TPS70933EVM-110

User's Guide SLVU689A – June 2011 – Revised September 2012 TPS709xxEVM-110 Evaluation Module This User’s Guide describes the operational use of the TPS709xxEVM-110 Evaluation Module (EVM) as a reference design for engineering demonstration and evaluation of the TPS709xx, low dropout linear regulator (LDO). Included in this user’s guide are setup instructions, a schematic diagram, board layout, thermal guidelines, a bill of materials, and test results. 1 2 3 4 5 6 Contents Introduction .................................................................................................................. Setup ......................................................................................................................... 2.1 Input/Output Connectors and Jumper Descriptions ........................................................... 2.2 Equipment Setup ................................................................................................... Operation ..................................................................................................................... Test Results ................................................................................................................. 4.1 Turn-on Waveform ................................................................................................. 4.2 Turn-off Waveform ................................................................................................. 4.3 Load Transient Waveform ........................................................................................ 4.4 PSRR ................................................................................................................ Thermal Guidelines and Layout Recommendations ................................................................... Board Layout ................................................................................................................ 2 2 2 2 2 3 3 4 4 5 6 6 List of Figures .............................................. 1 Turn-on Waveforms Into Full Load (22 Ω) of the TPS70933EVM-110 2 Turn-off Waveforms of the TPS70933EVM-110 ........................................................................ 4 3 Load Step and Transient Response of the TPS70933EVM-110 4 PSRR of the TPS70933EVM for Various Output Currents ............................................................ 5 5 PSRR of the TPS70933EVM for Various Input Voltages .............................................................. 5 6 TPS709xxEVM-110 Assembly Layer ..................................................................................... 6 7 TPS709xxEVM-110 Top Layer Routing .................................................................................. 6 8 TPS709xxEVM-110 Bottom Layer Routing .............................................................................. 7 9 TPS709xxEVM-110 Schematic ..................................................... ........................................................................................... 3 4 7 List of Tables 1 Thermal Resistance, θJA, and Maximum Power Dissipation........................................................... 6 2 TPS709xxEVM-110 Bill of Materials...................................................................................... 7 SLVU689A – June 2011 – Revised September 2012 Submit Documentation Feedback TPS709xxEVM-110 Evaluation Module Copyright © 2011–2012, Texas Instruments Incorporated 1 Introduction 1 www.ti.com Introduction The TI TPS709xxEVM-110 Evaluation Module (EVM) helps design engineers evaluate the operation and performance of the TPS709xx family of linear regulators for possible use in their own circuit application. This EVM configuration contains a single linear regulator with internal thermal protection, reverse current protection, and overcurrent protection in a SOT23-5 package. The regulator is capable of delivering up to 150 mA to the load, depending on the input-output power dissipation across the part which can be minimized because of the low dropout voltage. The input and output capacitors for the TPS709xx must be 2.2 µF (effective minimum) for stability. An additional input capacitor connection is added to the EVM if smaller, lower voltage capacitors are desired. 2 Setup This section describes the jumpers and connectors on the EVM as well as how to properly connect, setup, and use the TPS709xxEVM-110. 2.1 Input/Output Connectors and Jumper Descriptions 2.1.1 J1 – VIN J1 is the input power supply voltage connector. The positive input lead and ground return lead from the input power supply should be twisted and kept as short as possible to minimize EMI transmission. Additional bulk capacitance should be added between J1 and J2 if the supply leads are greater than six inches. For example, an additional 47-µF electrolytic capacitor connected from J1 to ground eliminates unwanted ringing on the input due to long wires. 2.1.2 J2 – GND J2 is the return connector for the input power supply. 2.1.3 J3 – EN This jumper enables or disables the output of the TPS709xx. Placing a shorting jumper between pins 1 and 2 (OFF position) disables the TPS709xx. There is a pull-up resistor connected internally in the device; therefore, removing the jumper enables the TPS709xx. The maximum rating of EN is 7 V. If EN is connected to VIN or an external voltage source, be sure EN does not exceed 7 V. 2.1.4 J4 – VOUT J4 is the regulated output voltage connector. 2.1.5 J5 – GND J5, the return connector for VOUT, is connected to J2 on the PCB. 2.2 Equipment Setup • • 3 Operation • • 2 Set the power supply voltage to the desired operating input voltage. Turn the power supply off. Connect the positive voltage lead from the power supply to J1 (VIN). Connect the ground lead from the power supply to J2 (GND). Connect a 0- to 150-mA load between J4 (VOUT) and J5 (GND). Turn on the power supply. Vary the respective load and input voltage as necessary, for test purposes. TPS709xxEVM-110 Evaluation Module SLVU689A – June 2011 – Revised September 2012 Submit Documentation Feedback Copyright © 2011–2012, Texas Instruments Incorporated Test Results www.ti.com 4 Test Results This section provides typical performance waveforms for the EVM. Actual performance data is affected by measurement techniques and environmental variables; therefore, these curves are presented for reference and may differ from actual results obtained. 4.1 Turn-on Waveform Figure 1 shows the turn-on characteristic, where 5 V is applied to VIN. The output drives a 22-Ω load (full load). Figure 1. Turn-on Waveforms Into Full Load (22 Ω) of the TPS70933EVM-110 SLVU689A – June 2011 – Revised September 2012 Submit Documentation Feedback TPS709xxEVM-110 Evaluation Module Copyright © 2011–2012, Texas Instruments Incorporated 3 Test Results 4.2 www.ti.com Turn-off Waveform Figure 2 shows the turn-off characteristic, where 5 V is applied to VIN. The output drives a 22-Ω load. Figure 2. Turn-off Waveforms of the TPS70933EVM-110 4.3 Load Transient Waveform Figure 3 shows the load transient response for a load-step transient from 15 mA to 135 mA, where 5 V is applied to VIN. Figure 3. Load Step and Transient Response of the TPS70933EVM-110 4 TPS709xxEVM-110 Evaluation Module SLVU689A – June 2011 – Revised September 2012 Submit Documentation Feedback Copyright © 2011–2012, Texas Instruments Incorporated Test Results www.ti.com 4.4 PSRR Figure 4 shows the PSRR of the TPS70933EVM-110 at different load currents and Figure 5 shows the PSRR of the TPS70933EVM-110 at different input voltages. Figure 4. PSRR of the TPS70933EVM for Various Output Currents 100 VIN = 4.3 V VIN = 5.0 V VIN = 7.0 V VIN = 10 V 90 80 PSRR (dB) 70 60 50 40 30 20 10 0 10 100 1k 10k 100k Frequency (Hz) 1M 10M G002 Figure 5. PSRR of the TPS70933EVM for Various Input Voltages SLVU689A – June 2011 – Revised September 2012 Submit Documentation Feedback TPS709xxEVM-110 Evaluation Module Copyright © 2011–2012, Texas Instruments Incorporated 5 Thermal Guidelines and Layout Recommendations 5 www.ti.com Thermal Guidelines and Layout Recommendations Thermal management is a key component in the design of any power converter and is especially important when the power dissipation in the LDO is high. Use the following formula to approximate the maximum power dissipation for the ambient temperature: TJ = TA + PD × θJA Where TJ is the junction temperature, TA is the ambient temperature, PD is the power dissipation in the device (Watts), and θJA is the thermal resistance from junction to ambient. All temperatures are in degrees Celsius. The maximum operating junction temperature, TJ, must not be allowed to exceed 125°C. The layout design must be copper trace and plane areas smartly, as thermal sinks, in order to not allow TJ to exceed the absolute maximum rating under all temperature and voltage conditions across the part. Table 1 repeats information from the Dissipation Ratings Table of the TPS709xx-series datasheet for comparison with the thermal resistance, θJA, for High-K JEDEC standard boards. The maximum input voltage can be calculated for full loads at different ambient temperatures. The input voltage must be less than these values in order to maintain a safe junction temperature. Table 1. Thermal Resistance, θJA, and Maximum Power Dissipation Package θJA Max VIN @ 150 mA (TA = 25°C) Max VIN @ 150 mA (TA = 70°C) DBV 212°C/W 6.4 V 5.0 V Board Layout J1 C3 C1 J2 J4 J3 U1 C2 6 Board High-K J5 Figure 6. TPS709xxEVM-110 Assembly Layer Figure 7. TPS709xxEVM-110 Top Layer Routing 6 TPS709xxEVM-110 Evaluation Module SLVU689A – June 2011 – Revised September 2012 Submit Documentation Feedback Copyright © 2011–2012, Texas Instruments Incorporated Board Layout www.ti.com Figure 8. TPS709xxEVM-110 Bottom Layer Routing Figure 9. TPS709xxEVM-110 Schematic Table 2. TPS709xxEVM-110 Bill of Materials Count RefDes Value Description Size Part Number MFR 1 C1 2.2 µF Capacitor, ceramic chip, 50 V, X7R, ±10% 1210 STD STD 1 C2 2.2 µF Capacitor, ceramic chip, 6.3 V, X7R, ±10% 0603 STD STD 0 C3 DNP Capacitor, ceramic chip 0603 STD STD 5 J1-5 PEC02SAAN 0.100 in × 2 PEC02SAAN Sullins 1 U1 TPS70933DBV IC, 150 mA, ultra-low IQ, 1-µA LDO regulator with enable SOT-23 TPS709xxDBV TI 1 J3 Shunt, black 100 mil 929950-00 3M 1 – PWR110 Any Notes: – Header, Male 2-pin, 100mil spacing PCB, 1.20 in × 1.30 in × 0.062 in 1. These assemblies are ESD sensitive, observe ESD precautions. 2. These assemblies must be clean and free from flux and all contaminants. Use of no-clean flux is not acceptable. 3. These assemblies must comply with workmanship standards IPC-A-610 Class 2. 4. Ref designators marked with an asterisk ('**') cannot be substituted. All other components can be substituted with equivalent MFG's components. spacer SLVU689A – June 2011 – Revised September 2012 Submit Documentation Feedback TPS709xxEVM-110 Evaluation Module Copyright © 2011–2012, Texas Instruments Incorporated 7 Evaluation Board/Kit Important Notice Texas Instruments (TI) provides the enclosed product(s) under the following conditions: This evaluation board/kit is intended for use for ENGINEERING DEVELOPMENT, DEMONSTRATION, OR EVALUATION PURPOSES ONLY and is not considered by TI to be a finished end-product fit for general consumer use. Persons handling the product(s) must have electronics training and observe good engineering practice standards. As such, the goods being provided are not intended to be complete in terms of required design-, marketing-, and/or manufacturing-related protective considerations, including product safety and environmental measures typically found in end products that incorporate such semiconductor components or circuit boards. This evaluation board/kit does not fall within the scope of the European Union directives regarding electromagnetic compatibility, restricted substances (RoHS), recycling (WEEE), FCC, CE or UL, and therefore may not meet the technical requirements of these directives or other related directives. Should this evaluation board/kit not meet the specifications indicated in the User’s Guide, the board/kit may be returned within 30 days from the date of delivery for a full refund. THE FOREGOING WARRANTY IS THE EXCLUSIVE WARRANTY MADE BY SELLER TO BUYER AND IS IN LIEU OF ALL OTHER WARRANTIES, EXPRESSED, IMPLIED, OR STATUTORY, INCLUDING ANY WARRANTY OF MERCHANTABILITY OR FITNESS FOR ANY PARTICULAR PURPOSE. The user assumes all responsibility and liability for proper and safe handling of the goods. Further, the user indemnifies TI from all claims arising from the handling or use of the goods. Due to the open construction of the product, it is the user’s responsibility to take any and all appropriate precautions with regard to electrostatic discharge. EXCEPT TO THE EXTENT OF THE INDEMNITY SET FORTH ABOVE, NEITHER PARTY SHALL BE LIABLE TO THE OTHER FOR ANY INDIRECT, SPECIAL, INCIDENTAL, OR CONSEQUENTIAL DAMAGES. TI currently deals with a variety of customers for products, and therefore our arrangement with the user is not exclusive. TI assumes no liability for applications assistance, customer product design, software performance, or infringement of patents or services described herein. Please read the User’s Guide and, specifically, the Warnings and Restrictions notice in the User’s Guide prior to handling the product. This notice contains important safety information about temperatures and voltages. For additional information on TI’s environmental and/or safety programs, please contact the TI application engineer or visit www.ti.com/esh. No license is granted under any patent right or other intellectual property right of TI covering or relating to any machine, process, or combination in which such TI products or services might be or are used. FCC Warning This evaluation board/kit is intended for use for ENGINEERING DEVELOPMENT, DEMONSTRATION, OR EVALUATION PURPOSES ONLY and is not considered by TI to be a finished end-product fit for general consumer use. It generates, uses, and can radiate radio frequency energy and has not been tested for compliance with the limits of computing devices pursuant to part 15 of FCC rules, which are designed to provide reasonable protection against radio frequency interference. Operation of this equipment in other environments may cause interference with radio communications, in which case the user at his own expense will be required to take whatever measures may be required to correct this interference. EVM Warnings and Restrictions It is important to operate this EVM within the input voltage range of -22 V to 0.3 V and the output voltage range of -20 V to -3 V . Exceeding the specified input range may cause unexpected operation and/or irreversible damage to the EVM. If there are questions concerning the input range, please contact a TI field representative prior to connecting the input power. Applying loads outside of the specified output range may result in unintended operation and/or possible permanent damage to the EVM. Please consult the EVM User's Guide prior to connecting any load to the EVM output. If there is uncertainty as to the load specification, please contact a TI field representative. During normal operation, some circuit components may have case temperatures greater than 125° C. The EVM is designed to operate properly with certain components above 125° C as long as the input and output ranges are maintained. These components include but are not limited to linear regulators, switching transistors, pass transistors, and current sense resistors. These types of devices can be identified using the EVM schematic located in the EVM User's Guide. When placing measurement probes near these devices during operation, please be aware that these devices may be very warm to the touch. Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265 Copyright © 2012, Texas Instruments Incorporated IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. All semiconductor products (also referred to herein as “components”) are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment. TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI’s terms and conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarily performed. TI assumes no liability for applications assistance or the design of Buyers’ products. Buyers are responsible for their products and applications using TI components. To minimize the risks associated with Buyers’ products and applications, Buyers should provide adequate design and operating safeguards. TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or other intellectual property right relating to any combination, machine, or process in which TI components or services are used. Information published by TI regarding third-party products or services does not constitute a license to use such products or services or a warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI. Reproduction of significant portions of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties, conditions, limitations, and notices. TI is not responsible or liable for such altered documentation. Information of third parties may be subject to additional restrictions. Resale of TI components or services with statements different from or beyond the parameters stated by TI for that component or service voids all express and any implied warranties for the associated TI component or service and is an unfair and deceptive business practice. TI is not responsible or liable for any such statements. Buyer acknowledges and agrees that it is solely responsible for compliance with all legal, regulatory and safety-related requirements concerning its products, and any use of TI components in its applications, notwithstanding any applications-related information or support that may be provided by TI. Buyer represents and agrees that it has all the necessary expertise to create and implement safeguards which anticipate dangerous consequences of failures, monitor failures and their consequences, lessen the likelihood of failures that might cause harm and take appropriate remedial actions. Buyer will fully indemnify TI and its representatives against any damages arising out of the use of any TI components in safety-critical applications. In some cases, TI components may be promoted specifically to facilitate safety-related applications. With such components, TI’s goal is to help enable customers to design and create their own end-product solutions that meet applicable functional safety standards and requirements. Nonetheless, such components are subject to these terms. No TI components are authorized for use in FDA Class III (or similar life-critical medical equipment) unless authorized officers of the parties have executed a special agreement specifically governing such use. Only those TI components which TI has specifically designated as military grade or “enhanced plastic” are designed and intended for use in military/aerospace applications or environments. Buyer acknowledges and agrees that any military or aerospace use of TI components which have not been so designated is solely at the Buyer's risk, and that Buyer is solely responsible for compliance with all legal and regulatory requirements in connection with such use. TI has specifically designated certain components which meet ISO/TS16949 requirements, mainly for automotive use. Components which have not been so designated are neither designed nor intended for automotive use; and TI will not be responsible for any failure of such components to meet such requirements. Products Applications Audio www.ti.com/audio Automotive and Transportation www.ti.com/automotive Amplifiers amplifier.ti.com Communications and Telecom www.ti.com/communications Data Converters dataconverter.ti.com Computers and Peripherals www.ti.com/computers DLP® Products www.dlp.com Consumer Electronics www.ti.com/consumer-apps DSP dsp.ti.com Energy and Lighting www.ti.com/energy Clocks and Timers www.ti.com/clocks Industrial www.ti.com/industrial Interface interface.ti.com Medical www.ti.com/medical Logic logic.ti.com Security www.ti.com/security Power Mgmt power.ti.com Space, Avionics and Defense www.ti.com/space-avionics-defense Microcontrollers microcontroller.ti.com Video and Imaging www.ti.com/video RFID www.ti-rfid.com OMAP Applications Processors www.ti.com/omap TI E2E Community e2e.ti.com Wireless Connectivity www.ti.com/wirelessconnectivity Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265 Copyright © 2012, Texas Instruments Incorporated