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TPS65930, TPS65920
SWCS037I – MAY 2008 – REVISED JANUARY 2015
TPS65920 and TPS65930 Integrated Power Management/Audio Codec (TPS65930 Only) –
Silicon Revision 1.2
1 Device Overview
1.1
Features
1
• Power:
– Three Efficient Step-down Converters
– Four External Linear LDOs for Clocks and
Peripherals
– SmartReflex™ Dynamic Voltage Management
• Audio (TPS65930 Device Only):
– Differential Input Main Microphones
– Mono Auxiliary/FM Input
– External Predrivers for Class D (Stereo)
– TDM Interface
– Automatic Level Control (ALC)
– Digital and Analog Mixing
– 16-Bit Linear Audio Stereo DAC (96, 48, 44.1,
and 32 kHz and Derivatives)
– 16-Bit Linear Audio Stereo ADC (48, 44.1, and
32 kHz and Derivatives)
– Carkit
• USB:
– USB 2.0 On-the-Go (OTG)-Compliant HS
Transceivers
– 12-Bit Universal Transceiver Macro Interface
ULPI
1.2
•
•
Applications
Smart Phones
Tablets
1.3
– USB Power Supply (5-V Charge Pump for
VBUS)
– Consumer Electronics Association (CEA)-2011:
OTG Transceiver Interface Specification
– CEA-936A: Mini-USB Analog Carkit
Specification
• Additional Features:
– LED Driver Circuit for Two External LEDs
– Two External 10-Bit MADC Inputs
– Real-Time Clock (RTC) and Retention Modules
– HS I2C Serial Control
– Thermal Shutdown and Hot-Die Detection
– Keypad Interface (up to 6 × 6)
– External Vibrator Control
– 15 GPIOs
– 0.65-mm Pitch, 139-Pin, 10-mm × 10-mm
Package
• Charger:
– Backup Battery Charger
•
•
Industrial
Handheld Systems
Description
The TPS65920 and TPS65930 devices are power-management ICs for OMAP™ and other mobile
applications. The devices include power-management, a universal serial bus (USB) high-speed (HS)
transceiver, light-emitting diode (LED) drivers, an analog-to-digital converter (ADC), a real-time clock
(RTC), and an embedded power control (EPC). In addition, the TPS65930 includes a full audio codec with
two digital-to-analog converters (DACs) and two ADCs to implement dual voice channels, and a stereo
downlink channel that can play all standard audio sample rates through a multiple format inter-integrated
sound (I2S)/time division multiplexing (TDM) interface.
These optimized devices support the power and peripheral requirements of the OMAP application
processors. The power portion of the devices contains three buck converters, two controllable by a
dedicated SmartReflex class-3 interface, multiple low dropout (LDO) regulators, an EPC to manage the
power sequencing requirements of OMAP, and an RTC and backup module. The RTC can be powered by
a backup battery when the main supply is not present, and the devices include a coin-cell charger to
recharge the backup battery as needed.
1
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.
TPS65930, TPS65920
SWCS037I – MAY 2008 – REVISED JANUARY 2015
www.ti.com
The USB module provides a HS 2.0 OTG transceiver suitable for direct connection to the OMAP UTMI+
low pin interface (ULPI), with an integrated charge pump and full support for the carkit CEA-936A
specification. An ADC is provided for monitoring signals, such as supply voltage, entering the device, and
two additional external ADC inputs are provided for system use.
The devices provide driver circuitry to power two LED circuits that can illuminate a panel or provide user
indicators. The drivers also provide pulse width modulation (PWM) circuits to control the illumination levels
of the LEDs. A keypad interface implements a built-in scanning algorithm to decode hardware-based key
presses and reduce software use, with multiple additional general-purpose input/output devices (GPIOs)
that can be used as interrupts when configured as inputs.
Device Information (1)
PACKAGE
BODY SIZE
TPS65920A2ZCHR
PART NUMBER
ZCH (139)
10.0 mm × 10.0 mm
TPS65930A2ZCHR
ZCH (139)
10.0 mm × 10.0 mm
(1)
2
For more information, see Section 8, Mechanical, Packaging, and Orderable Information.
Device Overview
Copyright © 2008–2015, Texas Instruments Incorporated
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Product Folder Links: TPS65930 TPS65920
TPS65930, TPS65920
www.ti.com
1.4
SWCS037I – MAY 2008 – REVISED JANUARY 2015
Functional Block Diagram
Figure 1-1 shows the TPS65920 device block diagram.
TPS65920
Interface subchip (D)
Digital signal(s)
Analog signal(s)
PIH
I2C A pad
Clock
generator
I2C B pad
TAP
OCP
Clk In/Out
Card Det1
GPIO pad
GPIO
SIH
Card Det2
TAP
SIH_INT
TAP
Clocks
OCP
OCP SR
TAP
OCP
Clocks
Clocks
SIH_INT
OCP
PMC slave
Smart
Reflex
RFIDEN
Vibrator
control (D)
Clock slicer
Power control
(BBS-backup
VRRTC-UVLO)
USB power
supply
USB subchip (A-D)
ULPI(12)
UART(2)
BERCLK
BERDATA
Auxiliary subchip (A-D)
Power digital
Keypad
(D)
Power analog
RTC
32 kHz
TAP
Shundan
RTC
Clocks
SIH
OCP
PMC master
SIH_INT
SIH_INT
OTG
module
USB 2.0
transceiver
USB
digital
(ULPI
regist
ers,
interr
upts,
Thermal monitor
system
MADC
digital
state-machine
MADC analog
(SAR-Vref)
MADCTOP
Rc oscillator
LEDTOP
Power provider
(LDOs-DcDcs)
Power references
(Vref-Iref-bandgap)
LED digital
LED analog
Power subchip (A-D)
LedSync
Figure 1-1. TPS65920 Block Diagram
Copyright © 2008–2015, Texas Instruments Incorporated
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Product Folder Links: TPS65930 TPS65920
Device Overview
3
TPS65930, TPS65920
SWCS037I – MAY 2008 – REVISED JANUARY 2015
www.ti.com
Table of Contents
1
2
3
4
Device Overview ......................................... 1
1.1
Features .............................................. 1
1.2
Applications ........................................... 1
1.3
Description ............................................ 1
1.4
Functional Block Diagram ............................ 3
Revision History ......................................... 5
Terminal Configuration and Functions .............. 6
Pin Diagram
3.2
Pin Attributes ......................................... 6
3.3
Signal Descriptions .................................. 10
6
Specifications ........................................... 15
4.1
Absolute Maximum Ratings ......................... 15
4.2
ESD Ratings
4.4
4.5
4.6
4.7
4
..........................................
3.1
4.3
5
5.3
........................................
Recommended Operating Conditions ...............
Thermal Characteristics for ZCH Package ..........
Minimum Voltages and Associated Currents .......
Digital I/O Electrical Characteristics.................
6
7
15
15
15
16
16
Timing Requirements and Switching Characteristics
......................................................
Detailed Description ...................................
5.1
Power Module .......................................
5.2
Real-Time Clock and Embedded Power Controller .
Table of Contents
19
27
8
USB Transceiver .................................... 53
...............................................
.........................................
5.6
Keyboard ............................................
5.7
Clock Specifications .................................
5.8
Debouncing Time ...................................
5.9
External Components ...............................
Audio/Voice Module (TPS65930 Device Only) ....
6.1
Audio/Voice Downlink (RX) Module .................
6.2
Audio Uplink (TX) Module ...........................
Device and Documentation Support ...............
7.1
Device Support ......................................
7.2
Community Resources ..............................
7.3
Related Links ........................................
7.4
Trademarks..........................................
7.5
Electrostatic Discharge Caution .....................
7.6
Export Control Notice ...............................
7.7
Glossary .............................................
7.8
Additional Acronyms ................................
5.4
MADC
62
5.5
LED Drivers
64
65
66
77
78
82
82
88
96
96
97
97
97
98
98
98
98
27
Mechanical, Packaging, and Orderable
Information ............................................. 101
52
8.1
Packaging Information ............................. 101
Copyright © 2008–2015, Texas Instruments Incorporated
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Product Folder Links: TPS65930 TPS65920
TPS65930, TPS65920
www.ti.com
SWCS037I – MAY 2008 – REVISED JANUARY 2015
2 Revision History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
Changes from Revision H (October 2014) to Revision I
•
Changed document to standard TI format
Page
........................................................................................
Copyright © 2008–2015, Texas Instruments Incorporated
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Product Folder Links: TPS65930 TPS65920
Revision History
1
5
TPS65930, TPS65920
SWCS037I – MAY 2008 – REVISED JANUARY 2015
www.ti.com
3 Terminal Configuration and Functions
Figure 3-1 shows the ball locations for the 139-ball plastic ball grid array (PBGA) package. Use this array
with Table 3-1 to locate signal names and ball grid numbers.
3.1
Pin Diagram
037-003
Figure 3-1. PBGA Bottom View
3.2
Pin Attributes
Table 3-1 describes the terminal characteristics and the signals multiplexed on each pin. The following list
describes the table column headers:
Table 3-1. Pin Attributes
TPS65920
BALL (1)
TPS65930
BALL (1)
H2
H2
F2
F2
M5
ADCIN0
A
I/O
VINTANA1.OUT
ADCIN2
A
I
VINTANA2.OUT
M5
PCHGAC
A
I
VACCHARGER
N1
N1
VPRECH
A
O
VPRECH
N5
N5
VBAT
A
Power
VBAT
GPIO0/CD1
D
I/O
IO_1P8
JTAG.TDO
D
I/O
IO_1P8
GPIO1
D
I/O
IO_1P8
JTAG.TMS
D
I
IO_1P8
GPIO2
D
I/O
IO_1P8
TEST1
D
I/O
IO_1P8
P2
6
REFERENCE
LEVEL
RL (5)
TYPE (4)
E7
(5)
(6)
(7)
A/D
(3)
F7
(1)
(2)
(3)
(4)
PIN
NAME (2)
F7
E7
P2
PU (6) (kΩ)
PD (6) (kΩ)
MIN
TYP
MAX
MIN
TYP
MAX
75
100
202
59
100
144
BUFFER
STRENGTH
(mA) (7)
8
8
2
75
100
202
59
100
144
156
220
450
59
100
144
2
2
Ball: Ball number(s) associated with each signal(s)
Pin Name: The names of all the signals that are multiplexed on each ball
A/D: Analog or digital signal
Type: The terminal type when a particular signal is multiplexed on the terminal:
• I = Input
• O = Output
Reference Level: See the power module chapter for values.
PU/PD: Denotes the presence of an internal pullup or pulldown. Pullups and pulldowns can be enabled or disabled by software.
Buffer Strength: Drive strength of the associated output buffer
Terminal Configuration and Functions
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Product Folder Links: TPS65930 TPS65920
TPS65930, TPS65920
www.ti.com
SWCS037I – MAY 2008 – REVISED JANUARY 2015
Table 3-1. Pin Attributes (continued)
TPS65920
BALL (1)
TPS65930
BALL (1)
P13
P13
L5
L5
J7
PIN
NAME (2)
A/D
REFERENCE
LEVEL
RL (5)
PU (6) (kΩ)
PD (6) (kΩ)
BUFFER
STRENGTH
(mA) (7)
(3)
TYPE (4)
GPIO15
D
I/O
IO_1P8
TEST2
D
I/O
IO_1P8
GPIO6
D
I/O
IO_1P8
PWM0
D
O
IO_1P8
TEST3
D
I/O
IO_1P8
2
GPIO7
D
I/O
IO_1P8
2
VIBRA.SYNC
D
I
IO_1P8
PWM1
D
O
IO_1P8
TEST4
D
I/O
IO_1P8
J7
MIN
TYP
MAX
MIN
TYP
MAX
156
220
450
59
100
144
2
2
2
75
75
100
100
202
202
59
59
100
100
144
4
144
4
2
D8
D8
SYSEN
D
Open drain/I
IO_1P8
A4
A4
CLKEN
D
O
IO_1P8
B13
B13
CLKREQ
D
I
IO_1P8
C10
C10
INT1
D
O
IO_1P8
2
C8
C8
NRESPWRON
D
O
IO_1P8
2
B9
B9
NRESWARM
D
I
IO_1P8
2
D10
D10
PWRON
D
I
VBAT
G5
G5
NSLEEP1
D
I
IO_1P8
E10
E10
CLK256FS (8)
D
O
IO_1P8
E4
E4
VMODE1
D
I
IO_1P8
E8
E8
BOOT0
A/D
I/O
VBAT
D7
D7
BOOT1
A/D
I/O
VBAT
B8
B8
REGEN
D
Open drain
VBAT
H4
H4
MSECURE
D
I
IO_1P8
L13
L13
VREF
A
Power
VREF
A
Power
ground
(GND)
GND
I2C.SR.SDA
D
I/O
IO_1P8
VMODE2
D
I
IO_1P8
I2C.SR.SCL
D
I/O
K13
K13
B3
B3
AGND
4.7
7.35
10
2
2
60
100
146
2
5.5
8
12
2
2.5
3.4
12
IO_1P8
2.5
3.4
12
N.C.
C5
C3
C3
I2C.CNTL.SDA
D
I/O
IO_1P8
2.5
3.4
12
B4
B4
I2C.CNTL.SCL
D
I
IO_1P8
2.5
3.4
12
See
(9)
H3
I2S.CLK
D
I/O
IO_1P8
2
See
(9)
K2
I2S.SYNC
D
I/O
IO_1P8
2
See
(9)
K4
I2S.DIN
D
I
IO_1P8
2
See
(9)
K3
I2S.DOUT
D
O
IO_1P8
2
See
(9)
D1
MIC.MAIN.P
A
I
MICBIAS1.OUT
See
(9)
E1
MIC.MAIN.M
A
I
MICBIAS1.OUT
A10
VBAT.RIGHT
A
Power
VBAT
PreDriv.LEFT
A
O
VINTANA2.OUT
VMID
A
Power
VINTANA2.OUT
PreDriv.RIGHT
A
O
VINTANA2.OUT
ADCIN7
A
I
VINTANA2.OUT
AUXR
A
I
VINTANA2.OUT
MICBIAS1.OUT
A
Power
VINTANA2.OUT
VMIC1.OUT
A
Power
VINTANA2.OUT
Power GND
GND
A10
See
(9)
See
(9)
See
See
See
(8)
(9)
2
C5
(9)
(9)
(9)
A7
A8
G1
E2
D2
MICBIAS.GND
G2
G2
AVSS1
A
Power GND
GND
L7
L7
AVSS2
A
Power GND
GND
N14
N14
AVSS3
A
Power GND
GND
C7
C7
AVSS4
A
Power GND
GND
To avoid reflection on this pin as a result of impedance mismatch, a serial resistance of 33 Ω must be added. This clock output is
available in TPS65920 also. Can be used as a clock source, if required.
Balls A7, A8, D1, D2, E1, E2, G1, H3, K2, K3, and K4 are present on TPS65920 package. However, there is no function associated with
these pins. These can be left floating.
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Terminal Configuration and Functions
7
TPS65930, TPS65920
SWCS037I – MAY 2008 – REVISED JANUARY 2015
www.ti.com
Table 3-1. Pin Attributes (continued)
TPS65920
BALL (1)
TPS65930
BALL (1)
M10
M10
L14
L14
K14
A/D
REFERENCE
LEVEL
RL (5)
PU (6) (kΩ)
PD (6) (kΩ)
BUFFER
STRENGTH
(mA) (7)
(3)
TYPE (4)
32KCLKOUT
D
O
IO_1P8
32KXIN
A
I
IO_1P8
K14
32KXOUT
A
O
IO_1P8
A11
A11
HFCLKIN
A
I
IO_1P8
M11
M11
HFCLKOUT
D
O
IO_1P8
P8
P8
VBUS
A
Power
VBUS
N10
N10
DP/UART3.RXD
A
I/O
VBUS
2
P10
P10
DN/UART3.TXD
A
I/O
VBUS
2
G6
G6
ID
A
I/O
VBUS
2
K11
K11
UCLK
D
I
IO_1P8
16
STP
D
I
IO_1P8
H12
H12
GPIO9
D
I/O
IO_1P8
2
DIR
D
O
IO_1P8
16
GPIO10
D
I/O
IO_1P8
2
NXT
D
O
IO_1P8
16
GPIO11
D
I/O
IO_1P8
2
DATA0
D
I/O
IO_1P8
16
UART4.TXD
D
I
IO_1P8
DATA1
D
I/O
IO_1P8
UART4.RXD
D
O
IO_1P8
2
DATA2
D
I/O
IO_1P8
16
UART4.RTSI
D
I
IO_1P8
DATA3
D
I/O
IO_1P8
UART4.CTSO
D
O
IO_1P8
GPIO12
D
I/O
IO_1P8
DATA4
D
I/O
IO_1P8
GPIO14
D
I/O
IO_1P8
2
DATA5
D
I/O
IO_1P8
16
GPIO3
D
I/O
IO_1P8
2
DATA6
D
I/O
IO_1P8
16
GPIO4
D
I/O
IO_1P8
2
DATA7
D
I/O
IO_1P8
16
GPIO5
D
I/O
IO_1P8
A/D
I
VBAT
H11
J8
L10
K10
G11
G10
E12
G9
G12
E11
P14
8
PIN
NAME (2)
MIN
75
J8
MAX
MIN
TYP
MAX
16
75
H11
TYP
75
100
202
100
202
100
202
59
59
59
100
100
100
144
144
144
L10
16
K10
G11
G10
E12
G9
16
60
100
140
60
100
140
75
100
202
59
100
144
75
100
202
59
100
144
16
16
75
G12
75
E11
75
P14
TEST.RESET
P1
P1
TESTV1
A
I/O
VBAT
A14
A14
TESTV2
A
I/O
VINTANA2.OUT
A1
A1
TEST
D
I
IO_1P8
A13
A13
JTAG.TDI/
BERDATA
D
I
IO_1P8
B14
B14
JTAG.TCK/
BERCLK
D
I
IO_1P8
VBAT/VBUS
P7
P7
CP.IN
A
Power
N7
N7
CP.CAPP
A
O
CP.CAPP
N6
N6
CP.CAPM
A
O
CP.CAPM
P5
P5
CP.GND
A
Power GND
GND
N9
N9
VBAT.USB
A
Power
VBAT
M8
M8
VUSB.3P1
A
Power
VUSB.3P1
L1
L1
VAUX12S.IN
A
Power
VBAT
N2
N2
VAUX2.OUT
A
Power
VAUX2.OUT
H14
H14
VPLLA3R.IN
A
Power
VBAT
K12
K12
VRTC.OUT
A
Power
VRTC.OUT
G14
G14
VPLL1.OUT
A
Power
VPLL1.OUT
A2
A2
VMMC1.IN
A
Power
VBAT
B1
B1
VMMC1.OUT
A
Power
VMMC1.OUT
M7
M7
VINTUSB1P5.
OUT
A
Power
VINTUSB1P5.OUT
Terminal Configuration and Functions
16
100
202
100
202
100
202
59
59
100
100
144
144
59
100
144
30
50
70
60
100
146
2
Copyright © 2008–2015, Texas Instruments Incorporated
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Product Folder Links: TPS65930 TPS65920
TPS65930, TPS65920
www.ti.com
SWCS037I – MAY 2008 – REVISED JANUARY 2015
Table 3-1. Pin Attributes (continued)
TPS65920
BALL (1)
TPS65930
BALL (1)
N8
N8
K1
PIN
NAME (2)
A/D
REFERENCE
LEVEL
RL (5)
(3)
TYPE (4)
VINTUSB1P8.
OUT
A
Power
K1
VDAC.IN
A
Power
VBAT
L2
L2
VDAC.OUT
A
Power
VDAC.OUT
H13
H13
VINT.IN
A
Power
VBAT
H1
H1
VINTANA1.OUT
A
Power
VINTANA1.OUT
J2
J2
VINTANA2.OUT
A
Power
VINTANA2.OUT
A5
VINTANA2.OUT
A
Power
VINTANA2.OUT
J13
J13
VINTDIG.OUT
A
Power
VINTDIG.OUT
D13
D13
VDD1.IN
A
Power
VBAT
D12
D12
VDD1.IN
A
Power
VBAT
D14
D14
VDD1.IN
A
Power
VBAT
C11
C11
VDD1.SW
A
O
VBAT
C12
C12
VDD1.SW
A
O
VBAT
C13
C13
VDD1.SW
A
O
VBAT
E14
E14
VDD1.FB
A
I
A12
A12
VDD1.GND
A
Power GND
GND
B11
B11
VDD1.GND
A
Power GND
GND
B12
B12
VDD1.GND
A
Power GND
GND
M13
M13
VDD2.IN
A
Power
VBAT
M12
M12
VDD2.IN
A
Power
VBAT
N13
N13
VDD2.FB
A
I
N11
N11
VDD2.SW
A
O
VBAT
P11
P11
VDD2.SW
A
O
VBAT
N12
N12
VDD2.GND
A
Power GND
GND
P12
P12
VDD2.GND
A
Power GND
GND
M2
M2
VIO.IN
A
Power
VBAT
M3
M3
VIO.IN
A
Power
VBAT
M4
M4
VIO.FB
A
I
N4
N4
VIO.SW
A
O
VBAT
P4
P4
VIO.SW
A
O
VBAT
N3
N3
VIO.GND
A
Power GND
GND
P3
P3
VIO.GND
A
Power GND
GND
H9
H9
BKBAT
A
Power
VBACK
B7
B7
IO.1P8
A
Power
IO_1P8
H10
H10
DGND
A
Power GND
GND
F13
F13
LEDGND
A
Power GND
GND
GPIO13
D
I/O
IO_1P8
LEDSYNC
D
I
IO_1P8
LEDA
A
Open drain
VBAT
VIBRA.P
A
Open drain
VBAT
LEDB
A
Open drain
VBAT
VIBRA.M
A
Open drain
VBAT
E13
G13
PD (6) (kΩ)
MIN
TYP
MAX
MIN
TYP
MAX
75
100
202
59
100
144
BUFFER
STRENGTH
(mA) (7)
VINTUSB1P8.OUT
A5
B10
PU (6) (kΩ)
B10
E13
G13
G4
G4
KPD.C0
D
Open drain
IO_1P8
G3
G3
KPD.C1
D
Open drain
IO_1P8
E5
E5
KPD.C2
D
Open drain
IO_1P8
B2
B2
KPD.C3
D
Open drain
IO_1P8
E3
E3
KPD.C4
D
Open drain
IO_1P8
D5
D5
KPD.C5
D
Open drain
IO_1P8
K7
K7
KPD.R0
D
I
IO_1P8
8
10
12
H5
H5
KPD.R1
D
I
IO_1P8
8
10
12
K5
K5
KPD.R2
D
I
IO_1P8
8
10
12
H6
H6
KPD.R3
D
I
IO_1P8
8
10
12
K8
K8
KPD.R4
D
I
IO_1P8
8
10
12
L8
L8
KPD.R5
D
I
IO_1P8
8
10
12
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Terminal Configuration and Functions
9
TPS65930, TPS65920
SWCS037I – MAY 2008 – REVISED JANUARY 2015
3.3
www.ti.com
Signal Descriptions
Table 3-2 describes the signals on the TPS65920 and TPS65930 devices; some signals are available on
multiple pins.
Table 3-2. Signal Description
MODULE
ADC
Charger
GPIOs/
JTAG
CONTROL
SIGNAL
NAME
DESCRIPTION
TPS65920
BALL
TPS65930
BALL
SIGNAL
TYPE
INTERNA
L PULL
OR NOT
FEATURES
NOT USED
ADCIN0
Battery type
I/O
H2
H2
ADCIN0
ADCIN2
General-purpose ADC input
I
F2
F2
ADCIN2
I
GND
PCHGAC
AC precharge sense signal. Also
used for EEPROM.
I
M5
M5
PCHGAC
I
GND
VPRECH
Precharge regulator output
O
N1
N1
VPRECH
O
Cap to GND
VBAT
Battery voltage sensing
Power
N5
N5
VBAT
Power
VBAT
GPIO0/CD1
GPIO0/card detection 1
I/O
JTAG.TDO
JTAG test data output
I/O
F7
F7
GPIO0
I
PD
Floating
GPIO1
GPIO1
I/O
JTAG.TMS
JTAG test mode state
E7
E7
GPIO1
I
PD
Floating
GPIO2
GPIO2
I/O
TEST1
TEST1 pin used in test mode
only
I/O
P2
P2
GPIO2
I
PD
Floating
GPIO15
GPIO15
I/O
TEST2
TEST2 pin used in test mode
only
I/O
P13
P13
GPIO15
I
PD
Floating
GPIO6
GPIO6
I/O
PWM0
Pulse width driver 0
O
L5
L5
GPIO6
I
PD
Floating
TEST3
TEST3 pin used in test mode
only (controlled by JTAG)
I/O
GPIO7
GPIO7
I/O
VIBRA.SYNC
Vibrator on-off synchronization
I
PWM1
Pulse width driver
O
J7
J7
GPIO7
I
PD
Floating
TEST4
TEST4 pin used in test mode
only (controlled by JTAG)
I/O
SYSEN
System enable output
D8
D8
SYSEN
OD
PU
Floating
CLKEN
Clock enable
O
A4
A4
CLKEN
O
CLKREQ
Clock request
I
B13
B13
CLKREQ
I
INT1
Output interrupt line 1
O
C10
C10
INT1
O
Floating
NRESPWRON
Output control the NRESPWRON
of the application processor
O
C8
C8
NRESPWRON
O
Floating
NRESWARM
Input; detect user action on the
reset button
I
B9
B9
NRESWARM
I
GND
PWRON
Input; detect a control command
to start or stop the system
I
D10
D10
PWRON
I
VBAT
NSLEEP1
Sleep request from device 1
I
Open
drain/I
CLK256FS
10
TYPE
DEFAULT CONFIGURATION AFTER
RESET RELEASED
GND
Floating
PD
GND
I
G5
G5
NSLEEP1
I
GND
O
E10
E10
CLK256FS
O
Floating
E4
E4
VMODE1
I
GND
VMODE1
Digital voltage scaling linked with
VDD1
I
BOOT0
Boot pin 0
I
E8
E8
BOOT0
I
PD
N/A
BOOT1
Boot pin 1
I
D7
D7
BOOT1
I
PD
N/A
Open
drain
B8
B8
REGEN
OD
PU
Floating
I
H4
H4
MSECURE
REGEN
Enable signal for external LDO
MSECURE
Security and digital rights
management
Terminal Configuration and Functions
I
N/A
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SWCS037I – MAY 2008 – REVISED JANUARY 2015
Table 3-2. Signal Description (continued)
SIGNAL
NAME
MODULE
VREF
2
IC
Smart
Reflex
I2C
TDM
ANA.MIC
HandsFree
Headset
AUX Input
VMIC
BIAS
DESCRIPTION
TYPE
VREF
Reference voltage
Power
AGND
Analog ground for reference
voltage
Power
GND
N.C.
Not connected
I2C.SR.SDA
SmartReflex I2C data
VMODE2
Digital voltage scaling linked with
VDD2
I2C.SR.SCL
SmartReflex I2C data
I/O
I2C.CNTL.SDA
General-purpose I2C data
I2C.CNTL.SCL
General-purpose I2C clock
I2S.CLK
Clock signal (audio port)
I2S.SYNC
Synchronization signal (audio
port)
I2S.DIN
TPS65930
BALL
L13
L13
DEFAULT CONFIGURATION AFTER
RESET RELEASED
SIGNAL
TYPE
INTERNA
L PULL
OR NOT
FEATURES
NOT USED
VREF
Power
N/A
Power
GND
GND
K13
K13
AGND
B3
B3
Signal not
functional
C5
C5
VMODE2
I/O
C3
C3
I2C.CNTL.SDA
I/O
PU
I/O
B4
B4
I2C.CNTL.SCL
I/O
PU
I/O
H3
I2S.CLK
I/O
Floating
I/O
K2
I2S.SYNC
I/O
Floating
Data receive (audio port)
I
K4
I2S.DIN
I
GND
I2S.DOUT
Data transmit (audio port)
O
K3
I2S.DOUT
O
Floating
MIC.MAIN.P
Main microphone left input (P)
I
D1
MIC.MAIN.P
I
Cap to GND
MIC.MAIN.M
Main microphone left input (M)
I
E1
MIC.MAIN.M
I
Cap to GND
VBAT.RIGHT
Battery voltage input
A10
VBAT.RIGHT
Power
VBAT
PreDriv.LEFT
Predriver output left P for
external class-D amplifier
A7
VMID
Power
Floating
A8
ADCIN7
I
GND
G1
AUXR
I
Cap to GND
E2
MICBIAS1.OUT
Power
Floating
D2
MICBIAS.GND
Power
GND
GND
Power
GND
GND
O
Floating
I/O
Floating
I
Power
VMID
A10
O
I
GND
N/A
N/A
Power
PreDriv.RIGHT
Predriver output right P for
external class-D amplifier
O
ADCIN7
General-purpose ADC input 7
I
AUXR
Auxiliary audio input right
I
MICBIAS1.
OUT
Analog microphone bias 1
Power
VMIC1.OUT
Digital microphone power supply
1
Power
MICBIAS.GND
Dedicated ground for
microphones
Power
GND
AVSS1
G2
G2
AVSS1
AVSS2
L7
L7
AVSS2
N14
N14
AVSS3
C7
C7
AVSS4
M10
M10
32KCLKOUT
AVSS3
Power
GND
Analog ground
AVSS4
CLOCK
TPS65920
BALL
32KCLKOUT
Buffered output of the 32-kHz
digital clock
32KXIN
Input of the 32-kHz oscillator
I
L14
L14
32KXIN
I
N/A
32KXOUT
Output of the 32-kHz oscillator
O
K14
K14
32KXOUT
O
Floating
HFCLKIN
Input of the digital (or sine) HS
clock
I
A11
A11
HFCLKIN
I
N/A
HFCLKOUT
HS clock output
O
M11
M11
HFCLKOUT
VBUS
VBUS power rail
Power
P8
P8
DP/
UART3.RXD
USB data P/USB carkit receive
data/universal asynchronous
receiver/transmitter (UART)3
receive data
I/O
N10
N10
DN/
UART3.TXD
USB data N/USB carkit transmit
data/UART3 transmit data
I/O
P10
ID
USB ID
I/O
G6
USB PHY
O
O
Floating
Power
N/A
DP/UART3.RX
D
I/O
N/A
P10
DN/UART3.TX
D
I/O
N/A
G6
ID
I/O
Connected to
VRUSB3V1
VBUS
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TPS65930, TPS65920
SWCS037I – MAY 2008 – REVISED JANUARY 2015
www.ti.com
Table 3-2. Signal Description (continued)
MODULE
ULPI
TEST
USB CP
SIGNAL
NAME
DESCRIPTION
TYPE
DEFAULT CONFIGURATION AFTER
RESET RELEASED
TPS65920
BALL
TPS65930
BALL
K11
K11
UCLK
O
H12
H12
STP
I
H11
H11
DIR
O
Floating
J8
J8
NXT
O
Floating
L10
L10
DATA0
O
Floating
K10
K10
DATA1
O
Floating
G11
G11
DATA2
O
Floating
G10
G10
DATA3
O
Floating
E12
E12
DATA4
O
Floating
G9
G9
DATA5
O
Floating
G12
G12
DATA6
O
Floating
E11
E11
DATA7
O
Floating
P14
P14
TEST.RESET
I
SIGNAL
TYPE
INTERNA
L PULL
OR NOT
FEATURES
NOT USED
UCLK
HS USB clock
I
STP
HS USB stop
I
GPIO9
GPIO9
DIR
HS USB direction
O
GPIO10
GPIO10
I/O
NXT
HS USB next
O
GPIO11
GPIO11
I/O
DATA0
HS USB Data0
I/O
UART4.TXD
UART4.TXD
DATA1
HS USB Data1
I/O
UART4.RXD
UART4.RXD
O
DATA2
HS USB Data2
I/O
UART4.RTSI
UART4.RTSI
DATA3
HS USB Data3
UART4.CTSO
UART4.CTSO
O
GPIO12
GPIO12
I/O
DATA4
HS USB Data4
I/O
GPIO14
GPIO14
I/O
DATA5
HS USB Data5
I/O
GPIO3
GPIO3
I/O
DATA6
HS USB Data6
I/O
GPIO4
GPIO4
I/O
DATA7
HS USB Data7
I/O
GPIO5
GPIO5
I/O
TEST.RESET
Reset T2 device (except power
state-machine)
TESTV1
Analog test
I/O
P1
P1
TESTV1
I/O
Floating
TESTV2
Analog test
I/O
A14
A14
TESTV2
I/O
Floating
TEST
Selection between JTAG mode
and application mode for
JTAG/GPIOs (with PU or PD)
I
A1
A1
TEST
I
JTAG.TDI/
BERDATA
JTAG.TDI/BERDATA
I
A13
A13
JTAG.TDI/
BERDATA
I
GND
JTAG.TCK/
BERCLK
JTAG.TCK/BERCLK
I
B14
B14
JTAG.TCK/
BERCLK
I
GND
CP.IN
Charge pump input voltage
Power
P7
P7
CP.IN
Power
VBAT
CP.CAPP
Charge pump flying capacitor P
O
N7
N7
CP.CAPP
O
Floating
CP.CAPM
Charge pump flying capacitor M
O
N6
N6
CP.CAPM
O
Floating
GND
I/O
I
I
Floating
PU
Floating
I/O
I
CP.GND
Floating
CP.GND
Charge pump ground
VBAT.US
B
VBAT.USB
USB LDOs (VINTUSB1P5,
VINTUSB1P8, VUSB.3P1) VBAT
Power
N9
N9
VBAT.USB
Power
VBAT
USB.LDO
VUSB.3P1
USB LDO output
Power
M8
M8
VUSB.3P1
Power
N/A
VAUX1
VAUX12S.IN
VAUX1/VAUX2/VSIM LDO input
voltage
Power
L1
L1
VAUX12S.IN
Power
VBAT
VAUX2
VAUX2.OUT
VAUX2 LDO output voltage
Power
N2
N2
VAUX2.OUT
Power
Floating
VPLLA3R
VPLLA3R.IN
Input for VPLL1, VPLL2, VAUX3,
and VRTC LDOs
Power
H14
H14
VPLLA3R.IN
Power
VBAT
VRTC
VRTC.OUT
VRTC internal LDO output
(internal use only)
Power
K12
K12
VRTC.OUT
Power
N/A
VPLL1
VPLL1.OUT
LDO output voltage
Power
G14
G14
VPLL1.OUT
Power
Floating
Terminal Configuration and Functions
P5
PD
GND
Power
GND
12
P5
Power
GND
PD
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SWCS037I – MAY 2008 – REVISED JANUARY 2015
Table 3-2. Signal Description (continued)
MODULE
SIGNAL
NAME
DESCRIPTION
TYPE
TPS65920
BALL
TPS65930
BALL
DEFAULT CONFIGURATION AFTER
RESET RELEASED
SIGNAL
TYPE
INTERNA
L PULL
OR NOT
FEATURES
NOT USED
VMMC1.IN
VMMC1 LDO input voltage
Power
A2
A2
VMMC1.IN
Power
VBAT
VMMC1.OUT
VMMC1 LDO output voltage
Power
B1
B1
VMMC1.OUT
Power
Floating
VINTUSB1 VINTUSB1P5.
P5
OUT
VINTUSB1P5 internal LDO
output (internal use only)
Power
M7
M7
VINTUSB1P5.
OUT
Power
Floating
VINTUSB1 VINTUSB1P8.
P8
OUT
VINTUSB1P8 internal LDO
output (internal use only)
Power
N8
N8
VINTUSB1P8.
OUT
Power
Floating
K1
K1
VDAC.IN
Power
VBAT
VMMC1
Video
DAC
VDAC.IN
Input for VDAC, VINTANA1, and
VINTANA2 LDOs
Power
VDAC.OUT
Output voltage of the regulator
Power
L2
L2
VDAC.OUT
Power
Floating
VINT
VINT.IN
Input for VINTDIG LDO
Power
H13
H13
VINT.IN
Power
VBAT
Power
N/A
VINTANA1.
VINTANA1
OUT
VINTANA1 internal LDO output
(internal use only)
Power
H1
H1
VINTANA1.OU
T
VINTANA2.
OUT
VINTANA2 internal LDO output
(internal use only)
Power
J2
J2
VINTANA2.OU
T
Power
N/A
VINTANA2.
OUT
VINTANA2 internal LDO output
(internal use only)
Power
A5
A5
VINTANA2.OU
T
Power
N/A
VINTDIG.OUT
VINTDIG internal LDO output
(internal use only)
Power
J13
J13
VINTDIG.OUT
Power
N/A
VDD1.IN
VDD1 DC-DC input voltage
Power
D13
D13
VDD1.IN
Power
VBAT
VDD1.IN
VDD1 DC-DC input voltage
Power
D12
D12
VDD1.IN
Power
VBAT
VDD1.IN
VDD1 DC-DC input voltage
Power
D14
D14
VDD1.IN
Power
VBAT
VDD1.SW
VDD1 DC-DC switch
O
C11
C11
VDD1.SW
O
Floating
VDD1.SW
VDD1 DC-DC switch
O
C12
C12
VDD1.SW
O
Floating
VDD1.SW
VDD1 DC-DC switch
O
C13
C13
VDD1.SW
O
Floating
VDD1.FB
VDD1 DC-DC output voltage
(feedback)
I
E14
E14
VDD1.FB
I
GND
VDD1.GND
VDD1 DC-DC ground
Power
GND
A12
A12
VDD1.GND
Power
GND
GND
VDD1.GND
VDD1 DC-DC ground
Power
GND
B11
B11
VDD1.GND
Power
GND
GND
VDD1.GND
VDD1 DC-DC ground
Power
GND
B12
B12
VDD1.GND
Power
GND
GND
VDD2.IN
VDD2 DC-DC input voltage
Power
M13
M13
VDD2.IN
Power
VBAT
VDD2.IN
VDD2 DC-DC input voltage
Power
M12
M12
VDD2.IN
Power
VBAT
VDD2.FB
VDD2 DC-DC output voltage
(feedback)
I
N13
N13
VDD2.FB
I
GND
VDD2.SW
VDD2 DC-DC switch
O
N11
N11
VDD2.SW
O
Floating
VDD2.SW
VDD2 DC-DC switch
O
P11
P11
VDD2.SW
O
Floating
VDD2.GND
VDD2 DC-DC ground
Power
GND
N12
N12
VDD2.GND
Power
GND
GND
VDD2.GND
VDD2 DC-DC ground
Power
GND
P12
P12
VDD2.GND
Power
GND
GND
VIO.IN
VIO DC-DC input voltage
Power
M2
M2
VIO.IN
Power
VBAT
VIO.IN
VIO DC-DC input voltage
Power
M3
M3
VIO.IN
Power
VBAT
VIO.FB
VIO DC-DC output voltage
(feedback)
I
M4
M4
VIO.FB
I
GND
VIO.SW
VIO DC-DC switch
O
N4
N4
VIO.SW
O
Floating
VIO.SW
VIO DC-DC switch
O
P4
P4
VIO.SW
O
Floating
VIO.GND
VIO DC-DC ground
Power
GND
N3
N3
VIO.GND
Power
GND
GND
VIO.GND
VIO DC-DC ground
Power
GND
P3
P3
VIO.GND
Power
GND
GND
BKBAT
Backup battery
Power
H9
H9
BKBAT
Power
GND
VINTANA2
VINTDIG
VDD1
VDD2
VIO
Backup
battery
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SWCS037I – MAY 2008 – REVISED JANUARY 2015
www.ti.com
Table 3-2. Signal Description (continued)
MODULE
SIGNAL
NAME
DESCRIPTION
TYPE
TPS65920
BALL
TPS65930
BALL
DEFAULT CONFIGURATION AFTER
RESET RELEASED
SIGNAL
TYPE
INTERNA
L PULL
OR NOT
FEATURES
NOT USED
Digital
VDD
IO.1P8
TPS65920/TPS65930 device I/O
input
Power
B7
B7
IO.1P8
Power
N/A
Digital
ground
DGND
Digital ground
Power
GND
H10
H10
DGND
Power
GND
GND
LEDGND
LED driver ground
Power
GND
F13
F13
LEDGND
Power
GND
GND
GPIO13
GPIO13
LEDSYNC
LED synchronization input
B10
B10
GPIO13
I
LEDA
LED leg A
VIBRA.P
H-bridge vibrator P
Open
drain
E13
E13
Signal not
functional
Floating
LEDB
LED leg B
VIBRA.M
H-bridge vibrator M
Open
drain
G13
G13
Signal not
functional
Floating
KPD.C0
Keypad column 0
Open
drain
G4
G4
KPD.C0
OD
Floating
KPD.C1
Keypad column 1
Open
drain
G3
G3
KPD.C1
OD
Floating
KPD.C2
Keypad column 2
Open
drain
E5
E5
KPD.C2
OD
Floating
KPD.C3
Keypad column 3
Open
drain
B2
B2
KPD.C3
OD
Floating
KPD.C4
Keypad column 4
Open
drain
E3
E3
KPD.C4
OD
Floating
KPD.C5
Keypad column 5
Open
drain
D5
D5
KPD.C5
OD
Floating
KPD.R0
Keypad row 0
I
K7
K7
KPD.R0
I
PU
Floating
KPD.R1
Keypad row 1
I
H5
H5
KPD.R1
I
PU
Floating
KPD.R2
Keypad row 2
I
K5
K5
KPD.R2
I
PU
Floating
KPD.R3
Keypad row 3
I
H6
H6
KPD.R3
I
PU
Floating
KPD.R4
Keypad row 4
I
K8
K8
KPD.R4
I
PU
Floating
KPD.R5
Keypad row 5
I
L8
L8
KPD.R5
I
PU
Floating
LED driver
Keypad
I/O
I
PD
Floating
1. This column provides the connection when the associated feature is not used or not connected. When
there is a pin muxing, not all functions on the muxed pin are used. But even if a function is not used,
the Default Configuration After Reset Released column still applies.
Connection criteria:
– Analog pins:
– For input: GND
– For output: Floating (except VPRECH is connected to GND)
– For I/O if input by default: GND (except for audio features input: capacitor to ground with a 100nF typical value capacitor)
– Digital pins:
– For input: GND (except keypad and STP are left floating)
– For input and pullup: Floating
– For output: Floating
– For I/O and pullup: Floating
N/A (not applicable): When the associated feature is mandatory for correct functioning of the
TPS65920/TPS65930 device
2. The signal VPRECH must be connected to the CPRECH capacitor to GND.
3. Signal not functional indicates that no signal is presented on the pad after a release reset.
14
Terminal Configuration and Functions
Copyright © 2008–2015, Texas Instruments Incorporated
Submit Documentation Feedback
Product Folder Links: TPS65930 TPS65920
TPS65930, TPS65920
www.ti.com
SWCS037I – MAY 2008 – REVISED JANUARY 2015
4 Specifications
4.1
Absolute Maximum Ratings
PARAMETER
TEST CONDITIONS
MIN
Main battery supply voltage (1)
Voltage on any input
Supply represents the voltage applied to the
power supply pin associated with the input
Ambient temperature
TYP
MAX
4.5
V
0.0
1.0*Supply
V
–40
Junction temperature (TJ)
UNIT
2.1
At 1.4 W (Theta JB 11°C/W 2S2P board)
85
°C
105
°C
Junction temperature (TJ) for parametric
compliance
–40
105
°C
Storage temperature (Tstg)
–55
125
°C
(1)
The product has negligible reliability impact if voltage spikes of 5.2 V occur for a total duration of 10 ms.
4.2
ESD Ratings
VALUE
VESD
(1)
(2)
Electrostatic discharge
(ESD) performance:
Human body model (HBM), per
ANSI/ESDA/JEDEC JS001 (1)
All other pins
UNIT
±2
CLK32KOUT pin
kV
±1.5
Charged device model (CDM), per JESD22-C101 (2)
±500
V
JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
4.3
Recommended Operating Conditions
MIN
TYP
MAX
2.7 (1)
3.6
4.5
Backup battery supply voltage
1.8
3.2
3.3
V
Ambient temperature range
–40
85
°C
Main battery supply voltage
(1)
UNIT
V
2.7 V is the minimum threshold for the battery at which the device will turn OFF. However, the minimum voltage at which the device will
power ON is 3.2 V ±100 mV (if PWRON does not have a switch and is connected to VBAT) considering battery plug as the device
switch on event. If PWRON has a switch then 3.2 V is the minimum for the device to turn ON.
4.4
Thermal Characteristics for ZCH Package
TPS65920–2S2P
NAME DESCRIPTION
(°C/W)
(2)
TPS65920–1S0P
TPS65930–2S2P
(°C/W)
(°C/W)
(2)
TPS65930–1S0P
(°C/W)
AIR
FLOW
(m/s) (1)
RΘJC
Junction-to-case (top)
6.74
6.74
33.42
57.05
0.00
RΘJB
Junction-to-board
13.80
14.50
13.81
14.51
0.00
RΘJA
Junction-to-free air
33.40
57.04
6.74
6.74
0.00
(1)
(2)
m/s = meters per second
These values are based on a JEDEC-defined 2S2P system (with the exception of the Theta JC [RΘJC] value, which is based on a
JEDEC-defined 1S0P system) and will change based on environment as well as application. For more information, see these
EIA/JEDEC standards:
• JESD51-2, Integrated Circuits Thermal Test Method Environmental Conditions - Natural Convection (Still Air)
• JESD51-3, Low Effective Thermal Conductivity Test Board for Leaded Surface Mount Packages
• JESD51-7, High Effective Thermal Conductivity Test Board for Leaded Surface Mount Packages
• JESD51-9, Test Boards for Area Array Surface Mount Package Thermal Measurements
Copyright © 2008–2015, Texas Instruments Incorporated
Submit Documentation Feedback
Product Folder Links: TPS65930 TPS65920
Specifications
15
TPS65930, TPS65920
SWCS037I – MAY 2008 – REVISED JANUARY 2015
4.5
www.ti.com
Minimum Voltages and Associated Currents
Table 4-1 lists the VBAT minimum and maximum currents per VBAT ball.
Table 4-1. VBAT Minimum Required Per VBAT Ball and Associated Maximum Current
CATEGORY
PIN AND MODULE
MAXIMUM
CURRENT
SPECIFIED (mA)
VBAT pin name
VDD_VPLLA3R_IN_6POV
340
VPLL1 (LDO)
40
VDD1 core (DCDC)