Using the TPS65910 EVM, A Multichannel
Power-management IC, 3 Buck, 1 Boost, and 8
LDOs
User's Guide
Literature Number: SWCU065F
March 2010 – Revised April 2013
User's Guide
SWCU065F – March 2010 – Revised April 2013
Introduction
1
Description
Device Description:
The TPS65910 device is an integrated power-management IC available in 48-QFN package and is
dedicated to applications powered by one Li-Ion or Li-Ion polymer battery cell, 3-series Ni-MH cells, or a 5
V input, and which requires multiple power rails. The device provides three step-down converters, one
step-up converter, and eight low dropout voltage regulators (LDOs) and is designed to support the specific
power requirements of OMAP™ processors.
Two of the step-down converters provide power for dual processor cores and are controllable by a
dedicated class-3 SmartReflex™ interface for optimum power savings. The third converter provides power
for the I/Os and memory in the system. The device includes eight general-purpose LDOs providing a wide
range of voltages and current capabilities. These LDOs can be controlled by the inter-integrated circuit
(I2C™) interface.
In addition to the power resources, the device contains an embedded power controller (EPC) to manage
the power sequencing requirements of OMAP processor and a real-time clock (RTC).
EVM Kit Description:
The TPS65910 evaluation module (EVM) is a stand-alone module that demonstrates the functions of the
integrated power management IC. It uses a USB-to-GPIO interface card (not included in the kit) to control
the standard I2C interfaces in the TPS65910 device. It includes Windows™-compatible software to
interface with the device. The sofware is a simple graphical user interface (GUI) that simplifies registers
access for the IC (software CD is not included in the kit, must be downloaded from product folder on
ti.com).
EPROM Power-Up Sequence Description:
This user guide is common for all TPS65910x parts. The only difference in these parts is the EEPROM
sequence for power-up. Each part has a unique EEPROM sequence to satisfy the attached application
processor. For details of the EEPROM sequence please refer to the corresponding user guide in the
“Application Notes” section on the TPS65910x folder page.
1.1
Applications
•
•
2
Embedded application processor power
Handheld/portable systems
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TPS65910 EVM Power Capabilities
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1.2
Features
•
•
•
•
•
•
•
•
•
•
•
•
•
•
2
An EPC
Two efficient step-down DCDC converters for processor cores
One efficient step-down DCDC converter for I/O power
One efficient step-up 5-V DCDC converter
SmartReflex-compliant dynamic voltage management for processor cores
Eight LDO voltage regulators and one RTC LDO (internal purpose)
One high-speed I2C interface for general-purpose control command
One high-speed I2C interface for SmartReflex (SR) class-3 control command
Two enable signals multiplexed with SR-I2C, configurable to control any supply state and processor
cores supply voltage
Thermal shutdown protection and hot-die detection
An RTC resource with:
– Oscillator for 32.768-kHz crystal or 32-kHz built-in RC oscillator
– Complete calendar capability
– Alarm capability
One configurable general-purpose input/output (GPIO)
DCDCs switching synchronization through internal or external 3-MHz clock
Backup battery charger
TPS65910 EVM Power Capabilities
Table 1. TPS65910 EVM Resources Summary
POWER RESOURCE
TYPE
VOLTAGE RANGE (V)
Imax (mA)
VIO
SMPS (buck)
1.5, 1.8, 2.5, 3.3
1000
VDD1
SMPS (buck)
0.6, 1.1, 1.5, 2.2, 3.2
1500
VDD2
SMPS (buck)
0.6, 1.1, 1.5, 2.2, 3.2
1500
VDD3
SMPS (boost)
5
100
VDIG1
LDO
1.2, 1.5, 1.8, 2.7
300
VDIG2
LDO
1.0, 1.1, 1.2, 1.8
300
VAUX33
LDO
1.8, 2.0, 2.8, 3.3
150
VMMC
LDO
1.8, 2.8, 3.0, 3.3
300
VAUX1
LDO
1.8, 2.5, 2.8, 2.85
300
VAUX2
LDO
1.8, 2.8, 2.9, 3.3
150
VDAC
LDO
1.8, 2.6, 2.8, 2.85
150
VPLL
LDO
1.0, 1.1, 1.8, 2.5
50
For detailed electrical characteristics of SMPS and LDO supplies, refer to the product data sheet.
3
Schematic
Figure 1 shows the TPS65910 EVM schematic.
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3
Schematic
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+
Figure 1. TPS65910 EVM Schematic
SWCU065-001
4
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Connector and Test Point Descriptions
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4
Connector and Test Point Descriptions
4.1
Connector Descriptions
4.1.1
Boot Pins
J16 and J17 are used to select the boot pin configuration for proper booting of the device. Table 2 shows
the possible boot options.
Table 2. Boot Configuration
4.1.2
BOOT 0
BOOT 1
POWER UP OPTION
0
0
AM35xx
0
1
EEPROM boot mode
1
0
OMAP3x
1
1
Test mode only
Backup Battery
J6 is used for the backup battery connection. The user can connect a backup battery between J6-2 and
J6-3 or alternatively can use the onboard 0.2 F, 3.3 V capacitor by shorting J6-1 and J6-2.
4.1.3
VBAT
VBAT (J4) is the main input source to the device. Table 3 lists the minimum and maximum levels that can
be applied to these pins. Use J5 for ground.
Table 3. VBAT Minimum and Maximum Levels
VBAT
MIN (V)
TYP (V)
MAX (V)
2.7
3.6
5.5
Ensure that the jumper settings for the jumpers listed in Table 4 are correct so the device is supplied by
VBAT.
Table 4. VBAT Input Jumper Settings
4.1.4
JUMPER CONNECTION
DEVICE INPUT PIN
J7 (1-2)
VCC5
Selects VBAT as power source
USE
J8 (1-2)
VCC3
Selects VBAT as power source
J9 (1-2)
VCC2, VCC4
Selects VBAT as power source
J10 (2-3)
VCC6
Selects VBAT as power source
Default Jumper Settings for the Boost Converter
Table 5. Boost Converter Jumper Settings
JUMPER ID
LABEL
USE
J21
SW3
Short jumper to use boost converter
J22
VFB3
Short jumper to use boost converter
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Connector and Test Point Descriptions
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For correct functioning of VDD3, first VAUX33 must be enabled at 3.3V and then VDD3 should be enabled
using the appropriate register settings.
4.1.5
I2C connector
TPS65910 has two slave I2C interfaces: one is a general-purpose interface to control the internal
configuration registers, the second is dedicated to SmartReflex applications such as dynamic voltage
frequency scaling (DVFS) or adaptive voltage scaling (AVS).
These interfaces support the standard slave mode (100 kbps), fast mode (400 kbps), and high-speed
mode (3.4 Mbps).
Table 6. I2C Connector
CONNECTOR NUMBER
PIN
DESCRIPTION
J1
9, 10
General purpose I2C interface for register
configuration
J2
9,10
Dedicated I2C interface for SmartReflex
J1 and J2 also have GPIO, SLEEP, and PWRHOLD signals that can be controlled from the GUI and USBto-GPIO interface.
The SmartReflex can be programmed as enable signals of one or several supplies when the device is on.
A resource assigned to either SmartReflex signal (SDASR_EN2 or SCLSR_EN1) automatically disables
the serial control interface.
Connectors J1 and J2 are used for the USB adapter. Table 7 lists the signal mapping to control the
signals on the EVM. The GPIO field on the GUI can be toggled to drive the following signals on the EVM.
Table 7. GPIO Mapping For GUI
4.1.6
PIN NUMBER FOR J1 and J2
GPIO ON GUI
Pin 1
GPIO7
SLEEP
TPS65910x SINGAL
Pin 2
GPIO6
GPIO
Pin 3
GPIO5
PWRHOLD
3.3-V I/O for VDDIO
The USB-to-GPIO interface is on connectors J1 and J2. The USB-to-GPIO module generates 3.3 V, which
is used as the I/O for the EVM. The following jumper configuration must be done for the I/O supply.
Table 8. Jumper for I/O Input Setting
JUMPER CONNECTION
DEVICE INPUT PIN
USE
VDDIO
Connects J1-5 (or J2-5) to VDDIO for 3.3V I/O input
J11 (1-2)
4.1.7
Control Jumper Settings
TPS65910 has some control signals that can be configured using the on-board jumpers or by using the
USB-to-GPIO connector.
Table 9. Control Signals
6
Jumper connection
Signal Name
Use
J18
GPIO
Jumper the three pin connector as
required
J19
SLEEP
Jumper the three pin connector as
required
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Table 9. Control Signals (continued)
J20
PWRHOLD
If PWRHOLD is low then the device will
not power-up. So, connect this to HI side
of the jumper. See important description
below.
J13
SDASR_EN2
J14
SCLSR_EN1
Both these signals can be used to control
the LDO and SMPS power supplies.
Please refer details on programming the
internal register to achieve this function.
If USB-to-GPIO connector is connected on J1 or J2 then the above signals can be controlled using the
GPIO writes from the GUI. In this case the above jumpers should not be connected. Jumpers should be
left open. In case of SLEEP and GPIO signals there will be contention for VDDIO supply. In case of
PWRHOLD, the device will be damaged. This is because the PWRHOLD signal from USB-to-GPIO is at
3.3V. The HI side of J20 jumper is connected to VRRTC. If VRRTC is shorted to 3.3V then this will
damage the device. When the adapter is connected all IOs should be at 3.3V, so ensure J11 is connected
between VDDIO and 3.3V.
4.2
Test Point Descriptions
Table 10. Test Point Descriptions
Power Domain/Control
TP
Label
Use
VIO
J39
VIO_OUT
Monitor VIO output voltage
VDD1
J35
VDD1
Monitor VDD1 output voltage
VDD2
J37
VDD2
Monitor VDD2 output voltage
VDD3
J33
VDD3
Monitor VDD3 output voltage
VPLL
J25
VPLL
Monitor VPLL output voltage
VDAC
J24
VDAC
Monitor VDAC output voltage
VAUX1
J26
VAUX1
Monitor VAUX1 output voltage
VAUX2
J27
VAUX2
Monitor VAUX2 output voltage
VMMC
J28
VMMC
Monitor VMMC output voltage
VAUX33
J29
VAUX33
Monitor VAUX33 output voltage
VDIG1
J30
VDIG1
Monitor VDIG1 output voltage
VDIG2
J31
VDIG2
Monitor VDIG2 output voltage
VREF
J15
VREF
Monitor VREF output voltage
VRRTC
J23
VRRTC
Monitor VRRTC output voltage
PWRHOLD
J20-2
PWRHOLD
Monitor PWRHOLD level
PWON
S1
POWER ON
Power-on switch
SLEEP
J19-2
SLEEP
Control device status
GPIO/CKSYN
J18-2
GPIO/CKSYNC
GPIO test point
NRESPWRON
TP5
NRESPWON
Reset to processor
INT1
TP4
INT1
Interrupt to processor
CLK32KOUT
TP6
CLK32KOUT
32KHz to processor
Use J32 for all GND connections for measuring the LDO power supplies. J34, J36, J38, and J40 can be
used for ground connections for measuring DCDC power supplies.
5
Test Set Up
5.1
Equipment
Recommended test equipments:
• Variable 6-V power supply capable of supplying 6 A current
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Test Set Up
•
•
•
•
8
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Voltmeter
Oscilloscope
Windows PC with a universal serial bus (USB) port
USB-to-GPIO converter
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GUI Information
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6
GUI Information
The GUI accompanying this device is fairly simple. It runs on a Windows PC. Ensure that your machine
supports Microsoft .NET Framework 3.5.
6.1
Installation Instructions:
To install the GUI follow these steps:
1. Download from site/Insert CD (based on how we package the GUI).
2. Create a new folder or unzip into any appropriate windows folder. If it is an exe, then select the
location. The default is C:/xyz/.
6.2
Know the Files
GUI software consists of the following files:
• DLL
• EXE
• XML
The GUI can be opened by clicking the MS Installer, TPS65910.msi file. The .xml file is the main file that
contains all the device registers. The registers in this file are categorized in blocks according to the
functions. The .xml file also specifies the slave I2C address for the device.
6.3
GUI Description
GUI windows are divided into the following sections:
6.3.1
Register Properties
The following blocks are on the GUI on the left-side pane under Register Properties:
• Time and Calendar Registers
• RTC Registers
• Back-up Registers
• DCDC Control Registers
• LDO Control Registers
• Device Control Registers
• Interrupts and GPIO Registers
Figure 2 shows a sample snapshot of the GUI.
Each block can be selected independently so that it appears on the main GUI window. Each register
instance appears in a separate block. See Figure 3.
The user can write to the registers through the I2C bus. Each bit in the 8-bit register can be written
independently or the complete register can be written using an 8-bit hexadecimal value in the Value field.
Individual bits can be toggled either by selecting the drop-down menu or by double-clicking the field.
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GUI Information
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Figure 2. GUI Snapshot – Register Properties
10
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Figure 3. Single Register Instance
6.3.2
Register Map
Figure 4 shows the register map view. The Register Map tab provides an alternative way to access the
device registers. Also in this view, the bits and complete words can be read or written through the I2C bus.
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GUI Information
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Figure 4. Register Map View
6.3.3
Modes
This section is used for executing multiple register writes in a single step. For example, to configure the
device in SLEEP state, multiple bits must be configured for SMPS and LDO supplies. An example is
provided in the .xml file that comes with the GUI package.
Users can create their own sequences in the .xml file.
6.3.4
I/O writes
Three control signals for the TPS65910 (SLEEP, PWRHOLD and GPIO) can be altered using the GUI. To
select these signals, the user can use the I/O Flag tab on the menu bar. For mapping of the I/O lines, refer
to the TPS65910 schematic and datasheet for the GPIO-to-USB adapter at
http://focus.ti.com/docs/toolsw/folders/print/usb-to-gpio.html.
12
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EVM Assembly Drawings and Layout
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7
EVM Assembly Drawings and Layout
The following figures show the design of the TPS65910 EVM printed circuit board. The EVM has been
designed using a 4-layer, 2-ounce, 4-inch × 4-inch copper-clad circuit board with all components on the
top side and all active traces to the top to let the user easily view, probe, and evaluate the TPS65910 IC.
4.000 IN
[101.600 mm]
J5
J3
J4
J26
J28
J27
J9
J29
TP6
J31
J30
C22
C20
C5
R5
C15
C16
R4
C10
L2
J37
J38
D1
C27
J35
J36
J33
J34
J7
R13
TP1 TP2 TP3
R11
J11
J10
TP7
C16
C14
C15
L4
R3
C3
Y1
C2
J22
C11
L1
C4 C5
C1
J21
C12
R2
R8
R9
C23
R10
R1
R7
R12
U1
C13
R6
J42
J41
J12
L3
C25
C21
1
C26
4.000 IN
[101.600 mm]
J6
C7
C17
J32
C8
R14
TP5
C9
J8
S1
C24
TP4
J25
J24
J17
J16
J13
J14
J18
J19
J20
J23
J39
J40
J1
J2
SWCU065-005
Figure 5. TPS65910 EVM Component Placement With Silkscreen Labels
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EVM Assembly Drawings and Layout
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SWCU065-006
Figure 6. TPS65910 EVM Top Layer (L1)
14
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SWCU065-007
Figure 7. TPS65910 EVM Internal Layer (L2)
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EVM Assembly Drawings and Layout
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SWCU065-008
Figure 8. TPS65910 EVM Internal Layer (L3)
16
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SWCU065-009
Figure 9. TPS65910 EVM Bottom Copper (L4)
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List of Materials
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List of Materials
Table 11 lists the EVM components as configured according to the schematic shown in Figure 1.
Table 11. TPS65910 EVM Bill of Materials
COUNT
VALUE
DESCRIPTION
SIZE
PART NUMBER
MFR
AK
EECEN0F204AK
Panasonic
1
C1
0.2 F
Capacitor,
Electric Double
Layer
1
C11
0.10 µF
Capacitor,
Ceramic, 10 V,
X5R, 10%
0402
STD
{MFR}
9
C14, C15, C16,
C17, C18, C19,
C20, C21, C22
2.2 µF
Capacitor,
Ceramic, 6.3 V,
X5R, 20%
0402
JMK105BJ225M
V-F
Taiyo Yuden
5
C2, C3, C6, C10,
C12
4.7 µF
Capacitor,
Ceramic, 6.3 V,
X5R, 20%
0603
JMK107BJ475K
A-T
Taiyo Yuden
2
C4, C5
12 pF
Capacitor,
Ceramic, vvV,
[temp], [tol]
0402
{Part Number}
{MFR}
9
C7, C8, C9, C13,
C23, C24, C25,
C26, C27
10 µF
Capacitor,
Ceramic, 6.3 V,
X5R, 20%
0603
C0603C106M9P
AC
Kemet
1
D1
MSS1P2L
Diode, Schottky,
20 V, 1 A
MicroSMP
MSS1P2L
Vishay
0.100 inch x 2X5
2510-5002UB
3M
2
J1, J2
2510-5002UB
Connector, Male
Right Angle
2x5 pin, 100 mil
spacing, 4 Wall
26
J3, J4, J5, J12,
J21, J22, J23,
J24, J25, J26,
J27, J28, J29,
J30, J31, J32,
J33, J34, J35,
J36, J37, J38,
J39, J40, J41,
J42
PEC02SAAN
Header, Male 2pin, 100 mil
spacing
0.100 inch x 2
PEC02SAAN
Sullins
13
J6, J7, J8, J9,
J10, J11, J13,
J14, J16, J17,
J18, J19, J20
PEC03SAAN
Header, Male 3pin, 100 mil
spacing
0.100 inch x 3
PEC03SAAN
Sullins
3
L1, L2, L3
2.2 µH
Inductor, SMT,
2.6 A, 58 mΩ
0.157 x 0.157
inch
VLCF5020T2R2N2R6-3
TDK
MIPF2520D4R7
S
FDK
1
18
REFDES
Introduction
L4
4.7 µH
Inductor, SMT
Multi-layer, 1 A,
110 mΩ
2520 mm
Alternate part:
LQM2HPN4R7M
G0L
Murata
4
R1, R7, R10,
R12
1.5 kΩ
Resistor, Chip,
1/16 W, 5%
0603
STD
STD
2
R11, R13
10 kΩ
Resistor, Chip,
1/16 W, 5%
0603
STD
STD
R14
10 kΩ
Resistor, Chip,
1/16 W, 5%
0603
STD
STD
7
R2, R3, R4, R5,
R6, R8, R9
0
Resistor, Chip,
1/16 W, 5%
0603
STD
STD
1
S1
EVQ-PLHA15
Switch, 1P1T, 50
mA, 12 V, 160 g
0.200 x 0.200
inch
EVQ-PLHA15
Panasonic
1
SH1
Short jumper
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List of Materials
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Table 11. TPS65910 EVM Bill of Materials (continued)
COUNT
REFDES
VALUE
DESCRIPTION
7
TP1, TP2, TP3,
TP4, TP5, TP6,
TP7
PEC01SAAN
Through Hole,
0.040 Diameter
1
U1
TPS65910RSL
IC, Integrated
Power
Management
1
Y1
32.768 kHz
Crystal
SIZE
PART NUMBER
MFR
PEC01SAAN
Sullins
QFN
TPS65910RSL
TI
1.50 x 3.20 mm
FC-135
Epson Toyocom
NOTE: These assemblies are ESD sensitive, ESD precautions must be observed.
These assemblies must be clean and free from flux and all contaminants. Use of
contaminated flux is not acceptable.
These assemblies must comply with workmanship standards IPC-A-610 Class 2.
Reference designators marked with an asterisk (**) cannot be substituted. All other
components can be substituted with equivalent manufacturer's components.
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TI has specifically designated certain components as meeting ISO/TS16949 requirements, mainly for automotive use. In any case of use of
non-designated products, TI will not be responsible for any failure to meet ISO/TS16949.
Products
Applications
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www.ti.com/audio
Automotive and Transportation
www.ti.com/automotive
Amplifiers
amplifier.ti.com
Communications and Telecom
www.ti.com/communications
Data Converters
dataconverter.ti.com
Computers and Peripherals
www.ti.com/computers
DLP® Products
www.dlp.com
Consumer Electronics
www.ti.com/consumer-apps
DSP
dsp.ti.com
Energy and Lighting
www.ti.com/energy
Clocks and Timers
www.ti.com/clocks
Industrial
www.ti.com/industrial
Interface
interface.ti.com
Medical
www.ti.com/medical
Logic
logic.ti.com
Security
www.ti.com/security
Power Mgmt
power.ti.com
Space, Avionics and Defense
www.ti.com/space-avionics-defense
Microcontrollers
microcontroller.ti.com
Video and Imaging
www.ti.com/video
RFID
www.ti-rfid.com
OMAP Applications Processors
www.ti.com/omap
TI E2E Community
e2e.ti.com
Wireless Connectivity
www.ti.com/wirelessconnectivity
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