User's Guide
SBVU031 – August 2016
TPS7A1901EVM-760 Evaluation Module
This user’s guide describes the operational use of the TPS7A1901EVM-760 evaluation module (EVM) as
a reference design for engineering demonstration and evaluation of the TPS7A1901DRB, low-dropout
linear regulator (LDO). Included in this user’s guide are setup and operating instructions, thermal and
layout guidelines, a printed circuit board (PCB) layout, a schematic diagram, and a bill of materials (BOM).
Throughout this document, the terms demonstration kit, evaluation board, and evaluation module are
synonymous with the TPS7A1901EVM-760.
The related documents listed in Table 1 are available through the Texas Instruments website at
www.ti.com.
Related Documentation
SBVU031 – August 2016
Submit Documentation Feedback
Device
Literature Number
TPS7A19
SBVS256
TPS7A1901EVM-760 Evaluation Module
Copyright © 2016, Texas Instruments Incorporated
1
Introduction
1
www.ti.com
Introduction
The TPS7A1901EVM-760 (made by Texas Instruments) helps design engineers evaluate the operation
and performance of the TPS7A19 family of linear regulators for possible use in their own circuit
application. This particular EVM configuration contains a single 40-V, low-IQ linear regulator for industrial
systems. The regulator is capable of delivering up to 450 mA to the load with a wide VIN range. For
stability, use a 20-µF (or larger) output capacitor for the TPS7A19 device.
1.1
Before You Begin
The following warnings and cautions are noted for the safety of anyone using or working close to the
TPS7A1901EVM-760. Observe all safety precautions.
Warning
Warning: Hot Surface. Contact may cause burns. Do not touch.
CAUTION
The circuit module may be damaged by overtemperature. To avoid damage,
monitor the temperature during evaluation and provide cooling, as needed, for
your system environment.
CAUTION
Some power supplies can be damaged by application of external voltages. If
using more than one power supply, check your equipment requirements and
use blocking diodes or other isolation techniques, as needed, to prevent
damage to your equipment.
CAUTION
The circuit module is not a finished product or electrical appliance. The module
does not contain current or voltage thresholds for circuit protection. It must be
used by qualified personnel with additional equipment for evaluation only.
2
TPS7A1901EVM-760 Evaluation Module
Copyright © 2016, Texas Instruments Incorporated
SBVU031 – August 2016
Submit Documentation Feedback
EVM Setup
www.ti.com
2
EVM Setup
This section describes how to properly connect and setup the TPS7A1901EVM-760, including the jumpers
and connectors on the EVM board.
2.1
2.1.1
Input/Output Connectors and Jumper Descriptions
J1 – VIN
Input power-supply voltage connector. Twist together the positive input lead and ground return lead from
the input power supply, and keep them as short as possible to minimize input inductance. Add additional
bulk capacitance between the input supply and ground (use the C1 footprint) if the supply leads are
greater than six inches. For example, an additional 47-µF electrolytic capacitor connected from the input
supply (J1) to ground can improve the transient response of the TPS7A19 device, and eliminates
unwanted ringing on the input because of long wire connections.
2.1.2
J2 – VOUT
Regulated output voltage connector.
2.1.3
J3 – RESET (PG)
Pullup-voltage selector for RESET (PG). RESET on the EVM refers to the power good (PG) functionality
of TPS7A19 device. This EVM is designed so that RESET (PG) can be pulled up to VOUT by shorting J3,
or pulled up to another voltage by applying an external voltage to TP3.
2.1.4
J4 – Resistor Divider
For convenience, the TPS7A1901EVM-760 is designed with two prepopulated feedback resistor dividers.
Table 1 lists the connections for choosing between the dividers.
Table 1. J4 Connector Selections
Short Pins
2.1.5
Resistors (kΩ)
Nominal
Output Voltage
RTop
RBottom
1 and 2
30.9
10.0
5.0 V
2 and 3
16.9
10.0
3.3 V
J5 – EN
Output enable. For convenience, the TPS7A1901EVM-760 is designed to allow EN to be tied to VDD or
GND. Table 2 lists the connection options.
Table 2. J5 Connector Selections
2.1.6
Short Pins
EN Voltage
Output Condition
1 and 2
GND
Disabled
2 and 3
VIN
Enabled
J6– GND
Input ground return connector.
2.1.7
J7 – GND
Output ground return connector.
SBVU031 – August 2016
Submit Documentation Feedback
TPS7A1901EVM-760 Evaluation Module
Copyright © 2016, Texas Instruments Incorporated
3
EVM Setup
2.1.8
www.ti.com
TP1 – VIN
Input test point.
2.1.9
TP2 – VOUT
Output test point.
2.1.10
TP3 – RESET (PG)
RESET (PG) test point.
2.1.11
TP4 – ADJ (FB)
ADJ (FB) test point. ADJ on the EVM refers to the feedback (FB) functionality of the TPS7A19 device.
2.1.12
TP5 – GND
Ground test point.
2.1.13
TP6 – GND
Ground test point.
2.2
Soldering Guidelines
To avoid damaging the integrated circuit (IC), use a hot-air system for any solder rework to modify the
EVM for repair or for other application reasons.
2.3
Equipment Connection
1.
2.
3.
4.
5.
3
Operation
1.
2.
3.
4.
4
Set the input power supply to 40 V (maximum), and turn the power supplies off.
Connect the positive voltage lead from the input power supply to VIN at the J1 connector of the EVM.
Connect the ground lead from the input power supply to GND at the J6 connector of the EVM.
Connect a 0-A to 450-mA load between OUT and GND.
Disable the output by shorting pin 1 (GND) and pin 2 (EN) of J3.
Turn on the power supply.
Enable the output by jumping pin 2 (EN) to pin 3 (IN) of J3.
Vary the respective load and input voltage as necessary for test purposes.
Diode D1 (not populated) can be added to provide a path for reverse current. See the TPS7A19 data
sheet (SBVS256) for more information.
TPS7A1901EVM-760 Evaluation Module
Copyright © 2016, Texas Instruments Incorporated
SBVU031 – August 2016
Submit Documentation Feedback
PCB Layout
www.ti.com
4
PCB Layout
Figure 1 to Figure 3 illustrate the PCB layout for this EVM.
Figure 1. Assembly Layer
Figure 2. Top Layer Routing
Figure 3. Bottom Layer Routing
SBVU031 – August 2016
Submit Documentation Feedback
TPS7A1901EVM-760 Evaluation Module
Copyright © 2016, Texas Instruments Incorporated
5
Schematic
5
www.ti.com
Schematic
Figure 4 shows the schematic for the EVM.
TP1
J1
J2
60V D1
VCC
DNP
TP2
4 V - 40 V
J3
J5
C3
10 µF
VCC
7
3
2
1
GND
GND
C6
0.01 µF
VIN
6
EN
1
DELAY
3
ADJ
R1
30.9 k
C2
C4
22 µF DNP100 µF
U1
VOUT
2
RESET
8
GND
GND
4
5
PAD
9
R2
16.9 k
J4
R3
10.0 k
TP3
1
2
3
C1
47 µFDNP
1.5 V - 18 V
450 mA
DNP
GND
C5
0.01 µF
TP4
R4
10.0 k
TP5
TPS7A1901DRBR
TP6
J6
J7
GND
GND
GND
Copyright © 2016, Texas Instruments Incorporated
NOTE: Capacitors C1, C2 and C5 and diode D1 do not come populated.
Figure 4. TPS7A1901EVM-760 Schematic
6
TPS7A1901EVM-760 Evaluation Module
SBVU031 – August 2016
Submit Documentation Feedback
Copyright © 2016, Texas Instruments Incorporated
Bill of Materials
www.ti.com
6
Bill of Materials
Table 3 lists the Bill of Materials (BOM) for the EVM.
Table 3. TPS7A1901EVM-760 BOM (1) (2) (3) (4)
Designator
Quantity
Value
Description
Package
Reference
Manufacturer
Alternate Part
Number
Alternate
Manufacturer
PWR760
Any
-
-
MuRata
SNT-100-BK-G
Samtec
!PCB1
1
C3
1
10 µF
CAP, CERM, 10
µF, 50 V, ± 10%,
X5R, 1210
1210
GRM32ER61H106
KA12L
C4
1
22 µF
CAP, CERM, 22
µF, 35 V, ± 20%,
X5R, 0805
0805
C2012X5R1V226M TDK
125AC
C6
1
0.01 µF
CAP, CERM, 0.01
µF, 25 V, ± 5%,
C0G/NP0, 0603
0603
C1608C0G1E103J
TDK
J1, J2
2
Standard Banana
Jack, Insulated,
Red
6091
6091
Keystone
J3
1
Header, 2.54 mm,
2 × 1, Gold, R/A,
SMT
Header, 2.54 mm,
2x1, R/A, SMT
87898-0204
Molex
J4, J5
2
Header, 100 mil, 3
× 1, Gold, SMT
Samtec_TSM-10301-X-SV
TSM-103-01-L-SV
Samtec
J6, J7
2
Standard Banana
Jack, Insulated,
Black
6092
6092
Keystone
R1
1
30.9 k
RES, 30.9 k, 1%,
0.1 W, 0603
0603
CRCW060330K9F
KEA
Vishay-Dale
R2
1
16.9 k
RES, 16.9 k, 1%,
0.1 W, 0603
0603
CRCW060316K9F
KEA
Vishay-Dale
R3, R4
2
10.0 k
RES, 10.0 k, 1%,
0.1 W, 0603
0603
CRCW060310K0F
KEA
Vishay-Dale
SH-J1, SH-J2, SHJ3
3
1×2
Shunt, 100 mil,
Gold plated, Black
Shunt
969102-0000-DA
3M
TP1, TP2, TP5,
TP6
4
SMT
Test Point,
Compact, SMT
Testpoint_Keyston
e_Compact
5016
Keystone
(1)
(2)
(3)
(4)
Printed Circuit
Board
Part Number
These assemblies are ESD sensitive, observe ESD precautions.
These assemblies must be clean and free from flux and all contaminants. Use of no-clean flux is not acceptable.
These assemblies must comply with workmanship standards IPC-A-610 Class 2.
Unless otherwise noted in the Alternate Part Number and/or Alternate Manufacturer columns, all parts may be substituted with equivalents.
SBVU031 – August 2016
Submit Documentation Feedback
TPS7A1901EVM-760 Evaluation Module
Copyright © 2016, Texas Instruments Incorporated
7
Bill of Materials
www.ti.com
Table 3. TPS7A1901EVM-760 BOM (1) (2) (3) (4) (continued)
Designator
8
Quantity
Value
Description
Package
Reference
SMT
Test Point,
Miniature, SMT
40-V, 450-mA,
High-Voltage,
Ultra-Low IQ LowDropout Regulator,
DRB0008B
Part Number
Manufacturer
Testpoint_Keyston
e_Miniature
5015
Keystone
DRB0008B
TPS7A1901DRBR
Texas Instruments
TP3, TP4
2
U1
1
C1
0
47 µF
CAP, AL, 47 µF, 50 F80
V, ± 20%, 0.68
ohm, SMD
EMZA500ADA470
MF80G
Chemi-Con
C2
0
100 µF
CAP, AL, 100 µF,
25 V, ± 20%, ohm,
SMD
F80
EMVE250ADA101
MF80G
Chemi-Con
C5
0
0.01 µF
CAP, CERM, 0.01
µF, 25 V, ± 5%,
C0G/NP0, 0603
0603
C1608C0G1E103J
TDK
D1
0
60 V
Diode, Schottky, 60 SOD-123
V, 3 A, SOD-123
MBR0560-TP
Micro Commercial
Components
FID1, FID2, FID3
0
Fiducial mark.
There is nothing to
buy or mount.
N/A
N/A
Fiducial
TPS7A1901EVM-760 Evaluation Module
Alternate Part
Number
Alternate
Manufacturer
TPS7A1901DRBT
Texas Instruments
SBVU031 – August 2016
Submit Documentation Feedback
Copyright © 2016, Texas Instruments Incorporated
IMPORTANT NOTICE
SBVU031 – August 2016
Submit Documentation Feedback
TPS7A1901EVM-760 Evaluation Module
9
Bill of Materials
www.ti.com
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other
changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest
issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and
complete. All semiconductor products (also referred to herein as “components”) are sold subject to TI’s terms and conditions of sale
supplied at the time of order acknowledgment.
TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI’s terms
and conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessary
to support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarily
performed.
TI assumes no liability for applications assistance or the design of Buyers’ products. Buyers are responsible for their products and
applications using TI components. To minimize the risks associated with Buyers’ products and applications, Buyers should provide
adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or
other intellectual property right relating to any combination, machine, or process in which TI components or services are used. Information
published by TI regarding third-party products or services does not constitute a license to use such products or services or a warranty or
endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the
third party, or a license from TI under the patents or other intellectual property of TI.
Reproduction of significant portions of TI information in TI data books or data sheets is permissible only if reproduction is without alteration
and is accompanied by all associated warranties, conditions, limitations, and notices. TI is not responsible or liable for such altered
documentation. Information of third parties may be subject to additional restrictions.
Resale of TI components or services with statements different from or beyond the parameters stated by TI for that component or service
voids all express and any implied warranties for the associated TI component or service and is an unfair and deceptive business practice.
TI is not responsible or liable for any such statements.
Buyer acknowledges and agrees that it is solely responsible for compliance with all legal, regulatory and safety-related requirements
concerning its products, and any use of TI components in its applications, notwithstanding any applications-related information or support
that may be provided by TI. Buyer represents and agrees that it has all the necessary expertise to create and implement safeguards which
anticipate dangerous consequences of failures, monitor failures and their consequences, lessen the likelihood of failures that might cause
harm and take appropriate remedial actions. Buyer will fully indemnify TI and its representatives against any damages arising out of the use
of any TI components in safety-critical applications.
In some cases, TI components may be promoted specifically to facilitate safety-related applications. With such components, TI’s goal is to
help enable customers to design and create their own end-product solutions that meet applicable functional safety standards and
requirements. Nonetheless, such components are subject to these terms.
No TI components are authorized for use in FDA Class III (or similar life-critical medical equipment) unless authorized officers of the parties
have executed a special agreement specifically governing such use.
Only those TI components which TI has specifically designated as military grade or “enhanced plastic” are designed and intended for use in
military/aerospace applications or environments. Buyer acknowledges and agrees that any military or aerospace use of TI components
which have not been so designated is solely at the Buyer's risk, and that Buyer is solely responsible for compliance with all legal and
regulatory requirements in connection with such use.
TI has specifically designated certain components as meeting ISO/TS16949 requirements, mainly for automotive use. In any case of use of
non-designated products, TI will not be responsible for any failure to meet ISO/TS16949.
Products
Applications
Audio
www.ti.com/audio
Automotive and Transportation
www.ti.com/automotive
Amplifiers
amplifier.ti.com
Communications and Telecom
www.ti.com/communications
Data Converters
dataconverter.ti.com
Computers and Peripherals
www.ti.com/computers
DLP® Products
www.dlp.com
Consumer Electronics
www.ti.com/consumer-apps
DSP
dsp.ti.com
Energy and Lighting
www.ti.com/energy
Clocks and Timers
www.ti.com/clocks
Industrial
www.ti.com/industrial
Interface
interface.ti.com
Medical
www.ti.com/medical
Logic
logic.ti.com
Security
www.ti.com/security
Power Mgmt
power.ti.com
Space, Avionics and Defense
www.ti.com/space-avionics-defense
Microcontrollers
microcontroller.ti.com
Video and Imaging
www.ti.com/video
RFID
www.ti-rfid.com
OMAP Applications Processors
www.ti.com/omap
TI E2E Community
e2e.ti.com
Wireless Connectivity
www.ti.com/wirelessconnectivity
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2016, Texas Instruments Incorporated
10
TPS7A1901EVM-760 Evaluation Module
Copyright © 2016, Texas Instruments Incorporated
SBVU031 – August 2016
Submit Documentation Feedback
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other
changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest
issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and
complete. All semiconductor products (also referred to herein as “components”) are sold subject to TI’s terms and conditions of sale
supplied at the time of order acknowledgment.
TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI’s terms
and conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessary
to support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarily
performed.
TI assumes no liability for applications assistance or the design of Buyers’ products. Buyers are responsible for their products and
applications using TI components. To minimize the risks associated with Buyers’ products and applications, Buyers should provide
adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or
other intellectual property right relating to any combination, machine, or process in which TI components or services are used. Information
published by TI regarding third-party products or services does not constitute a license to use such products or services or a warranty or
endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the
third party, or a license from TI under the patents or other intellectual property of TI.
Reproduction of significant portions of TI information in TI data books or data sheets is permissible only if reproduction is without alteration
and is accompanied by all associated warranties, conditions, limitations, and notices. TI is not responsible or liable for such altered
documentation. Information of third parties may be subject to additional restrictions.
Resale of TI components or services with statements different from or beyond the parameters stated by TI for that component or service
voids all express and any implied warranties for the associated TI component or service and is an unfair and deceptive business practice.
TI is not responsible or liable for any such statements.
Buyer acknowledges and agrees that it is solely responsible for compliance with all legal, regulatory and safety-related requirements
concerning its products, and any use of TI components in its applications, notwithstanding any applications-related information or support
that may be provided by TI. Buyer represents and agrees that it has all the necessary expertise to create and implement safeguards which
anticipate dangerous consequences of failures, monitor failures and their consequences, lessen the likelihood of failures that might cause
harm and take appropriate remedial actions. Buyer will fully indemnify TI and its representatives against any damages arising out of the use
of any TI components in safety-critical applications.
In some cases, TI components may be promoted specifically to facilitate safety-related applications. With such components, TI’s goal is to
help enable customers to design and create their own end-product solutions that meet applicable functional safety standards and
requirements. Nonetheless, such components are subject to these terms.
No TI components are authorized for use in FDA Class III (or similar life-critical medical equipment) unless authorized officers of the parties
have executed a special agreement specifically governing such use.
Only those TI components which TI has specifically designated as military grade or “enhanced plastic” are designed and intended for use in
military/aerospace applications or environments. Buyer acknowledges and agrees that any military or aerospace use of TI components
which have not been so designated is solely at the Buyer's risk, and that Buyer is solely responsible for compliance with all legal and
regulatory requirements in connection with such use.
TI has specifically designated certain components as meeting ISO/TS16949 requirements, mainly for automotive use. In any case of use of
non-designated products, TI will not be responsible for any failure to meet ISO/TS16949.
Products
Applications
Audio
www.ti.com/audio
Automotive and Transportation
www.ti.com/automotive
Amplifiers
amplifier.ti.com
Communications and Telecom
www.ti.com/communications
Data Converters
dataconverter.ti.com
Computers and Peripherals
www.ti.com/computers
DLP® Products
www.dlp.com
Consumer Electronics
www.ti.com/consumer-apps
DSP
dsp.ti.com
Energy and Lighting
www.ti.com/energy
Clocks and Timers
www.ti.com/clocks
Industrial
www.ti.com/industrial
Interface
interface.ti.com
Medical
www.ti.com/medical
Logic
logic.ti.com
Security
www.ti.com/security
Power Mgmt
power.ti.com
Space, Avionics and Defense
www.ti.com/space-avionics-defense
Microcontrollers
microcontroller.ti.com
Video and Imaging
www.ti.com/video
RFID
www.ti-rfid.com
OMAP Applications Processors
www.ti.com/omap
TI E2E Community
e2e.ti.com
Wireless Connectivity
www.ti.com/wirelessconnectivity
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2016, Texas Instruments Incorporated
