User's Guide
SLVU582A – December 2011 – Revised May 2012
TPS658643 System Evaluation Board
This user’s guide describes the characteristics, operation, and use of the TPS658643EVM-752 evaluation
module (EVM). The TPS658643EVM-752 is a fully assembled and tested platform for evaluating the
performance of the TPS658643 single-chip, power management device. This document includes
schematic diagrams, a printed-circuit board layout, bill of materials, and test data.
1
2
3
4
5
6
7
8
Contents
Introduction .................................................................................................................. 3
1.1
Features ............................................................................................................. 3
1.2
Applications ......................................................................................................... 3
1.3
Requirements ....................................................................................................... 3
Electrical Performance Specifications .................................................................................... 3
Schematic .................................................................................................................... 4
Connector and Test Point Descriptions .................................................................................. 8
4.1
Headers and Switches ............................................................................................ 8
4.2
Jumpers ............................................................................................................. 9
Setup ........................................................................................................................ 10
TPS658643EVM Test Data .............................................................................................. 11
6.1
Operation Waveforms ............................................................................................ 11
EVM Assembly Drawings and Layout .................................................................................. 16
Bill of Materials ............................................................................................................. 20
List of Figures
1
HPA752A Schematic, Sheet 1 ............................................................................................ 4
2
HPA752A Schematic, Sheet 2 ............................................................................................ 5
3
HPA752A Schematic, Sheet 3 ............................................................................................ 6
4
HPA752A Schematic, Sheet 4 ............................................................................................ 7
5
SM0, Ch. 1 - VIN 1 V/div; Ch. 2 - SW 1 V/div; Ch. 3 - Vout 10 mV/div ............................................ 11
6
SM1, Ch. 1 - VIN 1 V/div; Ch. 2 - SW 1 V/div; Ch. 3 - Vout 10 mV/div ............................................ 12
7
SM2, Ch. 1 - VIN 1 V/div; Ch. 2 - SW 1 V/div; Ch. 3 - Vout 10 mV/div ............................................ 12
8
SM0, SM1, SM2, and LDO1 Start-Up
9
LDO1, LDO2, LDO3, and LDO4 Start-Up .............................................................................. 13
10
LDO4, LDO5, and LDO9 Start-Up....................................................................................... 14
11
32-kHz Clock ............................................................................................................... 15
12
Top Assembly – Silkscreen .............................................................................................. 16
13
Top Layer ................................................................................................................... 16
14
Layer 2 ...................................................................................................................... 17
15
Layer 3 ...................................................................................................................... 17
16
Layer 4 ...................................................................................................................... 18
17
Layer 5 ...................................................................................................................... 18
18
Layer 6 ...................................................................................................................... 19
19
Bottom Layer ............................................................................................................... 19
..................................................................................
13
List of Tables
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1
2
3
2
.....................................................................................................
Jumpers ......................................................................................................................
Bill of Materials.............................................................................................................
Headers and Switches
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8
9
20
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Introduction
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1
Introduction
The TPS658643 is a single-chip, power management integrated circuit (IC) with multiple regulated power
supplies, system management, and display functions in a small package. The I2C interface enables
control of a wide range of subsystem parameters. Internal registers have a complete set of status
information, enabling easy diagnostics and host-controlled handling of fault conditions.
1.1
Features
•
•
•
•
•
•
1.2
Applications
•
•
•
•
•
1.3
Three programmable step-down converters
– Eleven programmable general-purpose LDOs
Three PWM outputs with programmable frequency and duty cycle
Dual RGB LED drivers
Eleven-channel ADC with three operating modes
Power-Good monitoring on all supply outputs
Interrupt controller with maskable interrupts
Tablet Portable Computers
Netbooks
Smart phones
Portable navigation devices
Portable media players
Requirements
In order to operate this EVM properly, the hardware must be connected and properly configured. All
components and connectors are installed on the EVM as shipped, except the dc power supplies.
2
Electrical Performance Specifications
Input voltage, VIN, 3 V to 5.5 V
Output current, step-down converters, 1.5 A (SMO, SM2) and 2 A (SM1)
Output voltage LDOs, seven with output voltages of 1.25 V to 3.3 V, two with output voltages of 0.725 V to
1.5 V, one always on with output voltage of 1.25 V to 3.3 V, one with output voltage of 1.7 V to 2.475 V.
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Schematic
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Schematic
Figure 1. HPA752A Schematic, Sheet 1
4
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Schematic
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Figure 2. HPA752A Schematic, Sheet 2
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Schematic
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Figure 3. HPA752A Schematic, Sheet 3
6
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Schematic
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Figure 4. HPA752A Schematic, Sheet 4
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Connector and Test Point Descriptions
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4
Connector and Test Point Descriptions
4.1
Headers and Switches
The following table contains header and switch descriptions.
Table 1. Headers and Switches
Header/Switch
8
Title
Description
J1
CHG_DET
Charger Detection Input, connected to CHG_DET (pin D11)
and NC (pins C12,13,D11-13)
J2
PWRGND
Power ground, connected to ground plane
J3
TJ1
Test jumper, connected to VIN pins E13 and F11- 13
J4
PWRGND
Power ground, connected to ground plane
J5
VIN
Power supply input; connect BAT or ac adapter here to J5;
connected to pins A11 - A13, B11 - B13, and C11
J6
PWRGND
Power ground, connected to ground plane
J7
TJ2
Test jumper, connected to VIN pins G10-13
J8
PWRGND
Power ground, connected to ground plane
J9
ADC_IN
Pins COMP (pin N1, input comparator for autoboot feature) and
ALNG1 - ALNG3 (pins L3, M1, M2) - inputs to analog-to-digital
converter. 20-kΩ pulldown to AGND
J10
GPIO
Connected to pins GPIO1 - GPIO4 (M3, M4, N3, N4) with 1-MΩ
pulldown to AGND
J11
USB-I2C ADAPTER
Connection for USB-TO-GPIO TI tool which connects HPA752
board to PC for GUI. Connected to pins GPIO1 - GPIO4 with 1MΩ pulldown to AGND, SAA_3V, SAA_GND, enable for I2C
port expander U2, SCLK ,and SDAT
J12
ADAPTER 3V
Header to sense/supply voltage to I2C bus
J13
SUPERCAP/COINCELL
Header to connect external real-time clock (RTC) supply
J14
32KHZOUT
Header to probe pin OUT32K (C7, pin 1 of J14 is OUT32k and
pin 2 of J14 is analog ground)
J15
AGND
Header with four connections to analog ground to facilitate
oscilloscope ground probe connection
J16
PWM
Header to pin K9; this pin is a no-connect inside the IC (NC6)
J17
DIG_PWM
Header to PWM, digital push-pull output; pin DIG_PWM (N11)
on the IC
J18
DIG_PWM2
Header to PWM, digital push-pull output; pin DIG_PWM2 (F4)
on the IC
J19
SM2
Output of dc/dc converter SM2
J20
PGND2
Power ground 2 for dc/dc converter SM2
J21
SM1
Output of dc/dc converter SM1
J22
PGND1
Power ground 1 for dc/dc converter SM1
J23
SM0
Output of dc/dc converter SM0
J24
PGND0
Power ground 1 for dc/dc converter SM0
J25
DGND2DT_EXTPWR
For IT internal use only
J26
SPARE_OUT
No internal connection
J27
NINT
Header for nINT pin; interruption pin nINT is LO when interrupt
is requested by TPS65864x. Open-drain output
J28
NNORTC
Header for nNORTC pin (D4); output status pin of RTC_OUT
LDO
J29
TNOPWR
Header to monitor NOPOWER pulse width set pin TNOPWR
(A3)
J30
NHOT_RST
Header for nHOT_RST pin (A2); reboot cycle request;
hardware reboot cycle control, pulled up to JP26 (SM2 or 2V2)
through 100 kΩ
J31
NNOPWR
Header for pin nNOPOWER (M11)
J32
RESUME
Header for pin RESUME (B2), connected to switch S3, and
pulled down to DGND through 1 MΩ
J33
SCLK/SDAT
Header for pins SCLK (H4) pin 1 of header and SDAT (J2) pin
2 of header, for monitoring I2C bus
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Table 1. Headers and Switches (continued)
Header/Switch
4.2
Title
Description
J34
SEQCTRL
Connected to SEQ_CTL pin (B3), pulled down to DGND
through 1MΩ - Discrete input control
J35
LDO4PG
Header for LDO4 Power Good output, pulled down to DGND
through 1MΩ
J36
EVM_3V
Header to connect external supply for LED bias and I2C port
expander U2
J37
SYNCEN
Header for SYNC enable pulled down to DGND through 1MΩ Discrete input control
J38
SM1PG
Header for dc/dc converter SM1 Power Good output
J39
PWRGND
Header for ground connection of external supply for LED bias
and I2C port expander U2
J40
SM1EN
Header for enabling dc/dc converter SM1 pulled down to
DGND through 1MΩ - Discrete input control
J41
SM0PG
Header for dc/dc converter SM0 Power Good output, pulled
down to DGND through 1M-Ohm
J42
SM0EN
Header for enabling dc/dc converter SM0 pulled down to
DGND through 1 MΩ - Discrete input control
J43
AGND
Header with four connections to analog ground
J44
DGND
Header with four connections to digital ground
S1
NOPWRCTL
Assertion of NOPWRCTL assets nNOPOWER output of PMU,
typically used as processor reset without rebooting PMU
S2
NHOT_RST
Used for rebooting PMU
S3
RESUME
Hold to wake up PMU or send PMU to sleep state
Jumpers
The following table shows the installed jumpers.
Table 2. Jumpers
Jumper
Title
Shunt Location
Description
JP1
EXT_THERM
Installed
Jumper to connect thermistor (R2) to pin TS
(J13)
JP2
INT PULLUP
Between pin 1 and pin 2
Jumper to select pullup voltage for INT pin
(L10). Pin 1 and pin 2 shorted INT pulled up
to 2V2. If pin 2 and 3 are shorted /INT is
pulled up to LDO8
JP3
I2C_PU
Not Installed
Jumper to select pullup voltage for SCLK
(H4) and SDAT (J2). Position 1 and position
2 shorted for 2V2 pullup; position 2 and
position 3 shorted for pullup to RTC_OUT
(H1).
JP4
32KOUT-PWR
Installed
Jumper to connect V32K (D7) to RTC_OUT
(H10)
JP5
32K-CLOAD
Not Installed
Jumper to connect 50-pF capacitor to
OUT32K (C7)
JP6
RESUME
Not Installed
Jumper to connect RESUME (B2) to pin P2
of the I2C port expander (U2)
JP7
SEQCTRL
Between pin 1 and pin 2
Jumper to connect SEQCTRL (B3) to either
2V2 or pin P3 of the I2C port expander U2
JP8
SYNCEN
Between pin 1 and pin 2
Jumper to connect SYNCEN (E10) to either
2V2 or pin P4 of the I2C port expander U2
JP9
SM1EN
Between pin 1 and pin 2
Jumper to connect SM1EN (E11) to either
2V2 or pin P5 of the I2C port expander U2
JP10
SM0EN
Not Installed
Jumper to connect SM0EN (F10) to either
2V2 or pin P5 of the I2C port expander U2
JP11
VIN_LDO01
Between pin 2 and pin 3
Jumper to select VIN or SM2 as input to
LDO0 and LDO1
JP12
VIN_LDO23
Between pin 2 and pin 3
Jumper to select VIN or SM2 as input to
LDO2 and LDO3
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Setup
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Table 2. Jumpers (continued)
Jumper
5
Title
Shunt Location
Description
JP13
VIN_LDO4
Between pin 2 and pin 3
Jumper to select VIN or SM2 as input to
LDO4
JP14
VIN_LDO678
Between pin 2 and pin 3
Jumper to select VIN or SM2 as input to
LDO6 - LDO8
JP15
VIN_LDO9
Between pin 2 and pin 3
Jumper to select VIN or SM2 as input to
LDO9
JP16
VIN_SM2
Installed
Jumper to connect VIN to VIN_SM2
JP17
SM2_IL
Installed
Jumper to measure current through inductor
L1
JP18
LED_PWM_DRV
Between pin 2 and pin 3
Jumper to select SM2 or VIN as supply for
LEDs, D14 - D17
JP19
VIN_SM1
Installed
Jumper to connects VIN to VIN_SM1
JP20
SM1_IL
Installed
Jumper to measure current through inductor
L2
JP21
RGB_DRV
Between pin 2 and pin 3
Jumper to select SM2 or VIN as supply for
RGB LED, D18
JP22
VIN_SM0
Installed
Jumper to connects VIN to VIN_SM0
JP23
SM0_IL
Installed
Jumper to measure current through inductor
L3
JP24
RGB2_DRV
Between pin 2 and pin 3
Jumper to select SM2 or VIN as supply for
RGB LED, D19
JP25
DGND2DT
Between pin 2 and pin 3
For TI internal use only
JP26
JP26
Between pin 2 and pin 3
Jumper to select SM2 or 2V2 as pullup for
HOT_RST
JP27
STATUS_LED_PWR
Between pin 1 and pin 2
Jumper to select VIN or EVM_3V J36 as bias
for status LEDs, D1 - D13
Setup
The following steps are intended to help users power up and evaluate the EVM.
1. To use the TPS65864xEVM with a personal computer, the TPS865864xEVM software is required
along with the HPA172 USB-to-I2C Interface Board (USB-TO-GPIO) and a USB cable. Two power
supplies capable of supplying 6 V at 2 A are required.
2. To test the HPA752, the computer must have the TPS65864xEVM software program installed. Install
the program from the TPS65864xEVM software zip file. This software zip file is supplied by Texas
Instruments. If the program does not automatically install properly, follow the instructions in the
Readme file.
3. Connect the USB cable between the computer and the HPA172. Connect the Molex cable between the
HPA172 and the HPA752 EVM (J11).
4. Verify the shorting jumpers are installed as noted in the shorting jumper table. The EVM ships with the
default jumper settings.
5. Supply 1: Set the input supply voltage to 3.3 V before connecting to the EVM, and turn the supply off.
While in the off state, connect the power supply positive lead to J36 (EVM 3V). Connect the power
supply return lead to J39 (GND).
6. Input Supply 2: Set the input supply voltage to 5 V before connecting to the EVM, and turn the supply
off. While in the off state, connect the power supply positive lead to J5 (VIN). Connect the power
supply return lead to J6 (GND).
7. First, turn on Input Supply 1 (3.3 V). Next, turn on Input Supply 2 (5 V).
8. To wake the PMU, hold the pushbutton switch, S1, RESUME, for one seconds and release. While the
PMU is awake, holding switch S1 for one second puts the PMU back into the sleep state. Different
combinations of the LDOs and switching converters turn on by default as per table 3-3: TPS65864x
Integrated Power Supply Power-Up Defaults in the corresponding device data sheet. Note, final silicon
can be marked as TPS658643 or P658643.
9. Using the GUI, select the LDOs tab on the left side. Press Read to load the contents of the I2C
10
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registers into the GUI. Next, check all the unchecked boxes. This enables all the LDOs.
10. Using the GUI, select the SMs tab on the left side. Press Read to load the contents of the I2C
registers into the GUI. Next, check all the unchecked boxes. This enables all the SM converters.
6
TPS658643EVM Test Data
This section presents typical performance data for the TPS658643EVM. Actual performance data can be
affected by measurement techniques and environmental variables; therefore, these results are presented
for reference and may differ from actual results obtained by some users.
6.1
Operation Waveforms
Figure 5. SM0, Ch. 1 - VIN 1 V/div; Ch. 2 - SW 1 V/div; Ch. 3 - Vout 10 mV/div
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TPS658643EVM Test Data
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Figure 6. SM1, Ch. 1 - VIN 1 V/div; Ch. 2 - SW 1 V/div; Ch. 3 - Vout 10 mV/div
Figure 7. SM2, Ch. 1 - VIN 1 V/div; Ch. 2 - SW 1 V/div; Ch. 3 - Vout 10 mV/div
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Figure 8. SM0, SM1, SM2, and LDO1 Start-Up
Figure 9. LDO1, LDO2, LDO3, and LDO4 Start-Up
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TPS658643EVM Test Data
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Figure 10. LDO4, LDO5, and LDO9 Start-Up
14
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Figure 11. 32-kHz Clock
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EVM Assembly Drawings and Layout
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EVM Assembly Drawings and Layout
TEXAS
INSTRUMENTS
Figure 12. Top Assembly – Silkscreen
Figure 13. Top Layer
16
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Figure 14. Layer 2
Figure 15. Layer 3
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EVM Assembly Drawings and Layout
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Figure 16. Layer 4
Figure 17. Layer 5
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Figure 18. Layer 6
Figure 19. Bottom Layer
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Bill of Materials
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Bill of Materials
Table 3. Bill of Materials
Count
20
Description
Size
Part Number
MFR
21
RefDes
C1, C2, C4,
10uF
C5, C8, C9,
C10, C11, C12,
C34, C35, C36,
C37, C39, C40,
C41, C42, C43,
C44, C45, C46
Value
Capacitor, Ceramic, 10V, X5R, 10%
0805
GRM21BR61A106KE19L
muRata
1
C13
2200pF
Capacitor, Ceramic, 50V, C0G, 5%
0603
C1608C0G1H222J
TDK
1
C14
6.8uF
Capacitor, Ceramic, 10V, X5R, 10%
0805
C0805C685K8PACTU
Kemet
3
C15, C16, C38
Open
Capacitor, Ceramic
0603
Std
Std
1
C18
50pF
Capacitor, Ceramic, 50V, C0G, 5%
0603
06035A500JAT2A
AVX
1
C3
4.7uF
Capacitor, Ceramic, 10V, X5R, 10%
0805
GRM219R61A475KE19D
muRata
17
C6, C17, C19,
2.2uF
C20, C21, C22,
C23, C24, C25,
C26, C27, C28,
C29, C30, C31,
C32, C33
Capacitor, Ceramic, 10V, X5R, 10%
0603
GRM188R61A225KE34D
muRata
1
C7
Capacitor, Ceramic, 50V, X7R, 10%
0603
C1608X7R1H104K
TDK
13
D1, D2, D3,
LTST-C190GKT
D4, D5, D6,
D7, D8, D9,
D10, D11, D12,
D13
0.1uF
Diode, LED, Green, 2.1V, 10mA, 6mcd
0603
LTST-C190GKT
Lite On
4
D14, D15, D16, LTW-C193TS5
D17
Diode, LED, White, 2.95V, 5mA
0603
LTW-C193TS5
Lite On
2
D18, D19
LATBT66B
Diode, LED, 20mA, Common Anode
0.118 x 0.134
LATBT66B-ST-1+TU735+QS-36-ZB-Z
ALTERNATE: LATBT66B-ST1+TU-35+QR-35-20-R18-ZB
Osram
38
J1, J2, J3, J4,
J5, J6, J7, J8,
J12, J13, J14,
J16, J17, J18,
J19, J20, J21,
J22, J23, J24,
J25, J26, J27,
J28, J29, J30,
J31, J32, J33,
J34, J35, J36,
J37, J38, J39,
J40, J41, J42
PEC02SAAN
Header, 2 pin, 100mil spacing,
0.100 x 2
PEC02SAAN
Sullins
5
J9, J10, J15,
J43, J44
PEC04SAAN
Header, 4 pin, 100mil spacing,
0.100 x 4
PEC04SAAN
Sullins
1
J11
N2510-6002-RB
Connector, Male Straight 2x5 pin, 100mil
spacing, 4 Wall
0.338 x 0.788
N2510-6002-RB
3M
10
JP1, JP4, JP5,
JP6, JP16,
JP17, JP19,
JP20, JP22,
JP23
PEC02SAAN
Header, 2 pin, 100mil spacing,
0.100 x 2
PEC02SAAN
Sullins
17
JP2, JP3, JP7,
JP8, JP9,
JP10, JP11,
JP12, JP13,
JP14, JP15,
JP18, JP21,
JP24, JP25,
JP26, JP27
PEC03SAAN
Header, 3 pin, 100mil spacing,
0.100 x 3
PEC03SAAN
Sullins
1
L1
1.5uH
Inductor, SMT, 3.1A, 78milliohm
0.169 x 0.169 inch
LPS4414-152ML
Coilcraft
2
L2, L3
1.5uH
Inductor, SMT, 2.7A, 70milliohm
0.153 x 0.153 inch
LPS4012-152ML
Coilcraft
6
R1, R19, R20,
R21, R23, R24
10k
Resistor, Chip, 1/16W, 1%
0603
Std
Std
2
R13, R17
0
Resistor, Chip, 1/16W, 1%
0603
Std
Std
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Table 3. Bill of Materials (continued)
Count
RefDes
Value
Description
Size
Part Number
MFR
1
R18
332
Resistor, Chip, 1/16W, 1%
0603
Std
Std
1
R2
200K
Potentiometer, 1/4 Cermet, 12-Turn, Top- 0.25x0.17
Adjust
3266W-1-204LF
Bourns
Open
1
R22
Resistor, Chip, 1/16W
0603
Std
Std
26
R25, R26, R27, 1.0k
R28, R29, R40,
R41, R42, R43,
R44, R45, R46,
R47, R48, R57,
R58, R59, R60,
R61, R62, R63,
R64, R73, R74,
R75, R76
Resistor, Chip, 1/16W, 1%
0603
Std
Std
4
R3, R89, R90,
R91
100k
Resistor, Chip, 1/16W, 1%
0603
Std
Std
8
R4, R5, R6,
R7, R12, R14,
R15, R16
20k
Resistor, Chip, 1/16W, 1%
0603
Std
Std
1
R77
Open
Resistor, Chip, 1/16W, 1%
0603
Std
Std
4
R78, R79, R80, 100
R81
Resistor, Chip, 1/10W, 1%
0805
Std
Std
39
R8, R9, R10,
1.0M
R11, R30, R31,
R32, R33, R34,
R35, R36, R37,
R38, R39, R49,
R50, R51, R52,
R53, R54, R55,
R56, R65, R66,
R67, R68, R69,
R70, R71, R72,
R88, R92, R93,
R94, R95, R96,
R97, R98, R99
Resistor, Chip, 1/16W, 1%
0603
Std
Std
6
R82, R83, R84, 10
R85, R86, R87
Resistor, Chip, 1/16W, 1%
0603
Std
Std
3
S1, S2, S3
Switch, 1P1T, PB Momentary, 100mA,
SM
0.19 x 0.18 inch
7914G-1-000E
Bourns
38
TP1, TP2, TP3, 5000
TP4, TP5, TP6,
TP7, TP8, TP9,
TP10, TP11,
TP12, TP13,
TP14, TP15,
TP16, TP17,
TP18, TP19,
TP20, TP26,
TP27, TP28,
TP29, TP30,
TP31, TP32,
TP33, TP38,
TP39, TP44,
TP46, TP48,
TP51, TP54,
TP56, TP58,
TP61
Test Point, Red, Thru Hole Color Keyed
0.100 x 0.100 inch
5000
Keystone
20
TP21,
TP23,
TP25,
TP35,
TP37,
TP42,
TP47,
TP52,
TP55,
TP59,
TP22,
TP24,
TP34,
TP36,
TP40,
TP45,
TP49,
TP53,
TP57,
TP60
5001
Test Point, Black, Thru Hole Color Keyed
0.100 x 0.100 inch
5001
Keystone
3
TP41, TP43,
TP50
5002
Test Point, White, Thru Hole Color Keyed 0.100 x 0.100 inch
5002
Keystone
1
U1
TPS658643ZGU
IC, Advanced Power Management Unit
TPS658643ZGU
TI
7914G-1-000E
SLVU582A – December 2011 – Revised May 2012
Submit Documentation Feedback
BGA
TPS658643 System Evaluation Board
Copyright © 2011–2012, Texas Instruments Incorporated
21
Bill of Materials
www.ti.com
Table 3. Bill of Materials (continued)
Count
22
RefDes
Value
Description
Size
Part Number
MFR
1
U2
PCF8574ADW
IC, Remote 8-Bit I/O Expander For I2C
Bus
SO-16
PCF8574ADW
TI
13
U3, U4, U5,
TLV3011AIDCK
U6, U7, U8,
U9, U10, U11,
U12, U13, U14,
U15
IC, Nanopower, 1.8V, Open-Drain
Comparator With Reference
SC70-6
TLV3011AIDCK
TI
1
Y1
Crystal, 32.768MHz, 12.5pF Capacitance
1.5mm x 3.2mm
CM315-32.768KDZF-UT
Citizen
1
--
PCB, 5.8 In x 5 In x 0.062 In
HPA752
Any
27
--
Shunt, 100-mil, Black
929950-00
3M
32.768KHz
TPS658643 System Evaluation Board
0.100
SLVU582A – December 2011 – Revised May 2012
Submit Documentation Feedback
Copyright © 2011–2012, Texas Instruments Incorporated
EVALUATION BOARD/KIT/MODULE (EVM) ADDITIONAL TERMS
Texas Instruments (TI) provides the enclosed Evaluation Board/Kit/Module (EVM) under the following conditions:
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SPACER
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SPACER
【Important Notice for Users of this Product in Japan】
】
This development kit is NOT certified as Confirming to Technical Regulations of Radio Law of Japan
If you use this product in Japan, you are required by Radio Law of Japan to follow the instructions below with respect to this product:
1.
2.
3.
Use this product in a shielded room or any other test facility as defined in the notification #173 issued by Ministry of Internal Affairs and
Communications on March 28, 2006, based on Sub-section 1.1 of Article 6 of the Ministry’s Rule for Enforcement of Radio Law of
Japan,
Use this product only after you obtained the license of Test Radio Station as provided in Radio Law of Japan with respect to this
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【ご使用にあたっての注】
本開発キットは技術基準適合証明を受けておりません。
本製品のご使用に際しては、電波法遵守のため、以下のいずれかの措置を取っていただく必要がありますのでご注意ください。
1.
2.
3.
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1.
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