: Fail
1: Pass
6
V10_PGOOD
R
0
V10 PGOOD STATUS
0: Fail
1: Pass
5
V9_PGOOD
R
0
V9 PGOOD STATUS
0: Fail
1: Pass
4
V8_PGOOD
R
0
V8 PGOOD STATUS
0: Fail
1: Pass
3
V7_PGOOD
R
0
V7 PGOOD STATUS
0: Fail
1: Pass
2
V6_PGOOD
R
0
V6 PGOOD STATUS
0: Fail
1: Pass
1
V5_PGOOD
R
0
V5 PGOOD STATUS
0: Fail
1: Pass
0
V4_PGOOD
R
0
V4 PGOOD STATUS
0: Fail
1: Pass
Detailed Description
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6.6.1.55 PGOOD_STAT2 Register (address = 0xE8) [reset = 00000000]
Figure 6-77. PGOOD_STAT2 Register Format
B7
B6
B5
RESERVED_P RESERVED_P RESERVED_P
GOOD_STAT2[ GOOD_STAT2[ GOOD_STAT2[
2]
1]
0]
0
0
0
R
R
R
B4
V12_PGOOD
B3
V11_PGOOD
B2
V11_SPGD
B1
V8_SPGD
B0
V6_SPGD
0
R
0
R
0
R
0
R
0
R
LEGEND: R/W = Read/Write; R = Read only; -n = value after reset
Table 6-58. PGOOD_STAT2 Register Field Descriptions
Bit
Field
Type
Reset
Description
7:5
RESERVED_PGOOD_STAT2[2:0]
R
000
Read Always Returns '1'
4
V12_PGOOD
R
0
V12 PGOOD STATUS
0: Fail
1: Pass
3
V11_PGOOD
R
0
V11 PGOOD STATUS
0: Fail
1: Pass
2
V11_SPGD
R
0
V11S PGOOD STATUS
0: Fail
1: Pass
1
V8_SPGD
R
0
V8S PGOOD STATUS
0: Fail
1: Pass
0
V6_SPGD
R
0
V6S PGOOD STATUS
0: Fail
1: Pass
Detailed Description
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6.6.1.56 MISC_BITS Register (address = 0xE9) [reset = 00010000]
Figure 6-78. MISC_BITS Register Format
B7
V13_PIN_OVR
B6
MV13EN
B5
V6_PIN_OVR
B4
MV6EN
B3
msLP_S3ZPG
0
RW
0
RW
0
RW
0
RW
0
RW
B2
msLP_SUSZP
G
0
RW
B1
BC_ACOK_EN
B0
V13DISCHG
1
RW
0
RW
LEGEND: R/W = Read/Write; R = Read only; -n = value after reset
Table 6-59. MISC_BITS Register Field Descriptions
Bit
122
Field
Type
Reset
Description
7
V13_PIN_OVR
RW
0
V13 ENABLE PIN Over Ride
0: V13 is OFF if MV13EN is '1'
1: V13 is ON if MV13EN is '1'
6
MV13EN
RW
0
V13 Enable Pin Mask
0: DDR_VT_CTRL Pin controls V13
1: V13_EN_PIN Bit [Bit(3)] controls V13
5
V6_PIN_OVR
RW
0
V6 ENABLE PIN Over Ride
0: V6 Pin controls V6
1: V6 is ON if VREN PIN MASK = '0'
4
MV6EN
RW
1
V6 Enable Pin Mask
0: VR Enable Pin controls VR enable
1: VR Enable Pin masked V*CTLV controls VR enable
3
msLP_S3ZPG
RW
0
SLP_S3Z is part of the power good tree
0: SLP_S3Z is part of Power Good Tree
1: SLP_S3Z is masked and set to 1 (not part of the Power Good
tree)
2
msLP_SUSZPG
RW
0
SLP_SUSZ is part of the power good tree
0: SLP_SUSZ is part of Power Good Tree
1: SLP_SUSZ is masked and set to 1 (not part of the Power
Good tree)
1
BC_ACOK_EN
RW
1
Enables BC_ACOK output out of LVA pin. The in put is ACOK
pin, instead of ENLVA pin.
0: LVA pin is not BC_ACOK, and ENLVA is the input for LVA
output, behaving as a general purpose level-shifter.
1: LVA pin is BC_ACOK, and ACOK is the input, and ENLVA is
not functional. BC_ACOK is a level-shifted version of ACOK.
0
V13DISCHG
RW
0
V0.6DX discharge resistance (V13)
0: No discharge
1: 100 Ω
Detailed Description
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6.6.1.57 STDBY_CTRL Register (address = 0xEA) [reset = 11111110]
Figure 6-79. STDBY_CTRL Register Format
B7
B6
B5
B4
B3
RESERVED_S RESERVED_S RESERVED_S RESERVED_S RESERVED_S
TDBY_CTRL[4] TDBY_CTRL[3] TDBY_CTRL[2] TDBY_CTRL[1] TDBY_CTRL[0]
1
1
1
1
1
R
R
R
R
R
B2
EN_VCOMP_1
0U
1
RW
B1
VCOMPEN
1
RW
B0
QLSLPS0_ACT
IVE
0
RW
LEGEND: R/W = Read/Write; R = Read only; -n = value after reset
Table 6-60. STDBY_CTRL Register Field Descriptions
Bit
Field
Type
Reset
Description
7:3
RESERVED_STDBY_CTRL[4:0]
R
11111
Read Always Returns '1'
2
EN_VCOMP_10U
RW
1
VCOMP Current Source Control bit:
0: Disable
1: Enable
1
VCOMPEN
RW
1
VCOMP Enable Control bit:
0: Disable
1: Enable
0
QLSLPS0_ACTIVE
RW
0
SLP_S0 & DDR_VTT_CTRL Detect logic Control
0: Normal Operation DELAY_ALL_SYS_PG is used in
QSTANDBY# (SLP_S0#)
1: DELAY_ALL_SYS_PG is ignored for QSTANDBY#
(SLP_S0#)
Detailed Description
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6.6.1.58 TEMPCRIT Register (address = 0xEB) [reset = 00000000]
Figure 6-80. TEMPCRIT Register Format
B7
RESERVED_T
EMPCRIT[1]
0
R
B6
RESERVED_T
EMPCRIT[0]
0
R
B5
LDO1_CRIT
B4
VR5_CRIT
B3
VR4_CRIT
B2
VR3_CRIT
B1
VR2_CRIT
B0
VR1_CRIT
0
RW
0
RW
0
RW
0
RW
0
RW
0
RW
LEGEND: R/W = Read/Write; R = Read only; -n = value after reset
Table 6-61. TEMPCRIT Register Field Descriptions
124
Bit
Field
Type
Reset
Description
7:6
RESERVED_TEMPCRIT[1:0]
R
00
Read Always Returns '0'
5
LDO1_CRIT
RW
0
LDO1 CRITTEMP
0: Not asserted,
1: Asserted, Regulator at critical temperature, write '1' to clear
4
VR5_CRIT
RW
0
VR5 CRITTEMP
0: Not asserted
1: Asserted, Regulator at critical temperature, write '1' to clear
3
VR4_CRIT
RW
0
VR4 CRITTEMP
0: Not asserted
1: Asserted, Regulator at critical temperature, write '1' to clear
2
VR3_CRIT
RW
0
VR3 CRITTEMP
0: Not asserted
1: Asserted, Regulator at critical temperature, write '1' to clear
1
VR2_CRIT
RW
0
VR2 CRITTEMP
0: Not asserted
1: Asserted, Regulator at critical temperature, write '1' to clear
0
VR1_CRIT
RW
0
VR1 CRITTEMP
0: Not asserted
1: Asserted, Regulator at critical temperature, write '1' to clear
Detailed Description
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6.6.1.59 TEMPHOT Register (address = 0xEC) [reset = 00000000]
Figure 6-81. TEMPHOT Register Format
B7
RESERVED_T
EMPHOT[1]
0
R
B6
RESERVED_T
EMPHOT[0]
0
R
B5
LDO1_HOT
B4
VR5_HOT
B3
VR4_HOT
B2
VR3_HOT
B1
VR2_HOT
B0
VR1_HOT
0
RW
0
RW
0
RW
0
RW
0
RW
0
RW
LEGEND: R/W = Read/Write; R = Read only; -n = value after reset
Table 6-62. TEMPHOT Register Field Descriptions
Bit
Field
Type
Reset
Description
7:6
RESERVED_TEMPHOT[1:0]
R
00
Read Always Returns '1'
5
LDO1_HOT
RW
0
LDO1 HOT TEMP
0: Not asserted
1: Asserted, write '1' to clear
4
VR5_HOT
RW
0
VR5 HOT TEMP
0: Not asserted
1: Asserted, write '1' to clear
3
VR4_HOT
RW
0
VR4 HOT TEMP
0: Not asserted
1: Asserted, write '1' to clear
2
VR3_HOT
RW
0
VR3 HOT TEMP
0: Not asserted
1: Asserted, write '1' to clear
1
VR2_HOT
RW
0
VR2 HOT TEMP
0: Not asserted
1: Asserted, write '1' to clear
0
VR1_HOT
RW
0
VR1 HOT TEMP
0: Not asserted
1: Asserted, write '1' to clear
Detailed Description
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6.6.1.60 VREN_PIN_OVR Register (address = 0xEE) [reset = 00000000]
Figure 6-82. VREN_PIN_OVR Register Format
B7
V12_PIN_OVR
0
RW
B6
V11_PIN_OVR
0
RW
B5
V10_PIN_OVR
0
RW
B4
V9_PIN_OVR
0
RW
B3
V8_PIN_OVR
0
RW
B2
V7_PIN_OVR
0
RW
B1
V5_PIN_OVR
0
RW
B0
V4_PIN_OVR
0
RW
LEGEND: R/W = Read/Write; R = Read only; -n = value after reset
Table 6-63. VREN_PIN_OVR Register Field Descriptions
Bit
126
Field
Type
Reset
Description
7
V12_PIN_OVR
RW
0
V12 ENABLE PIN Over Ride
0: V12 Pin controls V12
1: V12 is ON if VREN PIN MASK = '0'
6
V11_PIN_OVR
RW
0
V11 ENABLE PIN Over Ride
0: V11 Pin controls V11
1: V11 is ON if VREN PIN MASK = '0'
5
V10_PIN_OVR
RW
0
V10 ENABLE PIN Over Ride
0: V10 Pin controls V10
1: V10 is ON if VREN PIN MASK = '0'
4
V9_PIN_OVR
RW
0
V9 ENABLE PIN Over Ride
0: V9 Pin controls V9
1: V9 is ON if VREN PIN MASK = '0'
3
V8_PIN_OVR
RW
0
V8 ENABLE PIN Over Ride
0: V8 Pin controls V8
1: V8 is ON if VREN PIN MASK = '0'
2
V7_PIN_OVR
RW
0
V7 ENABLE PIN Over Ride
0: V7 Pin controls V7
1: V7 is ON if VREN PIN MASK = '0'
1
V5_PIN_OVR
RW
0
V5 ENABLE PIN Over Ride
0: V5 Pin controls V5
1: V5 is ON if VREN PIN MASK = '0'
0
V4_PIN_OVR
RW
0
V4 ENABLE PIN Over Ride
0: V4 Pin controls V4
1: V4 is ON if VREN PIN MASK = '0'
Detailed Description
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7 Application and Implementation
NOTE
Information in the following applications sections is not part of the TI component
specification, and TI does not warrant its accuracy or completeness. TI’s customers are
responsible for determining suitability of components for their purposes. Customers should
validate and test their design implementation to confirm system functionality.
7.1
Application Information
The TPS65083x can be used in several different applications from computing, industrial interfacing and
much more. This section describes the general application information and provides more detailed
description on the TPS65083x powering the Intel SkyLake and Kabylake system.
7.2
Typical Application
The TPS65083x can be used in any system that needs multiple voltage rails. A DC supply voltage in
between 5.4 V and 21 V is required. If the supply voltage is less than this range then a small boost can be
added to supply the VIN and VINLDO3.
Along with the 5 DCDCs and 1 LDO, the TPS65083x has 8 general purpose comparators, 2 level shifters,
board temperature monitoring system and 3 power path comparators. Latter 2 can be used as simple
comparators if desired increasing the total comparators available for use to 12 on the TPS65083x.
Application and Implementation
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Adaptor / AC
VIN
Battery1
Battery2
BAT2SWONZ
BAT1SWONZ
ACSWONZ
VIN
Cin
ACIN BAT1 BAT2
Power Path Comparators
PTC
DRVHVR1
VBSTVR1
System Level Power Goods,
INT, and Resets
SWVR1
Vout
0.1 PF
VCOMP
VR1
Controller
VCOMP
TRIPZ
Cout
DRVLVR1
PGNDVR1
Comparator Block
Pull-up source
VSx [A-H]
FBVR1P
FBVR1N
8
ILIMVR1
ENx [A-H]
Rcs
VIN
Cin
8
DRVHVR3
VBSTVR3
PGx [A-H]
8
SWVR3
VR3
Controller
2
2
Level Shifters
Vout
0.1 PF
Cout
DRVLVR3
PGNDVR3
FBVR3P
FBVR3N
ILIMVR3LS
Digital & Control
Block
VIN5VSW
Rcs
ILIMVR3HS
VIN
Cin
Rcs (HS)
EN5VSW
DRVHVR5
VBSTVR5
Load Switches
EN3V3SW
SWVR5
Vout
0.1 PF
VOUT3V3SW
VIN
VR5
Controller
VINLDO3
VIN
1 PF
LDO3V
4.7 PF
Cout
DRVLVR5
PGNDVR5
FBVR5P
FBVR5N
Internal LDOs &
Supplies
ILIMVR5LS
LDO5V
10 PF
DRVHVR4
VBSTVR4
SWVR4
PGNDVR2
Vout
0.1 PF
Cout
DRVLVR4
PGNDVR4
FBVR4N
FBVR4P
FBVR4N
VINLDO1
VINLDO1S
PGNDLDO1
SWVR2
LDO1
VOUTLDO1
Lout
FBVR2N
FBVR2P
VR2
Converter
SCL
SDA
SLAVEADDR
Cout
VR4
Controller
VINVR2
Cin
Vout
Cin
I2C Block
VREF1V25
100 Q
VIN
Rcs (HS)
0.47 PF
3.3V
Rcs
ILIMVR5HS
ILIMVR4
Rcs
Cout
Vout
Cin
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Figure 7-1. Simplifed General Block Diagram
128
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7.2.1
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Design Requirements
The TPS65083x requires decoupling caps on the supply pins. Refer to the Electrical Characteristics for
recommended capacitance on these supplies.
The controllers, converter, LDO, and some other features can be adjusted to meet the application needs.
The following describes how to design and adjust the external components to achieve desired
performances.
7.2.2
Detailed Design Procedure
7.2.2.1
Controller Design Procedure
Designing the controller breaks down into several steps: designing the output filter, selecting the FETs,
bootstrap capacitor, and input capacitors and setting the current limits.
Controllers VR1 and VR4 require VREG supply and capacitors. VREG should be connected to the 5-V
LDO and a 1-µF, X5R, 20%, 10-V or similar capacitor should be used for decoupling.
VIN
DRVHVRx
VBSTVRx
Cin
Lout
LDO5V
VREGVRx
SWVRx
Vout
0.1 PF
1 PF
Controller
Cout
DRVLVRx
PGNDVRx
ILIMVRx
Rcs
PGNDVRx
ENVRx
FBVRxP
FBVRxN
PGVRx
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Figure 7-2. Controller Diagram
7.2.2.1.1 Selecting the Inductor
An inductor is required to be placed between the external FETs and the output capacitors. The inductor
and output capacitors together make the double-pole which contributes towards stability. In addition, the
inductor is directly responsible for the output ripple, efficiency, and transient performance. With an
increase in inductance used the ripple current decreases which, typically increases efficiency. However,
with an increase in inductance used, the transient performance decreases. Finally, the inductor selected
has to be rated for appropriate saturation current, core losses, and DC resistance (DCR).
Use the equation below to calculate the recommended inductance for the controller. Let KIND be the ratio
of ILripple to the IoutMAX. It is recommended that KIND is set to a value between 0.2 and 0.4.
.=
8+0
8176 × :8+0 F 8176 ;
× B59 × +KQP/#: × -+0&
(1)
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With the chosen inductance value, the peak current for the inductor in steady state operation, ILmax, can be
calculated using the equation below. The rated saturation current of the inductor must be higher than the
ILmax current.
:8+0 F 8176 ; × 8176
+.I=T = +KQPI=T + J
K
2 × 8+0 × B59 × .
(2)
Following these equations the preferred inductor selected for the controllers are listed below in Table 7-1.
Table 7-1. Recommended Inductors
MANUFACTURER
PART NUMBER
VALUE
SIZE
HEIGHT
Cyntec
PIME031B
0.47 µH - 1 µH
3.3 mm x 3.7 mm
1.2 mm
Cyntec
PIMB041B
0.33 µH - 2.2 µH
4.45 mm x 4.75 mm
1.2 mm
Cyntec
PIMB051B
1 µH - 3.3 µH
5.4 mm x 5.75 mm
1.2 mm
Cyntec
PIME051E
0.33 µH - 4.7 µH
5.4 mm x 5.75 mm
1.5 mm
Cyntec
PIMB051H
0.47 µH - 4.7 µH
5.4 mm x 5.75 mm
1.8 mm
Cyntec
PIME061B
0.56 µH - 3.3 µH
6.8 mm x 7.3 mm
1.2 mm
Cyntec
PIME061E
0.33 µH - 4.7 µH
6.8 mm x 7.3 mm
1.5 mm
Cyntec
PIMB061H
0.1 µH - 4.7 µH
6.8 mm x 7.3 mm
1.8 mm
7.2.2.1.2 Selecting the Output Capacitors
Ceramic capacitors with low ESR values provide the lowest output voltage ripple and are recommended.
The output capacitor requires either an X7R or X5R dielectric. Y5V and Z5U dielectric capacitors, aside
from their wide variation in capacitance over temperature, become resistive at high frequencies.
At light load currents, the converter operates in Power Save Mode and the output voltage ripple is
dependent on the output capacitor value and the PFM peak inductor current. Higher output capacitor
values minimize the voltage ripple in PFM Mode. In order to achieve specified regulation performance and
low output voltage ripple, the DC-bias characteristic of ceramic capacitors must be considered. The
effective capacitance of ceramic capacitors drops with increasing DC bias voltage.
For the output capacitors of the DCDC controller the use of a small ceramic capacitors placed as close as
possible to the inductor and the respective PGND pins of the IC is recommended. This solution typically,
provides the smallest and lowest cost solution available for DCAP2 controllers.
7.2.2.1.3 Selecting the FETs
This controller is designed to drive NMOS FETs. Typically, the lower RDSon for the high and low side FETs
the better but, be sure to size the FETs, inductor and output capacitors appropriately as the RDSon for the
low side FET decreases, the minimum current limit increases. The Texas Instruments CSD87381P is
recommended for the controllers.
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7.2.2.1.4 Bootstrap Capacitor
To make sure that the internal high side gate drivers are supplied with a stable low noise supply voltage, a
capacitor must be connected between the VBSTVRx pins and the respective SWVRx pins. Using ceramic
capacitors with the value of 0.1 µF are recommended for the converters and the controllers, respectfully.
For testing, a 0.1-µF, size 0402, 10-V capacitor was used for the controllers.
It is recommended to reserve a small resistor in series with the bootstrap capacitor in case the turn on / off
of the FETs need to be slowed in order to reduce voltage ringing on the switch node. This is common
practice for controller design.
7.2.2.1.5 Setting the Current Limits
The controller has a Valley Current Limit topology, also known as a Low Side Current Limit. This type of
current limit works by limiting the current only when the low side FET is on. If the current being sourced by
the low side FET is greater than the set low side current limit, ILS, the controller will hold the low side FET
on and the high side off until the current through the low side FET decreases below the set ILS. Only if the
current through the low side FET is less than the ILS will the low side FET be allowed to turn off and the
high side FET to turn on.
A fast current increase is limited by the maximum on time for the high side FET. This forces the low side
FET to turn on every period. Once the low side FET turns on, the Low Side Current Limit can control the
FETs until the current decreases below the ILS. The maximum on time for the high side FET limits the
current increase to maximum on time multiplied by the di/dt of the inductor until the low side FET is
switched on.
IOCL is the average current when the valley current is consistently the ILS.
IOCL
ILS
Figure 7-3. IOCL Depiction
The low side current limit for the controllers is set by a resistor, RCS, at the ILIMx pin. A current, ITRIP, is
sourced across the RCS to set the voltage for the current limit comparator. Use the equation below to
determine the RCS resistor. It is recommended to set IOCL to 130% of IOUTmax and use a resistor with ±1%
or less tolerance for best results. Since the current limit is when the inductor current is near its maximum it
is recommended to use the saturation derating of the inductor when calculating the RCS.
4%5 =
8 × 4&5KJ × 1.3 × l+1%. F
:8+0 F 8176 ; × 8176
p
2 × . × B59 × 8+0
+64+2
(3)
There is a minimum and a maximum IOCL that can be achieved for the given parameters used in the
equation above. To ensure that the RCS has been sized correctly, the following equation must be true
across the application temperature range.
8%5IEJ < +64+2 × 4%5 < 8%5I=T
(4)
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If the controller has high side current limit then, use Equation 5 to calculate the high side RCS resistor. The
high side current limit must be set higher than the low side current limit. Again, since the current limit is
when the inductor current is near its maximum it is recommended to use the saturation derating of the
inductor when calculating the RCS.
4%5 (*5) =
:8 F 8176 ; × 8176
l4&5KJ × l+1%. + +0
pp
2 × . × B59 × 8+0
n
F 8µ#r × 20GÀ
3200À
+64+2
(5)
7.2.2.1.6 Selecting the Input Capacitors
Because of the nature of the switching converter and controller with a pulsating input current, a low ESR
input capacitor is required for best input voltage filtering and minimizing the interference with other circuits
caused by high input voltage spikes. For the controller, 12 µF of input capacitance is recommended for
most applications. To achieve the low ESR requirement, a ceramic capacitor is recommended. However,
the voltage rating and DC bias characteristic of ceramic capacitors need to be considered. The input
capacitor can be increased without any limit for better input voltage filtering. Be sure to size the ceramic
capacitor to achieve the recommended input capacitance. A ceramic capacitor placed as close as possible
to the respective VINx and PGNDx pins of the FETs is recommended.
The preferred capacitors for the controllers are two muRata GRM21BR61E106MA73: 10 μF, 0805, 25 V,
±20% or similar.
7.2.2.2
Converter Design Procedure
Designing the converter has only 2 steps: designing the output filter and selecting the input capacitors.
The converter must be supplied by a 3.3-V source which can be provided by one of the TPS65083x
controllers.
The converter requires VREG supply and capacitors. VREG should be connected to the 5-V LDO and a 1µF, X5R, 20%, 10-V or similar capacitor should be used for decoupling.
Lout
VINVR2
3.3V
Vout
SWVR2
LDO5V
Cin
VREGVRx
1 PF
Cout
FBVR2P
FBVR2N
Converter
100
PGVRx
ENVRx
PGNDVR2
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Figure 7-4. Converter Diagram
132
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7.2.2.2.1 Selecting the Inductor
An inductor is required to be placed between the SWVRx and the output capacitors. The inductor and
output capacitors together make the double-pole which contributes towards stability. In addition, the
inductor is directly responsible for the output ripple, efficiency, and transient performance. With an
increase in inductance used the ripple current decreases which, typically increases efficiency. However,
with an increase in inductance used, the transient performance decreases. Finally, the inductor selected
has to be rated for appropriate saturation current, core losses and DC resistance (DCR).
Use the equation below to calculate the recommended inductance for the controller. Let K IND be the ratio
of I Lripple to the Iout MAX. It is recommended that K IND is set to a value between 0.2 and 0.4.
.=
8+0
8176 × :8+0 F 8176 ;
× B59 × +KQP/#: × -+0&
(6)
With the chosen inductance value, the peak current for the inductor in steady state operation, I - Lmax , can
be calculated using the equation below. The rated saturation current of the inductor must be higher than
the I Lmax current.
:8+0 F 8176 ; × 8176
+.I=T = +KQPI=T + J
K
2 × 8+0 × B59 × .
(7)
Following these equations the preferred inductors selected for the converter are listed below in Table 7-2.
Table 7-2. Recommended Inductors
MANUFACTURER
PART NUMBER
VALUE
SIZE
HEIGHT
Cyntec
PIFE32251B-R68MS
0.68 µH
3.2 mm x 2.5 mm
1.2 mm
Würth
744383230068
0.68 µH
2.5 mm x 2 mm
1.0 mm
7.2.2.2.2 Selecting the Output Capacitors
Ceramic capacitors with low ESR values provide the lowest output voltage ripple and are recommended.
The output capacitor requires either an X7R or X5R dielectric. Y5V and Z5U dielectric capacitors, aside
from their wide variation in capacitance over temperature, become resistive at high frequencies.
At light load currents, the converter operates in Power Save Mode and the output voltage ripple is
dependent on the output capacitor value and the PFM peak inductor current. Higher output capacitor
values minimize the voltage ripple in PFM Mode. In order to achieve specified regulation performance and
low output voltage ripple, the DC-bias characteristic of ceramic capacitors must be considered. The
effective capacitance of ceramic capacitors drops with increasing DC bias voltage.
For the output capacitors of the DCDC converters the use of a small ceramic capacitors placed as close
as possible to the inductor and the respective PGND pins of the IC is recommended. If, for any reason,
the application requires the use of large capacitors which can not be placed close to the IC, use a smaller
ceramic capacitor in parallel to the large capacitor. The small capacitor should be placed as close as
possible to the inductor and the respective PGND pins of the IC.
At the DCDC converters the recommended capacitor for use is the muRata GRM188R60J226MEAO: 22
µF, 0603, 6.3 V, ±20% or similar. This capacitor was selected to achieve the highest derated capacitance
in a small 0603 package. If the selected output voltage is greater than 3.3 V then the muRata
GRM21BR61A226ME44: 22 µF, 0805, 10 V, ±20%, or similar is recommended for use. This capacitor is
recommended to maintain the actual capacitance as DC bias increases.
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7.2.2.2.3 Selecting the Input Capacitors
Because of the nature of the switching converter and controller with a pulsating input current, a low ESR
input capacitor is required for best input voltage filtering and minimizing the interference with other circuits
caused by high input voltage spikes. For the controller, 12 µF of input capacitance is recommended for
most applications. To achieve the low ESR requirement, a ceramic capacitor is recommended. However,
the voltage rating and DC bias characteristic of ceramic capacitors need to be considered. The input
capacitor can be increased without any limit for better input voltage filtering. Be sure to size the ceramic
capacitor to achieve the recommended input capacitance. A ceramic capacitor placed as close as possible
to the respective VINx and PGNDx pins of the IC is recommended.
The preferred capacitors for the controllers are two muRata GRM21BR61E106MA73: 10 μF, 0805, 25 V,
±20% or similar.
7.2.2.3
LDO Design Procedure
The LDO must handle the fast load transients from the DDR memory for termination. Therefore, it is
important to maintain a high amount of capacitance with low ESR on the LDO outputs and inputs. Ceramic
capacitors are ideal for this. Below is the recommended capacitors.
The preferred output capacitor for the LDO is muRata GRM188R60J476M: 47 μF, 0603, 6.3 V, ±20% or
similar.
The preferred input capacitor for the LDO is muRata GRM155R60J106ME44: 10 μF, 0402, 6.3 V, ±20% or
similar.
7.2.2.4
Board Temperature Monitoring Design Procedure
Board temperature monitoring requires only 1 thermistor if only 1 sense point is desired. It can be scaled
by adding as many thermistors as sense points desired. Simply connect a PTC thermistor that has an
exponential coefficient curve from the VCOMP pin to GND and a pull up to desired voltage source on the
TRIPZ pin. Place thermistor where desired. If multiple sense points are desired string the thermistors
together in a series connection while placing the thermistors where desired.
10µA
100k
VCOMP Pin
TRIPZ Pin
RT1
+
±
VREF = 1.25V
RT2
RT3
RT4
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Figure 7-5. Board Temperature Monitoring Circuit Example
134
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The thermistors should have low room and mid temperature resistances in the range of 1 kΩ to 10 kΩ.
The hot point resistance should be roughly 10x mid temperature resistance in the range of 100 kΩ to 200
kΩ. There is an internal 10-µA current source that provides a voltage across the thermistors. Once this
voltage exceeds the comparator threshold of 1.25 V the TRIPZ pin switches to LOW indicating a HOT
board temperature. Therefore, the resistance required for HOT board temperature is 125 kΩ. Select
thermistors that align this resistance with the desired HOT temperature setpoint.
The recommended thermistors for this feature is the muRata PRF15BG102RB6RC.
7.2.2.5
Power Path Design Procedure
The TPS65083x has power path comparators and outputs to control the power path switches. Simply
connect a voltage divider to the adaptor and batteries to set the threshold to the desired value. The
outputs of the comparators require a pull up since they are open-drain outputs. In-order for the power path
comparators to work without VIN supplied connect the VINPP to the power rails that are being monitored
by using a diode to select the highest voltage among the sources.
Adaptor
Battery 1
Battery 2
R1a
R1b
VINPP
Pull Up
R1c
Pull Up
Pull Up
TPS65083x
ACIN
BAT1IN
BAT2IN
R2a
R2b
ACOUT
BAT1OUT
BAT2OUT
R2c
Copyright © 2016, Texas Instruments Incorporated
Figure 7-6. Power Path Comparators and VINPP Supply
Example:
Desired is to measure a battery and an adaptor to decide when to switch over from battery to adaptor. The
voltages desired for thresholds are 9 V and 6 V respectively. Using Equation 8 the resistors required to set
the 9-V threshold are R1a = and R2a = . The resistors required to set the 6-V threshold are R1b = and
R2b = .
8+0
41 = 42 × l
F 1p
86DNAO DKH@
(8)
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Application Performance Curves
Table 7-3. Application Curves Overview
TYPE
DESCRIPTION AND ASSUMPTIONS
FIGURE NUMBER
Efficiency VR1
Using CSD87381P FET Block, PIME051H-1R0MS,
3 x GRM31CR60G227ME11 + 1 x GRM21BR60J107M, NDVCZ = HIGH, Vout = 1 V
Figure 7-7
Efficiency VR2
Using PIFE32251B-R68MS,
4 x ZRB18AR60G476ME01, NDVCZ = HIGH, Vout = 1.8 V
Figure 7-8
Efficiency VR3
Using CSD87381P FET Block, PIMB061H-1R5MS,
3 x GRM21BR60J107M , NDVCZ = HIGH, Vout = 3.3 V
Figure 7-9
Efficiency VR4
Using CSD87381P FET Block, PIME051H-1R0MS,
2 x GRM31CR60G227ME11 + 1 x GRM21BR60J107M, NDVCZ = HIGH, Vout = 1.2 V
Figure 7-10
Efficiency VR5
Using CSD87381P FET Block, PIMB051H-3R3MS,
11 x GRM21BR61A476ME15, NDVCZ = HIGH, Vout = 5 V
Figure 7-11
100
100
90
90
80
80
70
70
VR2 Efficiency (%)
VR1 Efficiency (%)
spacing
60
50
40
30
Vin=5.40V
Vin=8.70V
Vin=15.00V
Vin=24.00V
20
10
1
2
3
4
5
6
Iout (A)
50
40
30
20
Vin=2.97V
Vin=3.30V
Vin=3.63V
10
0
0
60
0
0.0
7
90
80
80
70
70
VR4 Efficiency (%)
VR3 Efficiency (%)
100
90
60
50
40
30
Vin=5.40V
Vin=8.70V
Vin=15.00V
Vin=24.00V
0
0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0 6.5
Iout (A)
D001
Figure 7-9. Typical Efficiency for VR3
136
1.5
2.0
2.5
D001
Figure 7-8. Typical Efficiency for VR2
100
10
1.0
Iout (A)
Figure 7-7. Typical Efficiency for VR1
20
0.5
D001
60
50
40
30
Vin=5.40V
Vin=8.70V
Vin=13.50V
Vin=24.00V
20
10
0
0
1
2
3
4
Iout (A)
5
6
7
D001
Figure 7-10. Typical Efficiency for VR4
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100
90
VR5 Efficiency (%)
80
70
60
50
40
30
Vin=5.40V
Vin=8.70V
Vin=13.50V
Vin=24.00V
20
10
0
0
0.5
1
1.5
2
Iout (A)
2.5
3
3.5
D001
Figure 7-11. Typical Efficiency for VR5
Application and Implementation
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7.2.4
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Specific Application - TPS650830 Powering the Intel SkyLake and Kabylake Platform
Volume Configuration
Volume configuration is the lowest cost and smallest solution for SkyLake and Kabylake power. It
combines multiple same voltage rails into one rail reducing cost and size. Load switches are utilized to
separate the rails and power the system with correct sequencing. The PMIC controls these load switches
with the power good comparators. The TPS65083x also supports Premium configurations, see
TPS650831 and TPS650832 or literature numbers: SLVSCS5 and SLVSCS6.
All Pullup Resistors 100kohm, unless noted
VDDIO
Comp_PG_mod
e
COMP
A
1
-
COMP
B
1
0
Enable Logic
ENB & V18U25UCNT ENB & V18U25UCNT
COMP
C
-
-
ENC
COMP
D
1
0
END & VCCIOCNT
END & VCCIOCNT
COMP
E
1
0
ENE
ENA & V33APCHCNT
PGOOD C
COMP
F
1
0
ENF
V33APCH
V18U25U
COMPIN_C
V33S
PGOOD F
V18S
V100S
COMP
G
1
-
ENG
PGOOD G
LS_INC
V5ADS3_PG
V12U_PG
V100S_PG
SLP_S4Z
COMPEN_C
V12U_PG & V100S_PG
SLP_SUSZ
SLP_S3Z
LS_INB
V33APCH_PG
V18U25ULSW
COMPOUT_C
VCCIOLSW
Rpull-up Shared
with V12U_PG
V33A_DSW
V33A_DSW
V33APCHLSW
V1.8S_PG
V100S_PG
LS_OUTC
ENA
ENB
ENC
END
ENE
ENF
ENG
ENH
PGA
PGB
PGC
PGD
PGE
PGF
PGG
PGH
VDDPG
REF
DCH
V33A_DSW
TTL
PG
EN
VSET
TTL
OD/PP
EN/
PGOOD
LOGIC
DIGCORE
FBVR2P
VR1
Controller
PGNDVR2
VDDIO
V18A_PG
DRVHVR1
Vout range
0.95v-1.05v
ENVR2
EN
VSET
OEM
VCOMP
V3P3A_RTC
TRIPZ
OD/PP
TTL
VDDIO
FBVR5P
PG
I2C AND
REGFILE
VR3
Controller
DTMODE
Vout 5V
FBVR3P
VBSTVR3
Vout 3.3V
DRVHVR3
VDDIO
PGNDVR3
ENVR3
VDDIO
REFSYS
LDO5V
VLDO5
VREF1V25
PGA
PGB
PGC
PGD
LDO3V
VOUT3V3SW
EN3V3SW
VDC
VINLDO3
DFT AND
AMUX
3L
TTL
SLAVEADDR
AGND [4]
OD
DIETEMP
VLDO3
VIN5VSW
SW EN5VSW
TTL
SW
TTL
EN3V3SW
EC
FROM EC
LEGEND
TTL = TTL LEVEL INPUT BUFFER
3L = 3 LEVEL (HI/LO/HI-Z) INPUT BUFFER
PP = PUSH-PULL OUTPUT BUFFER
PPB = PUSH PULL OUTPUT BUFFER WITH
HI-Z MODE (TEST ONLY)
OD = OPEN DRAIN OUTPUT BUFFER
TR = PUSH-PULL WITH CONTROLLED Tr
OD/PP = OPEN-DRAIN OR PUSH PULL
PGNDVR3
VLDO3
VIN
UVLO
VPROGOTP
VDDIO [2X]
OD
SDA
VLDO3
TEMP_ALERTZ
TTL
V100S
ENVR5
SCLK
VDDIO
VDDIO
TTL
50ohm
V33A_DSW
DRVLVR3
OTP
ILIMVR5LS
SLP_SUSZ
VDC
TTL
DRVLVR5
VREGVR1
PGNDVR5
PGNDVR5
V33APCH
SWVR3
Vout range
4.9v-5.1v
SWVR5
V33S
FBVR3N
Vout range
3.23v-3.34v
VBSTVR5
DRVHVR5
V33APCHLSW
SLP_S3Z
VDC
ILIMVR3LS
EN
VSET
EN
VSET
VR5
Controller
V33ADSW_PG
VREGVR4
VINVR3
ILIMVR3HS
EN/
PGOOD
LOGIC
EN/
PGOOD
LOGIC
THERMs
NVDCZ
TTL
VDDIO
V18U25U
TH_HOTZ
VCOMP
PGVR3
OD/PP
VDDIO
VDDIO
ILIMVR5HS
FBVR5N
V5ADS3
V18U25ULSW
V18S
VBATTBKUP
BACKUP
BATTERY
SELECTOR
V33ARTC
RTC
DIG
EN/
PGOOD
LOGIC
PG
Vout 1.00V
ENVR1
V18A_EN/
DPWROK
TTL
VINVR5
VDC
PGVR2
OD/PP
VDDIO
OD/PP
AGND
VLDO5
FBVR2N
PGNDVR2 [2X]
SLP_S3Z
VBSTVR1
OD/PP
VCCIO(V0975)
V18A
VREGVR2
Vout 1.8V
2A max
c
VDDLV
PGVR5
VDCSNS
V33A_DSW
SWVR2 [2X]
Vout range
1.76v-1.85v
VDDLVS
SLP_S3Z
V5ADS3_PG
BAT2SWONZ
PGNDLDO1
VINVR2 [2X]
VDDIO
V33APCH_PG
HV
OD
ACIN
LDO1
SINK/SRC LDO VOUTLDO1[2X]
V0.6DX/0.675DX
FBLDO1
/0.55DX
Vout= (VR4)/2
1A max
PGNDVR1
VCCIOLSW
BAT1SWONZ
BAT2
VINLDO1[2X]
EN
EN
LOGIC
PGNDVR1
V100S
SLP_S4Z
DDR_VTT_CTRL
PGNDLDO1[2X]
DRVLVR1
V085A
ENVR4
VR2
Converter
LVB
PGVR1
DDRID
DDR_VTT_CTRL
OD/PP
SWVR1
VR1_PG
DDRID
VINDLO1S
VDDPG
FBVR1P
V100A
PGNDVR4
PGNDVR4
ILIMVR1
FBVR1N
VDC
DRVLVR4
Vout 1.2V/
1.35V/1.1V
TTL
SEQ
+
INTEL
AND
OEM
LOGIC
VREGVR1
VLDO5
V9,V4,V33S PGOOD
DO NOT HAVE PINS!
VDC
SWVR4
3L
VDDIO
LVA
V12U
DRVHVR4
VDDIO
ENLVA
BCACOK
LS_OUTB
VBSTVR4
VDDIO
VDDIO
AGND
FBVR4P
TTL
V33A_DSW
V33A_DSW
(EC_VCC)
PG
EN
VSET
EN/
PGOOD
LOGIC
VDDIO
FBVR4N
VR4
Controller
Vout Range
1.056V1.391V
PP
VSA
VSB
VSC
VSD
VSE
VSF
VSG
VSH
VCCIO(V0975)
ACSWONZ
VDDIO
VDDIO
RESETZ
V33A_DSW
VLDO5
ILIMVR4
PPATH
LOGIC
PGOOD A
BAT1
VREGVR4
Pgood_logic
ENA & V33APCHCNT
V12U_PG
OD/PP
PP
Comp_Mode
Rpull-up Shared with
V100S_PG
PGVR4
VDDIO
Volume #1
COMP
COMP
VOLUME #1 Application
Block Diagram:
V12(V085A) = No Load Sw,
V11 (V1.00A) = No Load Sw
DPWROK
VINPP
EC_RSTZ
EC_ONOFFZ
PCH_PWRBTNZ
DPWROK
RSMRSTZ_PWRGD
PMIC_INTZ
POWER MONITOR
OD
TTL
EC_VCC
PCH_PWROK
ALL_SYS_PWRGD
VDDIO
ACOK
1HZ
VCCST_PWRGD
SYS_PWROK
TTL
VDDIO
HIV
VREF
RAM
VDDIO
TTL
TTL
PP
STANDBYZ
V33A_DSW
(EC_VCC)
V100S
PWRBTNIN
ECVCC
DS3_VREN
SHUTDOWNZ
LDO3
SLP_S0Z
V33A_DSW
V33A_DSW
V3.3S
ACOK
TPS650830
V5ADS3_PG
VLDO5
V5A_DS3
AGND
AGND
AGND
GROUND PLANE
AGND
PGNDVR2
PGNDVR1
PGNDVR4
PGNDVR3
PGNDLDO1
PGNDVR5
Copyright © 2016, Texas Instruments Incorporated
Figure 7-12. TPS650830 Volume Application Diagram
138
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7.2.4.1
SLVSCF4A – DECEMBER 2014 – REVISED JULY 2016
Design Requirements
The deisgn requirements are set by the Intel SkyLake and Kabylake Platform. Below are the requirements
of the power supply system. This procedure assumes the system is a 2S NVDC system but, the
TPS65083x supports 3S NVDC, as well as non-NVDC systems. 2S NVDC system has an input voltage
range of 5.4 V to 8.7 V.
• There must be 9 separate voltage rails:
– V5A_DS3 - 5 V, IMAX = 3.5 A
– V3.3A_DSW - 3.3 V, IMAX = 3.5 A
– V3.3A_PCH - 3.3 V, IMAX = 3 A
– V1.00A - 1.0 V, IMAX = 4.9 A
– VCCIO - 1.0 V, IMAX = 2.9 A
– V1.8A - 1.8 V, IMAX = 1 A
– V1.8U - 1.8 V, IMAX = 1 A
– VDDQ - 1.2 V, IMAX = 7.5 A
– VTT - 0.6 V, IMAX = ±1A
• All rails must have maximum tolerance of ±5% of the nominal voltage at all times with load transients.
– Load Transients are defined as 0% to 70%, 70% to 0%, 30% to 100% and 100% to 30% load
current steps relative of the IMAX current defined for each rail.
• Maximum height of components = 1.8 mm.
• Sequence in the order below:
– V3.3A_DSW with VIN supplied
– V1.8A with VIN supplied
– V5A_DS3 with SLP_SUS# transition to HIGH
– V3.3A_PCH with SLP_SUS# transition to HIGH
– V1.00A with SLP_SUS# transition to HIGH
– VDDQ with SLP_S4# transition to HIGH
– V1.8U with SLP_S4# transition to HIGH
– VCCIO with SLP_S3# transition to HIGH
– VTT with DDR_VTT_CTRL / SLP_S0# transition to HIGH
7.2.4.2
Detailed Design Procedure
The TPS650830 supplies 6 voltage rails and controls 3 load switches to meet the sequence order for the
V3.3A_PCH, V1.8U, and VCCIO rails.
• VR1 supplies the V1.00A rail and the VCCIO rail with a load switch.
• VR2 supplies the V1.8A rail and the V1.8U rail with a load switch.
• VR3 supplies the V3.3A_DSW rail and the V3.3A_PCH rail with a load switch.
• VR4 supplies the VDDQ rail and the VINLDO1 for termination.
• VR5 supplies the V5A_DS3 rail.
• VLDO1 supplies the VTT rail.
To meet the sequencing requirement the power goods of the VRs and PG comparators are feed back into
the enables for the VRs and comparators. The 5 external control signals SLP_SUS#, _S4#, _S3#, _S0#,
and DDR_VTT_CTRL are responsible for transitioning the system from sleep state to sleep state and the
reverse sequencing.
Since, the requirements are for a 2S NVDC system the NVDCZ pin should be tied LOW.
Application and Implementation
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7.2.4.2.1 Output Inductance and Capacitance
Following the recommend design procedure in Section 7.2.2 will yield output inductance and capacitance
similar to Table 7-4.
Table 7-4. SkyLake and Kabylake Volume Configuration Output L and C
VRx
OUTPUT
INDUCTANCE
MINIMUM OUTPUT
CAPACITANCE
RECOMMENDED OUTPUT CAPACITORS
CAPACITOR
MANUFACTURER
VR1
0.56 µH
160 µF
1 x GRM31CR60G227ME11 and
1 x ZRB18AR60G476ME01
muRata
VR2
0.68 µH
47 µF
4 x ZRB18AR60G476ME01
muRata
VR3
1 µH
87 µF
2 x GRM31CR60G227ME11
muRata
VR4
0.56 µH
117 µF
1 x GRM31CR60G227ME11
muRata
VR5
2.2 µH
76 µF
8 x GRM21BR61A476ME15
muRata
7.2.4.3
Application Performance Curves
Table 7-5. Application Curves Overview
TYPE
DESCRIPTION AND ASSUMPTIONS
FIGURE NUMBER
Efficiency VR1
Using CSD87381P FET Block, PIMB051H-0R56M,
1 x GRM31CR60G227ME11 + 1 x ZRB18AR60G476ME01, NDVCZ = LOW, Vout = 1 V
Figure 7-13
Efficiency VR2
Using PIFE32251B-R68MS,
4 x ZRB18AR60G476ME01, NDVCZ = LOW, Vout = 1.8 V
Figure 7-14
Efficiency VR3
Using CSD87381P FET Block, PIME051H-1R0MS,
2 x GRM31CR60G227ME11, NDVCZ = LOW, Vout = 3.3 V
Figure 7-15
Efficiency VR4
Using CSD87381P FET Block, PIMB051H-0R56M,
1 x GRM31CR60G227ME11, NDVCZ = LOW, Vout = 1.2 V
Figure 7-16
Efficiency VR5
Using CSD87381P FET Block, PIME051B-2R2MS,
8 x GRM21BR61A476ME15, NDVCZ = LOW, Vout = 5 V
Figure 7-17
100
100
90
90
80
80
70
VR2 Efficiency (%)
VR1 Efficiency (%)
space
60
50
40
30
Vin=5.40V
Vin=8.10V
Vin=8.70V
Vin=13.50V
20
10
1
2
3
4
Iout (A)
5
6
50
40
Vin=2.97V
Vin=3.30V
Vin=3.63V
20
10
0.0
7
0.5
1.0
1.5
2.0
Iout (A)
D001
Figure 7-13. Typical Efficiency for VR1
140
60
30
0
0
70
2.5
D001
Figure 7-14. Typical Efficiency for VR2
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100
100
90
90
80
80
70
70
VR4 Efficiency (%)
VR3 Efficiency (%)
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60
50
40
30
Vin=5.40V
Vin=8.10V
Vin=8.70V
Vin=13.50V
20
10
60
50
40
30
Vin=5.40V
Vin=8.10V
Vin=8.70V
Vin=13.50V
20
10
0
0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0 6.5
Iout (A)
D001
0
0
Figure 7-15. Typical Efficiency for VR3
1
2
3
4
Iout (A)
5
6
7
D001
Figure 7-16. Typical Efficiency for VR4
100
90
VR5 Efficiency (%)
80
70
60
50
40
30
Vin=5.40V
Vin=8.10V
Vin=8.70V
Vin=13.50V
20
10
0
0.00
0.50
1.00
1.50
2.00
Iout (A)
2.50
3.00
3.50
D001
Figure 7-17. Typical Efficiency for VR5
Application and Implementation
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7.3
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System Example
Below is a diagram of the SkyLake and Kabylake Platform System Power Delivery. The PMIC is flexible
and adjusts well across SkyLake and Kabylake platforms.
TPS650830
VOLUME
AC/DC
Adaptor
FET
FET
NVDC
Charger
6V - 8.4V
2S Battery Pack
FET
Vcore
FET
Driver
FET FET
Driver
FET FET
FET
SMBus
VCCSA
SKYLAKE
KABYLAKE
PLATFORM
SVID
ALERT#
TPS650830 - PMIC
FET
VCORE
VCCGT
V5ADS3
5V, 3.55A
FET FET
3.3V, 6.6A
FET FET
FET
V3.3A_DSW
LOAD V3.3S
SWITCH
Protection
V1.8A
1.8V, 1.8A
EC
Embedded
Controller
SMBus
Gas
Gauge
1.00V, 6.81A
FET FET
1.2V, 7.47A
FET FET
LOAD V3.3A_PCH
SWITCH
1.00V
LOAD V1.8U_V2.5U
SWITCH
LOAD V1.8S
SWITCH
V0.85A
Legend:
V1.2U
Power bus
Signal Wire
I2C
0.6V, 1.2A
V0.6DX
V1.00A
LOAD VCCIO
SWITCH
LOAD V1.0S
SWITCH
Integrated FET
regulator
External FET
regulator
Copyright © 2016, Texas Instruments Incorporated
Figure 7-18. TPS650830 Volume Simplified System Power Configuration Diagram
7.4
Do's and Don'ts
•
•
142
Always either float or connect the VINPP to the same voltage as VIN. Never ground VINPP.
If not using a voltage regulator connect the enable to ground and float the output.
Application and Implementation
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8 Power Supply Recommendations
Any power supply capable of delivering the required input power is acceptable provided that there is a
source within the recommended operating conditions for VIN and VINLDO3. The input voltage for the VR2
converter must be 3.3 V always. The input voltage of the controllers may vary from the VIN and VINLDO3
voltage. Ensure that VINPP is connected to the VIN or floated but not grounded.
Power Supply Recommendations
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9 Layout
9.1
Layout Guidelines
For all switching power supplies, the layout is an important step in the design, especially at high peak
currents and high switching frequencies. If the layout is not carefully done, the regulator could show
stability problems as well as EMI problems. Therefore, use wide and short traces for the main current path
and for the power ground tracks. The input capacitor, output capacitor, and the inductor should be placed
as close as possible to the IC. Use a common ground node for power ground and a different one for
control ground to minimize the effects of ground noise. Connect these ground nodes at any place close to
one of the ground pins of the IC.
There are 2 packages available for the TPS65083x, the ZAJ and ZCG. The ZAJ is a 7-mm x 7-mm BGA
with 0.5-mm ball pitch. The ZCG is a 9-mm x 9-mm BGA with 0.5-mm ball pitch but, some of the inner
balls have been removed for easier routing. Both packages preform relatively the same and the decision
between which package is best for the application depends on the space constraints and routing
technology used.
9.1.1
Fanout for ZAJ using Type 4 Routing
This small 7-mm x 7-mm package utilizes the Type 4 routing technique to decrease system board area as
much as possible. This Type 4 routing has vias in pad, blind and buried vias, and minimum trace width /
spacing of 4 mils.
= Ball Pad
= Via, with 10 mil pad
and 6 mil drill
4 mil
= Top Layer Trace
6 mil
Inner Balls
10 mil
10 mil
= Inner 1 / Bottom
Layer Trace
= Inner 2 / Bottom
Layer Trace
Inner Balls
Figure 9-1. Fanout for ZAJ Package Using Type 4 Routing
144
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Fanout for ZCG using Type 3 Routing
The ZCG has some of the inner balls removed to essentially create a 0.1-mm ball pitch for the inner balls
of the package. This feature allows for Type 3 routing of the board. This Type 3 routing has no vias in pad,
no blind and buried vias, and minimum trace width / spacing of 4 mils.
= Ball Pad
= Via, with 20 mil pad
and 10 mil drill
= Top Layer Trace
10 mil
Inner Balls
4 mil
= Inner 1 / Bottom
Layer Trace
= Inner 2 / Bottom
Layer Trace
20 mil
Inner Balls
Figure 9-2. Fanout for ZCG Package using Type 3 Routing
Layout
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9.1.3
Layout Checklist
•
•
•
•
•
•
•
9.2
9.2.1
www.ti.com
All inductors, input/output caps and FETs for the converters and controller should be on the same
board layer as the IC.
Place feedback connection points near the output capacitors and minimize the control feedback loop
as much as possible to achieve the best regulation performance.
Bootstrap capacitors must be place close to the IC from the SWVRx to VBSTVRx pins.
DRVLVRx signals must be routed on the same layer as the IC and the FETs and minimize the length
and parasitic inductance of the trace as much as possible.
Each converter and controller should have their own separate ground and each ground should connect
to the common ground separately. The input capacitors, output capacitors, and FET grounds for each
VRx converter and controller must be connected to the ground plane for the respective VRx rail. Since,
the PGNDs for each rail are not connect to each other or AGND, it is required to use the PGNDVRx
pins for the input and output capacitors for each VRx rail. This ground plane should connect in one
place to the common ground close to the input and output capacitor ground pads. See the figure below
for a visual representation of the converter layout scheme.
The internal reference regulators must have their input and output caps close to the IC pins.
Route the FBVRxP and FBVRxN signals as a differential pair.
Layout Example
Controller Layout
The routing of the controllers is critical to the performance of the power supply. To reduce the risk of the
controller effecting other sensitive circuits on the board, it is recommended to place all of the controller
components on the same layer are the PMIC. In addition to component placement, the DRV, SW, and
PGND signals should be routed on the same layer or as few of layers possible. It is recommended to
place the FETs as close as possible to the PMIC but, it is imperative that the input capacitors are placed
with minimal distance from the VIN and PGND pads of the FETs. The feedback signals should be routed
differentially to the furthest output capacitor, which should be placed close to the load. Be sure to not route
the feedback or any analog sensitive signals under the inductor, next to the SW node, or between the CIN
and the FETs due to the high frequency switching from the edges.
If the FETs of the controller are to be place far away from the PMIC the layout of the DRV, SW and PGND
signals becomes extremely critical. The loop inductance of the the traces must be minimized as much as
possible. In-order to do this, pair the DRVH and SW traces together and pair the DRVL and PGND traces
together. PGND is best routed as a plane. To reduce the loop inductance of the DRVL, DRVL trace should
be routed one layer above the PGND. Generally, the SW, DRVL and DRVH traces should be 20 mils or
larger assuming the PGND is a plane underneath the DRVL trace.
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Input Voltage
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PGND
CIN
COUT
COUT
COUT
CIN
Inductor
VR Output
SW
FETs
NC
DRVHVR1
FBVR1P
FBVR1N
ILIMVR1
VBSTVR1
SWVR1
VREGVR1
PGNDVR1
Feedback Signals
DRVLVR1
PMIC
Figure 9-3. Controller Layout Diagram
9.2.2
ZAJ Package
Figure 9-4. Top Layer ZAJ Layout
Figure 9-5. Bottom Layer ZAJ Layout
Layout
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9.2.3
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ZCG Package
Figure 9-6. Top Layer ZCG Layout
Figure 9-7. Bottom Layer ZCG Layout
9.3
Thermal Considerations
Implementation of integrated circuits in low-profile and fine-pitch surface-mount packages typically
requires special attention to power dissipation. Many system-dependent issues such as thermal coupling,
airflow, added heat sinks and convection surfaces, and the presence of other heat-generating components
affect the power-dissipation limits of a given component.
Three basic approaches for enhancing thermal performance are listed below.
• Improving the power dissipation capability of the PCB design
• Improving the thermal coupling of the component to the PCB by soldering the PowerPAD™
• Introducing airflow in the system
For more details on how to use the thermal parameters in the dissipation ratings table please check the
Thermal Characteristics Application Note (SZZA017) and the IC Package Thermal Metrics Application
Note (SPRA953).
148
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10 Device and Documentation Support
10.1 Device Support
For device support, please submit questions to the E2E forum here:e2e.ti.com
10.1.1 Third-Party Products Disclaimer
TI'S PUBLICATION OF INFORMATION REGARDING THIRD-PARTY PRODUCTS OR SERVICES DOES
NOT CONSTITUTE AN ENDORSEMENT REGARDING THE SUITABILITY OF SUCH PRODUCTS OR
SERVICES OR A WARRANTY, REPRESENTATION OR ENDORSEMENT OF SUCH PRODUCTS OR
SERVICES, EITHER ALONE OR IN COMBINATION WITH ANY TI PRODUCT OR SERVICE.
10.1.2 Development Support
For frequently asked questions, FAQs, on the TPS65083x, please refer to the FAQ here:
http://e2e.ti.com/support/power_management/pmu/w/design_notes/2898.tps65083x-faqs
10.2 Documentation Support
10.2.1 Related Documentation
For related documentation see the following:
• Thermal Characteristics of Linear and Logic Packages Using JEDEC PCB Designs Application Report
SZZA017
• Semiconductor and IC Package Thermal Metrics Application Report SPRA953
10.3 Receiving Notification of Documentation Updates
To receive notification of documentation updates—including silicon errata—go to the product folder for
your device on ti.com. In the upper right-hand corner, click the "Alert me" button. This registers you to
receive a weekly digest of product information that has changed (if any). For change details, check the
revision history of any revised document.
10.4 Community Resources
The following links connect to TI community resources. Linked contents are provided "AS IS" by the
respective contributors. They do not constitute TI specifications and do not necessarily reflect TI's views;
see TI's Terms of Use.
TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster
collaboration among engineers. At e2e.ti.com, you can ask questions, share knowledge,
explore ideas and help solve problems with fellow engineers.
Design Support TI's Design Support. Quickly find helpful E2E forums along with design support tools
and contact information for technical support.
10.5 Trademarks
PowerPAD, E2E are trademarks of Texas Instruments.
All other trademarks are the property of their respective owners.
10.6 Electrostatic Discharge Caution
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
10.7 Glossary
TI Glossary This glossary lists and explains terms, acronyms, and definitions.
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11 Mechanical, Packaging, and Orderable Information
11.1 Packaging Information
The following pages include mechanical packaging and orderable information. This information is the most
current data available for the designated devices. This data is subject to change without notice and
revision of this document. For browser-based versions of this data sheet, refer to the left-hand navigation.
150
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PACKAGE OPTION ADDENDUM
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10-Dec-2020
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
(2)
Lead finish/
Ball material
MSL Peak Temp
Op Temp (°C)
Device Marking
(3)
(4/5)
(6)
TPS650830ZAJR
ACTIVE
NFBGA
ZAJ
168
2000
RoHS & Green
SNAGCU
Level-3-260C-168 HR
-40 to 85
TPS650830
TPS650830ZAJT
ACTIVE
NFBGA
ZAJ
168
250
RoHS & Green
SNAGCU
Level-3-260C-168 HR
-40 to 85
TPS650830
TPS650830ZCGR
ACTIVE
NFBGA
ZCG
159
1000
RoHS & Green
SNAGCU
Level-3-260C-168 HR
-40 to 85
TPS650830
TPS650830ZCGT
ACTIVE
NFBGA
ZCG
159
250
RoHS & Green
SNAGCU
Level-3-260C-168 HR
-40 to 85
TPS650830
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of