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TPS65135
SLVS704C – NOVEMBER 2011 – REVISED JANUARY 2017
TPS65135 Single-Inductor, Multiple-Output Regulator
1 Features
3 Description
•
•
•
•
•
•
•
•
•
The TPS65135 device is a high-efficiency split-rail
power supply. Thanks to its single-inductor, multipleoutput (SIMO) topology, the converter uses very few
external components. The device operates with a
buck-boost topology and generates positive and
negative output voltages above or below the input
supply voltage. The SIMO topology achieves
excellent line and load regulation, which is necessary,
for example, to avoid disturbance of a mobile phone
display as a result of input voltage variations that
occur
during
transmit
periods
in
mobile
communication systems. The device can also be
used as a general-purpose split-rail supply as long as
the output current mismatch between the rails is less
than 50%.
1
•
•
•
•
•
Single-Inductor, Multiple-Output Topology
2.5-V to 5.5-V Input Voltage Range
750-mW Output Power at VI = 2.9 V
Positive Output Voltages Up to 6 V
Negative Output Voltage Down to –7 V
1% Output Voltage Accuracy
Up to 50% Output Current Mismatch Allowed
Excellent Line Regulation
Advanced Power-Save Mode for Light-Load
Efficiency
Low-Noise Operation
Out-of-Audio Mode
Short-Circuit Protection
Thermal Shutdown
3-mm × 3-mm Thin QFN Package
Device Information(1)
PART NUMBER
TPS65135
BODY SIZE (NOM)
3.00 mm × 3.00 mm
(1) For all available packages, see the orderable addendum at
the end of the data sheet.
2 Applications
•
•
•
PACKAGE
WQFN (16)
AMOLED Display Power Supplies
LCD Power Supplies
Split-Rail Power Supplies for Op-Amps, Data
Converters, Data Interfaces, etc.
Typical Application Schematic
L1
2.2 µH
TPS65135
15, 16
8
1
VI
2.5 V to 5.5 V
L1
L2
EN
OUTP
11, 12
VO(POS)
5 V, 80 mA
R1
365 k
FB
5
9, 10
VIN
C1
10 µF
C4
100 nF
4
13, 14
7
C2
4.7 µF
R2
120 k
VAUX
FBG
6
R3
487 k
GND
PGND
OUTN
2, 3
C3
4.7 µF
VO(NEG)
±5 V, 80 mA
Copyright © 2017, Texas Instruments Incorporated
1
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.
TPS65135
SLVS704C – NOVEMBER 2011 – REVISED JANUARY 2017
www.ti.com
Table of Contents
1
2
3
4
5
6
7
Features ..................................................................
Applications ...........................................................
Description .............................................................
Revision History.....................................................
Pin Configuration and Functions .........................
Specifications.........................................................
1
1
1
2
3
4
6.1
6.2
6.3
6.4
6.5
6.6
4
4
4
4
5
6
Absolute Maximum Ratings ......................................
ESD Ratings..............................................................
Recommended Operating Conditions.......................
Thermal Information ..................................................
Electrical Characteristics...........................................
Typical Characteristics ..............................................
Detailed Description .............................................. 7
7.1 Overview ................................................................... 7
7.2 Functional Block Diagram ......................................... 8
7.3 Feature Description................................................... 9
7.4 Device Functional Modes........................................ 11
8
Application and Implementation ........................ 12
8.1 Application Information............................................ 12
8.2 Typical Application ................................................. 12
9 Power Supply Recommendations...................... 19
10 Layout................................................................... 19
10.1 Layout Guidelines ................................................. 19
10.2 Layout Example .................................................... 20
11 Device and Documentation Support ................. 21
11.1
11.2
11.3
11.4
11.5
11.6
Device Support......................................................
Receiving Notification of Documentation Updates
Community Resources..........................................
Trademarks ...........................................................
Electrostatic Discharge Caution ............................
Glossary ................................................................
21
21
21
21
21
21
12 Mechanical, Packaging, and Orderable
Information ........................................................... 21
4 Revision History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
Changes from Revision B (June 2015) to Revision C
Page
•
Changed L2 pin numbers From: 1 and 14 To: 13 and 14 in the Pin Functions table ............................................................ 3
•
Changed PGND pin numbers From: 11 and 11 To: 11 and 12 in the Pin Functions table.................................................... 3
Changes from Revision A (November 2011) to Revision B
Page
•
Added Pin Configuration and Functions section, ESD Ratings table, Feature Description section, Device Functional
Modes, Application and Implementation section, Power Supply Recommendations section, Layout section, Device
and Documentation Support section, and Mechanical, Packaging, and Orderable Information section .............................. 1
•
Moved output current mismatch to Recommended Operating Conditions ............................................................................ 4
•
Moved maximum output power to Recommended Operating Conditions ............................................................................. 4
Changes from Original (November 2011) to Revision A
•
2
Page
Changed the UVLO threshould max value for VIN falling From: 2 V To 2.1 V ....................................................................... 5
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SLVS704C – NOVEMBER 2011 – REVISED JANUARY 2017
5 Pin Configuration and Functions
L1
L1
L2
L2
15
14
13
8
4
EN
VAUX
7
3
FB
OUTN
Exposed
Thermal
Pad
6
2
FBG
OUTN
5
1
GND
VIN
16
RTE Package
16-Pin WQFN
Top View
12
PGND
11
PGND
10
OUTP
9
OUTP
Pin Functions
PIN
NAME
NO.
I/O
DESCRIPTION
EN
8
I
Input pin to enable the device. Pulling this pin high enables the device. This pin has
an internal 500-kΩ pull-down resistor.
FB
7
I
Feedback regulation point for the positive output voltage rail
FBG
6
I
Feedback regulation point for the negative output voltage rail
GND
5
–
Analog ground
L1
L2
OUTN
OUTP
PGND
15
16
13
14
2
3
9
10
11
12
I/O
Inductor terminal
I/O
Inductor terminal
O
Negative output
O
Positive output
–
Power ground
VAUX
4
I/O
Reference voltage output. This pin requires a 100-nF capacitor for stability.
VIN
1
I
Input supply
Exposed thermal
pad
—
–
Connect this pad to ground
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6 Specifications
6.1 Absolute Maximum Ratings (1) (2)
over operating free-air temperature range (unless otherwise noted)
VIN, EN, VAUX, FB, OUTP, L2
Voltage
MIN
MAX
UNIT
–0.3
7
V
V
L1, OUTN
–8
7
–0.3
0.3
V
Operating junction temperature, TJ
–40
150
°C
Operating ambient temperature, TA
–40
85
°C
Storage temperature, Tstg
–65
150
°C
FBG
(1)
(2)
Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating
Conditions is not implied. Exposure to absolute–maximum–rated conditions for extended periods may affect device reliability.
All voltage values are with respect to ground.
6.2 ESD Ratings
VALUE
V(ESD)
(1)
(2)
Electrostatic discharge
Human body model (HBM), per ANSI/ESDA/JEDEC JS-001 (1)
±2000
Charged-device model (CDM), per JEDEC specification JESD22C101 (2)
±1000
Machine model (MM)
±200
UNIT
V
JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
6.3 Recommended Operating Conditions
MIN
TYP
MAX
VI
Input voltage range
2.5
5.5
IO(POS) /
|IO(NEG)|
Output current mismatch
0.5
2
PO
Output power (VI = 2.9 V, VO(POS) – VO(NEG) ≤ 10 V)
(1)
L
Inductor
C(IN)
Input Capacitor (1)
CO(POS),
CO(NEG)
Output Capacitors
TA
Operating ambient temperature
TJ
Operating junction temperature
(1)
(1)
1
2.2
4.7
10
4.7
10
UNIT
V
750
mW
4.7
µH
µF
20
µF
–40
85
°C
–40
125
°C
Please refer to Application Information for further information
6.4 Thermal Information
TPS65135
THERMAL METRIC (1)
RTE (WQFN)
UNIT
16 PINS
RθJA
Junction-to-ambient thermal resistance
RθJC(top)
Junction-to-case (top) thermal resistance
44.8
°C/W
42
°C/W
RθJB
ψJT
Junction-to-board thermal resistance
4.3
°C/W
Junction-to-top characterization parameter
16.9
°C/W
ψJB
Junction-to-board characterization parameter
0.4
°C/W
RθJC(bot)
Junction-to-case (bottom) thermal resistance
16.8
°C/W
(1)
4
For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report.
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6.5 Electrical Characteristics
VI = 3.7 V, V(EN) = VI, VO(POS) = 5 V, VO(NEG) = –5 V, TA = –40°C to 85°C; typical values are at TA = 25°C
(unless otherwise noted).
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
SUPPLY CURRENT
VI
Input voltage range
II(standby)
Quiescent current
EN = H; measured into VIN pin
2.5
7
5.5
V
Shutdown current
EN = L; measured into VIN pin
0.1
2
µA
VI rising
2
2.3
V
VI falling
1.8
2.1
V
mA
UNDERVOLTAGE LOCKOUT
Input threshold voltage (VIN)
(undervoltage lockout)
THERMAL SHUTDOWN
Thermal shutdown junction temperature
Thermal shutdown hysteresis
140
°C
5
°C
ENABLE
R(EN)
High-level input voltage (EN)
VI = 2.5 V to 5.5 V
Low-level input voltage (EN)
VI = 2.5 V to 5.5 V
Pull-down resistor (EN)
1.2
200
V
500
0.4
V
900
kΩ
6
V
OUTPUT
VO(POS)
Positive output voltage range
Threshold voltage (OUTP) (overvoltage
protection)
VO(NEG)
3
IO(POS) = 10 mA
Negative output voltage range
Threshold voltage (OUTN) (overvoltage
protection)
6.1
7
–7
IO(NEG) = –10 mA
V
–2.5
V
–7.6
-7.1
V
Vref1
Positive output reference voltage
–1%
1.24
+1%
Vref2
Negative output reference voltage
–10
0
10
ID(Q2)max
V
mV
MOSFET on-state resistance (Q1)
ID(Q1) = 100 mA
250
mΩ
MOSFET on-state resistance (Q2)
ID(Q2) = 100 mA
200
mΩ
MOSFET on-state resistance (Q3)
ID(Q3) = 100 mA
500
mΩ
MOSFET on-state resistance (Q4)
ID(Q4) = 100 mA
300
mΩ
Q2 switch current limit
VI = 3.7 V
0.9
1.2
1.6
VI = 2.5 V
1
1.5
1.9
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6.6 Typical Characteristics
VI= 3.7 V and TA = 25°C unless otherwise noted
1.6
1.6
ID(Q2)max
ID(Q2)max
1.5
Switch Current Limit (A)
Switch Current Limit (A)
1.5
1.4
1.3
1.2
1.1
1
0.9
1.4
1.3
1.2
1.1
1
0.9
0.8
−50
−25
0
25
50
75
Junction Temperature (°C)
100
0.8
2.5
125
3
G000
Figure 1. Switch Current Limit vs Temperature
3.5
4
4.5
Input Voltage (V)
5
G000
Figure 2. Switch Current Limit vs Input Supply Voltage
10m
10m
II(standby)
II(standby)
8m
Input Current (A)
8m
Input Current (A)
5.5
6m
4m
2m
6m
4m
2m
0
−50
−25
0
25
50
75
Junction Temperature (°C)
100
0
2.5
125
3
G000
Figure 3. Input Supply Current vs Temperature
3.5
4
4.5
Input Voltage (V)
5
G000
Figure 4. Input Supply Current vs Input Supply Voltage
1.250
10m
1.245
1.240
1.235
−25
0
25
50
75
Junction Temperature (°C)
100
125
5m
0
−5m
−10m
−50
G000
Figure 5. Reference Voltage Vref1 vs Temperature
6
Vref2
Reference Voltage (V)
Reference Voltage (V)
Vref1
1.230
−50
5.5
−25
0
25
50
75
Junction Temperature (°C)
100
125
G000
Figure 6. Reference Voltage Vref2 vs Temperature
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7 Detailed Description
7.1 Overview
The TPS65135 device uses a four-switch buck-boost converter topology to generate one negative and one
positive output voltage with a single inductor. The device uses a SIMO topology to achieve excellent line
transient response, buck-boost mode for both outputs, and high efficiency over the entire output current range.
High efficiency over the entire load-current range is implemented by reducing the converter switching frequency
under low load conditions. Out-of-audio mode prevents the switching frequency going below 20 kHz.
The converter operates with two control loops. One error amplifier controls the positive output voltage VO(POS) so
that the FB pin is regulated to 1.24 V. A second error amplifier controls the negative output voltage VO(NEG) so
that the FBG pin is regulated to 0 V. An external feedback divider allows both output voltages to be set to the
desired value. In principle, the SIMO converter topology operates just like any other buck-boost converter
topology, with the difference that the output voltage across the inductor is the sum of the positive and negative
output voltages. With this consideration all calculations of the buck-boost converter apply for this topology as
well. During the first part of a switching cycle Q1 and Q2 are closed, connecting the inductor from VI to ground.
During the second part of a switching cycle, the inductor discharges to the positive and negative outputs by
closing switches Q4 and Q3. Because the inductor is discharged to both of the outputs simultaneously, the
output voltages can be higher or lower than the input voltage. The converter operates best when the positive
output current IO(POS) is equal to the negative output current IO(NEG), for example, as is the case when driving an
AMOLED display. However, asymmetries of up to 50% in load current can be canceled out by the used topology.
In such cases, a third part of the switching cycle is implemented, during which either Q3 is turned off and Q1 is
turned on (as is the case when IO(POS) > IO(NEG)) or Q4 is turned off and Q2 is turned on (as is the case when
IO(NEG) > IO(POS)) (see Table 1).
During light loads the converter operates in DCM, using peak-current control and a switching frequ3ency
determined by a voltage-controlled oscillator (VCO). At higher load currents the converter operates in CCM with
a switching frequency controlled by a fixed off-time. The SIMO regulator topology achieves its best line transient
response when operating in DCM.
Table 1. Switch Control
Switching Cycle
Q1
Q2
Q3
Q4
Part 1
On
On
Off
Off
Part 2
Off
Off
On
On
On
Off
Off
On
If IO(POS) > |IO(NEG)|
Off
On
On
Off
If |IO(NEG)| > IO(POS)
Part 3
Remark
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7.2 Functional Block Diagram
L1
L2
I(SNS)
VI
VIN
Q1
OUTP
Q4
VO(POS)
Q2
FB
Gate
Driver
PGND
FBG
OUTN
Q3
PWM / PFM
Control
±
EN
&
V(FBG)
Vref2
Out-of-Audio
Control
VCO
TSD
UVLO
EN
Vref1
+
V(OUTN)
Overvoltage &
Short-Circuit
Protection
Current Limit
& Soft-Start
V(FB)
+
V(OUTP)
±
I(SNS)
VO(NEG)
Device
enable
Ideal diodes
V(VIN)
Internal supply
R(EN)
V(OUTP)
PGND
TSD = Thermal shutdown.
UVLO = Undervoltage lockout.
8
AGND
Linear
Regulator
VAUX
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7.3 Feature Description
7.3.1 Advanced Power-Save Mode for Light-Load Efficiency
In order to maintain high efficiency over the entire load current range, the converter reduces its switching
frequency as the load current decreases. The advanced power-save mode controls the switching frequency
using a voltage-controlled oscillator (VCO). The VCO frequency is proportional to the inductor peak current, with
a lower frequency limit of 20 kHz; but in typical applications the frequency does not go below 100 kHz. This
avoids disturbance of the audio band and minimizes audible noise coming from the ceramic input and output
capacitors. By maintaining a controlled switching frequency, potential EMI is minimized. This is especially
important when using the device in mobile phones. See Figure 24 for typical switching frequency versus load
current. For zero load an internal shunt regulator ensures stable output voltage regulation.
7.3.2 Buck-Boost Mode Operation
Buck-boost mode operation allows the input voltage to be higher or lower than the output voltage. This mode
allows the use of batteries and supply voltages that are above the positive output voltage.
7.3.3 Inherently Good Line-Transient Regulation
The SIMO regulator achieves inherently good line-transient response when operating in discontinuous
conduction mode (DCM), as shown in Figure 14 and Figure 15. In DCM, the current delivered to the output is
determined by the peak value and slope of the inductor current. This is illustrated in Figure 7, where the average
output current, shown by the shaded area, is the same for different input voltages. Because the converter uses
peak-current-mode control, the peak current is fixed as long as the load current is fixed. The falling slope of the
inductor current is given by the difference between the positive and negative output voltages and the inductor
value; it is independent of the input voltage. As a result, any change in input voltage changes the converter duty
cycle but not the peak value or slope of the inductor current when discharging. The average output current, given
by the area A (Figure 7), therefore remains constant over any input voltage variation. Entering continuous
conduction mode (CCM) linearly decreases the line-transient performance; however, the line-transient response
in CCM is still as good as any standard current-mode switching converter.
Slope =
I(L)
VO(POS) + +VO(NEG)+
L
I(L)M
t
VI
Slope =
L
Figure 7. Inherently Good Line-Transient Regulation
The following formulas describe the operation of the TPS65135 device when operating in CCM with equal
positive and negative output currents. The converter always sees the sum VO of the magnitude of the positive
and negative output voltages, as given by
SPACE
VO = VO(POS) + +VO(NEG) +
where
•
•
VO(POS) is the positive output voltage
and VO(NEG) is the negative output voltage.
(1)
SPACE
The converter duty cycle is calculated using the efficiency estimation from datasheet curves or from real
application measurements. A value of 70% for the efficiency η is a good starting assumption for most
applications.
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Feature Description (continued)
SPACE
VO
VI + VO
D=
where
•
•
D is the duty cycle of Q2
and η is the converter efficiency.
(2)
SPACE
Now the output current for entering CCM can be calculated. The switching frequency can be obtained from the
data sheet graphs. A frequency of 1.5 MHz is a good assumption for these calculations.
SPACE
IO(CCM) =
VO :1 ± D;2
2fL
where
•
•
•
IO(CCM) is the value of output current at which continuous conduction starts;
f is the converter switching frequency;
and L is the inductance connected between the L1 and L2 pins.
(3)
SPACE
The inductor ripple current when operating in CCM can also be calculated
SPACE
I:L;(PP) =
DVI
fL
where
•
I(L)(PP) is the peak-to-peak (that is, ripple) inductor current.
(4)
SPACE
Finally, the converter switch peak current can be calculated
SPACE
I:L;M =
I(L)(PP)
IO
+
2
1±D
where
•
I(L)M is the peak (that is, maximum) inductor current.
(5)
SPACE
7.3.4 Overvoltage Protection
The device monitors the positive and negative output voltages and reduces the current limit when either (or both)
of the output voltages exceeds its overvoltage protection threshold. The positive output voltage is clamped to 7 V
and the negative output voltage to –7.6 V.
7.3.5 Short-Circuit Protection
Both outputs are protected against short circuits either to ground or to the other output. The device's switching
frequency and current limit are reduced in case of a short circuit.
7.3.6 Soft-Start Operation
The device increases the current limit during soft-start operation to avoid high inrush currents during start up. The
current limit typically ramps up to its maximum value within 100 µs.
10
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Feature Description (continued)
7.3.7 Output-Current Mismatch
The device operates best when the current of the positive output is similar to the current of the negative output.
However, the device is able to regulate an output current mismatch of up to 50% (See Figure 26 for typically
allowed currents, only 50% mismatch is specified). If the output-current mismatch becomes much larger one of
the outputs goes out of regulation and finally the device shuts down. In case of zero load of one output the other
output can support up to 5 mA. The device automatically recovers when the mismatch is reduced. The formula
below can be used to calculate the maximum supported current mismatch.
SPACE
IO(POS)
0.5 ” d
d ”2
IO(NEG)
(6)
SPACE
7.3.8 Setting the Output Voltages
The output voltages are set by the three feedback resistors R1, R2, and R3 (Figure 8). R1 and R2 set the
positive output voltage VO(POS) and R2 and R3 set the negative output voltage VO(NEG). To reduce the circuit's
sensitivity to noise, it is recommended to choose R2 so that a current of at least 10 µA flows through the
feedback resistors. Equation 7 can be used to calculate a suitable value for R2.
SPACE
R2 =
Vref1
1.24 V
=
= 124 k
A
I(R2)
(7)
SPACE
The positive output voltage VO(POS) is given by
SPACE
VO(POS) = Vref1 l1 +
R1
p
R2
(8)
SPACE
The negative output voltage VO(NEG) is given by
SPACE
R3
VO(NEG) = ±Vref1 l p
R2
(9)
7.4 Device Functional Modes
7.4.1 Operation with 2.5 V ≤ VI ≤ 5.5 V
The recommended input supply voltage is 2.5 V to 5.5 V. Within this range the device operates normally and
achieves its specified performance.
7.4.2 Operation with VI < 2.5 V
The recommended minimum input supply voltage is 2.5 V. The device continues to operate with input supply
voltages lower than 2.5 V, however, its performance is not specified. The device does not operate with input
supply voltages below the UVLO threshold.
7.4.3 Operation with VI > 5.5 V
The recommended maximum input supply voltage is 5.5 V. As long as the absolute maximum voltage is not
exceeded, the device will not be damaged by input supply voltages greater than 5.5 V, however, its performance
is not specified.
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Device Functional Modes (continued)
7.4.4 Operation with EN
When EN = L the device is disabled and switching is inhibited. When EN = H the device is enabled and its startup sequence begins. If the EN pin is left floating an internal 500-kΩ resistor pulls this pin to ground.
8 Application and Implementation
NOTE
Information in the following applications sections is not part of the TI component
specification, and TI does not warrant its accuracy or completeness. TI’s customers are
responsible for determining suitability of components for their purposes. Customers should
validate and test their design implementation to confirm system functionality.
8.1 Application Information
The TPS65135 device can be used to generate spilt-rail supplies from input supply voltages in the range 2.5 V to
5.5 V and has been optimized for use with 3.3-V rails of single-cell Li-ion batteries. It can generate positive
output voltages up to 6 V and negative voltages down to –7 V with buck-boost action (i.e. the input supply
voltage may be above or below the positive output voltage), as long as the output current mis-match is 50% or
less. Both outputs are controlled by the EN pin: a high logic level enables both outputs, and a low logic level
disables them. An integrated UVLO function disables the device when the input supply voltage is too low for
proper operation.
8.2 Typical Application
Figure 8 shows a typical application for a ±5-V AMOLED display supply.
SPACE
L1
2.2 µH
TPS65135
15, 16
8
1
VI
2.5 V to 5.5 V
L1
L2
EN
OUTP
11, 12
VO(POS)
5 V, 80 mA
R1
365 k
FB
5
9, 10
VIN
C1
10 µF
C4
100 nF
4
13, 14
7
C2
4.7 µF
R2
120 k
VAUX
FBG
6
R3
487 k
GND
PGND
OUTN
2, 3
C3
4.7 µF
VO(NEG)
±5 V, 80 mA
Copyright © 2017, Texas Instruments Incorporated
Figure 8. Standard Application ±5-V Supply
8.2.1 Design Requirements
Table 2 shows the design requirements for a ±5-V AMOLED supply application used as an example to illustrate
the design process.
12
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Typical Application (continued)
Table 2. Design Parameters
PARAMETER
SYMBOL
EXAMPLE VALUE
Input Supply Voltage Range
VI
2.5 V to 5.5 V
Positive Output Voltage
VO(POS)
5V
Negative Output Voltage
VO(NEG)
–5 V
Maximum Positive Output Current
IO(POS) max
80 mA
Maximum Negative Output Current
IO(NEG) max
–80 mA
8.2.2 Detailed Design Procedure
8.2.2.1 Choosing a Suitable Inductor
The TPS65135 device is internally compensated and operates best with a 2.2-µH inductor. For this type of
converter, selection of the inductor is a key element in the design process because it has a big impact on the
efficiency, the line and load transient response, and the maximum output current the device is able to deliver.
Because the inductor ripple current is fairly large in the SIMO topology, the inductor core losses largely
determine converter efficiency. As a result, an inductor with a relatively large dc winding resistance (DCR) but
low core losses can often achieve higher converter efficiencies than other inductors with lower DCR but higher
core losses.
As previously described, the converter's line transient response is highest when the converter operates in DCM,
and since larger inductor values cause the converter to enter CCM operation at lower load currents, smaller
inductor values give the best line transient response. The formula to calculate the output current at which the
converter enters CCM operation is shown in Equation 3. The inductors listed in Table 3 achieve a good overall
converter efficiency while having a low height. The first two TOKO inductors achieve the highest efficiency
(almost identical) followed by the LPS3008. The best compromise between efficiency and inductor size is given
by the XFL2006 inductor. The inductor saturation current should typically be 1 A or higher, however, if the output
current required by the application is low, inductors with smaller saturation current ratings may be considered.
Table 3. Inductor Selection
INDUCTOR VALUE
2.2 µH
COMPONENT SUPPLIER
DIMENSIONS in mm
Isat / DCR
TOKO DFE252010C
2.5 x 2 x 1
1.9 A / 130 mΩ
TOKO DFE252012C
2.5 x 2 x 1.2
2.2 A / 90 mΩ
Coilcraft XFL2006-222
2 × 1.9 × 0.6
0.8 A / 278 mΩ
Coilcraft LPS3008-222
3 × 3 × 0.8
1.1 A / 175 mΩ
Samsung CIG2MW2R2NNE
2 × 1.6 × 1
1.2 A / 110 mΩ
TOKO FDSE0312-2R2
3.3 × 3.3 × 1.2
1.2 A / 160 mΩ
ABCO LPF3010T-2R2
2.8 × 2.8 × 1
1.0 A / 100 mΩ
Maruwa CXFU0208-2R2
2.65 × 2.65 × 0.8
0.85 A / 185 mΩ
8.2.2.2 Choosing Suitable Input and Output Capacitors
The TPS65135 device typically requires a 10-µF ceramic input capacitor. Larger values can be used to lower the
input voltage ripple. Table 4 lists capacitors suitable for use on the TPS65135 input.
Table 4. Input Capacitor Selection
CAPACITOR
COMPONENT SUPPLIER
SIZE
10 µF / 6.3V
Murata GRM188R60J106ME84D
0603
10 µF / 6.3 V
Taiyo Yuden JMK107BJ106
0603
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A 4.7-µF output capacitor is generally sufficient for most applications, but larger values can be used as well for
improved load- and line-transient response at higher load currents. The capacitors of Table 5 have been found to
work well with the TPS65135 device.
Table 5. Output Capacitor Selection
CAPACITOR
COMPONENT SUPPLIER
SIZE
10 µF / 6.3 V
Murata GRM188R60J106ME84D
0603
4.7 µF / 10 V
Taiyo Yuden LMK107BJ475
0603
10 µF / 6.3 V
Taiyo Yuden JMK107BJ106
0603
8.2.2.3 Choosing Suitable Feedback Resistors
Equation 7 can be used to calculate a suitable value for R2, so that the recommended current of ≈10 µA flows
through the feedback resistors.
The value of R1 can be calculated by rearranging Equation 7, so that
SPACE
R1 = R2 F
VO(POS)
± 1G
Vref1
(10)
SPACE
Inserting R2 = 120 kΩ, Vref1 = 1.24 V and VO(POS) = 5 V into Equation 10, we get
SPACE
5V
R1 = 120 k l
± 1p = 363.9 k
1.24 V
(11)
SPACE
The closest 1%-tolerance standard value is 365 kΩ, which will generate a nominal output voltage of 5.012 V.
The value of R3 can be calculated by rearranging Equation 9, so that
SPACE
R3 = R2 F
+VO(NEG) +
G
Vref1
(12)
SPACE
Inserting R2 = 120 kΩ, Vref1 = 1.24 V and VO(NEG) = –5 V into Equation 12, we get
SPACE
5V
R3 = 120 k l
p = 483.9 k
1.24 V
(13)
SPACE
The closest 1%-tolerance standard value is 487 kΩ, which will generate a nominal output voltage of –5.032 V.
8.2.2.4 Measurement Circuit
The following application curves were obtained using the circuit shown in Figure 9 and the external components
listed in Table 6.
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L1
TPS65135
15, 16
8
1
VI
L1
L2
EN
OUTP
13, 14
9, 10
VIN
VO(POS)
R1
C2
FB
C1
7
R2
C4
4
5
11, 12
VAUX
FBG
6
C3
GND
PGND
R3
OUTN
2, 3
VO(NEG)
Copyright © 2017, Texas Instruments Incorporated
Figure 9. Measurement Circuit
Table 6. Component List
Reference
Description
C1, C2, C3
10 μF, 6.3 V, 0603, X5R, ceramic
Murata, GRM188R60J106ME84D
Manufacturer and Part Number
C4
100 nF, 10 V, 0603, X7R, ceramic
Murata, GRM188R71H104KA93D
L1
2.2 μH, 2.2 A, 90 mΩ, 2.5 mm × 2.0 mm × 1.2 mm
Toko, 1239AS-H-2R2M
R1
Depending on the output voltage, 1%, (all measurements with ±5 V output voltage uses 365 kΩ)
R2
Depending on the output voltage, 1%, (all measurements with ±5 V output voltage uses 120 kΩ)
R3
Depending on the output voltage, 1%, (all measurements with ±5 V output voltage uses 487 kΩ)
U1
TPS65135RTE
Texas Instruments
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8.2.3 Application Curves
100
100
90
90
80
80
70
70
Efficiency (%)
Efficiency (%)
In the following curves VI = 3.7 V, VO(POS) = 5 V, VO(NEG) = –5 V unless otherwise noted. Where the symbol IO is
used, it implies that IO(POS) = |IO(NEG)|. All measurements at TA = 25°C unless otherwise noted.
60
50
40
30
60
50
40
30
VI = 2.5 V
VI = 3.7 V
VI = 4.5 V
20
10
0
1m
10m
Output Current (A)
VI = 2.5 V
VI = 3.7 V
VI = 4.5 V
20
10
100m
0
1m
10m
Output Current (A)
G000
L1 = 2.2 µH
100m
G000
L1 = 4.7 µH
Figure 10. Efficiency vs Load Current
Figure 11. Efficiency vs Load Current
V(L1)
V(L1)
VO(POS)
VO(POS)
VO(NEG)
VO(NEG)
I(L1)
I(L1)
IO = 10 mA
IO = 80 mA
Figure 12. Operation at Light Load Current (DCM)
Figure 13. Operation at High Load Current (CCM)
VI
VI
VO(POS)
VO(POS)
VO(NEG)
VO(NEG)
IO = 10 mA
VI = 2.9 V, 3.4 V
IO = 50 mA
Figure 14. Line Transient Response
16
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VI = 2.9 V, 3.4 V
Figure 15. Line Transient Response
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VI
V(EN)
VO(NEG)
VO(NEG)
VO(POS)
VO(POS)
I(IN)
I(IN)
IO = 0 mA
IO = 0 mA
Figure 16. Start Up (VI Rising)
Figure 17. Start Up (V(EN) Rising)
VI
V(EN)
VO(NEG)
VO(NEG)
VO(POS)
VO(POS)
I(IN)
I(IN)
IO = 0 mA
IO = 0 mA
Figure 18. Shut Down – (VI Falling)
Figure 19. Shut Down (V(EN) Falling)
VO(NEG)
VO(NEG)
VO(POS)
VO(POS)
IO
IO
IO = 10 mA, 50 mA
IO = 20 mA, 80 mA
Figure 20. Load Transient Response
Figure 21. Load Transient Response
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5.25
−4.75
5.20
−4.80
5.15
−4.85
Output Voltage (V)
Output Voltage (V)
SLVS704C – NOVEMBER 2011 – REVISED JANUARY 2017
5.10
5.05
5.00
4.95
4.90
VI = 2.7 V
VI = 3.6 V
VI = 4.2 V
4.85
4.80
4.75
0
10m
20m
30m 40m 50m
Input Current (A)
60m
70m
−4.90
−4.95
−5.00
−5.05
−5.10
VI = 2.7 V
VI = 3.6 V
VI = 4.2 V
−5.15
−5.20
−5.25
80m
0
Figure 22. Positive Output Load Regulation
30m 40m 50m
Input Current (A)
60m
70m
80m
G000
30m
IO = 0 mA
IO = 1 mA
IO = 2 mA
IO = 3 mA
IO = 4 mA
IO = 5 mA
25m
Input Current (A)
1.6M
Frequency (Hz)
20m
Figure 23. Negative Output Load Regulation
2M
1.2M
800k
VI = 2.5 V
VI = 3.1 V
VI = 3.7 V
VI = 4.6 V
400k
0
10m
G000
0
20m
15m
10m
5m
0
2.5
10m 20m 30m 40m 50m 60m 70m 80m 90m 100m
Output Current (A)
G000
Figure 24. Switching Frequency vs Load Current
3
3.5
4
4.5
Input Voltage (V)
5
5.5
G000
Figure 25. Input Current vs Input Voltage
Not allowed
Area
90
80
IO(NEG) (mA)
70
60
50
40
30
20
Not allowed
Area
10
0
0
10
20
30
40
50
60
IO(POS) (mA)
70
80
90
100
Figure 26. Output Current Mismatch
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9 Power Supply Recommendations
The TPS65135 device is designed to operate from an input supply voltage in the range 2.5 V to 5.5 V. If the
input supply is located more than a few centimeters from the device additional bulk capacitance may be required.
The 10-μF shown in the schematics in this data sheet are typical for this function.
10 Layout
10.1 Layout Guidelines
No PCB layout is perfect, and compromises are always necessary. However, the basic principles listed below (in
order of importance) go a long way to achieving the full performance of the TPS65135 device.
• If possible, route discontinuous switching currents on the top layer, using short, wide traces to minimize stray
inductance and resistance. For the TPS65135 device, the current flowing into the VIN, L1, L2, VPOS, VNEG
and PGND pins is discontinuous. In the example layout below, vias are used to connect discontinuous return
currents to the ground plane, as it is considered a slightly better approach with this device than forcing all
currents to flow on the top layer.
• Place C1 and C4 as close as possible to the VIN and AVIN pins respectively.
• Place C2 and C3 as close as possible to the VPOS and VNEG pins respectively.
• Place L1 as close as possible to the L1 and L2 pins.
• Use a copper pour (preferably on layer 2) as a thermal spreader and connect it to the exposed thermal pad
using the maximum number of thermal vias (see packaging information for more information on the
recommended thermal vias).
• The copper pour described above can be used as a ground plane if it is not possible to route power ground
signals on the top layer.
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10.2 Layout Example
Figure 27 shows an example PCB layout based on the above principles.
F
L1
C1
E
L2
L2
L1
13
14
F
D
15
F
16
C3
L1
VI
VIN
1
12
PGND
OUTN
2
11
PGND
OUTN
3
10
OUTP
VAUX
4
9
OUTP
C2
VO(NEG)
A
VO(POS)
5
6
7
8
FBG
FB
EN
D
GND
B
C4
C
B
R2
R1
R3
A
Multiple vias used to connect thermal pad to copper pour on bottom or inner layer to conduct heat away and minimize loop area.
B
Output voltages sensed directly at output capacitors. Sensing traces kept separate from high-current-carrying traces.
C
C4 placed close to VAUX and GND pins. Traces connecting to C4 do not need to be especially wide, because they do not conduct high current.
D
C2 and C3 placed close to OUTP and OUTN pins and connected with wide traces to minimize parasitic inductance.
E
C1 placed close to VIN pin and connected with very wide traces to minimize parasitic inductance.
F
PGND connected to copper pour ground plane on bottom or inner layer to minimize loop area.
Figure 27. PCB Layout Example
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11 Device and Documentation Support
11.1 Device Support
11.1.1 Third-Party Products Disclaimer
TI'S PUBLICATION OF INFORMATION REGARDING THIRD-PARTY PRODUCTS OR SERVICES DOES NOT
CONSTITUTE AN ENDORSEMENT REGARDING THE SUITABILITY OF SUCH PRODUCTS OR SERVICES
OR A WARRANTY, REPRESENTATION OR ENDORSEMENT OF SUCH PRODUCTS OR SERVICES, EITHER
ALONE OR IN COMBINATION WITH ANY TI PRODUCT OR SERVICE.
11.2 Receiving Notification of Documentation Updates
To receive notification of documentation updates, navigate to the device product folder on ti.com. In the upper
right corner, click on Alert me to register and receive a weekly digest of any product information that has
changed. For change details, review the revision history included in any revised document.
11.3 Community Resources
The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective
contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of
Use.
TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration
among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help
solve problems with fellow engineers.
Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and
contact information for technical support.
11.4 Trademarks
E2E is a trademark of Texas Instruments.
All other trademarks are the property of their respective owners.
11.5 Electrostatic Discharge Caution
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
11.6 Glossary
SLYZ022 — TI Glossary.
This glossary lists and explains terms, acronyms, and definitions.
12 Mechanical, Packaging, and Orderable Information
The following pages include mechanical, packaging, and orderable information. This information is the most
current data available for the designated devices. This data is subject to change without notice and revision of
this document. For browser-based versions of this data sheet, refer to the left-hand navigation.
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PACKAGE MATERIALS INFORMATION
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3-Jun-2022
TAPE AND REEL INFORMATION
REEL DIMENSIONS
TAPE DIMENSIONS
K0
P1
B0 W
Reel
Diameter
Cavity
A0
B0
K0
W
P1
A0
Dimension designed to accommodate the component width
Dimension designed to accommodate the component length
Dimension designed to accommodate the component thickness
Overall width of the carrier tape
Pitch between successive cavity centers
Reel Width (W1)
QUADRANT ASSIGNMENTS FOR PIN 1 ORIENTATION IN TAPE
Sprocket Holes
Q1
Q2
Q1
Q2
Q3
Q4
Q3
Q4
User Direction of Feed
Pocket Quadrants
*All dimensions are nominal
Device
TPS65135RTER
Package Package Pins
Type Drawing
WQFN
RTE
16
SPQ
Reel
Reel
A0
Diameter Width (mm)
(mm) W1 (mm)
3000
330.0
12.4
Pack Materials-Page 1
3.3
B0
(mm)
K0
(mm)
P1
(mm)
3.3
1.1
8.0
W
Pin1
(mm) Quadrant
12.0
Q2
PACKAGE MATERIALS INFORMATION
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3-Jun-2022
TAPE AND REEL BOX DIMENSIONS
Width (mm)
W
L
H
*All dimensions are nominal
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
TPS65135RTER
WQFN
RTE
16
3000
356.0
356.0
35.0
Pack Materials-Page 2
GENERIC PACKAGE VIEW
RTE 16
WQFN - 0.8 mm max height
PLASTIC QUAD FLATPACK - NO LEAD
3 x 3, 0.5 mm pitch
This image is a representation of the package family, actual package may vary.
Refer to the product data sheet for package details.
4225944/A
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PACKAGE OUTLINE
RTE0016C
WQFN - 0.8 mm max height
SCALE 3.600
PLASTIC QUAD FLATPACK - NO LEAD
3.1
2.9
A
B
PIN 1 INDEX AREA
3.1
2.9
SIDE WALL
METAL THICKNESS
DIM A
OPTION 1
OPTION 2
0.1
0.2
C
0.8 MAX
SEATING PLANE
0.05
0.00
0.08
1.68 0.07
(DIM A) TYP
5
8
EXPOSED
THERMAL PAD
12X 0.5
4
9
4X
1.5
SYMM
17
1
12
16X
PIN 1 ID
(OPTIONAL)
16
13
0.1
0.05
SYMM
16X
0.30
0.18
C A B
0.5
0.3
4219117/B 04/2022
NOTES:
1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. The package thermal pad must be soldered to the printed circuit board for thermal and mechanical performance.
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EXAMPLE BOARD LAYOUT
RTE0016C
WQFN - 0.8 mm max height
PLASTIC QUAD FLATPACK - NO LEAD
( 1.68)
SYMM
13
16
16X (0.6)
1
12
16X (0.24)
SYMM
17
(2.8)
(0.58)
TYP
12X (0.5)
9
4
( 0.2) TYP
VIA
5
(R0.05)
ALL PAD CORNERS
8
(0.58) TYP
(2.8)
LAND PATTERN EXAMPLE
EXPOSED METAL SHOWN
SCALE:20X
0.07 MIN
ALL AROUND
0.07 MAX
ALL AROUND
SOLDER MASK
OPENING
METAL
EXPOSED
METAL
SOLDER MASK
OPENING
EXPOSED
METAL
NON SOLDER MASK
DEFINED
(PREFERRED)
METAL UNDER
SOLDER MASK
SOLDER MASK
DEFINED
SOLDER MASK DETAILS
4219117/B 04/2022
NOTES: (continued)
4. This package is designed to be soldered to a thermal pad on the board. For more information, see Texas Instruments literature
number SLUA271 (www.ti.com/lit/slua271).
5. Vias are optional depending on application, refer to device data sheet. If any vias are implemented, refer to their locations shown
on this view. It is recommended that vias under paste be filled, plugged or tented.
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EXAMPLE STENCIL DESIGN
RTE0016C
WQFN - 0.8 mm max height
PLASTIC QUAD FLATPACK - NO LEAD
( 1.55)
16
13
16X (0.6)
1
12
16X (0.24)
17
SYMM
(2.8)
12X (0.5)
9
4
METAL
ALL AROUND
5
SYMM
8
(R0.05) TYP
(2.8)
SOLDER PASTE EXAMPLE
BASED ON 0.125 mm THICK STENCIL
EXPOSED PAD 17:
85% PRINTED SOLDER COVERAGE BY AREA UNDER PACKAGE
SCALE:25X
4219117/B 04/2022
NOTES: (continued)
6. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate
design recommendations.
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