TPS658610AZQZR

TPS658610A www.ti.com SLVSAH3 – AUGUST 2010 Advanced Power Management Unit Check for Samples: TPS658610A 1 Introduction 1.1 Main Features 1 • BATTERY CHARGER – Complete Charge Management Solution for a Single Cell Li-Ion/Li-Pol Cell With Dynamic Power Management and Thermal Foldback. – Maximum 1.0A charge current – Programmable Adapter and USB Charge Operation • INTEGRATED POWER SUPPLIES – 3 Programmable Step-Down converters • Software Controlled Enable/Forced PWM Mode • Automatic Power Saving Mode • Maximum 1.2A Outputs – 11 Programmable General Purpose LDOs • 7 With Output Voltages of 1.25V to 3.3V • 2 With Output Voltages of 0.725V to 1.5V or 1.25V to 2.586V (factory configurable) • 1 “Always On” With Output Voltages of 1.25V to 3.3V • 1 With Output Voltage of 1.70V–2.475V • DISPLAY SUPPORT FUNCTIONS – 4 PWM Outputs With Programmable Frequency and Duty Cycle – Dual RGB LED Drivers – Constant Current WLED Driver • 26.5V (max) at 25mA • Over-Voltage Protection • Programmable Current Level and Brightness Control • HOST INTERFACE – Interrupt Controller With Maskable Interrupts – External ADC Triggering and Step-Down Converter Mode Control 1.3 • SYSTEM MANAGEMENT – Dual Input Power Path • USB Current Limiting • Max 18V Over-Voltage Protection – Power Good Monitoring on all Supply Outputs – Software Reset Function – Hardware On/Off and Reboot Control – 11 Channel ADC With 3 Operating Modes • Single Conversion • Peak Detection • Averaging 1.2 • • • Applications Smart Phones Portable Navigation Devices Portable Media Players Overview The TPS658610A provides an easy to use, fully integrated solution for handheld devices, integrating charge management, multiple regulated power supplies, system management and display functions in a small 6x6 package. The I2C interface enables control of a wide range of subsystem parameters. Internal registers have a complete set of status information, enabling easy diagnostics and host-controlled handling of fault conditions. 1 Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright © 2010, Texas Instruments Incorporated To request a full data sheet, please send an email to: nvidia_contact@list.ti.com. PACKAGE OPTION ADDENDUM www.ti.com 1-Sep-2010 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Qty Eco Plan (2) Lead/ Ball Finish MSL Peak Temp (3) Samples (Requires Login) TPS658610AZQZR ACTIVE BGA MICROSTAR JUNIOR ZQZ 120 2500 Green (RoHS & no Sb/Br) SNAGCU Level-3-260C-168 HR TPS658610AZQZT ACTIVE BGA MICROSTAR JUNIOR ZQZ 120 250 Green (RoHS & no Sb/Br) SNAGCU Level-3-260C-168 HR (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. 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