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TPS70912DRVR

TPS70912DRVR

  • 厂商:

    BURR-BROWN(德州仪器)

  • 封装:

    WSON6_EP

  • 描述:

    IC REG LINEAR 1.2V 150MA 6WSON

  • 数据手册
  • 价格&库存
TPS70912DRVR 数据手册
TPS709 SBVS186H – MARCH 2012 – REVISED JULY 2021 TPS709 150-mA, 30-V, 1-µA IQ Voltage Regulators With Enable 1 Features 3 Description • • • • • • • The TPS709 series of linear regulators are ultralow, quiescent current devices designed for powersensitive applications. A precision band-gap and error amplifier provides 2% accuracy over temperature. Quiescent current of only 1 µA makes these devices ideal solutions for battery-powered, alwayson systems that require very little idle-state power dissipation. These devices have thermal-shutdown, current-limit, and reverse-current protections for added safety. 2 Applications • • • • • • • Smoke and heat detectors Thermostats Motion detectors (PIR, uWave, and so forth) Cordless power tools Appliance battery packs Electricity meters Water meters Shutdown mode is enabled by pulling the EN pin low. The shutdown current in this mode goes down to 150 nA, typical. The TPS709 series is available in WSON-6 and SOT-23-5 packages. Device Information(1) PART NUMBER TPS709 (1) PACKAGE BODY SIZE (NOM) SOT-23 (5) 2.90 mm × 1.60 mm WSON (6) 2.00 mm × 2.00 mm For all available packages, see the package option addendum at the end of the datasheet. 2 Typical Application Circuit Ground Pin Current (µA) • • Ultra-low IQ: 1 μA Reverse current protection Low ISHUTDOWN: 150 nA Input voltage range: 2.7 V to 30 V Supports 200-mA peak output 2% accuracy over temperature Available in fixed-output voltages: 1.2 V to 6.5 V Thermal shutdown and overcurrent protection Packages: SOT-23-5, WSON-6 1.8 1.5 1.2 1 TA = −40°C TA = +25°C TA = +85°C 0.8 TPS70912 0.5 0 5 10 15 20 Input Voltage (V) 25 30 35 G014 GND Current vs VIN and Temperature An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications, intellectual property matters and other important disclaimers. PRODUCTION DATA. TPS709 www.ti.com SBVS186H – MARCH 2012 – REVISED JULY 2021 Table of Contents 1 Features............................................................................1 2 Applications..................................................................... 1 3 Description.......................................................................1 4 Revision History.............................................................. 2 5 Pin Configuration and Functions...................................3 6 Specifications.................................................................. 4 6.1 Absolute Maximum Ratings........................................ 4 6.2 ESD Ratings............................................................... 4 6.3 Recommended Operating Conditions.........................4 6.4 Thermal Information....................................................4 6.5 Electrical Characteristics.............................................5 6.6 Typical Characteristics................................................ 6 7 Detailed Description......................................................12 7.1 Overview................................................................... 12 7.2 Functional Block Diagram......................................... 12 7.3 Feature Description...................................................12 7.4 Device Functional Modes..........................................13 8 Application and Implementation.................................. 14 8.1 Application Information............................................. 14 8.2 Typical Application.................................................... 14 9 Power Supply Recommendations................................15 9.1 Power Dissipation..................................................... 15 10 Layout...........................................................................16 10.1 Layout Guidelines................................................... 16 10.2 Layout Example...................................................... 16 11 Device and Documentation Support..........................17 11.1 Device Support........................................................17 11.2 Documentation Support.......................................... 17 11.3 Support Resources................................................. 17 11.4 Trademarks............................................................. 17 11.5 Electrostatic Discharge Caution.............................. 17 11.6 Glossary.................................................................. 17 12 Mechanical, Packaging, and Orderable Information.................................................................... 18 4 Revision History NOTE: Page numbers for previous revisions may differ from page numbers in the current version. Changes from Revision G (November 2015) to Revision H (July 2021) Page • Updated the numbering format for tables, figures, and cross-references throughout the document..................1 • Changed Applications section............................................................................................................................ 1 • Changed VEN(HI) row (changed parameter description and added test condition) in Electrical Characteristics table.................................................................................................................................................................... 5 • Added VEN(LOW) row to Electrical Characteristics table...................................................................................... 5 • Added M3 suffix information to Device Nomenclature table............................................................................. 17 Changes from Revision F (December 2014) to Revision G (November 2015) Page • Added DBV package for TPS709A to Pin Configurations and Functions section.............................................. 3 • Added DBV package for TPS709B to Pin Configurations and Functions section.............................................. 3 • Added TPS709A and TPS709B to Pin Functions table...................................................................................... 3 • Moved operating junction temperature from Electrical Characteristics to Recommended Operating Conditions ............................................................................................................................................................................4 2 Submit Document Feedback Copyright © 2021 Texas Instruments Incorporated Product Folder Links: TPS709 TPS709 www.ti.com SBVS186H – MARCH 2012 – REVISED JULY 2021 5 Pin Configuration and Functions 1 GND 2 EN 3 5 OUT 4 NC Figure 5-1. TPS709: DBV Package, 5-Pin SOT-23, Top View GND 1 IN 2 OUT 3 5 4 1 GND 2 IN 3 5 EN 4 NC Figure 5-2. TPS709A: DBV Package, 5-Pin SOT-23, Top View EN NC Figure 5-3. TPS709B: DBV Package, 5-Pin SOT-23, Top View OUT OUT 1 NC 2 GND 3 GND IN 6 IN 5 NC 4 EN Figure 5-4. DRV Package, 6-Pin WSON, Top View Table 5-1. Pin Functions PIN DRV NAME TPS709 DBV TPS709 I/O DESCRIPTION Enable pin. Drive this pin high to enable the device. Drive this pin low to put the device into low current shutdown. This pin can be left floating to enable the device. The maximum voltage must remain below 6.5 V. TPS709A TPS709B EN 4 3 5 5 I GND 3 2 2 1 — IN 6 1 3 2 I NC 2, 5 4 4 4 — No internal connection 1 5 1 3 O Regulated output voltage. Connect a small 2.2-µF or greater ceramic capacitor from this pin to ground to assure stability. — — — — The thermal pad is electrically connected to the GND node. Connect this pad to the GND plane for improved thermal performance. OUT Thermal pad Ground Unregulated input to the device Submit Document Feedback Copyright © 2021 Texas Instruments Incorporated Product Folder Links: TPS709 3 TPS709 www.ti.com SBVS186H – MARCH 2012 – REVISED JULY 2021 6 Specifications 6.1 Absolute Maximum Ratings specified at TJ = –40°C to 125°C (unless otherwise noted); all voltages are with respect to GND(1) MIN Voltage Maximum output current MAX UNIT VIN –0.3 32 VEN –0.3 7 VOUT –0.3 7 IOUT V Internally limited Output short-circuit duration Indefinite Continuous total power dissipation PDISS See Thermal Information Operating junction temperature, TJ –55 150 °C Storage temperature, Tstg –55 150 °C (1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. 6.2 ESD Ratings VALUE V(ESD) (1) (2) Electrostatic discharge Human body model (HBM), per ANSI/ESDA/JEDEC JS-001(1) UNIT ±2000 Charged device model (CDM), per JEDEC specification JESD22-C101(2) V ±500 JEDEC document JEP155 states that 2-kV HBM allows safe manufacturing with a standard ESD control process. JEDEC document JEP157 states that 500-V CDM allows safe manufacturing with a standard ESD control process. 6.3 Recommended Operating Conditions over operating junction temperature range (unless otherwise noted) MIN NOM MAX UNIT VIN Input voltage 2.7 30 V VOUT Output voltage 1.2 6.5 V VEN Enable voltage 0 6.5 V TJ Operating junction temperature –40 125 °C 6.4 Thermal Information TPS709 THERMAL DBV DRV 5 PINS 6 PINS UNIT RθJA Junction-to-ambient thermal resistance 212.1 73.1 °C/W RθJC(top) Junction-to-case (top) thermal resistance 78.5 97.0 °C/W RθJB Junction-to-board thermal resistance 39.5 42.6 °C/W ψJT Junction-to-top characterization parameter 2.86 2.9 °C/W ψJB Junction-to-board characterization parameter 38.7 42.9 °C/W RθJC(bot) Junction-to-case (bottom) thermal resistance N/A 12.8 °C/W (1) 4 METRIC(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report. Submit Document Feedback Copyright © 2021 Texas Instruments Incorporated Product Folder Links: TPS709 TPS709 www.ti.com SBVS186H – MARCH 2012 – REVISED JULY 2021 6.5 Electrical Characteristics at ambient temperature (TA) = –40°C to +85°C, VIN = VOUT(typ) + 1 V or 2.7 V (whichever is greater), IOUT = 1 mA, VEN = 2 V, and CIN = COUT = 2.2-μF ceramic (unless otherwise noted); typical values are at TA = 25°C PARAMETER VIN Input voltage range VOUT Output voltage range VOUT DC output accuracy ΔVOUT ISHUTDOWN PSRR Shutdown current Power-supply rejection ratio VOUT ≥ 3.3 V –1% 1% 3 10 20 50 TPS70933, IOUT = 50 mA 295 650 TPS70933, IOUT = 150 mA 960 1400 TPS70950, IOUT = 50 mA 245 500 TPS70950, IOUT = 150 mA 690 1200 TPS70965, IOUT = 50 mA 180 500 TPS70965, IOUT = 150 mA 460 1000 VOUT = 0.9 × VOUT(nom) 200 320 500 1.3 2.05 IOUT = 0 mA, VOUT > 3.3 V 1.4 2.25 IOUT = 150 mA 350 VEN ≤ 0.4 V, VIN = 2.7 V 150 f = 10 Hz 80 f = 100 Hz 62 f = 1 kHz 52 VOUT(nom) ≤ 3.3 V 200 600 VOUT(nom) > 3.3 V 500 1500 Start-up time(2) VEN(HI) Enable pin high-level input voltage Device enabled 0.9 VEN(LOW) Enable pin low-level input Device disabled voltage 0 IEN EN pin current EN = 1.0 V, VIN = 5.5 V Reverse current (flowing out of IN pin) VOUT = 3 V, VIN = VEN = 0 V 10 Reverse current (flowing into OUT pin) VOUT = 3 V, VIN = VEN = 0 V 100 Shutdown, temperature increasing 158 Reset, temperature decreasing 140 (1) (2) (3) (4) Thermal shutdown temperature mV mA µA dB 190 tSTR mV nA BW = 10 Hz to 100 kHz, IOUT = 10 mA, VIN = 2.7 V, VOUT = 1.2 V Output noise voltage tSD V 6.5 Vn I(REV) V 2% VIN = VOUT(typ) + 1.5 V or 3 V (whichever is greater), 100 µA ≤ IOUT ≤ 150 mA UNIT 30 1.2 Load regulation Ground pin current MAX –2% IOUT = 0 mA, VOUT ≤ 3.3 V IGND TYP VOUT < 3.3 V (VOUT(nom) + 1 V, 2.7 V) ≤ VIN ≤ 30 V Output current limit(4) I(CL) MIN 2.7 Line regulation Dropout voltage(1) (3) VDO TEST CONDITIONS μVRMS µs V 0.4 300 V nA nA °C VDO is measured with VIN = 0.98 × VOUT(nom). Start-up time = time from EN assertion to 0.95 × VOUT(nom) and load = 47 Ω. Dropout is only valid when VOUT ≥ 2.8 V because of the minimum input voltage limits. Measured with VIN = VOUT + 3 V for VOUT ≤ 2.5 V. Measured with VIN = VOUT + 2.5 V for VOUT > 2.5 V. Submit Document Feedback Copyright © 2021 Texas Instruments Incorporated Product Folder Links: TPS709 5 TPS709 www.ti.com SBVS186H – MARCH 2012 – REVISED JULY 2021 6.6 Typical Characteristics over operating temperature range (TJ = –40°C to 125°C), IOUT = 10 mA, VEN = 2 V, COUT = 2.2 μF, and VIN = VOUT(typ) + 1 V or 2.7 V (whichever is greater), unless otherwise noted; typical values are at TJ = 25°C 3.31 TJ = −40°C TJ = +25°C TJ = +85°C TJ = +125°C Output Voltage (V) Output Voltage (V) 1.205 1.2 TJ = −40°C TJ = +25°C TJ = +85°C TJ = +125°C 3.305 3.3 3.295 TPS70912 1.195 0 TPS70933 5 10 15 20 Input Voltage (V) 25 3.29 30 15 20 Input Voltage (V) 25 30 G002 1.205 TJ = −40°C TJ = +25°C TJ = +85°C TJ = +125°C 1.2 Output Voltage (V) 6.505 TJ = −40°C TJ = +25°C TJ = +85°C TJ = +125°C 6.5 6.495 1.195 1.19 1.185 TPS70965 5 TPS70912 10 15 20 Input Voltage (V) 25 1.18 30 0 20 40 G003 Figure 6-3. 6.5-V Line Regulation vs VIN and Temperature 60 80 100 Output Current (mA) 120 140 160 G004 Figure 6-4. 1.2-V Load Regulation vs IOUT and Temperature 6.505 3.305 TJ = −40°C TJ = +25°C TJ = +85°C TJ = +125°C TJ = −40°C TJ = +25°C TJ = +85°C TJ = +125°C 6.5 6.495 Output Voltage (V) 3.3 Output Voltage (V) 10 Figure 6-2. 3.3-V Line Regulation vs VIN and Temperature 6.51 6.49 5 G001 Figure 6-1. 1.2-V Line Regulation vs VIN and Temperature Output Voltage (V) 0 3.295 3.29 3.285 6.49 6.485 6.48 6.475 6.47 3.28 6.465 TPS70933 3.275 0 20 40 60 80 100 Output Current (mA) 120 140 160 TPS70965 0 G005 Figure 6-5. 3.3-V Load Regulation vs IOUT and Temperature 6 6.46 20 40 60 80 100 Output Current (mA) 120 140 160 G006 Figure 6-6. 6.5-V Load Regulation vs IOUT and Temperature Submit Document Feedback Copyright © 2021 Texas Instruments Incorporated Product Folder Links: TPS709 TPS709 www.ti.com SBVS186H – MARCH 2012 – REVISED JULY 2021 6.6 Typical Characteristics (continued) over operating temperature range (TJ = –40°C to 125°C), IOUT = 10 mA, VEN = 2 V, COUT = 2.2 μF, and VIN = VOUT(typ) + 1 V or 2.7 V (whichever is greater), unless otherwise noted; typical values are at TJ = 25°C 1.205 6.505 IOUT = 10 mA IOUT = 150 mA Output Voltage (V) 1.2 Output Voltage (V) IOUT = 10 mA IOUT = 150 mA 6.5 1.195 1.19 1.185 6.495 6.49 6.485 6.48 6.475 6.47 TPS70912 1.18 −50 −35 −20 −5 TPS70965 6.465 −50 −35 −20 −5 10 25 40 55 70 85 100 115 130 Junction Temperature (°C) G007 Figure 6-7. VOUT vs Temperature Figure 6-8. VOUT vs Temperature 1600 1600 TJ = −40°C TJ = +25°C TJ = +85°C TJ = +125°C 1200 1000 800 600 400 TPS70965 IOUT = 150 mA 200 0 2.5 3.5 4.5 Input Voltage (V) 5.5 TJ = −40°C TJ = +25°C TJ = +85°C TJ = +125°C 1400 Dropout Voltage (mV) Dropout Voltage (mV) 1400 1200 1000 800 600 400 200 TPS70965 0 6.5 0 20 40 60 80 100 Output Current (mA) G009 Figure 6-9. Dropout Voltage vs VIN and Temperature 120 140 160 G010 Figure 6-10. Dropout Voltage vs IOUT and Temperature 500 500 Current Limit (mA) TJ = −40°C TJ = +25°C TJ = +85°C TJ = +125°C 450 Current Limit (mA) 10 25 40 55 70 85 100 115 130 Junction Temperature (°C) G008 400 350 300 TJ = −40°C TJ = +25°C TJ = +85°C TJ = +125°C 450 400 350 250 TPS70933 TPS70912 200 3 3.5 4 4.5 5 5.5 Input Voltage (V) 6 6.5 7 300 5 G011 Figure 6-11. 1.2-V Current Limit vs VIN and Temperature 5.5 6 6.5 7 Input Voltage (V) 7.5 8 8.5 G012 Figure 6-12. 3.3-V Current Limit vs VIN and Temperature Submit Document Feedback Copyright © 2021 Texas Instruments Incorporated Product Folder Links: TPS709 7 TPS709 www.ti.com SBVS186H – MARCH 2012 – REVISED JULY 2021 6.6 Typical Characteristics (continued) over operating temperature range (TJ = –40°C to 125°C), IOUT = 10 mA, VEN = 2 V, COUT = 2.2 μF, and VIN = VOUT(typ) + 1 V or 2.7 V (whichever is greater), unless otherwise noted; typical values are at TJ = 25°C 2 TJ = −40°C TJ = +25°C TJ = +85°C TJ = +125°C 450 TPS70965 Ground Pin Current (µA) Current Limit (mA) 500 400 350 1.8 1.5 1.2 1 TA = −40°C TA = +25°C TA = +85°C 0.8 TPS70912 300 8 8.5 9 9.5 10 10.5 Input Voltage (V) 11 11.5 0.5 12 2.5 Ground Pin Current (µA) Ground Pin Current (µA) 2 1.75 1.5 1.25 1 TA = −40°C TA = +25°C TA = +85°C TPS70933 EN = open 25 30 35 G014 0 5 10 15 20 Input Voltage (V) 25 30 TA = −40°C TA = +25°C TA = +85°C 500 400 300 200 100 TPS70912 0 35 0 20 40 G035 Figure 6-15. GND Current vs VIN and Temperature 60 80 100 Output Current (mA) 120 140 160 G015 Figure 6-16. GND Current vs IOUT and Temperature 100 0.4 TA = −40°C TA = +25°C TA = +85°C 0.3 80 PSRR (dB) Ground Pin Current (µA) 15 20 Input Voltage (V) 600 0.75 0.2 0.1 60 40 VOUT = 2.8 V VIN = 3.8 V COUT = 2.2 µF 20 Shutdown Current TPS70912 0 5 10 15 20 Input Voltage (V) 25 30 35 0 10 G016 Figure 6-17. Shutdown Current vs VIN and Temperature 8 10 Figure 6-14. GND Current vs VIN and Temperature 2.25 0 5 G013 Figure 6-13. 6.5-V Current Limit vs VIN and Temperature 0.5 0 100 1k 10k 100k Frequency (Hz) 1M 10M G017 Figure 6-18. Power-Supply Rejection Ratio vs Frequency Submit Document Feedback Copyright © 2021 Texas Instruments Incorporated Product Folder Links: TPS709 TPS709 www.ti.com SBVS186H – MARCH 2012 – REVISED JULY 2021 6.6 Typical Characteristics (continued) over operating temperature range (TJ = –40°C to 125°C), IOUT = 10 mA, VEN = 2 V, COUT = 2.2 μF, and VIN = VOUT(typ) + 1 V or 2.7 V (whichever is greater), unless otherwise noted; typical values are at TJ = 25°C 7 140 VOUT = 2.8 V 130 5 Time (µs) Voltage ( µV / Hz ) 6 4 3 2 120 110 1 0 10 100 1k Frequency (Hz) 10k 100k TPS70912 100 −50 −35 −20 −5 G018 Figure 6-19. Noise 10 25 40 55 70 Temperature (°C) 85 100 115 130 G019 Figure 6-20. Start-Up Time vs Temperature Channel 2 (200 mV / div) Channel 2 (200 mV / div) Channel 2 = VOUT Channel 4 = IOUT VIN = 2.7 V Channel 2 = VOUT Channel 4 = IOUT VIN = 2.7 V Channel 4 (50 mA / div) Channel 4 (100 mA / div) Time (100 ms / div) Time (500 ms / div) G020 G021 Figure 6-21. TPS70912 Load Transient (0 mA to 50 mA) Figure 6-22. TPS70912 Load Transient (1 mA to 150 mA) Channel 2 (200 mV / div) Channel 2 (200 mV / div) Channel 2 = VOUT Channel 4 = IOUT VIN = 2.7 V Channel 2 = VOUT Channel 4 = IOUT VIN = 2.7 V Channel 4 (100 mA / div) Channel 4 (50 mA / div) Time (100 ms / div) Time (10 ms / div) G023 G022 Figure 6-23. TPS70912 Load Transient (50 mA to 0 mA) Figure 6-24. TPS70912 Load Transient (50 mA to 150 mA) Submit Document Feedback Copyright © 2021 Texas Instruments Incorporated Product Folder Links: TPS709 9 TPS709 www.ti.com SBVS186H – MARCH 2012 – REVISED JULY 2021 6.6 Typical Characteristics (continued) over operating temperature range (TJ = –40°C to 125°C), IOUT = 10 mA, VEN = 2 V, COUT = 2.2 μF, and VIN = VOUT(typ) + 1 V or 2.7 V (whichever is greater), unless otherwise noted; typical values are at TJ = 25°C Channel 2 (200 mV / div) Channel 2 (200 mV / div) Channel 2 = VOUT Channel 4 = IOUT VIN = 4.3 V Channel 2 = VOUT Channel 4 = IOUT VIN = 4.3 V Channel 4 (100 mA / div) Channel 4 (50 mA / div) Time (500 ms / div) Time (100 ms / div) G025 G024 Figure 6-26. TPS70933 Load Transient (1 mA to 150 mA) Figure 6-25. TPS70933 Load Transient (0 mA to 50 mA) Channel 2 (200 mV / div) Channel 2 (200 mV / div) Channel 2 = VOUT Channel 4 = IOUT VIN = 4.3 V Channel 2 = VOUT Channel 4 = IOUT VIN = 4.3 V Channel 4 (50 mA / div) Channel 4 (50 mA / div) Time (10 ms / div) Time (500 ms / div) G026 G027 Figure 6-27. TPS70933 Load Transient (50 mA to 0 mA) Figure 6-28. TPS70933 Load Transient (50 mA to 150 mA) Channel 2 = VOUT Channel 4 = VIN IOUT = 10 mA Channel 2 = VOUT Channel 4 = VIN IOUT = 50 mA Channel 2 (50 mV / div) Channel 2 (50 mV / div) Channel 4 (2 V / div) Channel 4 (2 V / div) Time (50 ms / div) Time (50 ms / div) G028 Figure 6-29. TPS70912 Line Transient (2.7 V to 3.7 V) 10 G029 Figure 6-30. TPS70912 Line Transient (2.7 V to 3.7 V) Submit Document Feedback Copyright © 2021 Texas Instruments Incorporated Product Folder Links: TPS709 TPS709 www.ti.com SBVS186H – MARCH 2012 – REVISED JULY 2021 6.6 Typical Characteristics (continued) over operating temperature range (TJ = –40°C to 125°C), IOUT = 10 mA, VEN = 2 V, COUT = 2.2 μF, and VIN = VOUT(typ) + 1 V or 2.7 V (whichever is greater), unless otherwise noted; typical values are at TJ = 25°C Channel 2 = VOUT Channel 4 = VIN IOUT = 10 mA Channel 2 = VOUT Channel 4 = VIN IOUT = 50 mA Channel 2 (50 mV / div) Channel 2 (50 mV / div) Channel 4 (2 V / div) Channel 4 (2 V / div) Time (50 ms / div) Time (50 ms / div) G030 G031 Figure 6-31. TPS70933 Line Transient (4.3 V to 5.3 V) Figure 6-32. TPS70933 Line Transient (4.3 V to 5.3 V) Channel 1 = EN Channel 2 = VOUT VIN = 4.3 V COUT = 2.2 mF TPS70933 Channel 2 (1 V / div) Channel 2 (1 V / div) Channel 1 (500 mV / div) Channel 1 (1 V / div) Time (50 ms / div) Channel 1 = VIN Channel 2 = VOUT IOUT = 3 mA TPS70933 Time (500 ms / div) G032 G033 Figure 6-33. Power-Up With Enable Figure 6-34. Power-Up and Power-Down Response Channel 2 (1 V / div) Channel 1 (1 V / div) Channel 1 = VIN Channel 2 = VOUT IOUT = 150 mA TPS70933 Time (500 ms / div) G034 Figure 6-35. Power-Up and Power-Down Response Submit Document Feedback Copyright © 2021 Texas Instruments Incorporated Product Folder Links: TPS709 11 TPS709 www.ti.com SBVS186H – MARCH 2012 – REVISED JULY 2021 7 Detailed Description 7.1 Overview The TPS709 series of devices are ultra-low quiescent current, low-dropout (LDO) linear regulators. The TPS709 offers reverse current protection to block any discharge current from the output into the input. The TPS709 also features current limit and thermal shutdown for reliable operation. 7.2 Functional Block Diagram OUT IN Current Limit Thermal Shutdown EN Bandgap Logic Device GND 7.3 Feature Description 7.3.1 Internal Current Limit The TPS709 internal current limit helps protect the regulator during fault conditions. During current limit, the output sources a fixed amount of current that is largely independent of output voltage. In such a case, the output voltage is not regulated, and can be measured as (VOUT = ILIMIT × RLOAD). The PMOS pass transistor dissipates [(VIN – VOUT) × ILIMIT] until a thermal shutdown is triggered and the device turns off. When cool, the device is turned on by the internal thermal shutdown circuit. If the fault condition continues, the device cycles between current limit and thermal shutdown; see the Thermal Protection section for more details. The TPS709 is characterized over the recommended operating output current range up to 150 mA. The internal current limit begins to limit the output current at a minimum of 200 mA of output current. The TPS709 continues to operate for output currents between 150 mA and 200 mA but some data sheet parameters may not be met. 7.3.2 Dropout Voltage The TPS709 use a PMOS pass transistor to achieve low dropout voltage. When (VIN – VOUT) is less than the dropout voltage (VDO), the PMOS pass device is in the linear region of operation and the input-to-output resistance is the RDS(ON) of the PMOS pass element. VDO approximately scales with the output current because the PMOS device functions like a resistor in dropout. The ground pin current of many linear voltage regulators increases substantially when the device is operated in dropout. This increase in ground pin current while operating in dropout can be several orders of magnitude larger than when the device is not in dropout. The TPS709 employs a special control loop that limits the increase in ground pin current while operating in dropout. This functionality allows for the most efficient operation while in dropout conditions that can greatly increase battery run times. 12 Submit Document Feedback Copyright © 2021 Texas Instruments Incorporated Product Folder Links: TPS709 TPS709 www.ti.com SBVS186H – MARCH 2012 – REVISED JULY 2021 7.3.3 Undervoltage Lockout (UVLO) The TPS709 uses an undervoltage lockout (UVLO) circuit to keep the output shut off until the internal circuitry operates properly. 7.3.4 Reverse-Current Protection The TPS709 has integrated reverse-current protection. Reverse-current protection prevents the flow of current from the OUT pin to the IN pin when output voltage is higher than input voltage. The reverse-current protection circuitry places the power path in high impedance when the output voltage is higher than the input voltage. This setting reduces leakage current from the output to the input to 10 nA, typical. The reverse current protection is always active regardless of the enable pin logic state or if the OUT pin voltage is greater than 1.8 V. Reverse current can flow if the output voltage is less than 1.8 V and if input voltage is less than the output voltage. If voltage is applied to the input pin, then the maximum voltage that can be applied to the OUT pin is the lower of three times the nominal output voltage or 6.5 V. For example, if the 1.2-V output voltage version is used, then the maximum reverse bias voltage that can be applied to the OUT pin is 3.6 V. If the 5.0-V output voltage version is used, then the maximum reverse bias voltage that can be applied to the OUT pin is 6.5 V. 7.4 Device Functional Modes The TPS709 has the following functional modes: 1. Enabled: When the enable pin (EN) goes above 0.9 V, the device is enabled. EN is pulled high by a 300-nA current source; therefore, EN can be left floating to enable the device. Do not connect EN to VIN. The EN pin is clamped by a 6.5-V Zener diode. Do not exceed the 7-V absolute maximum rating on the enable pin or excessive current flowing into the Zener clamp will destroy the device. 2. Disabled: When EN goes below 0.4 V, the device is disabled. During this time, OUT is high impedance and the current into IN (I(SHUTDOWN)) is typically 150 nA. Submit Document Feedback Copyright © 2021 Texas Instruments Incorporated Product Folder Links: TPS709 13 TPS709 www.ti.com SBVS186H – MARCH 2012 – REVISED JULY 2021 8 Application and Implementation Note Information in the following applications sections is not part of the TI component specification, and TI does not warrant its accuracy or completeness. TI’s customers are responsible for determining suitability of components for their purposes, as well as validating and testing their design implementation to confirm system functionality. 8.1 Application Information The TPS709 is a series of devices that consume low quiescent current and deliver excellent line and load transient performance. This performance, combined with low noise and very good PSRR with little (VIN – VOUT) headroom, makes this device ideal for RF portable applications, current limit, and thermal protection. The TPS709 is specified from –40°C to +125°C. 8.1.1 Input and Output Capacitor The TPS709 devices are stable with output capacitors with an effective capacitance of 2.0 μF or greater for output voltages below 1.5 V. For output voltages equal or greater than 1.5 V, the minimum effective capacitance for stability is 1.5 µF. The maximum capacitance for stability is 47 µF. The equivalent series resistance (ESR) of the output capacitor must be between 0 Ω and 0.2 Ω for stability. The effective capacitance is the minimum capacitance value of a capacitor after taking into account variations resulting from tolerances, temperature, and dc bias effects. X5R- and X7R-type ceramic capacitors are recommended because these capacitors have minimal variation in value and ESR over temperature. Although an input capacitor is not required for stability, good analog design practice is to connect a 0.1-µF to 2.2-µF capacitor from IN to GND. This capacitor counteracts reactive input sources and improves transient response, input ripple, and PSRR. An input capacitor is necessary if line transients greater than 10 V in magnitude are anticipated. 8.1.2 Transient Response As with any regulator, increasing the output capacitor size reduces over- and undershoot magnitude, but increases transient response duration. 8.2 Typical Application VIN IN VOUT OUT 1 mF 2.2 mF GND TPS70933 EN NC Figure 8-1. Wide Input, 3.3-V, Low-IQ Rail 8.2.1 Design Requirements Table 8-1 summarizes the design requirements for Figure 8-1. Table 8-1. Design Requirements for a Wide Input, 3.3-V, Low-IQ Rail Application 14 PARAMETER DESIGN SPECIFICATION VIN 5 V to 20 V VOUT 3.3 V I(IN) (no load) < 5 μA IOUT (max) 150 mA Submit Document Feedback Copyright © 2021 Texas Instruments Incorporated Product Folder Links: TPS709 TPS709 www.ti.com SBVS186H – MARCH 2012 – REVISED JULY 2021 8.2.2 Detailed Design Procedure Select a 2.2-µF, 10-V X7R output capacitor to satisfy the minimum output capacitance requirement with a 3.3-V dc bias. Select a 1.0-µF, 25-V X7R input capacitor to provide input noise filtering and eliminate high-frequency voltage transients. 8.2.3 Application Curves Channel 2 (200 mV / div) Channel 1 = EN Channel 2 = VOUT VIN = 4.3 V COUT = 2.2 mF TPS70933 Channel 2 (1 V / div) Channel 2 = VOUT Channel 4 = IOUT VIN = 4.3 V Channel 1 (500 mV / div) Channel 4 (50 mA / div) Time (500 ms / div) Time (50 ms / div) G027 Figure 8-2. TPS70933 Load Transient (50 mA to 150 mA) G032 Figure 8-3. Power-Up With Enable 9 Power Supply Recommendations This device is designed to operate with an input supply range of 2.7 V to 30 V. If the input supply is noisy, additional input capacitors with low ESR can help improve output noise performance. 9.1 Power Dissipation The ability to remove heat from the die is different for each package type, presenting different considerations in the printed circuit board (PCB) layout. The PCB area around the device that is free of other components moves the heat from the device to ambient air. Performance data for JEDEC low and high-K boards are given in the Thermal Information table. Using heavier copper increases the effectiveness in removing heat from the device. The addition of plated through-holes to heat-dissipating layers also improves the heat sink effectiveness. Power dissipation depends on input voltage and load conditions. Power dissipation (PDISS) is equal to the product of the output current and the voltage drop across the output pass element, as shown in Equation 1: PDISS = (VIN – VOUT) × IOUT (1) Submit Document Feedback Copyright © 2021 Texas Instruments Incorporated Product Folder Links: TPS709 15 TPS709 www.ti.com SBVS186H – MARCH 2012 – REVISED JULY 2021 10 Layout 10.1 Layout Guidelines Place input and output capacitors as close to the device pins as possible. To improve ac performance (such as PSRR, output noise, and transient response), TI recommends that the board be designed with separate ground planes for VIN and VOUT, with the ground plane connected only at the GND pin of the device. In addition, the ground connection for the output capacitor must be connected directly to the device GND pin. 10.1.1 Thermal Protection Thermal protection disables the output when the junction temperature rises to approximately 165°C, allowing the device to cool. When the junction temperature cools to approximately 145°C, the output circuitry is again enabled. Depending on power dissipation, thermal resistance, and ambient temperature, the thermal protection circuit can cycle on and off. This cycling limits the dissipation of the regulator, protecting it from damage as a result of overheating. Any tendency to activate the thermal protection circuit indicates excessive power dissipation or an inadequate heat sink. For reliable operation, limit junction temperature to 125°C, maximum. To estimate the margin of safety in a complete design (including heat sink), increase the ambient temperature until the thermal protection is triggered; use worst-case loads and signal conditions. For good reliability, thermal protection must trigger at least 35°C above the maximum expected ambient condition of the particular application. This configuration produces a worst-case junction temperature of 125°C at the highest expected ambient temperature and worst-case load. The TPS709 internal protection circuitry is designed to protect against overload conditions. This circuitry is not intended to replace proper heat sinking. Continuously running the TPS709 into thermal shutdown degrades device reliability. 10.2 Layout Example VOUT VIN 1 CIN 5 COUT 2 3 4 GND PLANE Represents via used for application specific connections Figure 10-1. Layout Example for DBV Package 16 Submit Document Feedback Copyright © 2021 Texas Instruments Incorporated Product Folder Links: TPS709 TPS709 www.ti.com SBVS186H – MARCH 2012 – REVISED JULY 2021 11 Device and Documentation Support 11.1 Device Support 11.1.1 Development Support 11.1.1.1 Evaluation Modules An evaluation module (EVM) is available to assist in the initial circuit performance evaluation using the TPS709xx. The TPS70933EVM-110 evaluation module (and related user guide) can be requested at the Texas Instruments website through the product folders or purchased directly from the TI eStore. 11.1.1.2 Spice Models Computer simulation of circuit performance using SPICE is often useful when analyzing the performance of analog circuits and systems. A SPICE model for the TPS709 is available through the product folders under Simulation Models. 11.1.2 Device Nomenclature Table 11-1. Device Nomenclature(1) (1) PRODUCT VOUT TPS709xx(x) yyy z or TPS709xx(x) yyy zM3 XX(X) is the nominal output voltage. For output voltages with a resolution of 100 mV, two digits are used in the ordering number; otherwise, three digits are used (for example, 28 = 2.8 V; 125 = 1.25 V). YYY is the package designator. Z is the tape and reel quantity (R = 3000, T = 250). M3 suffix device has same electrical specs as other devices and shares same design. For the most current package and ordering information see the Package Option Addendum at the end of this document, or see the TI web site at www.ti.com. 11.2 Documentation Support 11.2.1 Related Documentation For related documentation see the following: Texas Instruments, TPS70933EVM-110 Evaluation Module user guide 11.3 Support Resources TI E2E™ support forums are an engineer's go-to source for fast, verified answers and design help — straight from the experts. Search existing answers or ask your own question to get the quick design help you need. Linked content is provided "AS IS" by the respective contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of Use. 11.4 Trademarks TI E2E™ is a trademark of Texas Instruments. All trademarks are the property of their respective owners. 11.5 Electrostatic Discharge Caution This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications. 11.6 Glossary TI Glossary This glossary lists and explains terms, acronyms, and definitions. Submit Document Feedback Copyright © 2021 Texas Instruments Incorporated Product Folder Links: TPS709 17 TPS709 www.ti.com SBVS186H – MARCH 2012 – REVISED JULY 2021 12 Mechanical, Packaging, and Orderable Information The following pages include mechanical, packaging, and orderable information. This information is the most current data available for the designated devices. This data is subject to change without notice and revision of this document. For browser-based versions of this data sheet, refer to the left-hand navigation. 18 Submit Document Feedback Copyright © 2021 Texas Instruments Incorporated Product Folder Links: TPS709 PACKAGE OPTION ADDENDUM www.ti.com 6-Dec-2022 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan (2) Lead finish/ Ball material MSL Peak Temp Op Temp (°C) Device Marking (3) Samples (4/5) (6) TPS70912DBVR ACTIVE SOT-23 DBV 5 3000 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 125 SCX Samples TPS70912DBVT ACTIVE SOT-23 DBV 5 250 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 125 SCX Samples TPS70912DRVR ACTIVE WSON DRV 6 3000 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 125 SCX Samples TPS70912DRVT ACTIVE WSON DRV 6 250 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 125 SCX Samples TPS709135DBVR ACTIVE SOT-23 DBV 5 3000 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 125 SCY Samples TPS709135DBVT ACTIVE SOT-23 DBV 5 250 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 125 SCY Samples TPS70915DBVR ACTIVE SOT-23 DBV 5 3000 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 125 SIM Samples TPS70915DBVT ACTIVE SOT-23 DBV 5 250 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 125 SIM Samples TPS70915DRVR ACTIVE WSON DRV 6 3000 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 125 SIM Samples TPS70915DRVT ACTIVE WSON DRV 6 250 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 125 SIM Samples TPS70916DBVR ACTIVE SOT-23 DBV 5 3000 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 125 SCZ Samples TPS70916DBVT ACTIVE SOT-23 DBV 5 250 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 125 SCZ Samples TPS70918DBVR ACTIVE SOT-23 DBV 5 3000 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 125 SDA Samples TPS70918DBVT ACTIVE SOT-23 DBV 5 250 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 125 SDA Samples TPS70918DRVR ACTIVE WSON DRV 6 3000 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 125 SDA Samples TPS70918DRVRM3 ACTIVE WSON DRV 6 3000 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 125 SDA Samples TPS70918DRVT ACTIVE WSON DRV 6 250 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 125 SDA Samples TPS70919DBVR ACTIVE SOT-23 DBV 5 3000 RoHS & Green NIPDAU | SN Level-1-260C-UNLIM -40 to 125 SDB Samples TPS70919DBVT ACTIVE SOT-23 DBV 5 250 RoHS & Green NIPDAU | SN Level-1-260C-UNLIM -40 to 125 SDB Samples TPS70925DBVR ACTIVE SOT-23 DBV 5 3000 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 125 SDC Samples Addendum-Page 1 PACKAGE OPTION ADDENDUM www.ti.com Orderable Device 6-Dec-2022 Status (1) Package Type Package Pins Package Drawing Qty Eco Plan (2) Lead finish/ Ball material MSL Peak Temp Op Temp (°C) Device Marking (3) Samples (4/5) (6) TPS70925DBVT ACTIVE SOT-23 DBV 5 250 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 125 SDC Samples TPS70925DRVR ACTIVE WSON DRV 6 3000 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 125 SDC Samples TPS70925DRVT ACTIVE WSON DRV 6 250 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 125 SDC Samples TPS70927DBVR ACTIVE SOT-23 DBV 5 3000 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 125 SDD Samples TPS70927DBVT ACTIVE SOT-23 DBV 5 250 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 125 SDD Samples TPS70928DBVR ACTIVE SOT-23 DBV 5 3000 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 125 SDE Samples TPS70928DBVT ACTIVE SOT-23 DBV 5 250 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 125 SDE Samples TPS70930DBVR ACTIVE SOT-23 DBV 5 3000 RoHS & Green NIPDAU | SN Level-1-260C-UNLIM -40 to 125 SDF Samples TPS70930DBVT ACTIVE SOT-23 DBV 5 250 RoHS & Green NIPDAU | SN Level-1-260C-UNLIM -40 to 125 SDF Samples TPS70930DRVR ACTIVE WSON DRV 6 3000 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 125 SDF Samples TPS70930DRVT ACTIVE WSON DRV 6 250 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 125 SDF Samples TPS70933DBVR ACTIVE SOT-23 DBV 5 3000 RoHS & Green NIPDAU | SN Level-1-260C-UNLIM -40 to 125 SDG Samples TPS70933DBVT ACTIVE SOT-23 DBV 5 250 RoHS & Green NIPDAU | SN Level-1-260C-UNLIM -40 to 125 SDG Samples TPS70933DRVR ACTIVE WSON DRV 6 3000 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 125 SDG Samples TPS70933DRVRM3 ACTIVE WSON DRV 6 3000 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 125 SDG Samples TPS70933DRVT ACTIVE WSON DRV 6 250 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 125 SDG Samples TPS70936DBVR ACTIVE SOT-23 DBV 5 3000 RoHS & Green NIPDAU | SN Level-1-260C-UNLIM -40 to 125 SEJ Samples TPS70936DBVT ACTIVE SOT-23 DBV 5 250 RoHS & Green NIPDAU | SN Level-1-260C-UNLIM -40 to 125 SEJ Samples TPS70936DRVR ACTIVE WSON DRV 6 3000 RoHS & Green NIPDAU Level-2-260C-1 YEAR -40 to 125 1FV Samples TPS70938DBVR ACTIVE SOT-23 DBV 5 3000 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 125 SIC Samples TPS70938DBVT ACTIVE SOT-23 DBV 5 250 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 125 SIC Samples Addendum-Page 2 PACKAGE OPTION ADDENDUM www.ti.com Orderable Device 6-Dec-2022 Status (1) Package Type Package Pins Package Drawing Qty Eco Plan (2) Lead finish/ Ball material MSL Peak Temp Op Temp (°C) Device Marking (3) Samples (4/5) (6) TPS70939DBVR ACTIVE SOT-23 DBV 5 3000 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 125 SID Samples TPS70939DBVT ACTIVE SOT-23 DBV 5 250 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 125 SID Samples TPS70950DBVR ACTIVE SOT-23 DBV 5 3000 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 125 SDH Samples TPS70950DBVT ACTIVE SOT-23 DBV 5 250 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 125 SDH Samples TPS70950DRVR ACTIVE WSON DRV 6 3000 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 125 SDH Samples TPS70950DRVRM3 ACTIVE WSON DRV 6 3000 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 125 SDH Samples TPS70950DRVT ACTIVE WSON DRV 6 250 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 125 SDH Samples TPS70960DBVR ACTIVE SOT-23 DBV 5 3000 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 125 SIT Samples TPS70960DBVT ACTIVE SOT-23 DBV 5 250 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 125 SIT Samples TPS709A30DBVR ACTIVE SOT-23 DBV 5 3000 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 125 11RF Samples TPS709A30DBVT ACTIVE SOT-23 DBV 5 250 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 125 11RF Samples TPS709A33DBVR ACTIVE SOT-23 DBV 5 3000 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 125 11SF Samples TPS709A33DBVT ACTIVE SOT-23 DBV 5 250 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 125 11SF Samples TPS709B33DBVR ACTIVE SOT-23 DBV 5 3000 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 125 13C7 Samples TPS709B33DBVT ACTIVE SOT-23 DBV 5 250 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 125 13C7 Samples TPS709B345DBVR ACTIVE SOT-23 DBV 5 3000 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 125 1XSW Samples TPS709B50DBVR ACTIVE SOT-23 DBV 5 3000 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 125 13D7 Samples TPS709B50DBVT ACTIVE SOT-23 DBV 5 250 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 125 13D7 Samples (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. Addendum-Page 3 PACKAGE OPTION ADDENDUM www.ti.com 6-Dec-2022 OBSOLETE: TI has discontinued the production of the device. (2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may reference these types of products as "Pb-Free". RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption. Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of
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